Trademark applications and grants for Megica Corp. Megica Corp has 28 trademark applications. The latest application filed is for "POST-PASSIVATION"
Patent Application | Date |
---|---|
HIGH PERFORMANCE IC CHIP HAVING DISCRETE DECOUPLING CAPACITORS ATTACHED TO ITS IC SURFACE 20140021630 - 13/735894 Lin; Mou-Shiung | 2014-01-23 |
CHIP PACKAGES WITH POWER MANAGEMENT INTEGRATED CIRCUITS AND RELATED TECHNIQUES 20140021522 - 14/034440 Lin; Mou-Shiung ;   et al. | 2014-01-23 |
INTEGRATED CHIP PACKAGE STRUCTURE USING CERAMIC SUBSTRATE AND METHOD OF MANUFACTURING THE SAME 20130309812 - 13/887093 Lee; Jin-Yuan ;   et al. | 2013-11-21 |
SYSTEM-IN PACKAGES 20130292849 - 13/935135 LIN; Mou-Shiung ;   et al. | 2013-11-07 |
INTEGRATED CIRCUIT CHIP USING TOP POST-PASSIVATION TECHNOLOGY AND BOTTOM STRUCTURE TECHNOLOGY 20130242500 - 13/874983 Lin; Mou-Shiung ;   et al. | 2013-09-19 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.