U.S. patent application number 12/488366 was filed with the patent office on 2009-10-15 for mems device having a layer movable at asymmetric rates.
This patent application is currently assigned to QUALCOMM MEMS Technologies, Inc.. Invention is credited to Lior Kogut, Marc Mignard.
Application Number | 20090256218 12/488366 |
Document ID | / |
Family ID | 38236547 |
Filed Date | 2009-10-15 |
United States Patent
Application |
20090256218 |
Kind Code |
A1 |
Mignard; Marc ; et
al. |
October 15, 2009 |
MEMS DEVICE HAVING A LAYER MOVABLE AT ASYMMETRIC RATES
Abstract
A microelectromechanical (MEMS) device includes a substrate and
a movable layer mechanically coupled to the substrate. The movable
layer moves from a first position to a second position at a first
rate and from the second position to the first position at a second
rate faster than the first rate. The MEMS device further includes
an adjustable cavity defined between the substrate and the movable
layer and containing a fluid. The MEMS device further includes a
fluid conductive element through which the fluid flows at a first
flowrate from inside the cavity to outside the cavity upon movement
of the movable layer from the second position to the first position
and through which the fluid flows at a second flowrate slower than
the first flowrate from outside the cavity to inside the cavity
upon movement of the movable layer from the first position to the
second position.
Inventors: |
Mignard; Marc; (San Jose,
CA) ; Kogut; Lior; (Haifa, IL) |
Correspondence
Address: |
KNOBBE, MARTENS, OLSON & BEAR, LLP
2040 MAIN STREET, FOURTEENTH FLOOR
IRVINE
CA
92614
US
|
Assignee: |
QUALCOMM MEMS Technologies,
Inc.
San Diego
CA
|
Family ID: |
38236547 |
Appl. No.: |
12/488366 |
Filed: |
June 19, 2009 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
11360162 |
Feb 23, 2006 |
7550810 |
|
|
12488366 |
|
|
|
|
Current U.S.
Class: |
257/419 ;
257/E21.002; 257/E29.324; 438/53 |
Current CPC
Class: |
B81B 2203/053 20130101;
B81B 2201/047 20130101; B81B 3/0078 20130101; B81B 2201/054
20130101; G09G 2300/06 20130101; G09G 3/3466 20130101; G02B 26/001
20130101 |
Class at
Publication: |
257/419 ; 438/53;
257/E29.324; 257/E21.002 |
International
Class: |
H01L 29/84 20060101
H01L029/84; H01L 49/00 20060101 H01L049/00; H01L 21/02 20060101
H01L021/02 |
Claims
1. An electromechanical device comprising: a substrate comprising
an insulating layer; a movable layer mechanically coupled to the
substrate, the insulating layer on a portion of the substrate
facing the movable layer, the movable layer movable between a first
position and a second position with respect to the substrate,
wherein the movable layer is configured to move from the first
position to the second position at a first rate and wherein the
movable layer is configured to move from the second position to the
first position at a second rate that is faster than the first rate;
and an adhesive layer comprising a different material than the
insulating layer, the adhesive layer on at least a portion of the
substrate or the movable layer, the adhesive layer configured to
increase adhesion between the movable layer and the substrate when
the movable layer is in the position of the first position and the
second position that is closer to the substrate.
2. The device of claim 1, wherein the second rate is about 100
times faster than the first rate.
3. The device of claim 1, wherein the second position is further
from the substrate than is the first position.
4. The device of claim 1, wherein the device is substantially
reflective to incident light when the movable layer is in the first
position and wherein the device is substantially non-reflective to
incident light when the movable layer is in the second
position.
5. The device of claim 1, wherein the adhesive layer is on a
portion of the substrate.
6. The device of claim 1, wherein the adhesive layer is on a
portion of the movable layer facing away from the substrate.
7. The device of claim 1, wherein the adhesive layer is on a
portion of the movable layer facing towards the substrate.
8. The device of claim 1, wherein the adhesive layer comprises a
material selected from the group consisting of water, organic
material, inorganic material, and a self-assembled monolayer.
9. The device of claim 1, further comprising: a display; a
processor in electrical communication with the display, the
processor configured to process image data; and a memory device in
electrical communication with the processor.
10. The device of claim 9, further comprising a driver circuit
configured to send at least one signal to the display.
11. The device of claim 10, wherein the driver circuit is
compatible with a super twisted nematic (STN) display.
12. The device of claim 10, wherein the driver circuit is
configured to refresh the display at a frequency greater than about
once per 30 milliseconds.
13. An electromechanical device comprising: means for supporting a
MEMS device, the supporting means comprising means for insulating;
means for reflecting light, the light reflecting means mechanically
coupled to the supporting means, the insulating means on a portion
of the supporting means facing the reflecting means, the reflecting
means movable between a first position and a second position with
respect to the supporting means, wherein the reflecting means is
configured to move from the first position to the second position
at a first rate and wherein the reflecting means is configured to
move from the second position to the first position at a second
rate faster than the first rate; and means for increasing adhesion
between the reflecting means and the supporting means when the
reflecting means is in the position closer of the first position
and the second position that is closer to the supporting means, the
adhesion increasing means comprising a different material from the
insulating means, the adhesion increasing means on at least a
portion of the supporting means or the reflecting means.
14. The device of claim 13, wherein the adhesion increasing means
comprises at least one of water, an organic material, an inorganic
material, and a self-assembled monolayer.
15. A method of manufacturing an electromechanical device
comprising: providing a substrate including an insulating layer;
forming a sacrificial layer on the substrate; forming a movable
layer on the sacrificial layer, the insulating layer on a portion
of the substrate facing the movable layer; forming an adhesive
layer on at least a portion of the substrate or the movable layer,
the adhesive layer different from the insulating layer; and
removing the sacrificial layer, wherein the movable layer is
movable between a first position and a second position, wherein the
movable layer is configured to move from the first position to the
second position at a first rate and wherein the movable layer is
configured to move from the second position to the first position
at a second rate that is faster than the first rate, the adhesive
layer increasing adhesion between the movable layer and the
substrate when the movable layer is in the position closer to the
substrate.
16. The method of claim 15, wherein forming the adhesive layer is
performed after forming the sacrificial layer.
17. The method of claim 16, wherein forming the adhesive layer
comprises producing a substantially smooth surface of the
sacrificial layer facing the movable layer.
18. The method of claim 17, wherein producing the substantially
smooth surface comprises chemical mechanical polishing the
sacrificial layer.
19. The method of claim 17, wherein producing the substantially
smooth surface comprises electro-chemical etching the sacrificial
layer.
20. The method of claim 17, wherein producing the substantially
smooth surface comprises dry etching the sacrificial layer.
21. The method of claim 17, wherein producing the substantially
smooth surface comprises atomic layer dry etching the sacrificial
layer.
22. The method of claim 15, wherein the adhesive layer comprises a
layer of water, a layer of organic material, a layer of inorganic
material, or a self-assembled monolayer.
Description
RELATED APPLICATION
[0001] This application is a divisional of U.S. patent application
Ser. No. 11/360,162, filed Feb. 23, 2006, which is incorporated
herein by reference in its entirety.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The field of the invention relates to microelectromechanical
systems (MEMS).
[0004] 2. Description of the Related Art
[0005] Microelectromechanical systems (MEMS) include micro
mechanical elements, actuators, and electronics. Micromechanical
elements may be created using deposition, etching, and or other
micromachining processes that etch away parts of substrates and/or
deposited material layers or that add layers to form electrical and
electromechanical devices. One type of MEMS device is called an
interferometric modulator. As used herein, the term interferometric
modulator or interferometric light modulator refers to a device
that selectively absorbs and/or reflects light using the principles
of optical interference. In certain embodiments, an interferometric
modulator may comprise a pair of conductive plates, one or both of
which may be transparent and/or reflective in whole or part and
capable of relative motion upon application of an appropriate
electrical signal. In a particular embodiment, one plate may
comprise a stationary layer deposited on a substrate and the other
plate may comprise a metallic membrane separated from the
stationary layer by an air gap. As described herein in more detail,
the position of one plate in relation to another can change the
optical interference of light incident on the interferometric
modulator. Such devices have a wide range of applications, and it
would be beneficial in the art to utilize and/or modify the
characteristics of these types of devices so that their features
can be exploited in improving existing products and creating new
products that have not yet been developed.
SUMMARY OF THE INVENTION
[0006] The system, method, and devices of the invention each have
several aspects, no single one of which is solely responsible for
its desirable attributes. Without limiting the scope of this
invention, its more prominent features will now be discussed
briefly. After considering this discussion, and particularly after
reading the section entitled "Detailed Description of Certain
Embodiments" one will understand how the features of this invention
provide advantages over other display devices.
[0007] In certain embodiments, a microelectromechanical (MEMS)
device comprises a substrate and a movable layer mechanically
coupled to the substrate. The movable layer is movable between a
first position and a second position. The movable layer moves from
the first position to the second position at a first rate and from
the second position to the first position at a second rate. The
second rate is faster than the first rate. The MEMS device further
comprises an adjustable cavity defined between the substrate and
the movable layer. The adjustable cavity contains a fluid. The MEMS
device further comprises a fluid conductive element through which
the fluid flows at a first flowrate from inside the adjustable
cavity to outside the adjustable cavity upon movement of the
movable layer from the second position to the first position and
through which the fluid flows at a second flowrate from outside the
adjustable cavity to inside the adjustable cavity upon movement of
the movable layer from the first position to the second position.
The second flowrate is slower than the first flowrate
[0008] In certain embodiments, a method of manufacturing a
microelectromechanical (MEMS) device comprises providing a
substrate, forming a sacrificial layer on the substrate, forming a
movable layer on the sacrificial layer, and removing the
sacrificial layer. The movable layer is movable between a first
position and a second position. The movable layer moves from the
first position to the second position at a first rate and from the
second position to the first position at a second rate. The second
rate is faster than the first rate. The method further comprises
forming a fluid conductive element through which fluid flows at a
first flowrate from a region between the substrate and the movable
layer upon movement of the movable layer towards the substrate and
through which fluid flows at a second flowrate into the region upon
movement of the movable layer away from the substrate. The second
flowrate is slower than the first flowrate.
[0009] In certain embodiments, a microelectromechanical (MEMS)
device comprises means for supporting a MEMS device, means for
reflecting light, means for moving the reflecting means between a
first position and a second position, an adjustable cavity between
the supporting means and the moving means, and means for conducting
fluid from inside the adjustable cavity to outside the adjustable
cavity and from outside the adjustable cavity to inside the
adjustable cavity. The reflecting means moves from the first
position to the second position at a first rate and from the second
position to the first position at a second rate. The second rate is
faster than the first rate. The fluid conducting means conducts
fluid from inside the adjustable cavity to outside the adjustable
cavity upon movement of the moving means from the second position
to the first position at a first flowrate. The fluid conducting
means conducts fluid from outside the adjustable cavity to inside
the adjustable cavity upon movement of the moving means from the
first position to the second position at a second flowrate. The
second flowrate is slower than the first flowrate.
[0010] In certain embodiments, a microelectromechanical (MEMS)
device comprises a substrate, a movable layer mechanically coupled
to the substrate, and an adhesive layer on at least a portion of
the substrate or the movable layer. The movable layer is movable
between a first position and a second position. The movable layer
moves from the first position to the second position at a first
rate and from the second position to the first position at a second
rate. The second rate is faster than the first rate. The adhesive
layer increases adhesion between the movable layer and the
substrate when the movable layer is in the position closer to the
substrate.
[0011] In certain embodiments, a microelectromechanical (MEMS)
device comprises a substrate and a movable layer mechanically
coupled to the substrate. The movable layer is movable between a
first position and a second position in response to a voltage
applied between a first electrode and a second electrode. The first
electrode is configured to communicate with a diode. The diode is
configured to allow a charge to flow from the first electrode to a
capacitor between the first electrode and the second electrode and
a leakage resistor in parallel with the capacitor. The diode is
further configured to block the charge from flowing from the
capacitor to the first electrode. The movable layer moves from the
first position to the second position at a first rate and from the
second position to the first position at a second rate. The second
rate is faster than the first rate.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] FIG. 1 is an isometric view depicting a portion of one
embodiment of an interferometric modulator display in which a
movable reflective layer of a first interferometric modulator is in
a relaxed position and a movable reflective layer of a second
interferometric modulator is in an actuated position.
[0013] FIG. 2 is a system block diagram illustrating one embodiment
of an electronic device incorporating a 3.times.3 interferometric
modulator display.
[0014] FIG. 3 is a diagram of movable mirror position versus
applied voltage for one exemplary embodiment of an interferometric
modulator of FIG. 1.
[0015] FIG. 4 is an illustration of a set of row and column
voltages that may be used to drive an interferometric modulator
display.
[0016] FIG. 5A illustrates one exemplary frame of display data in
the 3.times.3 interferometric modulator display of FIG. 2.
[0017] FIG. 5B illustrates one exemplary timing diagram for row and
column signals that may be used to write the frame of FIG. 5A.
[0018] FIGS. 6A and 6B are system block diagrams illustrating an
embodiment of a visual display device comprising a plurality of
interferometric modulators.
[0019] FIG. 7A is a cross section of the device of FIG. 1.
[0020] FIG. 7B is a cross section of an alternative embodiment of
an interferometric modulator.
[0021] FIG. 7C is a cross section of another alternative embodiment
of an interferometric modulator.
[0022] FIG. 7D is a cross section of yet another alternative
embodiment of an interferometric modulator.
[0023] FIG. 7E is a cross section of an additional alternative
embodiment of an interferometric modulator.
[0024] FIGS. 8A, 8B, and 8C illustrate geometric variations in the
movable reflective layer that affect the actuation and release
times of the modulator so as to improve the operational response of
the modulator.
[0025] FIG. 9 is a partial perspective view of a modulator that
includes holes in the movable layer.
[0026] FIG. 10A illustrates an embodiment of a MEMS device having a
layer movable at asymmetric rates.
[0027] FIG. 10B illustrates an alternative embodiment of a MEMS
device having a layer movable at asymmetric rates.
[0028] FIG. 10C illustrates another alternative embodiment of a
MEMS device having a layer movable at asymmetric rates.
[0029] FIG. 11A illustrates a MEMS device having a layer movable at
asymmetric rates from a second position to a first position
including an aperture and a flap partially mechanically coupled to
the movable layer in one position.
[0030] FIG. 11B illustrates a MEMS device having a layer movable at
asymmetric rates from a second position to a first position
including an aperture and a flap partially mechanically coupled to
the movable layer in two positions.
[0031] FIG. 11C illustrates a MEMS device having a layer movable at
asymmetric rates from a second position to a first position
including an aperture and a flap partially mechanically coupled to
the movable layer by a brace.
[0032] FIG. 11D illustrates a MEMS device having a layer movable at
asymmetric rates from a second position to a first position
including an aperture and a flap partially mechanically coupled to
the movable layer by a rivet.
[0033] FIG. 11E illustrates a MEMS device having a layer movable at
asymmetric rates from a second position to a first position
including an aperture and a plug partially mechanically coupled to
the movable layer in one position.
[0034] FIG. 11F illustrates a MEMS device having a layer movable at
asymmetric rates from a second position to a first position
including an aperture and a plug partially mechanically coupled to
the movable layer in two positions.
[0035] FIG. 11G illustrates a MEMS device having a layer movable at
asymmetric rates from a second position to a first position
including an aperture and a plug partially mechanically coupled to
the movable layer by a brace.
[0036] FIG. 11H illustrates a MEMS device having a layer movable at
asymmetric rates from a second position to a first position
including an aperture and a plug partially mechanically coupled to
the movable layer by a rivet.
[0037] FIG. 12A illustrates a MEMS device having a layer movable at
asymmetric rates moving from a second position to a first
position.
[0038] FIG. 12B illustrates a MEMS device having a layer movable at
asymmetric rates moving from a first position to a second
position.
[0039] FIG. 13A illustrates an additional alternative embodiment of
a MEMS device having a layer movable at asymmetric rates.
[0040] FIG. 13B illustrates yet another alternative embodiment of a
MEMS device having a layer movable at asymmetric rates.
[0041] FIG. 13C illustrates still another alternative embodiment of
a MEMS device having a layer movable at asymmetric rates
[0042] FIG. 14A illustrates a MEMS device having a layer movable at
asymmetric rates moving from a second position to a first
position.
[0043] FIG. 14B illustrates a MEMS device having a layer movable at
asymmetric rates moving from a first position to a second
position.
[0044] FIG. 15A illustrates an embodiment of a MEMS device having a
layer movable at asymmetric rates and a substrate plug.
[0045] FIG. 15B illustrates an alternative embodiment of a MEMS
device having a layer movable at asymmetric rates and a substrate
plug.
[0046] FIG. 16A illustrates an embodiment of a MEMS device having a
layer movable at asymmetric rates and an aperture with differing
opening areas.
[0047] FIG. 16B illustrates an alternative embodiment of a MEMS
device having a layer movable at asymmetric rates and an aperture
with differing opening areas.
[0048] FIG. 16C illustrates another alternative embodiment of a
MEMS device having a layer movable at asymmetric rates and an
aperture with differing opening areas.
[0049] FIG. 17A illustrates an embodiment of a MEMS device having a
layer movable at asymmetric rates and an adhesive layer.
[0050] FIG. 17B illustrates an alternative embodiment of a MEMS
device having a layer movable at asymmetric rates and an adhesive
layer.
[0051] FIG. 17C illustrates another alternative embodiment of a
MEMS device having a layer movable at asymmetric rates and an
adhesive layer.
[0052] FIG. 18A illustrates an embodiment of a MEMS device having a
layer movable at asymmetric rates and a diode.
[0053] FIG. 18B illustrates an embodiment of a MEMS device having a
layer movable at asymmetric rates and a zener diode.
[0054] FIGS. 19A-19E illustrate an example of an asymmetric rate
protocol in contrast with a hysteresis drive scheme for an example
pixel of an interferometric modulator display device.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0055] The following detailed description is directed to certain
specific embodiments of the invention. However, the invention can
be embodied in a multitude of different ways. In this description,
reference is made to the drawings wherein like parts are designated
with like numerals throughout. As will be apparent from the
following description, the embodiments may be implemented in any
device that is configured to display an image, whether in motion
(e.g., video) or stationary (e.g., still image), and whether
textual or pictorial. More particularly, it is contemplated that
the embodiments may be implemented in or associated with a variety
of electronic devices such as, but not limited to, mobile
telephones, wireless devices, personal data assistants (PDAs),
hand-held or portable computers, GPS receivers/navigators, cameras,
MP3 players, camcorders, game consoles, wrist watches, clocks,
calculators, television monitors, flat panel displays, computer
monitors, auto displays (e.g., odometer display, etc.), cockpit
controls and/or displays, display of camera views (e.g., display of
a rear view camera in a vehicle), electronic photographs,
electronic billboards or signs, projectors, architectural
structures, packaging, and aesthetic structures (e.g., display of
images on a piece of jewelry). MEMS devices of similar structure to
those described herein can also be used in non-display applications
such as in electronic switching devices.
[0056] A deformable mechanical membrane (or layer) useful to form a
display device is provided. The membrane moves from a first
position to a second position faster than the membrane moves from
the second position to the first position. This asymmetric rate of
movement enables the interferometric modulator to be operated
without using a hysteresis protocol, which is desirable in some
devices. In some embodiments, fluid conductive elements which cause
asymmetric rates of movement of the mechanical layer are formed in
the mechanical layer or in a support structure between the
mechanical layer and the substrate. In some embodiments, an
adhesive layer which causes asymmetric rates of movement of the
mechanical layer is formed between the mechanical layer and the
substrate. In some embodiments, a diode and a leakage resistor are
in communication with the mechanical layer and cause asymmetric
rates of movement of the mechanical layer.
[0057] One interferometric modulator display embodiment comprising
an interferometric MEMS display element is illustrated in FIG. 1.
In these devices, the pixels are in either a bright or dark state.
In the bright ("on" or "open") state, the display element reflects
a large portion of incident visible light to a user. When in the
dark ("off" or "closed") state, the display element reflects little
incident visible light to the user. Depending on the embodiment,
the light reflectance properties of the "on" and "off" states may
be reversed. MEMS pixels can be configured to reflect predominantly
at selected colors, allowing for a color display in addition to
black and white.
[0058] FIG. 1 is an isometric view depicting two adjacent pixels in
a series of pixels of a visual display, wherein each pixel
comprises a MEMS interferometric modulator. In some embodiments, an
interferometric modulator display comprises a row/column array of
these interferometric modulators. Each interferometric modulator
includes a pair of reflective layers positioned at a variable and
controllable distance from each other to form a resonant optical
cavity with at least one variable dimension. In one embodiment, one
of the reflective layers may be moved between two positions. In the
first position, referred to herein as the relaxed position, the
movable reflective layer is positioned at a relatively large
distance from a fixed partially reflective layer. In the second
position, referred to herein as the actuated position, the movable
reflective layer is positioned more closely adjacent to the
partially reflective layer. Incident light that reflects from the
two layers interferes constructively or destructively depending on
the position of the movable reflective layer, producing either an
overall reflective or non-reflective state for each pixel.
[0059] The depicted portion of the pixel array in FIG. 1 includes
two adjacent interferometric modulators 12a and 12b. In the
interferometric modulator 12a on the left, a movable reflective
layer 14a is illustrated in a relaxed position at a predetermined
distance from an optical stack 16a, which includes a partially
reflective layer. In the interferometric modulator 12b on the
right, the movable reflective layer 14b is illustrated in an
actuated position adjacent to the optical stack 16b.
[0060] The optical stacks 16a and 16b (collectively referred to as
optical stack 16), as referenced herein, typically comprise several
fused layers, which can include an electrode layer, such as indium
tin oxide (ITO), a partially reflective layer, such as chromium,
and a transparent dielectric. The optical stack 16 is thus
electrically conductive, partially transparent and partially
reflective, and may be fabricated, for example, by depositing one
or more of the above layers onto a transparent substrate 20. The
partially reflective layer can be formed from a variety of
materials that are partially reflective such as various metals,
semiconductors, and dielectrics. The partially reflective layer can
be formed of one or more layers of materials, and each of the
layers can be formed of a single material or a combination of
materials.
[0061] In some embodiments, the layers of the optical stack are
patterned into parallel strips, and may form row electrodes in a
display device as described further below. The movable reflective
layers 14a, 14b may be formed as a series of parallel strips of a
deposited metal layer or layers (orthogonal to the row electrodes
of 16a, 16b) deposited on top of posts 18 and an intervening
sacrificial material deposited between the posts 18. When the
sacrificial material is etched away, the movable reflective layers
14a, 14b are separated from the optical stacks 16a, 16b by a
defined gap 19. A highly conductive and reflective material such as
aluminum may be used for the reflective layers 14, and these strips
may form column electrodes in a display device.
[0062] With no applied voltage, the cavity 19 remains between the
movable reflective layer 14a and optical stack 16a, with the
movable reflective layer 14a in a mechanically relaxed state, as
illustrated by the pixel 12a in FIG. 1. However, when a potential
difference is applied to a selected row and column, the capacitor
formed at the intersection of the row and column electrodes at the
corresponding pixel becomes charged, and electrostatic forces pull
the electrodes together. If the voltage is high enough, the movable
reflective layer 14 is deformed and is forced against the optical
stack 16. A dielectric layer (not illustrated in this Figure)
within the optical stack 16 may prevent shorting and control the
separation distance between layers 14 and 16, as illustrated by
pixel 12b on the right in FIG. 1. The behavior is the same
regardless of the polarity of the applied potential difference. In
this way, row/column actuation that can control the reflective vs.
non-reflective pixel states is analogous in many ways to that used
in conventional LCD and other display technologies.
[0063] FIGS. 2 through 5B illustrate one exemplary process and
system for using an array of interferometric modulators in a
display application.
[0064] FIG. 2 is a system block diagram illustrating one embodiment
of an electronic device that may incorporate aspects of the
invention. In the exemplary embodiment, the electronic device
includes a processor 21 which may be any general purpose single- or
multi-chip microprocessor such as an ARM, Pentium.RTM., Pentium
II.RTM., Pentium III.RTM., Pentium IV.RTM., Pentium.RTM. Pro, an
8051, a MIPS.RTM., a Power PC.RTM., an ALPHA.RTM., or any special
purpose microprocessor such as a digital signal processor,
microcontroller, or a programmable gate array. As is conventional
in the art, the processor 21 may be configured to execute one or
more software modules. In addition to executing an operating
system, the processor may be configured to execute one or more
software applications, including a web browser, a telephone
application, an email program, or any other software
application.
[0065] In one embodiment, the processor 21 is also configured to
communicate with an array driver 22. In one embodiment, the array
driver 22 includes a row driver circuit 24 and a column driver
circuit 26 that provide signals to a display array or panel 30. The
cross section of the array illustrated in FIG. 1 is shown by the
lines 1-1 in FIG. 2. For MEMS interferometric modulators, the
row/column actuation protocol may take advantage of a hysteresis
property of these devices illustrated in FIG. 3. It may require,
for example, a 10 volt potential difference to cause a movable
layer to deform from the relaxed state to the actuated state.
However, when the voltage is reduced from that value, the movable
layer maintains its state as the voltage drops back below 10 volts.
In the exemplary embodiment of FIG. 3, the movable layer does not
relax completely until the voltage drops below 2 volts. There is
thus a range of voltage, about 3 to 7 V in the example illustrated
in FIG. 3, where there exists a window of applied voltage within
which the device is stable in either the relaxed or actuated state.
This is referred to herein as the "hysteresis window" or "stability
window." For a display array having the hysteresis characteristics
of FIG. 3, the row/column actuation protocol can be designed such
that during row strobing, pixels in the strobed row that are to be
actuated are exposed to a voltage difference of about 10 volts, and
pixels that are to be relaxed are exposed to a voltage difference
of close to zero volts. After the strobe, the pixels are exposed to
a steady state voltage difference of about 5 volts such that they
remain in whatever state the row strobe put them in. After being
written, each pixel sees a potential difference within the
"stability window" of 3-7 volts in this example. This feature makes
the pixel design illustrated in FIG. 1 stable under the same
applied voltage conditions in either an actuated or relaxed
pre-existing state. Since each pixel of the interferometric
modulator, whether in the actuated or relaxed state, is essentially
a capacitor formed by the fixed and moving reflective layers, this
stable state can be held at a voltage within the hysteresis window
with almost no power dissipation. Essentially no current flows into
the pixel if the applied potential is fixed.
[0066] In typical applications, a display frame may be created by
asserting the set of column electrodes in accordance with the
desired set of actuated pixels in the first row. A row pulse is
then applied to the row 1 electrode, actuating the pixels
corresponding to the asserted column lines. The asserted set of
column electrodes is then changed to correspond to the desired set
of actuated pixels in the second row. A pulse is then applied to
the row 2 electrode, actuating the appropriate pixels in row 2 in
accordance with the asserted column electrodes. The row 1 pixels
are unaffected by the row 2 pulse, and remain in the state they
were set to during the row 1 pulse. This may be repeated for the
entire series of rows in a sequential fashion to produce the frame.
Generally, the frames are refreshed and/or updated with new display
data by continually repeating this process at some desired number
of frames per second. A wide variety of protocols for driving row
and column electrodes of pixel arrays to produce display frames are
also well known and may be used in conjunction with the present
invention.
[0067] FIGS. 4, 5A, and 5B illustrate one possible actuation
protocol for creating a display frame on the 3.times.3 array of
FIG. 2. FIG. 4 illustrates a possible set of column and row voltage
levels that may be used for pixels exhibiting the hysteresis curves
of FIG. 3. In the FIG. 4 embodiment, actuating a pixel involves
setting the appropriate column to -V.sub.bias, and the appropriate
row to +.DELTA.V, which may correspond to -5 volts and +5 volts
respectively Relaxing the pixel is accomplished by setting the
appropriate column to +V.sub.bias, and the appropriate row to the
same +.DELTA.V, producing a zero volt potential difference across
the pixel. In those rows where the row voltage is held at zero
volts, the pixels are stable in whatever state they were originally
in, regardless of whether the column is at +V.sub.bias, or
-V.sub.bias. As is also illustrated in FIG. 4, it will be
appreciated that voltages of opposite polarity than those described
above can be used, e.g., actuating a pixel can involve setting the
appropriate column to +.sub.bias, and the appropriate row to
-.DELTA.V. In this embodiment, releasing the pixel is accomplished
by setting the appropriate column to -V.sub.bias, and the
appropriate row to the same -.DELTA.V, producing a zero volt
potential difference across the pixel.
[0068] FIG. 5B is a timing diagram showing a series of row and
column signals applied to the 3.times.3 array of FIG. 2 which will
result in the display arrangement illustrated in FIG. 5A, where
actuated pixels are non-reflective. Prior to writing the frame
illustrated in FIG. 5A, the pixels can be in any state, and in this
example, all the rows are at 0 volts, and all the columns are at +5
volts. With these applied voltages, all pixels are stable in their
existing actuated or relaxed states.
[0069] In the FIG. 5A frame, pixels (1,1), (1,2), (2,2), (3,2) and
(3,3) are actuated. To accomplish this, during a "line time" for
row 1, columns 1 and 2 are set to -5 volts, and column 3 is set to
+5 volts. This does not change the state of any pixels, because all
the pixels remain in the 3-7 volt stability window. Row 1 is then
strobed with a pulse that goes from 0, up to 5 volts, and back to
zero. This actuates the (1,1) and (1,2) pixels and relaxes the
(1,3) pixel. No other pixels in the array are affected. To set row
2 as desired, column 2 is set to -5 volts, and columns 1 and 3 are
set to +5 volts. The same strobe applied to row 2 will then actuate
pixel (2,2) and relax pixels (2,1) and (2,3). Again, no other
pixels of the array are affected. Row 3 is similarly set by setting
columns 2 and 3 to -5 volts, and column 1 to +5 volts. The row 3
strobe sets the row 3 pixels as shown in FIG. 5A. After writing the
frame, the row potentials are zero, and the column potentials can
remain at either +5 or -5 volts, and the display is then stable in
the arrangement of FIG. 5A. It will be appreciated that the same
procedure can be employed for arrays of dozens or hundreds of rows
and columns. It will also be appreciated that the timing, sequence,
and levels of voltages used to perform row and column actuation can
be varied widely within the general principles outlined above, and
the above example is exemplary only, and any actuation voltage
method can be used with the systems and methods described
herein.
[0070] FIGS. 6A and 6B are system block diagrams illustrating an
embodiment of a display device 40. The display device 40 can be,
for example, a cellular or mobile telephone. However, the same
components of display device 40 or slight variations thereof are
also illustrative of various types of display devices such as
televisions and portable media players.
[0071] The display device 40 includes a housing 41, a display 30,
an antenna 43, a speaker 44, an input device 48, and a microphone
46. The housing 41 is generally formed from any of a variety of
manufacturing processes as are well known to those of skill in the
art, including injection molding, and vacuum forming. In addition,
the housing 41 may be made from any of a variety of materials,
including, but not limited to, plastic, metal, glass, rubber, and
ceramic, or a combination thereof In one embodiment the housing 41
includes removable portions (not shown) that may be interchanged
with other removable portions of different color, or containing
different logos, pictures, or symbols.
[0072] The display 30 of exemplary display device 40 may be any of
a variety of displays, including a bi-stable display, as described
herein. In other embodiments, the display 30 includes a flat-panel
display, such as plasma, EL, OLED, STN LCD, or TFT LCD as described
above, or a non-flat-panel display, such as a CRT or other tube
device, as is well known to those of skill in the art. However, for
purposes of describing the present embodiment, the display 30
includes an interferometric modulator display, as described
herein.
[0073] The components of one embodiment of exemplary display device
40 are schematically illustrated in FIG. 6B. The illustrated
exemplary display device 40 includes a housing 41 and can include
additional components at least partially enclosed therein. For
example, in one embodiment, the exemplary display device 40
includes a network interface 27 that includes an antenna 43 which
is coupled to a transceiver 47. The transceiver 47 is connected to
a processor 21, which is connected to conditioning hardware 52. The
conditioning hardware 52 may be configured to condition a signal
(e.g., filter a signal). The conditioning hardware 52 is connected
to a speaker 45 and a microphone 46. The processor 21 is also
connected to an input device 48 and a driver controller 29. The
driver controller 29 is coupled to a frame buffer 28, and to an
array driver 22, which in turn is coupled to a display array 30. A
power supply 50 provides power to all components as required by the
particular exemplary display device 40 design.
[0074] The network interface 27 includes the antenna 43 and the
transceiver 47 so that the exemplary display device 40 can
communicate with one or more devices over a network. In one
embodiment the network interface 27 may also have some processing
capabilities to relieve requirements of the processor 21. The
antenna 43 is any antenna known to those of skill in the art for
transmitting and receiving signals. In one embodiment, the antenna
transmits and receives RF signals according to the IEEE 802.11
standard, including IEEE 802.11(a), (b), or (g). In another
embodiment, the antenna transmits and receives RF signals according
to the BLUETOOTH standard. In the case of a cellular telephone, the
antenna is designed to receive CDMA, GSM, AMPS or other known
signals that are used to communicate within a wireless cell phone
network. The transceiver 47 pre-processes the signals received from
the antenna 43 so that they may be received by and further
manipulated by the processor 21. The transceiver 47 also processes
signals received from the processor 21 so that they may be
transmitted from the exemplary display device 40 via the antenna
43.
[0075] In an alternative embodiment, the transceiver 47 can be
replaced by a receiver. In yet another alternative embodiment,
network interface 27 can be replaced by an image source, which can
store or generate image data to be sent to the processor 21. For
example, the image source can be a digital video disc (DVD) or a
hard-disc drive that contains image data, or a software module that
generates image data.
[0076] Processor 21 generally controls the overall operation of the
exemplary display device 40. The processor 21 receives data, such
as compressed image data from the network interface 27 or an image
source, and processes the data into raw image data or into a format
that is readily processed into raw image data. The processor 21
then sends the processed data to the driver controller 29 or to
frame buffer 28 for storage. Raw data typically refers to the
information that identifies the image characteristics at each
location within an image. For example, such image characteristics
can include color, saturation, and gray-scale level.
[0077] In one embodiment, the processor 21 includes a
microcontroller, CPU, or logic unit to control operation of the
exemplary display device 40. Conditioning hardware 52 generally
includes amplifiers and filters for transmitting signals to the
speaker 45, and for receiving signals from the microphone 46.
Conditioning hardware 52 may be discrete components within the
exemplary display device 40, or may be incorporated within the
processor 21 or other components.
[0078] The driver controller 29 takes the raw image data generated
by the processor 21 either directly from the processor 21 or from
the frame buffer 28 and reformats the raw image data appropriately
for high speed transmission to the array driver 22. Specifically,
the driver controller 29 reformats the raw image data into a data
flow having a raster-like format, such that it has a time order
suitable for scanning across the display array 30. Then the driver
controller 29 sends the formatted information to the array driver
22. Although a driver controller 29, such as a LCD controller, is
often associated with the system processor 21 as a stand-alone
Integrated Circuit (IC), such controllers may be implemented in
many ways. They may be embedded in the processor 21 as hardware,
embedded in the processor 21 as software, or fully integrated in
hardware with the array driver 22.
[0079] Typically, the array driver 22 receives the formatted
information from the driver controller 29 and reformats the video
data into a parallel set of waveforms that are applied many times
per second to the hundreds and sometimes thousands of leads coming
from the display's x-y matrix of pixels.
[0080] In one embodiment, the driver controller 29, array driver
22, and display array 30 are appropriate for any of the types of
displays described herein. For example, in one embodiment, driver
controller 29 is a conventional display controller or a bi-stable
display controller (e.g., an interferometric modulator controller).
In another embodiment, array driver 22 is a conventional driver or
a bi-stable display driver (e.g., an interferometric modulator
display). In one embodiment, a driver controller 29 is integrated
with the array driver 22. Such an embodiment is common in highly
integrated systems such as cellular phones, watches, and other
small area displays. In yet another embodiment, display array 30 is
a typical display array or a bi-stable display array (e.g., a
display including an array of interferometric modulators).
[0081] The input device 48 allows a user to control the operation
of the exemplary display device 40. In one embodiment, input device
48 includes a keypad, such as a QWERTY keyboard or a telephone
keypad, a button, a switch, a touch-sensitive screen, a pressure-
or heat-sensitive membrane. In one embodiment, the microphone 46 is
an input device for the exemplary display device 40. When the
microphone 46 is used to input data to the device, voice commands
may be provided by a user for controlling operations of the
exemplary display device 40.
[0082] Power supply 50 can include a variety of energy storage
devices as are well known in the art. For example, in one
embodiment, power supply 50 is a rechargeable battery, such as a
nickel-cadmium battery or a lithium ion battery. In another
embodiment, power supply 50 is a renewable energy source, a
capacitor, or a solar cell, including a plastic solar cell, and
solar-cell paint. In another embodiment, power supply 50 is
configured to receive power from a wall outlet.
[0083] In some implementations control programmability resides, as
described above, in a driver controller which can be located in
several places in the electronic display system. In some cases
control programmability resides in the array driver 22. Those of
skill in the art will recognize that the above-described
optimization may be implemented in any number of hardware and/or
software components and in various configurations.
[0084] The details of the structure of interferometric modulators
that operate in accordance with the principles set forth above may
vary widely. For example, FIGS. 7A-7E illustrate five different
embodiments of the movable reflective layer 14 and its supporting
structures. FIG. 7A is a cross section of the embodiment of FIG. 1,
where a strip of metal material 14 is deposited on orthogonally
extending supports 18. In FIG. 7B, the movable reflective layer 14
is attached to supports at the corners only, on tethers 32. In FIG.
7C, the movable reflective layer 14 is suspended from a deformable
layer 34, which may comprise a flexible metal. The deformable layer
34 connects, directly or indirectly, to the substrate 20 around the
perimeter of the deformable layer 34. These connections are herein
referred to as support posts. The embodiment illustrated in FIG. 7D
has support post plugs 42 upon which the deformable layer 34 rests.
The movable reflective layer 14 remains suspended over the cavity,
as in FIGS. 7A-7C, but the deformable layer 34 does not form the
support posts by filling holes between the deformable layer 34 and
the optical stack 16. Rather, the support posts are formed of a
planarization material, which is used to form support post plugs
42. The embodiment illustrated in FIG. 7E is based on the
embodiment shown in FIG. 7D, but may also be adapted to work with
any of the embodiments illustrated in FIGS. 7A-7C as well as
additional embodiments not shown. In the embodiment shown in FIG.
7E, an extra layer of metal or other conductive material has been
used to form a bus structure 44. This allows signal routing along
the back of the interferometric modulators, eliminating a number of
electrodes that may otherwise have had to be formed on the
substrate 20.
[0085] In embodiments such as those shown in FIG. 7, the
interferometric modulators function as direct-view devices, in
which images are viewed from the front side of the transparent
substrate 20, the side opposite to that upon which the modulator is
arranged. In these embodiments, the reflective layer 14 optically
shields the portions of the interferometric modulator on the side
of the reflective layer opposite the substrate 20, including the
deformable layer 34. This allows the shielded areas to be
configured and operated upon without negatively affecting the image
quality. Such shielding allows the bus structure 44 in FIG. 7E,
which provides the ability to separate the optical properties of
the modulator from the electromechanical properties of the
modulator, such as addressing and the movements that result from
that addressing. This separable modulator architecture allows the
structural design and materials used for the electromechanical
aspects and the optical aspects of the modulator to be selected and
to function independently of each other. Moreover, the embodiments
shown in FIGS. 7C-7E have additional benefits deriving from the
decoupling of the optical properties of the reflective layer 14
from its mechanical properties, which are carried out by the
deformable layer 34. This allows the structural design and
materials used for the reflective layer 14 to be optimized with
respect to the optical properties, and the structural design and
materials used for the deformable layer 34 to be optimized with
respect to desired mechanical properties.
[0086] In certain embodiments, it is desirable for the movable
layer to transition from the relaxed state to the actuated/deformed
state very quickly. It can be advantageous for the opposite
transition back to the relaxed state to occur slowly, even when no
voltage is present across the electrodes of a given pixel. In
certain embodiments, it can be advantageous for the transition from
the actuated state to the relaxed state to occur quickly and for
the opposite transition from the relaxed state to the actuated
state to occur slowly, which skilled artisans will recognize can be
achieved by modifications of the embodiments described in detail
herein. This asymmetry in the transition rate can be referred to as
mechanical persistence, whereby the movable layer deforms quickly
in response to a voltage pulse across the electrodes, but remains
in the deformed state for a while after the pulse is over. In some
display embodiments, this mechanical persistence results in the
formed image persisting for the time necessary to sequentially
actuate all the rows of the display, at which point a "refresh" can
be performed before the image decays due to relaxation of the
individual modulators. In addition, if a set of movable layers in a
display are not fully relaxed between image refresh cycles, a
refresh or update can be performed faster and with less energy
since the voltages can be smaller, as described in more detail
below. Asymmetric rates can result in other advantages as well. For
example, asymmetric rates can mitigate stiction or adhesion between
the movable layer and the substrate in the actuated state. In
certain embodiments in which the movable layer is actuated at a
slower rate, a smaller contact area between the movable layer and
the substrate can result because the impact of the movable layer on
the substrate is smaller. In other embodiments having slow
relaxation rates, stiction or adhesion is at least partially
alleviated since the contact area between the movable layer and the
substrate is allowed to reduce during the slow relaxation process
(e.g., for viscous materials or for meniscuses formed at the
contact interface). In certain other embodiments, breaking the
contact slowly advantageously allows breaking of contact points
forming the physical contact between the surfaces, or "asperity
contacts," one after the other rather than breaking all of the
asperity contacts simultaneously as occurs in high relaxation
rates.
[0087] Stable operation of the MEMS interferometric modulator is
achieved by selecting mechanical design features of the
interferometric modulator that optimize the actuation and release
times for the particular row/column actuation protocol. Described
herein are certain structures and methods of making interferometric
modulators having varying release and actuation times. In general,
the mechanical persistence of the movable layer may be changed by
manipulating forces acting upon the movable layer, such as a
differential fluid pressure (e.g., a differential gas pressure, a
differential liquid pressure, or a combination of liquid and gas
pressures), and adhesion. Typically, the pressure acting upon the
movable layer will be from a gas (e.g., air) occupying a space
above and/or below the movable layer. In other embodiments, the gas
may be any gas suitable for use in an interferometric modulator. In
other embodiments, a low-viscosity liquid occupying the space above
and/or below the movable layer exerts a pressure on the movable
layer. In some embodiments, the fluid comprises a liquid dissolved
in a gas that condenses in the cavity 19 when the movable layer 14
actuates, as described later herein. A differential pressure that
acts in a direction towards the actuated position will decrease
actuation time and increase release time. Conversely, a
differential pressure that acts in a direction towards the relaxed
position will increase actuation time and decrease release
time.
[0088] The following description and accompanying figures include
examples of methods and structures for manipulating the mechanical
persistence of the movable layer of an interferometric modulator.
Although many of the protocols, methods, and apparatuses described
herein reference gas pressures, these same protocols, methods, and
apparatuses may be used with other fluid pressures.
[0089] As used herein, the term "cavity" is to be given its
broadest ordinary meaning, including, but not limited to, a space
or hollow area that is bounded at least in part by a material such
as, but not limited to, one or more layers or structures. As used
herein, the terms "hole," "aperture," and "perforation" are to be
given their broadest ordinary meanings including, but not limited
to, an opening, open space, or an area that does not contain a
solid material. As used herein, the term "substrate" is to be given
its broadest ordinary meaning, including, but not limited to, a
layer fabricated out of any material, including, but not limited
to, glass and plastic. The substrate may also have a variety of
forms, including, but not limited to, a homogeneous substance or a
non-homogenous substance, or having a uniform thickness or a
non-uniform thickness. The substrate may also have several
sublayers, a shorter expanse or region, or multiple expanses or
regions. The substrate may comprise an optical stack, as described
above.
[0090] FIGS. 8A through 8C illustrate a geometric variation in the
movable layer 14 that affects a fluid pressure (e.g., a gas
pressure) acting upon the movable layer 14, thereby affecting
actuation and release times of the modulator so as to improve the
operational response of the modulator. When the modulator is
actuated and the cavity 19 (depicted in FIG. 1 and FIGS. 7A through
7E) is collapsed, fluid in the cavity 19, typically air, is forced
out of the cavity 19. By perforating the movable layer 14, the
fluid is allowed to pass out of the cavity 19 through the movable
layer 14, resulting in a decrease in the actuation time. FIG. 8A
illustrates an embodiment of a solid movable layer 14 around which
the fluid flows from out of the cavity 19 when the movable layer 14
moves from the relaxed state to the actuated state. FIG. 8B
illustrates an example of a movable layer 14 that includes one or
more apertures 200 (also referred to as holes or perforations). The
apertures 200 provide additional pathways for fluid to flow from
out of the cavity 19 when the movable layer 14 moves from the
relaxed state to the actuated state. Thus, the apertures 200 can
decrease the actuation time of the modulator. The apertures 200
also decrease the release time of the modulator, however, by
providing additional pathways for fluid (e.g., gas) to flow into
the cavity 19 when the movable layer 14 moves from the actuated
state to the relaxed state.
[0091] As illustrated in FIG. 8C, the apertures 200 may be located
anywhere on the movable layer 14, including an edge portion 14a on
a periphery of the movable layer 14 and an inside portion 14b of
the movable layer 14. Moreover, the apertures 200 may be of any
size or pattern, including, but not limited to, rectangular and/or
circular shapes that are scattered and/or in an ordered array.
[0092] FIG. 9 illustrates an example of an interferometric
modulator 100 for which the actuation time of the modulator is
decreased as compared to the modulator illustrated in FIGS. 1 and
7A-7E. Referring to FIG. 9, the interferometric modulator 100
includes an array of cavities 19a, 19b, 19c fabricated on a
substrate 20. As described below, the cavities 19a, 19b, 19c are
filled with a fluid, such as air.
[0093] Each cavity 19a, 19b, 19c may be formed by a combination of
dielectric and metallic materials forming mirrors on two layers.
The first layer 102a, 102b, 102c forming the cavities 19a, 19b,
19c, respectively, is a primary mirror/conductor comprised of a
transparent conductive coating upon which a dielectric or metallic
mirror has been fabricated. In some embodiments, first layers 102a,
102b, 102c may include a lower layer 102a1, 102b1, 102c1,
respectively, comprised of indium-tin-oxide (also referred to
herein as ITO). In some embodiments, the first layers 102a, 102b,
102c may also include an upper layer 102a2, 102b2, 102c2,
respectively, comprised of chromium. The ITO functions as an
optically transparent electrical conductor, and the chromium
functions as a partial reflector. In certain embodiments, the first
layers 102a, 102b, 102c comprise an optical stack 16 formed on the
substrate 20.
[0094] Supports 18 space the second layer 106a, 106b, 106c of the
cavities 19a, 19b, 19c, respectively, from the corresponding first
layers 102a, 102b, 102c. The second layer 106a, 106b, 106c of
certain embodiments comprise a movable layer 14 and functions as
the secondary mirror/conductor. The second layer 106a, 106b, 106c
may comprise aluminum and is flexible. The second layer 106a, 106b,
106c is also fabricated such that it is under tensile stress and
thus is parallel to and spaced apart from the substrate 20 in the
relaxed state.
[0095] As shown in FIG. 9, the second layers 106a, 106b, and 106c
can include apertures 200 in the deforming regions 108a, 108b,
108c, respectively. These apertures 200 reduce a gas pressure
acting upon the second layers 106a, 106b, 106c as each second layer
106a, 106b, 106c deforms downward through an intervening layer of
gas that occupies the respective cavities 19a, 19b, 19c below the
second layers 106a, 106b, 106c. Without the apertures 200, the gas
occupying cavities 19a, 19b, 19c would exert a pressure on its
respective second layer 106a, 106b, 106c as the second layer 106a,
106b, 106c deforms downward. With the apertures 200, however, the
gas occupying cavities 19a, 19b, 19c is allowed to escape through
the apertures 200 of the respective second layer 106a, 106b, 106c
that is deforming towards the substrate 20, resulting in a decrease
of the actuation time. Similarly, the apertures 200 allow gas to
flow back into the cavities 19a, 19b, 19c when the respective
second layers 106a, 106b, 106c return to the relaxed state.
[0096] FIG. 10A shows an example of a microelectromechanical (MEMS)
device 300 in accordance with certain embodiments disclosed herein.
The MEMS device 300 comprises a substrate 20 and a movable layer 14
mechanically coupled to the substrate 20. In certain embodiments,
the movable layer 14 is directly mechanically coupled to the
substrate 20 (e.g., as shown in FIG. 10A), while in other
embodiments, the movable layer 14 is mechanically coupled to the
substrate 20 by intervening structures (e.g., the support structure
18 shown in FIG. 13A). In still other embodiments, the optical
stack 16 is integral with a first substrate and the movable layer
14 is integral with a second substrate that is mechanically coupled
to the first substrate during the fabrication process. The movable
layer 14 is movable between a first position and a second position.
In certain embodiments, the second position is further from the
substrate 20 than is the first position. For example, the first
position can correspond to the position of the movable layer 14
when the device 300 is in an actuated state and the second position
can correspond to the position of the movable layer 14 when the
device 300 is in a relaxed or an unactuated state. In other
embodiments, the second position is closer to the substrate 20 than
is the first position. For example, the first position can
correspond to the position of the movable layer 14 when the device
300 is in a relaxed or an unactuated state and the second position
can correspond to the position of the movable layer 14 when the
device 300 is in an actuated state. The movable layer 14 moves from
the first position to the second position at a first rate and from
the second position to the first position at a second rate. The
second rate is faster than the first rate.
[0097] The substrate 20 may comprise a material that is at least
partially transparent or translucent and at least partially
reflective, such as glass and plastic. The substrate 20 may also be
fabricated into a variety of forms, including, but not limited to,
a homogeneous substance or a non-homogenous substance, or having a
uniform thickness or a non-uniform thickness. The substrate 20 may
also have several sublayers, a shorter expanse or region, or
multiple expanses or regions. In certain embodiments, the substrate
20 includes an optical stack 16.
[0098] The movable layer 14 may comprise a material that is highly
conductive and reflective, such as aluminum. The movable layer 14
may also be fabricated into a variety of forms, including, but not
limited to, a homogeneous substance or a non-homogenous substance,
or having a uniform thickness or a non-uniform thickness. The
movable layer 14 may also have several sublayers, a shorter expanse
or region, or multiple expanses or regions. In certain embodiments,
the movable layer 14 comprises a substantially reflective surface
facing the substrate 20. In certain embodiments, the movable layer
14 is deformable (e.g., as shown in FIG. 10A), while in other
embodiments the movable layer 14 is mechanically coupled to
deformable tethers 32 (e.g., as shown in FIG. 10B) or to deformable
layers 34 (e.g., as shown in FIG. 10C).
[0099] The substrate 20 and the movable layer 14 may define an
adjustable cavity 19 therebetween. The cavity 19 may be filled with
gas, such as air, and/or liquid, such as liquids typically used in
LCD displays or any other liquid suitable for use in displays. In
certain embodiments, the cavity is filled with humid air.
[0100] As shown in FIG. 10A, the movable layer 14 may comprise at
least one aperture 200 through the movable layer 14. Flow of fluid
through the aperture 200 may be at least partially restricted or
limited by a stopple 210 mechanically coupled to the movable layer
14. The stopple 210 may be stationary, deformable due to fluid
pressure, or actuated by external means such as electrostatic,
magnetic, thermoelectric, and shape memory alloys. In certain
embodiments, the actuation and relaxation rates of the movable
layer 14 can be controlled by modifying the geometry (e.g., length,
width, thickness, etc.), materials, mechanical properties (e.g.,
elastic modulus), etc. of the stopple 14. In general, the stopple
210 may comprise any material (e.g., element, alloy, or other
combination of elements) that is conductive, semi-conductive,
insulating, reflective (e.g., aluminum), organic, or inorganic. In
certain embodiments, the stopple 210 comprises the same material as
the movable layer 14. As used herein, the term "stopple" is to be
given its broadest ordinary meaning, including, but not limited to,
a structure that at least partially obstructs a hole, a
perforation, or an aperture. The stopple 210 can be a plug, a flap,
or any other structure that occludes at least a portion of the
aperture 200. In certain embodiments, a fluid conductive element
comprises the stopple 210 and the aperture 200.
[0101] In certain embodiments, the stopple 210 comprises a flap 210
at least partially covering the aperture 200 as schematically
illustrated by FIG. 11A. The stopple 210 may be formed on either
surface of the movable layer 14 depending on whether it is
desirable for actuation to occur at a faster rate than relaxation
or vice versa. The flap 210 comprises a flexible, substantially
flat piece of material having a first portion 211 that is
mechanically coupled to the movable layer 14 and a second portion
212 that is movable with respect to the movable layer 14. A flap
210 at least partially covering an aperture 200 may be referred to
as an "actuated valve." As schematically illustrated in FIG. 11A,
the first portion 211 of the flap 210 is bonded to the movable
layer 14 in certain embodiments (e.g., by depositing the first
portion 211 on the movable layer 14). The second portion 212 of the
flap 210 is not mechanically coupled to the movable layer 14. For
example, as schematically illustrated by FIGS. 11 and 11B, the
second portion 212 of the flap 210 is spaced from the movable layer
14. As schematically illustrated in FIG. 11A, in certain
embodiments, the first portion 211 of the flap 210 is mechanically
coupled to the movable layer 14, and the second portion 212 of the
flap 210 extends over the aperture 200. The end of the second
portion 212 shown in FIG. 11A is free to move relative to the
movable layer 14. As schematically illustrated in FIG. 11B, in
certain embodiments, the flap 210 has two or more first portions
211 that are mechanically coupled to the movable layer 14, and the
second portion 212 extends over the aperture 200 between the two
first portions 211. While the ends of the second portion 212 are
fixed, the second portion 212 between the first portions 211 is
free to move relative to the movable layer 14.
[0102] In certain embodiments, instead of being flexible, the first
portion 211 is coupled to the second portion 212 of the flap 210 by
a hinge that provides the second portion 212 with a rotational
degree of freedom around the axis of the hinge. In some
embodiments, the rotational axis of the hinge is perpendicular to
the movable layer 14, which allows the second portion 212 to move
laterally from a position above the aperture 200 to a position not
above the aperture 200. In some embodiments, the rotational axis of
the hinge is parallel to the movable layer 14, which allows the
second portion 212 to move similarly to the second portion 212
illustrated in FIG. 11A. Other structures for coupling the second
portion 212 to the first portion 211 are also compatible with
embodiments described herein.
[0103] In certain other embodiments, the first portion 211 of the
flap 210 is mechanically coupled to the mechanical layer 14 by a
brace 213 that is attached to the movable layer 14 and that extends
over at least a portion of the flap 210, as schematically
illustrated by FIG. 11C. In certain other embodiments, the first
portion 211 of the flap 210 is mechanically coupled to the movable
layer 14 by a rivet 214 that is attached to the movable layer 14
and that extends through at least a portion of the flap 210, as
schematically illustrated by FIG. 11D. Other structures to couple
the first portion 211 of the flap 210 to the movable layer 14 and
to not couple the second portion 212 of the flap 210 to the movable
layer 14 are also compatible with embodiments described herein.
[0104] In certain embodiments, the stopple 210 comprises a plug 220
at least partially covering and filling the aperture 200, as
schematically illustrated by FIG. 11E. A plug 220 at least
partially covering an aperture 200 may also be referred to as an
"actuated valve." The plug 220 comprises a first portion 221
mechanically coupled to the movable layer 14, a flexible second
portion 222 and a third portion 223 that is sized and shaped to fit
into the aperture 200. FIGS. 11E through 11H show embodiments in
which a first portion 221 of the plug 220 is mechanically coupled
to the movable layer 14 and the second portion 222 and the third
portion 223 are movable with respect to the movable layer 14. In
certain embodiments, the first portion 221 is mechanically coupled
to the movable layer 14 by bonding or by a structure (e.g., a brace
213 or a rivet 214 as schematically illustrated in FIGS. 11G and
11H, respectively). As schematically illustrated in FIG. 11E, the
plug 220 comprises one first portion 221 in certain embodiments. As
schematically illustrated in FIG. 11F, the plug 220 comprises two
or more first portions 221 in certain embodiments. In certain
embodiments, the third portion 223 of the plug 220 is at least
partially within the aperture 200 when the plug 220 is in a relaxed
state (e.g., as shown in FIGS. 11E, 11G, and 11H). In certain other
embodiments, the third portion 223 of the plug 220 is out of the
aperture 200 when the plug 220 is in the relaxed state (e.g., as
shown in FIG. 11F). The third portion 223 can be any shape that at
least partially occludes the aperture 200, for example rectangular
(as depicted in FIGS. 11E-11H), triangular, trapezoidal, or
hemispherical.
[0105] In certain embodiments, the aperture 200 is formed by
patterning and etching through the movable layer 14. In some
embodiments, after the aperture 200 is formed, a sacrificial
material is deposited over the aperture 200 and at least partially
filling the aperture 200 in order to allow conformal deposition of
the stopple 210 material over the aperture 200. In some
embodiments, a first sacrificial material is used to at least
partially fill the aperture 200 and a second sacrificial layer is
deposited and patterned on the movable layer 14 in order to provide
a gap between the movable layer 14 and the second portion 212, 222
of stopple 210 and to permit the first portion 211, 221 of the
stopple 210 to bond to the movable layer 14 (e.g., by depositing
the first portion 211, 221 on the movable layer 14). In some
embodiments, the second sacrificial layer comprises the same
material as the first sacrificial material in the aperture 200. The
stopple 210 material is deposited over the movable layer 14 and the
sacrificial material within the aperture 200. In embodiments where
the stopple 210 comprises a plug 220, the stopple 210 material
fills the remaining portion of the aperture 200 that is not filled
by the sacrificial material. The stopple 210 material is then
patterned to form the stopple 210, and the underlying sacrificial
material is removed, for example by etching, to allow the stopple
210 to move relative to the movable layer 14. In certain
embodiments comprising a structure (e.g., a brace or a rivet) to
affix at least a portion of the stopple 210 to the movable layer
14, persons skilled in the art can provide appropriate patterning
processing steps, such as photolithography and etching, in
accordance with the embodiments described herein.
[0106] In certain embodiments, the stopple 210 is mechanically
coupled to the movable layer 14 so that the stopple 210 is movable
to vary the restriction of the aperture 200 depending on the
direction of movement of the movable layer 14. Depending on the
structure, the actuated valve can move up and down or sideways to
at least partially engage and/or clear the aperture 200. The
mechanical coupling of the stopple 210 to the movable layer 14 may
be made at one location in proximity to the aperture 200 or at
multiple locations, for example along an edge of the stopple 210.
In certain embodiments, at least part of the stopple 210 is held in
place, even during movement of the movable layer 14, while allowing
at least another portion of the stopple 210 to move relative to the
aperture 200 during movement of the movable layer 14. FIGS. 10B and
10C show alternative embodiments having apertures 200 and stopples
210 on a movable layer 14 and on a deformable layer 34,
respectively, which similarly allow fluid flow into and out of the
cavities 19. Other embodiments are possible as well, for example
devices comprising apertures 200 and stopples 210 on the deformable
layer 34 depicted in FIGS. 7C and 7E.
[0107] FIGS. 12A and 12B schematically show the combination of the
stopple 210 and the aperture 200 of FIG. 11A that creates a valve
which allows fluid to flow easily in one direction but not easily
in the opposite direction. While FIGS. 12A and 12B show the stopple
210 of FIG. 11A, other stopples 210, for example, those shown in
FIGS. 11B-11H, perform in a similar manner. At least a portion of
the stopple 210 moves away from the aperture 200 when the movable
layer 14 moves between the relaxed state to the actuated state, as
shown in FIG. 12A. When the movable layer 14 moves from the relaxed
state to the actuated state (shown by arrows 230), fluid within the
cavity 19 is compressed and applies a corresponding force on the
stopple 210 in a direction opposite to the movement of the movable
layer 14 (shown by arrows 240). This force moves at least a portion
of the stopple 210 away from the aperture 200 so that the stopple
210 allows fluid to flow out of the cavity 19 through the aperture
200 (shown by arrows 250). As the movable layer 14 actuates
downward, fluid from within the cavity 19 flows out of the cavity
19 through the available pathways, including through the aperture
200, relatively unimpeded, so the movable layer 14 is not
appreciably slowed by the fluid pressure within the cavity 19 when
moving from the relaxed state to the actuated state.
[0108] Conversely, as shown in FIG. 12B, when the movable layer 14
moves from the actuated state to the relaxed state (shown by arrows
260), fluid outside the cavity 19 applies a force on the stopple
210 towards the aperture 200 (shown by arrows 270), thereby at
least partially covering the aperture 200 and inhibiting fluid from
flowing into the cavity 19 through the aperture 200. As the movable
layer 14 moves upward, the fluid has fewer pathways to flow into
the cavity 19 than it did during actuation, so the fluid forces
directed against the movement of the movable layer 14 are greater,
thereby appreciably slowing the movable layer 14 as it moves from
the actuated state to the relaxed state. In certain embodiments,
the stopple 210 is configured on the opposite side of the aperture
200 so the movement of the stopple 210 is in the opposite
direction, such that the fluid flow into the cavity 19 during
movement of the movable layer 14 from the actuated state to the
relaxed state is faster than the fluid flow out of the cavity 19
during movement of the movable layer 14 from the relaxed state to
the actuated state.
[0109] In some embodiments, the movable layer 14 comprises at least
one valve including an aperture 200 and a stopple 210, wherein
fluid flows through the valve at a first flowrate when the movable
layer 14 moves from the relaxed state to the actuated state and
wherein fluid flows at a second flowrate when the movable layer 14
moves from the actuated state to the relaxed state. As described
above, the movement of the stopple 210 in response to fluid forces
acting upon the stopple 210 during the movement of the movable
layer 14 can result in the first flowrate being faster than the
second flowrate. In certain embodiments, the difference in
flowrates of fluid flowing through the aperture 200 during
actuation and relaxation will cause the movement of the movable
layer 14 to be about 100 times faster during actuation than during
relaxation. In other embodiments, the difference in flowrate causes
the movement of the movable layer 14 during relaxation to be faster
(e.g., by about 100 times) than during actuation.
[0110] FIGS. 13A through 13C schematically illustrate examples of
MEMS devices having at least one aperture 202 through a support
structure 18 between the substrate 20 and the movable layer 14. In
certain embodiments, the support structure 18 spaces the movable
layer 14 from the substrate 20. The support structure 18 may
comprise posts or walls. In certain embodiments, the support
structure 18 comprises walls that inhibit fluid flow from inside
the cavity 19 to outside the cavity 19 during actuation of the
movable layer 14.
[0111] As shown in FIG. 13A, the support structure 18 further
comprises at least one stopple 215 corresponding to the at least
one aperture 202 through the support structure 18. Flow of fluid
through the aperture 202 may be at least partially restricted or
limited by a stopple 215 mechanically coupled to the support
structure 18. The stopple 215 may comprise the same material as the
support structure 18 or a more flexible material. In certain
embodiments, the stopple 215 comprises the same material as the
movable layer 14. While FIGS. 13A through 13C show stopples 215
similar to the stopple 210 illustrated in FIG. 11A, in certain
other embodiments, stopples 215 similar to those shown in FIGS. 11B
through 11H may be used. In certain embodiments, a fluid conductive
element comprises the stopple 215 and the aperture 202.
[0112] As schematically illustrated in FIG. 14A, during actuation
of the movable layer 14, fluid pressure (shown by arrows 280) from
within the cavity 19 displaces the stopple 215 (shown by arrows
282) to provide a pathway for fluid flow from inside the cavity 19
to outside the cavity 19. As schematically illustrated in FIG. 14B,
during relaxation of the movable layer 14, fluid pressure (shown by
arrows 290) from outside the cavity 19 displaces the stopple 215 to
at least partially block fluid flow through the aperture 202 from
outside the cavity 19 to inside the cavity 19. Thus, the fluid
flowrate into the cavity 19 during relaxation of the movable layer
14 is less than the fluid flowrate out of the cavity 19 during
actuation of the movable layer 14. In certain embodiments, the rate
of movement of the movable layer 14 is dependent on the rate of
fluid flow into and out of the cavity 19, and the difference in
fluid flowrates through the aperture 202 during actuation and
relaxation can cause the movement of the movable layer 14 to be
about 100 times faster during actuation than during relaxation. In
other embodiments, the difference in flowrate causes the movement
of the movable layer 14 during relaxation to be faster (e.g., by
about 100 times) than during actuation.
[0113] In some embodiments, the stopple 210 is externally actuated,
causing the stopple 210 to move independent of the movement of the
movable layer 14. For example, the stopple 210 may be selectively
moved to at least partially occlude the aperture 200 or to at least
partially clear the aperture 200 by electrostatic forces, magnetic
forces, thermoelectric forces, and shape memory alloys regardless
of the movement or non-movement of the movable layer 14.
[0114] In certain embodiments, the substrate 20 comprises a plug
164 configured to engage the aperture 200 when the movable layer 14
is in the actuated state, as schematically illustrated by FIGS. 15A
and 15B. The plug 164 can be considered to be a stopple 210 that is
stationary in relation to the movable layer 14. As shown in FIG.
15A, when the movable layer 14 is not in the actuated state, the
plug 164 is separate from the aperture 200 so that fluid can flow
through the aperture 200. As shown in FIG. 15B, when the movable
layer 14 is in the actuated state, the plug 164 at least partially
obstructs fluid flow through the aperture 200. In another
embodiment, the plug 164 may be located on the support structure 18
to engage the aperture 200 on the movable layer 14 when the movable
layer 14 is in the actuated state. In still another embodiment, the
plug 164 may be formed on the movable layer 14 to engage the
aperture 202 in the support structure 18 when the movable layer 14
is in the actuated state. In some embodiments, the plug 164
comprises the same material as the substrate 20. In some
embodiments, a stopple 210 is used with the aperture 200 and the
plug 164, while in other embodiments, no stopple is used with the
aperture 200 and the plug 164. Preferably, the plug 164 is short
enough that the plug 164 only engages the movable layer 14 when the
movable layer 14 is almost fully actuated. In certain embodiments,
a fluid conductive element comprises the plug 164 and the aperture
200, 202.
[0115] When the movable layer 14 moves from the relaxed state to
the actuated state during actuation, the movable layer 14 moves
easily through the cavity 19. When the movable layer 14 is in the
actuated state, the plug 164 at least partially obstructs the
aperture 200 such that fluid flow through the aperture 200 is
limited. This restriction of the fluid flow into the cavity 19
and/or friction force between the plug 164 and the movable layer 14
slows the initial movement of the movable layer 14 from the
actuated state to the relaxed state. In certain embodiments, the
plug 164 contacts the movable layer 14, generating an adhesive
force, or "adhesion force," between the movable layer 14 and the
plug 164, and thus between the movable layer 14 and the substrate
20. This adhesion force increases the initial force required to
move the movable layer 14, and appreciably slows the movable layer
14 as it moves from the relaxed state to the actuated state. In
certain embodiments, the plug 164 will cause the movement of the
movable layer 14 to be about 100 times faster during actuation than
during relaxation. In other embodiments, the plug 164 will cause
the movement of the movable layer 14 during relaxation to be faster
(e.g., by about 100 times) than during actuation.
[0116] As schematically illustrated in FIGS. 16A through 16C, in
certain embodiments, the aperture 200, 202 has a shape that allows
fluid to flow easily in one direction but not easily in the
opposite direction. The aperture 200 shown in FIG. 16A has a first
opening 152 on a surface of the movable layer 14 facing towards the
substrate 20 and a second opening 154 on a surface of the movable
layer 14 facing away from the substrate 20. The first opening 152
has an area which is larger than the area of the second opening
154. Fluid flow through the aperture 200 is greater in the
direction from the first opening 152 to the second opening 154 than
in the direction from the second opening 154 to the first opening
152. The aperture 200 may be conical, pyramidal, hemispherical, or
any shape where the area of the first opening 152 is larger than
the area of the second opening 154. In some embodiments, a stopple
210 is used with the aperture 200 with differing opening areas 152,
154, while in other embodiments, no stopple is used with the
aperture 200 with differing opening areas 152, 154. In certain
embodiments, the aperture 200 with differing opening areas 152, 154
is on the movable layer 14, as schematically illustrated in FIG.
16A. In other certain embodiments, the aperture 202 with differing
opening areas 156, 158 is on the support structure 18, as
schematically illustrated in FIG. 16B. In still other certain
embodiments, the aperture 200 with differing opening areas 152, 154
is on the deformable layer 34, as schematically illustrated in FIG.
16C. In certain embodiments, a fluid conductive element comprises
the aperture 200, 202.
[0117] Referring again to FIG. 16A, when the movable layer 14 moves
from the relaxed state to the actuated state, fluid within the
cavity 19 is compressed and flows out of the cavity 19 through the
aperture 200. As the movable layer 14 actuates downward, fluid from
within the cavity 19 flows out of the cavity 19 through the
available pathways, including through the aperture 200, relatively
unimpeded, so the movable layer 14 is not appreciably slowed by the
fluid pressure within the cavity 19 when moving from the relaxed
state to the actuated state. However, when the movable layer 14
moves from the actuated state to the relaxed state, fluid outside
the cavity 19 has only a small area to flow through the aperture
200, so the fluid forces directed against the movement of the
movable layer 14 are greater, thereby appreciably slowing the
movable layer 14. The shape of the aperture 200 thus inhibits fluid
from flowing into the cavity 19 through the aperture 200.
[0118] In some embodiments, the aperture 200 has a first opening on
a surface of the movable layer 14 facing towards the substrate 20
which is smaller than a second opening on a surface of the movable
layer 14 facing away from the substrate 20. When the movable layer
14 moves from the actuated state to the relaxed state, fluid
outside the cavity 19 flows into the cavity 19 through the aperture
200 relatively unimpeded, so the movable layer 14 is not
appreciably slowed by the fluid pressure. However, when the movable
layer 14 moves from the relaxed state to the actuated state, fluid
inside the cavity 19 has only a small area to flow through the
aperture 200, so the fluid forces directed against the movable
layer 14 are greater, thereby appreciably slowing the movable layer
14. The shape of the aperture 200 thus inhibits fluid from flowing
out of the cavity 19 through the aperture 200.
[0119] FIGS. 17A through 17C show interferometric modulators 300
comprising an adhesive layer 310 between the substrate 20 and the
movable layer 14. As shown in FIG. 17A, the adhesive layer 310 may
be formed on the surface of the substrate 20 facing the movable
layer 14, while in other embodiments the adhesive layer 310 is
formed on the surface of the movable layer 14 facing the substrate
20 or on both the surface of the substrate 20 facing the movable
layer 14 and the surface of the movable layer 14 facing the
substrate 20. The adhesive layer 310 contacts both the substrate 20
and the movable layer 14 when the movable layer 14 is in the
actuated state. In certain embodiments in which the movable layer
14 moves from the actuated position to the relaxed position at a
rate faster than from the relaxed position to the actuated
position, the adhesive layer 310 is formed on the surface of the
movable layer 14 facing away from the substrate 20 and that
contacts a stationary layer above (i.e., adjacent to or in close
proximity with) the movable layer 14 when in the relaxed state. In
some embodiments, the adhesive layer 310 may comprise water, an
organic material, an inorganic material, a self-assembled
monolayer, or any material that will provide adhesion between the
substrate 20 and the movable layer 14 when the movable layer 14 is
in the actuated state.
[0120] In certain embodiments, during fabrication of the
interferometric modulator 300, the substrate 20 is processed to
produce a substantially smooth surface of the substrate 20 facing
the movable layer 14 (e.g., by smoothing the optical stack 16).
Examples of processes for smoothing include, but are not limited
to, chemical mechanical polishing, electro-chemical etching, dry
etching, atomic layer dry etching, etc. In certain embodiments,
during fabrication of the interferometric modulator 300, a
sacrificial layer is formed over the substrate 20, and the movable
layer 14 is formed over the sacrificial layer. The sacrificial
layer of certain embodiments is processed to make it smoother
(e.g., by chemical mechanical polishing, electro-chemical etching,
dry etching, atomic layer dry etching, etc.) prior to formation of
the movable layer 14 in order to produce a substantially smooth
surface of the movable layer 14 facing the substrate 20. In certain
embodiments in which at least one of the substrate 20 or the
sacrificial layer is smoothed, the surface area in contact between
the movable layer 14 and the substrate 20, and therefore the
adhesion force between the substrate 20 and the movable layer 14,
is advantageously increased when the movable layer 14 is in the
actuated state and the adhesive layer 310 contacts both the
substrate 20 and the movable layer 14.
[0121] When the movable layer 14 moves from the relaxed state to
the actuated state during actuation, the movable layer 14 moves
easily through the cavity 19. When the movable layer 14 is in the
actuated state, the adhesive layer 310 contacts both the movable
layer 14 and the substrate 20, generating an adhesion force between
the movable layer 14 and the substrate 20. This adhesion force
increases the initial force required to move the movable layer 14,
and appreciably slows the movable layer 14 as it moves from the
actuated state to the relaxed state. In certain embodiments, the
adhesion force from the adhesive layer 310 will cause the movement
of the movable layer 14 to be about 100 times faster during
actuation than during relaxation. In other embodiments, the
adhesion force will cause the movement of the movable layer 14
during relaxation to be faster (e.g., by about 100 times) than
during actuation.
[0122] As described above, in some embodiments, the movable layer
14 moves in response to a voltage applied between a first electrode
182 and a second electrode 184. When a potential difference is
applied to a selected row and column, the capacitor formed at the
intersection of the row and column electrodes, and the
corresponding pixel, becomes charged, and electrostatic forces pull
the movable layer 14 towards the substrate 20, as schematically
illustrated by arrows 181 in FIGS. 18A and 18B. If the voltage is
high enough, the movable layer 14 is deformed and is forced against
the substrate 20. A dielectric layer within the substrate 20 may be
used to prevent shorting and to control the separation distance
between the movable layer 14 and the substrate 20. The behavior of
the movable layer 14 is the same regardless of the polarity of the
applied potential difference between the first electrode 182 and
second electrode 184.
[0123] In some embodiments, as schematically illustrated in FIG.
18A, the first electrode 182 is configured to communicate with a
diode 186 and a leakage resistor 189 is configured to be in
parallel with the capacitor formed by the device. The diode 186
operates as a check valve. If the column voltage is brought to a
high voltage, the capacitor formed by the device will charge to the
applied voltage minus the diode voltage (e.g., 0.6 volts) by charge
flowing from the column wire to the capacitor. When the column
voltage is brought back down to a lower voltage, the diode 186
stops the flow of charge from the capacitor back through the column
wire. Instead, the capacitor charge will gradually dissipate
through the leakage resistor 189. In this way, the actuation rate
and the relaxation rate can be tailored to be different from one
another.
[0124] In certain embodiments, the first electrode 182 is
configured to communicate with zener diodes 187 and 188. Unlike the
diode 186, the zener diodes 187, 188 permit current to flow in the
reverse direction if the voltage is larger than the breakdown
voltage. Placing two zener diodes 187, 188 in series and oriented
opposite one another allows both voltage polarities to be applied
to the columns. When a positive voltage is applied to the pixel,
the zener diode 187 allows current to flow from the first electrode
182 to the capacitor and the zener diode 188 breaks down, also
allowing current to flow from the first electrode 182 to the
capacitor. When a negative voltage is applied to the pixel, the
zener diode 188 allows current to flow from the capacitor to the
first electrode 182 and the zener diode 187 breaks down, also
allowing current to flow from the capacitor to the first electrode
182. When no voltage is applied to the pixel, the zener diodes 187,
188 block the flow of charge from the capacitor back through the
column wire without breaking down. Instead, the capacitor charge
will gradually dissipate through the leakage resistor 189.
[0125] Manipulation of the mechanical persistence of the movable
layer allows an interferometric modulator to be operated without
using the hysteresis property of the modulator (illustrated in
FIGS. 3 through 5 and 19). Instead, the processes and systems
described herein may be used with row/column actuation protocols
that maintain voltages to the MEMS interferometric modulators that
are above or below the "hysteresis window" or the "stability
window." These protocols may advantageously operate the MEMS
interferometric modulator at lower voltages than the voltages
employed with the processes and systems described with reference to
FIGS. 3 through 5. Examples of such actuation protocols are
described in U.S. patent application Ser. No. 11/112,487, entitled
"Device and Method for Display Memory Using Manipulation of
Mechanical Response," filed Apr. 22, 2005, incorporated by
reference herein in its entirety.
[0126] FIGS. 19A-19E illustrate an example of an asymmetric rate
protocol in contrast with a hysteresis drive scheme for an example
pixel of an interferometric modulator display device. FIG. 19A
illustrates an example of a hysteresis curve of the example pixel.
The horizontal axis of FIG. 19A corresponds to the brightness of
the pixel and the vertical axis corresponds to the applied pixel
voltage, which is the voltage difference between the column voltage
and the row voltage of the pixel. FIG. 19A illustrates that when
the magnitude of the pixel voltage is changed from below about 3.5
volts to above about 3.5 volts, the movable layer of the pixel
moves from the relaxed state to the actuated state, thereby
changing the brightness of the pixel from high brightness to low
brightness. FIG. 19A further illustrates that when the magnitude of
the pixel voltage is changed from above about 2.5 volts to below
about 2.5 volts, the movable layer of the pixel moves from the
actuated state to the relaxed state, thereby changing the
brightness of the pixel from low brightness to high brightness. The
"hysteresis window" of the pixel is the voltage range between the
voltages that cause actuation and relaxation of the movable layer,
illustrated in FIG. 19A to be between about +2.5 volts and +3.5
volts and between about -2.5 volts and -3.5 volts.
[0127] FIG. 19B illustrates an example of a series of pixel
voltages which can be used to actuate and release the example pixel
having the hysteresis curve of FIG. 19A. FIG. 19C illustrates an
example of a series of column voltages and row voltages
corresponding to the pixel voltages of FIG. 19B. The horizontal
axes of FIGS. 19B and 19C correspond to time and the vertical axes
of FIGS. 19B and 19C correspond to pixel voltage and column/row
voltages, respectively. As illustrated in FIG. 19B, the pixel
voltage is selectively switched between -3 and +3 volts for two
cycles (e.g., by switching the column voltage between +6 volts and
0 volts while the row voltage remains at about +3 volts). The
magnitudes of these pixel voltages are insufficient to switch the
example pixel between the actuated and relaxed states, as shown in
the hysteresis curve of FIG. 19A, so the example pixel remains
unaffected. During these cycles, the column voltage is used in
actuating or releasing other pixels of the display device sharing
the same column voltage of the example pixel.
[0128] When the example pixel is to be actuated, the column voltage
is switched to about +6 volts and the row voltage is switched to
about 0 volts, resulting in a pixel voltage of about +6 volts.
Because this pixel voltage is greater than the actuation voltage of
+3.5 volts, as shown in FIG. 19A, the movable layer of the example
pixel is actuated. The pixel voltage of FIG. 19B then continues to
alternate between -3 and +3 volts for another two cycles (e.g., by
switching the column voltage between +6 volts and 0 volts while the
row voltage remains at about +3 volts). Again, the magnitudes of
these pixel voltages are insufficient to switch the example pixel,
so the example pixel remains in the actuated state while the column
voltage is used in actuating or releasing other pixels of the
display device sharing the same column voltage of the example
pixel.
[0129] When the example pixel is to be relaxed, the column voltage
is switched to about 0 volts and the row voltage is switched to
about 0 volts, resulting in a pixel voltage of about 0 volts.
Because this pixel voltage is less than the relaxation voltage of
+2.5 volts, as shown in FIG. 19A, the movable layer of the example
pixel is relaxed. The pixel voltage can then continue to alternate
between -3 and +3 volts until the example pixel is to be actuated
again.
[0130] For a hysteresis drive scheme (e.g., as shown in FIGS.
19A-19C), a static image only has to be written once, and it can
then be held indefinitely. However, for displaying video images
which change over time, the display must be continuously updated.
Because power is proportional to the square of the voltage, the
relatively large switches of the column voltage of a hysteresis
drive scheme (e.g., between +6 volts and 0 volts shown in FIG. 19C)
correspond to substantial power consumption. The power used to
change the columns is much larger than the power to change the rows
because each row changes only once per display frame, while each
column changes once for every row change.
[0131] FIGS. 19D and 19E illustrate an example of a series of pixel
voltages and column/row voltages, respectively, which can be used
to actuate and release an example pixel which does not have a
hysteresis curve, but which has an asymmetric rate. The horizontal
axes of FIGS. 19D and 19E correspond to time and the vertical axes
of FIGS. 19D and 19E correspond to pixel voltage and column/row
voltages, respectively. In certain embodiments, an asymmetric
protocol is similar to the drive scheme used for STN LCD display
devices.
[0132] In the example asymmetric protocol of FIGS. 19D and 19E,
while the example pixel can be actuated by applying a pixel voltage
having a magnitude greater than about +3.5 volts (actuation
voltage) and can be relaxed by applying a pixel voltage having a
magnitude less than about +3.5 volts, the rate of actuation upon
applying the actuation voltage is faster than the rate of
relaxation upon applying a voltage less than the actuation voltage.
Since the example pixel does not have a hysteresis curve, the
example pixel begins to relax as soon as the pixel voltage is less
than the actuation voltage. However, since the rate of relaxation
is relatively slow, while the example pixel begins to relax
immediately once the pixel voltage is less than the actuation
voltage, the example pixel does not completely relax until a period
of time has elapsed. This period of time can be approximately equal
to the time period between column/row voltage pulses (e.g., the
time period of voltage cycles), or the period of time can be
greater than the time period of voltage cycles (e.g., approximately
equal to the time period of two or more voltage cycles).
[0133] As illustrated in FIG. 19D, the pixel voltage is selectively
switched between -1 and +1 volts for two cycles (e.g., by switching
the column voltage between about +2 volts and +4 volts while the
row voltage remains at about +3 volts). The magnitudes of these
pixel voltages are insufficient to actuate the example pixel, so
the example pixel is unaffected by these pixel voltages. During
these cycles, the column voltage is used in actuating other pixels
of the display device sharing the same column voltage of the
example pixel.
[0134] When the example pixel is to be actuated, the column voltage
is switched to about +4 volts and the row voltage is switched to
about 0 volts, resulting in a pixel voltage of about +4 volts.
Because this pixel voltage is greater than the actuation voltage of
+3.5 volts, the movable layer of the example pixel is actuated. The
pixel voltage of FIG. 19D then continues to alternate between -1
and +1 volts for another two cycles (e.g., by switching the column
voltage between +4 volts and +2 volts while the row voltage remains
at +3 volts). Again, the magnitudes of these pixel voltages are
less than the actuation voltage of the example pixel, so the
example pixel relaxes during these cycles. To keep the example
pixel in the actuated state for another cycle, the pixel voltage is
again selected to be greater than the actuation voltage.
[0135] For the example asymmetric protocol of FIGS. 19D and 19E,
the example pixel begins to relax once the pixel voltage is less
than the actuation voltage. Thus, the example pixel can be in the
relaxed state at a selected moment once a sufficient amount of time
has elapsed from the immediately preceding application of a pixel
voltage greater than the actuation voltage. For example, as shown
in FIG. 19D, for a rate of relaxation in which the pixel takes
about three voltage cycles to switch from the actuated state to the
relaxed state, the pixel voltage remains below the actuation
voltage of +3.5 volts for three cycles prior to the moment when the
example pixel is to be in the relaxed state. Even when the pixel
voltage is about +2 volts (e.g., by switching the column voltage to
+2 volts and switching the row voltage to about 0 volts), the pixel
voltage is less than the actuation voltage, and the movable layer
in the pixel continues to slowly return to the relaxed state. To
actuate the example pixel, the pixel voltage is again selected to
be greater than the actuation voltage.
[0136] Because the switches of the column voltage (e.g., between +4
volts and +2 volts) for the asymmetric protocol can be
substantially less than for the hysteresis drive scheme (e.g.,
between +6 volts and 0 volts as described above), certain
embodiments utilizing the asymmetric protocol advantageously
provide substantial energy savings over the hysteresis drive
scheme. For an asymmetric protocol (e.g., as shown in FIGS. 19D and
19E), a static image has to be continuously updated, as do video
images that change over time. While the continual updating of
static images reduces the energy savings gained by utilizing the
asymmetric protocol rather than the hysteresis drive scheme, the
asymmetric protocol of certain embodiments can provide substantial
power reductions for changing video images that have to be updated
for both drive schemes.
[0137] Various specific embodiments have been described above.
Although the invention has been described with reference to these
specific embodiments, the descriptions are intended to be
illustrative of the invention and are not intended to be limiting.
Various modifications and applications may occur to those skilled
in the art without departing from the true scope of the invention
as defined in the appended claims.
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