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Patent applications and USPTO patent grants for Hsieh; Ming-Yang.The latest application filed is for "memory module with heat dissipating apparatus".
Patent | Date |
---|---|
Heat sink clip and method for forming the same Grant 9,016,353 - Hsieh April 28, 2 | 2015-04-28 |
Memory Module With Heat Dissipating Apparatus App 20130255928 - HSIEH; MING-YANG | 2013-10-03 |
Ring-shaped Heat Dissipating Device And A Manufacturing Method Thereof, And A Heat Dissipating Apparatus Including Said Ring-shaped Heat Dissipating Device App 20130186610 - HSIEH; Ming-Yang | 2013-07-25 |
Heat Sink Clip And Method For Forming The Same App 20130186595 - HSIEH; Ming-Yang | 2013-07-25 |
Memory Module Assembly And Heat Sink Thereof App 20110155363 - HSIEH; Ming-Yang | 2011-06-30 |
Memory module assembly and heat sink thereof Grant 7,929,307 - Hsieh April 19, 2 | 2011-04-19 |
Memory Module Assembly and Heat Sink thereof App 20100071884 - Hsieh; Ming-Yang | 2010-03-25 |
Memory module assembly and heat sink thereof Grant 7,679,913 - Hsieh March 16, 2 | 2010-03-16 |
Memory Module Assembly and Heat Sink thereof App 20080278916 - Hsieh; Ming-Yang | 2008-11-13 |
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