loadpatents
Patent applications and USPTO patent grants for LEE; Chien-Wei.The latest application filed is for "source/drain structure for semiconductor device".
Patent | Date |
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Source/drain Structure For Semiconductor Device App 20220302281 - LEE; Chien-Wei ;   et al. | 2022-09-22 |
FINFET Device and Method of Forming Same App 20220302282 - Lee; Chien-Wei ;   et al. | 2022-09-22 |
FinFET structure and method for manufacturing thereof Grant 11,450,742 - Tsai , et al. September 20, 2 | 2022-09-20 |
Warpage control in the packaging of integrated circuits Grant 11,432,372 - Cheng , et al. August 30, 2 | 2022-08-30 |
Nanosheet Semiconductor Device And Method For Manufacturing The Same App 20220271171 - SU; Chien-Chang ;   et al. | 2022-08-25 |
Transistors with Recessed Silicon Cap and Method Forming Same App 20220223591 - Chen; Yen-Ting ;   et al. | 2022-07-14 |
Method For Forming Semiconductor Structure App 20220190139 - LEE; Chien-Wei ;   et al. | 2022-06-16 |
FinFET device and method of forming same Grant 11,355,620 - Lee , et al. June 7, 2 | 2022-06-07 |
Method of Forming a Source/Drain App 20220123117 - Lee; Chien-Wei ;   et al. | 2022-04-21 |
Transistors with recessed silicon cap and method forming same Grant 11,296,077 - Chen , et al. April 5, 2 | 2022-04-05 |
Method for forming fin field effect transistor device structure Grant 11,271,096 - Lee , et al. March 8, 2 | 2022-03-08 |
Method of forming a source/drain Grant 11,217,672 - Lee , et al. January 4, 2 | 2022-01-04 |
FinFET Device and Method App 20210351081 - Li; Kun-Mu ;   et al. | 2021-11-11 |
Semiconductor Device and Method App 20210336048 - Lee; Chien-Wei ;   et al. | 2021-10-28 |
Method For Forming Fin Field Effect Transistor Device Structure App 20210313443 - LEE; Chien-Wei ;   et al. | 2021-10-07 |
Finfet Structure And Method For Manufacturing Thereof App 20210288146 - TSAI; CHUN HSIUNG ;   et al. | 2021-09-16 |
Data communication and processing method of master device and slave device Grant 11,119,959 - Sheu , et al. September 14, 2 | 2021-09-14 |
Semiconductor Device And Method App 20210265350 - Chin; Chih-Yun ;   et al. | 2021-08-26 |
Fin field-effect transistor device and method of forming the same Grant 11,088,028 - Lin , et al. August 10, 2 | 2021-08-10 |
FinFET device and method Grant 11,075,120 - Li , et al. July 27, 2 | 2021-07-27 |
Semiconductor device and method Grant 11,063,152 - Lee , et al. July 13, 2 | 2021-07-13 |
Interfacial Layer Between Fin and Source/Drain Region App 20210193831 - Chin; Chih-Yun ;   et al. | 2021-06-24 |
Fin Field-Effect Transistor Device and Method of Forming the Same App 20210159122 - Lin; Che-Yu ;   et al. | 2021-05-27 |
Interfacial layer between fin and source/drain region Grant 10,944,005 - Chin , et al. March 9, 2 | 2021-03-09 |
Method of Forming a Source/Drain App 20210066465 - Lee; Chien-Wei ;   et al. | 2021-03-04 |
Semiconductor Device and Method App 20210057567 - Lee; Chien-Wei ;   et al. | 2021-02-25 |
FinFET Device and Method App 20210050267 - Li; Kun-Mu ;   et al. | 2021-02-18 |
Data Communication And Processing Method Of Master Device And Slave Device App 20200257641 - A1 | 2020-08-13 |
Fin Field-effect Transistor Device And Method Of Forming The Same App 20200176319 - Lin; Che-Yu ;   et al. | 2020-06-04 |
Transistors with Recessed Silicon Cap and Method Forming Same App 20200161297 - Chen; Yen-Ting ;   et al. | 2020-05-21 |
FinFET Device and Method of Forming Same App 20200135900 - Lee; Chien-Wei ;   et al. | 2020-04-30 |
Warpage Control in the Packaging of Integrated Circuits App 20200045777 - Cheng; Ming-Da ;   et al. | 2020-02-06 |
Interfacial Layer Between Fin and Source/Drain Region App 20200006548 - Chin; Chih-Yun ;   et al. | 2020-01-02 |
Warpage control in the packaging of integrated circuits Grant 10,512,124 - Cheng , et al. Dec | 2019-12-17 |
Interfacial Layer Between Fin and Source/Drain Region App 20190378920 - Chin; Chih-Yun ;   et al. | 2019-12-12 |
Interfacial layer between fin and source/drain region Grant 10,483,396 - Chin , et al. Nov | 2019-11-19 |
Finfet Structure And Method For Manufacturing Thereof App 20180053825 - TSAI; CHUN HSIUNG ;   et al. | 2018-02-22 |
Multi-type Compatible Connector App 20170338608 - WANG; Pei-Lun ;   et al. | 2017-11-23 |
Composite Connector Having Dual Tongue App 20170338607 - WANG; Pei-Lun ;   et al. | 2017-11-23 |
FinFET structure and method for manufacturing thereof Grant 9,806,154 - Tsai , et al. October 31, 2 | 2017-10-31 |
Fin field effect transistor and method for fabricating the same Grant 9,620,503 - Liao , et al. April 11, 2 | 2017-04-11 |
Warpage Control in the Packaging of Integrated Circuits App 20170098571 - Cheng; Ming-Da ;   et al. | 2017-04-06 |
Warpage control in the packaging of integrated circuits Grant 9,538,582 - Cheng , et al. January 3, 2 | 2017-01-03 |
Finfet Structure And Method For Manufacturing Thereof App 20160211326 - TSAI; CHUN HSIUNG ;   et al. | 2016-07-21 |
Electronic Device And Method For Transmitting Files App 20150052141 - CHARNG; JEN-HSIUNG ;   et al. | 2015-02-19 |
Electronic Device And Method For Transmitting Files App 20150052101 - CHARNG; JEN-HSIUNG ;   et al. | 2015-02-19 |
Computing Device And File Searching Method Using The Computing Device App 20140258283 - CHARNG; JEN-HSIUNG ;   et al. | 2014-09-11 |
Warpage Control in the Packaging of Integrated Circuits App 20140027431 - Cheng; Ming-Da ;   et al. | 2014-01-30 |
Semiconductor device and fabrication method thereof Grant 8,603,911 - Huang , et al. December 10, 2 | 2013-12-10 |
Semiconductor Device And Fabrication Method Thereof App 20120223425 - Huang; Hui-Min ;   et al. | 2012-09-06 |
Touch Panel App 20120075209 - LEE; CHIEN-WEI ;   et al. | 2012-03-29 |
Driving circuit of input/output interface with changeable output force Grant 8,130,013 - Lin , et al. March 6, 2 | 2012-03-06 |
Driving Circuit Of Input/output Interface App 20110148475 - LIN; YU-TONG ;   et al. | 2011-06-23 |
Heat-dissipating Structure With High Heat-dissipating Efficiency And Method For Manufacturing The Same App 20110083829 - HUNG; Shui-Hsu ;   et al. | 2011-04-14 |
Plane-type heat-dissipating structure with high heat-dissipating effect and method formanufacturing the same App 20100326644 - Hung; Shui-Hsu ;   et al. | 2010-12-30 |
Compound pallet App 20060288914 - Lee; Chien-Wei | 2006-12-28 |
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