U.S. patent application number 13/123678 was filed with the patent office on 2011-08-11 for compression molding method and compression molding apparatus.
This patent application is currently assigned to TOWA CORPORATION. Invention is credited to Shigeru Hirata, Masanobu Takahashi, Hiroshi Uragami.
Application Number | 20110193261 13/123678 |
Document ID | / |
Family ID | 42119124 |
Filed Date | 2011-08-11 |
United States Patent
Application |
20110193261 |
Kind Code |
A1 |
Uragami; Hiroshi ; et
al. |
August 11, 2011 |
COMPRESSION MOLDING METHOD AND COMPRESSION MOLDING APPARATUS
Abstract
The present invention aims at effectively decreasing the
installation space of an entire semiconductor chip compression
molding apparatus and effectively decreasing the clamping force in
dies which are provided in the apparatus. It further aims at
performing a clamping, in the case where substrates having a
different thickness are used, with an efficient adjustment in
accordance with the thicknesses of the substrates. To this end, the
semiconductor chip compression molding includes two semiconductor
chip compression molding dies (top and bottom dies), and a die
opening/closing means for closing the die surfaces of top dies and
those of bottom dies in each of the upper and lower dies. The die
opening/closing means includes a die opening/closing mechanism
having two racks and one pinion, and a thickness adjustment
mechanism for adjusting the gaps in accordance with the thicknesses
of the substrates supplied to each of the upper and lower dies.
Inventors: |
Uragami; Hiroshi; (Kuse-gun,
JP) ; Takahashi; Masanobu; (Kusatsu-shi, JP) ;
Hirata; Shigeru; (Kusatsu-shi, JP) |
Assignee: |
TOWA CORPORATION
Kyoto-shi, Kyoto
JP
|
Family ID: |
42119124 |
Appl. No.: |
13/123678 |
Filed: |
October 16, 2009 |
PCT Filed: |
October 16, 2009 |
PCT NO: |
PCT/JP2009/005408 |
371 Date: |
April 11, 2011 |
Current U.S.
Class: |
264/279 ;
425/234; 425/89 |
Current CPC
Class: |
B29C 43/36 20130101;
B29C 2043/5841 20130101; B29C 2043/3411 20130101; H01L 21/565
20130101; B29C 2043/5825 20130101; B29K 2105/251 20130101; B29C
2043/3602 20130101; H01L 2924/0002 20130101; B29C 2043/5858
20130101; B29C 33/0088 20130101; B29C 43/34 20130101; B29C 33/20
20130101; B29C 2043/5833 20130101; H01L 2924/0002 20130101; B29C
33/30 20130101; B29C 43/18 20130101; H01L 2924/00 20130101 |
Class at
Publication: |
264/279 ;
425/234; 425/89 |
International
Class: |
B29C 43/18 20060101
B29C043/18; B29C 43/50 20060101 B29C043/50 |
Foreign Application Data
Date |
Code |
Application Number |
Oct 20, 2008 |
JP |
2008-269336 |
Claims
1. A compression molding method comprising the steps of: a)
individually supplying an insert member to each of two compression
molding dies vertically arranged in a stacked fashion; b) supplying
an adequate amount of resin material to each of the two compression
molding dies; c) clamping each of the two compression molding dies;
and d) compression-molding, in each of the two compression molding
dies, the insert member with the resin material to form a molded
product.
2. A compression molding method comprising the steps of a)
individually supplying an insert member to an insert member setting
unit provided in a top die of each of two compression molding dies
vertically arranged in a stacked fashion each having the top die
and a bottom die; b) supplying an adequate amount of resin material
to a compression molding cavity provided in the bottom die of each
of the two compression molding dies and heating the resin material;
c) clamping the top die and the bottom die in each of the two
compression molding dies; and d) pressurizing the resin in the
compression molding cavity in each of the two compression molding
dies to compression-mold the insert member in the compression
molding cavities.
3. The compression molding method according to claim 2, comprising
the step of: in clamping each of the two compression molding dies,
moving the bottom die of the upper compression molding die by a
distance of L and moving the bottom die of the lower compression
molding die by a distance of 2L.
4. The compression molding method according to claim 2, comprising
the step of in clamping each of the two compression molding dies,
clamping them while a distance between a die surface of the top die
and a die surface of the bottom die is adjusted in each of the two
compression molding dies in accordance with a thickness of the
insert member supplied to each of the two compression molding
dies.
5. The compression molding method according to claim 2, comprising
the steps of covering the compression molding cavity in each of the
two compression molding dies with a mold release film; and
supplying the resin material to each cavity which is covered with
the mold release film and heating the resin material.
6. A compression molding apparatus for compression-molding an
insert member with a resin material, having a molding unit
comprising: a) a stacked molding unit in which two compression
molding dies each having a top die and a bottom die are vertically
arranged in a stacked fashion; and b) a die opening/closing means
for opening/closing the two compression molding dies.
7. A compression molding apparatus, having a molding unit
comprising: a) an upper compression molding die and a lower
compression molding die each having a top die and a bottom die and
each being for compression-molding an insert member with a resin
material, the upper compression molding die and the lower
compression molding die being vertically arranged in a stacked
fashion; b) an upper fixed platen for fixing the upper top die; c)
a lower fixed platen provided beneath the upper fixed platen; d) an
adequate number of columns for connecting the upper fixed platen
and the lower fixed platen; e) an intermediate plate provided
between the upper bottom die and the lower top die while fixing
both of them and vertically slidably mounted on one or more of the
columns; f) a slide plate vertically slidably mounted on one or
more of the columns and for fixing the lower bottom die; g) a die
opening/closing means for individually closing a die surface of the
top die and a die surface of the bottom die provided in each of the
compression molding dies; h) a pressure mechanism provided between
the slide plate and the lower fixed platen, for applying a
predetermined clamping pressure to the two compression molding dies
from beneath the slide plate; i) an insert member setting unit
provided on each of the die surfaces of the top dies, on which the
insert member can be supplied and set; j) a compression molding
cavity individually provided on the die surface of each of the
bottom dies; and k) a heater for heating the resin material
supplied to the compression molding cavity.
8. The compression molding apparatus according to claim 6,
comprising: a) an in-loading unit for supplying the insert member
and the resin material to each of the compression molding dies; and
b) an out-loading unit for taking out a molded product from each of
the compression molding dies and the out-loading unit having a
container for containing the molded product.
9. The compression molding apparatus according to claim 8, wherein
each of the in-loading unit, the molding unit, and the out-loading
unit is attachable and detachable among these three units.
10. The compression molding apparatus according to claim 6,
including a plurality of molding units.
11. The compression molding apparatus according to claim 6,
wherein; the die opening/closing means comprises a die
opening/closing mechanism having a rack and pinion mechanism
composed of two racks and one pinion.
12. The compression molding apparatus according to claim 7, wherein
the die opening/closing means has a die opening/closing mechanism
which comprises: a) a rack fixed to one of the columns; b) an other
rack fixed to a rack standing member vertically provided on the
slide plate; c) a pinion rotatably gear-engaged between the two
racks; d) a rotational shaft provided on the pinion; e) a rotation
mechanism for rotating the rotational shaft; f) a bearing unit for
rotatably supporting the rotational shaft; and g) a pinion
suspending member vertically suspended from the intermediate plate
and having the bearing unit at a lower end thereof.
13. The compression molding apparatus according to claim 6, wherein
the die opening/closing means has a thickness adjustment mechanism
for adjusting a distance between the die surface of the top die and
the die surface of the bottom die of each of the upper compression
molding die and the lower compression molding die, in accordance
with a thickness of the insert member supplied to each of the upper
and lower compression molding dies.
14. The compression molding apparatus according to claim 12,
wherein the die opening/closing means has a thickness adjustment
mechanism which comprises: a) a bearing unit main body fixed to the
pinion suspending member to which the other rack is fixed; b) a
slider hole formed in the bearing unit main body; c) a bearing unit
slider which vertically and elastically slides in the slider hole
and rotatably supports the rotational shaft of the pinion; and d)
an elastic member for vertically and elastically sliding the slider
in the slider hole.
15. The molding apparatus according to claim 6, wherein: each of
the two bottom dies has a compression molding cavity having an
inside covered with a mold release film.
16. The compression molding apparatus according to claim 7,
comprising: a) an in-loading unit for supplying the insert member
and the resin material to each of the compression molding dies; and
b) an out-loading unit for taking out a molded product from each of
the compression molding dies and the out-loading unit having a
container for containing the molded product.
17. The compression molding apparatus according to claim 7,
including a plurality of molding units.
18. The compression molding apparatus according to claim 7,
wherein: the die opening/closing means comprises a die
opening/closing mechanism having a rack and pinion mechanism
composed of two racks and one pinion.
19. The compression molding apparatus according to claim 7, wherein
the die opening/closing means has a thickness adjustment mechanism
for adjusting a distance between the die surface of the top die and
the die surface of the bottom die of each of the upper compression
molding die and the lower compression molding die, in accordance
with a thickness of the insert member supplied to each of the upper
and lower compression molding dies.
20. The molding apparatus according to claim 7, wherein: each of
the two bottom dies has a compression molding cavity having an
inside covered with a mold release film.
Description
TECHNICAL FIELD
[0001] The present invention relates to an improved method and
apparatus for compression-molding semiconductor chips mounted on a
substrate with a resin material.
BACKGROUND ART
[0002] Conventionally, a compression molding method is used to
compression-mold semiconductor chips mounted on a substrate with a
resin material. This method is performed in the following
manner.
[0003] A semiconductor chip compression molding die (which is
composed of a top die and a bottom die) is provided in a
semiconductor chip compression molding apparatus. First, a
substrate (insert member) on which semiconductor chips are mounted
is supplied and set on a substrate setting unit provided in the top
die, with the semiconductor-chip-mounting surface facing down. A
resin material (e.g. a granular resin material) is supplied into a
compression molding cavity provided in the bottom die (this cavity
will be hereinafter referred to as a "bottom die cavity") and
heated to be melted, and then both the top die and the bottom die
are clamped.
[0004] In this process, the semiconductor chips mounted on the
substrate are immersed in the heated and melted resin material in
the bottom die cavity.
[0005] Next, a cavity bottom member provided in the bottom of the
bottom die cavity is moved upward to pressurize the resin in the
bottom die cavity.
[0006] When a predetermined period of time required for curing has
elapsed, the top and bottom dies are opened. Accordingly, it is
possible to compression-mold (resin-seal) the semiconductor chips
mounted on the substrate in a resin compact with a shape
corresponding to that of the bottom die cavity, and it is possible
to obtain a molded product (i.e. molded substrate) composed of a
resin compact and a substrate.
BACKGROUND ART DOCUMENT
Patent Document
[0007] [Patent Document 1] JP-A 2007-307766
DISCLOSURE OF THE INVENTION
Problems to be Solved by the Invention
[0008] In compression-molding semiconductor chips mounted on a
substrate by using a semiconductor chip compression molding
apparatus (or a semiconductor chip compression molding die), there
is a demand for efficiently enhancing the productivity of molded
products.
[0009] One approach to meeting this demand is to compression-mold
semiconductor chips mounted on a substrate by using a compression
molding apparatus having a compression molding die in which two (or
more) substrates are horizontally arranged on a die surface to
efficiently increase the productivity of molded products.
[0010] However, this disadvantageously enlarges the entire
compression molding apparatus. Supplying substrates to a
compression molding die in which two substrates are horizontally
arranged, for example, requires a large horizontal area for an
in-loading mechanism.
[0011] Further, in recent years, a clean production environment has
been required in semiconductor production plants. In such a plant,
the horizontal installation space (occupied floor area) of a
semiconductor-related production apparatus is limited.
[0012] The enlargement of a production apparatus is likely to
increase the consumption energy of the apparatus as well as the
energy to maintain the plant so as to meet the current requirement
of cleaning the production environment, which adversely affects the
productivity per unit area in the plant.
[0013] This raises the challenge of efficiently decreasing the
installation space of the entire semiconductor chip compression
molding apparatus.
[0014] Hence, in compression-molding two substrates for example, it
is required to effectively decrease the installation space of a
semiconductor chip compression molding apparatus.
[0015] In the case where a compression molding die in which two
substrates are horizontally arranged on a die surface is clamped
with the minimum clamping pressure, the required clamping force
(energy) is, by a simple computation, approximately twice as high
as the level required in the case where one substrate is clamped
with the minimum clamping pressure.
[0016] That is, clamping a die with two substrates being
horizontally arranged on the die surface requires a larger clamping
force to the die.
[0017] This raises the challenge of efficiently decreasing the
clamping force to the semiconductor chip compression molding die in
compression-molding two substrates.
[0018] In order to solve the aforementioned problems, in the
present invention, two semiconductor chip compression molding dies
are vertically arranged in a semiconductor chip compression molding
apparatus so as to provide the apparatus with a lower semiconductor
chip compression molding die and an upper semiconductor chip
compression molding die.
[0019] Therefore, in the present invention, compared to a
compression molding die in which two substrates are horizontally
arranged, the installation space of the dies can be decreased by
the area of one substrate by a simple computation, which leads to
an efficient decrease of the installation space of the compression
molding apparatus (or die).
[0020] In addition, in the present invention, the dies in each of
which one substrate can be set are vertically arranged. Hence,
under the condition that each die should be clamped with the same
clamping pressure in the case of the compression molding die in
which two substrates are horizontally arranged, the dies needs only
to be clamped with a clamping force that approximately equals the
force required for clamping the die in which one substrate is set,
which leads to an efficient decrease in the clamping force to the
dies.
[0021] The clamping force according to the present invention can
also be schematically explained as follows: In the present
invention, the system for clamping (pressurizing) substrates is
designed so that two substrates can be clamped with the minimum
force, i.e. the force required for clamping one substrate; this is
achieved by vertically arranging two compression molding dies, each
of which is capable of compression-molding one substrate, in such a
manner that the two substrates are arranged in the
three-dimensional space and appear as a single substrate when
viewed from above.
[0022] The present invention uses a semiconductor chip compression
molding apparatus (compression molding method) having a lower
semiconductor chip compression molding die and an upper
semiconductor chip compression molding die. Therefore, it is
required to efficiently clamp the lower semiconductor chip
compression molding die and the upper semiconductor chip
compression molding die.
[0023] In the case where a substrate is supplied to each of the two
vertically arranged dies provided in the semiconductor chip
compression molding apparatus and the dies are clamped, the
supplied substrates may be different in thickness.
[0024] In such a case, a gap may be generated in one of the two
dies, which causes a difficulty in efficiently clamping the two
dies. Additionally, the substrate may be clamped with an excessive
clamping force. The present invention aims at solving both these
problems at the same time.
[0025] Therefore, in the present invention, when substrates with a
different thickness are used, it is required to efficiently adjust
the semiconductor chip compression molding apparatus (die) in
accordance with the thicknesses of the substrates to clamp the
dies.
[0026] That is, the present invention aims at providing a
compression molding method and compression molding apparatus
capable of effectively decreasing the installation space of the
entire compression molding apparatus.
[0027] In addition, the present invention aims at providing a
compression molding method and compression molding apparatus
capable of effectively decreasing the clamping force in the
compression molding apparatus (die).
[0028] Further, with respect to the configuration where two
compression molding dies are arranged in a stacked fashion in a
compression molding apparatus, the present invention aims at
providing a compression molding method and a compression molding
apparatus capable of effectively clamping the two compression
molding dies.
[0029] In addition, with respect to the configuration where two
compression molding dies are arranged in a stacked fashion in a
semiconductor chip compression molding apparatus and where
substrates (insert members) having a different substrate thickness
are used, the present invention aims at a compression molding
method and a compression molding apparatus capable of effectively
adjusting and clamping the two compression molding dies provided in
the semiconductor chip compression molding apparatus in accordance
with the thicknesses of the substrates (insert members).
Means for Solving the Problem
[0030] To solve the aforementioned technical problems, the present
invention provides a compression molding method including the steps
of:
[0031] a) individually supplying an insert member to each of two
compression molding dies vertically arranged in a stacked
fashion;
[0032] b) supplying an adequate amount of resin material to each of
the two compression molding dies;
[0033] c) clamping each of the two compression molding dies;
and
[0034] d) compression-molding, in each of the two compression
molding dies, the insert member with the resin material to farm a
molded product.
[0035] To solve the aforementioned technical problems, the present
invention provides a compression molding method including the steps
of:
[0036] a) individually supplying an insert member to an insert
member setting unit provided in a top die of each of two
compression molding dies vertically arranged in a stacked fashion
each having the top die and a bottom die;
[0037] b) supplying an adequate amount of resin material to a
compression molding cavity provided in the bottom die of each of
the two compression molding dies and heating the resin
material;
[0038] c) clamping the top die and the bottom die in each of the
two compression molding dies; and
[0039] d) pressurizing the resin in the compression molding cavity
in each of the two compression molding dies to compression-mold the
insert members in the compression molding cavities.
[0040] To solve the aforementioned technical problems, the
compression molding method according to the present invention may
include the step of:
[0041] in clamping each of the two compression molding dies, moving
the bottom die of the upper compression molding die by a distance
of L and moving the bottom die of the lower compression molding die
by a distance of 2L.
[0042] To solve the aforementioned technical problems, the
compression molding method according to the present invention may
include the step of:
[0043] in clamping each of the two compression molding dies,
clamping them while a distance between a die surface of the top die
and a die surface of the bottom die is adjusted in each of the two
compression molding dies in accordance with a thickness of the
insert member supplied to each of the two compression molding
dies.
[0044] To solve the aforementioned technical problems, the
compression molding method according to the present invention may
include the steps of
[0045] covering the compression molding cavity in each of the two
compression molding dies with a mold release film; and
[0046] supplying the resin material to each cavity which is covered
with the mold release film and heating the resin material.
[0047] To solve the aforementioned technical problems, the present
invention provides a compression molding apparatus for
compression-molding an insert member with a resin material, having
a molding unit including:
[0048] a) a stacked molding unit in which two compression molding
dies each having a top die and a bottom die are vertically arranged
in a stacked fashion; and
[0049] b) a die opening/closing means for opening/closing the two
compression molding dies.
[0050] To solve the aforementioned technical problems, the present
invention provides a compression molding apparatus, having a
molding unit which includes:
[0051] a) an upper compression molding die and a lower compression
molding die each having a top die and a bottom die and each being
for compression-molding an insert member with a resin material, the
upper compression molding die and the lower compression molding die
being vertically arranged in a stacked fashion;
[0052] b) an upper fixed platen for fixing the upper top die;
[0053] c) a lower fixed platen provided beneath the upper fixed
platen;
[0054] d) an adequate number of columns for connecting the upper
fixed platen and the lower fixed platen;
[0055] e) an intermediate plate provided between the upper top die
and the lower top die while fixing both of them, and vertically
slidably mounted on one or more of the columns;
[0056] f) a slide plate vertically slidably mounted on one or more
of the columns and for fixing the lower bottom die;
[0057] g) a die opening/closing means for individually closing a
die surface of the top die and a die surface of the bottom die
provided in each of the compression molding dies;
[0058] h) a pressure mechanism provided between the slide plate and
the lower fixed platen, for applying a predetermined clamping
pressure to the two compression molding dies from beneath the slide
plate;
[0059] i) an insert member setting unit provided on each of the die
surfaces of the top dies, on which the insert member can be
supplied and set;
[0060] j) a compression molding cavity individually provided on the
die surface of each of the bottom dies; and
[0061] k) a heater for heating the resin material supplied to the
compression molding cavity.
[0062] To solve the aforementioned technical problems, in the
compression molding apparatus according to the present invention,
the die opening/closing means may include a die opening/closing
mechanism having a rack and pinion mechanism composed of two racks
and one pinion.
[0063] To solve the aforementioned technical problems, in the
compression molding apparatus according to the present invention,
the die opening/closing means may have a die opening/closing
mechanism which includes:
[0064] a) a rack fixed to one of the columns;
[0065] b) an other rack fixed to a rack standing member vertically
provided on the slide plate;
[0066] c) a pinion rotatably gear-engaged between the two
racks;
[0067] d) a rotational shaft provided on the pinion;
[0068] e) a rotation mechanism for rotating the rotational
shaft;
[0069] f) a bearing unit for rotatably supporting the rotational
shaft; and
[0070] g) a pinion suspending member vertically suspended from the
intermediate plate and having the bearing unit at a lower end
thereof.
[0071] To solve the aforementioned technical problems, in the
compression molding apparatus according to the present invention,
the die opening/closing means may have a thickness adjustment
mechanism for adjusting a distance between the die surface of the
top die and the die surface of the bottom die of each of the upper
compression molding die and the lower compression molding die, in
accordance with a thickness of the insert member supplied to each
of the upper and lower compression molding dies,
[0072] To solve the aforementioned technical problems, in the
compression molding apparatus according to the present invention,
the die opening/closing means may have a thickness adjustment
mechanism which includes:
[0073] a) a bearing unit main body fixed to the pinion suspending
member to which the other rack is fixed;
[0074] b) a slider hole formed in the bearing unit main body;
[0075] c) a bearing unit slider which vertically and elastically
slides in the slider hole and rotatably supports the rotational
shaft of the pinion; and
[0076] d) an elastic member for vertically and elastically sliding
the slider in the slider hole.
[0077] To solve the aforementioned technical problems, in the
compression molding apparatus according to the present invention,
each of the two bottom dies may have a compression molding cavity
having an inside covered with a mold release film.
Effects of the Invention
[0078] In the present invention, a semiconductor chip compression
molding apparatus (a semiconductor chip compression molding method)
has a stacked molding mechanism in which two semiconductor chip
compression molding dies are vertically arranged in a stacked
fashion. Hence, compared to the configuration in which two
semiconductor chip compression molding dies are horizontally
arranged, the present invention can advantageously provide a
compression molding method and a compression molding apparatus
capable of effectively decreasing the installation space of the
entire compression molding apparatus.
[0079] As previously described, in the present invention, the
semiconductor chip compression molding apparatus (the semiconductor
chip compression molding method) has a stacked molding mechanism in
which two semiconductor chip compression molding dies are
vertically arranged in a stacked fashion. Hence, compared to the
configuration in which two semiconductor chip compression molding
dies are horizontally arranged, the present invention can
advantageously provide a compression molding method and compression
molding apparatus capable of effectively decreasing the clamping
force in the compression molding apparatus (dies).
[0080] In the present invention, the semiconductor chip compression
molding apparatus (the semiconductor chip compression molding
method) includes: a stacked molding mechanism in which two
semiconductor chip compression molding dies are vertically arranged
in a stacked fashion; and a rack and pinion mechanism composed of
two racks and one pinion as the die opening/closing means (die
opening/closing mechanism).
[0081] Therefore, in the case where two compression molding dies
are arranged in a stacked fashion in a semiconductor chip
compression molding apparatus, the present invention can
advantageously provide a compression molding method and a
compression molding apparatus capable of effectively clamping the
two compression molding dies.
[0082] In addition, in the case where two compression molding dies
are arranged in a stacked fashion in a semiconductor chip
compression molding apparatus and where substrates (insert members)
having different substrate thicknesses are used, the present
invention can advantageously provide a compression molding method
and a compression molding apparatus capable of effectively
adjusting and clamping the two compression molding dies provided in
the semiconductor chip compression molding apparatus in accordance
with the thicknesses of the substrates (insert members).
BRIEF DESCRIPTION OF THE DRAWINGS
[0083] FIG. 1 is a schematic plain view schematically showing the
semiconductor chip compression molding apparatus according to the
present invention.
[0084] FIG. 2 is a schematic front view schematically showing a
stacked molding mechanism unit which is the main portion of the
molding unit of the compression molding apparatus illustrated in
FIG. 1, and illustrates the state in which the two semiconductor
chip compression molding dies vertically arranged in the stacked
molding mechanism unit are open.
[0085] FIG. 3 is a schematic front view schematically showing the
stacked molding mechanism unit (two semiconductor chip compression
molding dies) in the apparatus corresponding to that of FIG. 2, and
illustrates the state in which the dies are closed.
[0086] FIG. 4 is a magnified schematic front view schematically
showing the magnified main portion of the die illustrated in FIG.
3.
[0087] FIG. 5 is a magnified schematic vertical sectional view
schematically showing the magnified main portion of the die
illustrated in FIG. 3.
BEST MODE FOR CARRYING OUT THE INVENTION
[0088] The present invention will be described in detail with
reference to the figures of the embodiments.
[0089] FIG. 1 shows a semiconductor chip compression molding
apparatus according to the present invention.
[0090] FIGS. 2 and 3 show a stacked molding mechanism unit (in
which semiconductor chip compression molding dies are vertically
arranged) in the apparatus illustrated in FIG. 1.
[0091] FIG. 4 shows a die opening/closing means (die
opening/closing mechanism) in the stacked molding mechanism unit
illustrated in FIG. 3.
[0092] FIG. 5 shows a die opening/closing means (thickness
adjustment mechanism) in the stacked molding mechanism unit
illustrated in FIG. 3.
(Configuration of the Semiconductor Chip Compression Molding
Apparatus)
[0093] As shown in FIG. 1, a semiconductor chip compression molding
apparatus 1 according to the present invention is composed of a
molding unit A for compression-molding (or resin-sealing and
molding), with a resin material, a substrate 2 (insert member) on
which semiconductor chips are mounted; an in-loading unit B for
supplying the substrate 2 (a substrate before molding) onto which
semiconductor chips have been mounted in an in-loading mechanism D
(or a mechanism for conveying a material before molding) and a
resin material (e.g. a granular resin material) to the molding unit
A; and an out-loading unit C for taking out and receiving a molded
product 3 (the substrate 2 and a resin compact 35) which has been
compression-molded in the molding unit A by an out-loading
mechanism E (or a molded product conveying mechanism).
[0094] On the front side 1a of the molding apparatus 1, a moving
area F of the in-loading mechanism D and a moving area G of the
out-loading mechanism E are provided.
[0095] As illustrated in FIG. 1, with the in-loading mechanism D,
the substrate 2 and the resin material are first supplied from the
in-loading unit B to the molding unit A where the substrate 2 is
compression-molded into a molded product 3. Then, with the
out-loading mechanism E, the molded product 3 is taken out from the
molding unit A and received in the out-loading unit C.
[0096] The in-loading unit B, the molding unit A, and the
out-loading unit C are attachably and removably connected to each
other in line in this order with unit connectors H.
(Configuration of the Molding Unit)
[0097] As shown in FIG. 1, a stacked molding mechanism unit 4 (a
molding apparatus which has a double layer structure) for
compression-molding a substrate 2 on which semiconductor chips are
mounted is provided on the back side 1b of the apparatus in the
molding unit A.
[0098] Therefore, in the stacked molding mechanism unit (stacked
die mechanism unit) 4, semiconductor chips mounted on the substrate
2 are compression-molded and a molded product (molded substrate) 3
can be faulted.
(Configuration of the Stacked Molding Mechanism Unit)
[0099] As shown in FIGS. 2 and 3, in the stacked molding mechanism
unit 4, two semiconductor chip compression molding dies are
vertically provided in a stacked fashion.
[0100] That is, the stacked molding mechanism unit 4 includes an
upper semiconductor chip compression molding die 5, which is
located in the upper portion of the mechanism unit, and a lower
semiconductor chip compression molding die 6, which is located in
the lower portion of the mechanism unit.
[0101] The upper compression molding die 5 is composed of a top die
5a and a bottom die 5b which faces the top die 5a. The lower
compression molding die 6 is composed of a top die 6a and a bottom
die 6b which faces the top die 6a.
[0102] Therefore, in each of the two pairs of dies 5 and 6 (the top
and bottom dies 5a and 5b, or the top and bottom dies 6a and 6b)
vertically stacked in the stacked molding mechanism unit 4, a
substrate 2 on which semiconductor chips are mounted can be
individually (i.e. separately at each die) compression-molded with
a granular resin material (granular resin) for example to form a
molded product 3.
[0103] As will be described later, each of the upper compression
molding die 5 and the lower compression molding die 6 (upper and
lower dies 5 and 6) includes a top die substrate setting unit 19
and a compression molding bottom die cavity 21.
[0104] The stacked molding mechanism unit 4 includes an upper fixed
platen 7 and a lower fixed platen 8 provided beneath the upper
fixed platen 7. The upper fixed platen 7 and the lower fixed platen
8 are fixed to a predetermined number (four in the illustrated
example) of columns (tie bars) 9.
[0105] Between the upper fixed platen 7 and the lower fixed platen
8, an intermediate plate (intermediate moving plate) 10 is
vertically slidably mounted on the predetermined number of columns
9.
[0106] Between the intermediate plate 0 and the lower fixed platen
8, a slide plate (bottom moving plate) 11 is vertically slidably
mounted on the predetermined number of columns 9 in the same manner
as the intermediate plate 10.
[0107] The top die 5a of the upper die 5 is (immovably) attached
onto the lower side of the upper fixed platen 7.
[0108] The bottom die 5b of the upper compression molding die 5 is
attached onto the upper side of the intermediate plate 10. The top
die 6a of the lower compression molding die 6 is attached onto the
lower side of the intermediate plate 10.
[0109] The bottom die 6b of the lower die 6 is attached onto the
upper side of the slide plate 11.
[0110] The upper bottom die 5b, the intermediate plate 10, and the
lower top die 6a can be vertically moved integrally with each
other.
[0111] The lower bottom die 6b and the slid plate 11 can be
vertically moved integrally with each other.
[0112] As shown in FIGS. 2 and 3, the stacked molding mechanism
unit 4 includes a die opening/closing means 12 for interlockingly
and simultaneously opening or closing the die surface of the top
die 5a and that of the bottom die 5b, and that of the top die 6a
and that of the bottom die 6b in each of the upper compression
molding die 5 and the lower compression molding die 6 (upper and
lower dies 5 and 6), as will be described later.
[0113] Therefore, in the stacked molding mechanism unit 4, the
intermediate plate 10 and the slide plate 11 can be individually
moved upward by using the die opening/closing means 12 so that the
die surface of the top die 5a and that of the bottom die 5b in the
upper die 5 will be closed, whereby the top and bottom dies 5a and
5b can be clamped (refer to FIGS. 2 and 3).
[0114] At the same time, the die surface of the bottom die 6a and
that of the bottom die 6b in the lower die 6 will also be closed,
whereby the top and bottom dies 6a and 6b can be clamped.
[0115] In the illustrated example, there are four sets of the die
opening/closing means 12 attached to the four columns 9,
respectively.
[0116] As will be described later, the die opening/closing means 12
is composed of: a die opening/closing mechanism 13 for opening or
closing the die surfaces of the top dies 5a and 6a and those of the
bottom dies 5b and 6b in the upper and lower dies 5 and 6; and a
thickness adjustment mechanism 14, which has a floating structure,
for adjusting the thicknesses of two substrates 2 (2a and 2b)
sandwiched between the die surfaces of the top dies 5a and 6a as
well as between those of the bottom dies 5b and 6b.
[0117] As will be described later, a rack and pinion mechanism is
used for the die opening/closing mechanism 13, which is composed of
two racks and one pinion 17 gear-engaged between these two
racks.
[0118] As will be described later, in the rack and pinion mechanism
of the die opening/closing mechanism 13, one rack (column-side rack
15) is fixedly installed on the side of the column 9 and the other
rack (slide-plate-side rack 16) is installed on the side of the
slide plate 11. The pinion 17 which is gear-engaged between the two
racks is installed on the side of the intermediate plate 10 (refer
to FIG. 4).
[0119] As will be described later, in the case where the substrates
2 supplied to the upper and lower dies 5 and 6 have different
thicknesses (e.g. a thick substrate 2a and thin substrate 2b shown
in FIG. 5), the intermediate plate 15 (including the bottom die 5b
and the top die 6a) is moved upward or downward due to the
elasticity of the elastic member 34 in the thickness adjustment
mechanism 14, whereby the thicknesses of the substrates 2 (2a and
2b) can be efficiently adjusted in each of the upper and lower dies
5 and 6.
[0120] Hence, as will be described later, the die surface of the
top die 5a (6a) and that of the bottom die 5b (6b) can be closed to
be clamped in each of the upper and lower dies 5 and 6, by rotating
the pinion 17 to move the pinion 17 (and the intermediate plate 10)
upward and move the slide-plate-side rack 16 (and the slide plate
11) upward in the die opening/closing means 12 (die opening/closing
mechanism 13).
[0121] In this process, the pinion 17 (and the intermediate plate
10) is moved upward by distance L and the slide-plate-side rack 16
(and the slide plate 11) is moved upward by distance 2L.
[0122] The slide-plate-side rack 16 (and the slide plate 11) is
moved by L relative to the pinion 17.
[0123] In this process, as will be described later, in each of the
upper and lower dies 5 and 6, the distance between the die surface
of the top die 5a and that of the bottom die 5b, and the distance
between the die surface of the top die 6a and that of the bottom
die 6b can be efficiently adjusted in accordance with the
thicknesses of the substrates 2 (2a and 2b) by the thickness
adjustment mechanism 14.
[0124] Provided between the slide plate 11 and the lower fixed
platen 8 is a pressure mechanism 18 (slide plate vertical pressure
mechanism) for pressing the upper and lower dies 5 and 6 on each
other with a predetermined clamping pressure (predetermined
clamping force) in clamping the upper and lower dies 5 and 6 by the
die opening/closing means 12 (when they are clamped by the stacked
molding mechanism 4).
[0125] Therefore, in the stacked molding mechanism 4 (upper and
lower dies 5 and 6), each of the upper and lower dies 5 and 6 can
be individually clamped by closing the die surfaces by the die
opening/closing means 12 (die opening/closing mechanism 13), and
each of the upper and lower dies 5 and 6 can be individually
pressed on each other with a predetermined clamping pressure
(clamping force) by the pressure mechanism 18.
[0126] In addition, in clamping the upper and lower dies 5 and 6 by
the die opening/closing means 12 (die opening/closing mechanism
13), the slide plate 11 can be supplementarily moved upward or
downward by the pressure mechanism 18.
[0127] Hence, each of the upper and lower dies 5 and 6 can be
clamped with a predetermined clamping pressure by the die
opening/closing means 12 (die opening/closing mechanism 13) and the
pressure mechanism 18.
(Effects of Stacking the Dies in the Stacked Molding Mechanism
Unit)
[0128] In the present invention, the stacked molding mechanism unit
4 in which two compression molding dies 5 and 6 are vertically
stacked is provided in the semiconductor chip compression molding
apparatus 1 (molding unit A).
[0129] Hence, the semiconductor chip compression molding apparatus
1 according to the present invention practically has the
configuration of a semiconductor chip compression molding die for
one horizontally-placed substrate.
[0130] Therefore, compared to a semiconductor chip compression
molding apparatus in which a compression molding die for two
horizontally-placed substrates is provided, the present invention
can effectively decrease the installation space of the entire
apparatus.
[0131] In the semiconductor chip compression molding apparatus 1
according to the present invention, two semiconductor chip
compression molding dies 5 and 6 are stacked. Such a configuration
is practically equivalent to a semiconductor chip compression
molding die (apparatus 1) in which one horizontally-placed
substrate is clamped with a predetermined clamping pressure.
[0132] Therefore, compared to a semiconductor chip compression
molding apparatus in which a compression molding dies for two
horizontally-placed substrates is provided, the present invention
can effectively reduce the clamping force in the compression
molding apparatus 1 (dies 5 and 6) according to the present
invention.
(Configuration of the Upper and Lower Compression Molding Dies)
[0133] The upper compression molding die 5 and the lower
compression molding die 6 in the stacked molding mechanism unit 4
in the present invention will be described.
[0134] Each of the upper compression molding die 5 and the lower
compression molding die 6 (each of the upper and lower dies 5 and
6) has the same die configuration.
[0135] As shown in FIGS. 2 and 3, a substrate setting unit 19
(insert member setting unit) of the top die 5a for supplying a
substrate 2 with semiconductor chips mounted on the
downward-directed side, and suction holes 20 (substrate suction
means) as a substrate fixing means for fixing the substrate 2 (2a
or 2b) on the substrate setting unit 19, are provided on the die
surface of the top die of the upper compression molding die 5.
[0136] As shown in FIGS. 2 and 3, a compression molding cavity 21
of the bottom die 5b with an upwardly-open opening and a cavity
bottom member 22 for pressurizing resin provided on the bottom of
the bottom die cavity 21 are provided on the die surface of the
bottom die 5b of the lower compression molding die 5.
[0137] Although not shown, a heater for heating the upper
compression molding die 5 to a predetermined temperature is
provided in the die 5.
[0138] In the in-loading mechanism D, the substrate 2 on which
semiconductor chips are mounted is supplied and set on the
substrate setting unit 19 of the top die 5a and air is forcedly
sucked from the suction holes provided on the die surface of the
top die 5a, whereby the substrate 2 can be fixed by suction onto
the substrate setting unit 19.
[0139] In the in-loading mechanism D, a predetermined amount of
resin material (granular resin) is supplied into the bottom die
cavity 21 to be heated and melted.
[0140] Hence, by clamping the upper compression molding die 5 (the
top and bottom dies 5a), the semiconductor chips mounted on the
substrate 2 which has been supplied and set on the substrate
setting unit 19 of the top die are immersed in the resin material
which has been heated and melted in the bottom die cavity 21, and
simultaneously a predetermined resin pressure is applied to the
resin in the bottom die cavity 21 by the cavity bottom member
22.
[0141] Accordingly, in the bottom die cavity 21, semiconductor
chips are compression-molded (sealed and molded with resin) in a
resin compact 35 with a shape corresponding to that of the bottom
die cavity 21, and a molded product 3 (the resin compact 35 and the
substrate 2) can be formed by the upper compression molding die
5.
[0142] Similar to the upper compression molding die 5, the lower
compression molding die 6 also has a substrate setting unit 19
provided on the top die 6a, a compression molding cavity 21
provided on the bottom die 6b, a cavity bottom member 22, and a
heater (not shown).
[0143] Hence, in the lower compression molding die 6, as in the
upper compression molding die 5, semiconductor chips mounted on a
substrate 2 are compression-molded (sealed and molded with resin)
in a resin compact 35 with a shape corresponding to that of the
bottom die cavity 21, whereby a molded product 3 (the resin compact
35 and the substrate 2) can be formed,
(Configuration of the In-Loading Mechanism)
[0144] As shown in FIG. 2, the in-loading mechanism D is composed
of, for example, an upper in-loading unit 23, a lower in-loading
unit 24 provided beneath the upper in-loading unit 23, and an
in-loading connector 25 for connecting the upper in-loading unit 23
and the lower in-loading unit 24.
[0145] As shown in FIG. 1, the in-loading mechanism D can
reciprocate between the in-loading unit B and the molding unit A
along the in-loading mechanism moving area F.
[0146] In the in-loading unit B, a substrate 2 and a resin material
(granular resin) can be fastened (or placed) to be individually set
to each of the upper in-loading unit 23 and the lower in-loading
unit 24.
[0147] That is, first, in the in-loading unit B, the substrate 2
and the resin material are individually fastened and set to each of
the upper in-loading unit 23 and the lower in-loading unit 24 in
the in-loading mechanism D, and the in-loading mechanism D can be
moved from the in-loading unit B to the molding unit A along the
in-loading mechanism moving area F.
[0148] Next, in the stacked molding mechanism unit 4 in the molding
unit A, the upper in-loading unit 23 can be made to enter the upper
die 5 (into the space between the top and bottom dies 5a and
5b).
[0149] At the same time, the lower in-loading unit 24 can be made
to enter the lower die 6 (into the space between the top and bottom
dies 6a and 6b).
[0150] Accordingly, in the upper die 5, the substrate 2 can be
supplied and set on the substrate setting unit 19 of the top die 5a
and the resin material can be supplied into the cavity 21 of the
bottom die 5b by the upper in-loading unit 23.
[0151] At this point in time, in the lower die 6, the substrate 2
can be supplied and set on the substrate setting unit 19 of the top
die 6a and the resin material can be supplied into the cavity 21 of
the bottom die 6b by the lower in-loading unit 24.
(Configuration of the Out-Loading Mechanism)
[0152] Although not shown, the out-loading mechanism E is composed
of, (similar to the in-loading mechanism D), an upper out-loading
unit, a lower out-loading unit provided beneath the upper
out-loading unit, and an out-loading connector for connecting the
upper out-loading unit and the lower out-loading unit, for
example.
[0153] As shown in FIG. 1, the out-loading mechanism E can
reciprocate between the out-loading unit C and the molding unit A
along the out-loading mechanism moving area G.
[0154] In the out-loading unit C, each molded product 3 can be
taken out and received individually from the upper out-loading unit
and the lower out-loading unit.
[0155] That is, first, in the stacked molding mechanism unit 4 in
the molding unit A, the upper out-loading unit can be made to enter
the space between the upper top and bottom dies 5a and 5b to take
out (by fastening) the molded product 3 from the die surface of the
bottom die 5b.
[0156] At the same time, the lower out-loading unit can be made to
enter the space between the lower top and bottom dies 6a and 6b to
take out (by fastening) the molded product 3 from the die surface
of the bottom die 6b.
[0157] Next, the out-loading mechanism unit E can be moved from the
molding unit A to the out-loading unit C along the out-loading
mechanism moving area G.
[0158] Subsequently, in the out-loading unit C, each molded
products 3 can be taken out and received individually from the
upper out-loading unit and the lower out-loading unit of the
out-loading mechanism E.
(Configuration of the Die Opening/Closing Means)
[0159] As previously described, the die opening/closing means 12 is
composed of the die opening/closing mechanism 13 for individually
opening or closing the upper and lower dies 5 and 6 and the
thickness adjustment mechanism 14 for performing an adjustment
corresponding to the thicknesses of the substrates 2 which are
individually clamped (sandwiched) by the upper and lower dies 5 and
6.
[0160] Therefore, by using the die opening/closing means 12, each
of the upper and lower dies 5 and 6 can be individually clamped by
the die opening/closing mechanism 13, and the thicknesses of the
substrates 2 sandwiched by the upper and lower dies 5 and 6 can be
individually adjusted by the thickness adjustment mechanism 14.
(The Die Opening/Closing Mechanism in the Die Opening/Closing
Means)
[0161] As shown in FIGS. 4 and 5, in the die opening/closing
mechanism 13 of the die opening/closing means 12, a column-side
lack 15 is vertically fixed to a predetermined position of the
column 9 between the intermediate plate 10 and the slide plate
11.
[0162] In the die opening/closing mechanism 13, the
slide-plate-side rack 16 is vertically fixed to a predetermined
position of the rack standing member 26 vertically installed on the
slide plate 11.
[0163] The pinion 17 is provided between the column-side rack 15
and the side-plate-side rack 16 in such a manner as to be
gear-engaged to these two racks.
[0164] In the die opening/closing mechanism 13, a rotational shaft
27 coaxially fixed to the pinion 17, and a rotation mechanism 28
such as a motor is connected to the rotational shaft 27.
[0165] Hence, the pinion 17 can be rotated in the forward or
backward direction by the rotation mechanism 28 through the
rotational shaft 27.
[0166] Provided between the pinion 17 and the rotation mechanism 28
is a bearing unit 29 (including the thickness adjustment mechanism
14 which will be described later), which has a floating structure,
for rotatably supporting the rotational shaft 27.
[0167] In the die opening/closing mechanism 13, a pinion suspending
member 30 is suspended from the intermediate plate 10, and the
bearing unit 29, in which the pinion 17 (rotational shaft 27) is
rotatably provided, is fixedly provided at the lower end of the
pinion suspending member 30.
[0168] Next, the opening/closing operation of the die
opening/closing mechanism 13 (rack and pinion mechanism) will be
described with reference to FIGS. 2 through 5.
[0169] First, the operation of clamping the upper and lower dies 5
and 6 is described. In the example illustrated in FIG. 4, the
counterclockwise direction on the figure is the normal direction.
When rotated in the normal direction in the state of being engaged
with the column-side rack 15 fixed to the column 9, the pinion 17
moves upward.
[0170] Hence, the pinion 17, the pinion suspending member 30, and
the intermediate plate 10 can be integrally moved (or pushed)
upward (refer to FIG. 5).
[0171] At the same time, the slide-plate-side rack 16 fixed to the
rack standing member 26 (slide plate 11) can be moved (or pulled)
upward by the pinion 17 rotating in the normal direction and moving
upward.
[0172] Accordingly, the rack standing member 26, the
slide-plate-side rack 16 and the slide plate 11 can be integrally
moved upward.
[0173] In the example illustrated in FIG. 4, the clockwise
direction on the figure is the reverse direction. When rotated in
the reverse direction in the state of being engaged with the
column-side rack 15, the pinion 17 moves downward.
[0174] Hence, the pinion 17, the pinion suspending member 30, and
the intermediate plate 10 can be integrally moved downward.
[0175] At the same time, the slide-plate-side rack 16 fixed to the
rack standing member 26 (slide plate 11) can be moved downward by
the pinion 17 rotating in the reverse direction and moving
downward.
[0176] Accordingly, the rack standing member 26, the
slide-plate-side rack 16 and the slide plate 11 can be integrally
moved downward.
[0177] That is, by rotating the pinion 17 in the normal or reverse
direction by the rotation mechanism 28 (rotational shaft 27) in the
die opening/closing mechanism 13, the intermediate plate 10 and the
slide plate 11 can be interlockingly and simultaneously moved
upward or downward.
[0178] Accordingly, in each of the upper and lower dies 5 and 6,
the die surfaces of the top dies 5a and 6a and those of the bottom
dies 5b and 6b can be individually closed.
(Moving Distance by the Die Opening/Closing Mechanism)
[0179] The moving distance (stroke) of the intermediate plate 10
and the moving distance (stroke) of the slide plate 11 by the die
opening/closing mechanism 13 which uses a rack and pinion mechanism
will be described (with reference to FIG. 3).
[0180] For example, if the pinion 17 is rotated in the normal
direction by (arc) distance L along the circumference (for a given
period of time), the pinion 17 which rotates along the arc
(distance) L is moved upward along the column-side rack 15 by the
same distance L.
[0181] Hence, the die surface of the bottom die 5b installed on the
intermediate plate 10 fixed to the pinion 17 through the pinion
suspending member 30 is moved upward by distance L.
[0182] At the same time, the slide-plate-side rack 16 fixed to the
rack standing member 26 is moved upward by distance L relative to
the position of the pinion 17.
[0183] That is, the die surface of the bottom die 6b installed on
the slide plate 11 is moved upward by distance L relative to the
pinion 17.
[0184] Therefore, the slide-plate-side rack 16 fixed to the rack
standing member 26 is practically moved upward by distance 2L, the
sum of the distance L by which the pinion 17 is moved upward along
the column-side rack 15 and the distance L by which the
slide-plate-side rack 16 itself is moved relative to the pinion
17.
[0185] Accordingly, when the intermediate plate 10 (and the pinion
17) is moved upward by distance L, the slide plate 11 (and the
slide-plate-side rack 16) is moved upward by distance 2L.
[0186] At the same time, as a matter of course, the die surface of
the bottom die 5b of the upper die 5 can be moved upward by
distance L, and the die surface of the bottom die 6b of the lower
die 6 can be moved upward by distance 2L.
[0187] The operation of opening the upper and lower dies 5 and 6 by
the die opening/closing mechanism 13 is similar to the previously
described clamping operation.
[0188] That is to say, when the intermediate plate 10 (and the
pinion 17) is moved downward by distance L, the slide plate 11 (and
the slide-plate-side rack 16) is moved downward by distance 2L.
(Thickness Adjustment Mechanism of the Die Opening/Closing
Means)
[0189] As previously described, the bearing unit 29 includes the
thickness adjustment mechanism 14 having a floating structure.
[0190] The thickness adjustment mechanism 14 is composed of: a
bearing unit main body 31; a bearing unit slider 32 which receives
the rotational shaft 27; and a slider hole 33 of the bearing unit
main body for sliding the slider 32 upward or downward.
[0191] In the thickness adjustment mechanism 14 and inside the
slider hole 33 of the main body, an elastic member 34 such as a
compression spring for elastically sliding the slider 32 upward or
downward is provided above and below the slider 32,
respectively.
[0192] Hence, in the slider hole 33 of the main body, the slider 32
can be elastically slid upward or downward by the elastic members
34.
[0193] In the slider hole 33 in the main body 31 of the bearing
unit, the slider 32 including the pinion 17 and the rotational
shaft 27 can be slid (floated) upward or downward by the elasticity
of the elastic members 34.
[0194] That is, in the case where two substrates 2 (2a and 2b)
having different substrate thicknesses are individually supplied
and set to each of the upper and lower dies 5 and 6 and clamped by
the die opening/closing mechanism 13 of the opening/closing means
12, the two substrates 2 (2a and 2b) having different thicknesses
can be efficiently and individually sandwiched by the die surfaces
in accordance with their different thicknesses by the thickness
adjustment mechanism 14 (refer to FIG. 5).
[0195] Hence, by using the thickness adjustment mechanism 14, it is
possible to efficiently and individually adjust the distances
(interspaces) between the die surfaces in accordance with two
substrates 2 (2a and 2b) having different thicknesses.
[0196] Therefore, in clamping the upper and lower dies 5 and 6 in
the stacked molding mechanism unit 4, it is possible to efficiently
prevent the formation of a gap between the die surface (bottom die
surface) and the substrate 2 (the surface on which semiconductor
chips are mounted) in each of the upper and lower dies 5 and 6.
[0197] In addition, in clamping the upper and lower dies 5 and 6,
it is possible to efficiently prevent an excess clamping pressure
from being applied to the substrate 2 in each of the upper and
lower dies 5 and 6.
(Effect of Adjusting the Substrate Thickness by the Thickness
Adjustment Mechanism)
[0198] The operation of adjusting the distance between the die
surface of the top die 5a and that of the bottom die 5b and the
distance between the die surface of the top die 6a and that of the
bottom die 6b for the substrates by the thickness adjustment
mechanism 14 will be described with reference to FIG. 5.
[0199] FIG. 5 illustrates an example in which a thicker substrate
2a (2) is clamped in the upper die 5 and a thinner substrate 2b (2)
is clamped, in the lower die 6.
[0200] As shown in FIG. 5, when a clamping is performed by the
stacked molding mechanism unit 4, the upper fixed platen 7
(including the upper top die 5a), the column 9, and the column-side
rack 15 are united in a fixed state, forming a column-side
group.
[0201] In addition, when a clamping is performed by the stacked
molding mechanism unit 4, the intermediate plate 10 (including the
upper bottom die 5b and the lower top die 6a), the pinion
suspending member 30, and the main body 31 of the bearing unit 29
having the slider hole 33 are united in a fixed state, forming an
intermediate-plate-side group.
[0202] Further, when a clamping is performed by the stacked molding
mechanism unit 4, the slide plate 11 including the lower bottom die
6b, the rack standing member 26, the slide-plate-side rack 16, the
pinion 17, and the slider 32 including the rotational shaft 27
(rotation mechanism 28) are united in a fixed state, forming a
slide-plate-side group.
[0203] Therefore, by the elastic members 34 of the thickness
adjustment mechanism 14, the intermediate-plate-side group can be
moved upward or downward between the column-side group and the
slide-plate-side group.
[0204] Hence, by adjusting the distance between the die surface of
the top die 5a and that of the bottom die 5b and the distance
between the die surface of the top die 6a and that of the bottom
die 6b in accordance with the thicknesses of the substrates 2 (2a
and 2b) by the thickness adjustment mechanism 14, the two
substrates 2 (2a and 2b) having different substrate thicknesses can
be individually and effectively sandwiched and clamped between the
die surface of the top die 5a of the column-side group and that of
the bottom die 5b of the intermediate-plate-side group or between
the die surface of the top die of the intermediate-plate-side group
and that of the bottom die of the slide-plate-side group.
[0205] In other words, in clamping the upper and lower dies 5 and 6
in the stacked molding mechanism unit 4, when the clamping is
adjusted in accordance with the thicknesses of the substrates 2 (2a
and 2b), the column-side group (column-side rack 15) and the
slide-plate-side group (slide-plate-side rack 16) are fixed through
the pinion 17 (the slider 32 including the rotational shaft 27),
and the adjustment can be performed while the
intermediate-plate-side group between the column-side group and the
slide-plate-side group is elastically moved upward or downward (in
an elastically cushioned state) by the elastic member 34.
(Clamping a Thick Substrate and a Thin Substrate)
[0206] The case of supplying a thick substrate 2a to the upper die
5 (the substrate setting unit 19 of the top die 5a) and a thin
substrate 2b to the lower die 6 (the substrate setting unit 19 of
the top die 6a) will be described with reference to FIG. 5.
[0207] In the case of clamping the upper and lower dies 5 and 6 in
the stacked molding mechanism unit 4, when the pinion 17 is rotated
in the normal direction as previously described, the pinion 17 (and
the intermediate plate 10) rotating in the normal direction moves
upward along the column-side rack 15 the distance L, and the
slide-plate-side rack 16 (and the slide-plate 11) is moved upward
by distance L by the rotating and upward-moving pinion 17. Thus, in
each of the upper and lower dies 5 and 6, the die surfaces can be
closed at an equal clamping velocity.
[0208] That is, in the upper die 5, the thick substrate 2a supplied
and set on the substrate setting unit 19 of the top die 5a is first
sandwiched between the die surfaces of the top and bottom dies 5a
and 5b.
[0209] At this point in time, in the lower die 6, there is a gap
between the lower surface (the surface on which semiconductor chips
are mounted) of the thin substrate 2b supplied on the substrate
setting unit 19 of the top die 6a and the die surface of the bottom
die 6b.
[0210] Then, by further rotating the pinion 17 in the normal
direction, the thin substrate 2b supplied and set on the substrate
setting unit 19 of the top die 6a is sandwiched between the die
surfaces of the top and bottom dies 6a and 6b in the lower die
6.
[0211] Regarding the slide plate 11 (the die surface of the lower
bottom die 6b) and the intermediate plate 10 (the die surface of
the upper bottom die 5b), at this point in time, even if the slide
plate 11 is further moved upward, the slider 32 which is
substantially fixed to the slide plate 11 is elastically moved
upward against the elastic member 34 in the slider hole 33 of the
main body. Accordingly, the slider 32 can be elastically buffered
by the elastic members 34 (the thickness adjustment mechanism
14).
[0212] Therefore, by the thickness adjustment mechanism 14, the
distance between the die surface of the top die 5a and that of the
bottom die 5b, and the distance between the die surface of the top
die 6a and that of the bottom die 6b, can be efficiently adjusted
in correspondence to the thicknesses of the thick substrate 2a and
the thin substrate 2b.
(Configuration of the In-Loading Unit)
[0213] As shown in FIG. 1, the in-loading unit B is composed of,
for example, a substrate supply mechanism unit J and a resin
material supply mechanism unit K.
[0214] As shown in FIG. 1, the substrate supply mechanism unit J is
composed of, for example, a substrate loading unit (stocker) 81,
and a substrate alignment unit 32 for aligning substrates 2 from
the substrate loading unit 81 in a predetermined direction and for
supplying and setting them into the in-loading mechanism D (the
upper in-loading unit 23 and the lower in-loading unit 24).
[0215] Therefore, substrates 2 from the substrate loading unit 81
can be aligned in a predetermined direction by the substrate
alignment unit 82, and the aligned substrates 2 can be individually
fastened, placed, and set into the upper in-loading unit 23 and the
lower in-loading unit 24.
[0216] As shown in FIG. 1, the resin material supply mechanism unit
K is composed of, for example, a resin material loading unit 83 for
loading a resin material (e.g. a granular resin) and a resin
material distribution unit 84 for distributing the resin material
(granular resin) from the resin material loading unit to the
in-loading mechanism D (the upper in-loading unit 23 and the lower
in-loading unit 24) while leveling the resin material.
[0217] Hence, the granular resin from the resin material loading
unit 83 can be, supplied, distributed and leveled (in a resin
container, for example) by the resin material distribution unit 84,
and a predetermined amount of leveled resin material can be
fastened, placed, and set individually to the upper in-loading unit
23 and the lower in-loading unit 24.
(Configuration of the Out-Loading Unit)
[0218] As shown in FIG. 1, the out-loading unit (molded product
containing mechanism unit) C is composed of, for example, a molded
product placing unit 85 for placing molded products 3 from the
out-loading mechanism E (the upper out-loading unit and the lower
out-loading unit), and a molded product containing unit 86
(stocker) for containing the molded products 3 from the molded
product placing unit.
[0219] Therefore, the molded products 3 placed in the molded
product placing unit 85 can be transferred from the out-loading
mechanism E (the upper out-loading unit and the lower out-loading
unit) into the molded product containing unit 86.
(Semiconductor Chip Compression Molding Method in the Present
Invention)
[0220] As shown in FIG. 1, a substrate 2 and a resin material (e.g.
a granular resin) are fastened and set in the in-loading mechanism
D by the in-loading unit B, and the in-loading mechanism D is made
to move from the in-loading unit B the molding unit A along the
moving area F of the in-loading mechanism D.
[0221] Next, as shown in FIG. 2, the upper in-loading unit 23 of
the in-loading mechanism D is made to enter the space between the
top and bottom dies 5a and 5b of the upper die 5 in the stacked
molding mechanism unit 4 in the molding unit A so that the
substrate 2 on which semiconductor chips are mounted is supplied to
the substrate setting unit 19 of the top die 5a. At the same time,
a predetermined amount of leveled granular resin is supplied into
the bottom die cavity 21 and then heated to be melted.
[0222] As in the upper die 5, the lower in-loading unit 24 of the
in-loading mechanism D is made to enter the space between the top
and bottom dies 6a and 6b of the lower die 6 so that the substrate
2 on which semiconductor chips are mounted is supplied on the
substrate setting unit 19 of the top die 6a. At the same time, a
predetermined amount of leveled granular resin is supplied into the
bottom die cavity 21 and then heated to be melted.
[0223] Subsequently, the in-loading mechanism D is withdrawn and a
clamping is performed in each of the upper and lower dies 5 and 6
in the stacked molding mechanism unit 4 by the die opening/closing
means 12 (the die opening/closing mechanism 13) and the pressure
mechanism 18. That is, the die surfaces of each of the upper and
lower dies 5 and 6 (top and bottom dies 5a, 5b, 6a, and 6b) are
individually closed.
[0224] At this point in time, the upper and lower dies 5 and 6 can
be individually clamped with a predetermined clamping pressure by
the pressure mechanism 18.
[0225] At the same time, by the thickness adjustment mechanism 14
in the die opening/closing means 12, each of the substrates 2 (2a
and 2b) can be sandwiched and effectively clamped between the die
surfaces in each of the upper and lower dies 5 and 6 in accordance
with the thickness of each of the substrates 2 (2a and 2h) supplied
respectively in the upper and lower dies 5 and 6, while the
intermediate plate 10 is elastically moved upward or downward (in
an elastically buffered state).
[0226] Simultaneously, in each of the upper and lower dies 5 and 6,
the semiconductor chips mounted on the substrates 2 can be immersed
in the resin material heated and melted in the bottom die cavity
21.
[0227] Then, in each of the upper and lower dies 5 and 6, the resin
in the bottom die cavity 21 can be pressurized with a predetermined
resin pressure by the cavity bottom member 22,
[0228] When a predetermined period of time required for curing has
elapsed, each of the upper and lower dies 5 and 6 is individually
opened. As a result, a molded product 3, in which the semiconductor
chips mounted on the substrates 2 are individually
compression-molded in the resin compact 35 with a shape
corresponding to that of the bottom die cavity 21, is obtained in
each of the upper and lower dies 5 and 6.
[0229] Then, the upper out-loading unit of the out-loading
mechanism E is made to enter the space between the top and bottom
dies 5a and 5b in the upper die 5 to take out the molded product 3
from the die surface of the bottom die 5b.
[0230] As in the upper die 5, the lower out-loading unit of the
out-loading mechanism E is made to enter the space between the top
and bottom dies 6a and 6b in the lower die 6 to take out the molded
product 3 from the die surface of the bottom die 6b.
[0231] Then, the out-loading mechanism E is withdrawn and made to
move from the molding unit A to the out-loading unit C along the
moving area G for the out-loading mechanism E. In the out-loading
unit C, the molded products 3 can be received,
(Effects of the Present Invention)
[0232] According to the present invention, it is possible to create
a semiconductor chip compression molding apparatus 1 including a
stacked molding mechanism unit 4 in which two semiconductor chip
compression molding dies 5 and 6 are vertically stacked.
[0233] Therefore, according to the present invention, the
installation space of the entire semiconductor chip compression
molding apparatus can be effectively decreased as compared to a
semiconductor chip compression molding apparatus in which two
compression molding dies are horizontally arranged.
[0234] In addition, since the semiconductor chip compression
molding apparatus 1 according to the present invention has the
configuration in which two semiconductor chip compression molding
dies 5 and 6 are stacked, the clamping force in the semiconductor
chip compression molding apparatus 1 (dies 5 and 6) can be
effectively decreased, compared to the semiconductor chip
compression molding apparatus (die) in which two compression
molding dies are horizontally arranged.
[0235] With the present invention, in the configuration where two
compression molding dies 5 and 6 are vertically stacked in a
compression molding apparatus, the two upper and lower compression
molding dies 5 and 6 can be efficiently clamped by the die
opening/closing means 12 which uses a rack and pinion
mechanism.
[0236] When the bottom die 5b of the upper compression molding die
5 (and the intermediate plate 10) is moved upward by distance L to
clamp the dies, the bottom die 6b of the lower compression molding
die 6 (and the slide plate 11) can be moved upward by a distance 2L
to clamp the dies.
[0237] In the lower compression molding die 6, the relative
distance with respect to the intermediate plate 10 is L.
[0238] With the present invention, in the case where two substrates
2 (2a and 2b) having different substrate thicknesses, the distance
between the die surface of the top die 5a and that of the bottom
die 5b, and the distance between the die surface of the top die 6a
and that of the bottom die 6b can be efficiently adjusted to
perform a clamping in accordance with the thicknesses of the
substrates 2.
[0239] It should be noted that the present invention is not limited
to previously-described embodiment, and can be arbitrarily and
appropriately changed or selected according to necessity without
any departure from the scope of the present invention.
[0240] In the previously-described embodiment, a mold release film
for coating (by suction) the bottom die cavity 21 for compression
molding may be used.
[0241] For example, in the previously-described embodiment, a
leveled granular resin may be supplied into the bottom die cavity
21 covered with the mold release film, and the resin may be heated
and melted. Then, the semiconductor chips mounted on a substrate
may be compression-molded.
[0242] In the case where the bottom die cavity 21 is covered with
the mold release film, an intermediate die may be provided between
the top and bottom dies so that the mold release film is held
between the bottom die and the intermediate die.
[0243] Although a rack and pinion mechanism is used as the die
opening/closing means 12 (die opening/closing mechanism 13) in the
aforementioned embodiment, it is also possible to use, for example,
a linkage mechanism, a belt-pulley transmission mechanism, or a
hydraulic transmission mechanism.
[0244] In the previously-described embodiment, the in-loading unit
B, the molding unit A, and the out-loading unit C are attachably
and removably connected to each other in line in this order.
However, the three kinds of units A, B, and C can be attachably and
removably connected to each other in line in any order.
[0245] In the in-loading unit B, the substrate supply mechanism
unit J can be separated as a substrate supply unit, and the resin
material supply mechanism unit K can be separated as a resin
material supply unit.
[0246] In this case, the substrate supply unit (J), the resin
material supply unit (K), the out-loading unit C, and the molding
unit A can be attachably and removably connected to each other in
line in any order.
[0247] In the previously-described embodiment, the substrate 2 and
the resin material are simultaneously conveyed to the stacked
molding mechanism unit 4 by the in-loading mechanism D (or a
mechanism for conveying a material before molding). However, in the
aforementioned embodiment, the substrate 2 and the resin material
may be separately conveyed to the stacked molding mechanism unit 4
by separate conveying mechanisms (loaders).
[0248] In the previously-described embodiment, the conveyance of
the substrate 2 before molding to the stacked molding mechanism 4
and the takeout of the molded product 3 from the stacked molding
mechanism 4 can be performed by the same conveying mechanism
(loader).
[0249] In the previously-described embodiment, any required number
of molding units may be attachably and removably connected to each
other in line between the in-loading unit and the out-loading
unit.
[0250] On one side of the configuration in which a required number
of molding units A are attachably and removably connected to each
other in line, the in-loading unit B and the out-loading unit C may
be attachably and removably connected to each other in line in any
order.
[0251] Accordingly, as previously described, by using the
configuration in which a required number of molding units A are
attachably and removably connected to each other in line, the
productivity of molded products which are compression-molded in the
molding unit A can be efficiently improved.
[0252] In the previously-described embodiment, a liquid resin
material, a powdery resin material may be used in place of a
granular resin material.
EXPLANATION OF NUMERALS
[0253] 1 . . . Semiconductor Chip Compression Molding Apparatus
[0254] 1a . . . Front Side of the Apparatus [0255] 1b . . . Back
Side of the Apparatus [0256] 2 . . . Substrate (Pre-Molded
Substrate) [0257] 2a . . . Thick Substrate [0258] 2b . . . Thin
Substrate [0259] 3 . . . Molded Product (Molded Substrate) [0260] 4
. . . Stacked Molding Mechanism Unit [0261] 5 . . . Upper
Compression Molding Die [0262] 5a . . . Top Die [0263] 5b . . .
Bottom Die [0264] 6 . . . Lower Compression Molding Die [0265] 6a .
. . Top Die [0266] 6b . . . Bottom Die [0267] 7 . . . Upper Fixed
Platen [0268] 8 . . . Lower Fixed Platen [0269] 9 . . . Column
[0270] 10 . . . Intermediate Plate [0271] 11 . . . Slide Plate
[0272] 12 . . . Die Opening/Closing Means [0273] 13 . . . Die
Opening/Closing Mechanism [0274] 14 . . . Thickness Adjustment
Mechanism [0275] 15 . . . Column-Side Rack [0276] 16 . . .
Slide-Plate-Side Rack [0277] 17 . . . Pinion [0278] 18 . . .
Pressure Mechanism [0279] 19 . . . Substrate Setting Unit [0280] 20
. . . Suction Hole [0281] 21 . . . Cavity [0282] 22 . . . Cavity
Bottom Member [0283] 23 . . . Upper In-Loading Unit [0284] 24 . . .
Lower In-Loading Unit [0285] 25 . . . In-Loading Connector [0286]
26 . . . Rack Standing Member [0287] 27 . . . Rotational Shaft
[0288] 28 . . . Rotation Mechanism [0289] 29 . . . Bearing Unit
[0290] 30 . . . Pinion Suspending Member [0291] 31 . . . Main Body
of the Bearing Unit [0292] 32 . . . Slider [0293] 33 . . . Slider
Hole [0294] 34 . . . Elastic Member [0295] 35 . . . Resin Compact
[0296] 81 . . . Substrate Loading Unit [0297] 82 . . . Substrate
Alignment Unit [0298] 83 . . . Resin Material Loading Unit [0299]
84 . . . Resin Material Distribution Unit [0300] 85 . . . Molded
Product Placing Unit [0301] 86 . . . Molded Product Containing Unit
[0302] A . . . Molding Unit [0303] B . . . In-Loading Unit [0304] C
. . . Out-Loading Unit [0305] D . . . In-Loading Mechanism [0306] E
. . . Out-Loading Mechanism [0307] F . . . In-Loading Mechanism
Moving Area [0308] G . . . Out-Loading Mechanism Moving Area [0309]
H . . . Unit Connector [0310] J . . . Substrate Supply Mechanism
Unit [0311] K . . . Resin Material Supply Mechanism Unit
* * * * *