Nakaso; Akishi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Nakaso; Akishi.The latest application filed is for "micro fluid system support and manufacturing method thereof".

Company Profile

0.22.14

Nakaso; Akishi - Shimodate N/A JP
Nakaso; Akishi - Oyama JP
NAKASO; Akishi - Oyama-shi JP
Nakaso; Akishi - Shimodate-shi JP
Nakaso; Akishi - Tochigi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Micro fluid system support and manufacturing method thereof Grant 8,889,084 - Kawazoe , et al. November 18, 2	2014-11-18
Micro fluid system support and manufacturing method thereof Grant 8,865,090 - Kawazoe , et al. October 21, 2	2014-10-21
Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof Grant 8,028,402 - Nakamura , et al. October 4, 2	2011-10-04
Micro Fluid System Support And Manufacturing Method Thereof App 20110036479 - KAWAZOE; Hiroshi ; et al.	2011-02-17
Micro Fluid System Support And Manufacturing Method Thereof App 20090274585 - Kawazoe; Hiroshi ; et al.	2009-11-05
Micro Fluid System Support And Manufacturing Method Thereof App 20090274582 - KAWAZOE; Hiroshi ; et al.	2009-11-05
Micro Fluid System Support And Manufacturing Method Thereof App 20090274586 - KAWAZOE; Hiroshi ; et al.	2009-11-05
Micro Fluid System Support And Manufacturing Method Thereof App 20090274581 - Kawazoe; Hiroshi ; et al.	2009-11-05
Micro Fluid System Support And Manufacturing Method Thereof App 20090274583 - KAWAZOE; Hiroshi ; et al.	2009-11-05
Micro Fluid System Support And Manufacturing Method Thereof App 20090274584 - KAWAZOE; Hiroshi ; et al.	2009-11-05
Micro Fluid System Support And Manufacturing Method Thereof App 20090269245 - KAWAZOE; Hiroshi ; et al.	2009-10-29
Method of treating the surface of copper and copper Grant 7,588,835 - Yamashita , et al. September 15, 2	2009-09-15
Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof App 20090008141 - Nakamura; Hidehiro ; et al.	2009-01-08
Connection Board, And Multi-layer Wiring Board, Substrate For Semiconductor Package And Semiconductor Package Using Connection Board, And Manufacturing Method Thereof App 20080289868 - Nakamura; Hidehiro ; et al.	2008-11-27
Method Of Treating The Surface Of Copper And Copper App 20080096046 - Yamashita; Tomoaki ; et al.	2008-04-24
Connection Board, And Multi-layer Wiring Board, Substrate For Semiconductor Package And Semiconductor Package Using Connection Board, And Manufacturing Method Thereof App 20080010819 - NAKAMURA; Hidehiro ; et al.	2008-01-17
Connection substrate, multi-layer wiring board using the connection substrate, substrate for semiconductor package, and methods for manufacturing them App 20060162956 - Nakamura; Hidehiro ; et al.	2006-07-27
Micro fluid system support and manufacturing method thereof App 20050249637 - Kawazoe, Hiroshi ; et al.	2005-11-10
Substrate for mounting semiconductor chips Grant 6,281,450 - Urasaki , et al. August 28, 2	2001-08-28
Electromagnetically shielding bonding film Grant 6,207,266 - Kanbara , et al. March 27, 2	2001-03-27
Production of insulating varnishes and multilayer printed circuit boards using these varnishes Grant 6,197,149 - Kobayashi , et al. March 6, 2	2001-03-06
Electronic component parts device Grant 6,184,577 - Takemura , et al. February 6, 2	2001-02-06
Prepreg for printed circuit board Grant 5,965,245 - Okano , et al. October 12, 1	1999-10-12
Process for producing multilayer printed circuit boards Grant 5,945,258 - Shimizu , et al. August 31, 1	1999-08-31
Process for producing multilayer printed circuit board for wire bonding Grant 5,879,568 - Urasaki , et al. March 9, 1	1999-03-09
Chemical reducing solution for copper oxide Grant 5,736,065 - Nakaso , et al. April 7, 1	1998-04-07
Metal foil for printed wiring board and production thereof Grant 5,689,879 - Urasaki , et al. November 25, 1	1997-11-25
Process for producing multilayer printed circuit board Grant 5,690,837 - Nakaso , et al. November 25, 1	1997-11-25
Process for producing a printed wiring board Grant 5,638,598 - Nakaso , et al. June 17, 1	1997-06-17
Process for producing printed wiring board Grant 5,309,632 - Takahashi , et al. May 10, 1	1994-05-10
Process for treating copper surface Grant 4,902,551 - Nakaso , et al. February 20, 1	1990-02-20
Electroless copper plating solution Grant 4,557,762 - Nakaso , et al. December 10, 1	1985-12-10
Electroless copper deposition solution Grant 4,548,644 - Nakaso , et al. October 22, 1	1985-10-22
Method of improving adhesion between insulating substrates and metal deposits electrolessly plated thereon, and method of making additive printed circuit boards Grant 4,216,246 - Iwasaki , et al. August 5, 1	1980-08-05

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