U.S. patent application number 11/930210 was filed with the patent office on 2010-02-18 for low fabrication cost, high performance, high reliability chip scale package.
This patent application is currently assigned to MEGICA CORPORATION. Invention is credited to Ching-Cheng Huang, Jin-Yuan Lee, Ming-Ta Lei, Chuen-Jye Lin.
Application Number | 20100038803 11/930210 |
Document ID | / |
Family ID | 29271087 |
Filed Date | 2010-02-18 |
United States Patent
Application |
20100038803 |
Kind Code |
A9 |
Lee; Jin-Yuan ; et
al. |
February 18, 2010 |
LOW FABRICATION COST, HIGH PERFORMANCE, HIGH RELIABILITY CHIP SCALE
PACKAGE
Abstract
The invention provides a new method and chip scale package is
provided. The inventions starts with a substrate over which a
contact point is provided, the contact point is exposed through an
opening created in the layer of passivation and a layer of polymer
or elastomer. A barrier/seed layer is deposited, a first
photoresist mask is created exposing the barrier/seed layer where
this layer overlies the contact pad and, contiguous therewith, over
a surface area that is adjacent to the contact pad and emanating in
one direction from the contact pad. The exposed surface of the
barrier/seed layer is electroplated for the creation of
interconnect traces. The first photoresist mask is removed from the
surface of the barrier/seed layer. A second photoresist mask,
defining the solder bump, is created exposing the surface area of
the barrier/seed layer that is adjacent to the contact pad and
emanating in one direction from the contact pad. The solder bump is
created in accordance with the second photoresist mask, the second
photoresist mask is removed from the surface of the barrier/seed
layer, exposing the electroplating and the barrier/seed layer with
the metal plating overlying the barrier/seed layer. The exposed
barrier/seed layer is etched in accordance with the pattern formed
by the electroplating, reflow of the solder bump is optionally
performed.
Inventors: |
Lee; Jin-Yuan; (Hsin-Chu,
TW) ; Lei; Ming-Ta; (Hsin-Chu, TW) ; Huang;
Ching-Cheng; (Hsinchu, TW) ; Lin; Chuen-Jye;
(Taichung Hsien, TW) |
Correspondence
Address: |
McDermott Will & Emery LLP
11682 El Camino Real
Suite 400
San Diego
CA
92130
US
|
Assignee: |
MEGICA CORPORATION
Room 301/302, No. 47, Park 2nd Rd., Science-Based Industrial
Park
Hsinchu
TW
300
|
Prior
Publication: |
|
Document Identifier |
Publication Date |
|
US 20080099928 A1 |
May 1, 2008 |
|
|
Family ID: |
29271087 |
Appl. No.: |
11/930210 |
Filed: |
October 31, 2007 |
Related U.S. Patent Documents
|
|
|
|
|
|
Application
Number |
Filing Date |
Patent Number |
|
|
11136650 |
May 24, 2005 |
7338890 |
|
|
11930210 |
Oct 31, 2007 |
|
|
|
10638454 |
Aug 11, 2003 |
6917119 |
|
|
11136650 |
May 24, 2005 |
|
|
|
09953525 |
Sep 17, 2001 |
6642136 |
|
|
10638454 |
Aug 11, 2003 |
|
|
|
Current U.S.
Class: |
257/781 ;
257/E23.141 |
Current CPC
Class: |
H01L 2924/01022
20130101; H01L 2924/01033 20130101; H01L 2224/11901 20130101; H01L
2924/01013 20130101; H01L 2224/02311 20130101; H01L 2924/01041
20130101; H05K 2203/043 20130101; H01L 21/565 20130101; H01L
2224/11831 20130101; H01L 2924/30107 20130101; H01L 21/563
20130101; H01L 2924/00013 20130101; H01L 2924/09701 20130101; H05K
3/108 20130101; H01L 2224/03912 20130101; H01L 2224/0401 20130101;
H01L 2924/01042 20130101; H01L 2224/05599 20130101; H01L 2924/351
20130101; H01L 24/11 20130101; H01L 2924/181 20130101; H01L 23/3114
20130101; H01L 2924/01084 20130101; H01L 2224/11462 20130101; H01L
2924/01029 20130101; H05K 2201/09436 20130101; H01L 2924/01073
20130101; H01L 2224/0231 20130101; H01L 2924/01018 20130101; H01L
2224/13017 20130101; H01L 2924/01075 20130101; H01L 2924/14
20130101; H05K 2201/0367 20130101; H01L 2224/1147 20130101; H01L
24/16 20130101; H01L 2224/45099 20130101; H01L 2924/04941 20130101;
H01L 2924/00014 20130101; H01L 2924/01024 20130101; H01L 23/525
20130101; H01L 2224/131 20130101; H01L 2924/01006 20130101; H01L
24/48 20130101; H01L 2224/85399 20130101; H01L 2924/01079 20130101;
H05K 2201/0949 20130101; H01L 2924/014 20130101; H04B 1/712
20130101; H01L 2224/11849 20130101; H01L 2224/48227 20130101; H05K
2203/054 20130101; H01L 23/3128 20130101; H01L 24/12 20130101; H01L
2224/13023 20130101; H01L 2924/01074 20130101; H01L 2924/15311
20130101; H01L 2924/30105 20130101; H05K 3/3473 20130101; H01L
2224/73203 20130101; H01L 2924/01005 20130101; H01L 2924/01078
20130101; H05K 3/243 20130101; H01L 2224/131 20130101; H01L
2924/014 20130101; H01L 2924/00013 20130101; H01L 2224/13099
20130101; H01L 2924/351 20130101; H01L 2924/00 20130101; H01L
2224/85399 20130101; H01L 2924/00014 20130101; H01L 2224/05599
20130101; H01L 2924/00014 20130101; H01L 2924/00014 20130101; H01L
2224/45015 20130101; H01L 2924/207 20130101; H01L 2924/00014
20130101; H01L 2224/45099 20130101; H01L 2924/181 20130101; H01L
2924/00012 20130101 |
Class at
Publication: |
257/781 ;
257/E23.141 |
International
Class: |
H01L 23/52 20060101
H01L023/52 |
Claims
1. A chip package comprising: a ball grid array (BGA) substrate
having a first surface and a second surface opposite to said first
surface; a semiconductor device comprising a passivation layer, a
polymer layer on said passivation layer, and a pad exposed by an
opening in said passivation layer and in said polymer layer; a
copper pillar between said semiconductor device and said first
surface, wherein said copper pillar is connected to said pad
through said opening, and wherein said copper pillar has a height
between 10 and 100 micrometers and greater than a transverse
dimension of said copper pillar; a nickel layer between said copper
pillar and said first surface, wherein said nickel layer has a
thickness between 1 and 10 micrometers, wherein said copper pillar
has a transverse dimension smaller than that of said nickel layer,
wherein said copper pillar has a sidewall recessed from that of
said nickel layer, and wherein said nickel layer comprises a first
portion over said copper pillar and a second portion overhanging
said copper pillar; a solder metal between said nickel layer and
said first surface, wherein said solder metal is joined with said
ball grid array (BGA) substrate; an underfill between said
semiconductor device and said first surface, wherein said underfill
contacts with said semiconductor device and said first surface and
encloses said copper pillar and said solder metal; and a contact
ball on said second surface.
2. The chip package of claim 1, wherein said polymer layer
comprises polyimide.
3. The chip package of claim 1, wherein said polymer layer
comprises bisbenzocyclobutene (BCB).
4. The chip package of claim 1, wherein said pad comprises
copper.
5. The chip package of claim 1, wherein said pad comprises
aluminum.
6. A chip package comprising: a substrate; a semiconductor device
comprising a passivation layer, a polymer layer on said passivation
layer, and a pad exposed by an opening in said passivation layer
and in said polymer layer; a copper pillar between said
semiconductor device and said substrate, wherein said copper pillar
is connected to said pad through said opening, and wherein said
copper pillar has a thickness between 10 and 100 micrometers; a
nickel layer between said copper pillar and said substrate, wherein
said nickel layer has a height between 1 and 10 micrometers and
greater than a transverse dimension of said copper pillar, wherein
said copper pillar has a transverse dimension smaller than that of
said nickel layer, wherein said copper pillar has a sidewall
recessed from that of said nickel layer, and wherein said nickel
layer comprises a first portion over said copper pillar and a
second portion overhanging said copper pillar; a solder metal
between said nickel layer and said substrate, wherein said solder
metal is joined with said substrate; and an underfill between said
semiconductor device and said substrate, wherein said underfill
contacts with said semiconductor device and said substrate and
encloses said copper pillar and said solder metal.
7. The chip package of claim 6, wherein said polymer layer
comprises polyimide.
8. The chip package of claim 6, wherein said polymer layer
comprises bisbenzocyclobutene (BCB).
9. The chip package of claim 6, wherein said pad comprises
copper.
10. The chip package of claim 6, wherein said pad comprises
aluminum.
11. A chip package comprising: a ball grid array (BGA) substrate
having a first surface and a second surface opposite to said first
surface; a semiconductor device comprising a passivation layer, a
polymer layer on said passivation layer, a first pad exposed by an
opening in said passivation layer and in said polymer layer, and a
metal interconnect on said polymer layer, wherein said metal
interconnect comprises a second pad connected to said first pad,
wherein the position of said second pad from a top view is
different from that of said first pad; a copper pillar between said
second pad and said first surface, wherein said copper pillar is
connected to said first pad through said opening and said metal
interconnect, and wherein said copper pillar has a height between
10 and 100 micrometers and greater than a transverse dimension of
said copper pillar; a nickel layer between said copper pillar and
said first surface, wherein said nickel layer has a thickness
between 1 and 10 micrometers, wherein said copper pillar has a
transverse dimension smaller than that of said nickel layer,
wherein said copper pillar has a sidewall recessed from that of
said nickel layer, and wherein said nickel layer comprises a first
portion over said copper pillar and a second portion overhanging
said copper pillar; a solder metal between said nickel layer and
said first surface, wherein said solder metal is joined with said
ball grid array (BGA) substrate; an underfill between said
semiconductor device and said first surface, wherein said underfill
contacts with said semiconductor device and said first surface and
encloses said copper pillar and said solder metal; and a contact
ball on said second surface.
12. The chip package of claim 11, wherein said polymer layer
comprises polyimide.
13. The chip package of claim 11, wherein said metal interconnect
comprises titanium and copper.
14. The chip package of claim 11, wherein said first pad comprises
copper.
15. The chip package of claim 11, wherein said metal interconnect
comprises a first metal layer comprising sputtered
titanium-containing material and sputtered copper and a second
metal layer comprising an electroplated metal on said first metal
layer.
16. A chip package comprising: a substrate; a semiconductor device
comprising a passivation layer, a polymer layer on said passivation
layer, a first pad exposed by an opening in said passivation layer
and in said polymer layer, and a metal interconnect on said polymer
layer, wherein said metal interconnect comprises a second pad
connected to said first pad, wherein the position of said second
pad from a top view is different from that of said first pad; a
copper pillar between said second pad and said substrate, wherein
said copper pillar is connected to said first pad through said
opening and said metal interconnect, and wherein said copper pillar
has a height between 10 and 100 micrometers and greater than a
transverse dimension of said copper pillar; a nickel layer between
said copper pillar and said substrate, wherein said nickel layer
has a thickness between 1 and 10 micrometers, wherein said copper
pillar has a transverse dimension smaller than that of said nickel
layer, wherein said copper pillar has a sidewall recessed from that
of said nickel layer, and wherein said nickel layer comprises a
first portion over said copper pillar and a second portion
overhanging said copper pillar; a solder metal between said nickel
layer and said substrate, wherein said solder metal is joined with
said substrate; and an underfill between said semiconductor device
and said substrate, wherein said underfill contacts with said
semiconductor device and said substrate and encloses said copper
pillar and said solder metal.
17. The chip package of claim 16, wherein said polymer layer
comprises polyimide.
18. The chip package of claim 16, wherein said metal interconnect
comprises titanium and copper.
19. The chip package of claim 16, wherein said first pad comprises
copper.
20. The chip package of claim 16, wherein said metal interconnect
comprises a first metal layer comprising sputtered
titanium-containing material and sputtered copper and a second
metal layer comprising an electroplated metal on said first metal
layer.
Description
[0001] This application is a continuation of application Ser. No.
10/136,650, filed on May 24, 2005, now pending, which is a division
of application Ser. No. 10/638,454, filed on Aug. 11, 2003, now
U.S. Pat. No. 6,917,119, which is a division of application Ser.
No. 09/953,525, filed on Sep. 17, 2001, now U.S. Pat. No.
6,642,136.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The invention relates to the fabrication of integrated
circuit devices, and more particularly, to a method and package for
semiconductor devices.
[0004] 2. Description of the Prior Art
[0005] The creation of semiconductor devices, also referred to as
Integrated Circuits (IC) has been made possible by the rapid
development of supporting technologies such as photolithography and
methods of etching. Most of these technologies have over the years
had to address concerns created by a continued decrease in device
dimensions and increase in device densities. This effort of
creating improved performance devices does is not limited in its
impact on the device itself but extends into the methods and
packages that are used to further interconnect semiconductor
devices and to protect these devices from environmental damage.
This latter issue has created a packaging technology that is also
driven by continuing demands of device miniaturization and denser
packaging of devices, this at no penalty to device performance and
in a cost-effective manner.
[0006] Semiconductor device packaging typically mounts a device on
a substrate, such as semiconductor substrates, printed circuit
boards, flex circuits, metallized substrates, glass substrates and
semiconductor device mounting support. Such a substrate can be a
relative complex structure, having multiple payers of interconnect
metal distributed throughout the height of the substrate in
addition to having interconnect traces created on one or both
surfaces of the substrate. In addition, in order to enable the
mounting of semiconductor over the surface of the substrate,
contact pads such as bond pads are typically provided over at least
one of the surfaces of a substrate. For more complex packages,
several levels of packaging may be applied whereby a semiconductor
device is mounted on a substrate and connected to interconnect
metal that is part of the substrate, the first level substrate may
be further mounted over the surface of a larger substrate from
which the device is interconnected to surrounding circuitry or
electrical components. Limitations that are imposed on this method
of packaging are typically limitations of electrical performance
that is imposed on the device by the packaging interface. For
instance, of key concerns are RC delays in the transmission of
signals over the various interconnect traces. This places a
restraint of size and therefore packaging density on the package.
Also of concern are considerations of parasitic capacitance and
inductance that are introduced by the package since these
parameters have a negative impact on device performance, a more
serious impact on high frequency device performance. These
parasitic components must therefore be minimized or suppressed to
the maximum extent possible.
[0007] One or the more conventional methods of connecting a
semiconductor device to surrounding points of interconnect is the
use of a solder bump. Typically a semiconductor device will be
provided on the active surface of the device with points of
electrical interconnect which electrically access the device. To
connect these points of interconnect to for instance a printer
circuit board, solder bumps are provided on the surface of the
circuit board that align with the points of electrical contact of
the device. The creation of this interface is also subject to
requirements imposed by electrical performance of the completed
package, by requirements of package miniaturization, reliability,
cost performance and the like. The invention provides a package
that addresses these packaging concerns in addition to others.
[0008] U.S. Pat. No. 6,181,569 (Charkravorty) shows a solder bump
process and structure that includes trace formation and bump
plating.
[0009] U.S. Pat. No. 6,107,180 (Munroe et al.) shows a bump process
using UBM and solder bumps.
[0010] U.S. Pat. No. 5,879,964 (Paik et al.) shows a related bump
and interconnect process.
SUMMARY OF THE INVENTION
[0011] A principle objective of the invention is to provide a
high-pillar solder bump that sustains a high stand-off of the
complete solder bump while maintaining high bump reliability and
minimizing damage caused by mismatching of thermal stress factors
between the interfacing surfaces.
[0012] Another objective of the invention is to provide a method
that further improves bump reliability by reducing mechanical and
thermal stress.
[0013] Yet another objective of the invention is to provide
re-distribution bumps which enable the creation of a flip-chip
package without requiring a change in the design of the Integrated
Circuit and without modifying the pad pitch, the performance of the
package is improved and the package size does not need to be
modified.
[0014] A still further objective of the invention is to provide a
chip scale package using one UBM layer of metal, significantly
reducing costs of fabrication and materials.
[0015] A still further objective of the invention is to provide a
chip scale package whereby the solder ball is removed from the
semiconductor device, eliminating the need for low-alpha solder,
thus reducing fabrication cost and concerns of soft-error
occurrence.
[0016] In accordance with the objectives of the invention a new
method and chip scale package is provided. The inventions starts
with a substrate over which a contact point is provided, the
contact point and the surface of the substrate are protected by a
layer of passivation, the contact point is exposed through an
opening created in the layer of passivation. A layer of polymer or
elastomer is deposited over the layer of passivation, an opening is
created through the layer of polymer or elastomer that aligns with
the contact point (contact pad), exposing the contact pad. A
barrier/seed layer is deposited over the surface of the layer of
polymer or elastomer, including the inside surfaces of the opening
created through the layer of polymer or elastomer and the exposed
surface of the contact pad. A first photoresist mask is created
over the surface of the barrier/seed layer, the first photoresist
mask exposes the barrier/seed layer where this layer overlies the
contact pad and, contiguous therewith, over a surface area that is
adjacent to the contact pad and emanating in one direction from the
contact pad. The exposed surface of the barrier/seed layer is
electroplated for the creation of interconnect traces. The first
photoresist mask is removed from the surface of the barrier/seed
layer, a second photoresist mask is created exposing the surface
area of the barrier/seed layer that is adjacent to the contact pad
and emanating in one direction from the contact pad. The second
photoresist mask defines that solder bump. The solder bump is
created in accordance with the second photoresist mask, the second
photoresist mask is removed from the surface of the barrier/seed
layer, exposing the electroplating and the barrier/seed layer with
the metal plating overlying the barrier/seed layer. The exposed
barrier/seed layer is etched in accordance with the pattern formed
by the electroplating, reflow of the solder bump is optionally
performed.
BRIEF DESCRIPTION OF THE DRAWINGS
[0017] FIG. 1 shows a cross section of a conventional mini-BGA
package.
[0018] FIG. 2 shows a cross section of a conventional re-routing
bump.
[0019] FIGS. 3 through 8 detail the process flow of the invention,
as follows:
[0020] FIG. 3 shows a cross section of a silicon substrate, a top
metal contact pad has been provided, a layer of passivation and a
layer of polymer or elastomer have been deposited and patterned
over the surface of the BGA substrate.
[0021] FIG. 4 shows a cross section after a barrier/seed layer has
been deposited.
[0022] FIG. 5 shows a cross section after a first photoresist mask
has been created over the surface of the barrier/seed layer,
electroplating has been applied for the deposition of metal for the
formation of interconnect traces.
[0023] FIG. 6 shows a cross section after the first photoresist
mask has been removed from the surface of the barrier/seed
layer.
[0024] FIG. 7 shows a cross section after a second photoresist mask
has been created over the surface of the barrier/seed layer,
including the surface of the electroplated interconnect metal; the
second photoresist mask defines the solder bump.
[0025] FIG. 8 shows a cross section after the solder bump has been
electroplated in accordance with the second photoresist mask.
[0026] FIG. 9 shows a cross section after removal of the second
photoresist mask, exposing the surface of the barrier/seed layer
and the electroplated interconnect metal.
[0027] FIG. 10 shows a cross section after the barrier/seed layer
has been etched in accordance with the layer of interconnect
metal.
[0028] FIG. 11 shows a cross section of the package of the
invention with a molding compound as encapsulant.
[0029] FIG. 12 shows a cross section of the package of the
invention with underfill as encapsulant.
[0030] FIG. 13 shows a cross section of the package of the
invention using both molding and an underfill.
[0031] FIG. 14 shows a cross section of the package of the
invention as a bare die that can be directly attached to a next
level substrate.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0032] Two prior art applications are shown in the cross sections
of FIGS. 1 and 2, specifically in the cross section of FIG. 1 are
shown: [0033] 11, a BGA substrate such as a printed circuit board
and the like [0034] 12, a semiconductor device or die [0035] 14, a
molding compound that is used to encapsulate the die 12 [0036] 16,
solder balls that form the electrical interface between the package
shown in cross section in FIG. 1 and surrounding circuitry; these
solder balls can for instance be further connected to contact pads
on the surface of a Printed Circuit Board (PCB) [0037] 18, bond
wires used to connect points of electrical contact (not shown) on
the active surface of die 12 with contact pads (not shown) on the
second or upper surface of BGA substrate 11.
[0038] FIG. 2 shows a cross section of a conventional re-routing
bump, the re-routing applies since the solder bump that is shown in
cross section in FIG. 2 does not align with the contact pad with
which the solder bump is connected. The elements that are
highlighted in the cross section of FIG. 2 are the following:
[0039] 10, a device supporting silicon substrate [0040] 20, a
solder ball [0041] 22, top metal contact point [0042] 24, a layer
of passivation, applied for the protection of the underlying
surface and the surface of the layer 22 of top metal [0043] 26, a
layer of dielectric material [0044] 28, a layer of passivation,
applied for the protection of the underlying layer 26 of dielectric
and the surface of the layer 32 of re-routing metal [0045] 30, a
seed and/or barrier layer [0046] 32, a patterned layer of
re-routing metal [0047] 33, a seed layer, and [0048] 34, a layer of
UBM metal.
[0049] FIGS. 3 through 9 will now be used to describe the
invention. Referring specifically to the cross section that is
shown in FIG. 3, there is shown: [0050] 10, a semiconductor
supporting surface such as the surface of a silicon substrate
[0051] 40, a contact pad or top metal pad that has been provided in
or on the surface of the substrate layer 10 [0052] 42, a layer of
passivation deposited over the surface of layer 10; the layer 42 of
passivation has been patterned and etched, creating on opening 41
through the layer 42 of passivation that aligns with the contact
pad 40 [0053] 44, a layer of polymer or elastomer that has been
deposited over the surface of the layer 42 of passivation; the
layer 44 of polymer or elastomer has been patterned and etched,
creating on opening 41 through the layer 42 of polymer or elastomer
that aligns with the contact pad 40. Contact pad 40 can comprise
aluminum or copper or a compound thereof.
[0054] As materials that can be used as a polymer for the
deposition of layer 44 can be cited polyimide, parylene or teflon,
electron resist, solid organics or inorganics, BCB
(bisbenzocyclobutene), PMMA (poly-methyl-methacrylate), teflon
which is a polymer made from PTFE (polytetrafluoroethylene), also
polycarbonate (PC), polysterene (PS), polyoxide (PO) and poly
polooxide (PPO).
[0055] The semiconductor supporting surface 10 can be semiconductor
substrates, printed circuit boards, flex circuits, metallized
substrates, glass substrates and semiconductor device mounting
support, whereby the semiconductor substrate can selected from the
group of substrates consisting of semiconductor substrates, ceramic
substrates, glass substrates, gallium arsenide substrates, silicon
on insulator (SOI) substrates and silicon on sapphire (SOS)
substrates.
[0056] FIG. 4 shows a cross section of the semiconductor substrate
after a layer 46 of barrier/seed material has been deposited over
the surface of layer 44 of polymer or elastomer; inside surface of
opening 41 have also been covered with the layer 46 of barrier/seed
material.
[0057] A typical barrier layer 46 is deposited using rf. sputtering
of titanium nitride, tantalum, tungsten, niobium, molybdenum,
Ti/TiN or Ti/W and is more preferably formed from TiN. The barrier
layer 46 can also be used to improve the adhesion of a subsequent
overlying metal layers. A barrier layer is preferably about 100 and
1000 angstrom thick.
[0058] To further enhance the adhesion of a copper interconnect
line to the surrounding layer of dielectric or insulation, a seed
layer is deposited over the barrier layer. A seed layer can be
deposited using a sputter chamber or an Ion Metal Plasma (IMP)
chamber at a temperature of between about 0 and 300 degrees C. and
a pressure of between about 1 and 100 mTorr, using copper or a
copper alloy as the source at a flow rate of between about 10 and
400 sccm and using argon as an ambient gas. The minimum thickness
of a seed layer is about 5,000 Angstrom, this thickness is required
achieve a reliable gap fill.
[0059] FIG. 5 shows a cross section after: [0060] 48, a first
photoresist mask has been formed over the surface of barrier/seed
layer 46, exposing the surface of the barrier/seed layer 46, and
[0061] 50, a layer 50 of metal has been over the exposed surface of
the barrier/seed layer 46 in accordance with the opening 43 created
in the first photoresist mask.
[0062] The process of deposition and patterning a layer of
photoresist uses conventional methods of photolithography and
masking. Layer 48 of photoresist can be etched by applying O.sub.2
plasma and then wet stripping by using H.sub.2SO.sub.4,
H.sub.2O.sub.2 and NH.sub.4OH solution. Sulfuric acid
(H.sub.2SO.sub.4) and mixtures of H.sub.2SO.sub.4 with other
oxidizing agents such as hydrogen peroxide (H.sub.2O.sub.2) are
widely used in stripping photoresist after the photoresist has been
stripped by other means. Wafers to be stripped can be immersed in
the mixture at a temperature between about 100 degrees C. and about
150 degrees C. for 5 to 10 minutes and then subjected to a thorough
cleaning with deionized water and dried by dry nitrogen. Inorganic
resist strippers, such as the sulfuric acid mixtures, are very
effective in the residual free removal of highly postbaked resist.
They are more effective than organic strippers and the longer the
immersion time, the cleaner and more residue free wafer surface can
be obtained. The opening 43 that is in this manner created in the
layer 48 of photoresist exposes the surface of the layer 44 of
barrier/seed material over a surface area where re-routing metal
has to be created.
[0063] Removal of the first photoresist mask 48 from the surface of
the barrier/seed layer 46 results in the cross section that is
shown in FIG. 6.
[0064] The invention continues with the cross section that is shown
in FIG. 7, shown are: [0065] 52, a second photoresist mask is
created over the surface of the barrier/seed layer 46, including
the surface of the interconnect metal layer 50, and [0066] 51
opening created in the second layer 52 of photoresist, exposing the
surface of layer 50 of interconnect metal; opening 51 defined the
location and size (diameter) of the to be created solder bump.
[0067] The cross section that is shown in FIG. 8 is after the
opening 51 created in the second layer of dielectric has been
filled with solder bump material. These materials can be selected
as: [0068] layer 54 being a first layer of metal, typically
comprising copper, deposited to a thickness between about 10 and
100 .mu.m, and more preferably to a thickness of about 50 .mu.m
[0069] layer 56 being an UBM layer, typically comprising nickel,
deposited to a thickness between about 1 and 10 .mu.m, and more
preferably to a thickness of about 5 .mu.m, forming an integral
part of the pedestal of the to be created interconnect bump, and
[0070] layer 58 is a layer of solder compound, deposited to a
thickness between about 10 and 100 .mu.m, and more preferably to a
thickness of about 50 .mu.m.
[0071] With the completion of the electroplating of these three
layers, the solder bump is essentially complete. The second solder
mask 52, FIG. 8, is therefore removed from the surface of the
barrier/seed layer 46 and the surface of the interconnect metal 50,
see FIG. 9, exposing the barrier/seed layer 46 and the interconnect
metal 50, a pattern of barrier/seed material overlying the
barrier/seed layer 46.
[0072] It is good practice and can be of benefit in the creation of
the layers 54, 56 and 58 of metal to perform, prior to the
electroplating of these layers of metal, an in-situ sputter clean
of the exposed surface (exposed through opening 51) of the layer 50
of re-routing metal.
[0073] The barrier/seed layer 46 can now be etched using the
patterned layer 50 of interconnect metal as a mask, which leads to
the cross section that is shown in FIG. 10.
[0074] It is further good practice to oxidize the surface of the
UBM and pillar metal by chemical or thermal oxidation. The chemical
oxidation could be an H.sub.2O.sub.2 oxidation process, at a
temperature in excess of about 150 degrees C. These processing
steps can further help prevent wetting of the solder bump to the
metal traces.
[0075] Reflow can optionally be applied the layer 58 of solder
compound, creating a spherical layer 58 of solder which forms the
solder bump (not shown). It must be noted in the cross section that
is shown in FIG. 10 that the diameter of the UBM layer 54 is,
during and as a consequence of the etching of the barrier/seed
layer 46, reduced in diameter. This allows the solder ball 58 to be
removed from the surface of the substrate by a relatively large
distance. From this follows the advantage that it is no longer
required that low-alpha solder is used for the solder compound of
solder ball 58 reducing manufacturing cost in addition to reducing
concerns of memory soft-error conditions.
[0076] Layer 56 of UBM may contain multiple layers of metal such as
a layer of chrome, followed by a layer of copper, followed by a
layer of gold. From the latter it is apparent that layer 56 of UBM
may comprise several layers of metal that are successively
deposited.
[0077] Examples of the application of the package of the invention
are shown in cross section in FIGS. 11 and 12. Highlighted in FIG.
11 are: [0078] 60, a polymer or elastomer layer provided by the
invention, similar to layer 44 of FIG. 3 e.a. [0079] 62, a BGA
substrate over which a semiconductor device is to be mounted [0080]
64, a semiconductor device [0081] 66, a molding compound applied to
encapsulate the device 64 [0082] 68, contact balls to the package
of the invention [0083] 70, pillar metal, similar to layers 54 and
56 of FIG. 8 e.a., and [0084] 72, a solder bump, similar to layer
58 of FIG. 8 after thermal reflow has been applied to this
layer.
[0085] Shown in cross section in FIG. 12 is another application of
the invention. The elements that have been applied above under FIG.
11 are valid for the cross section shown in FIG. 12 with the
exception of element 74, which in the cross section of FIG. 12 is
an underfill that has been applied under semiconductor device 64
and that replaces layer 66 of molding compound in FIG. 11 as the
means for encapsulating the device 64.
[0086] FIGS. 13 and 14 show additional applications of the
invention with FIG. 13 showing a cross section of the package of
the invention using both molding and an underfill while FIG. 14
shows a cross section of the package of the invention as a bare die
that can be directly attached to a next level substrate. All
elements of the cross sections that are shown in FIGS. 13 and 14
have previously been described and need therefore not been further
highlighted at this time.
[0087] In order to better highlight the differences between the
prior art solder bump, as shown in cross section in FIG. 2, and the
solder bump of the invention, as shown in the cross section of FIG.
10, the processing steps to create these two solder bumps are
listed below. These steps are easier to follow if it is realized
that both methods require and apply two metal fill plating steps,
the first of these two step is to create a patterned layer of
re-routing metal, the second is to create the solder bump. The
processing sequences are as follows: [0088] 1. the prior art starts
with a device support substrate, a contact pad has been created
over the surface of the substrate, layers of passivation and
dielectric have been deposited over the surface of the substrate
and patterned to expose the contact pad; the invention starts with
the same structure [0089] 2. the prior art deposits a first seed
layer over the surface of the layer of dielectric; the invention
does the same [0090] 3. the prior art performs a first metal fill
over the first seed layer by creating a layer of metal that serves
as re-routing metal; the invention does the same [0091] 4. the
prior art etches the first seed layer; the instant invention does
not perform this step at this time [0092] 5. the prior art deposits
and patterns a layer of passivation, exposing the surface of the
layer of re-routing metal, the patterned second layer of
passivation serves as a mask for the reflow of the solder bump; the
instant invention does not perform this step because the solder
bump structure will not wet to the re-routing metal [0093] 6. the
prior art deposits a second seed layer over the surface of the
layer of passivation; the instant invention does not deposit a
second seed layer [0094] 7. the prior art plates a layer of UBM
over which a layer of solder compound is plated; the instant
invention deposits a layer of UBM and two metal plating steps, the
first metal plating step plating a layer of metal, such as copper
or nickel that forms an integral part of the pedestal of the to be
created interconnect bump, the second metal plating step depositing
a solder compound [0095] 8. the prior art performs reflow of the
solder compound; the instant invention does the same [0096] 9. the
prior art etches the second seed layer using the solder ball as a
mask; the instant invention etches the first seed layer using the
patterned re-routing metal as a mask.
[0097] The essential differences between the prior art and the
instant invention is provided by the two plating steps and can, for
easy reference be summarized as follows: TABLE-US-00001 Prior Art
Instant Invention First plating step 1.sup.st seed layer dep.
1.sup.st seed layer dep. plate re-routing metal plate re-routing
metal etch 1.sup.st seed layer (no equivalent step) Second plating
step 2.sup.st seed layer dep. (no equivalent step) plate UBM +
solder plate UBM + metal + solder etch 2.sup.st seed layer etch
1.sup.st seed layer
[0098] The advantages of the instant invention can be summarized as
follows: [0099] 1. the height of the metal pillar (layers 54 and
56, FIG. 10) allows for high stand-off between the surface of
substrate 10, thereby reducing impact of mismatching of thermal
fatigue between interfacing surfaces such as the surface of the
substrate 10 and the layers of metal that are part of the solder
bump [0100] 2. the layer 44 has been highlighted as being a layer
of or polymer or elastomer and is selected for its ability to
provide stress release between overlying surfaces and thus to
enhance solder bump reliability [0101] 3. the re-distribution
solder bump of the invention allows for creating a flip-chip
package without the need for semiconductor device redesign or
changes in the pitch of the contact points of the package (the
pitch of contact balls 72 and 68, FIGS. 11 and 12); the package
size can also remain constant while still being able to package die
of different dimensions (due to the flexibility of the routing of
the re-routing metal layer 50, FIG. 50, FIG. 10) [0102] 4. the
method of creating the solder pillar and the solder bump, that is
plating a layer of UBM over which metal is plated twice,
contributes a significant cost saving in both materials used and in
the manufacturing cost; the need for separate UBM plating and
etching, for separate plating and etching the pillar metal and for
separate plating and etching the solder compound is reduced to
using one photoresist mask that is applied for all three steps
[0103] 5. by creating a relatively high layer of pillar metal, the
solder ball is removed from the surface of the substrate; from this
follows that low-alpha solder is no longer required as a solder
compound for the solder bump, reducing manufacturing costs; from
this further follows that soft-error concerns that typically apply
to memory chip designs are less valid using the solder bump of the
invention [0104] 6. by creating a relatively high layer of pillar
metal, the solder ball of the instant invention will not wet to the
re-routing metal trace. Thus, the second layer of passivation
material, which typically serves as a solder mask, is no longer
required and, consequently, processing cost is reduced.
[0105] In sum: the invention provides a method to create a solder
bump having a high metal pillar and a solder ball. Seed/barrier
layer deposition is limited to one deposition, a first metal
plating step defines the re-routing metal, a second metal plating
step creates the solder bump. The need for additional layers of
passivation or solder mask has been removed.
[0106] Although the invention has been described and illustrated
with reference to specific illustrative embodiments thereof, it is
not intended that the invention be limited to those illustrative
embodiments. Those skilled in the art will recognize that
variations and modifications can be made without departing from the
spirit of the invention. It is therefore intended to include within
the invention all such variations and modifications which fall
within the scope of the appended claims and equivalents
thereof.
* * * * *