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name:-0.0033130645751953
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Hsieh; Ming-Yang Patent Filings

Hsieh; Ming-Yang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hsieh; Ming-Yang.The latest application filed is for "memory module with heat dissipating apparatus".

Company Profile
0.4.9
  • Hsieh; Ming-Yang - Taichung TW
  • HSIEH; MING-YANG - Taichung City TW
  • Hsieh; Ming-Yang - Dali TW
  • Hsieh; Ming-Yang - Dali City Taichung County 412 TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Heat sink clip and method for forming the same
Grant 9,016,353 - Hsieh April 28, 2
2015-04-28
Memory Module With Heat Dissipating Apparatus
App 20130255928 - HSIEH; MING-YANG
2013-10-03
Ring-shaped Heat Dissipating Device And A Manufacturing Method Thereof, And A Heat Dissipating Apparatus Including Said Ring-shaped Heat Dissipating Device
App 20130186610 - HSIEH; Ming-Yang
2013-07-25
Heat Sink Clip And Method For Forming The Same
App 20130186595 - HSIEH; Ming-Yang
2013-07-25
Memory Module Assembly And Heat Sink Thereof
App 20110155363 - HSIEH; Ming-Yang
2011-06-30
Memory module assembly and heat sink thereof
Grant 7,929,307 - Hsieh April 19, 2
2011-04-19
Memory Module Assembly and Heat Sink thereof
App 20100071884 - Hsieh; Ming-Yang
2010-03-25
Memory module assembly and heat sink thereof
Grant 7,679,913 - Hsieh March 16, 2
2010-03-16
Memory Module Assembly and Heat Sink thereof
App 20080278916 - Hsieh; Ming-Yang
2008-11-13

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