U.S. patent application number 12/581129 was filed with the patent office on 2011-02-24 for radiating package module for exothermic element.
Invention is credited to Seog Moon Choi, Jin Su Kim, Jong Man KIM, Sang Hyun Shin.
Application Number | 20110042042 12/581129 |
Document ID | / |
Family ID | 43604355 |
Filed Date | 2011-02-24 |
United States Patent
Application |
20110042042 |
Kind Code |
A1 |
KIM; Jong Man ; et
al. |
February 24, 2011 |
RADIATING PACKAGE MODULE FOR EXOTHERMIC ELEMENT
Abstract
Disclosed herein is a radiating package module for an exothermic
element. The radiating package module includes a heat conducting
plate which has a groove of an internal thread shape, with the
exothermic element being mounted on a surface of the heat
conducting plate. A heat pipe is inserted into the groove in a
screw-type coupling manner and has a coupling part of an external
thread shape. An adhesive is applied between the groove and the
coupling part. A cooling unit is coupled to an end of the heat
pipe. The radiating package module maintains the reliability with
which the radiating package radiates heat and improves structural
reliability.
Inventors: |
KIM; Jong Man; (Gyunggi-do,
KR) ; Choi; Seog Moon; (Seoul, KR) ; Shin;
Sang Hyun; (Gyunggi-do, KR) ; Kim; Jin Su;
(Seoul, KR) |
Correspondence
Address: |
BLAKELY SOKOLOFF TAYLOR & ZAFMAN LLP
1279 OAKMEAD PARKWAY
SUNNYVALE
CA
94085-4040
US
|
Family ID: |
43604355 |
Appl. No.: |
12/581129 |
Filed: |
October 17, 2009 |
Current U.S.
Class: |
165/104.26 ;
165/104.33; 165/133; 165/185 |
Current CPC
Class: |
F28F 1/08 20130101; F21V
29/51 20150115; F28F 2275/14 20130101; F28D 15/0275 20130101; F21Y
2115/30 20160801; H01L 2924/0002 20130101; F21Y 2115/10 20160801;
F28F 2275/025 20130101; H01L 2924/0002 20130101; H01L 2924/00
20130101 |
Class at
Publication: |
165/104.26 ;
165/104.33; 165/185; 165/133 |
International
Class: |
F28D 15/04 20060101
F28D015/04; F28F 7/00 20060101 F28F007/00; F28F 13/18 20060101
F28F013/18 |
Foreign Application Data
Date |
Code |
Application Number |
Aug 24, 2009 |
KR |
10-2009-0078131 |
Claims
1. A radiating package module for an exothermic element,
comprising: a heat conducting plate having a groove of an internal
thread shape, with the exothermic element being mounted on a
surface of the heat conducting plate; a heat pipe inserted into the
groove in a screw-type coupling manner, and having a coupling part
of an external thread shape; an adhesive applied between the groove
and the coupling part; and a cooling unit coupled to an end of the
heat pipe.
2. The radiating package module as set forth in claim 1, wherein
the groove passes from a side of the heat conducting plate to an
opposite side thereof.
3. The radiating package module as set forth in claim 1, wherein
the coupling part has a shape of a round thread.
4. A radiating package module for an exothermic element,
comprising: a heat conducting plate having a groove of an internal
thread shape, with the exothermic element being mounted on a
surface of the heat conducting plate; a heat pipe inserted into the
groove in a screw-type coupling manner, and having a coupling part
of an external thread shape; an adhesive applied between the groove
and the coupling part; a polymer core contained in the adhesive;
and a cooling unit coupled to an end of the heat pipe, wherein a
micro pattern is formed on either of a surface of the groove or a
surface of the coupling part.
5. The radiating package module as set forth in claim 4, wherein
the micro pattern is formed in the same direction as the
thread.
6. A radiating package module for an exothermic element,
comprising: a heat conducting plate having the exothermic element
mounted on a surface thereof and a groove of an internal thread
shape, with a first micro pattern being formed on a surface of the
groove; a heat pipe inserted into the groove in a screw-type
coupling manner, and having a coupling part of an external thread
shape, with a second micro pattern being formed on a surface of the
coupling part; an adhesive applied between the groove and the
coupling part; a polymer core contained in the adhesive; and a
cooling unit coupled to an end of the heat pipe.
7. The radiating package module as set forth in claim 6, wherein
the first micro pattern and the second micro pattern are formed in
the same directions as the internal thread and the external thread,
respectively, the first micro pattern and the second micro pattern
being formed at corresponding positions.
Description
CROSS REFERENCE TO RELATED APPLICATION(S)
[0001] This application claims the benefit of Korean Patent
Application No. 10-2009-0078131, filed on Aug. 24, 2009, entitled
"RADIATING PACKAGE MODULE IN EXOTHERMIC ELEMENT", which is hereby
incorporated by reference in its entirety into this
application.
BACKGROUND OF THE INVENTION
[0002] 1. Technical Field
[0003] The present invention relates to a radiating package module
for an exothermic element.
[0004] 2. Description of the Related Art
[0005] The quantity of light of a luminous element is very
susceptible to the design of a radiating package. Considering that
the luminous element emits in the form of heat about 60%.about.80%
of the power which is applied, the thermal design of the radiating
package is very important in terms of luminous efficiency of the
luminous element and thermal reliability. Also, in a package module
on which an exothermic element as well as the luminous element is
mounted, the efficiency of the module is considerably affected by
the radiative ability of the designed radiating package module.
[0006] Generally, many of the radiating package module of the
exothermic element use a forced air cooling method. A heat sink, a
heat pipe, a fan, and a blower have been used as parts of the
radiating package module.
[0007] A thermal interface material (TIM) is used between the
package with the exothermic element and the heat sink so as to
minimize thermal resistance generated in the empty space. In order
to minimize thermal resistance between radiative parts in the
radiating package module, the radiative parts are coupled to each
other by applying solder paste or thermal grease to a coupling
cooling part, thus improving heat transfer characteristics.
[0008] The conventional radiating package module generally includes
an exothermic element, a heat conducting plate on which the
exothermic element is mounted, a heat pipe which transfers emitted
heat, and a cooling unit which radiates transferred heat to an
outside.
[0009] In order to assemble the heat conducting plate having the
exothermic element with the heat pipe, the heat pipe is forcibly
fitted into the heat conducting plate, and thereafter is pressed
using a press. Such a forcible fitting method impairs the surface
of the heat pipe, so that water may leak out of the heat pipe in a
reliability test. In the case where solder paste is used as an
adhesive, a bonded state may become poor when the heat pipe and the
heat conducting plate are coupled to each other in a reflow
process.
[0010] Therefore, the radiating package module is problematic in
that a crack may occur in a test for high temperature reliability,
impact or vibration. Especially, a crack may occur between solder
paste material and the heat pipe or between solder paste material
and the heat conducting plate because of external vibration, so
that thermal resistance increases at a contact surface, and thus
the lifespan of the package may be reduced.
SUMMARY OF THE INVENTION
[0011] The present invention is intended to provide a radiating
package module for an exothermic element which is capable of
improving structural reliability by changing a coupling shape in
place of a simple coupling method using solder paste or thermal
grease.
[0012] Further, the present invention is intended to provide a
radiating package module for an exothermic element, in which a
groove of a heat conducting plate and a coupling part of a heat
pipe have a thread shape and are coupled to each other in a
screw-type coupling manner, micro patterns are provided on the
groove of the heat conducting plate and a surface of the coupling
part of the heat pipe, and a polymer core is added to solder paste
or thermal grease, thus improving both the reliability of radiating
heat and structural reliability.
[0013] In an exemplary radiating package module for an exothermic
element according to an embodiment of the present invention, a heat
conducting plate has a groove of an internal thread shape, with the
exothermic element being mounted on a surface of the heat
conducting plate. A heat pipe is inserted into the groove in a
screw-type coupling manner and has a coupling part of an external
thread shape. An adhesive is applied between the groove and the
coupling part. A cooling unit is coupled to an end of the heat
pipe.
[0014] The groove may pass from a side of the heat conducting plate
to an opposite side thereof.
[0015] Further, the coupling part may have a shape of a round
thread.
[0016] In an exemplary radiating package module for an exothermic
element according to another embodiment of the present invention, a
heat conducting plate has a groove of an internal thread shape,
with the exothermic element being mounted on a surface of the heat
conducting plate. A heat pipe is inserted into the groove in a
screw-type coupling manner, and has a coupling part of an external
thread shape. An adhesive is applied between the groove and the
coupling part. A polymer core is contained in the adhesive. A
cooling unit is coupled to an end of the heat pipe. Here, a micro
pattern is formed on either of a surface of the groove or a surface
of the coupling part.
[0017] Further, the micro pattern may be formed in the same
direction as the thread.
[0018] In an exemplary radiating package module for an exothermic
element according to a further embodiment of the present invention,
a heat conducting plate has the exothermic element mounted on a
surface thereof and a groove of an internal thread shape, with a
first micro pattern being formed on a surface of the groove. A heat
pipe is inserted into the groove in a screw-type coupling manner,
and has a coupling part of an external thread shape, with a second
micro pattern being formed on a surface of the coupling part. An
adhesive is applied between the groove and the coupling part. A
polymer core is contained in the adhesive. A cooling unit is
coupled to an end of the heat pipe.
[0019] Further, each of the first and second micro patterns may be
formed in the same direction as a thread and at corresponding
positions.
BRIEF DESCRIPTION OF THE DRAWINGS
[0020] FIG. 1 is a perspective view illustrating a radiating
package module for an exothermic element according to a preferred
embodiment of the present invention;
[0021] FIG. 2 is a sectional view taken along line A-A' of FIG. 1
and illustrating a heat conducting plate according to the preferred
embodiment of the present invention;
[0022] FIG. 3 is a perspective view illustrating a heat pipe
according to the preferred embodiment of the present invention;
[0023] FIG. 4 is a sectional view taken along line A-A' of FIG. 1
and illustrating a heat conducting plate according to another
preferred embodiment of the present invention;
[0024] FIG. 5 is a perspective view illustrating a heat pipe
according to another preferred embodiment of the present invention;
and
[0025] FIG. 6 is a sectional view illustrating the coupled shape of
a coupling part of a heat pipe with a groove of the heat conducting
plate in a screw-type coupling manner according to the preferred
embodiment of the present invention.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0026] Various objects, advantages and features of the invention
will become apparent from the following description of embodiments
with reference to the accompanying drawings.
[0027] The terms and words used in the present specification and
claims should not be interpreted as being limited to typical
meanings or dictionary definitions, but should be interpreted as
having meanings and concepts relevant to the technical scope of the
present invention based on the rule according to which an inventor
can appropriately define the concept of the terms to describe most
appropriately the best method he or she knows for carrying out the
invention.
[0028] The above and other objects, features and advantages of the
present invention will be more clearly understood from the
following detailed description taken in conjunction with the
accompanying drawings. Herein, the same reference numerals are used
throughout the different drawings to designate the same components.
Further, when it is determined that the detailed description of the
known art related to the present invention might obscure the gist
of the present invention, the detailed description thereof will be
omitted.
[0029] Hereinafter, the preferred embodiments of the present
invention will be described in detail with reference to the
accompanying drawings.
[0030] FIG. 1 is a perspective view illustrating a radiating
package module for an exothermic element according to a preferred
embodiment of the present invention, FIG. 2 is a sectional view
taken along line A-A' of FIG. 1 and illustrating a heat conducting
plate included in the radiating package module, and FIG. 3 is a
perspective view illustrating a heat pipe which is to be coupled to
a heat conducting plate in a screw-type coupling manner.
[0031] The radiating package module according to the preferred
embodiment of the present invention will be described below with
reference to FIG. 1.
[0032] The radiating package module according to this embodiment
includes a heat conducting plate 20, a heat pipe 30, an adhesive,
and a cooling unit 40. The heat conducting plate 20 has a groove,
with an exothermic element 10 mounted to a surface of the heat
conducting plate 20. The heat pipe 30 has a coupling part which is
inserted into the groove to be coupled thereto in a screw-type
coupling manner. The adhesive is applied between the groove and the
coupling part. The cooling unit 40 is connected to an end of the
heat pipe 30.
[0033] Here, the exothermic element 10 means an element which
generates heat to the outside when the element is operated in
combination with a luminous element. Particularly, the luminous
element means an element which transforms electric energy into
light energy. The luminous element may comprise an Integrated
Circuit (IC) chip such as a Light Emitting Diode (LED) or an
Injection Laser Diode (ILD). Compared to other luminous elements,
the LED is inexpensive and may be operated within a wide
temperature range, so that the LED may be widely used in a variety
of fields. Recently, the LED has been widely used for illumination
of cars as well as for general illumination.
[0034] Further, the exothermic element 10 is mounted on a surface
of the heat conducting plate 20. The heat conducting plate 20
transmits heat from the exothermic element 10 to the heat pipe 30,
in addition to locking and supporting the exothermic element
10.
[0035] The heat pipe 30 absorbs heat transmitted via the heat
conducting plate 20, prior to transmitting the heat to the cooling
unit 40. The heat transfer method of the heat pipe 30 is classified
into two methods, the first of which involves the heat pipe 30
containing a working fluid therein and transferring heat through
the evaporation and condensation of the working fluid;
alternatively, the heat pipe 30 does not contain working fluid
therein but is made of a material having a high heat conductivity
through which the heat is transferred. The heat pipe according to
the present invention may use either of the above-mentioned
methods.
[0036] Further, solder paste or thermal grease may be used as the
adhesive. The adhesive is applied between the groove 21 of the heat
conducting plate 20 and the coupling part 31 of the heat pipe 30 so
as to prevent an empty space from being created between the groove
21 and the coupling part 31, thus improving the heat conductivity
of the heat conducting plate and the heat pipe. Further, the
adhesive is hardened through a reflow process in order to more
firmly couple the heat conducting plate 20 with the heat pipe
30.
[0037] As shown in FIG. 1, the cooling unit 40 has the shape of a
fin and serves to dissipate heat transmitted through the heat pipe
30 to the outside. The cooling unit 40 is not limited to the shape
of the fin shown in FIG. 1, and may further include a cooling
fan.
[0038] The heat conducting plate according to the preferred
embodiment of the present invention will be described in detail
with reference to FIG. 2.
[0039] As shown in FIG. 2, the heat conducting plate 20 has the
groove 21 which has the shape of an internal thread.
[0040] The groove 21 may be formed to pass from one side in a
thickness direction of the heat conducting plate 20 to the center
thereof. The groove 21 is the area into which the coupling part 31
of the heat pipe 30 that will be described below in detail is
inserted in a screw-type coupling manner.
[0041] The groove 21 may be formed to pass through part of the heat
conducting plate 20 in the direction of the center thereof.
However, in order to increase the contact area of the heat pipe 30
with the heat conducting plate 20, the groove 21 is preferably
formed to completely pass from one side to the other side in the
thickness direction of the heat conducting plate 20.
[0042] Further, the groove 21 has the shape of the internal thread.
In this regard, the shape of the internal thread means the shape in
which threads are formed on the inner surface of the groove. Such a
shape allows the heat pipe 30 with the coupling part 31 having the
shape of an external thread to be more firmly coupled to the heat
conducting plate 20 using the screw-type coupling manner.
[0043] Preferably, the pitch, depth and shape of the internal
thread correspond to those of the external thread so that the
internal thread of the groove 21 easily engages with the external
thread of the coupling part 31 of the heat pipe 30.
[0044] The heat pipe according to the preferred embodiment of the
present invention will be described in detail with reference to
FIG. 3.
[0045] As shown in FIG. 3, the heat pipe 30 has the coupling part
31 having the shape of the external thread.
[0046] The coupling part 31 is provided on a predetermined portion
of the heat pipe 30. Preferably, the length of the coupling part 31
corresponds to that of the groove 21 of the heat conducting plate
20. Further, the coupling part 31 may be provided on the middle
portion of the heat pipe 30. However, it is preferable that the
coupling part 31 be formed from a central portion of the heat pipe
30 to an end thereof. Such a construction enables the position of
the heat pipe 30 relative to the heat conducting plate 20 to be
adjusted.
[0047] Further, the coupling part 31 has the shape of the external
thread. The shape of the external thread means the shape in which
threads are formed on the outer surface of the pipe.
[0048] Here, the groove 21 of the heat conducting plate 20 is
coupled to the coupling part 31 of the heat pipe 30 in a screw-type
coupling manner, so that the frequency of cracks which may occur
during coupling is reduced unlike a simple coupling manner which
uses press fitting, and the contact area of the groove 21 with the
coupling part 31 is increased. Consequently, heat conductivity is
improved.
[0049] Meanwhile, the external thread may have various shapes
including a triangular thread, a square thread, and a buttress
thread. The external thread preferably comprises a round thread
which enables the groove 21 to be coupled with the coupling part 31
in a screw-type coupling manner without generating friction, in
addition to increasing a contact surface.
[0050] FIG. 4 is a sectional view taken along line A-A' of FIG. 1
and illustrating a heat conducting plate according to another
preferred embodiment of the present invention, FIG. 5 is a
perspective view illustrating a heat pipe which is to be coupled to
the heat conducting plate in a screw-type coupling manner, and FIG.
6 is a sectional view illustrating a shape in which the heat pipe
is coupled to a groove of the heat conducting plate.
[0051] Hereinafter, a radiating package module for an exothermic
element according to to another embodiment of the present invention
will be described with reference to FIGS. 4 to 6. The detailed
description of the construction of the radiating package of FIGS. 4
to 6 which is equal to that of the radiating package of FIGS. 1 to
3 will be omitted herein.
[0052] The heat conducting plate according to the preferred
embodiment of the present invention will be described in detail
with reference to FIG. 4.
[0053] Here, the heat conducting plate 20 has a groove 21 having
the shape of an internal thread. A micro pattern 22 is further
provided on a surface of the internal thread.
[0054] The micro pattern 22 is a micro groove which is formed at an
inner position on the internal thread. Since the micro groove may
have various shapes, including those of a triangle, a square, and a
circle, the shape of the micro pattern is not limited. Further, it
is preferable that the micro pattern 22 be continuously formed on
the surface of the internal thread in a solid line or a broken
line.
[0055] As shown in FIG. 4, the micro pattern 22 is preferably
formed in the same direction as the proceeding direction of the
internal thread. The internal thread is formed such that a thread
is positioned in a surface while having a predetermined torsion
angle. If the micro pattern is formed to have the same angle as the
torsion angle of the internal thread, the micro pattern may be
formed in the same direction as the thread of the internal thread.
Further, a plurality of micro patterns 22 may be formed on one
thread by adjusting the width of a micro pattern 22 and an interval
between adjacent micro patterns 22.
[0056] Meanwhile, the micro pattern 22 may be formed through
mechanical etching, and is covered by an adhesive containing a
polymer core when the coupling part 31 of the heat pipe 30 is
coupled to the groove 21. When the micro pattern 22 is covered by
the adhesive, heat conductivity is improved. The groove 21 of the
heat conducting plate 20 is more strongly coupled to the coupling
part 31 of the heat pipe 30.
[0057] Further, when the coupling part 31 of the heat pipe 30
having the shape of the external thread is coupled to the groove 21
in a screw-type coupling manner, the adhesive and the polymer core
(not shown) are naturally inserted into the micro pattern 22.
[0058] The polymer core may be a spherical particle which includes
a core made of polymer and a contact layer surrounding the core.
Since the core is made of polymer, stress relief ability is
excellent. Further, since the contact layer comprises a metal
plating layer, it has heat conductivity. The type of polymer
forming the core and the metal plating layer is not subject to any
specific limitations. However, the contact layer is preferably made
of gold or nickel having high heat conductivity.
[0059] Further, the diameter of the polymer core is not limited,
and polymer cores of a variety of sizes may be applied to this
embodiment. In order to allow the polymer core to be inserted into
the micro pattern 22, the polymer core which has a size
corresponding to that of the micro pattern is preferably used.
[0060] Therefore, the polymer core is inserted into the micro
pattern 22, so that heat conductivity for transferring heat from
the heat conducting plate 20 to the heat pipe 30 is maintained, and
a crack occurring in the heat conducting plate 20 changes its
proceeding direction or is delayed when the crack proceeds to the
surface of the internal thread, and so that impacts continuously
acting on the heat conducting plate 20 are absorbed by the polymer
core. As a result, the progress of a crack can be delayed.
[0061] The heat pipe according to the preferred embodiment of the
present invention will be described in detail with reference to
FIG. 5.
[0062] The heat pipe 30 has a coupling part 31 having the shape of
an external thread, and a micro pattern 32 formed on a surface of
the external thread.
[0063] The micro pattern 32 formed on the surface of the external
thread has the same shape as the micro pattern 22 of the groove 21
which is formed on the heat conducting plate 20, and may be formed
in the same manner as the micro pattern 22 of the groove 21.
Further, polymer core may be inserted into the micro pattern 32
formed on the surface of the external thread of the coupling part
31, in the same manner that the polymer core is inserted into the
micro pattern 22 of the groove 21.
[0064] The polymer core changes the direction in which a crack
proceeds when one occurs in the heat pipe 30 or delays the crack,
and absorbs impact acting on the heat pipe 30.
[0065] Meanwhile, since the micro pattern 22 formed on the surface
of the internal thread and the micro pattern 32 formed on the
surface of the external thread may be made through separate
mechanical etching, the micro patterns may have different shapes.
Although the micro patterns 22 and 32 have different shapes, it is
preferable that each micro pattern be formed in the same direction
as the thread, as described above with reference to FIG. 4.
[0066] FIG. 6 is a sectional view illustrating the shape in which
the coupling part 31 of the heat pipe 30 is coupled to the groove
21 of the heat conducting plate 20 in a screw-type coupling manner.
The shape of the groove 21 coupled with the coupling part 31 will
be described below with reference to FIG. 6.
[0067] Both the groove 21 and the coupling part 31 may be formed to
have micro patterns on surfaces thereof. That is, the first micro
pattern 22 is formed on the surface of the groove 21, and the
second micro pattern 32 is formed on the surface of the coupling
part 31. Here, polymer cores may be inserted, respectively, into
the first micro pattern 22 and the second micro pattern 32 to be
secured thereto.
[0068] Meanwhile, a polymer core 51 may be placed between the
surface of the coupling part 31 having no micro pattern and the
surface of the groove 21 having no micro pattern, thus maintaining
stress relief ability, therefore reducing impact acting on the
radiating package.
[0069] Further, as shown in FIG. 6, the first micro pattern 22 or
the second micro pattern 32 is formed in the same direction as a
thread. The first and second micro patterns 22 and 32 may be formed
at corresponding positions. Thus, the polymer core 51 may be
positioned between the micro patterns 22 and 32.
[0070] Since the polymer core 51 is uniformly inserted between the
micro patterns 22 and 32, it can delay a crack occurring in the
groove 21 or the coupling part 31 and mitigate impact acting on the
radiating package.
[0071] Meanwhile, FIG. 6 shows an example provided merely for
illustrative purposes wherein three micro patterns 32 are formed on
a unit thread of the coupling part 31. Further, the degree of
etching changes according to the size of the polymer core 51
contained in the adhesive 50 so as to adjust the size of the micro
pattern 32.
[0072] As described above, the present invention provides a
radiating package module for an exothermic element, which uses a
screw-type coupling method in place of a simple coupling method of
forced press-fitting, thus changing the structural shape thereof
and thereby improving the structural reliability of the radiating
package.
[0073] Further, the present invention provides a radiating package
module for an exothermic element, in which an adhesive containing a
polymer core is applied between a heat conducting plate and a heat
pipe so as to prevent thermal resistance from being generated
between radiation parts, thus maintaining heat transfer
characteristics and improving the structural reliability of the
radiating package.
[0074] Although the preferred embodiments of the present invention
have been disclosed for illustrative purposes, those skilled in the
art will appreciate that various modifications, additions and
substitutions are possible, without departing from the scope and
spirit of the invention as disclosed in the accompanying claims.
Accordingly, such modifications, additions and substitutions should
also be understood as falling within the scope of the present
invention.
* * * * *