U.S. patent application number 12/831705 was filed with the patent office on 2010-11-04 for infrared sensor manufactured by method suitable for mass production.
This patent application is currently assigned to NEC Corporation. Invention is credited to Toshiya KUMAGAI, Seiji KURASHINA, Susumu MIZUTA, Yuriko MIZUTA, Toshihito SASAKI, Tetsuo TSUCHIYA.
Application Number | 20100276593 12/831705 |
Document ID | / |
Family ID | 37945685 |
Filed Date | 2010-11-04 |
United States Patent
Application |
20100276593 |
Kind Code |
A1 |
TSUCHIYA; Tetsuo ; et
al. |
November 4, 2010 |
INFRARED SENSOR MANUFACTURED BY METHOD SUITABLE FOR MASS
PRODUCTION
Abstract
An infrared sensor manufacturing method according to this
invention includes a step of forming a bridge structure of an
insulating material on an Si substrate, a step of forming a
vanadium oxide thin film on the bridge structure by a dry film
forming method, a step of irradiating laser light onto the vanadium
oxide thin film to thereby change material properties thereof, a
step of forming the vanadium oxide thin film with the changed
material properties into a bolometer resistor having a
predetermined pattern, and a step of forming a protective layer of
an insulating material so as to cover the bolometer resistor having
the predetermined pattern and the bridge structure.
Inventors: |
TSUCHIYA; Tetsuo; (Ibaraki,
JP) ; MIZUTA; Susumu; (Ibaraki, JP) ; MIZUTA;
Yuriko; (Tokyo, JP) ; KUMAGAI; Toshiya;
(Ibaraki, JP) ; SASAKI; Toshihito; (Tokyo, JP)
; KURASHINA; Seiji; (Tokyo, JP) |
Correspondence
Address: |
YOUNG & THOMPSON
209 Madison Street, Suite 500
Alexandria
VA
22314
US
|
Assignee: |
NEC Corporation
Tokyo
JP
National Institute of Advanced Industrial Science and
Technology
Tokyo
JP
|
Family ID: |
37945685 |
Appl. No.: |
12/831705 |
Filed: |
July 7, 2010 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
11710962 |
Feb 27, 2007 |
7781030 |
|
|
12831705 |
|
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Current U.S.
Class: |
250/338.3 ;
257/E21.002; 257/E31.002; 438/54; 438/57 |
Current CPC
Class: |
G01J 5/20 20130101 |
Class at
Publication: |
250/338.3 ;
438/54; 438/57; 257/E31.002; 257/E21.002 |
International
Class: |
G01J 5/20 20060101
G01J005/20; H01L 31/18 20060101 H01L031/18 |
Foreign Application Data
Date |
Code |
Application Number |
Feb 27, 2006 |
JP |
2006-49492 |
Claims
1. An infrared sensor manufactured by a method of manufacturing a
bolometer-type infrared sensor that changes a temperature of a
light-incident portion thereof by absorption of incident infrared
light so as to change an electrical resistance value of a resistor
by a temperature change, thereby outputting a signal indicative of
a radiation intensity of the incident infrared light, said method
comprising the steps of: forming a bridge structure of an
insulating material on an insulating substrate; forming a vanadium
oxide thin film on said bridge structure by a dry film forming
method; irradiating laser light onto said vanadium oxide thin film
to thereby change material properties thereof; forming said
vanadium oxide thin film with the changed material properties into
a predetermined pattern as said resistor; and forming a protective
layer of an insulating material so as to cover said vanadium oxide
thin film formed into the predetermined pattern and said bridge
structure.
Description
[0001] This application claims priority to prior Japanese patent
application JP 2006-49492, the disclosure of which is incorporated
herein by reference.
BACKGROUND OF THE INVENTION
[0002] This invention relates to a method of manufacturing a
bolometer-type non-cooling infrared sensor that changes the
temperature of a light-incident portion thereof by absorption of
incident infrared light so as to change the electrical resistance
value of a resistor by the temperature change, thereby outputting a
signal indicative of the infrared radiation intensity.
[0003] A bolometer utilizes the temperature variation of electrical
resistance of a metal or semiconductor thin film that is thermally
insulated from a substrate material. Generally, as a temperature
coefficient of resistance (hereinafter referred to as a "TCR") of
the bolometer material, i.e. the material of the metal or
semiconductor thin film, increases, the detection sensitivity is
improved and a noise equivalent temperature difference (hereinafter
referred to as an "NETD") representing the temperature resolution
of the infrared sensor decreases.
[0004] An alloy thin film such as a nickel-iron alloy thin film has
a small TCR of about 0.5% K. Therefore, it is considered that a
conductive oxide thin film such as a vanadium oxide thin film, a
perovskite-type Mn oxide thin
[0005] film, or a YBa.sub.2Cu.sub.3o.sub.x thin film is preferable
as a bolometer resistor film for use in a highly sensitive infrared
sensor.
[0006] A manufacturing method of an infrared sensor having such a
conductive oxide thin film is described, for example, in Patent
Document 1. (Japanese Unexamined Patent Application Publication
(JP-A) No. 2002-289931).
[0007] In the manufacturing method according to Patent Document 1,
a bridge structure formed on an Si substrate via a gap, a bolometer
resistor film formed on the bridge structure, and a protective
layer formed on the surface of the bridge structure including the
bolometer resistor film are each formed as an oxide thin film by
dissolving a metal-organic compound in a solvent to make a
solution, then coating and drying it, and then irradiating it with
laser light having a wavelength of 400 nm or less to thereby cut
and decompose carbon-oxygen bonds.
[0008] It has been confirmed that, according to this manufacturing
method, the bolometer resistor film having a predetermined sheet
resistance and TCR is obtained by laser annealing for several
minutes as compared with a heat treatment method which requires
thermal annealing for several hours to several tens of hours.
[0009] In the manufacturing method as described above, although an
effect is obtained that the number of processes can be reduced by
forming the bridge structure, the bolometer resistor film, and the
protective layer, respectively, by the coating method, there is a
problem that the coating method is not suitable for mass
production.
[0010] Further, there is room for improvement in TCR with respect
to the bolometer resistor film made of vanadium oxide.
SUMMARY OF THE INVENTION
[0011] This invention pays attention particularly to the vanadium
oxide thin film among the foregoing conductive oxide thin films and
aims to provide an infrared sensor manufacturing method that is
suitable for mass production and, further, capable of improving the
TCR.
[0012] According to this invention, a method of manufacturing a
bolometer-type infrared sensor is provided. The bolometer-type
infrared sensor is that changes a temperature of a light-incident
portion thereof by absorption of incident infrared light so as to
change an electrical resistance value of a resistor by a
temperature change, thereby outputting a signal indicative of a
radiation intensity of the incident infrared light. According to an
aspect of this invention, the manufacturing method comprises the
steps of forming a bridge structure of an insulating material on an
insulating substrate, forming a vanadium oxide thin film on the
bridge structure by a dry film forming method, and irradiating
laser light onto the vanadium oxide thin film to thereby change
material properties thereof. The manufacturing method further
comprises the steps of forming the vanadium oxide thin film with
the changed material properties into a predetermined pattern as the
resistor, and forming a protective layer of an insulating material
so as to cover the vanadium oxide thin film formed into the
predetermined pattern and the bridge structure.
[0013] In the manufacturing method according to this invention, the
dry film forming method may be one of a sputtering method, a vacuum
deposition method, and a CVD method. The bridge structure and the
protective layer may be each in the form of one of an SiN thin film
and an SiON thin film formed by a CVD method. The use may be made,
as the laser light, of laser light having a wavelength of 157 to
550 nm and, preferably, laser light having a wavelength of 222 to
360 nm. It is preferable that an irradiation energy of the laser
light is set to 10 to 150 mJ/cm.sup.2 and, preferably, 30 to 60
mJ/cm.sup.2. It is preferable that irradiation of the laser light
is performed at a substrate temperature of 350.degree. C. or less
and, preferably, at room temperature. It is preferable that
irradiation of the laser light is performed in a vacuum or in a
mixed reducing gas atmosphere.
[0014] According to another aspect of this invention, an infrared
sensor manufactured by the method according to the above-mentioned
aspect is provided.
[0015] According to the manufacturing method of this invention, it
is possible to provide the infrared sensor that is suitable for
mass production and, further, capable of improving the TCR.
BRIEF DESCRIPTION OF THE DRAWINGS
[0016] FIGS. 1A to 1E are diagrams for explaining an embodiment of
infrared sensor manufacturing processes according to this
invention;
[0017] FIG. 2 is a characteristic diagram showing the results of
measuring the temperature dependence of TCR of a bolometer resistor
in the case where the irradiation energy of laser light irradiated
onto the bolometer resistor is changed in the infrared sensor
manufacturing process shown in FIG. 1C;
[0018] FIG. 3 is a characteristic diagram showing the results of
measuring the relationship between the resistivity of a bolometer
resistor and the irradiation time in the case where the irradiation
energy of laser light irradiated onto the bolometer resistor is
changed in the infrared sensor manufacturing process shown in FIG.
1C; and
[0019] FIG. 4 is a characteristic diagram showing the results of
measuring the temperature dependence of resistivity of a bolometer
resistor in the case where the irradiation energy of laser light
irradiated onto the bolometer resistor is changed in the infrared
sensor manufacturing process shown in FIG. 1C.
DESCRIPTION OF THE PREFERRED EMBODIMENT
[0020] Hereinbelow, an infrared sensor manufacturing method
according to this invention will be described in detail.
[0021] This invention relates to a bolometer-type non-cooling
infrared sensor that changes the temperature of a light-incident
portion thereof by absorption of incident infrared light and
outputs a signal indicative of the incident infrared intensity
using the fact that the electrical resistance value of a resistor
changes due to the temperature change.
[0022] This invention is characterized by forming a bolometer
resistor film, through a dry film forming process, on a bridge
structure formed on an insulating substrate via a gap and then
irradiating laser light under the predetermined conditions onto the
resistor film to change the material properties thereof, thereby
forming it as a metal oxide film. Herein, "to change the material
properties" represents cutting bonds between metal and oxygen atoms
forming the metal oxide film to separate oxygen, thereby improving
the transfer of electrons in the metal oxide film, i.e. reducing
the electrical resistivity.
[0023] As the dry film forming process, use can be made of a
sputtering method, a vacuum deposition method, or a CVD (Chemical
Vapor Deposition) method.
[0024] A vanadium oxide thin film is used as the bolometer resistor
film. Since the temperature for forming the vanadium oxide thin
film is low, i.e. 500.degree. C. or less, there is hardly a problem
in manufacturing process.
[0025] On the other hand, since the bridge structure and a
protective layer, if conductive, affect the detection sensitivity
to a change in electrical resistivity of the bolometer resistor
film, use is made, as each of them, of an inorganic insulating thin
film made of SiN or SiON being an insulator having a large
resistance and a high infrared absorptivity.
[0026] The thickness of the inorganic insulating thin film may be
set to about 0.01 to 1 .mu.m according to the purpose.
[0027] The insulating substrate having the vanadium oxide thin film
formed on the bridge structure is set in a chamber under vacuum or
in a chamber capable of controlling its atmosphere with a mixed
reducing gas and the laser light is irradiated onto the vanadium
oxide thin film at a predetermined wavelength, intensity, and
repetition frequency for a predetermined time. Then, as described
above, the material properties of the vanadium oxide thin film
change.
[0028] As the mixed reducing gas, there is cited H2, NH.sub.3,
N.sub.2O, or the like.
[0029] As the laser light, use can be made of ultraviolet laser
light with a small heating effect, such as laser light with a
wavelength of 157 to 550 nm which is generated by an excimer laser
such as XeF (wavelength: 351 nm), XeCI (wavelength: 308 nm), KrF
(wavelength: 248 nm), ArF (wavelength: 193 nm), or F2 (wavelength:
157 nm), an Ar-ion laser (second harmonic: 257 nm), or the like.
Among them, in terms of the stability and maximum output energy
density of the laser, the laser light with a wavelength of 222 to
360 nm is preferable because it can uniformly change the material
properties.
[0030] With respect to the irradiation energy (density) of the
laser light, although the irradiation is enabled with low or high
energy by changing the wavelength and can be effectively performed
in the range of 10 to 150 mJ/cm.sup.2, the range of 30 to 60
mJ/cm.sup.2 is preferable.
[0031] The irradiation frequency of the laser light is 1 Hz to 2000
kHz, preferably 1 to 100 Hz. This is because, although the pulse
frequencies of industrial high-output lasers are normally 1 to 100
Hz, high-frequency lasers, but with low outputs, have been provided
in recent years and, as the repetition frequency increases, the
high-speed processing is enabled correspondingly.
[0032] The pulse width of the laser light is 10 to 200 nsec,
preferably 10 to 40 nsec. This is also because although the pulse
widths of commercial lasers are normally 10 to 40 nsec, it is
becoming possible to change the pulse width.
[0033] The irradiation time of the laser light is 1 second to 2
hours, preferably 1 second to 30 minutes. This is because although
it is about 10 to 30 minutes with a current laser, it is expected
that the irradiation for about 2 hours may be optimal with a
low-output laser.
[0034] If the irradiation energy of the laser light is too small,
there occurs no change in material properties, while, if it is too
large, ablation occurs to vaporize the material of the thin
film.
[0035] It is preferable to heat the insulating substrate to a
temperature of 350.degree. C. or less at the time of the laser
light irradiation, but the irradiation can be performed at room
temperature.
[0036] Hereinbelow, a preferred embodiment of an infrared sensor
manufacturing method according to this invention will be described
with reference to
[0037] FIGS. 1A to 1E, but this invention is not limited
thereto.
Embodiment
[0038] As shown in FIG. 1A, a metal such as WSi having a high
infrared reflectance was formed into a film, by a sputtering
method, on an Si substrate 1 formed with a signal output circuit
(not shown), thereby obtaining an infrared reflecting film 8. A
conventional technique was used as it was for the formation of the
infrared reflecting film 8. Then, a photosensitive polyimide was
coated in a region including the infrared reflecting film 8 and
then was subjected to patterning by lithography, thereby forming a
sacrificial layer 9 having a shape as shown. Instead, a
polycrystalline silicon film may be formed on the infrared
reflecting film 8 by a CVD method and then be subjected to
patterning, thereby forming a sacrificial layer 9 having the shown
shape.
[0039] Subsequently, as shown in FIG. 1B, an inorganic insulating
film of SiON was formed on the sacrificial layer 9 by a plasma CVD
method. This SiON thin film serves as a bridge structure 2.
[0040] Then, referring to FIG. 1C, a metal such as Ti having a
small thermal conductivity was formed into a film on the bridge
structure 2 by a sputtering method and then was subjected to normal
exposure, development, and etching processes, thereby forming
wirings 5. Then, after forming a vanadium oxide thin film 4 on the
bridge structure 2 by a sputtering method, XeCI excimer laser light
10 with a wavelength of 308 nm was irradiated onto the entire
surface of the thin film 4 at 50 mJ/cm.sup.2 and 10 Hz in a vacuum
at room temperature for 5minutes. Then, through exposure,
development, and etching processes, a portion of the vanadium oxide
thin film 4 with a predetermined pattern, adapted to serve as a
bolometer resistor 4'(FIG. 1D), was left remaining on the bridge
structure 2 at its portion corresponding to the infrared reflecting
film 8. As a result, the bolometer resistor 4' irradiated with the
laser light changed in electrical resistivity and TCR.
[0041] Then, as shown in FIG. 1D, an inorganic insulating thin film
of SiON was formed on the bridge structure 2 including the
bolometer resistor 4' by a plasma CVD method. This SiON thin film
serves as a protective layer 6 adapted to shield the bolometer
resistor 4' from the outside.
[0042] Thereafter, the protective layer 6 was formed with a pattern
by exposure and development and there was formed a slit-like groove
(not shown) reaching the sacrificial layer 9 by dry etching using a
gas. Then, treatment was performed to remove the sacrificial layer
9 through the slit-like groove, thereby forming a gap 3 at a
portion where the sacrificial layer 9 had been present (FIG. 1E).
[0043] By the forming method as described above, there was formed a
diaphragm having a structure with the bolometer resistor 4'
floating in the air. A principle in which the cell obtained by the
foregoing manufacturing method operates as an infrared sensor is as
follows:
[0044] When infrared light is incident on the cell (light-incident
portion), the infrared light is absorbed by the protective layer 6
and the bridge structure 2 each having a high infrared
absorptivity, while, part of the infrared light is transmitted
through the protective layer 6 and the bridge structure 2 and then
is reflected by the infrared reflecting film 8 so as to be absorbed
by the bridge structure 2 and the protective layer 6. The absorbed
infrared light serves to heat the diaphragm to thereby change the
resistance of the bolometer resistor 4'. The change in resistance
of the bolometer resistor 4' is output as a signal indicative of
the infrared radiation intensity through the wirings 5 and the
signal output circuit.
[0045] FIG. 2 is a characteristic diagram showing the results of
measuring the temperature dependence of TCR of the infrared sensor
(bolometer resistor 4') in the case where the irradiation energy of
the laser light irradiated onto the bolometer resistor 4' is 40
mJ/cm.sup.2, 50 mJ/cm.sup.2, and 60 mJ/cm.sup.2, respectively. When
the irradiation energy is 50 mJ/cm.sup.2, a good TCR of about 3%/K
exceeding conventional 2%/K is obtained around room temperature
(300 K).
[0046] FIG. 3 is a characteristic diagram showing the results of
measuring the relationship between the resistivity of the infrared
sensor (bolometer resistor 4') and the irradiation time in the case
where the irradiation energy of the laser light irradiated onto the
bolometer resistor 4' is 40 mJ/cm.sup.2, 50 mJ/cm.sup.2, and 60
mJ/cm2, respectively. At any irradiation energy, the electrical
resistivity becomes 10'cm or less when the irradiation time exceeds
2 minutes, and thus falls within the electrical resistivity range
required for the material of the bolometer resistor.
[0047] FIG. 4 is a characteristic diagram showing the results of
measuring the temperature dependence of resistivity of the infrared
sensor (bolometer resistor 4') in the case where the irradiation
energy of the laser light irradiated onto the bolometer resistor 4'
is 40 mJ/cm.sup.2, 50 mJ/cm.sup.2, and 60 mJ/cm.sup.2,
respectively.
[0048] From the foregoing measurement results, it can be understood
that the preferable irradiation energy range is 30 to 60
mJ/cm.sup.2 in the manufacturing method according to this
invention.
[0049] The infrared sensor according to this embodiment is superior
to the infrared sensor disclosed in Patent Document 1 in the
following points: [0050] 1. Using, as the material of each of the
bridge structure and the protective layer, SiN or SiON having a
better infrared absorptivity as compared with SiO.sub.2, TiO.sub.2,
Al.sub.2O.sub.3, or the like, it is possible to improve the TCR.
[0051] 2. The formation of the vanadium oxide thin film for forming
the bolometer resistor is carried out by the sputtering method,
i.e. not by the coating method. The coating method can reduce the
number of processes, but cannot uniformly form a film on the rough
surface of a substrate, and thus is not suitable for mass
production. In contrast, the sputtering method can uniformly form a
film regardless of the roughness of the surface of a substrate and
thus is suitable for mass production. [0052] 3. The temperature
reduction is realized by setting the temperature of the substrate
to 350.degree. C. or less as compared with conventional 400 to
500.degree. C. or less.
[0053] It is readily understood that this invention is not limited
to the foregoing embodiment, but various changes or modifications
can be made without departing from the technical thought of this
invention.
* * * * *