U.S. patent application number 12/461566 was filed with the patent office on 2010-02-25 for flat-plate loop heat conduction device and manufacturing method thereof.
Invention is credited to Kwun-Yao Ho.
Application Number | 20100044014 12/461566 |
Document ID | / |
Family ID | 41695249 |
Filed Date | 2010-02-25 |
United States Patent
Application |
20100044014 |
Kind Code |
A1 |
Ho; Kwun-Yao |
February 25, 2010 |
Flat-plate loop heat conduction device and manufacturing method
thereof
Abstract
A flat-plate loop heat conduction device and a manufacturing
method thereof. The flat-plate loop heat conduction device includes
an upper flat plate and a lower flat plate overlapping and mating
with each other. Complementary partial evaporation sections,
partial vapor transfer pipes, partial condensing sections and
partial condensing transfer pipes are disposed on the upper and
lower flat plates. After the upper and lower flat plates are mated
with each other, a complete evaporation section, a complete
condensing section, a complete vapor transfer pipe and a complete
condensing transfer pipe are formed in communication with each
other to achieve a heat conduction loop structure for a working
fluid to circulate therein. The flat-plate loop heat conduction
device is easier to manufacture. Moreover, the flat-plate loop heat
conduction device has reinforced structure and is not subject to
damage.
Inventors: |
Ho; Kwun-Yao; (Hsin-Tien
City, TW) |
Correspondence
Address: |
ROSENBERG, KLEIN & LEE
3458 ELLICOTT CENTER DRIVE-SUITE 101
ELLICOTT CITY
MD
21043
US
|
Family ID: |
41695249 |
Appl. No.: |
12/461566 |
Filed: |
August 17, 2009 |
Current U.S.
Class: |
165/104.26 ;
29/890.03 |
Current CPC
Class: |
F28D 1/035 20130101;
Y10T 29/4935 20150115; F28D 15/0266 20130101 |
Class at
Publication: |
165/104.26 ;
29/890.03 |
International
Class: |
F28D 15/00 20060101
F28D015/00; B21D 53/02 20060101 B21D053/02 |
Foreign Application Data
Date |
Code |
Application Number |
Aug 19, 2008 |
CN |
200810145763.X |
Claims
1. A flat-plate loop heat conduction device at least comprising an
upper flat plate and a lower flat plate overlapping and mating with
each other, on a mating face of at least one of the upper and lower
flat plates being disposed at least one partial evaporation
section, one partial vapor transfer pipe, one partial condensing
section and one partial condensing transfer pipe, two ends of the
partial vapor transfer pipe being respectively connected to one end
of the partial evaporation section and one end of the partial
condensing section, two ends of the partial condensing transfer
pipe being respectively connected to the other end of the partial
evaporation section and the other end of the partial condensing
section, whereby after the upper and lower flat plates are mated
with each other, a complete evaporation section, a complete
condensing section, a complete vapor transfer pipe and a complete
condensing transfer pipe are formed between the mating faces of the
upper and lower flat plates in communication with each other to
achieve a loop structure within which a working fluid can
circulate.
2. The flat-plate loop heat conduction device as claimed in claim
1, wherein complementary partial winding passages are arranged in
the partial condensing sections of the upper and lower flat plates,
two ends of the partial winding passages being respectively
connected to the partial vapor transfer pipes and the partial
condensing transfer pipes, capillary structures being disposed on
inner surfaces of the partial winding passages.
3. The flat-plate loop heat conduction device as claimed in claim
1, wherein capillary structures are disposed on inner surfaces of
at least one of the evaporation section, the condensing section,
the vapor transfer pipe and the condensing transfer pipe.
4. The flat-plate loop heat conduction device as claimed in claim
2, wherein capillary structures are disposed on inner surfaces of
at least one of the evaporation section, the condensing section,
the vapor transfer pipe and the condensing transfer pipe.
5. The flat-plate loop heat conduction device as claimed in claim
3, wherein the capillary structures are formed with multiple
channels.
6. The flat-plate loop heat conduction device as claimed in claim
3, wherein the capillary structures are filled with sintered metal
powder or ceramic powder to form porous structures.
7. The flat-plate loop heat conduction device as claimed in claim
1, wherein there are multiple evaporation sections and one
condensing section.
8. The flat-plate loop heat conduction device as claimed in claim
2, wherein there are multiple evaporation sections and one
condensing section.
9. The flat-plate loop heat conduction device as claimed in claim
3, wherein there are multiple evaporation sections and one
condensing section.
10. The flat-plate loop heat conduction device as claimed in claim
1, wherein the upper and lower flat plates have a thickness ranging
from 0.05 cm to 20 cm.
11. The flat-plate loop heat conduction device as claimed in claim
2, wherein the upper and lower flat plates have a thickness ranging
from 0.05 cm to 20 cm.
12. The flat-plate loop heat conduction device as claimed in claim
3, wherein the upper and lower flat plates have a thickness ranging
from 0.05 cm to 20 cm.
13. The flat-plate loop heat conduction device as claimed in claim
7, wherein the upper and lower flat plates have a thickness ranging
from 0.05 cm to 20 cm.
14. The flat-plate loop heat conduction device as claimed in claim
1, wherein the upper and lower flat plates are made of at least one
of the following materials: metal, alloy, ceramic material and
silicon.
15. The flat-plate loop heat conduction device as claimed in claim
2, wherein the upper and lower flat plates are made of at least one
of the following materials: metal, alloy, ceramic material and
silicon.
16. The flat-plate loop heat conduction device as claimed in claim
3, wherein the upper and lower flat plates are made of at least one
of the following materials: metal, alloy, ceramic material and
silicon.
17. The flat-plate loop heat conduction device as claimed in claim
1, wherein radiating fins are disposed at the condensing
section.
18. The flat-plate loop heat conduction device as claimed in claim
2, wherein radiating fins are disposed at the condensing
section.
19. The flat-plate loop heat conduction device as claimed in claim
3, wherein radiating fins are disposed at the condensing
section.
20. The flat-plate loop heat conduction device as claimed in claim
10, wherein radiating fins are disposed at the condensing
section.
21. A manufacturing method of a flat-plate loop heat conduction
device, comprising steps of: preparing an upper flat plate and a
lower flat plate; forming complementary partial evaporation
sections, partial vapor transfer pipes, partial condensing sections
and partial condensing transfer pipe on mating faces of the upper
and lower flat plates respectively, two ends of the partial vapor
transfer pipes being respectively connected to one end of the
partial evaporation sections and one end of the partial condensing
sections, two ends of the partial condensing transfer pipes being
respectively connected to the other end of the partial evaporation
sections and the other end of the partial condensing sections; and
mating the upper and lower flat plates with each other to form a
complete evaporation section, a complete condensing section, a
complete vapor transfer pipe and a complete condensing transfer
pipe between the mating faces of the upper and lower flat plates in
communication with each other, whereby a loop structure is achieved
for a working fluid to circulate therewithin.
22. The manufacturing method of the flat-plate loop heat conduction
device as claimed in claim 19, wherein complementary partial
winding passages are arranged in the partial condensing sections of
the upper and lower flat plates, two ends of the partial winding
passages being respectively connected to the partial vapor transfer
pipes and the partial condensing transfer pipes.
23. The manufacturing method of the flat-plate loop heat conduction
device as claimed in claim 21, wherein capillary structures are
disposed on inner surfaces of at least one of the evaporation
section, the condensing section, the vapor transfer pipe and the
condensing transfer pipe.
24. The manufacturing method of the flat-plate loop heat conduction
device as claimed in claim 23, wherein the capillary structures are
formed with multiple channels.
25. The manufacturing method of the flat-plate loop heat conduction
device as claimed in claim 23, wherein before mating the upper and
lower flat plates with each other, the capillary structures are
filled with sintered metal powder or ceramic powder to form porous
structures.
26. The manufacturing method of the flat-plate loop heat conduction
device as claimed in claim 24, wherein the capillary structures are
filled with sintered metal powder or ceramic powder to form porous
structures.
27. The manufacturing method of the flat-plate loop heat conduction
device as claimed in claim 23, wherein the capillary structures are
formed by means of die-casting, etching, electroplating or laser
processing.
28. The manufacturing method of the flat-plate loop heat conduction
device as claimed in claim 25, wherein the capillary structures are
formed by means of die-casting, etching, electroplating or laser
processing.
29. The manufacturing method of the flat-plate loop heat conduction
device as claimed in claim 21, wherein the upper and lower flat
plates are mated with each other by means of thermal ultrasonic
welding, laser sealing or metal/nonmetal adhesion.
30. The manufacturing method of the flat-plate loop heat conduction
device as claimed in claim 22, wherein the upper and lower flat
plates are mated with each other by means of thermal ultrasonic
welding, laser sealing or metal/nonmetal adhesion
31. The manufacturing method of the flat-plate loop heat conduction
device as claimed in claim 23, wherein the upper and lower flat
plates are mated with each other by means of thermal ultrasonic
welding, laser sealing or metal/nonmetal adhesion.
32. The manufacturing method of the flat-plate loop heat conduction
device as claimed in claim 25, wherein the upper and lower flat
plates are mated with each other by means of thermal ultrasonic
welding, laser sealing or metal/nonmetal adhesion.
33. The manufacturing method of the flat-plate loop heat conduction
device as claimed in claim 27, wherein the upper and lower flat
plates are mated with each other by means of thermal ultrasonic
welding, laser sealing or metal/nonmetal adhesion.
34. The manufacturing method of the flat-plate loop heat conduction
device as claimed in claim 21, wherein the upper and lower flat
plates have a thickness ranging from 0.05 cm to 20 cm.
35. The manufacturing method of the flat-plate loop heat conduction
device as claimed in claim 22, wherein the upper and lower flat
plates have a thickness ranging from 0.05 cm to 20 cm.
36. The manufacturing method of the flat-plate loop heat conduction
device as claimed in claim 23, wherein the upper and lower flat
plates have a thickness ranging from 0.05 cm to 20 cm.
37. The manufacturing method of the flat-plate loop heat conduction
device as claimed in claim 21, wherein the upper and lower flat
plates are made of at least one of the following materials: metal,
alloy, ceramic material and silicon.
38. The manufacturing method of the flat-plate loop heat conduction
device as claimed in claim 22, wherein the upper and lower flat
plates are made of at least one of the following materials: metal,
alloy, ceramic material and silicon.
39. The manufacturing method of the flat-plate loop heat conduction
device as claimed in claim 23, wherein the upper and lower flat
plates are made of at least one of the following materials: metal,
alloy, ceramic material and silicon.
40. The manufacturing method of the flat-plate loop heat conduction
device as claimed in claim 25, wherein the upper and lower flat
plates are made of at least one of the following materials: metal,
alloy, ceramic material and silicon.
41. The manufacturing method of the flat-plate loop heat conduction
device as claimed in claim 27, wherein the upper and lower flat
plates are made of at least one of the following materials: metal,
alloy, ceramic material and silicon.
42. The manufacturing method of the flat-plate loop heat conduction
device as claimed in claim 28, wherein the upper and lower flat
plates are made of at least one of the following materials: metal,
alloy, ceramic material and silicon.
43. The manufacturing method of the flat-plate loop heat conduction
device as claimed in claim 21, wherein radiating fins are disposed
at the condensing section.
44. The manufacturing method of the flat-plate loop heat conduction
device as claimed in claim 22, wherein radiating fins are disposed
at the condensing section.
45. The manufacturing method of the flat-plate loop heat conduction
device as claimed in claim 23, wherein radiating fins are disposed
at the condensing section.
46. The manufacturing method of the flat-plate loop heat conduction
device as claimed in claim 25, wherein radiating fins are disposed
at the condensing section.
47. The manufacturing method of the flat-plate loop heat conduction
device as claimed in claim 27, wherein radiating fins are disposed
at the condensing section.
48. The manufacturing method of the flat-plate loop heat conduction
device as claimed in claim 28, wherein radiating fins are disposed
at the condensing section.
Description
BACKGROUND OF THE INVENTION
[0001] The present invention relates generally to a heat conduction
device, and more particularly to a flat-plate loop heat conduction
device and a manufacturing method thereof.
[0002] It is known that loop heat pipe is a heat dissipation device
often applied to various electronic components, notebook computers,
LED lighting systems, televisions, mechanical equipments, etc.
[0003] FIG. 1 shows a conventional loop heat pipe structure 10
including an evaporation section 12 with internal capillary
structure, a compensation chamber 14 and a condensing section 16
arranged on a metal board. These components are connected with
vapor transfer pipe 17 and condensing transfer pipe 18 to form a
closed loop structure within which a working fluid flows. The
evaporation section 12 serves to absorb heat transferred from a
heat source. The working fluid in the evaporation section 12 will
absorb the heat and phase-change into vapor. The vapor is
transferred through the vapor transfer pipe 17 to the condensing
section 16. In the condensing section 16, the working fluid is
condensed and phase-changed back into liquid. Then the capillary
structure of the evaporation section 12 applies capillary
attraction to the liquid, whereby the liquid flows back into the
evaporation section 12 to complete a circulation loop.
[0004] The conventional loop heat pipe 10 has very fine structure
so that it is hard to mass-produce such loop heat pipe 10.
Moreover, the evaporation section 12, the vapor transfer pipe 17
and the condensing transfer pipe 18 are generally positioned
outside the metal board of the condensing section 16. That is, only
the condensing section 16 is supported by the metal board 161,
while other components are not supported by any support structure.
As a result, the structure is not rigid enough as a whole.
Therefore, when installing the loop heat pipe into an electronic
device or uninstalling the loop heat pipe therefrom, an operator
must be very careful so as not to damage the loop heat pipe.
SUMMARY OF THE INVENTION
[0005] It is therefore a primary object of the present invention to
provide a flat-plate loop heat conduction device and a
manufacturing method thereof. The flat-plate loop heat conduction
device is composed of at least two flat plates overlapping and
mating with each other. The flat-plate loop heat conduction device
has simplified structure and is easier to manufacture.
[0006] To achieve the above and other objects, the flat-plate loop
heat conduction device of the present invention includes an upper
flat plate and a lower flat plate overlapping and mating with each
other. Complementary partial evaporation sections, partial vapor
transfer pipes, partial condensing sections and partial condensing
transfer pipes are disposed on the mating faces of the upper and
lower flat plates. The partial vapor transfer pipes are
respectively connected to one end of the partial evaporation
section and one end of the partial condensing section. The partial
condensing transfer pipes are respectively connected to the other
end of the partial evaporation section and the other end of the
partial condensing section. Capillary structures are disposed on
inner surfaces of the partial evaporation sections and the partial
condensing transfer pipes of the upper and lower flat plates. After
the upper and lower flat plates are mated with each other, a
complete evaporation section, a complete condensing section, a
complete vapor transfer pipe and a complete condensing transfer
pipe are formed in communication with each other to achieve a loop
structure within which a working fluid can circulate.
[0007] The manufacturing method of the flat-plate loop heat
conduction device of the present invention includes steps of:
preparing an upper flat plate and a lower flat plate; forming
complementary partial evaporation sections, partial vapor transfer
pipes, partial condensing sections and partial condensing transfer
pipe on the upper and lower flat plates by means of etching,
electroplating or laser processing, the partial vapor transfer
pipes being respectively connected to one end of the partial
evaporation sections and one end of the partial condensing
sections, the partial condensing transfer pipes being respectively
connected to the other end of the partial evaporation sections and
the other end of the partial condensing sections, capillary
structures being formed on inner surfaces of the partial
evaporation sections and the partial condensing transfer pipes by
means of die-casting, etching, electroplating or laser processing;
and mating the upper and lower flat plates with each other to form
a complete evaporation section, a complete condensing section, a
complete vapor transfer pipe and a complete condensing transfer
pipe between the mating faces of the upper and lower flat plates in
communication with each other, whereby a loop structure is achieved
for a working fluid to circulate therewithin.
[0008] The present invention can be best understood through the
following description and accompanying drawings wherein:
BRIEF DESCRIPTION OF THE DRAWINGS
[0009] FIG. 1 is a perspective view of a conventional loop heat
pipe;
[0010] FIG. 2 is a perspective assembled view of the flat-plate
loop heat conduction device of the present invention;
[0011] FIG. 3 is a perspective exploded view of the flat-plate loop
heat conduction device of the present invention;
[0012] FIG. 4 is a sectional view of the flat-plate loop heat
conduction device of the present invention;
[0013] FIG. 5 is a sectional view taken along line A-A of FIG. 4,
showing the capillary structures formed on the inner surface of the
evaporation section;
[0014] FIG. 6 is a sectional view taken along line B-B of FIG. 4,
showing the capillary structures formed on the inner surface of the
winding passage; and
[0015] FIG. 7 is a flow chart of the manufacturing method of the
flat-plate loop heat conduction device of the present
invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0016] Please refer to FIG. 2, which is a perspective view of the
flat-plate loop heat conduction device of the present invention.
The flat-plate loop heat conduction device 20 includes an upper
flat plate 22 and a lower flat plate 24. The thickness of the upper
and lower flat plates 22, 24 ranges from 0.05 cm to 20 cm. The
upper and lower flat plates 22, 24 can be made of metal, alloy or
ceramic material.
[0017] Please refer to FIG. 3, which shows the structures of the
upper and lower flat plates 22, 24. The upper and lower flat plates
22, 24 respectively have complementary partial evaporation sections
261, 262, partial vapor transfer pipes 281, 282, partial condensing
sections 301, 302 and partial condensing transfer pipes 321, 322.
The inlet ends 2810, 2820 and outlet ends 2811, 2821 of the partial
vapor transfer pipes 281, 282 are respectively connected to the
outlet ends 2611, 2621 of the partial evaporation sections 261, 262
and the inlet ends 3010, 3020 of the partial condensing sections
301, 302. The inlet ends 3210, 3220 of the partial condensing
transfer pipes 321, 322 are respectively connected to the outlet
ends 3011, 3021 of the partial condensing sections 301, 302 and the
inlet ends 2610, 2620 of the partial evaporation sections 261, 262.
In addition, partial winding passages 341, 342 are arranged in the
partial condensing sections 301, 302. Two ends of the partial
winding passages 341, 342, that is, the inlet end 3010 and the
outlet end 3011, are respectively connected to the partial vapor
transfer pipes 281, 282 and the inlet ends 3210, 3220 of the
partial condensing transfer pipes 321, 322. The other parts of the
flat plates 22, 24 are flat sealingly connected sections 23,
25.
[0018] According to the above arrangement, when the upper and lower
flat plates 22, 24 are mated with and attached to each other as
shown in FIG. 2, a complete flat-plate loop heat conduction device
20 is achieved. In the flat-plate loop heat conduction device 20
are formed a complete evaporation section 26, a complete vapor
transfer pipe 28, a complete condensing section 30, a complete
condensing transfer pipe 32 and a complete winding passage 34.
Accordingly, a working fluid can circulate within the flat-plate
loop heat conduction device 20 for heat exchange as shown in FIG.
2.
[0019] Please further refer to FIGS. 4, 5 and 6. On the upper and
lower flat plates 22, 24, capillary structures 38 are disposed on
inner surfaces of the partial evaporation sections 261, 262, the
partial condensing transfer pipes 321, 322 and the partial winding
passages 341, 342 of the partial condensing sections 301, 302.
FIGS. 5 and 6 are sectional views taken along line A-A and line B-B
of FIG. 4, showing the capillary structures of the evaporation
section 26 and the winding passage 34 of the condensing section 30.
The capillary structures 38 are formed with multiple channels or
filled with sintered metal powder or ceramic powder. Alternatively,
the capillary structures 38 are meshed texture or any other
suitable porous structure for achieving capillarity.
[0020] When the evaporation section 26 absorbs the heat transferred
from the heat source, the working fluid in the evaporation section
26 will absorb the heat and phase-change into vapor phase. The
vapor-phase working fluid flows through the vapor transfer pipe 28
into the condensing section 30. Thereafter, the vapor-phase working
fluid is condensed and phase-changed back into liquid-phase working
fluid. Then the internal capillary structures of the condensing
section 30, the condensing transfer pipe 32 and the evaporation
section 26 apply capillary attraction to the liquid-phase working
fluid. Accordingly, the liquid-phase working fluid quickly flows
back to the evaporation section 26 to complete a circulation loop
and achieve heat dissipation effect.
[0021] The present invention includes at least one evaporation
section 26 and at least one condensing section. The number of the
evaporation section 26 can be increased according to the
requirement of the heat source. In this case, one condensing
section 30 is for multiple evaporation sections 26. Multiple
radiating fins (not shown) can be disposed at the condensing
section 30 to enhance condensing effect.
[0022] Please now refer to FIG. 7, which is a flow chart of the
manufacturing method of the flat-plate loop heat conduction device
of the present invention. The method includes steps S1, S2, and S3.
In step S1, at least two flat plates are prepared, that is, an
upper flat plate and a lower flat plate. By means of etching,
electroplating or laser processing, the upper and lower flat plates
are formed with complementary partial evaporation sections, partial
vapor transfer pipes, partial condensing sections and partial
condensing transfer pipes. Complementary partial winding passages
are arranged in the partial condensing sections. The partial
winding passages can be combined into a complete winding passage.
The partial vapor transfer pipes are respectively connected to
first ends of the partial evaporation sections and the partial
condensing sections. The partial condensing transfer pipes are
respectively connected to second ends of the partial evaporation
sections and the partial condensing sections. Two ends of the
partial winding passages are respectively connected to the partial
vapor transfer pipes and the partial condensing transfer pipes. In
step S2, by means of die-casting, etching, electroplating or laser
processing, capillary structures are formed on inner surfaces of
the partial evaporation sections, the partial condensing transfer
pipes and the partial winding passages. The capillary structures
are formed with multiple channels or filled with sintered metal
powder or ceramic powder. Alternatively, the capillary structures
are formed of any other suitable porous material. Finally, in step
S3, by means of thermal ultrasonic welding, laser sealing or
metal/nonmetal adhesion, the upper and lower flat plates are mated
with each other to form a complete flat-plate loop heat conduction
device. In the flat-plate loop heat conduction device are formed a
complete evaporation section, a complete condensing section, a
complete vapor transfer pipe, a complete condensing transfer pipe
and a complete winding passage in communication with each other. A
working fluid can circulate within the flat-plate loop heat
conduction device. In order to enhance the condensing effect of the
condensing section, multiple radiating fins can be disposed at the
condensing section.
[0023] Alternatively, the flat-plate loop heat conduction device
can include three or more flat plates, which are connected with
each other to form the complete circulation loop.
[0024] According to the above arrangement, the heat conduction
structure of the present invention is composed of at least two flat
plates. This facilitates processing and reduces difficulty in
manufacturing of the capillary structures. Accordingly, the present
invention can be more easily manufactured.
[0025] The above embodiments are only used to illustrate the
present invention, not intended to limit the scope thereof. Many
modifications of the above embodiments can be made without
departing from the spirit of the present invention.
* * * * *