Gurrum; Siva P.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Gurrum; Siva P..The latest application filed is for "spot-solderable leads for semiconductor device packages".

Company Profile

2.9.7

Gurrum; Siva P. - Allen TX
Gurrum; Siva P. - Dallas TX
Gurrum; Siva P - Irving TX
Gurrum; Siva P - Dallas TX
Gurrum; Siva P. - Irving TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Spot-solderable leads for semiconductor device packages Grant 11,430,719 - Prakuzhy , et al. August 30, 2	2022-08-30
Spot-solderable leads for semiconductor device packages Grant 10,607,927 - Prakuzhy , et al.	2020-03-31
Spot-Solderable Leads for Semiconductor Device Packages App 20190318983 - Prakuzhy; Manu A. ; et al.	2019-10-17
Spot-Solderable Leads for Semiconductor Device Packages App 20180076116 - Prakuzhy; Manu J. ; et al.	2018-03-15
Semiconductor package having etched foil capacitor integrated into leadframe Grant 9,373,572 - Howard , et al. June 21, 2	2016-06-21
Semiconductor Package Having Etched Foil Capacitor Integrated Into Leadframe App 20160035655 - Howard; Gregory E. ; et al.	2016-02-04
Semiconductor package having etched foil capacitor integrated into leadframe Grant 9,165,873 - Howard , et al. October 20, 2	2015-10-20
Semiconductor package having etched foil capacitor integrated into leadframe Grant 9,142,496 - Howard , et al. September 22, 2	2015-09-22
Method for contacting agglomerate terminals of semiconductor packages Grant 8,716,068 - Edwards , et al. May 6, 2	2014-05-06
Method For Contacting Agglomerate Terminals Of Semiconductor Packages App 20140038358 - Edwards; Darvin R. ; et al.	2014-02-06
Stud bumps as local heat sinks during transient power operations Grant 8,129,224 - Gurrum , et al. March 6, 2	2012-03-06
Heat extraction from packaged semiconductor chips, scalable with chip area Grant 7,989,949 - Gupta , et al. August 2, 2	2011-08-02
Stud Bumps As Local Heat Sinks During Transient Power Operations App 20100301470 - Gurrum; Siva P. ; et al.	2010-12-02
Heat Extraction from Packaged Semiconductor Chips, Scalable with Chip Area App 20090267218 - GUPTA; Vikas ; et al.	2009-10-29
Heat extraction from packaged semiconductor chips, scalable with chip area Grant 7,572,679 - Gupta , et al. August 11, 2	2009-08-11
Heat Extraction from Packaged Semiconductor Chips, Scalable with Chip Area App 20090026605 - Gupta; Vikas ; et al.	2009-01-29

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