U.S. patent application number 13/041010 was filed with the patent office on 2011-06-30 for memory module assembly and heat sink thereof.
Invention is credited to Ming-Yang HSIEH.
Application Number | 20110155363 13/041010 |
Document ID | / |
Family ID | 39969330 |
Filed Date | 2011-06-30 |
United States Patent
Application |
20110155363 |
Kind Code |
A1 |
HSIEH; Ming-Yang |
June 30, 2011 |
MEMORY MODULE ASSEMBLY AND HEAT SINK THEREOF
Abstract
A memory module assembly includes a plurality of memory modules
and a heat sink assembly. Each of the memory modules includes at
least one heat source. The heat sink assembly includes a heat
dissipating plate and a plurality of heat transfer mediums. Each of
the heat transfer mediums includes a base attached to the heat
dissipating plate, and at least one resilient sheet extending from
an end of the base. The base and the resilient sheet define an
included angle which is non-right angle so that the resilient sheet
can snugly cling to the respective heat source.
Inventors: |
HSIEH; Ming-Yang; (Taichung,
TW) |
Family ID: |
39969330 |
Appl. No.: |
13/041010 |
Filed: |
March 4, 2011 |
Related U.S. Patent Documents
|
|
|
|
|
|
Application
Number |
Filing Date |
Patent Number |
|
|
12626907 |
Nov 29, 2009 |
7929307 |
|
|
13041010 |
|
|
|
|
11767493 |
Jun 23, 2007 |
7679913 |
|
|
12626907 |
|
|
|
|
Current U.S.
Class: |
165/185 |
Current CPC
Class: |
H01L 23/3672 20130101;
H01L 23/467 20130101; H01L 2924/0002 20130101; H01L 2924/0002
20130101; H01L 2924/00 20130101 |
Class at
Publication: |
165/185 |
International
Class: |
F28F 7/00 20060101
F28F007/00 |
Claims
1. A heat sink assembly comprising: a heat dissipating plate being
of a one-piece construction and defining a first slit from top to
bottom; and a first heat transfer medium including a base secured
on the top of the heat dissipating plate and a first connecting
sheet extending from an end of the base and through the first slit
of the heat dissipating plate to be in contact with a side of a
first heat source.
2. The heat sink assembly of claim 1 further comprising a second
heat transfer medium which includes a base secured on the top of
the heat dissipating plate and a first connecting sheet extending
from an end of the base, wherein the heat dissipating plate further
has another first slit where the first connecting sheet of the
second heat transfer medium is passed to be in contact with a side
of a second heat source.
3. The heat sink assembly of claim 1, wherein the heat dissipating
plate further defines a second slit from the top to the bottom; and
the first heat transfer medium further has a second connecting
sheet extending from the opposite end of the base and through the
second slit of the heat dissipating plate to be in contact with the
opposite side of the first heat source.
4. The heat sink assembly of claim 3 further comprising a second
heat transfer medium which includes a base secured on the top of
the heat dissipating plate, a first connecting sheet, and a second
connecting sheet; the first and second connecting sheets extending
from opposite ends of the base respectively; and the heat
dissipating plate further including another first slit and another
second slit where the first and second connecting sheets of the
second heat transfer medium are respectively passed to be in
contact with opposite sides of a second heat source.
5. The heat sink assembly of claim 3, wherein the first and second
connecting sheets are both resilient and each is inclined with
respect to the base.
6. The heat sink assembly of claim 1, wherein the heat dissipating
plate further defines a second slit from the top to the bottom; and
the first heat transfer medium further has a second connecting
sheet extending from the opposite end of the base and through the
second slit of the heat dissipating plate to be in contact with a
side of a second heat source.
7. The heat sink assembly of claim 6 further comprising a second
heat transfer medium which includes a base secured on the top of
the heat dissipating plate, a first connecting sheet, and a second
connecting sheet; the first and second connecting sheets extending
from opposite ends of the base respectively; and the heat
dissipating plate further including another first slit where the
first connecting sheet of the second heat transfer medium is passed
to be in contact with the opposite side of the second heat source,
and another second slit where the second connecting sheet of the
second heat transfer medium is passed to be in contact with a side
of a third heat source.
8. The heat sink assembly of claim 6 wherein the first and second
connecting sheets are both resilient and each is inclined with
respect to the base.
9. The heat sink assembly of claim 1 wherein the first heat
transfer medium further includes a fastening portion extending from
a side of the first connecting sheet, and the fastening portion
upwardly abuts against the bottom of the heat dissipating plate to
affix the base onto the top of the heat dissipating plate.
10. The heat sink assembly of claim 1 further comprising a fan,
wherein the heat dissipating plate further has a through hole where
the fan is mounted.
11. A heat sink assembly comprising: a heat dissipating plate; and
a first heat transfer medium secured on a side of the heat
dissipating plate and including two resilient, heat-conductive
sheets which are outwardly biased such that the sheets are
elastically compressed by two adjacent heat sources when placed in
between the two adjacent heat sources.
12. The heat sink assembly of claim 11 further comprising a second
heat transfer medium which is secured on the heat dissipating plate
and includes two resilient, heat-conductive sheets outwardly biased
such that the sheets are elastically compressed by another two
adjacent heat sources when placed in between the another two
adjacent heat sources.
13. The heat sink assembly of claim 11 further comprising at least
one fan, wherein the heat dissipating plate further has at least
one through hole where the fan is mounted.
14. A heat sink assembly comprising: a heat dissipating plate; and
a first heat transfer medium secured on a side of the heat
dissipating plate, and including two resilient, heat-conductive
sheets which are inwardly biased to snugly cling to opposite sides
of a first heat source.
15. The heat sink assembly of claim 14 further comprising a second
heat transfer medium which is secured on the heat dissipating plate
and includes two resilient sheets inwardly biased in order to
snugly cling to opposite sides of a second heat source.
16. The heat sink assembly of claim 14 further comprising at least
one fan, wherein the heat dissipating plate further has at least
one through hole where the fan is mounted.
Description
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This application is a Continuation of co-pending application
Ser. No. 12/626,907, filed on Nov. 29, 2009, which is a
continuation of U.S. Pat. No. 7,679,913, filed on Jun. 23, 2007,
and for which priority is claimed under 35 U.S.C. .sctn.120; the
entire contents of all of which are hereby incorporated by
reference.
BACKGROUND OF INVENTION
[0002] 1. Field of Invention
[0003] The present invention relates to a memory module assembly
and a heat sink assembly configured to be fitted to the memory
module assembly, and in particular to a heat sink assembly for
radiating heat generated from a fully buffered dual in-line memory
module (FBDIMM), a printed circuit board (PCB) of the FBDIMM on
which the advanced memory buffer (AMB) package is mounted.
[0004] 2. Related Prior Art
[0005] A memory module may be classified into a single in-line
memory module (SIMM) and a dual in-line memory module (DIMM). The
SIMM includes a row of memory chips mounted on only one side of the
PCB, and the DIMM has two rows of the memory chips mounted on both
sides of the PCB respectively.
[0006] In order to improve transmission efficiency, a fully
buffered DIMM (FBDIMM) has been provided. FBDIMM has a hub, such as
an advanced memory buffer (AMB) logic chip that is mounted on the
center of the memory module. The AMB chip receives packet signals
including a memory command and/or data from an external host (e.g.,
a memory controller), and provides the received data to respective
memory chips. In addition, the AMB chip packetizes data outputted
from the memory chips, and provides the packets to the memory
controller. In the FBDIMM, signals from external sources are
transmitted to the respective memory chips via the AMB chip.
Accordingly, all signal lines on which the signals are transmitted
are coupled to the AMB chip. Consequently, a large load is
concentrated on the AMB chip and high heat may be generated in the
AMB chip. High heat reduces the life span of the AMB chip and
lowers the operational reliability of peripheral circuits of the
AMB chip. Hence, it is advantageous to quickly dissipate away the
heat from the AMB chip.
[0007] As shown in FIGS. 11 and 12, Taiwan Patent No. 1273688
discloses a memory module integrated mechanism 100 mounted on a
motherboard 200, which comprises a plurality of FBDIMMs 110 and a
heat sink 120. Each of the FBDIMMs 110 includes a PCB 111, a row of
memory chips 112 mounted on the PCB 111, an AMB chip 113 attached
to one of the memory chips 112, and a heat sink plate 114. The heat
sink plate 114 is attached to the AMB chip 113 and is parallel to
the PCB 111 for radiating heat generated from the AMB chip 113.
Furthermore, the heat sink 120 is disposed above the FBDIMMs 110
and contacts with each one of the heat sink plates 114 of the
FBDIMMs 110. The heat sink 120 comprises a heat dissipating plate
121 and a plurality of clipping members 122 extending from the heat
dissipating plate 121. The heat dissipating plate 121 is
perpendicular with each one of the PCBs 111 of the FBDIMMs 110.
Each of the clipping members 122 extends toward the respective heat
sink plate 114 and includes two parallel clipping sheets 122a as
depicted in FIG. 12. A top portion of each of the heat sink plates
114 is sandwiched in between the two respective clipping sheets
122a. However, there is not disclosed how the clipping members 122
and the heat dissipating plate 121 are connected in the
specification. Generally, the connection may be fulfilled by
welding or the like, but requiring much time and work. In addition,
the two parallel clipping sheets 122a can only contact the top
portion of the heat sink plate 114, which means only little area of
the heat sink plate 114 is used for heat transferring to the heat
dissipating plate 121. Hence, the heat dissipating efficiency is
limited.
SUMMARY OF INVENTION
[0008] The primary object of this invention is therefore to provide
an improved heat sink assembly of a memory modules assembly, which
is easy to be assembled and provides increased heat dissipating
efficiency.
[0009] According to the present invention, a memory module assembly
and a heat sink assembly applying for the memory module assembly
are disclosed. The memory module assembly comprises a plurality of
memory modules and the heat sink assembly. Each of the memory
modules includes at least one heat source, such as an AMB chip. The
heat sink assembly comprises a heat dissipating plate and a
plurality of heat transfer mediums. Each of the heat transfer
mediums includes a base attached with the heat dissipating plate,
and at least one resilient sheet extending from an end of the base.
The base and the resilient sheet define an included angle which is
non-right angle so that the resilient sheet can snugly cling to the
respective heat source by resilience.
[0010] Preferably, the heat dissipating plate defines at least one
slit therein. The resilient sheet is inserted into the slit to
cling to the heat source. The heat transfer medium further includes
a fastening portion disposed on the resilient sheet so that the
base can be firmly attached to the heat dissipating plate.
[0011] Further benefits and advantages of the present invention
will become clear as the description proceeds.
BRIEF DESCRIPTION OF DRAWINGS
[0012] The invention will now be elucidated with reference to the
following description and accompanying drawings where:
[0013] FIG. 1 is an exploded view of a memory module assembly of
the preferred embodiment being mounted on a motherboard according
to the present invention;
[0014] FIG. 2 is a perspective view of FIG. 1;
[0015] FIG. 3 shows a load punching on a base of a heat transfer
medium so as to bend a heat dissipating plate;
[0016] FIG. 4 shows a view of FIG. 3 after punching;
[0017] FIGS. 5 and 6 illustrate a first example of the heat
transfer medium being fit into memory modules;
[0018] FIGS. 7 and 8 illustrate a second example of the heat
transfer medium being fit into the memory modules;
[0019] FIG. 9 illustrate s a third example of the heat transfer
medium being fit into the memory modules;
[0020] FIG. 10 illustrates a fourth example of the heat transfer
medium being fit into the memory modules; and
[0021] FIGS. 11 and 12 are views of a prior art.
DETAILED DESCRIPTION OF EMBODIMENTS
[0022] With reference to FIGS. 1 to 10, description will be given
of a memory module assembly including a heat sink assembly 4
according to the preferred embodiment of this invention.
[0023] FIG. 1 shows that the memory module assembly comprises a
plurality of memory modules 3 mounted on a motherboard 2, and the
heat sink assembly 4.
[0024] Each of the memory modules 3, such as an FBDIMM, comprises a
PCB 31, a plurality of memory chips 33, two hub chips 34 (eg. an
AMB chip), and two heat sink plates 32. The memory chips 33 are
mounted on both sides of the PCB 31. Each side of the PCB 31
includes one hub chip 34 mounted on one of the memory chips 33. The
hub chips 34 are configured to connect memory chips 33 via a
respective memory chip interface. As mentioned above, a large load
is concentrated on each of the hub chips 34, namely the AMB chips,
and high heat may be generated in the hub chips 34, namely heat
sources. The heat sink plates 32 are attached to the hub chips 34
respectively for radiating heat generated from the hub chips
34.
[0025] It should be noted that the heat source of this embodiment
is the AMB chips while in other instance, a heat source may be just
a memory chip when a traditional SIMM or DIMM is used, where there
is no hub chip thereon. In that kind of case, the heat sink plate
can be directly attached to the memory chip.
[0026] In this preferred embodiment, the heat sink assembly 4
comprises a heat dissipating plate 40, a plurality of heat transfer
mediums 41, and two fans 43.
[0027] The heat dissipating plate 40 is of a one-piece construction
and defines a plurality of slits 401 therein corresponding to the
heat transfer mediums 41, and two through holes 402 corresponding
to the two fans 43. Each of the heat transfer mediums 41 includes a
base 410, two resilient connecting sheets 411 and four fastening
portions 412. The two resilient sheets 411 extend from opposite
ends of the base 410 and are made of a heat-conductive material,
such as copper. Referring to FIG. 2, the two resilient sheets 411
are inserted into a pair of the slits 401, and thereby a bottom of
the base 410 can be right attached to a top of the heat dissipating
plate 40. Referring back to FIG. 1, two of the four fastening
portions 412 extend outward from an upper portion of the respective
resilient sheet 411, namely outwardly biased, for holding to a
bottom of the heat dissipating plate 40. Because of being outwardly
biased in the beginning, the fastening portions 412 can be
compressed to be aligned with the resilient sheets 411, and can
return to open outwardly again once released. Thus while the
resilient sheets 411 are being inserted into the slits 401, the
four fastening portions 412 are compressed as a result of the small
slits 401. For this, a load 5 can be used to punch the base 410 of
the heat transfer mediums 41, as shown in FIG. 3, so that the heat
dissipating plate 40 can be bent upward a bit and the slits 401 be
enlarged to a degree that the fastening portions 412 can bounce out
from the slits 401 to abut against the bottom of the heat
dissipating plate 40. After the load 5 is lifted up, as shown in
FIG. 4, the heat dissipating plate 40 is released and the fastening
portions 412 keep upholding the heat dissipating plate 40. In such
a manner, the base 410 can be firmly attached to the heat
dissipating plate 40.
[0028] As shown in FIG. 5, before the heat sink assembly 4 is
attached to the memory modules 3, the two resilient sheets 411 of
each of the heat transfer mediums 41 are inwardly biased in the
beginning. When the heat sink assembly 4 and the memory modules 3
are engaged, as shown in FIG. 6, the two resilient sheets 411 are
placed around one of the memory modules 3 and snugly attached to
the two opposite heat sink plates 32 of the memory module 3
respectively. In such a manner, these heat transfer mediums 41 can
be perfectly fit in between the memory modules 3.
[0029] In another example, the two resilient sheets 411 of each of
the heat transfer mediums 41 may be outwardly biased in the
beginning, as shown in FIG. 7, so that the two resilient sheets 411
can be placed in between adjacent two of the memory modules 3 and
elastically compressed by the corresponding opposing heat sink
plates 32 of the adjacent two memory modules 3, as shown in FIG. 8.
That is to say, these heat transfer mediums 41 can be perfectly fit
in between the memory modules 3.
[0030] In yet another example, as shown in FIG. 9, each of the heat
transfer mediums 41 may has only one resilient sheet 411 with one
fastening portion 412 thereon. The resilient sheet 411 and the base
410, as indicated by phantom lines, define an obtuse angle, larger
than 90 degrees, so that the resilient sheet 411 can be placed in a
corresponding position so as to snugly cling to the right heat sink
plate 32 of the respective memory module 3.
[0031] Similarly, as shown in FIG. 10, the resilient sheet 411 and
the base 410 define an acute angle, smaller than 90 degrees, so
that the resilient sheet 411 can be placed in another corresponding
position so as to snugly cling to the left heat sink plate 32 of
the respective memory module 3.
[0032] Accordingly, as long as the resilient sheet 411 and the base
410 define an included angle which is non-right angle, the
resilient sheet 411 can snugly cling to the right or left heat sink
plate 32 of the respective memory module 3. In such a manner, these
heat transfer mediums 41 can be perfectly fit in between the memory
modules 3.
[0033] Referring back to FIG. 2, the fans 43 are mounted on the
heat dissipating plate 40 facing the through holes 402. In this
manner, airflows generated by the fans 43 can be guided toward the
memory modules 3 via the through holes 402 to enhance cooling of
the memory modules 3.
[0034] Numerous characteristics and advantages of the invention
have been set forth in the foregoing description. The disclosure,
however, is illustrative only, and changes may be made in detail
within the principle of the invention, to the full extent indicated
by the broad general meaning of the terms in which the appended
claims are expressed.
* * * * *