U.S. patent application number 12/769611 was filed with the patent office on 2010-08-19 for processes and equipments for preparing f2-containing gases, as well as processes and equipments for modifying the surfaces of articles.
This patent application is currently assigned to KANTO DENKA KOGYO CO., LTD.. Invention is credited to Katsuya Fukae, Takashi Tanioka, Taisuke Yonemura.
Application Number | 20100206480 12/769611 |
Document ID | / |
Family ID | 35063659 |
Filed Date | 2010-08-19 |
United States Patent
Application |
20100206480 |
Kind Code |
A1 |
Tanioka; Takashi ; et
al. |
August 19, 2010 |
PROCESSES AND EQUIPMENTS FOR PREPARING F2-CONTAINING GASES, AS WELL
AS PROCESSES AND EQUIPMENTS FOR MODIFYING THE SURFACES OF
ARTICLES
Abstract
Apparatus for safely and easily preparing an F.sub.2-containing
gas including equipment for handling a gas containing a fluoro
compound that is easier to handle than F.sub.2, and in which the
fluoro compound is excited and decomposed to convert it into
F.sub.2 gas before surface modification and then used for surface
modification. There is no necessity of providing, storing and
transporting a large amount of F.sub.2 gas in advance because a
necessary amount of F.sub.2 gas is obtained immediately before
surface modification.
Inventors: |
Tanioka; Takashi;
(Shibukawa-shi, JP) ; Fukae; Katsuya;
(Shibukawa-shi, JP) ; Yonemura; Taisuke;
(Chiyoda-ku, JP) |
Correspondence
Address: |
BROWDY AND NEIMARK, P.L.L.C.;624 NINTH STREET, NW
SUITE 300
WASHINGTON
DC
20001-5303
US
|
Assignee: |
KANTO DENKA KOGYO CO., LTD.
Chiyoda-ku
JP
|
Family ID: |
35063659 |
Appl. No.: |
12/769611 |
Filed: |
April 28, 2010 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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10585878 |
Jul 11, 2006 |
|
|
|
PCT/JP2005/006149 |
Mar 30, 2005 |
|
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12769611 |
|
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Current U.S.
Class: |
156/345.1 ;
422/186 |
Current CPC
Class: |
C01B 7/20 20130101; C23C
8/08 20130101 |
Class at
Publication: |
156/345.1 ;
422/186 |
International
Class: |
C23F 1/08 20060101
C23F001/08; B01J 19/08 20060101 B01J019/08; H01L 21/306 20060101
H01L021/306 |
Foreign Application Data
Date |
Code |
Application Number |
Mar 31, 2004 |
JP |
2004/103364 |
Claims
1. An equipment for preparing an F.sub.2-containing gas comprising:
a means for ionizing a fluoro compound-containing gas under reduced
pressure; and a pressure controlling means communicating with the
ionizing means and controlling the pressure of the ionized fluoro
compound-containing gas at a normal pressure or overpressure
condition.
2. A surface modification equipment comprising a means
communicating with the pressure controlling means in the equipment
for preparing an F.sub.2-containing gas of claim 1 and positioning
an article whose surface should be contacted with the
F.sub.2-containing gas prepared in the equipment for preparing an
F.sub.2-containing gas under reduced pressure or overpressure or
normal pressure.
3. The surface modification equipment of claim 2 further comprising
a vacuum pump or compressor communicating with the means for
positioning the article.
4. An apparatus for preparing an F.sub.2-containing gas comprising:
means for exciting at least one fluoro compound in a fluoro
compound-containing gas by conferring energy on the fluoro
compound-containing gas under reduced pressure; and means for
partially or completely converting the excited fluoro
compound-containing gas containing the excited fluoro compound into
F.sub.2 under normal pressure or overpressure.
5. The apparatus of claim 4, wherein the means for exciting a
fluoro compound comprises a first zone adapted for and capable of
being maintained under reduced pressure; and the means for
converting the gas into F.sub.2 comprises a second zone
communicating with the first zone and adapted for and capable of
being maintained under normal pressure or overpressure.
6. The apparatus of claim 4, wherein the means for exciting a
fluoro compound comprises a first zone adapted for and capable of
being maintained under reduced pressure; and the means for
converting the gas into F.sub.2 comprises means for maintaining the
pressure in the transportation system under a normal pressure or
overpressure condition during transportation of the excited fluoro
compound-containing gas to a second zone communicating with the
first zone.
7. The apparatus of claim 4 wherein the means for exciting a fluoro
compound comprises a first zone capable of being maintained under
reduced pressure; and the means for converting the gas into F.sub.2
comprises means for maintaining the pressure in the first zone
under a normal pressure or overpressure condition.
8. The apparatus of claim 4 wherein the means for exciting a fluoro
compound comprises a first chamber capable of begin maintained
under reduced pressure; and the means for converting the gas into
F.sub.2 comprises means for transporting the excited fluoro
compound-containing gas containing the excited fluoro compound from
the first chamber to a second chamber maintained under normal
pressure or overpressure via a gas channel connecting the first
chamber and the second chamber.
9. The apparatus of claim 4 wherein the means for exciting a fluoro
compound comprises a first chamber capable of being maintained
under reduced pressure; and the means for converting the gas into
F.sub.2 comprises means for maintaining the pressure in the
transportation system under a normal pressure or overpressure
condition during transportation of the excited fluoro
compound-containing gas containing the excited fluoro compound from
the first chamber to a second chamber via a gas channel connecting
the first chamber and the second chamber.
10. The apparatus of claim 4 wherein the means for exciting a
fluoro compound comprises a first chamber and means for maintaining
the first chamber under reduced pressure; and the means for
converting the gas into F.sub.2 comprises means in the first
chamber for maintaining the first chamber under normal pressure or
overpressure.
11. The apparatus of claim 8 wherein a vacuum pump is provided in a
gas channel connecting the first chamber and the second chamber and
said vacuum pump for use during transporting the excited fluoro
compound-containing gas from the first chamber to the second
chamber.
12. The apparatus of claim 9 wherein a vacuum pump is provided in a
gas channel connecting the first chamber and the second chamber and
said vacuum pump for use during transporting the excited fluoro
compound-containing gas from the first chamber to the second
chamber.
Description
[0001] This is a divisional of allowed application Ser. No.
10/585,878, filed Jul. 11, 2006, which is the U.S. National Phase
application of International Application No. PCT/JP04/019574 filed
Mar. 30, 2005, the contents of each of which are incorporated
herein.
TECHNICAL FIELD
[0002] The present invention relates to processes and equipments
for preparing F.sub.2-containing gases by exciting a fluoro
compound under reduced pressure to generate an active species, and
then raising the pressure to a normal pressure or overpressure
condition to substantially wholly deactivate the generated active
species, thereby generating fluorine (F.sub.2), as well as
processes and equipments for modifying the surfaces of articles by
contacting the F.sub.2-containing gas with the surfaces.
BACKGROUND ART
[0003] Plasma CVD is widely used to form thin films in the
manufacture of semiconductor devices. In plasma CVD, a gaseous
fluoro compound such as NF.sub.3 is ionized, and the resulting
ionized species are used for etching the surfaces of semiconductor
substrates or cleaning CVD chambers. During such plasma ionization,
F.sub.2 gas is also generated, but F.sub.2 gas is treated as
exhaust gas.
[0004] For example, a method has been known for ionizing F.sub.2
gas and using the resulting ionized species to clean the inner wall
of a CVD chamber (e.g., see patent document 1), but this method
uses a plasma of F.sub.2 gas rather than F.sub.2 gas itself.
[0005] Surface treatment methods for materials other than
semiconductors such as metal materials and plastic materials using
a plasma derived from a fluoro compound have been reported (see
patent document 2, and patent document 4). However, the plasma may
penetrate into the article to be surface-treated to damage the
article in these methods.
[0006] A surface treatment method using unionized F.sub.2 gas has
also been reported (e.g., see patent document 3). However, the
method directly using F.sub.2 gas has the following problems.
First, it is difficult to store, transport and use a large amount
of F.sub.2 gas because of the toxicity, hazardousness, reactivity,
and corrosiveness of F.sub.2 gas. In order to reduce hazardousness,
diluted F.sub.2 gas can be used, but costs for storage and
transportation increase. Moreover, very stable materials must be
used for the sites exposed to F.sub.2 gas, which add costs of the
surface treatment equipment.
[0007] A method for treating the surface of an article comprising
exciting a halogen compound by applying a low-frequency voltage on
it at or near atmospheric pressure to decompose it and generate a
halogen or hydrogen halide has also been proposed (see patent
document 5). This method has the advantage that it is simple and
safe to operate because it can be performed at or near atmospheric
pressure. However, the concentration of the halogen or hydrogen
halide that can be generated by this method is considerably low
because of low decomposition efficiency and it is not easy to
secure a sufficient concentration or amount for the subsequent
use.
REFERENCES
[0008] Patent document 1: JP 2004-039740 A [0009] Patent document
2: JP 2000-319433 A [0010] Patent document 3: JP 2001-240956 A
[0011] Patent document 4: JP 08-217897 A [0012] Patent document 5:
JP 09-205272 A
DISCLOSURE OF THE INVENTION
Problems to be Solved by the Invention
[0013] The present invention was made under the circumstances as
described above and provides processes for safely and easily
preparing F.sub.2 gas in simple equipments and such equipments. The
present invention also provides processes and equipments enabling
safe and easy surface modification by F.sub.2 gas.
Means for Solving the Problems
[0014] As a result of careful studies to solve these problems, we
accomplished the present invention on the basis of the finding that
surface modification by F.sub.2 gas can be safely and easily
performed by supplying a gas containing a fluoro compound (a
fluorine-containing compound) that is easier to handle than F.sub.2
gas and converting the fluoro compound into F.sub.2 gas before
surface modification. We also accomplished the present invention on
the basis of the finding that F.sub.2 gas can be efficiently
generated in a sufficient concentration and amount from a fluoro
compound by exciting the fluoro compound under reduced pressure to
generate an active species and then raising the pressure to a
normal pressure or overpressure condition to substantially wholly
deactivate the active species generated.
[0015] Accordingly, the present invention provides the
following.
[0016] (1) A process for preparing an F.sub.2-containing gas
comprising the steps of:
[0017] exciting at least one fluoro compound in a fluoro
compound-containing gas by conferring energy on the fluoro
compound-containing gas under reduced pressure; and
[0018] partially or completely converting the excited fluoro
compound-containing gas containing the excited fluoro compound into
F.sub.2 under normal pressure or overpressure.
[0019] (2) The process for preparing an F.sub.2-containing gas as
defined in (1) wherein the step of exciting a fluoro compound is
performed in a first zone maintained under reduced pressure;
and
[0020] the step of converting the gas into F.sub.2 is performed in
a second zone communicating with the first zone and maintained
under normal pressure or overpressure.
[0021] (3) The process for preparing an F.sub.2-containing gas as
defined in (1) wherein the step of exciting a fluoro compound is
performed in a first zone maintained under reduced pressure;
and
[0022] the step of converting the gas into F.sub.2 comprises
maintaining the pressure in the transportation system under a
normal pressure or overpressure condition during transportation of
the excited fluoro compound-containing gas to a second zone
communicating with the first zone.
[0023] (4) The process for preparing an F.sub.2-containing gas as
defined in (1) wherein the step of exciting a fluoro compound is
performed in a first zone maintained under reduced pressure;
and
[0024] the step of converting the gas into F.sub.2 is performed by
maintaining the pressure in the first zone under a normal pressure
or overpressure condition.
[0025] (5) The process for preparing an F.sub.2-containing gas as
defined in (1) wherein the step of exciting a fluoro compound is
performed in a first chamber maintained under reduced pressure;
and
[0026] the step of converting the gas into F.sub.2 comprises
transporting the excited fluoro compound-containing gas containing
the excited fluoro compound from the first chamber to a second
chamber maintained under normal pressure or overpressure via a gas
channel connecting the first chamber and the second chamber.
[0027] (6) The process for preparing an F.sub.2-containing gas as
defined in (1) wherein the step of exciting a fluoro compound is
performed in a first chamber maintained under reduced pressure;
and
[0028] the step of converting the gas into F.sub.2 comprises
maintaining the pressure in the transportation system under a
normal pressure or overpressure condition during transportation of
the excited fluoro compound-containing gas containing the excited
fluoro compound from the first chamber to a second chamber via a
gas channel connecting the first chamber and the second
chamber.
[0029] (7) The process for preparing an F.sub.2-containing gas as
defined in (1) wherein the step of exciting a fluoro compound is
performed in a first chamber maintained under reduced pressure;
and
[0030] the step of converting the gas into F.sub.2 is performed in
the first chamber by maintaining the first chamber under normal
pressure or overpressure.
[0031] (8) The process for preparing an F.sub.2-containing gas as
defined in (5) or (6) wherein a vacuum pump is provided in a gas
channel connecting the first chamber and the second chamber and
said vacuum pump is used during the step of transporting the
excited fluoro compound-containing gas from the first chamber to
the second chamber.
[0032] (9) The process for preparing an F.sub.2-containing gas as
defined in any one of (1) to (8) wherein the step of exciting a
fluoro compound comprises ionizing the fluoro compound-containing
gas.
[0033] (10) The process for preparing an F.sub.2-containing gas as
defined in any one of (1) to (9) wherein the fluoro compound is a
gaseous fluoro compound selected from linear, branched or cyclic
saturated perfluorocarbons, linear, branched or cyclic unsaturated
perfluorocarbons, carbonyl fluorides, perfluoro hypofluorides,
perfluoro peroxides, perfluoroether compounds, oxygen-containing
fluorides, interhalogen fluorides, iodine-containing fluorides,
sulfur-containing fluorides, nitrogen-containing fluorides,
silicon-containing fluorides, rare gas-containing fluorides, or
combinations thereof.
[0034] (11) The process for preparing an F.sub.2-containing gas as
defined in any one of (1) to (9) wherein the fluoro compound is
selected from CF.sub.4, C.sub.2F.sub.6, C.sub.3F.sub.8,
C.sub.4F.sub.10, C.sub.5F.sub.12, C.sub.6F.sub.14, C.sub.2F.sub.4,
C.sub.3F.sub.6, C.sub.4F.sub.8, C.sub.5F.sub.10, C.sub.6F.sub.12,
C.sub.4F.sub.6, FCOF, CF.sub.3COF, CF.sub.2(COF).sub.2,
C.sub.3F.sub.7COF, CF.sub.3OF, C.sub.2F.sub.5OF,
CF.sub.2(OF).sub.2, CF.sub.3COOF, CF.sub.3OOCF.sub.3,
CF.sub.3COOOF, CF.sub.3OCF.sub.3, C.sub.2F.sub.5OC.sub.2F.sub.5,
C.sub.2F.sub.4OC.sub.2F.sub.4, OF.sub.2, SOF.sub.2, SOF.sub.4, NOF,
ClF.sub.3, IF.sub.5, BrF.sub.5, BrF.sub.3, CF.sub.3I,
C.sub.2F.sub.5I, N.sub.2F.sub.4, NF.sub.3, NOF.sub.3, SiF.sub.4,
Si.sub.2F.sub.6, XeF.sub.2, XeF.sub.4, KrF.sub.2, SF.sub.4,
SF.sub.6, or a mixture thereof.
[0035] (12) The process for preparing an F.sub.2-containing gas as
defined in any one of (1) to (11) wherein the fluoro
compound-containing gas comprises an inert gas and/or oxygen.
[0036] (13) The process for preparing an F.sub.2-containing gas as
defined in (12) wherein the inert gas is He, Ne, Ar, Xe, Kr,
N.sub.2, or a combination thereof.
[0037] (14) The process for preparing an F.sub.2-containing gas as
defined in any one of (1) to (13) wherein the fluoro compound is
one or more members selected from the group consisting of NF.sub.3,
C.sub.2F.sub.6, and COF.sub.2.
[0038] (15) The process for preparing an F.sub.2-containing gas as
defined in (14) wherein the fluoro compound is ionized in the
presence of oxygen when it is a perfluorocarbon or a mixture
containing one or more perfluorocarbons.
[0039] (16) A process for modifying the surface of an article
comprising contacting an F.sub.2-containing gas obtained by the
process for preparing an F.sub.2-containing gas as defined in any
one of (1) to (15) with the surface of the article under reduced
pressure or overpressure or normal pressure.
[0040] (17) The surface modification process as defined in (16)
further comprising the step of introducing an inert gas and/or
oxygen after conferring energy on the fluoro compound-containing
gas before contacting the gas with the article to be
surface-modified.
[0041] (18) The surface modification process as defined in (16) or
(17) wherein the surface modification is performed by fluorinating
the surface of the article.
[0042] (19) The surface modification process as defined in any one
of (16) to (18) wherein the article to be surface-modified is one
or more members selected from the group consisting of metals, metal
compounds and polymers.
[0043] (20) The surface modification process as defined in (19)
wherein the polymer is an article based on polypropylene.
[0044] (21) The surface modification process as defined in (19)
wherein the metal compound is one or more members selected from the
group consisting of metal oxides, metal nitrides, metal carbides,
metal hydroxides and metal chlorides.
[0045] (22) The surface modification process as defined in (19)
wherein the metal compound is a compound based on Si.
[0046] (23) The surface modification process as defined in (22)
wherein the compound based on Si is Si, SiO.sub.2, Si.sub.3N.sub.4,
SiC, polysilicon, amorphous silicon, or a combination thereof.
[0047] (24) The surface modification process as defined in (22)
wherein the compound based on Si is deposited in an LPCVD
equipment.
[0048] (25) An equipment for preparing an F.sub.2-containing gas
comprising:
[0049] a means for ionizing a fluoro compound-containing gas under
reduced pressure; and
[0050] a pressure controlling means communicating with the ionizing
means and controlling the pressure of the ionized fluoro
compound-containing gas at a normal pressure or overpressure
condition.
[0051] (26) A surface modification equipment comprising a means
communicating with the pressure controlling means in the equipment
for preparing an F.sub.2-containing gas as defined in (25) and
positioning an article whose surface should be contacted with the
F.sub.2-containing gas prepared in the equipment for preparing an
F.sub.2-containing gas under reduced pressure or overpressure or
normal pressure.
[0052] (27) The surface modification equipment as defined in (26)
further comprising a vacuum pump or compressor communicating with
the means for positioning the article.
[0053] (28) A method for using the equipment as defined in any one
of (25) to (27) to directly fluorinate an organic and/or inorganic
material.
ADVANTAGES OF THE INVENTION
[0054] According to the present invention, F.sub.2 gas can be
prepared from a fluoro compound and used in an amount necessary for
each application, especially for surface modification of a material
or synthetic reaction using F.sub.2 gas, thereby eliminating the
necessity of providing/storing a large amount of hard-to-handle
F.sub.2 gas in advance.
BRIEF EXPLANATION OF THE DRAWINGS
[0055] FIG. 1 shows an example of a surface modification equipment
of the present invention.
THE MOST PREFERRED EMBODIMENTS OF THE INVENTION
[0056] In the present invention, the first zone for conferring
energy on a fluoro compound-containing gas and the second zone for
modifying the surface of an article may be provided in the same
chamber. As used herein, the first zone refers to a space in which
energy is conferred on a fluoro compound-containing gas by an
energy conferring means, and the second zone refers to a space in
which an article to be surface-modified is placed. The first zone
and the second zone are in gaseous communication, and the fluoro
compound-containing gas flows in gas phase from the first zone to
the second zone. The first and second zones may be placed at
different locations in the same chamber. For example, when the
energy conferring means and the means for mounting an article to be
surface-modified are placed at different locations, the space
containing the former is the first zone and the space containing
the latter is the second zone.
[0057] The first zone and the second zone may be different
chambers. In this case, the first zone and the second zone form a
first chamber and a second chamber, respectively. The first chamber
and the second chamber are brought into gaseous communication by
any known method. For example, the first chamber and the second
chamber are connected via a gas channel so that the fluoro
compound-containing gas flows from the first zone to the second
zone via the gas channel.
[0058] A partition wall may be provided between the first zone and
the second zone while keeping communication therebetween. In this
case, the pressure in the first and second zones can be
independently varied by operatively evacuating the first zone
and/or second zone. When the first zone is under reduced pressure
and the second zone is at a pressure higher than that of the first
zone, the excited fluoro compound can be partially or completely
converted into F.sub.2 by raising the pressure. However, conversion
into F.sub.2 is not limited to such an embodiment, but may also be
performed in the first zone or during transportation from the first
zone to the second zone.
[0059] In the present invention, the fluoro compound in the fluoro
compound-containing gas supplied to the first zone is not
specifically limited, but any compound can be used so far as it is
excited by conferring energy and decomposed and then produces
F.sub.2 gas and it is easier to handle than F.sub.2 gas. In terms
of ease of handling, fluoro compounds that are gaseous in use
conditions are preferred. For example, compounds that are gaseous
at 25.degree. C., 1 atm are preferred.
[0060] Fluoro compounds include linear, branched or cyclic
saturated perfluorocarbons; linear, branched or cyclic unsaturated
perfluorocarbons, carbonyl fluorides, perfluoro hypofluorides,
perfluoro peroxides, perfluoroether compounds, oxygen-containing
fluorides, interhalogen fluorides, iodine-containing fluorides,
sulfur-containing fluorides, nitrogen-containing fluorides,
silicon-containing fluorides, rare gas-containing fluorides, or
combinations thereof.
[0061] As used herein, the perfluorocarbon refers to a hydrocarbon
in which all the H atoms have been replaced by F atoms. As used
herein, substituted or unsubstituted hydrocarbon groups without
prefix or without distinction between structural isomers include
all isomers unless otherwise indicated. For example,
C.sub.4F.sub.10 includes n-C.sub.4F.sub.10 and i-C.sub.4F.sub.10.
The cyclic compounds may be monocyclic compounds or polycyclic
compounds, alicyclic compounds or aromatic compounds, or
carbocyclic compounds or heterocyclic compounds.
[0062] The saturated perfluorocarbon refers to a perfluorocarbon
having no carbon-carbon multiple bonds. The number of carbon atoms
in the saturated perfluorocarbon is not specifically limited, but
preferably 1-8, more preferably 1-6. Linear saturated
perfluorocarbons include CF.sub.4, C.sub.2F.sub.6, C.sub.3F.sub.8,
n-C.sub.4F.sub.10, n-C.sub.5F.sub.12, and n-C.sub.6F.sub.14;
branched saturated perfluorocarbons include i-C.sub.4F.sub.10,
i-C.sub.5F.sub.12, C(CF.sub.3).sub.4, i-C.sub.6F.sub.14,
C.sub.3F.sub.7CF (CF.sub.3).sub.2; and cyclic perfluorocarbons
include C.sub.6F.sub.12.
[0063] The unsaturated perfluorocarbon refers to a perfluorocarbon
having at least one carbon-carbon double bond and/or triple bond.
The number of carbon atoms in the unsaturated perfluorocarbon is
not specifically limited, but preferably 2-8, more preferably 2-6.
For example, unsaturated perfluorocarbons include C.sub.2F.sub.4,
C.sub.3F.sub.6, CF(CF.sub.3).dbd.CF(CF.sub.3),
CF.sub.2.dbd.C(C.sub.2F.sub.5) F, CF.sub.2.dbd.C(CF.sub.3).sub.2,
c-C.sub.4F.sub.8, CF.ident.CC.sub.2F.sub.5,
CF.sub.3C.ident.CCF.sub.3, C.sub.5F.sub.10, C.sub.6F.sub.12,
C.sub.2F.sub.2, C.sub.3F.sub.4, C.sub.4F.sub.6.
[0064] The carbonyl fluoride refers to a compound containing a
carbonyl group and fluorine. Carbonyl fluorides include FCOF,
CF.sub.3COF, CF.sub.2(COF).sub.2, and C.sub.3F.sub.7COF.
[0065] The perfluoro peroxide refers to a peroxide in which all the
H atoms have been replaced by F atoms, such as
CF.sub.3OOCF.sub.3.
[0066] The perfluoroether compound refers to an ether in which all
the H atoms have been replaced by F atoms, such as
CF.sub.3OCF.sub.3, C.sub.2F.sub.5OC.sub.2F.sub.5, and
C.sub.2F.sub.4OC.sub.2F.sub.4.
[0067] The perfluoro hypofluoride refers to a compound having a
structure obtained by replacing all the --OH groups of a compound
having at least one --OH group by --OF groups and replacing all the
H atoms other than --OH groups by F atoms. Perfluoro hypofluorides
include CF.sub.3OF, C.sub.2F.sub.5OF, CF.sub.2(OF).sub.2, and
CF.sub.3COOF.
[0068] Oxygen-containing fluorides include OF.sub.2, SOF.sub.2,
SOF.sub.4, NOF and NOF.sub.3 in addition to the carbonyl fluorides,
perfluoro peroxides and perfluoroether compounds described
above.
[0069] The interhalogen fluoride refers to a compound in which a
bond has been formed between a halogen other than fluorine and
fluorine. Interhalogen fluorides include ClF.sub.3, IF.sub.5,
BrF.sub.5, and BrF.sub.3.
[0070] The iodine-containing fluoride refers to a compound
containing iodine and fluorine, such as CF.sub.3I, and
C.sub.2F.sub.5I.
[0071] The nitrogen-containing fluoride refers to a compound
containing nitrogen and fluorine, such as N.sub.2F.sub.4, NF.sub.3,
NOF, NOF.sub.3.
[0072] The silicon-containing fluoride refers to a compound
containing silicon and fluorine, such as SiF.sub.4,
Si.sub.2F.sub.6.
[0073] The rare gas-containing fluoride refers to a compound
containing a rare gas and fluorine, such as XeF.sub.2, XeF.sub.4,
and KrF.sub.2.
[0074] The sulfur-containing fluoride refers to a compound
containing sulfur and fluorine, such as SF.sub.4, SF.sub.6,
SOF.sub.2, and SOF.sub.4.
[0075] These fluoro compounds may be used alone or in
combination.
[0076] The fluoro compound-containing gas supplied to the first
zone may contain a gas other than the fluoro compound. The type and
flow rate of the gas other than the fluoro compound and the
pressure in the first zone is selected depending on the mode of
exciting the fluoro compound in the first zone and the intended
concentration of F.sub.2 generated. When a plasma is generated in
the first zone, an inert gas and/or oxygen can be used as the gas
other than the fluoro compound. Inert gases include He, Ne, Ar, Xe,
Kr, N.sub.2, or a combination thereof. When the fluoro compound is
a nitrogen-containing fluoro compound, Ar is preferred, and when
the fluoro compound is a perfluorocarbon, O.sub.2 is preferred.
[0077] Methods for exciting the fluoro compound by conferring
energy in the first zone are not specifically limited so far as
F.sub.2 is generated after excitation, e.g., plasma ionization,
irradiation, and heating. Excitation refers to transition to an
energy state higher than the ground state. For plasma ionization,
any known method can be used, such as inductively coupled plasma
(ICP), helicon wave plasma, and electron cyclotron resonance plasma
(ECR). Irradiations include UV irradiation and laser irradiation.
If the fluoro compound is thermally decomposed to generate F.sub.2,
heating can be used as energy conferring means.
[0078] The gas containing the fluoro compound excited in the first
zone generates F.sub.2 before it is contacted with an article to be
surface-modified in the second zone. F.sub.2 can be generated at
any site and any time, i.e., it can be generated in the first zone,
or during transportation from the first zone to the second zone, or
in the second zone. When the first zone and second zone are
different chambers, F.sub.2 can be generated in a gas channel
connecting both. F.sub.2 can be generated by any reaction
mechanism, including recombination of the F radicals generated by
excitation, for example.
[0079] When the fluoro compound-containing gas contains two or more
fluoro compounds, F.sub.2 can be generated from all species of
fluoro compounds or a part of species of fluoro compounds can
contribute to F.sub.2 generation. The proportion of fluoro
compounds converted into F.sub.2 is preferably higher, and the
total amounts of fluoro compounds may be converted into F.sub.2.
The gas containing the fluoro compound when it is supplied to the
first zone is herein referred to as "fluoro compound-containing
gas". The gas containing the fluoro compound excited in the first
zone is referred to as "excited fluoro compound-containing gas".
The "excited fluoro compound-containing gas" may sometimes contain
F.sub.2 derived from the excited fluoro compound.
[0080] The fluoro compound-containing gas treated in the first zone
is transported to the second zone. The fluoro compound-containing
gas treated in the first zone may generate F.sub.2 gas in the first
zone or may generate F.sub.2 gas as time goes by. The generation of
F.sub.2 gas can be promoted by increasing the total pressure of the
fluoro compound-containing gas and/or the partial pressure of the
excited fluoro compound. Thus, when the first chamber and the
second chamber communicate via a gas channel, the fluoro
compound-containing gas can be transported to the second chamber
without removing it outside.
[0081] Processes of the present invention offer the advantage that
there is no necessity of providing or transporting or otherwise
handling a large amount of F.sub.2 gas in advance because F.sub.2
gas in an amount necessary for surface modification is prepared in
a first zone by exciting a fluoro compound and consumed in a second
zone. In other words, the conventional problems with handling of
F.sub.2 gas can be solved by storing F.sub.2 gas in the form of a
fluoro compound that is safer and easier to handle than F.sub.2 gas
before surface modification and converting the fluoro compound into
F.sub.2 gas to use it for surface modification.
[0082] After the fluoro compound is excited and before it is
contacted with an article to be surface-modified, the fluoro
compound may be mixed with another gas. The additional gas to be
mixed is preferably an inert gas. The inert gas here has the
meaning as defined above. The additional gas can be introduced
anywhere in the first zone and second zone. When the first zone and
the second zone are different chambers, the additional gas can be
introduced anywhere in the first chamber, in the second chamber,
and in the gas channel connecting the first chamber and the second
chamber.
[0083] At the point when the excited fluoro compound-containing gas
is removed from the first zone, it may contain F.sub.2. In view of
the hazardousness and reactivity of F.sub.2 gas, the F.sub.2 gas
concentration of the F.sub.2-containing gas is preferably low.
[0084] To remove the fluoro compound-containing gas from the first
chamber, the first chamber may be evacuated via a vacuum pump and
the discharged fluoro compound-containing gas may be introduced
into the second chamber. The vacuum pump can be provided in a gas
channel connecting the first chamber and the second chamber. When a
vacuum pump is used, the fluoro compound may be mixed with another
gas between the first chamber and the vacuum pump or between the
vacuum pump and the second chamber.
[0085] The flow rate of the additional gas to be mixed after
removal from the first zone and the pressure in the second zone are
selected depending on the material and surface area of the article
to be surface-modified.
[0086] The article to be surface-modified is not specifically
limited and may be made from any material so far as it reacts with
F.sub.2 gas upon contact with it. Preferably, the surface is
fluorinated by contacting the surface with F.sub.2 gas. Various
properties such as water repellency, oil repellency, soil
resistance and weather resistance can be improved by surface
fluorination. In view of the reaction with F.sub.2 gas, the article
to be surface-modified preferably comprises a metal and/or metal
compound and/or polymer, more preferably comprises a metal and/or
metal compound and/or polymer on the surface.
[0087] Metals include, for example, elemental metals such as iron,
aluminum, titanium, zinc, nickel, tin and copper; and alloys such
as stainless steel and brass. Metal compounds include one or more
members selected from the group consisting of metal oxides, metal
nitrides, metal carbides, metal hydroxides and metal chlorides,
e.g., a compound based on Si, i.e., Si, SiO.sub.2, Si.sub.3N.sub.4,
SiC, polysilicon, amorphous silicon, or a combination thereof. The
compound based on Si may be deposited in an LPCVD equipment.
Polymers include polyethylenes such as HDPE, LDPE, LLDPE;
polypropylene; polyesters such as polyethylene terephthalate and
polyethylene naphthalate; polyvinyl chloride, polyvinylidene
chloride, nylon, polyvinyl acetate, polyvinyl alcohol, polyvinyl
acetal, polystyrene, etc.
[0088] The present invention also relates to a surface modification
equipment comprising a first zone and a second zone, as well as a
surface modification equipment comprising a first chamber, a second
chamber, and a gas channel connecting the first chamber and the
second chamber.
[0089] The first zone includes an energy conferring means, which
confers energy on a fluoro compound-containing gas, thereby
exciting at least one fluoro compound in the fluoro
compound-containing gas. The energy conferring means include plasma
generators, light sources, and heat sources. Plasma generators
include ECR plasma generators, ICP plasma generators, and helical
plasma generators. Light sources include xenon lamps, excimer
lasers, etc. Heat sources include electric furnaces.
[0090] After the fluoro compound is excited in the first zone, the
excited fluoro compound-containing gas is transported to the second
zone. When the first and second zone are different chambers, the
excited fluoro compound-containing gas flows via a gas channel
connecting the first chamber and second chamber. The surface
modification equipment of the present invention may further
comprise a vacuum pump in the gas channel.
[0091] The surface modification equipment of the present invention
may further comprise a means for mixing the excited fluoro
compound-containing gas and an inert gas. The means for mixing the
excited fluoro compound-containing gas and an inert gas is not
specifically limited, and the equipment may be simply designed so
that the excited fluoro compound-containing gas channel and the
inert gas channel join.
[0092] The second zone can include a means for introducing an
article to be surface-modified. The introducing means is not
specifically limited, and a movable stage may be introduced via a
sample introducing chamber. The gas discharged from the second zone
is sent to an exhaust gas treatment facility because F.sub.2 or a
fluoro compound may remain in it.
[0093] An embodiment of the present invention for exciting a fluoro
compound-containing gas by plasma ionization is explained below
with reference to FIG. 1.
[0094] In the surface modification equipment of FIG. 1, the first
chamber includes a plasma generator, which is evacuated to a
pressure suitable for plasma generation, preferably 1-1333 Pa.
After evacuation, a fluoro compound capable of generating F.sub.2
gas by plasma ionization such as an NF.sub.3-containing gas is
supplied to the first chamber. The fluoro compound may be mixed
with another gas such as N.sub.2 or Ar before it is supplied to the
first chamber. In this case, a gas containing the fluoro compound
and the additional gas is supplied to the first chamber as a fluoro
compound-containing gas. In other words, the supplied fluoro
compound-containing gas may be NF.sub.3 alone or a mixed gas of
NF.sub.3 and N.sub.2.
[0095] If NF.sub.3 is completely converted into F.sub.2 as shown
below:
NF.sub.3.fwdarw.1/2N.sub.2+3/2F.sub.2
when the fluoro compound-containing gas is NF.sub.3 alone, 25%
nitrogen gas is generated and therefore, the concentration of the
F.sub.2 gas generated is 75% at maximum. One of preferred features
of the present invention is that substantially complete
decomposition of NF.sub.3 can be achieved.
[0096] As the amount of NF.sub.3 that can be introduced is 100
sccm-5000 sccm, the amount of F.sub.2 gas generated is 150
sccm-7500 sccm. An inert gas is introduced upstream of the treating
chamber if one wishes to use the F.sub.2 gas at a more dilute
concentration than 75%, or it is introduced upstream of the vacuum
pump if one wishes to handle the F.sub.2 gas at a concentration as
low as possible. Alternatively, an inert gas is introduced upstream
of the plasma generator and controlled to a desired concentration
provided that the conditions for generating a plasma are satisfied.
This dilute fluorine gas is introduced into the treating chamber
downstream in the line, in which it is used for surface
modification of an article under reduced pressure or normal
pressure or overpressure.
[0097] The working conditions of the plasma generator in the first
chamber are selected to excite the fluoro compound supplied. The
working conditions are selected to increase the decomposition rate
of the fluoro compound, preferably to completely decompose the
fluoro compound.
[0098] The excited fluoro compound-containing gas is transported
from the first chamber to the second chamber via the gas channel.
In the gas channel, the excited fluoro compound-containing gas is
mixed with another gas to control the F.sub.2 concentration to a
level suitable for surface modification. The additional gas can be
added from any one or more of the three inlets shown in the FIGURE.
Alternatively, no additional gas may be added and a fluoro
compound-containing gas containing a fluoro compound mixed with
another gas may be provided in advance.
[0099] In the second chamber, surface modification takes place. The
gas discharged from the second chamber is introduced into an
exhaust gas treatment facility.
[0100] In the equipment of FIG. 1, the pressure is maintained at a
level lower than atmospheric pressure (or normal pressure) upstream
of the vacuum pump, then at atmospheric pressure downstream of the
vacuum pump and upstream of the surface treating chamber, and then
at reduced pressure or overpressure or atmospheric pressure in the
surface treating chamber. However, the present invention is not
limited to the embodiment of FIG. 1, but the pressure downstream of
the vacuum pump may be raised by adding another gas. Preferred
pressure conditions include 1-1333 Pa upstream of the vacuum pump
and atmospheric pressure or more downstream of the vacuum pump.
INDUSTRIAL APPLICABILITY
[0101] According to the present invention, a large amount of
hard-to-handle F.sub.2 can be easily prepared in any concentration
range when needed. Therefore, it is very useful for all industries
using F.sub.2. Especially, the present invention is useful for
industries taking advantage of the reactivity of F.sub.2 such as
semiconductor manufacturing industry and pharmaceutical and
agricultural chemical manufacturing industry as well as industries
taking advantage of fluorinated materials prepared by reactions
with F.sub.2 such as polymer material manufacturing industry,
inorganic material manufacturing industry, metal material
manufacturing industry, organic material manufacturing industry and
battery material manufacturing industry.
EXAMPLES
[0102] The following examples illustrate the present invention
without, however, limiting the present invention thereto.
Example 1
[0103] F.sub.2 was prepared from a fluoro compound-containing gas
using the equipment of FIG. 1. NF.sub.3 was used as the fluoro
compound gas, and an inductively coupled plasma (ICP) generator
(Litmas Blue 1200 from Landmark Technology) was used as the plasma
generator.
[0104] First, the first chamber including the plasma generator was
evacuated to 1 Torr (133 Pa). Then, NF.sub.3 (flow rate: 200 sccm)
was diluted with Ar (flow rate: 300 sccm) at diluting gas inlet 1
to prepare a fluoro compound-containing gas, and the fluoro
compound-containing gas was supplied to the first chamber. A power
of 1200 W was applied to the plasma generator. The fluoro
compound-containing gas discharged from the first chamber was
diluted again with nitrogen (flow rate: 9300 sccm) at diluting gas
inlet 3 and transported to the treating chamber (second chamber)
maintained under normal pressure downstream of the vacuum pump.
[0105] Theoretically, if NF.sub.3 supplied at the NF.sub.3 flow
rate of the present example is completely decomposed
(NF.sub.3.fwdarw.1/2N.sub.2+3/2F.sub.2), N.sub.2 and F.sub.2 will
be generated at 100 sccm and 300 sccm, respectively. Thus, if
NF.sub.3 is completely decomposed, the F.sub.2 concentration after
dilution with nitrogen will be 3.0 vol %.
[0106] The fluoro compound-containing gas was sampled between the
vacuum pump and the second chamber and analyzed by FT-IR and
titrated with a 10% KI aqueous solution. The FT-IR analyzer used
was FT-IR IGA-2000 from Midac. As a result, the concentration of
F.sub.2 in the fluoro compound-containing gas was 2.9 vol %,
showing that the decomposition rate of NF.sub.3 supplied to the
first chamber was 98%.
[0107] Then, surface treatment of polypropylene plates was
performed in the second chamber. The second chamber used was a
cylindrical vessel made from Ni having an inner volume of 4.6 L.
Five polypropylene plates (hereinafter sometimes abbreviated as PP;
L.times.W.times.H=20 mm.times.20 mm.times.2 mm) were placed in this
vessel and the atmosphere in the second chamber was replaced by
nitrogen gas. Then, the fluoro compound-containing gas obtained by
the operation above was transported into the second chamber and
surface treatment of PP was performed at 25.degree. C. for a
predetermined period. The contact angles on PP surfaces (contact
angles of water expressed in degrees) were measured at various
treating times (the contact angle on PP before treatment: 89
degrees). The measurement results are shown in Table 1 (the
calculated average of five PPs (n=5)).
Example 2
[0108] An experiment similar to Example 1 was performed except that
the flow rate of nitrogen for diluting the fluoro
compound-containing gas discharged from the first chamber including
the plasma generator was changed to 5300 sccm. If NF.sub.3 is
completely decomposed under these conditions, the concentration of
F.sub.2 in the fluoro compound-containing gas transported to the
second chamber maintained under normal pressure downstream of the
vacuum pump will be 5.0 vol %.
[0109] The concentration of F.sub.2 in a sampled fluoro
compound-containing gas was 4.9 vol %, showing that the
decomposition rate of NF.sub.3 was 98%.
[0110] Then, surface treatment of PP was performed in the same
manner as in Example 1 and the contact angles were measured. The
measurement results are shown in Table 1.
TABLE-US-00001 TABLE 1 Contact angles on surfaces (in degrees)
Treating time Example 1 min 5 min 10 min 30 min 60 min 1 89 89 101
104 105 2 94 102 103 105 105
Example 3
[0111] An experiment similar to Example 1 was performed except that
C.sub.2F.sub.6 was used in place of NF.sub.3 as the fluoro
compound, a fluoro compound-containing gas was generated by
diluting C.sub.2F.sub.6 (flow rate: 40 sccm) with O.sub.2 (flow
rate: 160 sccm) and supplied to the first chamber including the
plasma generator and the fluoro compound-containing gas discharged
from the first chamber was diluted with nitrogen at a flow rate of
100 slm.
[0112] In a sampled fluoro compound-containing gas, 710 ppm F.sub.2
gas was detected, and the decomposition rate of C.sub.2F.sub.6
supplied was approximately 100%.
[0113] Then, surface treatment was performed in the same manner as
in Example 1 except that the fluoro compound-containing gas diluted
with nitrogen as described above was used and aluminum plates were
used in place of the polypropylene plates. Five aluminum plates
(hereinafter sometimes abbreviated as Al; L.times.W.times.H=20
mm.times.20 mm.times.2 mm) were placed in a cylindrical vessel made
from Ni having an inner volume of 4.6 L (second chamber) and the
atmosphere in the second chamber was replaced by nitrogen gas.
Then, the fluoro compound-containing gas obtained by the operation
above was transported into the second chamber and surface treatment
of Al was performed at 25.degree. C. for a predetermined period,
and the contact angles on Al surfaces (contact angles of water
expressed in degrees) were measured at various treating times.
[0114] The measurement results are shown in Table 2.
Example 4
[0115] An experiment similar to Example 3 was performed except that
FCOF was used in place of C.sub.2F.sub.6 as the fluoro
compound.
[0116] In a sampled fluoro compound-containing gas, 140 ppm F.sub.2
gas was detected, and the decomposition rate of FCOF supplied was
69%.
[0117] Then, surface treatment of cupper plates (sometimes
abbreviated as Cu) in place of Al was performed and the contact
angles were measured in the same manner as in Example 3. In this
case, Cu was preliminarily acid-washed (Cu was stirred in a 0.1N
HCl solution for 30 min and then washed with water three times) and
heated (heated in the atmosphere at 200.degree. C. for 1 hr and
then allowed to cool in a desiccator). The measurement results are
shown in Table 2.
TABLE-US-00002 TABLE 2 Contact angles on surfaces (in degrees)
Treating time Example 10 min 30 min 60 min 120 min 180 min 3 93 105
109 108 109 4 94 102 109 109 108
Example 5
[0118] Using the equipment of FIG. 1, surface modification of
polypropylene was performed. NF.sub.3 was used as the fluoro
compound gas, and an inductively coupled plasma (ICP) generator
(Litmas Blue 1200 from Landmark Technology) was used as the plasma
generator. A polypropylene (PP) sample of L.times.W.times.H=20
mm.times.20 mm.times.2 mm was placed in the second chamber.
[0119] First, the first chamber was evacuated to 1 Torr. Then,
NF.sub.3 (flow rate: 100 sccm) was diluted with Ar (flow rate: 400
sccm) at inlet 1 to prepare a fluoro compound-containing gas, and
the fluoro compound-containing gas was supplied to the first
chamber. A power of 1200 W was applied to the plasma generator. The
fluoro compound-containing gas discharged from the first chamber
was diluted again with nitrogen (flow rate: 14400 sccm) at inlet 3
and introduced into the second chamber maintained under normal
pressure. If NF.sub.3 is completely decomposed under these
conditions, the concentration of F.sub.2 in the fluoro
compound-containing gas introduced into the second chamber will be
1 vol (the results of sample analyses showed that the F.sub.2
concentration was 0.99 vol % and the decomposition rate was
99%).
[0120] In the second chamber, the PP sample was contacted with the
fluoro compound-containing gas under normal pressure at 24.degree.
C. for 3 hrs.
[0121] The sample surface was analyzed by XPS PHI Quantum 2000 from
ULVAC-PHI. Before treatment, the atomic concentration of carbon on
the sample surface was 83 atom % and the atomic concentration of
fluorine was 0 atom %, but after treatment, the atomic
concentration of carbon was 49 atom % and the atomic concentration
of fluorine was 44 atom %. The results of this analysis by XPS show
that the sample surface has been fluorinated.
[0122] Conditions of analysis by XPS are as follows.
[0123] X-ray source: Al K.alpha. 1486.6 eV monochromatic
[0124] X-ray output: 24.72 W
[0125] X-ray beam diameter: 100.0 mm
[0126] Source to analyzer angle: 45.0.degree.
[0127] Neutralizer energy: 1.0 V
[0128] Neutralizer current: 25.0 nA
[0129] In-depth analyses
[0130] Sputter ion: Ar.sup.+
[0131] Sputter energy: 3.000 keV
[0132] Sputter current: 25.0 nA.
Example 6
[0133] Surface modification of a PP sample was performed in the
same manner as in Example 5 except that NF.sub.3 (flow rate: 200
sccm) was diluted with Ar (flow rate: 300 sccm) to prepare a fluoro
compound-containing gas and the fluoro compound-containing gas
discharged from the first chamber was diluted with nitrogen at a
flow rate of 9300 sccm. If NF.sub.3 is completely decomposed, the
concentration of F.sub.2 in the fluoro compound-containing gas
introduced into the second chamber will be 3 vol % (the results of
sample analyses showed that the F.sub.2 concentration was 2.9 vol %
and the decomposition rate was 99%).
[0134] After surface treatment, the surface of the PP sample was
analyzed by XPS PHI Quantum 2000 from ULVAC-PHI in the same manner
as in Example 5. Before treatment, the atomic concentration of
carbon on the sample surface was 83 atom % and the atomic
concentration of fluorine was 0 atom %, but after treatment, the
atomic concentration of carbon was 41 atom % and the atomic
concentration of fluorine was 53 atom %. These results show that
the sample surface has been fluorinated.
Example 7
[0135] Using the equipment of FIG. 1, an etching test was performed
on a wafer with SiO.sub.2 film. A wafer (25 mm.times.25 mm) having
an SiO.sub.2 film (7500 angstroms) on single-crystal Si was placed
in a cylindrical vessel made from Ni having an inner volume of 4.6
L (second chamber). Upstream of this second chamber, an inductively
coupled plasma (ICP) generator (ASTRONi from ASTeX) was provided as
the plasma generator (first chamber). The atmosphere in the first
and second chambers was replaced by nitrogen. Then, the second
chamber was evacuated to 0.5.times.10.sup.5 Pa, and heated to
predetermined temperatures (260.degree. C. and 310.degree. C.).
NF.sub.3 (1000 sccm) was supplied into the first chamber and
decomposed, and the fluoro compound-containing gas discharged from
the first chamber was diluted with nitrogen (flow rate: 5500 sccm)
at diluting gas inlet 3. The pressure near diluting gas inlet 3 was
normal pressure. Thus, a fluoro compound-containing gas containing
F.sub.2 at a concentration of 20 vol % was generated. Of this
fluoro compound-containing gas, 1000 sccm was transported into the
second chamber maintained at 0.5.times.10.sup.5 Pa and each
predetermined temperature, and the target wafer was surface treated
at each temperature.
[0136] After treatment, the wafer was measured for film thickness
using Nano Spec 3000AF-T from Nanometrics to determine the etching
rate at each predetermined temperature. The results are shown in
Table 3.
TABLE-US-00003 TABLE 3 Etching rate of SiO.sub.2 film (in
angstroms/min) Treating temperature Etching rate 260.degree. C. 60
310.degree. C. 280
Example 8
[0137] Using the surface treatment equipment of FIG. 1, compounds
were fluorinated.
[0138] In the surface treatment equipment of FIG. 1, a 1000 ml PFA
reactor including a temperature-controlled bath was placed at the
position of the treating chamber. In the reactor, 517 g (5.87 mol)
of 1,3-dioxolan-2-one was introduced and molten in the
temperature-controlled bath at 50.degree. C. Then, dissolved gas
components such as air were expelled from the system with a
nitrogen gas stream at a flow rate of 200 sccm fed into the reactor
for 30 min so that the atmosphere in the system was replaced by
nitrogen. Then, F.sub.2 was generated from NF.sub.3 using NF.sub.3
as the fluoro compound-containing gas and an inductively coupled
plasma (ICP) generator (ASTRONi from ASTeX) as the plasma
generator. NF.sub.3 (1000 sccm) was introduced and diluted with
N.sub.2 (3000 sccm) to give approximately 30% of F.sub.2. The
pressure near diluting N.sub.2 gas inlet 3 was normal pressure. Of
the 30% F.sub.2, 350 sccm was introduced into the reactor using a
gas nozzle fitted with an SUS filter (pore diameter 15 .mu.m,
surface area 7.5 cm.sup.2). The reaction solution was constantly
stirred by a stirrer at about 800 rpm to prevent fluorine gas from
locally staying. The liquid phase temperature in the reactor was
maintained at 50-60.degree. C. by an outer temperature-controlled
bath. Simultaneously, the gas phase temperature was maintained at
35-50.degree. C. by condensing/refluxing the vapor of the starting
material, product and by-produced hydrogen fluoride with a
condenser provided at the top of the reactor. Uncondensed gases
such as unreacted fluorine was treated in a scrubber provided
downstream of the condenser.
[0139] When the amount of fluorine introduced reached 10.6 mol (1.8
mol equivalents of the starting material), the reaction was
terminated and the by-produced hydrogen fluoride was distilled off,
and then the residue was washed with water (200 ml) and a 10%
NaHCO.sub.3 aqueous solution (100 ml), extracted with
dichloromethane (6.times.500 ml). The extract was dried over
anhydrous magnesium sulfate, and then dichloromethane was distilled
off. The resulting crude product (590 g) was purified by
distillation to give 480 g of 4-fluoro-1,3-dioxolan-2-one at a
purity of 90% or more (yield about 70%).
[0140] The crude product at a purity of 90% was recrystallized at
15.degree. C. three times to give about 390 g of
4-fluoro-1,3-dioxolan-2-one at a purity of 99% or more.
Comparative Example 1
[0141] In the equipment of FIG. 1, a decomposition experiment of a
fluoro compound (NF.sub.3) was performed to prepare a fluoro
compound-containing gas in the same manner as in Example 1 except
that the first chamber of the plasma generator and the second
chamber of the treating chamber were connected without using the
vacuum pump unlike Example 1 and the pressure in the treating
chamber was maintained at 1.0 Torr similarly to the pressure in the
plasma generator rather than normal pressure.
[0142] In this case, the concentration of F.sub.2 in a sampled
fluoro compound-containing gas was 114 ppm.
Comparative Example 2
[0143] In the equipment of FIG. 1, a decomposition experiment of a
fluoro compound (NF.sub.3) was performed to prepare a fluoro
compound-containing gas in the same manner as in Example 1 except
that the plasma generator and the treating chamber were connected
without using the vacuum pump unlike Example 1 and the fluoro
compound (NF.sub.3) was ionized at 1.0 Torr and the pressure in the
treating chamber was adjusted to 0.48 Torr rather than normal
pressure.
[0144] In this case, the concentration of F.sub.2 in a sampled
fluoro compound-containing gas was 84 ppm.
[0145] In addition to the embodiments explained above, the present
invention includes the following embodiments.
[0146] [A] A surface modification process comprising the steps
of:
[0147] (1) exciting at least one fluoro compound in a fluoro
compound-containing gas by conferring energy on the fluoro
compound-containing gas in a first zone maintained under reduced
pressure;
[0148] (2) transporting the excited fluoro compound-containing gas
containing the excited fluoro compound to a second zone
communicating with the first zone and maintained under normal
pressure or overpressure; and
[0149] (3) contacting an F.sub.2-containing gas containing F.sub.2
gas generated by partial or complete conversion of the excited
fluoro compound with the surface of an article in the second zone
to modify the surface of the article;
[0150] (4) wherein the converted F.sub.2 gas is used before the
fluoro compound excited in the first zone is partially or wholly
contacted with the surface of the article in the second zone.
[0151] [B] A surface modification process comprising the steps
of:
[0152] (1) exciting at least one fluoro compound in a fluoro
compound-containing gas by conferring energy on the fluoro
compound-containing gas under a reduced pressure condition in a
first zone;
[0153] (2) maintaining the pressure in the transportation system
under a normal pressure or overpressure condition during
transportation of the excited fluoro compound-containing gas
containing the excited fluoro compound to a second zone
communicating with the first zone; and
[0154] (3) contacting an F.sub.2-containing gas containing F.sub.2
gas generated by partial or complete conversion of the excited
fluoro compound with the surface of an article in the second zone
to modify the surface of the article;
[0155] (4) wherein the converted F.sub.2 gas is used before the
fluoro compound excited in the first zone is partially or wholly
contacted with the surface of the article in the second zone.
[0156] [C] A surface modification process comprising the steps
of:
[0157] (1) exciting at least one fluoro compound in a fluoro
compound-containing gas by conferring energy on the fluoro
compound-containing gas under a reduced pressure condition in a
first zone;
[0158] (2) partially or completely converting the excited fluoro
compound into an F.sub.2-containing gas containing F.sub.2 by
maintaining the pressure in the first zone under a normal pressure
or overpressure condition;
[0159] (3) transporting the converted F.sub.2-containing gas to a
second zone communicating with the first zone; and
[0160] (4) contacting the F.sub.2-containing gas containing F.sub.2
gas generated by partial or complete conversion of the excited
fluoro compound with the surface of an article in the second zone
to modify the surface of the article;
[0161] (5) wherein the converted F.sub.2 gas is used before the
fluoro compound excited in the first zone is partially or wholly
contacted with the surface of the article in the second zone.
[0162] [D] A surface modification process comprising the steps
of:
[0163] (1) exciting at least one fluoro compound in a fluoro
compound-containing gas by conferring energy on the fluoro
compound-containing gas in a first chamber maintained under reduced
pressure;
[0164] (2) transporting the excited fluoro compound-containing gas
containing the excited fluoro compound from the first chamber to a
second chamber maintained under normal pressure or overpressure via
a gas channel connecting the first chamber and the second chamber;
and
[0165] (3) contacting an F.sub.2-containing gas containing F.sub.2
gas generated by partial or complete conversion of the excited
fluoro compound with the surface of an article in the second
chamber to modify the surface of the article;
[0166] (4) wherein the converted F.sub.2 gas is used before the
fluoro compound excited in the first chamber is partially or wholly
contacted with the surface of the article in the second
chamber.
[0167] [E] A surface modification process comprising the steps
of:
[0168] (1) exciting at least one fluoro compound in a fluoro
compound-containing gas by conferring energy on the fluoro
compound-containing gas under a reduced pressure condition in a
first chamber;
[0169] (2) maintaining the pressure in the transportation system
under a normal pressure or overpressure condition during
transportation of the excited fluoro compound-containing gas
containing the excited fluoro compound from the first chamber to a
second chamber via a gas channel connecting the first chamber and
the second chamber; and
[0170] (3) contacting an F.sub.2-containing gas containing F.sub.2
gas generated by partial or complete conversion of the excited
fluoro compound with the surface of an article in the second
chamber to modify the surface of the article;
[0171] (4) wherein the converted F.sub.2 gas is used before the
fluoro compound excited in the first chamber is partially or wholly
contacted with the surface of the article in the second
chamber.
[0172] [F] A surface modification process comprising the steps
of:
[0173] (1) exciting at least one fluoro compound in a fluoro
compound-containing gas by conferring energy on the fluoro
compound-containing gas under a reduced pressure condition in a
first chamber;
[0174] (2) partially or completely converting the excited fluoro
compound into an F.sub.2-containing gas containing F.sub.2 gas
generated by such conversion by maintaining the pressure in the
first chamber under a normal pressure or overpressure
condition;
[0175] (3) transporting the converted F.sub.2-containing gas from
the first chamber to a second chamber via a gas channel connecting
the first chamber and the second chamber; and
[0176] (4) contacting the F.sub.2-containing gas containing F.sub.2
gas generated by partial or complete conversion of the excited
fluoro compound with the surface of an article in the second
chamber to modify the surface of the article;
[0177] (5) wherein the converted F.sub.2 gas is used before the
fluoro compound excited in the first chamber is partially or wholly
contacted with the surface of the article in the second
chamber.
[0178] [G] The surface modification process of [D] or [E] wherein a
vacuum pump is provided in the gas channel connecting the first
chamber and the second chamber and said vacuum pump is used during
the step of transporting the excited fluoro compound-containing gas
from the first chamber to the second chamber.
[0179] [H] The surface modification process of any one of [A]-[G]
further comprising the step of introducing an inert gas and/or
oxygen after conferring energy on the fluoro compound-containing
gas before contacting the gas with the article to be
surface-modified.
[0180] [I] The surface modification process of any one of [A]-[H]
wherein the energy conferring step comprises ionizing the fluoro
compound-containing gas.
[0181] [J] The surface modification process of any one of [A]-[I]
wherein the fluoro compound is a gaseous fluoro compound selected
from linear, branched or cyclic saturated perfluorocarbons, linear,
branched or cyclic unsaturated perfluorocarbons, carbonyl
fluorides, perfluoro hypofluorides, perfluoro peroxides,
perfluoroether compounds, oxygen-containing fluorides, interhalogen
fluorides, iodine-containing fluorides, sulfur-containing
fluorides, nitrogen-containing fluorides, silicon-containing
fluorides, rare gas-containing fluorides, or combinations
thereof.
[0182] [K] The surface modification process of any one of [A]-[I]
wherein the fluoro compound is selected from CF.sub.4,
C.sub.2F.sub.6, C.sub.3F.sub.8, C.sub.4F.sub.10, C.sub.5F.sub.12,
C.sub.6F.sub.14, C.sub.2F.sub.4, C.sub.3F.sub.6, C.sub.4F.sub.8,
C.sub.5F.sub.10, C.sub.6F.sub.12, C.sub.4F.sub.6, FCOF,
CF.sub.3COF, CF.sub.2(COF).sub.2, C.sub.3F.sub.7COF, CF.sub.3OF,
C.sub.2F.sub.5OF, CF.sub.2(OF).sub.2, CF.sub.3COOF,
CF.sub.3OOCF.sub.3, CF.sub.3COOOF, CF.sub.3OCF.sub.3,
C.sub.2F.sub.5OC.sub.2F.sub.5, C.sub.2F.sub.4OC.sub.2F.sub.4,
OF.sub.2, SOF.sub.2, SOF.sub.4, NOF, ClF.sub.3, IF.sub.5,
BrF.sub.5, BrF.sub.3, CF.sub.3I, C.sub.2F.sub.5I, N.sub.2F.sub.4,
NF.sub.3, NOF.sub.3, SiF.sub.4, Si.sub.2F.sub.6, XeF.sub.2,
XeF.sub.4, KrF.sub.2, SF.sub.4, SF.sub.6, or a mixture thereof.
[0183] [L] The surface modification process of any one of [A]-[K]
wherein the fluoro compound-containing gas comprises an inert gas
and/or oxygen.
[0184] [M] The surface modification process of [L] wherein the
inert gas is He, Ne, Ar, Xe, Kr, N.sub.2, or a combination
thereof.
[0185] [N] The surface modification process of any one of [A]-[M]
wherein the fluoro compound is one or more members selected from
the group consisting of NF.sub.3, C.sub.2F.sub.6, and
COF.sub.2.
[0186] [O] The surface modification process of [N] wherein the
fluoro compound is ionized in the presence of oxygen when it is a
perfluorocarbon or a mixture containing one or more
perfluorocarbons.
[0187] [P] The surface modification process of any one of [A]-[O]
wherein the surface modification is performed by fluorinating the
surface of the article.
[0188] [Q] The surface modification process of any one of [A]-[P]
wherein the article to be surface-modified is a metal and/or metal
compound and/or polymer.
[0189] [R] The surface modification process of [Q] wherein the
polymer is an article based on polypropylene.
[0190] [S] The surface modification process of [Q] wherein the
metal compound is one or more members selected from the group
consisting of metal oxides, metal nitrides, metal carbides, metal
hydroxides and metal chlorides.
[0191] [T] The surface modification process of [Q] wherein the
metal compound is a compound based on Si, especially Si, SiO.sub.2,
Si.sub.3N.sub.4, SiC, polysilicon, amorphous silicon, or a
combination thereof.
[0192] [U] The surface modification process of [T] wherein the
compound based on Si is deposited in an LPCVD equipment.
[0193] [V] A surface modification equipment comprising:
[0194] a first zone including a means for ionizing a fluoro
compound-containing gas under reduced pressure, and
[0195] a second zone communicating with the first zone and
including an article to be surface-modified therein and a means for
contacting a fluorine-containing gas generated by controlling the
pressure under normal pressure or overpressure with the surface of
the article under reduced pressure or overpressure to modify the
surface of the article.
[0196] [W] A surface modification equipment comprising:
[0197] a first chamber including a means for ionizing a fluoro
compound-containing gas under reduced pressure, and
[0198] a second chamber communicating with the first chamber and
including an article to be surface-modified therein and a means for
contacting a fluorine-containing gas generated by controlling the
pressure under normal pressure or overpressure with the surface of
the article under reduced pressure or overpressure to modify the
surface of the article.
[0199] [X] The surface modification equipment of [W] wherein a
vacuum pump or compressor is provided before and/or after the
second chamber.
[0200] [Y] The surface modification equipment of [X] wherein the
first chamber, second chamber, and vacuum pump are successively
connected and the first chamber and second chamber are
independently connected with the vacuum pump or the surface
modification equipment of [X] wherein the first chamber,
compressor, and second chamber are successively connected and the
first chamber and compressor are independently connected with the
second chamber.
[0201] [Z] A method for using the equipment of [V]-[Y] to directly
fluorinate an organic and/or inorganic material.
* * * * *