U.S. patent application number 12/458037 was filed with the patent office on 2010-12-30 for plane-type heat-dissipating structure with high heat-dissipating effect and method formanufacturing the same.
Invention is credited to Shui-Hsu Hung, Chien-Wei Lee, Shih-Wei Lee.
Application Number | 20100326644 12/458037 |
Document ID | / |
Family ID | 43379459 |
Filed Date | 2010-12-30 |
![](/patent/app/20100326644/US20100326644A1-20101230-D00000.TIF)
![](/patent/app/20100326644/US20100326644A1-20101230-D00001.TIF)
![](/patent/app/20100326644/US20100326644A1-20101230-D00002.TIF)
![](/patent/app/20100326644/US20100326644A1-20101230-D00003.TIF)
![](/patent/app/20100326644/US20100326644A1-20101230-D00004.TIF)
![](/patent/app/20100326644/US20100326644A1-20101230-D00005.TIF)
![](/patent/app/20100326644/US20100326644A1-20101230-D00006.TIF)
![](/patent/app/20100326644/US20100326644A1-20101230-D00007.TIF)
![](/patent/app/20100326644/US20100326644A1-20101230-D00008.TIF)
![](/patent/app/20100326644/US20100326644A1-20101230-D00009.TIF)
![](/patent/app/20100326644/US20100326644A1-20101230-D00010.TIF)
View All Diagrams
United States Patent
Application |
20100326644 |
Kind Code |
A1 |
Hung; Shui-Hsu ; et
al. |
December 30, 2010 |
Plane-type heat-dissipating structure with high heat-dissipating
effect and method formanufacturing the same
Abstract
A plane-type heat-dissipating structure with high
heat-dissipating effect includes a first heat-dissipating unit and
a second heat-dissipating unit. The first heat-dissipating unit has
an evacuated hollow heat-dissipating body, a plurality of supports
integratedly formed in the hollow heat-dissipating body in order to
divide an inner space of the hollow heat-dissipating body into a
plurality of receiving spaces, and a plurality of microstructures
integratedly formed on an inner surface of the hollow
heat-dissipating body. Work liquid is filled into the receiving
spaces. The second heat-dissipating unit is integratedly formed on
an outer surface of the first heat-dissipating unit.
Inventors: |
Hung; Shui-Hsu; (Tainan,
TW) ; Lee; Chien-Wei; (Hsinchu, TW) ; Lee;
Shih-Wei; (Fongshan City, TW) |
Correspondence
Address: |
ROSENBERG, KLEIN & LEE
3458 ELLICOTT CENTER DRIVE-SUITE 101
ELLICOTT CITY
MD
21043
US
|
Family ID: |
43379459 |
Appl. No.: |
12/458037 |
Filed: |
June 30, 2009 |
Current U.S.
Class: |
165/185 ;
29/890.03 |
Current CPC
Class: |
F28D 15/0283 20130101;
F28F 1/422 20130101; H01L 2924/0002 20130101; Y10T 29/4935
20150115; F28D 2021/0029 20130101; F28F 13/187 20130101; H01L
2924/0002 20130101; F28D 15/046 20130101; F28D 15/0233 20130101;
H01L 23/427 20130101; F28F 2275/14 20130101; H01L 2924/00 20130101;
F28F 1/42 20130101 |
Class at
Publication: |
165/185 ;
29/890.03 |
International
Class: |
F28F 3/04 20060101
F28F003/04; B21D 53/02 20060101 B21D053/02 |
Claims
1. A plane-type heat-dissipating structure with high
heat-dissipating effect, comprising: a first heat-dissipating unit
having an evacuated hollow heat-dissipating body, a plurality of
supports integratedly formed in the hollow heat-dissipating body in
order to divide an inner space of the hollow heat-dissipating body
into a plurality of receiving spaces, and a plurality of
microstructures integratedly formed on an inner surface of the
hollow heat-dissipating body, wherein work liquid is filled into
the receiving spaces; and a second heat-dissipating unit
integratedly formed on an outer surface of the first
heat-dissipating unit.
2. The plane-type heat-dissipating structure according to claim 1,
wherein the first heat-dissipating unit and the second
heat-dissipating unit are made of aluminum alloy.
3. The plane-type heat-dissipating structure according to claim 1,
wherein the first heat-dissipating unit has a plurality of grooves
formed in the receiving spaces, each groove is between every two
adjacent microstructures, and each microstructure has a rectangular
prism, a cylinder, a taper or a dovetailed shape.
4. The plane-type heat-dissipating structure according to claim 1,
wherein the second heat-dissipating unit has a plurality of
heat-dissipating fins.
5. The plane-type heat-dissipating structure according to claim 4,
wherein the heat-dissipating fins are integratedly disposed on one
part of a top surface of the hollow heat-dissipating body, and
another part of the top surface of the hollow heat-dissipating body
provides a space for receiving at least one heat-generating
element.
6. The plane-type heat-dissipating structure according to claim 4,
wherein each heat-dissipating fin has a rectangular prism, a
cylinder, a taper or a dovetailed shape.
7. The plane-type heat-dissipating structure according to claim 6,
further comprising: at least one third heat-dissipating unit having
a heat-dissipating body, a plurality of heat-dissipating fins
extended upwards from the heat-dissipating body, and a plurality of
dovetailed retaining bodies extended downwards from the
heat-dissipating body, wherein the third heat-dissipating unit is
retained on the second heat-dissipating unit by matching the
dovetailed retaining bodies and the dovetailed heat-dissipating
fins.
8. The plane-type heat-dissipating structure according to claim 7,
wherein the second heat-dissipating unit is integratedly disposed
on one part of a top surface of the hollow heat-dissipating body,
and another part of the top surface of the hollow heat-dissipating
body is one end surface of the hollow heat-dissipating body to
provide a space for receiving at least one heat-generating element,
and the third heat-dissipating unit is disposed over other end
surface of the hollow heat-dissipating body.
9. The plane-type heat-dissipating structure according to claim 7,
wherein the second heat-dissipating unit is integratedly disposed
on a top surface of the hollow heat-dissipating body, so that at
least one heat-generating element with a dovetailed bottom seat is
retained on one end surface of the second heat-dissipating unit,
and the third heat-dissipating unit is retained on another opposite
end surface of the second heat-dissipating unit.
10. The plane-type heat-dissipating structure according to claim 1,
further comprising: at least two third heat-dissipating units,
wherein each third heat-dissipating unit has a heat-dissipating
body, a plurality of heat-dissipating fins extended upwards from
the heat-dissipating body, and a plurality of dovetailed retaining
bodies extended downwards from the heat-dissipating body, wherein
the third heat-dissipating unit is retained on the second
heat-dissipating unit by matching the dovetailed retaining bodies
and the dovetailed heat-dissipating fins, wherein the second
heat-dissipating unit is integratedly disposed on one part of a top
surface of the hollow heat-dissipating body, and another part of
the top surface of the hollow heat-dissipating body is position on
a central area of the first heat-dissipating unit to provide a
space for receiving at least one heat-generating element, and the
two third heat-dissipating units are respectively disposed over two
opposite end surfaces of the hollow heat-dissipating body.
11. A method for manufacturing a plane-type heat-dissipating
structure with high heat-dissipating effect, comprising: using an
extruding mold to integratedly extrude a first heat-dissipating
unit and a second heat-dissipating unit, wherein the first
heat-dissipating unit has a hollow heat-dissipating body, a
plurality of supports integratedly formed in the hollow
heat-dissipating body in order to divide an inner space of the
hollow heat-dissipating body into a plurality of receiving spaces,
and a plurality of microstructures integratedly formed on an inner
surface of the hollow heat-dissipating body, and the second
heat-dissipating unit is integratedly formed on an outer surface of
the first heat-dissipating unit; closing one end of the first
heat-dissipating unit; filling work liquid into the receiving
spaces; and extracting air from the receiving spaces and closing
other opposite end of the first heat-dissipating unit to make the
hollow heat-dissipating body become an evacuated hollow
heat-dissipating body.
12. The method according to claim 11, wherein the extruding mold is
composed of a mold body and a spindle, the mold body has a
plurality of protrusion portions disposed on an inner wall thereof,
the spindle has a forming portion extending forwards from one end
thereof, and the first heat-dissipating unit and the second
heat-dissipating unit are integratedly extruded by matching the
protrusion portions and the forming portion.
13. The method according to claim 12, wherein the forming portion
has a plurality of extending bodies connected to the spindle and
extending forwards, many gaps respectively formed between every two
extending bodies, and each extending body has a plurality of micro
protrusions disposed on a top surface and a bottom surface
thereof.
14. The method according to claim 11, wherein the first
heat-dissipating unit has a plurality of grooves formed in the
receiving spaces, each groove is between every two adjacent
microstructures, and each microstructure has a rectangular prism, a
cylinder, a taper or a dovetailed shape.
15. The method according to claim 11, wherein the second
heat-dissipating unit has a plurality of heat-dissipating fins, and
each heat-dissipating fin has a rectangular prism, a cylinder, a
taper or a dovetailed shape.
16. The method according to claim 15, wherein the heat-dissipating
fins are integratedly disposed on one part of a top surface of the
hollow heat-dissipating body, and another part of the top surface
of the hollow heat-dissipating body provides a space for receiving
at least one heat-generating element.
17. The method according to claim 16, further comprising: at least
one third heat-dissipating unit having a heat-dissipating body, a
plurality of heat-dissipating fins extended upwards from the
heat-dissipating body, and a plurality of dovetailed retaining
bodies extended downwards from the heat-dissipating body, wherein
the third heat-dissipating unit is retained on the second
heat-dissipating unit by matching the dovetailed retaining bodies
and the dovetailed heat-dissipating fins.
18. The method according to claim 17, wherein the second
heat-dissipating unit is integratedly disposed on one part of a top
surface of the hollow heat-dissipating body, and another part of
the top surface of the hollow heat-dissipating body is one end
surface of the hollow heat-dissipating body to provide a space for
receiving at least one heat-generating element, and the third
heat-dissipating unit is disposed over other end surface of the
hollow heat-dissipating body.
19. The method according to claim 17, wherein the second
heat-dissipating unit is integratedly disposed on a top surface of
the hollow heat-dissipating body, so that at least one
heat-generating element with a dovetailed bottom seat is retained
on one end surface of the second heat-dissipating unit, and the
third heat-dissipating unit is retained on another opposite end
surface of the second heat-dissipating unit.
20. The plane-type heat-dissipating structure according to claim
11, further comprising: at least two third heat-dissipating units,
wherein each third heat-dissipating unit has a heat-dissipating
body, a plurality of heat-dissipating fins extended upwards from
the heat-dissipating body, and a plurality of dovetailed retaining
bodies extended downwards from the heat-dissipating body, wherein
the third heat-dissipating unit is retained on the second
heat-dissipating unit by matching the dovetailed retaining bodies
and the dovetailed heat-dissipating fins, wherein the second
heat-dissipating unit is integratedly disposed on one part of a top
surface of the hollow heat-dissipating body, and another part of
the top surface of the hollow heat-dissipating body is position on
a central area of the first heat-dissipating unit to provide a
space for receiving at least one heat-generating element, and the
two third heat-dissipating units are respectively disposed over two
opposite end surfaces of the hollow heat-dissipating body.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a plane-type
heat-dissipating structure and a method for manufacturing the same,
in particular, to a plane-type heat-dissipating structure with high
heat-dissipating effect and a method for manufacturing the
same.
[0003] 2. Description of Related Art
[0004] Cooling or heat removal has been one of the major obstacles
of the electronic industry. The heat dissipation increases with the
scale of integration, the demand for higher performance, and the
increase of multi-functional applications. The development of high
performance heat transfer devices becomes one of the major
development efforts of the industry. Heat pipes have excellent heat
transfer performance due to their low thermal resistance, and are
therefore an effective means for transfer or dissipation of heat
from heat sources. Currently, heat pipes are widely used for
removing heat from heat-generating components such as central
processing units (CPUs) of computers.
[0005] A heat pipe is usually a vacuum casing containing therein a
working medium, which is employed to carry, under phase transitions
between liquid state and vapor state, thermal energy from an
evaporator section to a condenser section of the heat pipe.
Preferably, a wick structure is provided inside the heat pipe,
lining an inner wall of the casing, for drawing the working medium
back to the evaporator section after it is condensed at the
condenser section. In operation, the evaporator section of the heat
pipe is maintained in thermal contact with a heat-generating
component. The working medium contained at the evaporator section
absorbs heat generated by the heat-generating component and then
turns into vapor and moves towards the condenser section where the
vapor is condensed into condensate after releasing the heat into
ambient environment. Due to the difference in capillary pressure
which develops in the wick structure between the two sections, the
condensate is then brought back by the wick structure to the
evaporator section where it is again available for evaporation.
[0006] However, the design of the positions of the evaporator
section and the condenser section still has improvement space.
SUMMARY OF THE INVENTION
[0007] In view of the aforementioned issues, the present invention
provides a plane-type heat-dissipating structure with high
heat-dissipating effect and a method for manufacturing the same.
The present invention can achieve high heat-dissipating effect by
matching two integrated heat-dissipating units. One of the two
heat-dissipating units has an evacuated hollow heat-dissipating
body, a plurality of supports integratedly formed in the hollow
heat-dissipating body in order to divide an inner space of the
hollow heat-dissipating body into a plurality of receiving spaces,
and a plurality of microstructures integratedly formed on an inner
surface of the hollow heat-dissipating body. Work liquid is filled
into the receiving spaces. The second heat-dissipating unit has a
plurality of exposed heat-dissipating fins.
[0008] To achieve the above-mentioned objectives, the present
invention provides a plane-type heat-dissipating structure with
high heat-dissipating effect, including: a first heat-dissipating
unit and a second heat-dissipating unit. The first heat-dissipating
unit has an evacuated hollow heat-dissipating body, a plurality of
supports integratedly formed in the hollow heat-dissipating body in
order to divide an inner space of the hollow heat-dissipating body
into a plurality of receiving spaces, and a plurality of
microstructures integratedly formed on an inner surface of the
hollow heat-dissipating body. Work liquid is filled into the
receiving spaces. The second heat-dissipating unit is integratedly
formed on an outer surface of the first heat-dissipating unit.
[0009] To achieve the above-mentioned objectives, the present
invention provides a method for manufacturing a plane-type
heat-dissipating structure with high heat-dissipating effect,
including: using an extruding mold to integratedly extrude a first
heat-dissipating unit and a second heat-dissipating unit, wherein
the first heat-dissipating unit has a hollow heat-dissipating body,
a plurality of supports integratedly formed in the hollow
heat-dissipating body in order to divide an inner space of the
hollow heat-dissipating body into a plurality of receiving spaces,
and a plurality of microstructures integratedly formed on an inner
surface of the hollow heat-dissipating body, and the second
heat-dissipating unit is integratedly formed on an outer surface of
the first heat-dissipating unit; closing one end of the first
heat-dissipating unit; filling work liquid into the receiving
spaces; and then extracting air from the receiving spaces and
closing other opposite end of the first heat-dissipating unit to
make the hollow heat-dissipating body become an evacuated hollow
heat-dissipating body.
[0010] Therefore, the present invention has the following
advantages:
[0011] 1. The work liquid may generate capillarity by the design of
the microstructures, so that the work liquid may flow back quickly
to a heat-generating area to absorb heat. The microstructures can
be any regular shapes (such as rectangular prism, a cylinder, a
taper or a dovetailed shape) and any irregular shape according to
different design requirement.
[0012] 2. Each heat-dissipating fin has a rectangular prism, a
cylinder, a taper or a dovetailed shape according to different
design requirement.
[0013] 3. The hollow heat-dissipating body provides the second
surface, so that the heat-generating element is smoothly disposed
on the second surface in order to increase heat-conducting
efficiency. Hence, heat generated from the heat-generating element
may be absorbed by the second surface, and the heat is dissipated
by the heat-dissipating fins that are formed on the first
surface.
[0014] 4. A third heat-dissipating unit is retained on the second
heat-dissipating unit by matching the dovetailed retaining bodies
of the third heat-dissipating unit and the dovetailed
heat-dissipating fins of the second heat-dissipating unit.
[0015] 5. A heat-generating element is retained on the second
heat-dissipating unit by matching the dovetailed bottom seat of the
heat-generating element and the dovetailed heat-dissipating fins of
the second heat-dissipating unit.
[0016] In order to further understand the techniques, means and
effects the present invention takes for achieving the prescribed
objectives, the following detailed descriptions and appended
drawings are hereby referred, such that, through which, the
purposes, features and aspects of the present invention can be
thoroughly and concretely appreciated; however, the appended
drawings are merely provided for reference and illustration,
without any intention to be used for limiting the present
invention.
BRIEF DESCRIPTION OF THE DRAWINGS
[0017] FIG. 1A is a perspective, schematic view of the plane-type
heat-dissipating structure with high heat-dissipating effect
according to the first embodiment of the present invention;
[0018] FIG. 1B is a partial enlarged view of the dotted line area
in FIG. 1A;
[0019] FIG. 2 is a partial enlarged view of the plane-type
heat-dissipating structure with high heat-dissipating effect
according to the second embodiment of the present invention;
[0020] FIG. 3 is a partial enlarged view of the plane-type
heat-dissipating structure with high heat-dissipating effect
according to the third embodiment of the present invention;
[0021] FIG. 4 is a partial enlarged view of the plane-type
heat-dissipating structure with high heat-dissipating effect
according to the fourth embodiment of the present invention;
[0022] FIG. 5 is a partial enlarged view of the plane-type
heat-dissipating structure with high heat-dissipating effect
according to the fifth embodiment of the present invention;
[0023] FIG. 6 is a perspective, schematic view of the plane-type
heat-dissipating structure with high heat-dissipating effect
according to the sixth embodiment of the present invention;
[0024] FIG. 7 is a perspective, schematic view of the plane-type
heat-dissipating structure with high heat-dissipating effect
according to the seventh embodiment of the present invention;
[0025] FIG. 8 is a perspective, schematic view of the plane-type
heat-dissipating structure with high heat-dissipating effect
according to the eighth embodiment of the present invention;
[0026] FIG. 9 is a perspective, schematic view of the plane-type
heat-dissipating structure with high heat-dissipating effect
according to the ninth embodiment of the present invention;
[0027] FIG. 10A is a flowchart of the method for manufacturing the
plane-type heat-dissipating structure with high heat-dissipating
effect according to the present invention;
[0028] FIG. 10B is a cross-sectional, schematic view of the
extruding mold according to the present invention;
[0029] FIG. 10C is a partial, perspective, schematic view of the
spindle of the extruding mold according to the present invention;
and
[0030] FIG. 10D is a partial, enlarged view of the extruding mold
according to the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0031] Referring to FIGS. 1A and 1B (FIG. 1B is an enlarged view of
the dotted line range in FIG. 1A), the first embodiment of the
present invention provides a plane-type heat-dissipating structure
with high heat-dissipating effect, including: a first
heat-dissipating unit 1a and a second heat-dissipating unit 2a.
[0032] The first heat-dissipating unit 1a has an evacuated hollow
heat-dissipating body 10a (FIG. 1A shows central part of the hollow
heat-dissipating body 10a), a plurality of supports 11a
integratedly formed in the hollow heat-dissipating body 10a in
order to divide an inner space of the hollow heat-dissipating body
10a into a plurality of receiving spaces 100a, and a plurality of
microstructures 12a integratedly formed on an inner surface of the
hollow heat-dissipating body 10a. In addition, the first
heat-dissipating unit 1a can be made of aluminum alloy such as 1070
series, 6063 series or 6061 series etc. The first heat-dissipating
unit 1a has a plurality of grooves 120a formed in the receiving
spaces 100a, and each groove 120a is between every two adjacent
microstructures 12a. In the first embodiment, each microstructure
12a has a rectangular prism and work liquid (not shown) is filled
into the receiving spaces 100a.
[0033] Moreover, the second heat-dissipating unit 2a is
integratedly formed on an outer surface of the first
heat-dissipating unit 1a. The second heat-dissipating unit 2a can
be made of aluminum alloy such as 1070 series, 6063 series or 6061
series etc. The second heat-dissipating unit 2a has a plurality of
heat-dissipating fins 20a. In the first embodiment, each
heat-dissipating fin 20a has a rectangular prism. However, the
rectangular prism is just an example, and it does not limit the
present invention. For example, each heat-dissipating fin 20a can
be a cylinder, a taper, a dovetailed shape, or any shape in the
present invention.
[0034] Therefore, the work liquid may generate capillarity by the
design of the microstructures 12a, so that the work liquid may flow
back quickly to a heat-generating area to absorb heat. In other
words, when the plane-type heat-dissipating structure is evacuated,
the work liquid would vapor quickly after absorbing heat generated
by a heat-generating area. The heat absorbed by the work liquid
(the vapor) may be dissipated (or cooling) by the first
heat-dissipating unit and the second heat-dissipating unit, and at
the same time the work liquid is cooling and flow back to the
heat-generating area to absorb heat again by capillarity in order
to achieve the circulation of heat absorption and heat
extraction.
[0035] Referring to FIG. 2, the difference between the second
embodiment and the first embodiment is that: in the second
embodiment, each microstructure 12b has a cylinder.
[0036] Referring to FIG. 3, the difference between the third
embodiment and the above-mentioned embodiments is that: in the
third embodiment, each microstructure 12c has a taper.
[0037] Referring to FIG. 4, the difference between the fourth
embodiment and the above-mentioned embodiments is that: in the
fourth embodiment, each microstructure 12d has a dovetailed
shape.
[0038] Referring to FIG. 5, the difference between the fifth
embodiment and the above-mentioned embodiments is that: in the
fifth embodiment, each microstructure 12e has an irregular
shape.
[0039] However, the above-mentioned shape of each microstructure is
just an example, and it does not limit the present invention. Any
regular shapes such as rectangular prism, a cylinder, a taper or a
dovetailed shape and any irregular shape are protected in the
present invention.
[0040] Referring to FIG. 6, the difference between the sixth
embodiment and the above-mentioned embodiments is that: in the
sixth embodiment, the heat-dissipating fins 20f are integratedly
disposed on one part (the first surface F1) of a top surface of the
hollow heat-dissipating body 10f, and another part (the second
surface F2) of the top surface of the hollow heat-dissipating body
10f provides a space for receiving at least one heat-generating
element Hf. In other words, the hollow heat-dissipating body 10f
provides the second surface F2, so that the heat-generating element
Hf is smoothly disposed on the second surface F2 (heat-dissipating
paste can be filled between the heat-generating element Hf and the
second surface F2 extra) in order to increase heat-conducting
efficiency. Hence, heat generated from the heat-generating element
Hf may be absorbed by the second surface F2, and the heat is
dissipated by the heat-dissipating fins 20f that are formed on the
first surface F1.
[0041] Referring to FIG. 7, the difference between the seventh
embodiment and the above-mentioned embodiments is that: the seventh
embodiment further includes at least one third heat-dissipating
unit 3g having a heat-dissipating body 30g, a plurality of
heat-dissipating fins 31g extended upwards from the
heat-dissipating body 30g, and a plurality of dovetailed retaining
bodies 32g extended downwards from the heat-dissipating body 30g.
The third heat-dissipating unit 3g is retained on the second
heat-dissipating unit 2g by matching the dovetailed retaining
bodies 32g and the dovetailed heat-dissipating fins 20g.
[0042] In addition, the second heat-dissipating unit 2g is
integratedly disposed on one part (the first partial surface G1) of
a top surface of the hollow heat-dissipating body 10g, and another
part (the second partial surface G2) of the top surface of the
hollow heat-dissipating body 10g is one end surface of the hollow
heat-dissipating body 10g to provide a space for receiving at least
one heat-generating element Hg, and the third heat-dissipating unit
3g is disposed over other end surface of the hollow
heat-dissipating body 10g.
[0043] Referring to FIG. 8, the difference between the eighth
embodiment and the above-mentioned embodiments is that: the eighth
embodiment further includes at least one third heat-dissipating
unit 3h having a heat-dissipating body 30h, a plurality of
heat-dissipating fins 31h extended upwards from the
heat-dissipating body 30h, and a plurality of dovetailed retaining
bodies 32h extended downwards from the heat-dissipating body 30h.
The third heat-dissipating unit 3h is retained on the second
heat-dissipating unit 2h by matching the dovetailed retaining
bodies 32h and the dovetailed heat-dissipating fins 20h.
[0044] In addition, the second heat-dissipating unit 2h is
integratedly disposed on a top surface (the whole top surface H) of
the hollow heat-dissipating body 10h, so that at least one
heat-generating element Hh with a dovetailed bottom seat Bh is
retained on one end surface of the second heat-dissipating unit 2h,
and the third heat-dissipating unit 3h is retained on another
opposite end surface of the second heat-dissipating unit 2h.
[0045] Referring to FIG. 9, the difference between the ninth
embodiment and the above-mentioned embodiments is that: the ninth
embodiment further includes at least two third heat-dissipating
units 3i. Each third heat-dissipating unit 3i has a
heat-dissipating body 30i, a plurality of heat-dissipating fins 31i
extended upwards from the heat-dissipating body 30i, and a
plurality of dovetailed retaining bodies 32i extended downwards
from the heat-dissipating body 30i. Hence, the two third
heat-dissipating units 3i are retained on the second
heat-dissipating unit 2i by matching the dovetailed retaining
bodies 32i and the dovetailed heat-dissipating fins 20i.
[0046] In addition, the second heat-dissipating unit 2i is
integratedly disposed on one part (the first surface I1) of a top
surface of the hollow heat-dissipating body 10i, and another part
(the second surface I2) of the top surface of the hollow
heat-dissipating body 10i is position on a central area of the
first heat-dissipating unit 1i to provide a space for receiving at
least one heat-generating element Hi, and the two third
heat-dissipating units 3i are respectively disposed over two
opposite end surfaces of the hollow heat-dissipating body 1i.
[0047] Referring to FIGS. 10A to 10D, the first embodiment is an
example; the present invention provides a method for manufacturing
a plane-type heat-dissipating structure with high heat-dissipating
effect. The method includes the following steps:
[0048] Step S100 is that: using an extruding mold M to integratedly
extrude a first heat-dissipating unit 1a and a second
heat-dissipating unit 2a; wherein the first heat-dissipating unit
1a has a hollow heat-dissipating body 10a, a plurality of supports
11a integratedly formed in the hollow heat-dissipating body 10a in
order to divide an inner space of the hollow heat-dissipating body
10a into a plurality of receiving spaces 100a, and a plurality of
microstructures 12a integratedly formed on an inner surface of the
hollow heat-dissipating body 10a, and the second heat-dissipating
unit 2a is integratedly formed on an outer surface of the first
heat-dissipating unit 1a.
[0049] Referring to FIG. 10B, the extruding mold M is composed of a
mold body M1 and a spindle M2. The mold body M1 has a plurality of
protrusion portions M10 disposed on an inner wall thereof, and the
spindle M2 has a forming portion M20 extending forwards from one
end thereof. In addition, the protrusion portions M10 can be used
to extrude tooth shape, and the protrusion portions M10 are
manufactured by contact fabrication or noncontact fabrication, for
example, electro-chemistry (such as etching, electroforming,
electro-discharge machining, and CNC wire cutting) and energy
bundle processing (such as laser with different wavelength,
electronic beam, and ultrasonic machining).
[0050] Referring to FIG. 10C, the forming portion M20 has a
plurality of extending bodies M200 connected to the spindle M2 and
extending forwards. There are many gaps G respectively formed
between every two extending bodies M200. Each extending body M200
has a plurality of micro protrusions M2000 disposed on a top
surface and a bottom surface thereof.
[0051] Referring to FIGS. 10B to 10D, the first heat-dissipating
unit 1a and the second heat-dissipating unit 2a are integratedly
extruded by matching the protrusion portions M10 of the mold body
M1 and the micro protrusions M2000 of the forming portion M20.
[0052] Step S102 is that: closing one end of the first
heat-dissipating unit 1a.
[0053] Step S104 is that: filling work liquid (not shown) into the
receiving spaces 100a.
[0054] Step S106 is that: extracting air from the receiving spaces
100a and closing other opposite end of the first heat-dissipating
unit 1a to make the hollow heat-dissipating body 10a become an
evacuated hollow heat-dissipating body 10a.
[0055] In conclusion, the present invention has the following
advantages:
[0056] 1. The work liquid may generate capillarity by the design of
the microstructures, so that the work liquid may flow back quickly
to a heat-generating area to absorb heat. The microstructures can
be any regular shapes (such as rectangular prism, a cylinder, a
taper or a dovetailed shape) and any irregular shape according to
different design requirement.
[0057] 2. Each heat-dissipating fin has a rectangular prism, a
cylinder, a taper or a dovetailed shape according to different
design requirement.
[0058] 3. The hollow heat-dissipating body provides the second
surface, so that the heat-generating element is smoothly disposed
on the second surface in order to increase heat-conducting
efficiency. Hence, heat generated from the heat-generating element
may be absorbed by the second surface, and the heat is dissipated
by the heat-dissipating fins that are formed on the first
surface.
[0059] 4. The third heat-dissipating unit is retained on the second
heat-dissipating unit by matching the dovetailed retaining bodies
of the third heat-dissipating unit and the dovetailed
heat-dissipating fins of the second heat-dissipating unit.
[0060] 5. The heat-generating element is retained on the second
heat-dissipating unit by matching the dovetailed bottom seat of the
heat-generating element and the dovetailed heat-dissipating fins of
the second heat-dissipating unit.
[0061] The above-mentioned descriptions represent merely the
preferred embodiment of the present invention, without any
intention to limit the scope of the present invention thereto.
Various equivalent changes, alternations or modifications based on
the claims of present invention are all consequently viewed as
being embraced by the scope of the present invention.
* * * * *