KURASHINA; Seiji

Patent Applications and Registrations

Patent applications and USPTO patent grants for KURASHINA; Seiji.The latest application filed is for "terahertz-wave detector".

Company Profile

2.10.15

KURASHINA; Seiji - Tokyo JP
- Tokyo JP
KURASHINA; Seiji - Minato-ku JP
Kurashina; Seiji - Kanagawa JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Terahertz-wave Detector App 20170030775 - KURASHINA; Seiji ; et al.	2017-02-02
Infrared Sensor Manufactured By Method Suitable For Mass Production App 20160238453 - TSUCHIYA; Tetsuo ; et al.	2016-08-18
Vacuum Sealed Package, Printed Circuit Board Having Vacuum Sealed Package, Electronic Device, And Method For Manufacturing Vacuum Sealed Package App 20140022718 - YAMAZAKI; TAKAO ; et al.	2014-01-23
Bolometer type Terahertz wave detector Grant 8,618,483 - Kurashina , et al. December 31, 2	2013-12-31
Bolometer type Terahertz wave detector Grant 08618483 -	2013-12-31
Infrared Ray Sensor Package, Infrared Ray Sensor Module, And Electronic Device App 20130306868 - YAMAZAKI; Takao ; et al.	2013-11-21
Bolometer-type THz wave detector Grant 8,541,742 - Kurashina , et al. September 24, 2	2013-09-24
Encapsulating package, printed circuit board, electronic device and method for manufacturing encapsulating package Grant 8,525,323 - Yamazaki , et al. September 3, 2	2013-09-03
BOLOMETER-TYPE THz WAVE DETECTOR App 20120235045 - Kurashina; Seiji ; et al.	2012-09-20
Infrared sensor and manufacturing method thereof Grant 8,215,832 - Kurashina July 10, 2	2012-07-10
Vacuum Sealed Package, Printed Circuit Board Having Vacuum Sealed Package, Electronic Device, And Method For Manufacturing Vacuum Sealed Package App 20120106085 - Yamazaki; Takao ; et al.	2012-05-03
Bolometer Type Terahertz Wave Detector App 20110303847 - Kurashina; Seiji ; et al.	2011-12-15
Encapsulating Package, Printed Circuit Board, Electronic Device And Method For Manufacturing Encapsulating Package App 20110114840 - Yamazaki; Takao ; et al.	2011-05-19
Infrared Sensor Manufactured By Method Suitable For Mass Production App 20100276593 - TSUCHIYA; Tetsuo ; et al.	2010-11-04
Vacuum package and manufacturing process thereof Grant 7,795,585 - Sogawa , et al. September 14, 2	2010-09-14
Infrared sensor manufacturing method suitable for mass production Grant 7,781,030 - Tsuchiya , et al. August 24, 2	2010-08-24
Infrared Sensor And Manufacturing Method Thereof App 20090207879 - KURASHINA; SEIJI	2009-08-20
Vacuum Package And Manufacturing Process Thereof App 20090140146 - SOGAWA; Yoshimichi ; et al.	2009-06-04
Infrared sensor manufacturing method suitable for mass production App 20070272863 - Tsuchiya; Tetsuo ; et al.	2007-11-29
Thermal-type infra-red ray solid-state image sensor and method of fabricating the same Grant 7,276,698 - Tohyama , et al. October 2, 2	2007-10-02
Thermal-type infra-red ray solid-state image sensor and method of fabricating the same App 20050218326 - Tohyama, Shigeru ; et al.	2005-10-06
Thermal-type infra-red ray solid-state image sensor and method of fabricating the same App 20050116169 - Tohyama, Shigeru ; et al.	2005-06-02

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