CHOI; Seog Moon

Patent Applications and Registrations

Patent applications and USPTO patent grants for CHOI; Seog Moon.The latest application filed is for "sensing device".

Company Profile

0.73.113

CHOI; Seog Moon - Suwon-si KR
Choi; Seog Moon - Seoul KR
Choi; Seog Moon - Gyunggi-do KR
CHOI; Seog Moon - Gyeonggi-Do KR
CHOI; Seog Moon - Seocho-gu KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Sensing Device App 20220066022 - LEE; Young Ki ; et al.	2022-03-03
Antenna Apparatus App 20210126353 - LEE; Hong Seok ; et al.	2021-04-29
Antenna apparatus Grant 10,992,033 - Lee , et al. April 27, 2	2021-04-27
Power module package and method for manufacturing the same Grant 9,318,352 - Kim , et al. April 19, 2	2016-04-19
Light emitting device package and method of manufacturing the same Grant 9,257,615 - Lee , et al. February 9, 2	2016-02-09
Insulation structure for high temperature conditions and manufacturing method thereof Grant 9,231,167 - Lee , et al. January 5, 2	2016-01-05
Method of manufacturing a hybrid heat-radiating substrate Grant 9,107,313 - Lim , et al. August 11, 2	2015-08-11
Sensor Package And Portable Terminal Having The Same App 20150177028 - LEE; Sun Kyu ; et al.	2015-06-25
Insulation Structure For High Temperature Conditions And Manufacturing Method Thereof App 20150084089 - LEE; Young Ki ; et al.	2015-03-26
Power module package and system module having the same Grant 8,941,220 - Kim , et al. January 27, 2	2015-01-27
Method Of Manufacturing Printed Circuit Board App 20140317919 - KIM; Jin Su ; et al.	2014-10-30
3D power module package Grant 8,842,438 - Kim , et al. September 23, 2	2014-09-23
Semiconductor package Grant 8,823,153 - Kim , et al. September 2, 2	2014-09-02
Method of manufacturing printed circuit board Grant 8,800,137 - Kim , et al. August 12, 2	2014-08-12
Heat-dissipating Substrate And Fabricating Method Thereof App 20140174940 - LIM; Chang Hyun ; et al.	2014-06-26
Semiconductor package substrate Grant 8,736,077 - Kim , et al. May 27, 2	2014-05-27
Power module package and method for fabricating the same Grant 8,729,683 - Kim , et al. May 20, 2	2014-05-20
Package Substrate For Optical Element And Method Of Manufacturing The Same App 20140113392 - PARK; Ji Hyun ; et al.	2014-04-24
Package Substrate For Optical Element And Method Of Manufacturing The Same App 20140113393 - PARK; Ji Hyun ; et al.	2014-04-24
Hybrid Heat-radiating Substrate And Method Of Manufacturing The Same App 20140096380 - LIM; Chang Hyun ; et al.	2014-04-10
Heat-dissipating substrate and fabricating method thereof Grant 8,686,295 - Lim , et al. April 1, 2	2014-04-01
Power module package and method for manufacturing the same Grant 8,664,755 - Lim , et al. March 4, 2	2014-03-04
Power module using sintering die attach and manufacturing method thereof Grant 8,630,097 - Kim , et al. January 14, 2	2014-01-14
Heat dissipation device for power conversion module Grant 8,630,090 - Sohn , et al. January 14, 2	2014-01-14
Power Module Package And Method For Manufacturing The Same App 20130337613 - Kim; Kwang Soo ; et al.	2013-12-19
Light emitting diode package and method of manufacturing the same Grant 8,610,146 - Shin , et al. December 17, 2	2013-12-17
Method of manufacturing package substrate for optical element Grant 8,603,842 - Lim , et al. December 10, 2	2013-12-10
Light emitting diode package having multi-stepped reflecting surface structure and fabrication method thereof Grant 8,586,128 - Shin , et al. November 19, 2	2013-11-19
Heat-radiating substrate and method of manufacturing the same Grant 8,553,417 - Park , et al. October 8, 2	2013-10-08
Power module package and method for manufacturing the same Grant 8,502,374 - Kim , et al. August 6, 2	2013-08-06
Transformer having the heat radiation function Grant 8,493,167 - Kim , et al. July 23, 2	2013-07-23
Method forming a semiconductor light emitting device with perforations formed within Grant 8,476,090 - Shin , et al. July 2, 2	2013-07-02
Semiconductor Package App 20130154069 - Kim; Tae Hoon ; et al.	2013-06-20
Semiconductor Package App 20130154070 - Kim; Tae Hoon ; et al.	2013-06-20
Power Module Package And Method Of Manufacturing The Same App 20130083492 - KIM; Kwang Soo ; et al.	2013-04-04
Package Substrate For Optical Element And Method Of Manufacturing The Same App 20130045550 - PARK; Ji Hyun ; et al.	2013-02-21
Heat-radiating Substrate And Method Of Manufacturing The Same App 20130042963 - Lim; Chang Hyun ; et al.	2013-02-21
Semiconductor Package Substrate App 20130037967 - KIM; Jong Man ; et al.	2013-02-14
Light Emitting Device Package And Method Of Manufacturing The Same App 20130026901 - LEE; Young Ki ; et al.	2013-01-31
Power Module Package And Method For Manufacturing The Same App 20130020687 - Kim; Kwang Soo ; et al.	2013-01-24
Substrate For Power Module Package And Method For Manufacturing The Same App 20130020111 - Oh; Kyu Hwan ; et al.	2013-01-24
Power Module Package And Method For Manufacturing The Same App 20130009291 - KIM; Kwang Soo ; et al.	2013-01-10
Power Module Package And Method For Manufacturing The Same App 20130009290 - Lim; Chang Hyun ; et al.	2013-01-10
Power Module Package And System Module Having The Same App 20120319260 - Kim; Kwang Soo ; et al.	2012-12-20
Power Module Package And Method For Fabricating The Same App 20120319259 - Kim; Kwang Soo ; et al.	2012-12-20
Heat-radiating substrate and method of manufacturing the same Grant 8,315,056 - Lim , et al. November 20, 2	2012-11-20
Light emitting diode package and fabrication method thereof Grant 8,310,023 - Park , et al. November 13, 2	2012-11-13
Power semiconductor module and method of manufacturing the same Grant 8,309,399 - Gao , et al. November 13, 2	2012-11-13
Light emitting diode package having anodized insulation layer and fabrication method therefor Grant 8,304,279 - Lee , et al. November 6, 2	2012-11-06
Heat Dissipating Circuit Board And Method Of Manufacturing The Same App 20120273558 - SHIN; Hye Sook ; et al.	2012-11-01
Heat Disspiating Substrate And Method Of Manufacturing The Same App 20120273116 - SOHN; Young Ho ; et al.	2012-11-01
Light emitting device package and method of manufacturing the same Grant 8,299,692 - Lee , et al. October 30, 2	2012-10-30
Package Substrate For Ptical Element And Method Of Manufacturing The Same App 20120225508 - Lim; Chang Hyun ; et al.	2012-09-06
Heat dissipating circuit board and method of manufacturing the same Grant 8,242,371 - Shin , et al. August 14, 2	2012-08-14
3d Power Module Package App 20120162931 - Kim; Tae Hoon ; et al.	2012-06-28
Rigid-flexible circuit board and method of manufacturing the same Grant 8,198,543 - Kang , et al. June 12, 2	2012-06-12
Power Package Module App 20120139098 - LEE; Kwan Ho ; et al.	2012-06-07
Heat-Radiating Substrate and Method Of Manufacturing The Same App 20120127666 - PARK; Ji Hyun ; et al.	2012-05-24
Soldering Connecting Pin, Semiconductor Package Substrate And Method Of Mounting Semiconductor Chip Using The Same App 20120127681 - RYU; Ji Man ; et al.	2012-05-24
Metal Clad Laminate, Method Of Manufacturing The Same, And Heat-radiating Substrate App 20120118615 - LEE; Kwan Ho ; et al.	2012-05-17
Loose Preventing Assembly App 20120121361 - LEE; Kwan Ho ; et al.	2012-05-17
Method Of Manufacturing Semiconductor Package Board App 20120122278 - LEE; Kwan Ho ; et al.	2012-05-17
Heat-radiating Substrate And Method For Manufacturing The Same App 20120111610 - KIM; Kwang Soo ; et al.	2012-05-10
Heat-dissipating Substrate App 20120103588 - KIM; Kwang Soo ; et al.	2012-05-03
Transformer Having The Heat Radiation Function App 20120105186 - Kim; Jong Man ; et al.	2012-05-03
Heat Dissipation Device For Power Conversion Module App 20120103589 - Sohn; Young Ho ; et al.	2012-05-03
Power Module Using Sintering Die Attach And Manufacturing Method Thereof App 20120106109 - KIM; Tae Hyun ; et al.	2012-05-03
Anodized Heat-radiating Substrate And Method Of Manufacturing The Same App 20120073863 - KANG; Jung Eun ; et al.	2012-03-29
Heat-radiating Substrate And Method For Manufacturing The Same App 20120067623 - PARK; Sung Keun ; et al.	2012-03-22
Charge Module App 20120049788 - KIM; Jong Man ; et al.	2012-03-01
Transformer Integrated With Inductor App 20120049993 - HAN; Kyu Bum ; et al.	2012-03-01
Power Semiconductor Module And Method Of Manufacturing The Same App 20120015484 - GAO; Shan ; et al.	2012-01-19
Printed Circuit Board And Method Of Manufacturing The Same App 20120000697 - Kang; Jung Eun ; et al.	2012-01-05
Light Emitting Diode Package Having Anodized Insulation Layer And Fabrication Method Therefor App 20110312109 - LEE; Young Ki ; et al.	2011-12-22
Hybrid Heat-radiating Substrate And Method Of Manufacturing The Same App 20110303440 - LIM; Chang Hyun ; et al.	2011-12-15
Heat-radiating Substrate And Method Of Manufacturing The Same App 20110304990 - Lim; Chang Hyun ; et al.	2011-12-15
Heat-radiating Substrate And Method Of Manufacturing The Same App 20110303437 - LIM; Chang Hyun ; et al.	2011-12-15
Printed Circuit Board And Method Of Manufacturing The Same App 20110284382 - Park; Sung Keun ; et al.	2011-11-24
Semiconductor chip package and printed circuit board Grant 8,064,215 - Chung , et al. November 22, 2	2011-11-22
Anodized metal substrate module Grant 8,058,781 - Lee , et al. November 15, 2	2011-11-15
Power semiconductor module and method of manufacturing the same Grant 8,058,722 - Gao , et al. November 15, 2	2011-11-15
Cooling device for light emitting device package of vibration generating machine and head lamp for vibration generating machine Grant 8,047,693 - Lee , et al. November 1, 2	2011-11-01
Insulation Structure For High Temperature Conditions And Manufacturing Method Thereof App 20110260198 - Lee; Young Ki ; et al.	2011-10-27
Light emitting diode package having anodized insulation layer and fabrication method therefor Grant 8,030,762 - Lee , et al. October 4, 2	2011-10-04
Method for manufacturing a semiconductor package Grant 8,017,437 - Yoo , et al. September 13, 2	2011-09-13
LED package and fabricating method thereof Grant 8,012,778 - Kim , et al. September 6, 2	2011-09-06
Insulation structure for high temperature conditions and manufacturing method thereof Grant 7,998,879 - Lee , et al. August 16, 2	2011-08-16
Package Substrate For Optical Element And Method Of Manufacturing The Same App 20110140144 - Lim; Chang Hyun ; et al.	2011-06-16
Sub-mount, light emitting diode package and manufacturing method thereof Grant 7,960,806 - Lee , et al. June 14, 2	2011-06-14
Method Of Manufacturing Printed Circuit Board App 20110126409 - KIM; Jin Su ; et al.	2011-06-02
Package Substrate For Optical Element And Method Of Manufacturing The Same App 20110101392 - Park; Sung Keun ; et al.	2011-05-05
Package Substrate For Optical Element And Method Of Manufacturing The Same App 20110095315 - PARK; Ji Hyun ; et al.	2011-04-28
Heat Dissipating Substrate App 20110088928 - LIM; Chang Hyun ; et al.	2011-04-21
Metal Wiring Structure Comprising Electroless Nickel Plating Layer And Method Of Fabricating The Same App 20110083885 - KIM; Tae Hyun ; et al.	2011-04-14
Rigid-flexible Circuit Board And Method Of Manufacturing The Same App 20110075374 - KANG; Jung Eun ; et al.	2011-03-31
Heat Dissipating Circuit Board And Method Of Manufacturing The Same App 20110067902 - SHIN; Hye Sook ; et al.	2011-03-24
Wafer level device package with sealing line having electroconductive pattern and method of packaging the same Grant 7,911,043 - Hong , et al. March 22, 2	2011-03-22
Heat-dissipating Substrate And Fabricating Method Thereof App 20110061901 - LIM; Chang Hyun ; et al.	2011-03-17
Light Emitting Diode Package, Circuit Board For Light Emitting Diode Package And Method Of Manufacturing The Same App 20110065219 - SHIN; Sang Hyun ; et al.	2011-03-17
Radiating Package Module For Exothermic Element App 20110042042 - KIM; Jong Man ; et al.	2011-02-24
Substrate for light emitting diode package and light emitting diode package having the same App 20110042699 - Park; Sung Keun ; et al.	2011-02-24
Power Device Package And Method Of Fabricating The Same App 20110031608 - KIM; Tae Hyun ; et al.	2011-02-10
Method of manufacturing a semiconductor package Grant 7,875,497 - Yoo , et al. January 25, 2	2011-01-25
Semiconductor package Grant 7,875,983 - Yoo , et al. January 25, 2	2011-01-25
Power Semiconductor Module And Method Of Manufacturing The Same App 20110012252 - GAO; Shan ; et al.	2011-01-20
Light emitting diode package, circuit board for light emitting diode package and method of manufacturing the same Grant 7,863,640 - Shin , et al. January 4, 2	2011-01-04
Heat Dissipating Substrate And Method Of Manufacturing The Same App 20100294543 - Sohn; Young Ho ; et al.	2010-11-25
Power Semiconductor Module App 20100295172 - Gao; Shan ; et al.	2010-11-25
Light emitting diode package and fabrication method thereof Grant 7,816,156 - Choi , et al. October 19, 2	2010-10-19
Cooling Device For Light Emitting Device Package Of Vibration Generating Machine And Head Lamp For Vibration Generating Machine App 20100124071 - Lee; Young Ki ; et al.	2010-05-20
Surface mounting device-type light emitting diode Grant 7,696,525 - Kim , et al. April 13, 2	2010-04-13
Method of manufacturing a semicondictor package App 20100087034 - Yoo; Do-Jae ; et al.	2010-04-08
Method for manufacturing a semiconductor package App 20100087035 - Yoo; Do-Jae ; et al.	2010-04-08
Semiconductor package App 20100084754 - Yoo; Do-Jae ; et al.	2010-04-08
Light Emitting Diode Package And Method Of Manufacturing The Same App 20100032705 - Shin; Sang Hyun ; et al.	2010-02-11
Light emitting diode package including monitoring photodiode Grant 7,649,208 - Lee , et al. January 19, 2	2010-01-19
Semiconductor package and method for manufacturing thereof Grant 7,642,656 - Yoo , et al. January 5, 2	2010-01-05
Ligth emitting device package and method of manufacturing the same App 20090267505 - Lee; Young Ki ; et al.	2009-10-29
Sub-Mount, light emitting diode package and manufacturing method thereof App 20090261356 - Lee; Young-Ki ; et al.	2009-10-22
Light Emitting Diode Package Having Multi-stepped Reflecting Surface Structure And Fabrication Method Thereof App 20090227050 - SHIN; Sang Hyun ; et al.	2009-09-10
LED package using Si substrate and fabricating method thereof Grant 7,582,496 - Lee , et al. September 1, 2	2009-09-01
Light emitting diode package Grant 7,566,912 - Lee , et al. July 28, 2	2009-07-28
Light emitting diode package having multi-stepped reflecting surface structure and fabrication method thereof Grant 7,547,923 - Shin , et al. June 16, 2	2009-06-16
Light Emitting Diode Package And Fabrication Method Thereof App 20090137073 - PARK; Ho Joon ; et al.	2009-05-28
Light Emitting Diode Package App 20090095975 - SHIN; Sang Hyun ; et al.	2009-04-16
Semiconductor chip package and printed circuit board App 20090073667 - Chung; Yul-Kyo ; et al.	2009-03-19
Led Package And Fabricating Method Thereof App 20090061550 - KIM; Yong Suk ; et al.	2009-03-05
Light emitting diode package Grant 7,491,978 - Zakgeym , et al. February 17, 2	2009-02-17
Image sensor module at wafer level, method of manufacturing the same, and camera module App 20090014827 - Lim; Chang Hyun ; et al.	2009-01-15
Semiconductor package and method for manufacturing thereof App 20080308950 - Yoo; Do Jae ; et al.	2008-12-18
Camera module package and method of manufacturing the same App 20080304821 - Jeung; Won Kyu ; et al.	2008-12-11
Wafer level device package with sealing line having electroconductive pattern and method of packaging the same App 20080290479 - Hong; Ju Pyo ; et al.	2008-11-27
Wafer level package and wafer level packaging method App 20080283989 - Jeung; Won Kyu ; et al.	2008-11-20
LED package and fabricating method thereof Grant 7,453,093 - Kim , et al. November 18, 2	2008-11-18
Method of fabricating light emitting diode package Grant 7,371,603 - Kim , et al. May 13, 2	2008-05-13
Light emitting diode package App 20080035948 - Shin; Sang Hyun ; et al.	2008-02-14
Light emitting diode package and fabrication method thereof App 20080038854 - Choi; Sang Hyun ; et al.	2008-02-14
Light emitting diode package with protective function against electrostatic discharge Grant 7,326,964 - Lim , et al. February 5, 2	2008-02-05
Light emitting diode package having multi-stepped reflecting surface structure and fabrication method thereof App 20070246715 - Shin; Sang Hyun ; et al.	2007-10-25
Surface Mounting Device-type Light Emitting Diode App 20070246728 - KIM; Yong Sik ; et al.	2007-10-25
Light emitting diode package having anodized insulation layer and fabrication method therefor App 20070235743 - Lee; Young Ki ; et al.	2007-10-11
Light emitting diode package App 20070221928 - Lee; Young Ki ; et al.	2007-09-27
Insulation structure for high temperature conditions and manufacturing method thereof App 20070215894 - Lee; Young Ki ; et al.	2007-09-20
Anodized metal substrate module App 20070217221 - Lee; Young Ki ; et al.	2007-09-20
Fabrication method of light emitting diode package Grant 7,268,014 - Lee , et al. September 11, 2	2007-09-11
Light emitting diode package, circuit board for light emitting diode package and method of manufacturing the same App 20070201213 - Shin; Sang Hyun ; et al.	2007-08-30
Light emitting diode package and fabrication method thereof Grant 7,262,440 - Choi , et al. August 28, 2	2007-08-28
Method of manufacturing light emitting diode package App 20070155033 - Kim; Yong Sik ; et al.	2007-07-05
Method of manufacturing high sag lens and high sag lens manufactured thereby App 20070091443 - Lim; Chang Hyun ; et al.	2007-04-26
Light emitting diode package and method for manufacturing the same App 20070063214 - Kim; Yong Sik ; et al.	2007-03-22
Light emitting diode package App 20070023776 - Zakgeym; Alexander L'Vovich ; et al.	2007-02-01
LED package and fabricating method thereof App 20070018190 - Kim; Yong Suk ; et al.	2007-01-25
Light emitting diode package App 20060267037 - Lim; Chang Hyun ; et al.	2006-11-30
Method of fabricating light emitting diode package App 20060270078 - Kim; Yong Suk ; et al.	2006-11-30
Fabrication method of light emitting diode package App 20060246617 - Lee; Young Ki ; et al.	2006-11-02
LED package using Si substrate and fabricating method thereof App 20060220036 - Lee; Sung Jun ; et al.	2006-10-05
Light emitting diode package and fabrication method thereof App 20060214178 - Choi; Sang Hyun ; et al.	2006-09-28
Light emitting diode package with protective function against electrostatic discharge App 20060214181 - Lim; Chang Hyun ; et al.	2006-09-28
Light emitting diode package including monitoring photodiode App 20060192084 - Lee; Sung Jun ; et al.	2006-08-31
Nitride semiconductor light emitting device App 20060192223 - Lee; Sung Jun ; et al.	2006-08-31
Light emitting diode package and fabrication method thereof App 20060186430 - Park; Ho Joon ; et al.	2006-08-24

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