U.S. patent application number 12/512953 was filed with the patent office on 2010-10-21 for heat dissipation device.
This patent application is currently assigned to FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD.. Invention is credited to JUI-WEN HUNG, CHING-BAI HWANG, JIN-GONG MENG.
Application Number | 20100263834 12/512953 |
Document ID | / |
Family ID | 42958535 |
Filed Date | 2010-10-21 |
United States Patent
Application |
20100263834 |
Kind Code |
A1 |
HWANG; CHING-BAI ; et
al. |
October 21, 2010 |
HEAT DISSIPATION DEVICE
Abstract
A heat dissipation device includes a chamber, a tube, a wick
structure and a plurality of fins arranged around the tube. The
chamber includes a base and a cover hermetically connected to the
base. An evaporation room is defined between the base and the cover
of the chamber. The tube extends upwardly from the cover of the
chamber, and defines a condensation room communicating with the
evaporation room. The wick structure is immerged with working
fluid, and includes a main portion disposed in the evaporation room
and a projection extending from the main portion into the
condensation room.
Inventors: |
HWANG; CHING-BAI; (Tu-Cheng,
TW) ; MENG; JIN-GONG; (Shenzhen City, CN) ;
HUNG; JUI-WEN; (Tu-Cheng, TW) |
Correspondence
Address: |
Altis Law Group, Inc.;ATTN: Steven Reiss
288 SOUTH MAYO AVENUE
CITY OF INDUSTRY
CA
91789
US
|
Assignee: |
FURUI PRECISE COMPONENT (KUNSHAN)
CO., LTD.
KunShan City
CN
Foxconn Technology Co., Ltd.
Tu-Cheng
TW
|
Family ID: |
42958535 |
Appl. No.: |
12/512953 |
Filed: |
July 30, 2009 |
Current U.S.
Class: |
165/104.26 |
Current CPC
Class: |
F28D 15/0275 20130101;
H01L 23/467 20130101; H01L 23/427 20130101; H01L 2924/0002
20130101; H01L 2924/00 20130101; F28D 15/0266 20130101; H01L
23/3672 20130101; H01L 2924/0002 20130101 |
Class at
Publication: |
165/104.26 |
International
Class: |
F28D 15/02 20060101
F28D015/02 |
Foreign Application Data
Date |
Code |
Application Number |
Apr 16, 2009 |
CN |
200910301609.1 |
Claims
1. A heat dissipation device, comprising: a heat transfer member
comprising a hollow chamber and at least a hollow tube extending
from and communicating the chamber, the at least one tube being
substantially perpendicular to the chamber; a wick structure
immerged with working fluid comprising a first section received in
the chamber and at least one second section extending from the
first section into the at least one tube, a channel being defined
between the at least one tube and the wick structure for vapor
flowing in the at least one tube; and a heat dissipation member
comprising a plurality of fins arranged around the at least one
tube.
2. The heat dissipation device of claim 1, wherein the chamber is
flat, the at least one tube extending upwardly from a middle of the
chamber, a cross section of the at least one tube having a
substantially elongated rectangular shape with two arc ends.
3. The heat dissipation device of claim 2, wherein the at least one
tube comprises two flat plates, two arced plates respectively
formed at lateral sides of the flat plates, and a top plate
coupling to top sides of the flat plates and the arced plates, the
at least one second section of the wick structure abutting the flat
plates and spaced from the arced plates of the at least one tube,
the channel being defined between the arced plates of the at least
one tube and the at least one second section of the wick
structure.
4. The heat dissipation device of claim 3, wherein the at least one
second section of the wick structure is spaced from the top plate
of the at least one tube.
5. The heat dissipation device of claim 1, wherein the chamber
comprises a base and a cover parallel to and spaced from the base,
the first section of the wick structure attaching to the base and
spaced from the cover.
6. The heat dissipation device of claim 5, wherein at least one
aperture is defined in the cover and has a substantially elongated
rectangular shape with two arc ends, a wall extending upwardly from
a border of the at least one aperture, the at least one tube having
a bottom end inserted into and connected to the wall
hermetically.
7. The heat dissipation device of claim 5, wherein a plurality of
arms extend outwards from the base and each define a through hole
for assembly the heat dissipation device.
8. The heat dissipation device of claim 1, wherein the at least one
tube comprises a pair of tubes, the pair of tubes are aslant to
each other.
9. A heat dissipation device, comprising: a chamber comprising a
base and a cover hermetically connected to the base, an evaporation
room being defined between the base and the cover of the chamber; a
tube extending upwardly from the cover of the chamber, and defining
a condensation room therein communicating the evaporation room of
the chamber; a wick structure immerged with working fluid
comprising a main portion disposed in the evaporation room and a
projection extending from the main portion into the condensation
room; and a plurality of fins arranged around the tube.
10. The heat dissipation device of claim 9, wherein the tube is
flat, comprising two flat plates, two arced plates respectively
connecting lateral sides of the flat plates, and a top plate
coupling to top sides of the flat plates and the arced plates, the
projection of the wick structure abutting the flat plates and
spaced from the arced plates, a channel being defined between the
arced plates of the tube and the projection of the wick
structure.
11. The heat dissipation device of claim 10, wherein a top end of
the projection is lower than the top plate of the tube.
12. The heat dissipation device of claim 9, wherein the wick
structure is a screen mesh.
13. The heat dissipation device of claim 9, wherein an aperture is
defined in the cover and has a substantially elongated rectangular
shape with two arc ends, a wall extending upwardly from a border of
the aperture, a bottom end of the tube inserted into and connected
to the wall hermetically.
14. The heat dissipation device of claim 9, wherein a plurality of
arms extend outwards from the base and each define a through hole.
Description
BACKGROUND
[0001] 1. Technical Field
[0002] The disclosure generally relates to heat dissipation
devices, and more particularly to a heat dissipation device having
a low heat resistance.
[0003] 2. Description of Related Art
[0004] With continuing development of the electronic technology,
electronic components such as CPUs are generating more and more
heat which is required to be dissipated immediately. A heat
dissipation device is usually adopted for cooling the electronic
component.
[0005] Generally, a heat dissipation device includes a heat
spreader, a fin unit and a heat pipe. The heat spreader attaches to
an electronic component to absorb heat therefrom. The heat pipe has
an evaporation end attaching to the heat spreader and a condensing
end attaching to the fin unit to transfer heat of the electronic
component to the fin unit for dissipation. However, a heat
resistance existed between the heat spreader and the evaporation
end of the heat pipe limits a heat transfer efficiency between the
heat spreader and the heat pipe, and thus a heat dissipation
efficiency of the heat dissipation device is limited even through
the heat pipe transferring heat through phase change has a much
better heat transfer efficiency.
[0006] For the foregoing reasons, therefore, there is a need in the
art for a heat dissipation device which overcomes the limitations
described.
BRIEF DESCRIPTION OF THE DRAWINGS
[0007] FIG. 1 is an isometric, assembled view of a heat dissipation
device according to an exemplary embodiment.
[0008] FIG. 2 is an exploded view of the heat dissipation device of
FIG. 1.
[0009] FIG. 3 is an exploded view of a heat transfer member of the
heat dissipation device of FIG. 2.
[0010] FIG. 4 is a cross section of the heat dissipation device,
taken along line IV-IV of FIG. 1.
[0011] FIG. 5 is a cross section of the heat dissipation device,
taken along line V-V of FIG. 1.
DETAILED DESCRIPTION
[0012] Referring to FIG. 1, a heat dissipation device for cooling
heat generating components (not shown), such as electronic
components, according to an exemplary embodiment includes a heat
transfer member 10 and a heat dissipation member 20 connected to
the heat transfer member 10.
[0013] As shown in FIGS. 2 and 3, the heat transfer member 10 is
hollow. A wick structure 18 immerged with working fluid, such as
alcohol, water, etc., is received in the heat transfer member 10.
The heat transfer member 10 includes a chamber 14 and two tubes 16
extending upwardly from the chamber 14. The tubes 16 are spaced
from each other, and both are perpendicular to the chamber 14.
[0014] Referring to FIG. 4, the chamber 14 includes a base 144 and
a cover 142 coupled to the base 144 firmly and hermetically. The
base 144 and the cover 142 each have a rectangular main plate 143
and a flange 145 extending from an outer periphery of the main
plate 143. The flanges 145 of the cover 142 and the base 144 are
connected together to form an evaporation room 147 between the
cover 142 and the base 144. Four arms 146 extend outwardly from
four corners of the base 144, respectively. Each arm 146 defines a
through hole 149 therein for a screw extending therethrough to
assemble the heat dissipation device to the heat generating
component.
[0015] A pair of apertures 30 are defined in a middle of the main
plate 143 of the cover 142 of the chamber 14, and spaced from each
other. Each of the apertures 30 has nearly an elongated rectangular
shape with two arc ends. A wall 15 extends upwardly from a border
of each aperture 30. The walls 15 are aslant to the lateral sides
of the cover 142, and are aslant to each other. Each wall 15 slants
from a lower left towards an upper right. A distance between the
walls 15 gradually decreases from the lower left to the upper
right. The walls 15 have shapes and sizes substantially identical
to each other. Each wall 15 includes a pair of linear sides 141
parallel to each other, and two arced sides 140 at opposite ends of
the linear sides 141. A length of the wall 15, i.e., a distance
between the arced sides 140 of the wall 15, is much larger than a
width of the wall 15 i.e., a distance between the linear sides 141
of the wall 15.
[0016] The tubes 16 are substantially identical to each other, and
are respectively connected to the walls 15 of the cover 142. Each
tube 16 includes a pair of flat plates 162, a pair of arced plates
164, and a top plate 166. The flat plates 162 and the arced plates
164 each extend vertically. The flat plates 162 are parallel to
each other, the arced plates 164 are connected at lateral sides of
the flat plate 162. The top plate 166 couples top sides of the flat
plates 162 and the arced plates 164. Thus a condensation room 168
is defined in each tube 16 among the flat plates 162, the arced
plates 164 and the top plate 166 with a top end being closed by the
top plate 166. Bottom end of each tube 16 is inserted into a
corresponding wall 15 of the cover 142 of the chamber 14, and
connected to the corresponding wall 15 closely. Thus the
condensation room 168 of each tube 16 communicates the evaporation
room 147 of the chamber 14 through the corresponding aperture
30.
[0017] The wick structure 18 is a screen mesh, and defines a
plurality of micro-pores therein. Alternatively, the wick structure
18 can be other type, such as sintered power. The wick structure 18
includes a main portion 181 and a pair of projections 182. Both of
the main portion 181 and the projections 182 are flat. The main
portion 181 is arranged in the evaporation room 147 of the chamber
14 and attaches the base 144 of the chamber 14 closely. A thickness
of the main portion 181 of the wick structure 18 is smaller than a
height of the evaporation chamber 14, and thus the main portion 181
of the wick structure 18 is spaced from the cover 142 of the
chamber 14.
[0018] The projections 182 extend perpendicularly from the main
portion 181 into the condensation rooms 168 of the tubes 16,
respectively. Each projection 182 of the wick structure 18 has a
height a little smaller than that of the tube 16. A length of each
projection 182 is smaller than that of the tube 16, i.e., a
distance between the arced plates 164 of each tube 16. A thickness
of each projection 182 substantially equals to a width of the tube
16, i.e., a distance between the flat plates 162 of the tube 16. As
shown in FIGS. 4 and 5, each projection 182 of the wick structure
18 in a corresponding tube 16 abuts the flat plates 162 of the tube
16, and spaces from the arced plates 164 and the closed plate of
the tube 16. A channel 40 is thus defined in each tube 16 between
the wick structure 18 and the arced plates 164 of the tube 16 for
vapor flowing upwardly to transfer heat to the heat dissipation
member 20.
[0019] The heat dissipation member 20 includes a plurality of
stacked fins 21 parallel to each other. Each fin 21 has a main body
22 and four hems 24 bent from four corners of the main body 22,
respectively. Distal edges of the hems 24 of each fin 21 contact
with the main body 22 of an adjacent fin 21 to form an air passage
23 between neighboring fins 21. A pair of openings 222 are defined
in each fin 21 for receiving the tubes 16. The shape, size and
location of the openings 222 are decided according to the tubes 16.
A protrusion 224 extends upwardly from a border of each opening 222
of each fin 21 with a height nearly equaling to the distance
between two adjacent fins 21. When the fins 21 are assembled
together, the protrusion 224 of each fin 21 contacts the border of
the opening 222 of the adjacent fin 21. Thus, the openings 222
cooperatively form a pair of columned holes for the tubes 16
extending therethrough, respectively, and the protrusions 224
enclose and contact with the tubes 16, which enlarges the
contacting surface area between the tubes 16 and the fins 21.
[0020] During operation, the main plate 143 of the base 144 of the
chamber 14 of the heat transfer member 10 attaches to the heat
generating component tightly to absorb heat thereform. The working
fluid that is contained in the chamber 14 absorbs heat and
evaporates substantially and moves to the tubes 16 along the
channels 40. Evaporated working fluid is cooled at the tubes 16 and
condensed, whereby the heat is thus released to the fins 21.
Finally, the condensed working fluid flows back quickly to the
chamber 14 on the action of the wick structure 18 to begin another
cycle of heat dissipation. Since the heat transfer member 10 has
the chamber 14 and the tubes 16, the chamber 14 can absorb heat
directly and thus a heat resistance between a heat spreader and a
heat pipe of a conventional heat dissipation device is avoided;
therefore, the heat of the heat generating component can be
transferred to the heat dissipation member 20 almost immediately. A
heat dissipation efficiency of the heat dissipation device is thus
enhanced.
[0021] It is to be understood, however, that even though numerous
characteristics and advantages of the disclosure have been set
forth in the foregoing description, together with details of the
structure and function of the disclosure, the disclosure is
illustrative only, and changes may be made in detail, especially in
matters of shape, size, and arrangement of parts within the
principles of the disclosure to the full extent indicated by the
broad general meaning of the terms in which the appended claims are
expressed.
* * * * *