loadpatents
name:-0.03013801574707
name:-0.016786098480225
name:-0.00051188468933105
Meng; Jin-Gong Patent Filings

Meng; Jin-Gong

Patent Applications and Registrations

Patent applications and USPTO patent grants for Meng; Jin-Gong.The latest application filed is for "heat dissipation device".

Company Profile
0.12.24
  • Meng; Jin-Gong - Shenzhen CN
  • MENG; JIN-GONG - Shenzhen City CN
  • Meng; Jin-Gong - Guangdong CN
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Heat dissipation device
Grant 7,987,898 - Meng , et al. August 2, 2
2011-08-02
Thermal module with porous type heat dissipater
Grant 7,913,749 - Meng , et al. March 29, 2
2011-03-29
Heat dissipation device and computer using same
Grant 7,839,630 - Hwang , et al. November 23, 2
2010-11-23
Heat Dissipation Device
App 20100263834 - HWANG; CHING-BAI ;   et al.
2010-10-21
Heat dissipation apparatus
Grant 7,802,617 - Hwang , et al. September 28, 2
2010-09-28
Heat dissipation device
Grant 7,779,894 - Peng , et al. August 24, 2
2010-08-24
Heat Pipe
App 20100181048 - HWANG; CHING-BAI ;   et al.
2010-07-22
Thermal Module
App 20100155030 - HWANG; CHING-BAI ;   et al.
2010-06-24
Thermal Module
App 20100139895 - HWANG; CHING-BAI ;   et al.
2010-06-10
Heat Dissipation Device And Computer Using Same
App 20100073864 - HWANG; CHING-BAI ;   et al.
2010-03-25
Heat spreader with vapor chamber defined therein and method of manufacturing the same
Grant 7,651,601 - Hwang , et al. January 26, 2
2010-01-26
Heat spreader with vapor chamber and method of manufacturing the same
Grant 7,603,775 - Meng , et al. October 20, 2
2009-10-20
Heat dissipation device
Grant 7,606,036 - Hwang , et al. October 20, 2
2009-10-20
Heat dissipation apparatus
Grant 7,520,314 - Hwang , et al. April 21, 2
2009-04-21
Heat dissipation apparatus with porous type heat dissipater
Grant 7,492,588 - Hwang , et al. February 17, 2
2009-02-17
Heat Dissipation Device
App 20090008066 - MENG; JIN-GONG ;   et al.
2009-01-08
Thermal Module With Porous Type Heat Dissipater
App 20080314576 - MENG; JIN-GONG ;   et al.
2008-12-25
Heat dissipation apparatus
Grant 7,434,610 - Hwang , et al. October 14, 2
2008-10-14
Heat Dissipation Apparatus With Porous Type Heat Dissipater
App 20080247134 - HWANG; CHING-BAI ;   et al.
2008-10-09
Thermal Module
App 20080093056 - HWANG; CHING-BAI ;   et al.
2008-04-24
Heat Spreader With Vapor Chamber And Method Of Manufacturing The Same
App 20080087405 - MENG; JIN-GONG ;   et al.
2008-04-17
Heat Dissipation Device
App 20080023176 - Peng; Jie-Bo ;   et al.
2008-01-31
Heat Dissipation Apparatus
App 20080017358 - HWANG; CHING-BAI ;   et al.
2008-01-24
Heat Dissipation Apparatus
App 20080011460 - HWANG; CHING-BAI ;   et al.
2008-01-17
Heat Dissipation Apparatus
App 20080011461 - Hwang; Ching-Bai ;   et al.
2008-01-17
Heat Dissipation Apparatus
App 20080011454 - HWANG; CHING-BAI ;   et al.
2008-01-17
Heat sink
Grant 7,304,847 - Hwang , et al. December 4, 2
2007-12-04
Heat Dissipation Device
App 20070272395 - HWANG; CHING-BAI ;   et al.
2007-11-29
Heat Dissipation Apparatus
App 20070267172 - HWANG; CHING-BAI ;   et al.
2007-11-22
Heat Dissipation Apparatus With Guilding Plates For Guiding Airflow Flowing Through A Fin Assembly
App 20070251677 - HWANG; CHING-BAI ;   et al.
2007-11-01
Thermal Module
App 20070251675 - HWANG; CHING-BAI ;   et al.
2007-11-01
Fastening Device For Mounting A Thermal Module To An Electronic Component
App 20070253769 - HWANG; CHING-BAI ;   et al.
2007-11-01
Heat Sink
App 20070188992 - HWANG; CHING-BAI ;   et al.
2007-08-16
Thermal Module
App 20070068659 - HWANG; CHING-BAI ;   et al.
2007-03-29
Heat Spreader With Vapor Chamber Defined Therein And Method Of Manufacturing The Same
App 20070017814 - Hwang; Ching-Bai ;   et al.
2007-01-25
Flat Type Heat Pipe
App 20070006993 - Meng; Jin-Gong ;   et al.
2007-01-11

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