Ho; Kwun-Yao
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ho; Kwun-Yao.The latest application filed is for "light-emitting semiconductor packaging structure without wire bonding".
Company Profile
0.44.63
- Ho; Kwun-Yao - Taipei Hsien TW
- HO; Kwun-Yao - Hsin-Tien City TW
- Ho; Kwun-Yao - Hsin-Tien TW
- Ho; Kwun Yao - Taipei TW
- Ho; Kwun-Yao - Hsien-Tien TW
- Ho, Kwun-Yao - Hsien-Tien City TW
- Ho, Kwun-Yao - US
Patent Activity
| Patent | Date |
|---|---|
| Multi-chip package Grant 8,269,329 - Kung , et al. September 18, 2 | 2012-09-18 |
| Light-emitting semiconductor packaging structure without wire bonding App 20100084673 - HO; Kwun-Yao | 2010-04-08 |
| Flat-plate loop heat conduction device and manufacturing method thereof App 20100044014 - Ho; Kwun-Yao | 2010-02-25 |
| Chip package Grant 7,638,881 - Chang , et al. December 29, 2 | 2009-12-29 |
| Electronic Apparatus App 20090296330 - Ho; Kwun-Yao ; et al. | 2009-12-03 |
| Manufacturing process of a chip package structure Grant 7,622,326 - Ho , et al. November 24, 2 | 2009-11-24 |
| Multi-chip package App 20090200651 - Kung; Moriss ; et al. | 2009-08-13 |
| Chip and manufacturing method and application thereof Grant 7,504,726 - Ho , et al. March 17, 2 | 2009-03-17 |
| Multi-conducting through hole structure Grant 7,470,864 - Ho , et al. December 30, 2 | 2008-12-30 |
| Chip package and bump connecting structure thereof Grant 7,382,049 - Ho , et al. June 3, 2 | 2008-06-03 |
| Chip And Manufacturing Method And Application Thereof App 20080122077 - Ho; Kwun-Yao ; et al. | 2008-05-29 |
| Electronic Apparatus App 20080084677 - Ho; Chih-Long ; et al. | 2008-04-10 |
| Low coefficient of thermal expansion build-up layer packaging and method thereof Grant 7,342,317 - Ho , et al. March 11, 2 | 2008-03-11 |
| Chip package and fabricating method thereof App 20070222072 - Chang; Chia-Jung ; et al. | 2007-09-27 |
| Chip carrier with oxidation protection layer Grant 7,247,951 - Ho , et al. July 24, 2 | 2007-07-24 |
| Semiconductor package and fabricating method thereof App 20070164447 - Ho; Kwun-Yao ; et al. | 2007-07-19 |
| Conductive block mounting process for electrical connection Grant 7,235,429 - Ho , et al. June 26, 2 | 2007-06-26 |
| Bumpless chip package and fabricating process thereof App 20070069352 - Ho; Kwun-Yao ; et al. | 2007-03-29 |
| Chip package and bump connecting structure thereof App 20070045869 - Ho; Kwun-Yao ; et al. | 2007-03-01 |
| Stacked multi-chip package Grant 7,180,166 - Ho , et al. February 20, 2 | 2007-02-20 |
| Integrated circuit package with a balanced-part structure Grant 7,176,559 - Ho , et al. February 13, 2 | 2007-02-13 |
| High performance thermally enhanced package and method of fabricating the same Grant 7,173,341 - Ho , et al. February 6, 2 | 2007-02-06 |
| Manufacturing Process Of A Chip Package Structure App 20060231863 - Ho; Kwun-Yao ; et al. | 2006-10-19 |
| Flip chip package and the fabrication thereof App 20060220245 - Ho; Kwun-Yao ; et al. | 2006-10-05 |
| Electrical package capable of increasing the density of bonding pads and fine circuit lines inside a interconnection Grant 7,071,569 - Ho , et al. July 4, 2 | 2006-07-04 |
| Assembly structure and method for embedded passive device App 20060118931 - Ho; Kwun-Yao ; et al. | 2006-06-08 |
| Packaging substrate without plating bar and a method of forming the same Grant 7,033,917 - Ho , et al. April 25, 2 | 2006-04-25 |
| Cavity-down stacked multi-chip package App 20060071314 - Ho; Kwun-Yao ; et al. | 2006-04-06 |
| Chip carrier and chip package structure thereof App 20060055023 - Ho; Kwun-Yao ; et al. | 2006-03-16 |
| Multi-conducting through hole structure App 20060012030 - Ho; Kwun-Yao ; et al. | 2006-01-19 |
| Circuit board and fabricating process thereof Grant 6,981,320 - Ho , et al. January 3, 2 | 2006-01-03 |
| High density laminated substrate structure and manufacture method thereof Grant 6,977,348 - Ho , et al. December 20, 2 | 2005-12-20 |
| Module board having embedded chips and components and method of forming the same Grant 6,972,964 - Ho , et al. December 6, 2 | 2005-12-06 |
| Packaging substrate without plating bar and a method of forming the same App 20050266608 - Ho, Kwun-Yao ; et al. | 2005-12-01 |
| Fine-pitch packaging substrate and a method of forming the same App 20050258551 - Ho, Kwun-Yao ; et al. | 2005-11-24 |
| Stacked multi-chip package App 20050253224 - Ho, Kwun-Yao ; et al. | 2005-11-17 |
| Multi-chip package and manufacturing method thereof Grant 6,960,826 - Ho , et al. November 1, 2 | 2005-11-01 |
| Vertical routing structure Grant 6,946,727 - Ho , et al. September 20, 2 | 2005-09-20 |
| Process of plating through hole App 20050196898 - Ho, Kwun-Yao ; et al. | 2005-09-08 |
| Low coefficient of thermal expansion build-up layer packaging and method thereof App 20050189644 - Ho, Kwun-Yao ; et al. | 2005-09-01 |
| Electrical connection device between a pin-typed IC package and a circuit board Grant 6,929,488 - Kung , et al. August 16, 2 | 2005-08-16 |
| Bump process for flip chip package Grant 6,916,687 - Ho , et al. July 12, 2 | 2005-07-12 |
| Lamination process and structure of high layout density substrate Grant 6,913,814 - Ho , et al. July 5, 2 | 2005-07-05 |
| Module board having embedded chips and components and method of forming the same App 20050122698 - Ho, Kwun-Yao ; et al. | 2005-06-09 |
| Process of forming bonding columns Grant 6,902,997 - Ho , et al. June 7, 2 | 2005-06-07 |
| Method of fabricating circuit substrate Grant 6,896,173 - Ho , et al. May 24, 2 | 2005-05-24 |
| Tab package Grant 6,894,904 - Kung , et al. May 17, 2 | 2005-05-17 |
| Pattern formation process for an integrated circuit substrate Grant 6,881,662 - Kung , et al. April 19, 2 | 2005-04-19 |
| Chip scale package with heat dissipating part Grant 6,876,087 - Ho , et al. April 5, 2 | 2005-04-05 |
| Module board having embedded chips and components and method of forming the same Grant 6,865,089 - Ho , et al. March 8, 2 | 2005-03-08 |
| Bump transfer fixture App 20050035453 - Ho, Kwun-Yao ; et al. | 2005-02-17 |
| [electrical Package And Manufacturing Method Thereof] App 20050035464 - Ho, Kwun-Yao ; et al. | 2005-02-17 |
| [multi-chip Package And Manufacturing Method Thereof] App 20050029644 - Ho, Kwun-Yao ; et al. | 2005-02-10 |
| Conductive block mounting process for electrical connection App 20050026330 - Ho, Kwun-Yao ; et al. | 2005-02-03 |
| High density integrated circuit packages and method for the same Grant 6,849,955 - Ho , et al. February 1, 2 | 2005-02-01 |
| Process of forming bonding columns Grant 6,849,534 - Ho , et al. February 1, 2 | 2005-02-01 |
| [multi-chip Package] App 20050017336 - Kung, Moriss ; et al. | 2005-01-27 |
| [method Of Fabricating Circuit Substrate] App 20050017058 - Ho, Kwun-Yao ; et al. | 2005-01-27 |
| Under-bump metallugical structure App 20050012211 - Kung, Moriss ; et al. | 2005-01-20 |
| Integrated circuit package with a balanced-part structure App 20050012189 - Ho, Kwun Yao ; et al. | 2005-01-20 |
| Process of forming bonding columns App 20050003651 - Ho, Kwun-Yao ; et al. | 2005-01-06 |
| Circuit board and fabricating process thereof App 20040238215 - Ho, Kwun-Yao ; et al. | 2004-12-02 |
| [bump Process For Flip Chip Package] App 20040241911 - HO, KWUN-YAO ; et al. | 2004-12-02 |
| Vertical routing structure App 20040211594 - Ho, Kwun-Yao ; et al. | 2004-10-28 |
| Hybrid interconnect substrate and method of manufacture thereof Grant 6,808,643 - Ho , et al. October 26, 2 | 2004-10-26 |
| Method and structure for tape ball grid array package Grant 6,779,783 - Kung , et al. August 24, 2 | 2004-08-24 |
| Vertical routing structure App 20040155347 - Ho, Kwun-Yao ; et al. | 2004-08-12 |
| [chip Package Structure And Manufacturing Process Thereof] App 20040155357 - HO, KWUN-YAO ; et al. | 2004-08-12 |
| High-density multichip module package App 20040124513 - Ho, Kwun Yao ; et al. | 2004-07-01 |
| Lamination process and structure of high layout density substrate App 20040105955 - Ho, Kwun Yao ; et al. | 2004-06-03 |
| Method for manufacturing multi-layer package substrates Grant 6,743,659 - Kung , et al. June 1, 2 | 2004-06-01 |
| Process of forming bonding columns App 20040082161 - Ho, Kwun-Yao ; et al. | 2004-04-29 |
| Hybrid interconnect substrate and method of manufacture thereof App 20040074865 - Ho, Kwun-Yao ; et al. | 2004-04-22 |
| Electronic assembly Grant 6,724,081 - Ho , et al. April 20, 2 | 2004-04-20 |
| Electrical connection device App 20040072462 - Kung, Moriss ; et al. | 2004-04-15 |
| Flexible electric-contact structure for IC package Grant 6,716,037 - Kung , et al. April 6, 2 | 2004-04-06 |
| High density integrated circuit package Grant 6,717,264 - Ho , et al. April 6, 2 | 2004-04-06 |
| Combination device of the IC connection device and the main board Grant 6,711,025 - Ho , et al. March 23, 2 | 2004-03-23 |
| Chip package structure Grant 6,707,162 - Ho , et al. March 16, 2 | 2004-03-16 |
| High density integrated circuit packages and method for the same App 20040046264 - Ho, Kwun Yao ; et al. | 2004-03-11 |
| Tab Package And Method For Fabricating The Same App 20040042185 - Kung, Moriss ; et al. | 2004-03-04 |
| Pin grid array integrated circuit connecting device Grant 6,699,046 - Ho , et al. March 2, 2 | 2004-03-02 |
| High performance thermally enhanced package and method of fabricating the same App 20040036154 - Ho, Kwun-Yao ; et al. | 2004-02-26 |
| Chip Scale Package And Manufacturing Method Therefor App 20040036180 - HO, KWUN-YAO ; et al. | 2004-02-26 |
| Thin planar heat distributor Grant 6,695,040 - Kung , et al. February 24, 2 | 2004-02-24 |
| Metal post manufacturing method Grant 6,696,305 - Kung , et al. February 24, 2 | 2004-02-24 |
| Electrical connection device Grant 6,692,265 - Kung , et al. February 17, 2 | 2004-02-17 |
| Flexible electric-contact structure for IC package App 20040018753 - Kung, Moriss ; et al. | 2004-01-29 |
| Module board having embedded chips and components and method of forming the same App 20040001324 - Ho, Kwun Yao ; et al. | 2004-01-01 |
| Method for high layout density integrated circuit package substrate Grant 6,667,190 - Kung , et al. December 23, 2 | 2003-12-23 |
| Under-bump metallugical structure App 20030222352 - Kung, Chen-Yueh ; et al. | 2003-12-04 |
| High density laminated substrate structure and manufacture method thereof App 20030223207 - Ho, Kwun-Yao ; et al. | 2003-12-04 |
| Method For High Layout Density Integrated Circuit Package Substrate App 20030218250 - Kung, Moriss ; et al. | 2003-11-27 |
| High-density integrated circuit package and method for the same App 20030218249 - Ho, Kwun-Yao ; et al. | 2003-11-27 |
| Fine patterning and fine solid via process for multi-layer substrate App 20030215566 - Kung, Moriss ; et al. | 2003-11-20 |
| Ultra fine patterning process for multi-layer substrate App 20030196987 - Kung, Moriss ; et al. | 2003-10-23 |
| Pattern formation process for an integrated circuit substrate App 20030190799 - Kung, Moriss ; et al. | 2003-10-09 |
| Pin-typed electric connection device App 20030143884 - Kung, Moriss ; et al. | 2003-07-31 |
| Metal post manufacturing method App 20030139032 - Kung, Moriss ; et al. | 2003-07-24 |
| Combination device of the IC connection device and the main board App 20030112612 - Ho, Kwun-Yao ; et al. | 2003-06-19 |
| Method for manufacturing multi-layer package substrates App 20030113951 - Kung, Moriss ; et al. | 2003-06-19 |
| Electrical connection device App 20030114023 - Kung, Moriss ; et al. | 2003-06-19 |
| Method and structure for tape ball grid array package App 20030100212 - Kung, Chen-Yueh ; et al. | 2003-05-29 |
| Structure of a ball-grid array package substrate and processes for producing thereof Grant 6,569,712 - Ho , et al. May 27, 2 | 2003-05-27 |
| Replaceable integrated circuit device App 20030094692 - Ho, Kwun-Yao ; et al. | 2003-05-22 |
| Pin grid array integrated circuit connecting device App 20030096514 - Ho, Kwun-Yao ; et al. | 2003-05-22 |
| Structure Of A Ball-grid Array Package Substrate And Processes For Producing Thereof App 20030075357 - Ho, Kwun-Yao ; et al. | 2003-04-24 |
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