U.S. patent application number 12/501097 was filed with the patent office on 2009-11-05 for micro fluid system support and manufacturing method thereof.
This patent application is currently assigned to HITACHI CHEMICAL CO., LTD.. Invention is credited to Shigeharu ARIKE, Hiroshi KAWAZOE, Akishi NAKASO.
Application Number | 20090274583 12/501097 |
Document ID | / |
Family ID | 27761226 |
Filed Date | 2009-11-05 |
United States Patent
Application |
20090274583 |
Kind Code |
A1 |
KAWAZOE; Hiroshi ; et
al. |
November 5, 2009 |
MICRO FLUID SYSTEM SUPPORT AND MANUFACTURING METHOD THEREOF
Abstract
A support unit for a microfluidic system includes a first
support; a first adhesive layer provided on a surface of the first
support; and a hollow filament laid on a surface of the first
adhesive layer to have an arbitrary shape and functioning as a flow
channel layer of the microfluidic system.
Inventors: |
KAWAZOE; Hiroshi;
(Shimodate-shi, JP) ; NAKASO; Akishi;
(Shimodate-shi, JP) ; ARIKE; Shigeharu;
(Shimodate-shi, JP) |
Correspondence
Address: |
WESTERMAN, HATTORI, DANIELS & ADRIAN, LLP
1250 CONNECTICUT AVENUE, NW, SUITE 700
WASHINGTON
DC
20036
US
|
Assignee: |
HITACHI CHEMICAL CO., LTD.
Tokyo
JP
|
Family ID: |
27761226 |
Appl. No.: |
12/501097 |
Filed: |
July 10, 2009 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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10505416 |
Jun 13, 2005 |
|
|
|
PCT/JP2003/002066 |
Feb 25, 2003 |
|
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12501097 |
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Current U.S.
Class: |
422/400 ;
156/289; 156/60 |
Current CPC
Class: |
B01L 3/502707 20130101;
B01L 2400/0655 20130101; B01J 2219/00788 20130101; B01L 2300/0816
20130101; B81C 1/00119 20130101; Y10T 156/10 20150115; B01L
2300/0874 20130101; B01J 19/0093 20130101; B01J 2219/0086 20130101;
B81C 2201/019 20130101; B81C 2203/032 20130101; B01J 2219/00833
20130101; B01L 2200/12 20130101; B01J 2219/00783 20130101; B01L
2300/0838 20130101; B81B 2201/051 20130101; B01J 2219/00822
20130101; B01J 2219/00869 20130101; B01L 2400/0481 20130101; B01L
2300/0887 20130101 |
Class at
Publication: |
422/99 ; 156/60;
156/289 |
International
Class: |
B01L 3/00 20060101
B01L003/00; B32B 37/00 20060101 B32B037/00 |
Foreign Application Data
Date |
Code |
Application Number |
Feb 25, 2002 |
JP |
2002048580 |
Oct 4, 2002 |
JP |
2002292978 |
Feb 24, 2003 |
JP |
2003046414 |
Claims
1. A support unit for a microfluidic system, comprising: a first
support; a first adhesive layer provided on a surface of the first
support; and a hollow filament laid on a surface of the first
adhesive layer to have an arbitrary shape and functioning as a flow
channel layer of the microfluidic system.
2. A support unit for a microfluidic system, comprising: a first
support; a first adhesive layer provided on a surface of the first
support; and a first hollow filament group constituted by a
plurality of hollow filaments laid on a surface of the first
adhesive layer and respectively functioning as a plurality of flow
channel layers of the microfluidic system.
3. The support unit for a microfluidic system according to claim 2,
further comprising: a second adhesive layer provided on a surface
of the first hollow filament group; and a second support provided
on a surface of the second adhesive layer.
4. The support unit for a microfluidic system according to claim 2
or 3, further comprising a second hollow filament group constituted
by a plurality of hollow filaments laid in a direction so as to
intersect with the first hollow filament group and functioning as
another plurality of flow channel layers of the microfluidic
system.
5. The support unit for a microfluidic system according to any one
of claims 2 to 4, wherein the plurality of hollow filaments is
partially exposed from the first support.
6. The support unit for a microfluidic system according to any one
of claims 2 to 5, wherein a metal film is formed on a part of at
least one of the plurality of hollow filaments.
7. The support unit for a microfluidic system according to any one
of claims 2 to 6, wherein at least one of the plurality of hollow
filaments is partially provided with an optically transparent
portion.
8. A support unit for a microfluidic system, comprising: a first
support; a first adhesive layer provided on a surface of the first
support; a plurality of hollow filaments laid on a surface of the
first adhesive layer; a second adhesive layer provided on the first
adhesive layer and the hollow filaments; a second support provided
on a surface of the second adhesive layer; and a relay portion
provided in the first adhesive layer and the second adhesive layer
and connecting routes of the hollow filaments.
9. The support unit for a microfluidic system according to claim 8,
wherein the relay portion includes a part of the second
support.
10. A manufacturing method of a support unit for a microfluidic
system, comprising: forming a first adhesive layer on a surface of
a first support; and laying a hollow filament on a surface of the
first adhesive layer.
11. A manufacturing method of a support unit for a microfluidic
system, comprising: forming a first adhesive layer on a surface of
a first support; and laying a first hollow filament group
constituted by a plurality of hollow filaments, on a surface of the
first adhesive layer.
12. The manufacturing method of a support unit for a microfluidic
system according to claim 11, between the forming the first
adhesive layer and laying the first hollow filament group, the
manufacturing method further comprising: providing release layers
on the surface of the first adhesive layer at positions where the
hollow filaments are exposed; and providing a slit in the first
support, wherein the first hollow filament group is laid to be in
contact with both surfaces of a pair of the release layers.
13. The manufacturing method of a support unit for a microfluidic
system according to claim 11 or 12, further comprising the laying a
second hollow filament group constituted by a plurality of hollow
filaments in a direction so as to intersect with the first hollow
filament group, after the laying the first hollow filament
group.
14. The manufacturing method of a support unit for a microfluidic
system according to claim 11 or 12, after the laying the first
hollow filament group, the manufacturing method further comprising:
forming a second adhesive layer on a surface of the first hollow
filament group; and adhering a second support onto a surface of the
second adhesive layer.
15. A manufacturing method of a support unit for a microfluidic
system, comprising: forming a first adhesive layer on a surface of
a first support; laying a plurality of hollow filaments on a
surface of the first adhesive layer; forming a second adhesive
layer on the first adhesive layer and the hollow filaments; forming
a relay portion in the first adhesive layer and the second adhesive
layer; and adhering a second support onto a surface of the second
adhesive layer.
16. The manufacturing method of a support unit for a microfluidic
system according to claim 15, wherein the forming the relay portion
in the first adhesive layer and the second adhesive layer further
includes forming the relay portion so that the second support
becomes a part of the relay portion.
Description
[0001] This application is a divisional of U.S. application Ser.
No. 10/505,416, filed on Jun. 13, 2005, pending, which is a
National Stage of International Application No. PCT/JP2003/02066,
filed on Feb. 25, 2003.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates to a support unit for a
microfluidic system, in which a hollow filament is laid on and
fixed to a support to have a predetermined shape, and a
manufacturing method thereof.
[0004] 2. Description of the Related Art
[0005] In chemical and biochemical fields, studies have advanced to
miniaturization of reaction systems and analyzers that use
microelectromechanical systems (MEMS). In conventional research and
development, there is a micron-scale machine element (referred to
as "micromachine" hereinafter) having a single function as a
micromotor or micropump.
[0006] In order to conduct an intended chemical reaction or
chemical analysis, it is necessary to combine a plurality of
various micromachine parts together and systemize them. A complete
form of such system is referred to by such names as micro reactor
system, or micro total analysis system (.mu.TAS). Usually,
micromachines are formed on a silicon chip by applying a
semiconductor manufacturing process. In principle, it is possible
to form (integrate) a plurality of elements on one chip systemizing
them, and efforts have been made in fact toward this operation.
However, the fabrication process of the system is complicated, and
it is assumed difficult to manufacture the system at a mass
production level. A chip substrate (referred to as nanoreactor
hereinafter), where a groove is formed as a flow channel by etching
or the like at a predetermined position in a silicon substrate, has
been suggested as a method of connecting a plurality of
micromachines to form a fluidic circuit (system). This method has
an advantage in that manufacturing of the system is far easier than
manufacturing of the system in the aforementioned method of
integration. However, a cross-sectional area of the flow channel is
small, and interface resistance between a fluid and the side
surface of the groove is large. Thus, under the present
circumstances, the maximum length of the flow channel is not more
than millimeters, and, in synthetic reactions and chemical
reactions that are actually conducted, the number of steps and the
amount of a fluid for reaction and analysis are limited.
[0007] However, the fabrication process of the system is
complicated, and it is assumed difficult to manufacture the system
at a mass production level. Therefore, in recent years, a chip
substrate, where a groove is formed as a flow channel by etching or
the like at a predetermined position in a silicon substrate, has
been suggested as a method of connecting a plurality of
micromachines to form a fluidic circuit. This method has an
advantage in that manufacturing of the system is far easier than
manufacturing of the system in the aforementioned method of
integration. However, on the other hand, this method has a problem
in that a cross-sectional area of the flow channel is small, and
interface resistance between a fluid and the side surface of the
groove is large. Thus, under the present circumstances, the maximum
length of the flow channel is not more than millimeters, and, in
synthetic reactions and chemical reactions that are actually
conducted, the number of steps and the amount of a fluid for
reaction and analysis are limited.
SUMMARY OF THE INVENTION
[0008] The present invention was accomplished to resolve the
above-described problem. In other words, an object of the present
invention is to provide a support unit for a microfluidic system,
which is manufactured easily and has a long flow channel in
centimeters that does not limit the number of steps and an amount
of a fluid for reaction and analysis.
[0009] Another object of the present invention is to provide a
support unit for a small microfluidic system, which does not
require space even with a complicated fluidic circuit.
[0010] Yet another object of the present invention is to provide a
manufacturing method for a support unit for a microfluidic system,
in which a complicated fluidic circuit can be formed.
[0011] In order to achieve the above object, a first aspect of the
present invention inheres in a support unit for a microfluidic
system including (a) a first support, (b) a first adhesive layer
provided on a surface of the first support, (c) a hollow filament
laid on a surface of the first adhesive layer to have an arbitrary
shape, and (d) a hollow filament laid on the surface of the first
adhesive layer to have an arbitrary shape and functioning as a flow
channel layer of a microfluidic system. In the first aspect of the
present invention, another hollow filament can be
three-dimensionally laid in a manner of intersecting with said
hollow filament. Therefore, it becomes possible to provide a
support unit for a microfluidic system which has good accuracy, can
be manufactured easily and has a long flow channel in centimeters
that does not limit the number of steps and the amount of a fluid
for reaction and analysis. Further, according to the first aspect
of the present invention, it is possible to provide a support unit
for a small microfluidic system, which does not require space even
with a complicated fluidic circuit. Thus, it is also possible to
downsize the microfluidic system itself.
[0012] A second aspect of the present invention inheres in a
support unit for a microfluidic system including (a) a first
support, (b) a first adhesive layer provided on a surface of the
first support, and (c) a first hollow filament group constituted by
a plurality of hollow filaments laid on a surface of the first
adhesive layer to have an arbitral shape and respectively
functioning as a plurality of flow channel layers of the
microfluidic system. In the second aspect of the present invention,
a second hollow filament group constituted by a plurality of hollow
filaments can be three-dimensionally laid to intersect the first
hollow filament group constituted by the plurality of hollow
filaments. Therefore, it becomes possible to provide a support unit
for a microfluidic system which has good accuracy, can be
manufactured easily and has a long flow channel in centimeters that
does not limit the number of steps and the amount of a fluid for
reaction and analysis. Further, according to the first aspect of
the present invention, it is possible to provide a support unit for
a small microfluidic system, which does not require space even with
a complicated fluidic circuit. Thus, it is also possible to
downsize the microfluidic system itself.
[0013] A third aspect of the present invention inheres in a
manufacturing method of a support unit for a microfluidic system
including (a) forming a first adhesive layer on a surface of a
first support, and (b) laying a hollow filament on a surface of the
first adhesive layer. The manufacturing method of a support unit
for a microfluidic system according to the third aspect of the
present invention is a manufacturing method using the support unit
for a microfluidic system explained in the first aspect. According
to the third aspect of the present invention, it is possible to
provide a manufacturing method of a support unit for a small
microfluidic system in which a complicated fluidic circuit can be
formed.
[0014] A fourth aspect of the present invention inheres in a
manufacturing method of a support unit for a microfluidic system
including (a) forming a first adhesive layer on a surface of a
first support, and (b) laying a first hollow filament group
constituted by a plurality of hollow filaments on a surface of the
first adhesive layer. The manufacturing method of a support unit
for a microfluidic system according to the fourth aspect of the
present invention is a manufacturing method using the support unit
for a microfluidic system described in the second aspect. According
to the fourth aspect of the present invention, it is possible to
provide a manufacturing method of a support unit for a small
microfluidic system in which a complicated fluidic circuit can be
formed.
BRIEF DESCRIPTION OF DRAWINGS
[0015] FIG. 1 is a cross sectional view of a support unit for a
microfluidic system according to a first embodiment of the present
invention, and FIG. 1B is a plan view whose cross section along the
line I.sub.A-I.sub.A viewed in the arrow direction corresponds to
FIG. 1A.
[0016] FIG. 2 is a process cross sectional view (No. 1) explaining
a manufacturing method of the support unit for a microfluidic
system according to the first embodiment of the present
invention.
[0017] FIG. 3A is a process cross sectional view (No. 2) explaining
the manufacturing method of the support unit for a microfluidic
system according to the first embodiment of the present invention,
and FIG. 3B is a plan view whose cross section along the line
III.sub.A-III.sub.A viewed in the arrow direction corresponds to
FIG. 3A.
[0018] FIG. 4A is a process cross sectional view (No. 3) explaining
the manufacturing method of the support unit for a microfluidic
system according to the first embodiment of the present invention,
and FIG. 4B is a plan view whose cross section along the line
IV.sub.A-IV.sub.A viewed in the arrow direction corresponds to FIG.
4A.
[0019] FIG. 5A is a process cross sectional view (No. 4) explaining
the manufacturing method of the support unit for a microfluidic
system according to the first embodiment of the present invention,
and FIG. 5B is a plan view whose cross section along the line
V.sub.A-V.sub.A viewed in the arrow direction corresponds to FIG.
5A.
[0020] FIG. 6A is a process cross sectional view (No. 5) explaining
the manufacturing method of the support unit for a microfluidic
system according to the first embodiment of the present invention,
and FIG. 6B is a plan view whose cross section along the line
VI.sub.A-VI.sub.A viewed in the arrow direction corresponds to FIG.
6A.
[0021] FIG. 7A is a process cross sectional view (No. 6) explaining
the manufacturing method of the support unit for a microfluidic
system according to the first embodiment of the present invention,
and FIG. 7B is a plan view whose cross section along the line
VII.sub.A-VII.sub.A viewed in the arrow direction corresponds to
FIG. 7A.
[0022] FIG. 8A is a bird's eye view of a support unit for a
microfluidic system including a relay portion according to a second
embodiment of the present invention, and FIG. 8B is a cross
sectional view along the line VIII.sub.B-VIII.sub.B.
[0023] FIG. 9A is a bird's eye view (No. 1) explaining a
configuration of a hollow filament for a support unit for a
microfluidic system according to another embodiment of the present
invention, and FIG. 9B is a bird's eye view (No. 2) explaining a
configuration of a hollow filament for a support unit for a
microfluidic system according to another embodiment of the present
invention.
[0024] FIG. 10 is a cross sectional view of a support unit for a
microfluidic system including a relay portion according to another
embodiment of the present invention.
[0025] FIG. 11A is a cross sectional view viewed in the arrow
direction along the line XIA-XIA of a plan view of a support unit
for a microfluidic system shown in FIG. 11C, according to yet
another embodiment of the present invention, FIG. 11B is a cross
sectional view viewed in the arrow direction along the line XIB-XIB
of the plan view shown in FIG. 11C.
[0026] FIG. 12 is a bird's eye view of the support unit for a
microfluidic system according to yet another embodiment of the
present invention shown in FIGS. 11A to 11C.
[0027] FIG. 13 is a bird's eye view showing a modification of the
support unit for a microfluidic system according to yet another
embodiment of the present invention.
DETAILED DESCRIPTION OF THE INVENTION
[0028] Embodiments of the present invention are described with
reference to the drawings. The same or similar parts are denoted by
the same or similar symbols. However, the drawings are schematic,
and a relation between a thickness and a dimension of a plane, a
ratio between thicknesses of respective layers, and the like are
different from those in reality. Therefore, specific thicknesses
and dimensions should be determined by checking the description
below. In addition, between the drawings, relationship and ratio
between dimensions may of course be different.
First Embodiment
(Support Unit for Microfluidic System)
[0029] As shown in FIGS. 1A and 1B, a support unit for a
microfluidic system according to a first embodiment of the present
invention includes a first support 2, a first adhesive layer 1a
provided on a surface of the first support 2, a first hollow
filament group constituted by a plurality of hollow filaments 501,
502, 503, . . . , 508 laid on a surface of the first adhesive layer
to have an arbitrary shape, a second hollow filament group
constituted by a plurality of hollow filaments 511, 512, 513, . . .
, 518 laid in a direction intersecting with the first hollow
filament group, a second adhesive layer 1b provided on a surface of
the second hollow filament group, and a second support 6 provided
on a surface of the second adhesive layer 1b. The first hollow
filament group constituted by the plurality of hollow filaments
501, 502, 503, . . . , 508 and the second hollow filament group
constituted by the plurality of hollow filaments 511, 512, 513, . .
. , 518 respectively configure flow channel layers for a chemical
solution, in the support unit for a microfluidic system according
to the first embodiment of the present invention.
[0030] The inner diameters and outer diameters of the plurality of
hollow filaments 501 to 508 and 511 to 518 may be selected
depending on a purpose. However, the inner diameters preferably
range from about .phi.0.05 mm to .phi.0.5 mm since milliliters (mL)
to microliters (.mu.L) of fluid is flown therethrough. In
fabricating the hollow filaments 501 to 508 and 511 to 518 with the
above diameters, particularly suitable materials for the hollow
filaments are polyimide (PI), polyether ether ketone (PEEK),
polyether imide (PEI), polyphenylene sulfide (PPS),
tetrafluoroethylene-perfluoroalkoxyethylene copolymer (PFA), and
the like. With inner diameters of .phi.0.05 mm or smaller, an
influence of the interface resistance between the fluid and the
inner wall surfaces of the hollow filaments 501 to 508 and 511 to
518 becomes too great to be ignored. On the other hand, with inner
diameters larger than .phi.0.5 mm, high pressure is required to
allow the fluid to flow continuously, thus causing an increase in
burdens on other parts and mixing of air bubbles into the fluid.
When causing a chemical reaction in the fluid flowing through the
first hollow filament group constituted by the plurality of hollow
filaments 501 to 508 and the second hollow filament group
constituted by the plurality of hollow filaments 511 to 518, it is
preferred that the hollow filaments 501 to 508 and 511 to 518 be
chemical resistant. Further, when causing a photochemical reaction
or performing spectroscopic analysis by illuminating the fluid
flowing through the hollow filaments 501 to 508 and 511 to 518, it
is preferred that the hollow filaments 501 to 508 and 511 to 518 be
transparent. A value of light transmittance may depend on purpose,
but the value is preferably 80% or more with a target wavelength,
and the value of 90% or more is optimal. In other words, as shown
in FIG. 9A, it is preferred that the second support 6, the second
adhesive layer 1b, and a hollow filament 58 be transparent at a
predetermined position, or that the hollow filament 58 be exposed
and at least the exposed portion of the hollow filament 58 be
transparent.
[0031] In comparison with a free state, fixing the hollow filaments
501 to 508 and 511 to 518 to the first support 2 produces an
excellent advantage in that various environments around the hollow
filaments such as temperature, an electric field, and a magnetic
field can be easily controlled. This is advantageous in performing
a chemical reaction or chemical analysis, and is particularly
essential for micronized reaction system and analysis system. There
is another advantage in that the hollow filaments 501 to 508 and
511 to 518 are easily aligned with and connected to parts, and a
number of the hollow filaments 501 to 508 and 511 to 518 can be
accommodated compactly.
[0032] Further, when performing chemical analysis, providing the
plurality of hollow filaments 501 to 508 and 511 to 518 is
advantageous in that operation efficiency is improved. In this
case, it is required that the lengths of the plurality of hollow
filaments 501 to 508 constituting the first hollow filament group
are equal to each other from a viewpoint that, when the analysis
starts simultaneously in the hollow filaments, results of the
analysis should be obtained almost simultaneously. Similarly, it is
required that the lengths of the plurality of hollow filaments 511
to 518 constituting the second hollow filament group are equal to
each other. In other words, it is important that amounts of energy
applied from the outside to the inlets through the outlets for a
sample are uniform, and that there is little difference between the
amounts of energy applied to the hollow filaments. From this
viewpoint, it is preferred that the hollow filaments 501 to 508 and
511 to 518 be sandwiched by at least two supports so that
distribution of heat conducted through the hollow filaments 501 to
508 and 511 to 518 is uniform.
[0033] Moreover, it is preferred that the plurality of hollow
filaments 501 to 508 constituting the first hollow filament group
and the plurality of hollow filaments 511 to 518 constituting the
second hollow filament group be arrayed at mutually equal
intervals. Furthermore, it is preferred that the plurality of
hollow filaments 501 to 508 constituting the first hollow filament
group and the plurality of hollow filaments 511 to 518 constituting
the second hollow filament group have a uniform tube thickness.
[0034] Commercially available tubes made from various materials can
be used for the plurality of hollow filaments 501 to 508 and 511 to
518, and tubes made of an arbitrary material may be selected
depending on a purpose. These materials include, for example, an
organic material such as polyvinyl chloride resin (PVC),
polyvinylidene chloride resin, polyvinyl acetate resin, polyvinyl
alcohol resin (PVA), polystyrene resin (PS), acrylonitrile
butadiene styrene copolymer (ABS), polyethylene resin (PE),
ethylene-vinyl acetate copolymer (EVA), polypropylene resin (PP),
poly-4-methylpentene (TPX), polymethyl methacrylate (PMMA), PEEK,
PI, PEI, PPS, cellulose acetate, polytetrafluoroethylene resin
(PTFE), tetrafluoroethylene-hexafluoropropylene resin (FEP), PFA,
polyethylene-tetrafluoroethylene copolymer (ETFE),
polychlorotrifluoro-ethylene (PCTFE), polyvinylidene fluoride
(PVDF), polyethylene terephthalate resin (PET), polyamide resin
(nylon), polyacetal (POM), polyphenylene terephthalate (PPT),
polycarbonate resin (PC), polyurethane resin, polyesterelastomer,
polyolefin resin, silicone resin, and polyimide resin, and an
inorganic material such as glass, quartz, and carbon.
[0035] Material type, shape and size of the first support 2 may be
selected depending on a purpose. An appropriate range of the board
thickness or film thickness of the first support 2 is
differentiated depending on a purpose or a required function. For
example, where electrical insulation properties are required in the
first support 2, selected is an epoxy resin board or a polyimide
resin board used for a printed wiring board, a polyimide film
represented by Kapton film by DuPont Corporation used for a
flexible printed wiring board, or a PET film represented by
Lumirror Film by Toray Industries Inc. It is preferred that the
first support 2 have a large board thickness (film thickness), and
the thickness of 0.05 mm or larger is particularly preferred.
Moreover, where heat dissipation properties are required in the
first support 2, a metal board such as an aluminum (Al) board, a
copper (Cu) board, a stainless steel board, and a titanium (Ti)
board is selected. It is preferred that the thickness of the first
support 2 is even thicker, and the thickness of 0.5 mm or larger is
particularly preferred. Further, where light transmittivity is
required in the first support 2, selected is a board made of a
transparent inorganic material such as glass and quartz, or a board
or film made of a transparent organic material such as
polycarbonate and acryl. It is preferred that the first support 2
has a small board thickness (film thickness), and a thickness of
0.5 mm or smaller is particularly preferred. It is also possible to
use so-termed flexible circuit board or printed circuit board in
which a metal pattern such as a copper pattern is formed on the
surface of the first support 2 by etching or plating. In virtue of
this, it becomes possible to form a terminal or a circuit which
implements various parts and elements such as a micromachine, a
heater element, a piezoelectric element, various sensors including
those of temperature, pressure, distortion, vibration, voltage,
magnetic field, and the like, an electronic part such as a
resistor, a capacitor, a coil, a transistor, and an IC, and an
optical part such as a laser diode (LD), a light emitting diode
(LED) and a photodiode (PD). Thus, systemization becomes easy.
[0036] The first adhesive layer 1a formed on the surface of the
first support 2 is preferably a pressure sensitive or
photosensitive adhesive. These materials realize stickiness or
adhesion by application of pressure or light thereto. Therefore,
these materials are suitable for the case where the hollow
filaments (hollow capillaries) are mechanically laid. As for the
pressure sensitive adhesive, a high-molecular weight synthetic
rubber adhesive or a silicone resin adhesive is appropriate. The
high-molecular weight synthetic rubber may be, for example,
polyisobutylene such as Vistanex MML-120 by Tonex Co., Ltd.,
acrylonitrile-butadiene rubber such as Nipol N1432 by Zeon
Corporation, chlorosulfonated polyethylene such as Hypalon 20 by
DuPont Corporation, and the like. In this case, the first adhesive
layer 1a can be formed in a manner that these materials are
dissolved into a solvent, applied directly onto the first support 2
and dried. Further, a crosslinking agent may be compounded in these
materials as necessary. It is also possible to use a pressure
sensitive adhesive double coated tape made of acrylic resin, such
as No. 500 by Nitto Denko Corporation, A-10, A-20, A-30 or the like
by 3M Corporation, and the like. As for the silicone resin
adhesive, a suitable adhesive is a silicone rubber made from
high-molecular weight polydimethylsiloxane or
polymethylphenylsiloxane and containing terminal silanol groups, or
a silicone adhesive whose main ingredient is a silicone resin like
a methyl silicone resin or a methylphenyl silicone resin. Various
crosslinking can be performed in order to control cohesive
strength. For example, crosslinking can be performed by an addition
reaction of silane, a condensation reaction of alkoxy, a
condensation reaction of acetoxy, and a radical reaction by
peroxide or the like. Commercially available adhesives of the above
kind include YR3286 (product name, produced by GE Toshiba Silicones
Co., Ltd.), TSR1521 (product name, produced by GE Toshiba Silicones
Co., Ltd.), DKQ9-9009 (product name, produced by Dow Corning
Corporation) and the like. As for the photosensitive adhesive, for
example, a dry film resist used as an etching resist of a printed
circuit board, a solder resist ink, a photosensitive buildup
material of a printed circuit board can be employed. Specifically,
H-K440 by Hitachi Chemical Co., Ltd., Probimer by Ciba-Geigy
Corporation or the like can be used. Particularly, a photovia
material provided for use in a buildup wiring board is durable to a
manufacturing process of a printed wiring board and to a process of
mounting parts by soldering. Any kind of material can be used as
such material as long as it is a copolymer containing functional
groups which can be crosslinked by light, or a composition
containing monomer, and/or a composition obtained by mixing
functional groups which can be crosslinked by heat in stead of
light and a thermal polymerization initiator.
[0037] The first adhesive layer 1a may be epoxy resin, brominated
epoxy resin, cycloaliphatic epoxy resin such as rubber-modified
epoxy resin and rubber-dispersed epoxy resin, or bisphenol A epoxy
resin and acid modifications of these epoxy resins. Particularly,
when photo-curing is performed by illumination, modifications made
of these epoxy resins and unsaturated acid are preferred.
Unsaturated acid may include maleic anhydride, tetrahydrophthalic
anhydride, itaconic acid anhydride, acrylic acid, methacrylic acid,
and the like. These modifications are obtained by reacting
unsaturated carboxylic acid with epoxy groups of epoxy resin with a
compounding ratio in which an amount of unsaturated carboxylic acid
is equal to or less than epoxy groups. Apart from the above, a
thermosetting material such as melamine resin and cyanate ester
resin, or a combination of such thermosetting material and phenolic
resin is also a part of favorable application examples. In
addition, a combination of such resin and a material which adds
flexibility is also favorable. Examples of this include
acrylonitrile-butadiene rubber, natural rubber, acrylic rubber,
SBR, carboxylic acid-modified acrylonitrile-butadiene rubber,
carboxylic acid-modified acrylic rubber, crosslinking NBR
particles, carboxylic acid-modified crosslinking NBR particles and
the like. By adding various resin components, a curing material can
be provided with various properties while maintaining basic
properties such as photo-curing and thermosetting. For example, a
combination with epoxy resin or phenolic resin can add good
electrical insulating properties to a curing material. When a
rubber component is compounded, a curing material is provided with
toughness, and, at the same time, the surface of the curing
material can be roughened easily by surface treatment using an
oxidizing chemical solution. Further, additives (polymerization
stabilizer, leveling agent, pigment, dye and the like), which are
commonly used, may also be added. It is perfectly acceptable to
compound a filler. The filler may include inorganic microparticles
such as silica, fused silica, talc, alumina, hydrated alumina,
barium sulfate, calcium hydroxide, aerosol, and calcium carbonate,
organic microparticles such as powdered epoxy resin and powdered
polyimide particles, and powdered polytetrafluoroethylene
particles. These fillers may be subjected to coupling treatment in
advance. Dispersion of these fillers can be achieved by a known
mixing method such as a kneader, a ball mill, a bead mill, and a
triple-roll mill. A method of forming a photosensitive resin of
this kind may be a coating method such as a roll coating, curtain
coating and dip coating, and a method of producing films of an
insulating resin on a carrier film and sticking the films together
by a laminator. Specifically, a photo-via film BF-8000 by Hitachi
Chemical Co., Ltd. or the like can be used.
[0038] Earlier-described various materials for the first support 2
can be used for the second support 6. Further, the second adhesive
layer 1b is inserted between the second support 6 and the second
hollow filament group constituted by the plurality of hollow
filaments 511 to 518. This is preferable since the first hollow
filament group constituted by the plurality of hollow filaments 501
to 508 and the second hollow filament group constituted by the
plurality of hollow filaments 511 to 518 are provided with
increased protection. By selecting a mesh-like film or a porous
film as the second support 6, a problem such as trapped air bubbles
when laminating becomes difficult. This mesh-like film or a fabric
may be a polyester mesh TB-70 by Tokyo Screen Co., Ltd. The porous
film may be Duragard by Celanese Chemicals, Ltd., Celgard 2400 by
Daicel Chemical Industries, Ltd., for example.
[0039] The earlier-described various materials for the first
adhesive layer 1a can be used for the second adhesive layer 1b.
(Manufacturing Method of Support Unit for Microfluidic System)
[0040] Next, a manufacturing method of the support unit for a
microfluidic system according to the first embodiment of the
present invention is described using FIGS. 2 to 8.
[0041] (a) First of all, as shown in FIG. 2, the first adhesive
layer 1a is formed on the surface of the first support 2 to have
the same shape and approximately the same size as the first support
2. Then, as shown in FIGS. 3A and 3B, four rectangle release layers
3a, 3b, 3c, and 3d are equally formed on the peripheral portions of
the surface of the first adhesive layer 1a. These release layers
3a, 3b, 3c and 3d are formed on the surface of the first adhesive
layer 1a by a method of applying a commercially available release
agent or sticking release-films to predetermined portions of the
surface of the first adhesive layer 1a. Next, slits 4a, 4b, 4c and
4d are provided in the first support 2 by a cutter or the like. For
example, the slits are made at positions adjacent to the inner
lines of the respective four release layers 3a, 3b, 3c and 3d.
[0042] (b) Next, as shown in FIGS. 4A and 4B, the first hollow
filament group constituted by the plurality of hollow filaments 501
to 508 is laid in a vertical direction from the release layer 3b
towards the release layer 3d, on the surface of the first support 2
on which the first adhesive layer 1a is formed. Although not
illustrated, an NC wiring machine 61 similar to that shown in FIG.
5A is used when laying the first hollow filament group. (There is a
wiring machine disclosed in Japanese Patent Laid-Open Publication
(Kokai) No. 2001-59910 as such a wiring machine. Further, a machine
disclosed in Japanese Examined Patent Publication (Kokoku) No.
Showa 50 (1975)-9346 can apply a load and ultrasonic vibration
while wiring. Furthermore, a machine disclosed in Japanese Examined
Patent Publication (Kokoku) No. Heisei 7 (1995)-95622 is capable of
applying a load and emitting a laser beam.) The NC wiring machine
61 is numerically controlled and is capable of controlling outputs
of ultrasonic vibration and a load. By using this NC wiring machine
61, a laid pattern of the first hollow filament group constituted
by the plurality of hollow filaments 501 to 508 can be precisely
controlled. Specifically, the NC wiring machine 61 applies a load
and vibration by an ultrasonic wave to the first hollow filament
group constituted by the hollow filaments 501 to 508, while moving
in parallel with the first support 2.
[0043] (c) Next, as shown in FIGS. 5A and 5B, the second hollow
filament group constituted by the plurality of hollow filaments 511
to 518 is laid in a direction from the release layer 3a towards the
release layer 3c intersecting with the first hollow filament group
constituted by the plurality of hollow filaments 501 to 508 which
has already been laid. As shown in FIG. 5A, the NC wiring machine
61 is used when laying the second hollow filament group. Thus, a
laid pattern of the second hollow filament group constituted by the
plurality of hollow filaments 511 to 518 can be controlled
precisely. Specifically, the NC wiring machine 61 applies a load
and vibration by an ultrasonic wave to the second hollow filament
group constituted by the plurality of hollow filaments 511 to 518,
while moving in parallel with the first support 2. However, the NC
wiring machine 61 is set to stop a load and ultrasonic vibration at
the position where the first hollow filament group constituted by
the hollow filaments 501 to 508 and the second hollow filament
group constituted by the hollow filaments 511 to 518 intersect with
each other. By stopping a load and/or ultrasonic vibration near the
intersection of the first hollow filament group and the second
hollow filament group, stress on the hollow filaments 501 to 508
and 511 to 518 is reduced, and breakage of the hollow filaments 501
to 508 and 511 to 518 can be prevented.
[0044] (d) Next, as shown in FIGS. 6A and 6B, the second adhesive
layer 1b having the same shape and almost the same size as the
first support 2 is formed so as to cover the first hollow filament
group constituted by the plurality of hollow filaments 501 to 508
and the second hollow filament group constituted by the plurality
of hollow filaments 511 to 518, which have already been laid.
Further, the second support 6 having the same shape and size as the
first support 2 is prepared and adhered (laminated) onto the second
adhesive layer 1b. Various methods are considered for laminating
the second support 6. Where the second support 6 is a mesh-like
film or a porous film, this protection film can be closely adhered
to the second adhesive layer 1b without air trapped in the
interface, by applying a little pressure. However, where the second
support 6 is a uniform film, there is no way to avoid air bubbles
remaining in the interface. In this case, pressing the film with
high pressure may be considered, but a large force is applied onto
the hollow filaments 501 to 508 and 511 to 518 and the hollow
portions of the filaments are deformed. Further, there is a problem
in that, for example, a large force is locally applied onto the
intersection between the first hollow filament group and the second
hollow filament group, and the filaments at the intersection are
broken. In such a case, it is preferred to use a vacuum laminating
machine to create a vacuum state before the second support 6 is
closely adhered to the second adhesive layer 1b and, thereafter, to
press and bond the second support 6 to the second adhesive layer 1b
at low pressure. This is because there will be no air trapped in
the interface, and a large stress does not remain in the hollow
filaments 501 to 508 and 511 to 518, causing no breakage of the
hollow filaments.
[0045] (e) Thereafter, the support unit is cut along a cutting line
7 in a desired shape shown by a dotted line in FIG. 7B. A method of
making the support unit for a microfluidic system into the desired
shape is cutting the support unit by a cutter or cutting the same
by pressing a metal blade fabricated to have the desired shape in
advance. However, automation of cutting with a cutter is difficult,
and, as for the blade, fabrication of jigs takes time and effort.
Therefore, it is preferred to use an NC driven laser beam machine
as it only requires data preparation to operate. Further, with
regard to the laser beam machine, it is preferred to use a laser
beam driller for drilling small diameter holes in a printed circuit
board rather than a machine with a large output designated for
cutting. The laser beam driller for a printed circuit board is
preferred since it has a large energy output per unit period,
drills a hole by a plurality of shots at the same position, and
moves by a measure of about half the diameter of the hole, thus
causing the very small number of laser scorches. As shown in FIG.
7B, the support unit is cut along a cutting line 7 set so as to
overlap positions 4a where the slits 4a, 4b, 4c and 4d are made in
advance. As shown in FIG. 7A, by making the slits 4a, 4b, 4c and 4d
in advance, the first adhesive layer 1a and the second adhesive
layer 1b are automatically peeled off near the end of the hollow
filament 518. Although not illustrated, at the ends of the other
hollow filaments 501 to 508, 511, 512, 513, . . . , 517, the first
adhesive layer 1a and the second adhesive layer 1b are similarly
peeled off automatically. The first hollow filament group
constituted by the plurality of hollow filaments 501 to 508 and the
second hollow filament group constituted by the plurality of hollow
filaments 511 to 518 are laid on the first adhesive layer 1a.
Thereafter, the second support 6 is adhered to the hollow filaments
through the second adhesive layer 1b. With this construction, a
process of exposing the ends of the plurality of hollow filaments
501 to 508 and 511 to 518 becomes complicated. Therefore, the slits
4a, 4b, 4c and 4d are provided in advance at the boundary lines
between the portions which are unnecessary and removed ultimately
and the portion to remain as the first support 2, thus facilitating
the process of exposing the ends of the hollow filaments 501 to 518
and 511 to 518.
[0046] (f) After cutting the support unit along the cutting line 7
shown by the dotted line in FIG. 7B, the release layer 3b and the
release layer 3d positioned near the ends of the hollow filaments
501 to 508 are removed, and further, the release layer 3a and the
release layer 3c positioned near the ends of the hollow filaments
511 to 518 are removed. Thus, the support unit for a microfluidic
system shown in FIGS. 1A and 1B is completed.
[0047] As described above, the release layers 3a, 3b, 3c and 3d are
provided on the surfaces of the ends of the first support 2 which
become unnecessary and are ultimately removed, as shown in FIGS. 4A
and 4B. This makes it even easier to carry out the process of
drawing out the first hollow filament group constituted by the
plurality of hollow filaments 501 to 508 and the second hollow
filament group constituted by the plurality of hollow filaments 511
to 518 respectively from the ends of the support unit for a
microfluidic system. However, care should be taken for the lengths
of the exposed portions of the hollow filaments 501 to 508 and 511
to 518. The reason is as follows. The unexposed portions of the
hollow filaments 501 to 508 and 511 to 518 are fixed, and it is
thus easy to control factors such as temperature, flow velocity
distribution, electrophoretic velocity distribution, and applied
voltage, of the fluid within the hollow filaments 501 to 508 and
511 to 518. Meanwhile, the exposed portions of the hollow filaments
501 to 508 and 511 to 518 are not fixed and are in a free state,
and it is thus difficult to control each of the above factors.
Further, careless handling easily causes breakage of the exposed
portions of the hollow filaments 501 to 508 and 511 to 518.
Therefore, it is important to make the lengths of the exposed
portions as short as possible, and it is preferred that the lengths
of the exposed portions be at least shorter than the lengths of the
unexposed portions.
[0048] Moreover, in the manufacturing method of the support unit
for a microfluidic system according to the first embodiment of the
present invention, the hollow members (hollow filaments) 501 to 508
and 511 to 518 are used. Therefore, appropriate thoughts should be
put into design and manufacturing. Apart from the laying conditions
on the intersection between the first hollow filament group and the
second hollow filament group, there are thoughts put on forming
conditions of the second support 6 serving as a protection film
layer. Further, considerations should be made regarding laying
conditions of the respective straight portions of the first hollow
filament group constituted by the plurality of hollow filaments 501
to 508 and the second hollow filament group constituted by the
plurality of hollow filaments 511 to 518, and curvature conditions
on the hollow filaments 501 to 508 and 511 to 518. These conditions
cannot be set generally since they largely depend on the material
of the hollow filaments 501 to 508 and 511 to 518 and the
specification of the first adhesive layer 1a. In other words, it is
required to set design and manufacturing conditions suitable for
the hollow filaments 501 to 508 and 511 to 518 and the first
adhesive layer 1a to be used. If this operation is neglected, good
hollow portions cannot be ensured and, in addition, defects occur
in the hollow filaments 501 to 508 and 511 to 518, causing
incidents such as leakage of a fluid.
Second Embodiment
[0049] As shown in FIGS. 8A and 8b, a support unit for a
microfluidic system according to a second embodiment of the present
invention is different from the support unit for a microfluidic
system according to the first embodiment of the present invention
shown in FIGS. 1A and 1B in that the support unit for a
microfluidic system according to the second embodiment has an relay
portion 8. The first adhesive layer 1a, the second adhesive layer
1b, and the second support 6 form the wall portion of the relay
portion 8, and the first support 2 is the bottom portion of the
same. The rest is similar to the first embodiment, and duplicated
description is thus omitted.
[0050] As shown in FIGS. 8A and 8B, the relay portion 8 has a
construction where hollow filaments 58 are exposed between the
first adhesive layer 1a and the second adhesive layer 1b. The
exposed hollow filaments 58 discharge a fluid. The relay portion 8
enables the discharged fluid to be mixed or branched. The shape and
size of the relay portion 8 may be decided depending on the flow
quantity of the fluid. For example, where the total thickness of
flow channels formed by two or three hollow filaments 58 with .phi.
200 .mu.m, and the first adhesive layer 1a and the second adhesive
layer 1b, which hold the hollow filaments 58, is 200 .mu.m, the
relay portion 8 may have a cylindrical shape with about .phi.2 mm
to .phi.7 mm.
[0051] Laser beam machining is preferred for removal of the first
adhesive layer 1a, the second adhesive layer 1b, and the hollow
filaments 58 at a predetermined position which becomes the relay
portion 8. Laser beam machining is particularly preferred where the
volume of the removed portion, that is, the volume of the relay
portion 8 is as small as a volume in cubic millimeters or smaller.
A laser used for laser beam machining is a carbon dioxide gas
laser, a YAG laser, an excimer laser, and the like, and may be
selected depending on the materials of the first adhesive layer 1a,
the second adhesive layer 1b, and the hollow filament 58. Note
that, where the relay portion 8 is formed by a laser, it is
preferred to use the first support 2 with a metal thin film such as
a copper or aluminum film formed on the surface thereof. The metal
thin film serves as a laser beam stopper. When the volume of the
relay portion 8 is in cubic centimeters or larger and a large area
is thus removed, machining by a drill or the like may be applied.
In the case of machining, a desmear treatment for removing resin
shavings produced while cutting is added.
[0052] A method of allowing the second support 6 to be a part of
the relay portion 8 may be a process of machining the second
support 6 to have a shape so that the second support 6 becomes a
part of the relay portion 8. This process is carried out after the
second support 6 is adhered to the second adhesive layer 1b. In
this case, a method of sticking the second support 6 by a needle
such as an injection needle, or the like, is appropriate.
[0053] Further, another method may be a method of machining the
second support 6 to have a shape so that the second support 6
becomes a part of relay portion 8, simultaneously with the
formation of the relay portion 8 in the first adhesive layer 1a and
the second adhesive layer 1b. In this case, a method of machining
the entire layers at once by the foregoing laser, or the like, is
appropriate.
[0054] Further, yet another method may be a method of machining the
second support 6 in advance to have a shape so that the second
support 6 becomes a part of the relay portion 8, and then adhering
the second support 6 to the second adhesive layer 1b. The method of
machining the second support 6 may be drilling, punching, laser
beam machining or the like.
[0055] According to the support unit for a microfluidic system
according to the second embodiment of the present invention,
provision of the relay potion 8 makes it possible to mix or branch
a fluid flowing through the hollow filaments 58. Further, the
second support 6 becomes a part of the relay portion 8. Thus, the
relay portion 8 can have an open structure, enabling a new fluid to
be filled into the relay portion from outside and enabling the
fluid within the relay portion 8 to be removed.
Example 1
[0056] Kapton 300H by DuPont Corporation with a thickness of 75
.mu.m was used as the first support 2. On the surface of the first
support 2, a VBH A-10 film by 3M Corporation having a thickness of
250 .mu.m and stickiness at room temperature was laminated by a
roll laminator as shown in FIG. 2. As shown in FIGS. 3A and 3B,
one-sided release paper was provided as the release layers 3a, 3b,
3c and 3d at desired positions on the first support 2 so that the
release surfaces were closely adhered to the adhesive surface.
Further, as shown in FIGS. 4A and 4B, the slits 4a, 4b, 4c and 4d
were made by a cutter at desired positions in the first support 2.
Then, as shown in FIG. 5A, the hollow filaments 501 to 508 and 511
to 518 constituted by high-performance engineering plastic tubes by
Nirei Industry Co., Ltd. (material: PEEK, inner diameter of 0.2 mm,
outer diameter 0.4 mm) 62 were laid onto the first support 2 by
using an NC wiring machine 61 which is capable of output control of
ultrasonic vibration and a load and capable of moving an X-Y table
by NC control. A lord of 80 g and vibration by an ultrasonic wave
with frequency of 30 kHz were applied to the hollow filaments 501
to 508 and 511 to 518 to be laid. As shown in FIG. 5B, the hollow
filaments 501 to 508 and 511 to 518 were laid to have an arcuate
shape with a radius of 5 mm and an intersection therebetween was
provided. The load and ultrasonic vibration could be stopped near
the intersection. Kapton 300H by DuPont Corporation, on which a VBH
A-10 film by 3M Corporation was laminated by the use of a roll
laminator, was used as the second support 6. The second support 6
was laminated by a vacuum laminator on the surface of the second
filament group constituted by the plurality of hollow filaments 511
to 518, as shown in FIGS. 6A and 6B. Thereafter, a laser beam
driller for drilling small diameter holes in a printed circuit
board was used for machining of the outer shape, and a hole with
.phi.0.2 mm was made at an interval of 0.1 mm with a pulse width of
5 ms and four shots, and the support unit was cut into a wide cross
shape along the desired cutting line 7 shown in FIG. 7B. At this
time, the support unit was cut so as to overlap the portions where
the slits 4a, 4b, 4c and 4d had been respectively made in advance
in the positions where the eight hollow filaments in 0.4 mm-pitch
were collectively in flat cable shape. Thereafter, the portions of
the first support 2, where the release layers 3a, 3b, 3c and 3d had
been stuck near the ends of the hollow filaments 501 to 508 and 511
to 518, could be easily removed. Then, a support unit for a
microfluidic system was fabricated so that the support unit had a
shape where the first hollow filament group constituted by eight
hollow filaments 501 to 508 with an overall length of 20 cm and the
second hollow filament group constituted by the hollow filaments
511 to 518 with an overall length of 20 cm were exposed at their
ends, and the length of each exposed end was 10 mm. There was no
breakage in the entire portions where the hollow filaments were
laid, particularly in the portion where the hollow filaments
intersect with each other.
[0057] As a result, variations in positions of the flow channels
formed by the first hollow filament group constituted by the
plurality of hollow filaments 501 to 508 and the second hollow
filament group constituted by the plurality of hollow filaments 511
to 518 were within +/-10 .mu.m or smaller with reference to a
design drawing. The support unit for a microfluidic system was put
in a thermoregulator, and the temperature was maintained at 80
degrees centigrade. Liquid color ink was then flown from one ends
of the hollow filaments, and duration of time until the ink was
flown out were measured by a measurement instrument such as a
stopwatch. The ink flew out from the other ends of the eight hollow
filaments almost at the same moment (+/-1 second or shorter).
Example 2
[0058] A 0.5 mm-thick aluminum plate was used as the first support
2. Then, as shown in FIG. 2, a non-stick pressure sensitive
adhesive S9009 by Dow Corning Asia Ltd. was laminated onto the
surface of the aluminum plate as the first adhesive layer 1a by a
roll laminator. Further, as shown in FIGS. 3A and 3B, the release
layers 3a, 3b, 3c and 3d made of one-sided release paper were
provided as films without stickiness onto the surfaces of the
portions of the first adhesive layer 1a, which were near the ends
of the hollow filaments and would be unnecessary. The release
layers 3a, 3b, 3c were provided so that the release surfaces
thereof were closely adhered to the adhesive surface. As shown in
FIGS. 4A and 4B and FIGS. 5A and 5B, glass tubes ESG-2 by Hagitec
Co., Ltd. (inner diameter of 0.8 mm and outer diameter of 1 mm)
were laid on the above layers by using the NC wiring machine 61
capable of output control of ultrasonic vibration and a load, and
capable of moving an X-Y table by NC control. A lord of 100 g and
vibration by an ultrasonic wave with frequency of 20 kHz were
applied to the hollow filaments 501 to 508 and 511 to 518 to be
laid. As shown in FIG. 5B, the hollow filaments 501 to 508 and 511
to 518 were laid to have an arcuate shape with a radius of 10 mm
and an intersection therebetween was provided. The load and an
ultrasonic vibration were stopped near the intersection. Kapton
200H by DuPont Corporation, which is the same as the film support,
was used as the second support 6 and laminated by a vacuum
laminator on the support unit on which the hollow filaments 501 to
508 and 511 to 518 had been laid, as shown in FIGS. 6A and 6B. At
this time, thermocouples for temperature measurement were buried
near the inlet, outlet and intersection of the hollow filaments 501
to 508 and 511 to 518. Thereafter, for machining of the outer shape
shown in FIGS. 7A and 7B, the support unit was cut into a desired
shape by using an outer shape process machine for a printed circuit
board. At this time, the support unit was cut so as to overlap the
portions where the slits 4a, 4b, 4c and 4d had been respectively
made in the portion where twelve hollow filaments with 1 mm-pitch
were collectively in flat cable shape. Thereafter, the portions of
the support, where the non-stick films had been stuck near the ends
of the plurality of hollow filaments 501 to 508 and 511 to 518,
could be easily removed. Then, a support unit for a microfluidic
system was fabricated to have a shape where the twelve hollow
filaments 501 to 508 and 511 to 518 with an overall length of 40 cm
were exposed with each exposed portion having a length of 50 mm.
Variations in positions of the flow channels formed by the hollow
filaments 501 to 508 and 511 to 518 were within +/-20 .mu.m or
smaller with reference to a design drawing. There was no breakage
in the entire portions where the hollow filaments were laid,
particularly in the portion where the hollow filaments 501 to 508
and 511 to 518 intersect with each other.
[0059] A film heat FTH-40 by Kyohritsu Electronic Industry Co.,
Ltd. was stuck to the entire back surface of the aluminum plate and
temperature was set at 90 degrees centigrade. Water at about 20
degrees centigrade was flown from the one ends of the hollow
filaments, and temperature of water flown out from the other ends
was measured. The measured temperature was 88+/-1 degrees
centigrade. Moreover, temperature at the inlet, outlet and
intersection was 89+/-0.5 degrees centigrade, and temperature could
be accurately regulated.
Example 3
[0060] As shown in FIGS. 8A and 8B, a copper-clad laminate (plate
thickness of 0.2 mm) having 18 .mu.m-thick copper on its surface
was used as the first support 2. On the surface of the copper-clad
laminate, a pressure sensitive adhesive S9009 by Dow Corning Asia
Ltd. (thickness of 200 .mu.m), which is non-stick at room
temperature, was laminated by a roll laminator as the first
adhesive layer 1a and the second adhesive layer 1b.
High-performance engineering plastic tubes by Nirei Industry Co.,
Ltd. (material: PEEK, inner diameter of 0.2 mm, outer diameter of
0.4 mm) were laid by using a wiring machine for multi-wiring, which
is capable of output control of ultrasonic vibration and a load and
capable of moving an X-Y table by NC control. A load of 80 g and
vibration by an ultrasonic wave with frequency of 30 kHz were
applied to the hollow filaments 58 to be laid. The hollow filaments
58 were laid to have an arcuate shape with a radius of 5 mm and an
intersection therebetween was provided. The load and ultrasonic
vibration was stopped near the intersection. Kapton 200H by DuPont
Corporation, on which S9009 by Dow Corning Asia Ltd. (thickness of
200 .mu.m) was laminated by a roll laminator, was used as the
second support 6. The second support 6 was laminated by a vacuum
laminator on the surface where the hollow filaments 58 were
laid.
[0061] Thereafter, a laser beam driller for small diameter holes in
a printed circuit board was used with a pulse width of 5 ms and 4
shots to make a hole with .phi.0.2 mm in the second support 6, the
first adhesive layer 1a, the second adhesive layer 1b and the
hollow filaments 58, at the position which would be the relay
portion 8. Thereafter, a router was used to process the outer
shape, thus fabricating a support unit for a microfluidic system
having the relay portion 8 where a plurality of flow channels is
connected to each other.
Other Examples
[0062] The present invention has been described based on the
foregoing aspects. However, it should be understood that the
sections and drawings constituting a part of this disclosure do not
limit this invention. Various alternative embodiments, examples and
application technologies will be apparent to those skilled in the
art from this disclosure.
[0063] For example, as shown in FIG. 9A, a through hole is provided
in a part of the support unit for a microfluidic system. The
support unit may be used like a micropump or a microvalve which
applies a time-periodic force to a part of a hollow filament 58 by
using a motor with a cam, or the like, to deform the hollow
filament at the position where the force is applied, thus moving a
fluid at the position and causing pulsating flow. In this case, it
is preferred that the hollow filament 58 have elasticity. In
particular it is preferred that Youngs modulus of the hollow
filament 58 is 10.sup.3 MPa or lower.
[0064] Moreover, as shown in FIG. 9B, it is possible to form a
metal film 59 on a part of the exposed hollow filament 58 to form a
terminal to which a voltage or the like is applied. In this case,
it is preferred that the metal film 59 be formed by plating or
deposition of a single layered or multi-layered Cu, Al, nickel
(Ni), chrome (Cr), gold (Au), or the like.
[0065] Further, as shown in FIGS. 8A and 8B, the support unit for a
microfluidic system is provided with the relay portion 8 which is
an opening portion. However, where the relay portion 8 is only for
mixing or branching a fluid, the relay portion 8 may have a closed
structure without removing the second support 6 as shown in FIG.
10.
[0066] Furthermore, the first hollow filament group and the second
hollow filament group do not necessarily intersect with each other
at 90 degrees and may only intersect with each other. Therefore,
for example, not only the first and second hollow filament groups
but also a third hollow filament group may be laid.
[0067] On the other hand, the hollow filaments do not necessarily
intersect with each other. As shown in FIGS. 11A to 11C and 12,
there may be only the first hollow filament group constituted by
the plurality of hollow filaments 501 to 508 running in one
direction.
[0068] Moreover, as shown in FIG. 13, the plurality of hollow
filaments 511 to 518 with curvatures may be laid.
[0069] Note that the number of the hollow filaments to be laid is
not necessarily plural. In other words, the number of the hollow
filaments to be laid may be single.
INDUSTRIAL APPLICABILITY
[0070] As described above, according to the present invention, it
is possible to provide a support unit for a microfluidic system,
which is easily manufactured and has a long flow channel in
centimeters that does not limit the number of steps and an amount
of a fluid for reaction and analysis.
[0071] As a result, according to the present invention, it is
possible to provide a fluidic circuit (a microfluidic system) with
good accuracy and fewer manufacturing variations. Further, it is
possible to three-dimensionally lay the first hollow filament group
constituted by the plurality of hollow filaments and the second
hollow filament group constituted by the plurality of hollow
filaments, which intersects with the first hollow filament group
orthogonally. Thus, a small microfluidic system can be provided
even with a complicated flow circuit.
[0072] Moreover, according to the present invention, it is possible
to provide a support unit for a microfluidic system in which hollow
filaments are arrayed to serve as fluidic channels, and a method of
manufacturing such a support unit for a microfluidic system with
good accuracy and less manufacturing variations.
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