U.S. patent application number 12/543763 was filed with the patent office on 2010-12-02 for stud bumps as local heat sinks during transient power operations.
This patent application is currently assigned to Texas Instruments Incorporated. Invention is credited to Vikas Gupta, Siva P. Gurrum, Kapil Heramb Sahasrabudhe.
Application Number | 20100301470 12/543763 |
Document ID | / |
Family ID | 43087277 |
Filed Date | 2010-12-02 |
United States Patent
Application |
20100301470 |
Kind Code |
A1 |
Gurrum; Siva P. ; et
al. |
December 2, 2010 |
STUD BUMPS AS LOCAL HEAT SINKS DURING TRANSIENT POWER
OPERATIONS
Abstract
A thermal management configuration for a flip chip semiconductor
device is disclosed. The device includes a high power silicon based
die having a metal bonding surface. A plurality of interconnects
are formed on the metal surface and connected to a substrate. A
plurality of thermal management stud bumps are formed on the metal
bonding surface, the thermal management stud bumps positioned
distinct from the interconnects and local to die hot spots, exposed
ends of the thermal management stud bumps spaced from the
substrate.
Inventors: |
Gurrum; Siva P.; (Irving,
TX) ; Sahasrabudhe; Kapil Heramb; (Dallas, TX)
; Gupta; Vikas; (Dallas, TX) |
Correspondence
Address: |
TEXAS INSTRUMENTS INCORPORATED
P O BOX 655474, M/S 3999
DALLAS
TX
75265
US
|
Assignee: |
Texas Instruments
Incorporated
|
Family ID: |
43087277 |
Appl. No.: |
12/543763 |
Filed: |
August 19, 2009 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
12473602 |
May 28, 2009 |
|
|
|
12543763 |
|
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Current U.S.
Class: |
257/713 ;
257/690; 257/707; 257/778; 257/E21.505; 257/E23.102; 438/122 |
Current CPC
Class: |
H01L 23/367 20130101;
H01L 2924/10253 20130101; H01L 2924/00014 20130101; H01L 23/3171
20130101; H01L 2224/056 20130101; H01L 2924/14 20130101; H01L
2924/19041 20130101; H01L 2924/00014 20130101; H01L 2224/16
20130101; H01L 2924/01079 20130101; H01L 2224/05573 20130101; H01L
2924/00014 20130101; H01L 2924/00 20130101; H01L 2224/05599
20130101; H01L 2224/0556 20130101; H01L 2924/01084 20130101; H01L
2924/00 20130101; H01L 2224/05548 20130101; H01L 2924/10253
20130101; H01L 2924/00014 20130101; H01L 2924/00014 20130101; H01L
2224/056 20130101; H01L 24/16 20130101; H01L 2924/14 20130101; H01L
2224/0555 20130101; H01L 2224/0554 20130101; H01L 24/14
20130101 |
Class at
Publication: |
257/713 ;
438/122; 257/778; 257/690; 257/707; 257/E23.102; 257/E21.505 |
International
Class: |
H01L 23/367 20060101
H01L023/367; H01L 21/58 20060101 H01L021/58 |
Claims
1. A thermal management configuration for transient operation of a
flip chip semiconductor device, the configuration comprising: a
high power die comprising a metal bonding surface; a plurality of
interconnects formed on the metal bonding surface and connected to
a substrate; and a plurality of heat dissipating stud bumps formed
on the metal bonding surface and local to die hot spots, exposed
ends of the heat dissipating stud bumps spaced from the
substrate.
2. The device of claim 1, wherein the heat dissipating stud bumps
comprise a single layer of stud bumps.
3. The device of claim 1, wherein the heat dissipating stud bumps
comprise stacked stud bumps.
4. The device of claim 1, wherein the heat dissipating stud bumps
are positioned to intercept heat generated in the die.
5. The device of claim 1, wherein the heat dissipating stud bumps
temporarily store and then gradually dissipate heat.
6. The device of claim 1, wherein the metal bonding surface
comprises one or more of copper, gold and aluminum and alloys
thereof.
7. A flip chip semiconductor device comprising: a high power
silicon based integrated circuit (IC) having transient operations;
a metal bonding layer formed over the IC; interconnects formed on
the metal bonding layer, the interconnects connected to a
substrate; and thermal management stud bumps formed on the metal
bonding layer and local to die hot spots, exposed ends of the
thermal management stud bumps spaced from the substrate.
8. The device of claim 7, wherein the heat dissipating stud bumps
comprise a single layer of stud bumps.
9. The device of claim 7, wherein the thermal management stud bumps
comprise stacked stud bumps.
10. The device of claim 7, wherein the thermal management stud
bumps temporarily store and then gradually dissipate heat.
11. The device of claim 7, wherein the thermal management stud
bumps comprise a material selected from one or more of copper, gold
and aluminum and alloys thereof.
12. The device of claim 7, wherein the metal bonding layer
comprises one or more of copper, gold and aluminum and alloys
thereof
13-17. (canceled)
Description
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This application is a continuation-in-part of application
Ser. No. 12/473,602, filed on May 28, 2009, and incorporated herein
by reference, in its entirety.
FIELD
[0002] This invention relates generally to semiconductor thermal
management, and more particularly placing and utilizing stud bumps
as local heat sinks during transient power operations of a
semiconductor device.
BACKGROUND
[0003] Heat dissipating structures have long been included in a
variety of integrated circuit (IC) devices. Typical heat
dissipating structures can be found in heat spreaders, cooling
plates, Peltier devices, thermal adhesives, bonding over active
circuits (BOAC) and use of varying structural materials in an
effort to absorb and/or dissipate heat. In certain high power
applications, an increase in temperature can adversely affect
reliable device functioning.
[0004] For example, high power semiconductor devices experience
transient periods immediately after input power is turned on or
off. During these periods, high current and voltage spikes are
present, resulting in peak power for the device. Such voltage
spikes are particularly evident in power electronic integrated
circuits (ICs), where power FETs constitute a large percentage of
the die area. When excessive power is dissipated within a junction,
its temperature rises. By way of example, a pulse period in a
laterally diffused metal oxide semiconductor (LDMOS) device is 1-3
ms, and a temperature rise during that interval can be several
hundred degrees. This temperature rise can limit the amount of
power that can be handled by the device in any given cycle, which
can be unsuitable for some high power applications. As junction
temperature rises beyond a critical limit, the device can suffer
reduced operating capability or irreversible damage.
BRIEF SUMMARY
[0005] Accordingly, a problem in high power IC devices is the need
to dissipate heat generated during a transient (i.e. "ON") function
of the device. By effectively dissipating heat, a lower junction
temperature can be maintained over longer "ON" periods.
[0006] As used herein, a high power device refers to power silicon
devices, including those with clustered transistors, FETs and LDMOS
devices. In these types of devices there is metal across all or a
major part of the die. The power transistors can be found in
various numbers and positions in the die according to the specific
device. Each transistor can be a hot spot. The hot spot is that
location in the die which generates heat during operation.
[0007] As integrated circuit (IC) devices continue to shrink in
size, thermal management becomes increasingly important. Therefore,
to maintain the device's junction temperature below the maximum
allowed, effective heat flow from the IC through the package to the
ambient is essential. It is therefore a purpose of the exemplary
embodiments herein to locally dissipate heat from a high power
silicon based die during transient operating modes. Exemplary
embodiments disclose thermal management stud bumps formed on a
metal bonding surface of the die to store and dissipate heat
generated in the high power die during transient operations,
thereby suppressing the temperature rise and thus junction
temperature of the die. The thermal management stud bumps can be
formed on the metal bonding surface of the IC device, either in a
single layer or stacked.
[0008] By locally dissipating heat from the die, advantages of
reducing peak temperature rise of an IC device, maximizing a pulse
width, and therefore duration of a power ON cycle, and maximize
total power output for a given reliable operating temperature limit
can be achieved. Although components of the IC devices do
inherently dissipate heat, they can not be populated or positioned
to the extent that they can effectively and consistently dissipate
heat specifically at a hot spot. Also, while it may be proposed to
form a thicker copper layer over the die, such an option is
unsatisfactory at least because the cost is relatively high and not
specific to hot spots. The thicker copper could be localized with a
mask in fabrication, thereby reducing somewhat an amount of copper
utilized, but this adds unnecessary steps. Another reason for
avoiding these two options is that the greater the copper
thickness, the higher the stress on the die. Because the thicker
copper helps dissipate heat in modeling scenarios, the inventors
realized that thermal management stud bumps could be specifically
placed and achieve the same and better results without overloading
the die with a thick copper layer.
[0009] Additional embodiments of the disclosure will be set forth
in part in the description which follows, and in part will be
obvious from the description, or may be learned by practice of the
present disclosure. The embodiments of the disclosure will be
realized and attained by means of the elements and combinations
particularly pointed out in the appended claims.
[0010] It is to be understood that both the foregoing general
description and the following detailed description are exemplary
and explanatory only and are not restrictive of the invention, as
claimed.
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] The invention is best understood from the following detailed
description when read with the accompanying FIGURES. It is
emphasized that in accordance with the standard practice in the
semiconductor industry, various features may not be drawn to scale.
In fact, the dimensions of various features may be arbitrarily
increased or reduced for clarity of discussion. Reference is now
made to the following descriptions taken in conjunction with the
accompanying drawings, in which:
[0012] FIG. 1 is a side view depicting an exemplary semiconductor
device according to certain embodiments;
[0013] FIG. 2 is a top plan view depicting thermal management stud
bump configurations of an exemplary semiconductor device according
to certain embodiments;
[0014] FIG. 3 is a graph depicting prophetic relational outputs
according to certain embodiments;
[0015] FIG. 4 is a chart depicting prophetic device improvements
according to FIG. 3;
[0016] FIG. 5 is a chart depicting prophetic relational outputs
according to certain embodiments;
[0017] FIG. 6 is a chart depicting prophetic device improvements
according to FIG. 5; and
[0018] FIG. 7 depicts an exemplary layout of stud bumps on a
substrate.
DETAILED DESCRIPTION
[0019] Reference will now be made in detail to the exemplary
embodiments of the present disclosure, an example of which is
illustrated in the accompanying drawings. Wherever possible, the
same reference numbers will be used throughout the drawings to
refer to the same or like parts.
[0020] In the following description, reference is made to the
accompanying drawings that form a part thereof, and in which is
shown by way of illustration specific exemplary embodiments which
may be practiced. These embodiments are described in sufficient
detail to enable those skilled in the art to practice the
embodiments and it is to be understood that other embodiments may
be utilized and that changes may be made without departing from the
scope of the invention. The following description is, therefore,
merely exemplary.
[0021] Notwithstanding that the numerical ranges and parameters
setting forth the broad scope of the disclosure are approximations,
the numerical values set forth in the specific examples are
reported as precisely as possible. Any numerical value, however,
inherently contains certain errors necessarily resulting from the
standard deviation found in their respective testing measurements.
Moreover, all ranges disclosed herein are to be understood to
encompass any and all sub-ranges subsumed therein. For example, a
range of "less than 10" can include any and all sub-ranges between
(and including) the minimum value of zero and the maximum value of
10, that is, any and all sub-ranges having a minimum value of equal
to or greater than zero and a maximum value of equal to or less
than 10, e.g., 1 to 5.
[0022] According to embodiments, a thermal management configuration
of a semiconductor device can locally dissipate heat from a high
power silicon based die. The structure includes thermal management
stud bumps formed on a metal surface of the high power die to store
and dissipate heat generated in the die during a high power
transient operation, thereby suppressing the temperature rise and
thus junction temperature of the die. Even further, the exemplary
thermal management configuration is depicted in a flip chip
device.
[0023] FIG. 1 is a side view depicting a flip chip semiconductor
device 100, according to certain embodiments. It should be readily
apparent to those skilled in the art that FIG. 1 is exemplary and
that other elements can be added, removed or modified without
departing from the scope of the exemplary embodiments.
[0024] As depicted, the exemplary flip chip semiconductor device
100 can be incorporated into and include various other devices. The
semiconductor device 100 can include a silicon based integrated
circuit (IC) 110, a metal layer 130 over the integrated circuit
110, interconnects 140, a substrate 150 positioned such that the
interconnects are formed between the metal layer 130 and substrate
150, and thermal management stud bumps 160 formed on the metal
layer, an outer end 165 of the thermal management stud bumps 160
spaced from the substrate 150 as depicted at 120. Space 120 can be
of an amount suitable to maintain separation without contact
between outer ends 165 of the thermal management stud bump 160 and
a facing surface of the substrate 150. While FIG. 1 depicts several
components of the semiconductor device 100, one skilled in the art
will realize that the semiconductor device 100 can include any
number and type of components.
[0025] The silicon based integrated circuit 110 of the
semiconductor device 100 can be formed of a material, using any
process, to any dimension and specification, as known in the art.
The silicon based IC 110 can include any silicon based power
devices. The silicon based power devices can include clustered
transistors, and back end interconnects. Further, the silicon based
power device can include power field effect transistors (FETs). The
power FETs can include laterally diffused metal oxide
semiconductors (LDMOS), as known in the art.
[0026] It will be appreciated that the silicon based power IC
devices 110 can generate heat during transient cycles of the
device. A direction of the dissipated heat is depicted by arrows,
from local hot spots 115 of the device, through the heat
dissipating stud bumps 160 to an ambient.
[0027] In addition, and although not shown, a passivation layer can
be formed of a material and components, using any process, to any
dimension and specification, as known in the art. The passivation
layer can include, for example, a passivation glass. The
passivation layer can be formed on the power silicon based IC 110
and include openings formed therein over the IC device 110 to the
metal layer.
[0028] The metal layer 130 can be formed on the passivation layer.
The metal layer 130 can be formed of components, using any process,
to any dimension and specification, as known in the art. The metal
layer 130 can include a metal bonding layer of conductive material,
for example copper, deposited or otherwise formed, to a
predetermined thickness. The metal bonding layer 130 can be
deposited or otherwise formed over all or substantially all of a
surface of the IC device 110. The metal bonding layer 130 can
further conductively contact the IC device 110. The metal bonding
layer 130 can be deposited to a thickness of between about 0.5
.mu.m to about 5 .mu.m on a surface of the IC device 110.
[0029] The interconnects 140 can be formed of a material and
components, using any process, to any dimension and specification,
as known in the art. Interconnects 140 can be formed as, for
example, a solder bump, a wire bond stud bump, and using copper
pillar technologies. Interconnects 140 can include a single layer
of interconnects 140 formed on a surface of the metal bonding layer
130. Interconnects 140 can further include multilayer interconnects
formed on a surface of the metal bonding layer 130. Interconnects
140 can be connected to the substrate 150 as known in the art. The
substrate 150 can be formed of a material and components, using any
process, to any dimension and specification, as known in the art.
For example, the substrate 150 can include an organic or ceramic
substrate.
[0030] The thermal management stud bumps 160 can be formed on a
surface of the metal bonding layer 130. The thermal management stud
bumps 160 do not have to electrically connect to the substrate 150;
however electrical connection is not precluded. Stud bump bonding
is a modified wire bonding process. Like wire bonding, there is
bonding of the ball to the substrate. Unlike wire bonding, there is
no second wire bond to a lead. The wire is terminated after the
first bond, so there is only a bump on the substrate. To create the
stud bump, a ball is formed using a standard ball bumping process.
After the ball is bonded to the die pad, and the bond head moves to
tear the wire. The thermal management stud bumps 160 can have a
height such that a clearance remains between an exposed end 165 of
the thermal management stud bump 160 and a surface of the substrate
150. Wire diameter and bonding force can be varied to achieve the
desired height for a given flip chip configuration. In addition, a
height of the thermal management stud bumps 160 can be coined using
a metallic plate. Coining can result in a common height of all
coined thermal management stud bumps.
[0031] It will be appreciated that the metal bonding layer 130 in
itself can act as a heat sink/spreader to remove heat from the die
110. However, with a thinner metal bonding layer in the range of
about 3-6 .mu.m, additional mass is needed to restrict a junction
temperature rise during a high power transient cycle. Accordingly,
the thermal management stud bumps 160 can provide the additional
needed mass.
[0032] More specifically, the thermal management stud bumps 160 can
be formed local to die hot spots. Die hot spots are those regions
of the silicon based IC device 110 which can exhibit an increase in
temperature during a transient function of the semiconductor
device. For example, during a high power transient operation, the
junction temperature increases considerably during a `Power ON`
cycle. In the case of high voltage power devices in LBC (LDMOS),
the pulse period can be 1-3 ms, and temperature rise can be several
hundred degrees. The thermal management stud bumps 160 essentially
act as local thermal capacitors and have enough mass to store and
dissipate a considerable amount of heat.
[0033] Because the thermal management stud bumps 160 can be
positioned to intercept heat dissipated from the die, an increase
in die temperature during the power cycle can be reduced, thereby
enabling higher power in the device at a lower temperature, thereby
maximizing a power "ON" duration, without damage to the device.
[0034] FIG. 2 is a top plan view of FIG. 1, absent the substrate
150, depicting an exemplary layout of interconnects 140 and thermal
management stud bumps 160, according to certain embodiments. It
should be readily apparent to those skilled in the art that FIG. 2
is exemplary and that other elements can be added, removed or
modified without departing from the scope of the exemplary
embodiments.
[0035] In FIG. 2, the silicon based die 110, metal bonding layer
130, and interconnects 140 are also depicted. Thermal management
stud bumps 160 can be positioned proximate to interconnects 140 and
on a surface of the metal bonding layer 130. More specifically, the
thermal management stud bumps 160 can be formed local to die hot
spots. Die hot spots can be those regions of the silicon based IC
device 110 which can exhibit an increase in temperature during a
transient function of the semiconductor device. The thermal
management stud bumps 160 can populate all or substantially all of
the metal area of the metal bonding layer 130, according to certain
fabrication parameters such as the pitch of the thermal management
stud bumps 160, the number of interconnects 140, and capillary size
for forming interconnects 140. Further, the thermal management stud
bumps 160 can be located proximate to a heat source if a die has a
limited surface area. A majority of the thermal management stud
bumps 160 can be concentrated in the heat producing area of the die
in certain aspects of the device.
[0036] Even further, the thermal management stud bumps 160 can be
positioned at corners of the die 110 on the metal bonding layer
130. Such positioning can utilize the thermal management stud bumps
160 as delamination resisting structures. For example, underfill
material can fill an area surrounding interconnects 140 and thermal
management stud bumps 160. With the additional structures present
on the die surface, there can be additional surface area to which a
mold compound can adhere, thereby further limiting delamination of
the mold compound from the package.
[0037] The thermal management stud bumps 160 can include a
thermally conductive material, capable of dissipating heat from the
device. For example, the thermal management stud bumps can be
formed of copper, gold, aluminum, and alloys thereof formed on the
device. The thermal management stud bumps can be particularly
positioned to be local to known or expected IC hot spots. The
thermal management stud bumps can be further positioned to
intercept heat dissipated from the IC device. In particular, the
thermal management stud bumps can store and then gradually
dissipate heat therefrom, according to an amount of heat generated
in or by the IC device.
[0038] Various comparisons can be made to demonstrate the
effectiveness of the thermal management stud bumps described
herein. For example, FIG. 3 depicts a change in temperature over
time for a 15 mils die in package, with a linear ramp down pulse
having a 100W peak. Each of a plurality of configurations is
represented in FIG. 3. The representations include that of no thick
copper, 3 .mu.m thick copper, 10 .mu.m thick copper, 3 .mu.m thick
copper plus thermal management stud bumps of a single layer, 10
.mu.m thick copper plus thermal management bumps of a single layer,
3 .mu.m copper plus stacked thermal management stud bumps; and 10
.mu.m thick copper plus stacked thermal management stud bumps. As
summarized in FIG. 4, an improvement percentage ranges from about
18% to about 25.3%. With one layer of thermal management stud bumps
over 3 .mu.m thick copper, the thermal model results showed an 18%
improvement in heat dissipation. With thermal management stud bumps
stacked to two layers over 3 .mu.m thick copper, the thermal model
results showed a 28.4% improvement in heat dissipation. With one
layer of thermal management stud bumps over 10 .mu.m thick copper,
the thermal model results showed a 16% improvement in heat
dissipation. With thermal management stud bumps stacked to two
layers over 10 .mu.m thick copper, the thermal model results showed
a 25.3% improvement in heat dissipation.
[0039] FIG. 5 depicts a change in temperature over time for a 15 ml
die in package, with a square pulse having a 100W peak. Each of a
plurality of configurations is represented in FIG. 5. The
representations include that of no thick copper, 3 .mu.m thick
copper, 10 .mu.m thick copper, 3 .mu.m thick copper plus thermal
management stud bumps of a single layer, 10 .mu.m thick copper plus
thermal management bumps of a single layer, 3 .mu.m copper plus
stacked thermal management stud bumps; and 10 .mu.m thick copper
plus stacked thermal management stud bumps. As summarized in FIG.
6, an improvement percentage ranges from about 16.8% to about
22.7%. With one layer of thermal management stud bumps over 3 .mu.m
thick copper, the thermal model results showed a 16.8% improvement
in heat dissipation. With thermal management stud bumps stacked in
two layers over 3 .mu.m thick copper, the thermal model results
showed a 26.5% improvement in heat dissipation. With one layer of
thermal management stud bumps over 10 .mu.m thick copper, the
thermal model results showed a 14% improvement in heat dissipation.
With thermal management stud bumps stacked in two layers over 10
.mu.m thick copper, the thermal model results showed a 22.7%
improvement in heat dissipation.
[0040] FIG. 7 depicts an exemplary heat dissipating layout 700
according to certain embodiments. It should be readily apparent to
those skilled in the art that FIG. 7 is exemplary and that other
elements can be added, removed or modified without departing from
the scope of the exemplary embodiments.
[0041] In certain embodiments, thermal management stud bumps 760
can be formed in a heat dissipating pattern on a substrate 730. The
substrate 730 can be a metal layer and the metal layer can further
be supported on a surface of a silicon die. The thermal management
stud bumps 760 can be a single layer of stud bumps 760; however, as
described above, the thermal management stud bumps can include
multiple layers of stacked thermal management stud bumps. The
exemplary layout 700 can be used in any of the exemplary
embodiments disclosed above. As illustrated, the thermal management
stud bumps can be positioned local to known or expected IC hot
spots.
[0042] Thus, the exemplary embodiments promote numerous technical
advantages, including but not limited to improved thermal
properties, resilience, longevity, manufacturability, and
reliability. In demonstrated thermal model results, the exemplary
embodiments can reduce a peak temperature rise for a given pulse
width and power profile. The exemplary embodiments can increase ON
cycle times during transient operation without affecting the device
performance and reduce dependence on current thick BOAC layer for
heat removal. The increased ON cycle times can increase an overall
total power output for a device. Use of thermal management stud
bumps can lessen the need for a thick Cu layer in BOAC. The thinner
Cu results in cost savings, and an ability to further decrease the
transistor on-resistance. Reducing a thickness of the copper layer
an also reduce related reliability issues such as PO cracking and
Al extrusion without adversely affecting the device thermal
performance. The presence of the thermal management stud bumps in
addition to the wire bonds can improve adhesion between an
underfill and the die by acting as posts around which the underfill
can form. Thermal management stud bumps can be positioned at
corners of the die and can act as delamination resisting
structures.
[0043] While the invention has been described with reference to the
exemplary embodiments thereof, those skilled in the art will be
able to make various modifications to the described embodiments
without departing from the true spirit and scope. The terms and
descriptions used herein are set forth by way of illustration and
are not meant as limitations. In particular, although the method
has been described by examples, the steps of the method may be
performed in a different order than illustrated or simultaneously.
Furthermore, to the extent that the terms "including", "includes",
"having", "has", "with", or variants thereof are used in either the
detailed description and the claims, such terms are intended to be
inclusive in a manner similar to the term "comprising". As used
herein, the term "one or more of" with respect to a listing of
items such as, for example, A and B, means A alone, B alone, or A
and B.
[0044] Other embodiments of the present disclosure will be apparent
to those skilled in the art from consideration of the specification
and practice of the invention disclosed herein. It is intended that
the specification and examples be considered as exemplary only,
with a true scope and spirit of the invention being indicated by
the following claims.
* * * * *