Uragami; Hiroshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Uragami; Hiroshi.The latest application filed is for "method for producing electronic component, bump-formed plate-like member, electronic component, and method for producing bump-formed plate-like member".

Company Profile

0.3.6

Uragami; Hiroshi - Kyoto JP
URAGAMI; Hiroshi - Kyoto-shi JP
Uragami; Hiroshi - Kuse-gun JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for producing resin-encapsulated electronic component, bump-formed plate-like member, resin-encapsulated electronic component, and method for producing bump-formed plate-like member Grant 9,728,426 - Okada , et al. August 8, 2	2017-08-08
Method for producing electronic component, bump-formed plate-like member, electronic component, and method for producing bump-formed plate-like member Grant 9,580,827 - Okada , et al. February 28, 2	2017-02-28
Method For Producing Electronic Component, Bump-formed Plate-like Member, Electronic Component, And Method For Producing Bump-formed Plate-like Member App 20160020187 - OKADA; Hirokazu ; et al.	2016-01-21
Method For Producing Resin-encapsulated Electronic Component, Bump-formed Plate-like Member, Resin-encapsulated Electronic Component, And Method For Producing Bump-formed Plate-like Member App 20150311095 - OKADA; Hirokazu ; et al.	2015-10-29
Method Of Manufacturing Resin-encapsulated Electronic Component And Apparatus For Manufacturing Resin-encapsulated Electronic Component App 20150017372 - Uragami; Hiroshi ; et al.	2015-01-15
Compression Molding Method And Compression Molding Apparatus App 20110193261 - Uragami; Hiroshi ; et al.	2011-08-11
Resin Sealing/Molding Apparatus App 20090162467 - Uragami; Hiroshi ; et al.	2009-06-25
Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device, semiconductor device and resin material Grant 7,056,770 - Uragami , et al. June 6, 2	2006-06-06
Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device, semiconductor device and resin material App 20040101631 - Uragami, Hiroshi ; et al.	2004-05-27

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