| Patent | Date |
|---|
Demand-based charging of a heat pipe
Grant 10,982,907 - Anderl , et al. April 20, 2 | 2021-04-20 |
Dynamic keying assembly
Grant 10,644,451 - Mann , et al. | 2020-05-05 |
Dynamic keying assembly
Grant 10,553,992 - Mann , et al. Fe | 2020-02-04 |
Ball grid array rework
Grant 10,546,828 - Kline , et al. Ja | 2020-01-28 |
Demand-based charging of a heat pipe
Grant 10,295,270 - Anderl , et al. | 2019-05-21 |
Thermoset resin flow models for printed circuit board laminates
Grant 10,169,499 - Kuczynski , et al. J | 2019-01-01 |
Demand-based charging of a heat pipe
Grant 10,156,403 - Anderl , et al. Dec | 2018-12-18 |
Demand-based charging of a heat pipe
Grant 10,126,070 - Anderl , et al. November 13, 2 | 2018-11-13 |
Ball Grid Array Rework
App 20180190609 - Kline; Eric V. ; et al. | 2018-07-05 |
Electronic module with laterally-conducting heat distributor layer
Grant 10,004,161 - Sinha , et al. June 19, 2 | 2018-06-19 |
Ball grid array rework
Grant 9,978,706 - Kline , et al. May 22, 2 | 2018-05-22 |
Dual magnetically coupled rotor heat exchanger
Grant 9,976,812 - Holahan , et al. May 22, 2 | 2018-05-22 |
Dynamic keying assembly
Grant 9,954,338 - Mann , et al. April 24, 2 | 2018-04-24 |
Dynamic Keying Assembly
App 20180097330 - Mann; Phillip V. ; et al. | 2018-04-05 |
Dynamic Keying Assembly
App 20180097329 - Mann; Phillip V. ; et al. | 2018-04-05 |
Demand-based Charging Of A Heat Pipe
App 20180080720 - Anderl; William J. ; et al. | 2018-03-22 |
Method for containing computer system components
Grant 9,921,619 - Elison , et al. March 20, 2 | 2018-03-20 |
Demand-based Charging Of A Heat Pipe
App 20180073815 - Anderl; William J. ; et al. | 2018-03-15 |
Method of affixing a group of elastic filaments to an electronic component body
Grant 9,907,185 - Mann , et al. February 27, 2 | 2018-02-27 |
Demand-based charging of a heat pipe
Grant 9,863,712 - Anderl , et al. January 9, 2 | 2018-01-09 |
Pin attach converter
Grant 9,853,375 - Mann , et al. December 26, 2 | 2017-12-26 |
Dynamic keying assembly
Grant 9,843,152 - Mann , et al. December 12, 2 | 2017-12-12 |
Demand-based charging of a heat pipe
Grant 9,835,384 - Anderl , et al. December 5, 2 | 2017-12-05 |
Light pipe connector apparatus
Grant 9,726,837 - Mann , et al. August 8, 2 | 2017-08-08 |
Alignment of three dimensional integrated circuit components
Grant 9,721,855 - Kuczynski , et al. August 1, 2 | 2017-08-01 |
Pin Attach Converter
App 20170104284 - Mann; Phillip V. ; et al. | 2017-04-13 |
Demand-based Charging Of A Heat Pipe
App 20170102188 - Anderl; William J. ; et al. | 2017-04-13 |
Demand-based Charging Of A Heat Pipe
App 20170102189 - Anderl; William J. ; et al. | 2017-04-13 |
Demand-based Charging Of A Heat Pipe
App 20170102187 - Anderl; William J. ; et al. | 2017-04-13 |
Demand-based Charging Of A Heat Pipe
App 20170102190 - Anderl; William J. ; et al. | 2017-04-13 |
Light Pipe Connector Apparatus
App 20170090129 - Mann; Phillip V. ; et al. | 2017-03-30 |
Area array device connection structures with complimentary warp characteristics
Grant 9,609,744 - Hoffmeyer , et al. March 28, 2 | 2017-03-28 |
Pin attach converter
Grant 9,590,329 - Mann , et al. March 7, 2 | 2017-03-07 |
Thermoset Resin Flow Models For Printed Circuit Board Laminates
App 20170017733 - Kuczynski; Joseph ; et al. | 2017-01-19 |
Pin Attach Converter
App 20160359246 - Mann; Phillip V. ; et al. | 2016-12-08 |
Alignment of three dimensional integrated circuit components
Grant 9,508,614 - Kuczynski , et al. November 29, 2 | 2016-11-29 |
Dual optical and electrical LGA contact
Grant 9,494,752 - Mann , et al. November 15, 2 | 2016-11-15 |
Air valve for electronics enclosures
Grant 9,482,349 - Anderl , et al. November 1, 2 | 2016-11-01 |
Light pipe connector apparatus
Grant 9,482,833 - Mann , et al. November 1, 2 | 2016-11-01 |
Thermal spreading for an externally pluggable electronic module
Grant 9,414,528 - Mann , et al. August 9, 2 | 2016-08-09 |
Thermal spreading for an externally pluggable electronic module
Grant 9,414,527 - Mann , et al. August 9, 2 | 2016-08-09 |
Cooling apparatus with dynamic load adjustment
Grant 9,414,526 - Mann , et al. August 9, 2 | 2016-08-09 |
Cooling apparatus with dynamic load adjustment
Grant 9,392,731 - Mann , et al. July 12, 2 | 2016-07-12 |
Dual optical and electrical LGA contact
Grant 9,389,379 - Mann , et al. July 12, 2 | 2016-07-12 |
Ball Grid Array Rework
App 20160197053 - Kline; Eric V. ; et al. | 2016-07-07 |
Dual Optical And Electrical Lga Contact
App 20160187601 - Mann; Phillip V. ; et al. | 2016-06-30 |
Dual Optical And Electrical Lga Contact
App 20160187602 - Mann; Phillip V. ; et al. | 2016-06-30 |
Computer System Component Bay
App 20160179146 - Elison; Bret P. ; et al. | 2016-06-23 |
Alignment Of Three Dimensional Integrated Circuit Components
App 20160172252 - Kuczynski; Joseph ; et al. | 2016-06-16 |
Electronic Module With Laterally-conducting Heat Distributor Layer
App 20160174416 - SINHA; Arvind K. ; et al. | 2016-06-16 |
Alignment Of Three Dimensional Integrated Circuit Components
App 20160172324 - Kuczynski; Joseph ; et al. | 2016-06-16 |
Thermal Spreading For An Externally Pluggable Electronic Module
App 20160135327 - Mann; Phillip V. ; et al. | 2016-05-12 |
Thermal Spreading For An Externally Pluggable Electronic Module
App 20160135332 - Mann; Phillip V. ; et al. | 2016-05-12 |
Ball grid array rework
Grant 9,338,885 - Kline , et al. May 10, 2 | 2016-05-10 |
Ball grid array rework
Grant 9,332,639 - Kline , et al. May 3, 2 | 2016-05-03 |
Computer system component bay
Grant 9,326,386 - Elison , et al. April 26, 2 | 2016-04-26 |
Managing Heat Transfer For Electronic Devices
App 20160095254 - Mann; Phillip V. ; et al. | 2016-03-31 |
Implementing integrated circuit chip attach in three dimensional stack using vapor deposited solder Cu pillars
Grant 9,299,686 - Mann , et al. March 29, 2 | 2016-03-29 |
Electronic module with laterally-conducting heat distributor layer
Grant 9,301,430 - Sinha , et al. March 29, 2 | 2016-03-29 |
Implementing integrated circuit chip attach in three dimensional stack using vapor deposited solder Cu pillars
Grant 9,299,591 - Mann , et al. March 29, 2 | 2016-03-29 |
Cooling an electronic device using a thermally conductive loop
Grant 9,277,677 - Elison , et al. March 1, 2 | 2016-03-01 |
Continuous loop cooling for an electronic device
Grant 9,265,179 - Elison , et al. February 16, 2 | 2016-02-16 |
System and method to process horizontally aligned graphite nanofibers in a thermal interface material used in 3D chip stacks
Grant 9,257,359 - Kuczynski , et al. February 9, 2 | 2016-02-09 |
Sealing connector to mitigate corrosion
Grant 9,252,525 - Mann , et al. February 2, 2 | 2016-02-02 |
Area array device connection structures with complimentary warp characteristics
Grant 9,247,636 - Hoffmeyer , et al. January 26, 2 | 2016-01-26 |
Horizontally aligned graphite nanofibers in etched silicon wafer troughs for enhanced thermal performance
Grant 9,245,813 - Bartley , et al. January 26, 2 | 2016-01-26 |
Air Valve For Electronics Enclosures
App 20160018008 - Anderl; William J. ; et al. | 2016-01-21 |
Ball Grid Array Rework
App 20160007457 - Kline; Eric V. ; et al. | 2016-01-07 |
Ball Grid Array Rework
App 20160007515 - Kline; Eric V. ; et al. | 2016-01-07 |
Duplex Flexible Heat Exchanger
App 20150318231 - Holahan; Maurice F. ; et al. | 2015-11-05 |
Implementing microscale thermoacoustic heat and power control for processors and 3D chipstacks
Grant 9,177,889 - Elison , et al. November 3, 2 | 2015-11-03 |
Duplex flexible heat exchanger
Grant 9,170,056 - Holahan , et al. October 27, 2 | 2015-10-27 |
Horizontally and vertically aligned graphite nanofibers thermal interface material for use in chip stacks
Grant 9,111,899 - Bartley , et al. August 18, 2 | 2015-08-18 |
Dynamic Keying Assembly
App 20150214664 - Mann; Phillip V. ; et al. | 2015-07-30 |
Dynamic Keying Assembly
App 20150214675 - Mann; Phillip V. ; et al. | 2015-07-30 |
Area Array Device Connection Structures With Complimentary Warp Characteristics
App 20150195901 - Hoffmeyer; Mark K. ; et al. | 2015-07-09 |
Air Valve For Electronics Enclosures
App 20150192219 - Anderl; William J. ; et al. | 2015-07-09 |
Electronic Device Cooling
App 20150156923 - Elison; Bret P. ; et al. | 2015-06-04 |
Electronic Device Cooling
App 20150156922 - Elison; Bret P. ; et al. | 2015-06-04 |
Cooling Apparatus With Dynamic Load Adjustment
App 20150136365 - Mann; Phillip V. ; et al. | 2015-05-21 |
Cooling Apparatus With Dynamic Load Adjustment
App 20150138731 - Mann; Phillip V. ; et al. | 2015-05-21 |
Implementing Redundant And High Efficiency Hybrid Liquid And Air Cooling For Chipstacks
App 20150092349 - Elison; Bret P. ; et al. | 2015-04-02 |
Electronic Component Retainers
App 20150082627 - Mann; Phillip V. ; et al. | 2015-03-26 |
Sealing Connector To Mitigate Corrosion
App 20150050823 - Mann; Phillip V. ; et al. | 2015-02-19 |
Motherboard assembly for interconnecting and distributing signals and power
Grant 8,958,214 - Colbert , et al. February 17, 2 | 2015-02-17 |
Implementing graphene interconnect for high conductivity applications
Grant 8,952,258 - Plucinski , et al. February 10, 2 | 2015-02-10 |
Heat spreader flatness detection
Grant 8,941,398 - Sinha , et al. January 27, 2 | 2015-01-27 |
Receptacle with heat management for electronic and optical systems
Grant 8,911,244 - Elison , et al. December 16, 2 | 2014-12-16 |
Computer System Component Bay
App 20140312750 - Elison; Bret P. ; et al. | 2014-10-23 |
Area Array Device Connection Structures With Complimentary Warp Characteristics
App 20140268603 - Hoffmeyer; Mark K. ; et al. | 2014-09-18 |
Horizontally Aligned Graphite Nanofibers In Etched Silicon Wafer Troughs For Enhanced Thermal Performance
App 20140210068 - Bartley; Gerald K. ; et al. | 2014-07-31 |
Implementing enhanced thermal conductivity in stacked modules
Grant 8,779,585 - O'Connell , et al. July 15, 2 | 2014-07-15 |
Receptacle With Heat Management For Electronic And Optical Systems
App 20140170898 - Elison; Bret P. ; et al. | 2014-06-19 |
Electronic Component Retainers
App 20140165378 - Mann; Phillip V. ; et al. | 2014-06-19 |
Implementing enhanced dimensional stability with graphite nanotube hybrid socket
Grant 8,716,597 - Mann , et al. May 6, 2 | 2014-05-06 |
Providing thermal compensation for topographic measurement at an elevated temperature using a non-contact vibration transducer
Grant 8,705,050 - Sinha April 22, 2 | 2014-04-22 |
Securing Opposing Components To A Circuit Board
App 20140087586 - O'Connell; Kevin M. ; et al. | 2014-03-27 |
Implementing Microscale Thermoacoustic Heat And Power Control For Processors And 3d Chipstacks
App 20140083094 - Elison; Bret P. ; et al. | 2014-03-27 |
Implementing Graphene Interconnect For High Conductivity Applications
App 20140083741 - Plucinski; Mark D. ; et al. | 2014-03-27 |
Chassis With An Airflow Adjustment
App 20140073234 - Elison; Bret P. ; et al. | 2014-03-13 |
Horizontally And Vertically Aligned Graphite Nanofibers Thermal Interface Material For Use In Chip Stacks
App 20140070393 - Bartley; Gerald K. ; et al. | 2014-03-13 |
Electronic Module With Laterally-conducting Heat Distributor Layer
App 20140016271 - SINHA; Arvind K. ; et al. | 2014-01-16 |
Electronic module with laterally-conducting heat distributor layer
Grant 8,611,090 - Sinha , et al. December 17, 2 | 2013-12-17 |
Heat Spreader Flatness Detection
App 20130321008 - Sinha; Arvind K. ; et al. | 2013-12-05 |
Heat spreader flatness detection
Grant 8,558,564 - Sinha , et al. October 15, 2 | 2013-10-15 |
Plug and receptacle arrangement with connection sensor
Grant 8,550,840 - Mann , et al. October 8, 2 | 2013-10-08 |
Piezoelectric chromic impact sensor
Grant 8,544,337 - Kuczynski , et al. October 1, 2 | 2013-10-01 |
Implementing Enhanced Dimensional Stability With Graphite Nanotube Hybrid Socket
App 20130178092 - Mann; Phillip V. ; et al. | 2013-07-11 |
Motherboard assembly for interconnecting and distributing signals and power
Grant 8,446,738 - Colbert , et al. May 21, 2 | 2013-05-21 |
Plug And Receptacle Arrangement With Connection Sensor
App 20130122738 - Mann; Phillip V. ; et al. | 2013-05-16 |
Motherboard Assembly for Interconnecting and Distributing Signals and Power
App 20130055192 - Colbert; John L. ; et al. | 2013-02-28 |
Implementing Enhanced Thermal Conductivity In Stacked Modules
App 20130032935 - O'Connell; Kevin M. ; et al. | 2013-02-07 |
System And Method To Process Horizontally Aligned Graphite Nanofibers In A Thermal Interface Material Used In 3d Chip Stacks
App 20130020716 - KUCZYNSKI; Joseph ; et al. | 2013-01-24 |
Use of a Local Constraint to Enhance Attachment of an IC Device to a Mounting Platform
App 20120299201 - Kline; Eric V. ; et al. | 2012-11-29 |
Flux-free detachable thermal interface between an integrated circuit device and a heat sink
Grant 8,289,712 - Holahan , et al. October 16, 2 | 2012-10-16 |
Heat Spreader Flatness Detection
App 20120217983 - Sinha; Arvind K. ; et al. | 2012-08-30 |
Duplex Flexible Heat Exchanger
App 20120138269 - Holahan; Maurice F. ; et al. | 2012-06-07 |
Providing Thermal Compensation for Topographic Measurement at an Elevated Temperature Using a Non-Contact Vibration Transducer
App 20120086952 - Sinha; Arvind K. | 2012-04-12 |
Electronic Module With Laterally-conducting Heat Distributor Layer
App 20120063095 - SINHA; Arvind K. ; et al. | 2012-03-15 |
Method And System For Alignment Of Graphite Nanofibers For Enhanced Thermal Interface Material Performance
App 20120018666 - Kuczynski; Joseph ; et al. | 2012-01-26 |
Flexible Heat Exchanger
App 20110303403 - Holahan; Maurice F. ; et al. | 2011-12-15 |
Implementing Reduced Signal Degradation For Fiber Optic Modules
App 20110182575 - Kuczynski; Joseph ; et al. | 2011-07-28 |
Method and apparatus of changing PCB pad structure to increase solder volume and strength
Grant 7,929,314 - Sinha , et al. April 19, 2 | 2011-04-19 |
Motherboard Assembly for Interconnecting and Distributing Signals and Power
App 20110085313 - Colbert; John L. ; et al. | 2011-04-14 |
Cold plate stability
Grant 7,903,411 - Campbell , et al. March 8, 2 | 2011-03-08 |
Enhanced Connector Cradle Having a Cooling Shell for Preferential Cooling of Wafers
App 20100243716 - Kuczynski; Joseph ; et al. | 2010-09-30 |
Heatsink apparatus for applying a specified compressive force to an integrated circuit device
Grant 7,777,329 - Colbert , et al. August 17, 2 | 2010-08-17 |
Methods for configuring tubing for interconnecting in-series multiple liquid-cooled cold plates
Grant 7,751,918 - Campbell , et al. July 6, 2 | 2010-07-06 |
Electronic assembly and techniques for installing a heatsink in an electronic assembly
Grant 7,701,720 - Colbert , et al. April 20, 2 | 2010-04-20 |
Method And Apparatus Of Changing Pcb Pad Structure To Increase Solder Volume And Strength
App 20090316376 - Sinha; Arvind K. ; et al. | 2009-12-24 |
Forming A Three-dimensional Stackable Die Configuration For An Electronic Circuit Board
App 20090119911 - Sinha; Arvind K. | 2009-05-14 |
Stacked Multiple Electronic Component Interconnect Structure
App 20090119902 - Plucinski; Mark D. ; et al. | 2009-05-14 |
Electronic Assembly and Techniques for Installing a Heatsink in an Electronic Assembly
App 20090083972 - Colbert; John L. ; et al. | 2009-04-02 |
Cold plate stability
Grant 7,499,279 - Campbell , et al. March 3, 2 | 2009-03-03 |
Apparatus And Method For Attaching Heatsinks
App 20090034198 - Colbert; John L. ; et al. | 2009-02-05 |
Cold Plate Stability
App 20080308260 - Campbell; Levi A. ; et al. | 2008-12-18 |
Rework Process And Method For Lead-free Capped Multi-core Modules With Organic Substrates
App 20080265402 - Sinha; Arvind K. | 2008-10-30 |
Methods and Apparatuses for Cold Plate Stability
App 20080266799 - Campbell; Levi A. ; et al. | 2008-10-30 |
Apparatus for restricting rotational moment about a longitudinal axis of SMT connectors
Grant 7,442,053 - Brodsky , et al. October 28, 2 | 2008-10-28 |
Apparatus For Restricting Rotational Moment About A Longitudinal Axis Of Smt Connectors
App 20080220634 - Brodsky; William L. ; et al. | 2008-09-11 |
Method And Apparatus For Restricting Rotational Moment About A Longitudinal Axis Of Smt Connectors
App 20080220624 - Brodsky; William L. ; et al. | 2008-09-11 |
Methods For Configuring Tubing For Interconnecting In-series Multiple Liquid-cooled Cold Plates
App 20080163631 - CAMPBELL; Levi A. ; et al. | 2008-07-10 |
Method and apparatus for restricting rotational moment about a longitudinal axis of SMT connectors
Grant 7,354,281 - Brodsky , et al. April 8, 2 | 2008-04-08 |
Dynamic air moving system
Grant 7,352,575 - Anderl , et al. April 1, 2 | 2008-04-01 |
A Dynamic Air Moving System
App 20080024983 - Anderl; William J. ; et al. | 2008-01-31 |
Heatsink Apparatus for Applying a Specified Compressive Force to an Integrated Circuit Device
App 20080024991 - Colbert; John L. ; et al. | 2008-01-31 |
Topside installation apparatus for land grid array modules
Grant 6,802,733 - Colbert , et al. October 12, 2 | 2004-10-12 |
Method of installing a land grid array multi-chip modules
Grant 6,757,965 - Colbert , et al. July 6, 2 | 2004-07-06 |
Apparatus for mounting a land grid array module
Grant 6,634,095 - Colbert , et al. October 21, 2 | 2003-10-21 |
Holding member for the installation of land grid array multi-chip modules
App 20030192180 - Colbert, John L. ; et al. | 2003-10-16 |
Apparatus and method for determining stiffness properties of an anisotropic electronic substrate using scanning acoustic microscopy
Grant 6,534,964 - Sinha March 18, 2 | 2003-03-18 |
Topside Installation apparatus for land grid array modules
App 20030036301 - Colbert, John L. ; et al. | 2003-02-20 |
Holding member for the installation of land grid array multi-chip modules
App 20030000080 - Colbert, John L. ; et al. | 2003-01-02 |
Land grid array socket actuation hardware for MCM applications
Grant 6,475,011 - Sinha , et al. November 5, 2 | 2002-11-05 |
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