U.S. patent application number 12/814175 was filed with the patent office on 2011-12-15 for flexible heat exchanger.
This patent application is currently assigned to INTERNATIONAL BUSINESS MACHINES CORPORATION. Invention is credited to Maurice F. Holahan, Eric V. Kline, Paul N. Krystek, Michael R. Rasmussen, Arvind K. Sinha, Stephen M. Zins.
Application Number | 20110303403 12/814175 |
Document ID | / |
Family ID | 44352204 |
Filed Date | 2011-12-15 |
United States Patent
Application |
20110303403 |
Kind Code |
A1 |
Holahan; Maurice F. ; et
al. |
December 15, 2011 |
Flexible Heat Exchanger
Abstract
An embodiment of the invention comprises a method for
constructing a heat exchanger for cooling one or more semiconductor
components. The method comprises the step of providing first and
second planar sheets of specified thermally conductive metal foil,
wherein each of the sheets has and exterior side and an interior
side. The method further comprises forming one or more thermal
contact nodes (TCNs) in the first sheet, wherein each TCN extends
outward from the exterior side of the first sheet, and comprises a
planar contact member and one or more side sections, the side
sections respectively including resilient components that enable
the contact member of the TCN to move toward and away from the
exterior side of the first sheet, and the side sections and contact
member of a TCN collectively forming a coolant chamber. Channel
segments are configured along the interior side of the first sheet,
wherein each channel extends between the coolant chambers and two
TCNs, or between the coolant chamber of a TCN and an input port or
output port, selectively. The method further comprises joining the
interior side of the second sheet to the interior side of the first
sheet, in order to form a sealed flow path that includes each
channel segment, and enables liquid coolant to flow into and out of
the coolant chamber of each TCN.
Inventors: |
Holahan; Maurice F.; (Lake
City, MN) ; Kline; Eric V.; (Rochester, MN) ;
Krystek; Paul N.; (Highland, NY) ; Rasmussen; Michael
R.; (Mazeppa, MN) ; Sinha; Arvind K.;
(Rochester, MN) ; Zins; Stephen M.; (Oronoco,
MN) |
Assignee: |
INTERNATIONAL BUSINESS MACHINES
CORPORATION
Armonk
NY
|
Family ID: |
44352204 |
Appl. No.: |
12/814175 |
Filed: |
June 11, 2010 |
Current U.S.
Class: |
165/180 ;
29/890.03 |
Current CPC
Class: |
H01L 2924/0002 20130101;
H01L 2924/0002 20130101; H01L 23/4332 20130101; Y10T 29/4935
20150115; H01L 2924/00 20130101; F28F 3/12 20130101; F28F 2255/02
20130101; H01L 23/473 20130101 |
Class at
Publication: |
165/180 ;
29/890.03 |
International
Class: |
F28F 21/00 20060101
F28F021/00; B21D 53/02 20060101 B21D053/02 |
Claims
1. A method for constructing a heat exchanger for cooling one or
more semiconductor components, said method comprising the steps of:
providing first and second planar sheets of specified thermally
conductive metal foil, wherein each of the sheets has an exterior
side and an interior side; forming one or more thermal contact
nodes (TCNs) in the first sheet, wherein each TCN extends outward
from the exterior side of the first sheet, and comprises a planar
contact member and one or more side sections, the side sections and
contact member of a TCN collectively forming a coolant chamber;
configuring channel segments along the interior side of the first
sheet, wherein each channel segment extends between the coolant
chambers of two or more TCNs, or between the coolant chamber of a
TCN and an input port or output port, selectively; and joining the
interior side of the second sheet to the interior side of the first
sheet, in order to form a sealed flow path that includes each
channel segment, and enables liquid coolant to flow into and out of
the coolant chamber of each TCN.
2. The method of claim 1, wherein: the side sections of at least
one of said TCNs respectively include resilient components that
collectively enable the contact member of the TCN to move toward
and away from the exterior side of the first sheet.
3. The method of claim 1, wherein: a plurality of TCNs are formed
in said first sheet, wherein each TCN has a dimension measured
along a Z-axis that is orthogonal to said first sheet, and the
Z-axis dimension of one of said TCNs is different from the Z-axis
dimension of another of said
4. The method of claim 1, wherein: the resilient component of each
of said side sections comprises a bellows structure.
5. The method of claim 1, wherein: one or more TCNs are formed in
the second sheet, wherein each TCN formed in the second sheet
extends outward from the exterior side of the second sheet, and
comprises a planar contact member and one or more side
sections.
6. The method of claim 1, wherein: the cross-section of one or more
of said channel segments is made different from the cross-section
of one or more other channel segments in order to cause said
coolant to flow out of the coolant chamber of at least one of said
TCNs at a different rate than it flows out of the coolant chamber
of another of said TCNs.
7. The method of claim 1, wherein: selected structure is placed in
a given coolant chamber, to cause turbulence of coolant flowing
through the given coolant chamber.
8. The method of claim 1, wherein: said TCNs and channel segments
are formed in the first sheet by means of an embossing process.
9. The method of claim 1, wherein: a laser welding process is used
to join said first and second sheets together at regions that
respectively surround each of said TCNs and each of said channel
segments.
10. The method of claim 1, wherein: prior to forming said TCNs and
configuring said channel segments, the interior sides of said first
and second sheets are each coated with a selected barrier metal
that does not react with said coolant.
11. The method of claim 1, wherein: said channel segments and
coolant chambers collectively define a path of flow for said
coolant from said input port to said output port.
12. Heat exchanger apparatus for cooling one or more semiconductor
components, said apparatus comprising: a first planar sheet of
specified thermally conductive foil that has an exterior side and
an interior side, wherein one or more thermal contact nodes (TCNs)
are formed in the first sheet, each TCN extending outward from the
exterior side of the first sheet and comprising a planar contact
member and one or more side sections, the side sections
respectively including resilient components that collectively
enable the contact member of the TCN to move toward and away from
the exterior side of the first sheet, the side sections and contact
member of a TCN collectively forming a coolant chamber, and a
channel segment is configured along the interior side of the first
sheet, wherein each channel segment extends between the coolant
chambers of two or more TCNs, or between the coolant chamber of a
TCN and an input port or an output port, selectively; a second
planar sheet of said specified thermally conductive foil that has
an exterior side and an interior side; and means for joining the
interior side of the second sheet to the interior side of the first
sheet, in order to form a sealed flow path that includes each
channel segment, and enables liquid coolant to flow into and out of
the coolant chamber of each TCN.
13. The apparatus of claim 12, wherein: the resilient component of
each side section comprises a bellows structure.
14. The apparatus of claim 12, wherein: the cross-section of one or
more of the channel segments is made different from the
cross-section of at least one or more other channel segments, in
order to cause said coolant to flow out of the coolant chamber of
one or more of said TCNs at a different rate than it flows out of
the coolant chamber of another of said TCNs.
15. The apparatus of claim 12, wherein: selected liquid flow
turbulence structure is placed in a given coolant chamber, to cause
turbulence of coolant flowing through the given coolant chamber in
order to increase the thermal transfer efficiency of the TCN.
16. The apparatus of claim 12, wherein: said TCNs and channel
segments are formed in the first sheet by means of an embossing
process.
17. The apparatus of claim 12, wherein: prior to forming said TCNs
and configuring said channel segments, the interior sides of the
first and second sheets are each coated with a selected barrier
metal that does not react with said coolant.
18. A method for constructing a heat exchanger for cooling one or
more semiconductor components, said method comprising the steps of:
providing first and second planar sheets of specified thermally
conductive metal foil, wherein each of the sheets has an exterior
side and an interior side; forming one or more thermal contact
nodes (TCNs) in the first sheet, wherein each TCN extends outward
from the exterior side of the first sheet, and comprises a planar
contact member and one or more side sections, the side sections and
contact member of a TCN collectively forming a coolant chamber;
configuring channel segments along the interior side of the first
sheet, wherein each channel segment extends between the coolant
chambers of two or more TCNs, or between the coolant chamber of a
TCN and an input port or output port, selectively; joining the
interior side of the second sheet to the interior side of the first
sheet, in order to form a sealed flow path that includes each
channel segment, and enables liquid coolant to flow into and out of
the coolant chamber of each TCN; an input coolant connector joined
to said input port for receiving coolant from a coolant circulating
mechanism; and an output coolant connector joined to said output
port for returning coolant to the coolant circulating
mechanism.
19. The method of claim 18, wherein: a first one of said TCNs is
adapted to contact a first semiconductor component, and a second
one of said TCNs is adapted to contact a second semiconductor
component, wherein said first and second semiconductor components
are adjacent to each other, and have respective height dimensions
that are different from each other.
20. The method of claim 18, wherein: the side sections of at least
one of said TCNs respectively include resilient components that
collectively enable the contact member of the TCN to move toward
and away from the exterior side of the first sheet.
Description
BACKGROUND
[0001] 1. Field of the Invention
[0002] The disclosure relates generally to a liquid flow through
(LFT) heat exchanger for cooling printed circuit boards (PCB)
devices, or other semiconductor devices or components. More
specifically, the invention pertains to a heat exchanger of the
above type that is very flexible and may be readily adapted for use
with semiconductor devices of varying heights or other
dimensions.
[0003] 2. Description of the Related Art
[0004] High performance computing systems are using ever increasing
amounts of power at higher power densities. As a result, system
cooling requirements have become more challenging, and it is
necessary to consider solutions that use liquid cooling. Currently
available liquid cooling approaches include heat pipe, vapor
chamber, and liquid flow through (LFT) solutions. These solutions,
however, tend to be quite costly.
[0005] In a system that uses liquid cooling, it may also be
necessary to place components for removing heat in physical contact
with semiconductor devices located on a PCB assembly or the like.
However, adjacent semiconductor devices may be of different sizes.
Moreover, two semiconductor devices that are of the same type may
in fact have a dimension that is different for the two devices,
even though such dimension is within the allowed tolerance for both
devices. As a result, it may be difficult to provide heat exchanger
components that can effectively be adapted to meet the size
requirements encountered for these different devices. A thermal
interface material (TIM) is typically used by practitioners to
perform gap-filling functions (e.g. gels, greases, and thermal
putties). However, this limits thermal transfer efficiency.
Improvements are therefore necessary in the current state of the
art.
SUMMARY
[0006] According to one embodiment of the present invention, a
method is provided for constructing a heat exchanger for cooling
one or more semiconductor components. The method comprises the step
of providing first and second planar sheets of specified thermally
conductive metal foil, wherein each of the sheets has an exterior
side and an interior side. The method further comprises forming one
or more thermal contact nodes (TCNs) in the first sheet, wherein
each TCN extends outward from the exterior side of the first sheet,
and comprises a planar contact member and one or more side
sections. The side sections may respectively include resilient
components that collectively enable the contact member of the TCN
to move toward and away from the exterior side of the first sheet,
and the side sections and contact member of a TCN collectively form
a coolant chamber. A plurality of TCNs thus formed may accommodate
different device heights since each TCN can be formed with varying
geometries and each TCN mechanically functions substantially
independently. Channel segments are configured along the interior
side of the first sheet and/or second sheet, wherein each channel
segment extends between the coolant chambers of two TCNs, or
between the coolant chamber of a TCN and an input port or an output
port, selectively. The method further comprises joining the
interior side of the second sheet to the interior side of the first
sheet, in order to form a sealed flow path that includes each
channel segment, and enables liquid coolant to flow into and out of
the coolant chamber of each TCN. The method further comprises a
connector means to couple and decouple coolant flow to/from the
invention.
BRIEF DESCRIPTION OF THE DRAWINGS
[0007] FIG. 1 is an exploded perspective view showing an embodiment
of the invention, which includes two metal foil sheets of
substantially identical dimensions.
[0008] FIG. 2 is a perspective view showing the opposing side of
one of the sheets depicted in FIG. 1.
[0009] FIG. 3 is a sectional view taken along lines 3-3 of FIG.
2.
[0010] FIG. 4 is a schematic view showing TCNs of the embodiment of
FIG. 1 in engagement with respective semiconductor devices, to
remove heat therefrom.
[0011] FIG. 5 is a schematic view showing a modification of the
embodiment of FIG. 1.
[0012] FIG. 6 is a schematic view showing a further modification of
the embodiment of FIG. 1.
DETAILED DESCRIPTION
[0013] As will be appreciated by one skilled in the art, the
present invention may be embodied as a system or method.
Accordingly, the present invention may take the form of an entirely
hardware embodiment, an entirely process embodiment (including
design, fabrication, assembly and use steps, etc.) or an embodiment
combining method and hardware aspects that may all generally be
referred to herein as a process or an "assembly" or a "system."
[0014] Embodiments of the invention provide a method and apparatus
for removing heat from semiconductor devices or components, such as
those on a single module or an entire PCB assembly. Embodiments
enhance simplicity, reduce cost, and may be readily adapted for use
with multiple semiconductor components that are adjacent to one
another, but are of different sizes or dimensions from one another.
Embodiments of the invention are also able to adapt to variations
in height, or other critical dimension, that can occur among
semiconductor devices of the same type.
[0015] Referring to FIG. 1, there is shown an exploded perspective
view of an embodiment of the invention, which comprises a liquid
flow through (LFT) heat exchanger for removing heat from multiple
semiconductor devices or components. The heat exchanger can be
readily adapted for use with devices that are adjacent to one
another, but are of different sizes. FIG. 1 shows two rectangular,
substantially planar metal foil sheets 10 and 12, which usefully
are of the same dimensions. Thus, the length and cross-section of
sheet 10 are equal to the length and cross-section of sheet 12,
respectively. Metal foil sheets 10 and 12 are formed from a
material that has high thermal conductivity, such as copper, a
brass alloy, beryllium copper, (BeCu), aluminum, an aluminum alloy,
or stainless steel. However, the invention is not limited
thereto.
[0016] Each of the sheets 10 and 12 has an interior side, such as
interior side 12a of sheet 12. The interior side 10a of sheet 10 is
shown in FIG. 2. Each sheet also has an exterior side, such as
exterior side 10b of sheet 10. In fabricating the heat exchanger of
FIG. 1, sheets 10 and 12 are joined together so that interior sides
10a and 12a are maintained in close abutting relationship with each
other. It is also useful to join the two sheets so that their
respective corresponding corners are aligned with one another, as
shown in FIG. 1. However, before the sheets can be joined together,
it is necessary to form certain structural or 3-dimensional
features in the material of at least one of the sheets. These
structural features will be determined by the particular
configuration of semiconductor devices with which the heat
exchanger of FIG. 1 is to be used, to remove heat therefrom.
[0017] Referring further to FIG. 1, there are shown, by way of
example and not limitation, thermal contact nodes (TCNs) 14 and 16,
which are respectively formed in metal foil sheet 10 and are thus
thermally conductive. TCN 14 has a planar contact member 14a, and
TCN 16 has a planar contact member 16a. Member 16a extends outward
from exterior side 10b by some amount of spacing, and is supported
with respect to side 10b by side sections 16b-16e, which are
respectively positioned along the four sides of contact member 16a.
As described hereinafter in further detail, each side section
includes a rigid component and a resilient component. The rigid
component is firmly joined to exterior side 10b of sheet 10. The
resilient component is positioned between the rigid component and
member 16a, to allow member 16a to move or flex toward or away from
side 10b, that is, to move along the Z-axis.
[0018] Planar contact member 14a is similarly supported for
movement along the Z-axis by side sections 14b-14e, which are
respectively positioned along the four sides of contact member 14a.
Each side section 14b-14e is similar in construction and function
to the side sections 16b-16e.
[0019] FIG. 1 also shows that planar contact members 14a and 16a
are spaced apart from one another by a particular distance. This
indicates that the heat exchanger of FIG. 1, after it has been
fabricated, will be used to cool two semiconductor devices that are
likewise spaced apart by the particular distance separating members
14a and 16a. In addition, FIG. 1 shows that contact member 16a is
significantly larger than member 14a. This indicates that the
device with which TCN 16 will be used is larger, or needs a larger
thermal contact surface area, than the device with which TCN 14
will be used.
[0020] As stated above, the provision of two TCNs as shown by FIG.
1 is only exemplary, and the invention is by no means limited
thereto. More generally, it is to be emphasized that the number of
TCNs formed on sheet 10, as well as their respective sizes and
positions, can be readily adapted to meet the needs of many
different applications for electronic component heat removal. This
capability emphasizes the flexibility which is provided by
embodiments of the invention. A particular configuration of TCNs,
designed for a particular application, can be fabricated by
embossing or molding sheet 10, or by using other techniques known
to those of skill in the art.
[0021] In order to carry out a heat removal function, it is
necessary to provide a flow of coolant fluid to and away from each
of the TCNs and their respective planar contact members 14a and
16a. Accordingly, in addition to forming the TCNs 14 and 16 in
sheet 10, a coolant flow channel is also formed therein. More
particularly, FIG. 1 shows channel segments 18, 20, and 22 formed
in sheet 10. Each of these segments has a semicircular cross
section and is convex with respect to side 10b of sheet 10, that
is, each segment extends outward therefrom. Channel segment 18
extends from a channel end 18a to TCN 16. Segment 20 extends from
TCN 16 to TCN 14, and channel segment 22 extends from TCN 14 to a
channel end 22a.
[0022] Referring to FIG. 2, there is shown interior side 10a of
sheet 10, that is, the side thereof that is opposite to exterior
side 10b. FIG. 2 further shows that the contact member 16a and its
side sections 16b-16e of TCN 16 collectively form a chamber or
compartment 24, which can receive and contain liquid coolant fluid.
An end 18b of coolant channel segment 18 is formed to access, or
open into, the chamber 24. In like manner, an end 20a of channel
segment 20 accesses or opens into chamber 24.
[0023] Referring further to FIG. 2, it is seen that similar to TCN
16, the contact member 14a and side sections 14b-14e of TCN 14
collectively form a chamber 26 that can receive and contain coolant
fluid. An end 20b of channel segment 20 and an end 22b of channel
segment 22 each accesses or opens into chamber 26.
[0024] Referring again to FIG. 1, it will be appreciated that when
sheets 10 and 12 are joined together as described above, chambers
24 and 26 will be completely enclosed, except at the locations of
access to the channel segments. Moreover, the chambers 24 and 26
and the channel segments collectively comprise a system that is
enclosed except at channel ends 18a and 22a. By using one of the
channel ends as an input port and the other as an output port,
liquid coolant fluid can be selectively circulated through the
channel segments, and through chamber 24 of TCN 16 and chamber 26
of TCN 14.
[0025] In joining metal foil sheets 10 and 12 together, laser
welding may be used to join regions of sheets 10 and 12 that
surround or are proximate to TCNs 14 and 16, and also to channel
segments 18-22. This will ensure the formation of very tight seals
for the fluid containing chambers 24 and 26 and the channel
segments. The edges of sheets 10 and 12 may be joined by means of
laser welding, or may alternatively be joined by means of an
adhesive, or by a metallurgical process such as soldering.
[0026] FIG. 1 further shows small channel segments 28 and 30 formed
in sheet 12. Each of these channel segments has a semicircular
cross section, and is convex with respect to interior side 12a,
that is, each channel extends away from sheet 10 as viewed in FIG.
1. Channel segments 28 and 30 are positioned to mate with channel
ends 18a and 22a, respectively, when sheets 10 and 12 are joined
together. This provides each of the channel segments 18 and 22 with
a circular aperture at its opening. Couplings 32 and 34 are each
sized and fitted to a corresponding one of these apertures. The
couplings may then be connected to a conventional coolant fluid
pump (not shown), with one of the couplings such as 34 selected as
the input port and the other as the output port. By operating the
pump, liquid coolant fluid is circulated to each of the TCNs, as
discussed above, for heat removal applications. The coolant fluid
could comprise distilled water, or other fluid used by those of
skill in the art to remove heat from semiconductor devices.
[0027] Referring now to FIG. 3, there is shown a sectional view
taken through metal foil sheet 10, along lines 3-3 of FIG. 2. FIG.
3 thus depicts features of side sections 16e and 16c of TCN 16.
More particularly, each of these side sections is shown to include
a component 36, which is comparatively rigid. That is, when TCN 16
was formed in sheet 10, each of the side section components 36 was
constructed so that it would not move in relation to adjacent
portions of sheet 10.
[0028] Referring further to FIG. 3, there is shown a component 38
attached to each rigid component 36, and also attached to a side or
edge of contact member 16a of TCN 16. In the formation of sheet 10,
each component 38 is fabricated in the manner of or to function as
a bellows, so that it is capable of flexure or resilience. Contact
member 16a is thus able to move toward or away from sheet 10, i.e.,
upward or downward or along the Z-axis, as viewed in FIG. 3. In the
formation of sheet 10, the resilient components 38 of a TCN are
usefully provided with a prespecified spring constant, to permit
elements of the TCN to be compressed or elongated within the
elastic limit of the sheet 10 material.
[0029] Side sections 16b and 16d, while not shown in FIG. 3, each
comprises a rigid component and a resilient component that are
similar or identical to rigid components 36 and resilient
components 38, respectively.
[0030] Referring further to FIG. 3, there is shown side sections
14e and 14c each comprising a rigid component 40 and a resilient
component 42. Each component 40 is similar to components 36 and
each component 42 is similar to components 38, as described above.
Accordingly, contact member 14a of TCN 14 is able to move along the
Z-axis in the same manner as contact member 16a.
[0031] Side sections 14b and 14d, while not shown in FIG. 3, each
comprises a rigid component and a resilient component that are
similar or identical to those shown in FIG. 3 in connection with
side sections 14c and 14e.
[0032] Referring to FIG. 4, there is shown a schematic view that
illustrates the use or operation of the embodiment described above
to remove heat from semiconductor electronic devices. More
particularly, FIG. 4 shows semiconductor devices 46 and 48 mounted
on a PCB 44 or the like, wherein contact member 16a of TCN 16 has
been brought into contacting relationship with device 46.
Accordingly, heat from the device 46 is transferred to thermally
conductive member 16a, and through the member 16a to liquid coolant
50 contained in chamber 24. As described above, liquid coolant may
be circulated through chamber 24, and thereby removes heat
therefrom.
[0033] Similarly, FIG. 4 shows contact member 14a of TCN 14 in
contact with semiconductor device 48, to remove heat therefrom and
transfer the heat to coolant 50 in chamber 26.
[0034] It is to be appreciated that semiconductor devices 46 and 48
shown in FIG. 4 are distinctly different in size from each other.
In view of this, TCNs 14 and 16 have likewise been constructed to
be different from one another, and each has been adapted to mate
with its corresponding semiconductor device. FIG. 4 thus further
illustrates the flexibility that can be provided by embodiments of
the invention to adapt to different cooling requirements. It is
considered that any reasonable number of TCNs and channel segments
can be formed in sheet 10, with configurations to meet particular
arrangements of semiconductor devices.
[0035] To illustrate a further benefit provided by embodiments of
the invention, FIG. 4 shows semiconductor device 46 provided with a
height mark 46a. This mark represents the minimum height that
device 46 could have, and still be within its prespecified
tolerance. FIG. 4 further shows that device 46 exceeds the minimum
height requirement 46a, by an amount .DELTA.. However, by
constructing TCN 16 as described above, the resilient components 38
enable contact member 16a to be adjusted or offset by the same
amount .DELTA., while remaining in close contact with device 46 to
provide effective heat transfer. As viewed in FIG. 4, member 16a is
moved upward by the amount .DELTA., to accommodate the height by
which component 46 exceeds its minimum allowable height. At the
same time, the resiliency of components 38 prevent device 46 or TCN
16 from being subjected to undue stress, and avoids exceeding
elastic limits thereof.
[0036] In a modification of the embodiment shown in FIG. 1, one or
more TCNs and channel segments, having features similar to those
described above in connection with sheet 10, may also be formed in
sheet 12. The resulting modified heat exchanger could then be
placed between two configurations of semiconductor devices, with
one configuration being cooled by the TCN's of sheet 10, and the
other configuration by the TCN's of sheet 12.
[0037] In a further modification, before or after forming any TCNs
or channel segments, the interior sides of both sheets 10 and 12
would be coated with a metal referred to as a barrier metal. This
metal does not react with the liquid that is to be used as the
coolant fluid. Use of the barrier metal thus reduces interior
corrosion of the heat exchanger.
[0038] In yet another modification, the cross-sections of one or
more channel segments could be made larger than the cross-sections
of other sections, to increase the rate at which coolant flows away
from a particular TCN. For example, if coolant is flowing from
channel end 22a, through respective channel segments and TCNs 14
and 16 to channel end 22a, the diameter of channel segment 18 could
be made greater than the diameter of segment 22. This would
increase the rate at which coolant flowed away from TCN 16, and
would thus increase the capacity of TCN 16 to dissipate heat. As an
alternative, two or more channel segments could be formed in sheet
10, to carry heat away from TCN 16.
[0039] Referring to FIG. 5, there is shown a TCN 52 similar to TCNs
14 and 16. TCN 52 thus comprises a planar contact member 52a and
side sections 52b-52e which collectively form a coolant chamber. In
a modification of the invention, structure 54, comprising a series
of waves, or hills and valleys is formed as part of TCN 52 that is,
integral with other components of TCN 52 or in situ. Structure 54
is therefore contained in the coolant chamber of TCN 52, and is
formed integral with and supported upon member 52a.
[0040] By placing the structure 54 in the coolant chamber of TCN
52, coolant flowing through the chamber will become quite
turbulent. This turbulence, in turn, will cause the fluid to be
much more effective in dissipating heat that has been transferred
to fluid in the chamber, from a semiconductor device in contact
with member 52a.
[0041] Referring to FIG. 6, there is shown a TCN 56 similar to TCNs
14 and 16. TCN 56 thus comprises a planar contact member 56a and
side sections 56b-56e which collectively form a coolant chamber. In
a further modification of the invention, structure 58, similar to
structure 54 of FIG. 5, comprises a series of waves, or hills and
valleys. However, structure 58 is formed independently of TCN 56,
and is placed into the coolant chamber of TCN 56 after TCN 56 has
been formed. Structure 58 causes turbulence of the coolant in the
chamber of TCN 56, in like manner with structure 54.
[0042] The terminology used herein is for the purpose of describing
particular embodiments only and is not intended to be limiting of
the invention. As used herein, the singular forms "a", "an" and
"the" are intended to include the plural forms as well, unless the
context clearly indicates otherwise. It will be further understood
that the terms "comprises" and/or "comprising," when used in this
specification, specify the presence of stated features, integers,
steps, operations, elements, and/or components, but do not preclude
the presence or addition of one or more other features, integers,
steps, operations, elements, components, and/or groups thereof.
[0043] The corresponding structures, materials, acts, and
equivalents of all means or step plus function elements in the
Claims below are intended to include any structure, material, or
act for performing the function in combination with other Claimed
elements as specifically Claimed. The description of the present
invention has been presented for purposes of illustration and
description, but is not intended to be exhaustive or limited to the
invention in the form disclosed. Many modifications and variations
will be apparent to those of ordinary skill in the art without
departing from the scope and spirit of the invention. The
embodiment was chosen and described in order to best explain the
principles of the invention and the practical application, and to
enable others of ordinary skill in the art to understand the
invention for various embodiments with various modifications as are
suited to the particular use contemplated.
[0044] The invention can take the form of an entirely hardware
embodiment, an entirely method embodiment or an embodiment
containing both hardware and method elements. In a preferred
embodiment, the invention is implemented in process, which includes
but is not limited to real components and parts and specific
process steps to design, fabricate and utilize the invention.
[0045] The description of the present invention has been presented
for purposes of illustration and description, and is not intended
to be exhaustive or limited to the invention in the form disclosed.
Many modifications and variations will be apparent to those of
ordinary skill in the art. The embodiment was chosen and described
in order to best explain the principles of the invention, the
practical application, and to enable others of ordinary skill in
the art to understand the invention for various embodiments with
various modifications as are suited to the particular use
contemplated.
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