U.S. patent application number 12/576554 was filed with the patent office on 2011-04-14 for heat-dissipating structure with high heat-dissipating efficiency and method for manufacturing the same.
Invention is credited to Shui-Hsu HUNG, Chien-Wei LEE, Shih-Wei LEE.
Application Number | 20110083829 12/576554 |
Document ID | / |
Family ID | 43853897 |
Filed Date | 2011-04-14 |
United States Patent
Application |
20110083829 |
Kind Code |
A1 |
HUNG; Shui-Hsu ; et
al. |
April 14, 2011 |
HEAT-DISSIPATING STRUCTURE WITH HIGH HEAT-DISSIPATING EFFICIENCY
AND METHOD FOR MANUFACTURING THE SAME
Abstract
A method for manufacturing a heat-dissipating structure with
high heat-dissipating efficiency, includes the following steps:
providing a heat-dissipating casing having a hollow
heat-dissipating body that has at least two ends; closing one end
of the hollow heat-dissipating body; pouring work liquid from other
end of the hollow heat-dissipating body into an inner portion of
the hollow heat-dissipating body; cooling the work liquid from the
liquid state to the solid state by an external cooling medium;
extracting air from the hollow heat-dissipating body; and then
closing the other end of the hollow heat-dissipating body to form
an evacuated hollow heat-dissipating body.
Inventors: |
HUNG; Shui-Hsu; (Tainan
City, TW) ; LEE; Chien-Wei; (Hsinchu City, TW)
; LEE; Shih-Wei; (Fongshan City, TW) |
Family ID: |
43853897 |
Appl. No.: |
12/576554 |
Filed: |
October 9, 2009 |
Current U.S.
Class: |
165/104.26 ;
29/890.032 |
Current CPC
Class: |
Y10T 29/49353 20150115;
B23P 2700/09 20130101; H01L 23/427 20130101; F28D 15/0233 20130101;
H01L 2924/0002 20130101; F28D 15/046 20130101; H01L 2924/00
20130101; F28F 1/022 20130101; H01L 2924/0002 20130101; F28D
15/0283 20130101 |
Class at
Publication: |
165/104.26 ;
29/890.032 |
International
Class: |
F28D 15/04 20060101
F28D015/04; B21D 53/02 20060101 B21D053/02 |
Claims
1. A heat-dissipating structure with high heat-dissipating
efficiency, comprising: a heat-dissipating casing having an
evacuated hollow heat-dissipating body and a plurality of
microstructures integratedly formed on an inner surface of the
hollow heat-dissipating body, wherein the hollow heat-dissipating
body has at least two ends that have been closed; and a plurality
of solid work liquids received in the hollow heat-dissipating
body.
2. The heat-dissipating structure according to claim 1, wherein the
heat-dissipating casing includes a plurality of supports
integratedly formed in the hollow heat-dissipating body in order to
divide an inner space of the hollow heat-dissipating body into a
plurality of receiving spaces, and the solid work liquids are
filled into the receiving spaces.
3. The heat-dissipating structure according to claim 2, wherein the
solid work liquids are selected from the group consisting of pure
water, ammonia, methanol, ethanol, propane and heptane, and the
receiving spaces receive the solid work liquids with the same
property or different property.
4. The heat-dissipating structure according to claim 1, wherein the
heat-dissipating casing is a heat pipe, and the heat pipe has at
least two ends that have been closed.
5. The heat-dissipating structure according to claim 1, wherein the
microstructures are composed of a plurality of capillary
structures.
6. The heat-dissipating structure according to claim 1, wherein the
heat-dissipating casing is made of metal material, and the metal
material is selected from the group consisting of aluminum, copper,
iron, steel, stainless steel, nickel and titanium.
7. The heat-dissipating structure according to claim 1, wherein the
cross-sectional shape of each microstructure is triangle, square,
rectangle, trapezoid or arc.
8. A method for manufacturing a heat-dissipating structure with
high heat-dissipating efficiency, comprising: providing a
heat-dissipating casing having a hollow heat-dissipating body that
has at least two ends; closing one end of the hollow
heat-dissipating body; pouring work liquid from other end of the
hollow heat-dissipating body into an inner portion of the hollow
heat-dissipating body; cooling the work liquid from the liquid
state to the solid state by an external cooling medium; extracting
air from the hollow heat-dissipating body; and closing the other
end of the hollow heat-dissipating body to form an evacuated hollow
heat-dissipating body.
9. The method according to claim 8, wherein the heat-dissipating
casing has a plurality of microstructures integratedly formed on an
inner surface of the hollow heat-dissipating body.
10. The method according to claim 9, wherein the microstructures
are composed of a plurality of capillary structures.
11. The method according to claim 9, wherein the cross-sectional
shape of each microstructure is triangle, square, rectangle,
trapezoid or arc.
12. The method according to claim 8, wherein the heat-dissipating
casing includes a plurality of supports integratedly formed in the
hollow heat-dissipating body in order to divide an inner space of
the hollow heat-dissipating body into a plurality of receiving
spaces, and the work liquid is filled into the receiving
spaces.
13. The method according to claim 12, wherein the work liquid is
selected from the group consisting of pure water, ammonia,
methanol, ethanol, propane and heptane, and the receiving spaces
receive the work liquid with the same property or different
property, so that the same work liquid or different work liquid is
filled in the receiving spaces.
14. The method according to claim 8, wherein the heat-dissipating
casing is made of metal material, and the metal material is
selected from the group consisting of aluminum, copper, iron,
steel, stainless steel, nickel and titanium.
15. The method according to claim 8, wherein the hollow
heat-dissipating body is a hollow pipe formed by extrusion molding
or deep drawing, and hollow pipe has a plane shape, a fin shape or
a groove shape.
16. The method according to claim 8, wherein the external cooling
medium is a freezer, a cryogenic cooler, refrigerant, liquid air,
liquid nitrogen or liquid helium, and the cooling temperature of
the external cooling medium is ranged from -273.degree. C. to
15.degree. C.
17. The method according to claim 8, wherein the two ends of the
hollow heat-dissipating body are closed by a press-fitting clamp
with normal or high temperature, and the width of the clamp is
equal to or larger than that of the hollow heat-dissipating
body.
18. The method according to claim 8, wherein the hollow
heat-dissipating body has an inner coating formed on an inner
surface thereof in order to increase air-tight seal level of the
two ends of the hollow heat-dissipating body by electroplating,
anode process, sol gel or chemical conversion coating, and the
inner coating is made of copper, aluminum, tin, lead, zinc,
magnesium, silicon or hot melt glue.
19. The method according to claim 8, wherein air-tight seal level
of the two ends of the hollow heat-dissipating body is increased by
using physical or chemical process.
20. The method according to claim 19, wherein the physical process
includes plastic deformation, welding, laser, ultrasound wave or
physical vapor deposition, and the chemical process includes
electroplating, electroforming or chemical vapor deposition.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a heat-dissipating
structure and a method for manufacturing the same, in particular,
to a heat-dissipating structure with high heat-dissipating
efficiency and a method for manufacturing the same.
[0003] 2. Description of Related Art
[0004] Cooling or heat removal has been one of the major obstacles
of the electronic industry. The heat dissipation increases with the
scale of integration, the demand for higher performance, and the
increase of multi-functional applications. The development of high
performance heat transfer devices becomes one of the major
development efforts of the industry. Heat pipes have excellent heat
transfer performance due to their low thermal resistance, and are
therefore an effective means for transfer or dissipation of heat
from heat sources. Currently, heat pipes are widely used for
removing heat from heat-generating components such as central
processing units (CPUs) of computers.
[0005] A heat pipe is usually a vacuum casing containing therein a
working medium, which is employed to carry, under phase transitions
between liquid state and vapor state, thermal energy from an
evaporator section to a condenser section of the heat pipe.
Preferably, a wick structure is provided inside the heat pipe,
lining an inner wall of the casing, for drawing the working medium
back to the evaporator section after it is condensed at the
condenser section. In operation, the evaporator section of the heat
pipe is maintained in thermal contact with a heat-generating
component. The working medium contained at the evaporator section
absorbs heat generated by the heat-generating component and then
turns into vapor and moves towards the condenser section where the
vapor is condensed into condensate after releasing the heat into
ambient environment. Due to the difference in capillary pressure
which develops in the wick structure between the two sections, the
condensate is then brought back by the wick structure to the
evaporator section where it is again available for evaporation.
[0006] However, one part of work liquid that has been poured into
the heat pipe would be extracted out during vacuum pumping process,
so that the liquid measure of the work liquid is less than original
work liquid that has been poured into the heat pipe. In order to
keep a predetermined liquid measure of the work liquid in the heat
pipe, the vacuum level of the heat pipe needs to be decreased.
Hence, the heat-dissipating efficiency of the heat pipe of the
prior art is decreased.
SUMMARY OF THE INVENTION
[0007] In view of the aforementioned issues, the present invention
provides a heat-dissipating structure with high heat-dissipating
efficiency and a method for manufacturing the same. The present
invention can keep a predetermined liquid measure of work liquid
and achieve a better vacuum level, so that the present invention
can obtain high heat-dissipating efficiency.
[0008] To achieve the above-mentioned objectives, the present
invention provides a heat-dissipating structure with high
heat-dissipating efficiency, including: a heat-dissipating casing
and a plurality of solid work liquids. The heat-dissipating casing
has an evacuated hollow heat-dissipating body and a plurality of
microstructures integratedly formed on an inner surface of the
hollow heat-dissipating body. The hollow heat-dissipating body has
at least two ends that have been closed. The solid work liquids are
received in the hollow heat-dissipating body.
[0009] To achieve the above-mentioned objectives, the present
invention provides a method for manufacturing a heat-dissipating
structure with high heat-dissipating efficiency. The method
includes providing a heat-dissipating casing having a hollow
heat-dissipating body that has at least two ends; closing one end
of the hollow heat-dissipating body; pouring work liquid from other
end of the hollow heat-dissipating body into an inner portion of
the hollow heat-dissipating body; cooling the work liquid from the
liquid state to the solid state by an external cooling medium;
extracting air from the hollow heat-dissipating body; and then
closing the other end of the hollow heat-dissipating body to form
an evacuated hollow heat-dissipating body.
[0010] Therefore, work liquid is pre-solidifying to become solid
state, so that the present invention can control the liquid measure
of the work liquid and can increase air-extracting time in order to
increase the vacuum level of the hollow heat-dissipating body.
Hence, the present invention has good heat-dissipating
efficiency.
[0011] In order to further understand the techniques, means and
effects the present invention takes for achieving the prescribed
objectives, the following detailed descriptions and appended
drawings are hereby referred, such that, through which, the
purposes, features and aspects of the present invention can be
thoroughly and concretely appreciated; however, the appended
drawings are merely provided for reference and illustration,
without any intention to be used for limiting the present
invention.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] FIG. 1 is a flowchart of the method for manufacturing a
heat-dissipating structure with high heat-dissipating efficiency
according to the first embodiment of the present invention;
[0013] FIGS. 1A1 to 1F are schematic views of the heat-dissipating
structure with high heat-dissipating efficiency according to the
first embodiment of the present invention, at different stages of
the manufacturing processes, respectively; and
[0014] FIG. 2 is a partial, cross-sectional, schematic view of the
heat-dissipating structure with high heat-dissipating efficiency
according to the second embodiment of the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0015] Referring to FIGS. 1 and 1A1-1E, the first embodiment of the
present invention provides a method for manufacturing a
heat-dissipating structure with high heat-dissipating efficiency.
The method includes the following steps:
[0016] The step S100 is that: referring to FIGS. 1, 1A1 and 1A2,
providing a heat-dissipating casing 1 having a hollow
heat-dissipating body 10 that has at least two ends (10A, 10B). In
addition, the heat-dissipating casing 1 has a plurality of
microstructures 11 integratedly formed on an inner surface of the
hollow heat-dissipating body 10 and a plurality of supports 12
integratedly formed in the hollow heat-dissipating body 10 in order
to divide an inner space of the hollow heat-dissipating body 10
into a plurality of receiving spaces 100.
[0017] Moreover, the heat-dissipating casing 1 can be made of metal
material or any other material. For example, the metal material can
be selected from the group consisting of aluminum, copper, iron,
steel, stainless steel, nickel and titanium. In addition, the
hollow heat-dissipating body 10 is a hollow pipe formed by
extrusion molding or deep drawing, and hollow pipe has a plane
shape, a fin shape or a groove shape. Furthermore, the
microstructures 11 are composed of a plurality of capillary
structures, and the cross-sectional shape of each microstructure 11
can be triangle, square, rectangle, trapezoid or arc. However, the
inner structure of the hollow heat-dissipating body 10, the
material property of the heat-dissipating casing 1, the forming
method of the hollow heat-dissipating body 10, the shape of the
hollow heat-dissipating body 10 and the cross-sectional shape of
each microstructure 11 are just examples. These do not limit the
present invention.
[0018] The step S102 is that: referring to FIGS. 1, 1B1 and 1B2,
closing one end 10B of the hollow heat-dissipating body 10. For
example, one end 10B of the hollow heat-dissipating body 10 is
closed by a press-fitting clamp C with normal or high temperature
(such as 200.degree. C.), and the width W1 of the clamp C is equal
to or larger than the width W2 of the hollow heat-dissipating body
10.
[0019] The step S104 is that: referring to FIGS. 1 and 1C, pouring
work liquid W from other end 10A of the hollow heat-dissipating
body 10 into an inner portion of the hollow heat-dissipating body
10. The work liquid W is filled into the receiving spaces 100. In
addition, the work liquid W can be selected from the group
consisting of pure water, ammonia, methanol, ethanol, propane and
heptane, and the receiving spaces 100 receive the work liquid W
with the same property or different property. In other words, the
work liquid W with the same property can be filled into the
receiving spaces 100 or the work liquid W with different property
can be alternatively filled into the receiving spaces 100 according
to different requirement. For example, referring to FIG. 1C,
alcohol can be filled into the first, the third and the fifth
receiving spaces 100 and propane is filled into the second and the
fourth receiving spaces 100 in order to achieve composite
heat-dissipating efficiency.
[0020] The step S106 is that: referring to FIGS. 1 and 1D, cooling
the work liquid W from the liquid state to the solid state by an
external cooling medium M. In other words, one side of the hollow
heat-dissipating body 10 is disposed into the external cooling
medium M for cooling the work liquid W, so that the liquid work
liquid W is frozen to form the solid work liquid W'. In addition,
the external cooling medium M can be a freezer, a cryogenic cooler,
refrigerant, liquid air, liquid nitrogen, liquid helium or any
other cooling medium. The relationship between minimum work
temperature, freezing temperature and applied field are shown as
the following tables:
TABLE-US-00001 External cooling medium Minimum work temperature
freezer -25.degree. C. refrigerant -110.degree. C. cryogenic cooler
-140.degree. C. liquid air -192.degree. C. liquid nitrogen
-196.degree. C. liquid helium -269.degree. C.
TABLE-US-00002 Work liquid pure water ammonia methanol ethanol
propane freezing 0.1 -77.5 -97.9 -114.3 -93 temperature (.degree.
C.)
TABLE-US-00003 Work liquid pentane heptane toluene mercury freezing
-129.9 -90.5 -94.9 -38.8 temperature (.degree. C.)
TABLE-US-00004 Work liquid pure water ammonia methanol ethanol
propane Cooling medium 0.1 -77.5 -97.9 -114.3 -93 freezer
.smallcircle. refrigerant .smallcircle. .smallcircle. .smallcircle.
.smallcircle. cryogenic cooler .smallcircle. .smallcircle.
.smallcircle. .smallcircle. .smallcircle. liquid air .smallcircle.
.smallcircle. .smallcircle. .smallcircle. .smallcircle. liquid
nitrogen .smallcircle. .smallcircle. .smallcircle. .smallcircle.
.smallcircle. liquid helium .smallcircle. .smallcircle.
.smallcircle. .smallcircle. .smallcircle.
TABLE-US-00005 Work liquid pentane heptane toluene mercury Cooling
medium -129.9 -90.5 -94.9 -38.8 freezer refrigerant .smallcircle.
.smallcircle. .smallcircle. cryogenic cooler .smallcircle.
.smallcircle. .smallcircle. .smallcircle. liquid air .smallcircle.
.smallcircle. .smallcircle. .smallcircle. liquid nitrogen
.smallcircle. .smallcircle. .smallcircle. .smallcircle. liquid
helium .smallcircle. .smallcircle. .smallcircle. .smallcircle.
[0021] The step S108 is that: referring to FIG. 1, extracting air
from the hollow heat-dissipating body 10. Because the solid work
liquid W' is in solid state, so the solid work liquid W' does not
be extracted out during the step of extracting air from the hollow
heat-dissipating body 10. Hence, the present invention can keep a
predetermined liquid measure and achieve a better vacuum level. In
other words, the solid work liquid W' is in solid state, so that
the present invention can control the liquid measure of the work
liquid W (The maximum liquid measure of the work liquid W is 99%)
and can increase air-extracting time in order to increase the
vacuum level of the hollow heat-dissipating body 10.
[0022] The step S110 is that: referring to FIGS. 1, 1E1 and 1E2,
closing the other end 10A of the hollow heat-dissipating body 10 to
form an evacuated hollow heat-dissipating body. For example, the
other end 10A of the hollow heat-dissipating body 10 is closed by a
press-fitting clamp C with normal or high temperature (such as
200.degree. C.), and the width W1 of the clamp C is equal to or
larger than the width W2 of the hollow heat-dissipating body
10.
[0023] Therefore, the first embodiment of the present invention
provides a heat-dissipating structure (half-finished product) with
high heat-dissipating efficiency. The heat-dissipating structure
includes a heat-dissipating casing 1 and a plurality of solid work
liquids W'. The heat-dissipating casing 1 can be a heat pipe, and
the heat pipe has at least two ends that have been closed. In
addition, the heat-dissipating casing 1 has an evacuated hollow
heat-dissipating body 10, a plurality of microstructures 11
integratedly formed on an inner surface of the hollow
heat-dissipating body 10, and a plurality of supports 12
integratedly formed in the hollow heat-dissipating body 10 in order
to divide an inner space of the hollow heat-dissipating body 10
into a plurality of receiving spaces 100. The solid work liquids W'
are received in the hollow heat-dissipating body 10, and the solid
work liquids W' are filled into the receiving spaces 100.
[0024] After the other end 10A of the hollow heat-dissipating body
10 is closed and the solid work liquids W' is heated to become
liquid state, the heat-dissipating structure of the present
invention is finished. The work temperature range of the present
invention is shown as the following table:
TABLE-US-00006 Work temperature range (.degree. C.) Major work
liquid -273~-70 Helium, neon, argon, krypton, hydrogen, (cryogenic
temperature) nitrogen, oxygen, methane -70~200 Freon, ethane,
ammonia, pentane, heptane, (low temperature) acetone, methanol,
ethanol, water, toluene 200~500 Naphthalene, dowtherm, thermex,
sulfur, (medial temperature) mercury 500~1000 Cesium, rubidium,
potassium, sodium (high temperature) over 1000 Lithium, calcium,
lead, indium, silver (high temperature)
[0025] Moreover, referring to FIG. 1F, the air-tight seal level of
the two ends (10A', 10B') of the hollow heat-dissipating body 10'
is increased by using physical or chemical process to form an outer
coating E on the two ends (10A', 10B') of the hollow
heat-dissipating body 10'. In addition, the physical process
includes plastic deformation, welding, laser, ultrasound wave,
impregnation method or physical vapor deposition, and the chemical
process includes electroplating, electroforming or chemical vapor
deposition. The composition of coatings can be pure metal, alloy,
oxide, polymer or epoxy.
[0026] Referring to FIG. 2, the hollow heat-dissipating body 10''
has an inner coating L formed on an inner surface thereof (the
inner surface of the receiving spaces 100'') in order to increase
the air-tight seal level of the two ends of the hollow
heat-dissipating body 10'' by electroplating, anode process, sol
gel or chemical conversion coating. The inner coating L can be made
of copper, aluminum, tin, lead, zinc, magnesium, silicon or hot
melt glue. When the two ends of the hollow heat-dissipating body
10'' are closed, the air-tight seal level of the two ends of the
hollow heat-dissipating body 10'' is increased by using the inner
coating L.
[0027] In conclusion, the work liquid is pre-solidifying to become
solid state, so that the present invention can control the liquid
measure of the work liquid and can increase air-extracting time in
order to increase the vacuum level of the hollow heat-dissipating
body. Hence, the present invention has good heat-dissipating
efficiency.
[0028] The above-mentioned descriptions represent merely the
preferred embodiment of the present invention, without any
intention to limit the scope of the present invention thereto.
Various equivalent changes, alternations or modifications based on
the claims of present invention are all consequently viewed as
being embraced by the scope of the present invention.
* * * * *