U.S. patent application number 12/428530 was filed with the patent office on 2009-08-20 for memory module, memory module socket and mainboard using same.
This patent application is currently assigned to SAMSUNG ELECTRONICS CO., LTD.. Invention is credited to Kyoung-Sun KIM, Jea-Eun LEE, Jung-Joon LEE, Sung-Joo PARK.
Application Number | 20090209134 12/428530 |
Document ID | / |
Family ID | 39051356 |
Filed Date | 2009-08-20 |
United States Patent
Application |
20090209134 |
Kind Code |
A1 |
PARK; Sung-Joo ; et
al. |
August 20, 2009 |
MEMORY MODULE, MEMORY MODULE SOCKET AND MAINBOARD USING SAME
Abstract
A memory module socket disposed on a principal surface of a
mainboard, and adapted to mechanically receive and electrically
connect a memory module with a mainboard, the memory module socket
including a first unit socket having a plurality of first socket
pins adapted to electrically connect a first connector disposed on
an edge of the memory module, and a second unit socket having a
plurality of second socket pins adapted to electrically connect to
a second connector disposed on the memory module orthogonal to the
first connector, wherein the memory module as installed in the
memory module socket is parallel to the principal surface of the
mainboard.
Inventors: |
PARK; Sung-Joo; (Anyang-si,
KR) ; KIM; Kyoung-Sun; (Uijeongbu-si, KR) ;
LEE; Jung-Joon; (Seoul, KR) ; LEE; Jea-Eun;
(Seoul, KR) |
Correspondence
Address: |
VOLENTINE & WHITT PLLC
ONE FREEDOM SQUARE, 11951 FREEDOM DRIVE SUITE 1260
RESTON
VA
20190
US
|
Assignee: |
SAMSUNG ELECTRONICS CO.,
LTD.
Suwon-si
KR
|
Family ID: |
39051356 |
Appl. No.: |
12/428530 |
Filed: |
April 23, 2009 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
11836286 |
Aug 9, 2007 |
7540743 |
|
|
12428530 |
|
|
|
|
Current U.S.
Class: |
439/620.15 |
Current CPC
Class: |
H01R 12/83 20130101;
H05K 2201/10159 20130101; H05K 1/117 20130101; H05K 2201/09954
20130101; H01R 13/62988 20130101; H05K 1/0295 20130101; H01R 13/631
20130101 |
Class at
Publication: |
439/620.15 |
International
Class: |
H01R 13/66 20060101
H01R013/66 |
Foreign Application Data
Date |
Code |
Application Number |
Aug 11, 2006 |
KR |
10-2006-0076261 |
Claims
1. A memory module comprising: a memory module substrate having a
plurality of memory devices mounted thereon; a first connector
having a first set of connection pins within a first arrangement,
the first connector being formed on a lengthwise edge of the memory
module substrate; and a second connector disposed orthogonal to the
first connector and having a second set of connection pins with a
second arrangement different from the first arrangement.
2. The memory module of claim 1, wherein the first set of
connection pins has a linear side-by-side arrangement and the
plurality set of connection pins has a complex arrangement.
3. The memory module of claim 2, wherein the complex arrangement
comprises a staggered or zigzag arrangement.
4. The memory module of claim 1, wherein the second connector
comprises two second connectors respectively formed on opposing
widthwise edges of the memory module.
5. The memory module of claim 1, wherein the second connector is a
single connector centrally disposed in the memory module.
6. The memory module of claim 1, wherein the memory module is a
small outline dual in-line memory module SODIMM.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This is a divisional of application Ser. No. 11/836,286
filed on Aug. 9, 2007, which is incorporated herein by reference in
its entirety.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates to a memory module, a memory
module socket, and a mainboard using same. More particularly, the
invention relates to a memory module providing an increased number
of connectors adapted for use as external connection ports to the
memory module, a related memory module socket, and a mainboard
incorporating same.
[0004] This application claims the benefit of Korean Patent
Application No. 10-2006-0076261, filed on 11 Aug. 2006, the subject
matter of which is hereby incorporated by reference.
[0005] 2. Description of the Related Art
[0006] Contemporary computational systems, such as personal
computers (PCs), workstations, notebook computers, and mobile
devices such as mobile phones require an increasing variety of
functional capabilities. This expanding set of capabilities
requires a greater tolerance for different software configurations
and hardware add-ons. At the same time, contemporary computational
systems are being reduced in physical size while also providing
greater data capacities and increased operating speeds.
[0007] One result of these commercial motivations is the provision
of significantly expanded memory capabilities within contemporary
computational systems. The number, speed and complexity of signals
(e.g., data, address and control) applied to the various memory
resources in such systems have also increased. The number of
connection pins (ground, power and signal) connecting this
expanding multiplicity of signals is also increasing. This
increasing number of memory module pins generally increases the
area (and/or number deposition layers) associated with memory
modules incorporated within the system. The overall wiring design
of the printed circuit boards (PCBs) implementing the various
memory modules as well as the incorporating mainboard has been in
many instances quite challenging. As a result of this difficulty,
further reductions in the physical size of contemporary
computational systems has been impeded and the signaling
performance associated with constituent memory systems has in some
instance deteriorated.
[0008] Memory modules are devices mounting a plurality of
semiconductor memory devices on a single substrate, such as a PCB.
Memory modules commonly group the performance functionality of the
memory devices, such as the provision of power/ground signals,
control and address signals, etc. Memory modules are commonly
connected to one another or to a mainboard using via socket and pin
assemblies. That is, a memory module is mechanically inserted into
a memory module socket to electrically connect it with the
mainboard (sometimes referred to as a motherboard) within a
computational system.
[0009] Common memory modules include the single in-line memory
module (SIMM) type in which contact points are linearly arranged on
one side of the module substrate, and the dual in-line memory
module (DIMM) type in which the contact points are linearly
arranged on both sides of the memory module substrate. Indeed, most
memory modules have a structure in which the contact points are
arranged along one or more primary sides in a lengthwise
direction.
[0010] However, when a connector, (such as a Tape Automated Bonded
or TAB connector), is formed on a memory module such that its
contact points are arranged along only one side, it is difficult to
meet the contemporary demands for a greater number of connections.
This is particularly true given the decreasing size of many memory
modules. Thus, further reductions in the size of memory modules is
precluded by a lack of reliable electrical connections.
[0011] To begin addressing this problem, another type of memory
module has recently been introduced. This memory module includes
not only a number of external connection ports formed along the
lengthwise direction of module substrate, but also along the
widthwise direction (i.e., along the short sides of the memory
module).
[0012] Figure (FIG.) 1 is a front schematic view of a conventional
memory module as it fits into a corresponding memory module socket.
Referring to FIG. 1, a total three connectors, including a
lengthwise connector 111 and two widthwise connectors 112, are
formed on a memory module 110 mounting a plurality of memory
devices 115. A memory module socket 120 mounted on a mainboard
substrate 150 is adapted to receive memory module 110 and has a
U-shaped structure containing socket pins that correspond to
connectors 111 and 112.
[0013] When edge portions of memory module 110 are inserted into
memory module socket 120 from a direction indicated by an arrow in
FIG. 1, the pins forming connectors 111 and 112 are electrically
connected to the socket pins of memory module socket 120. Thus,
memory module 110 is mechanically and electrically connected to
mainboard 150 via memory module socket 120. Through this
multiplicity of pin connections power, data, control and address
signals may be communicated between mainboard 150 and memory module
110.
[0014] In the conventional example shown in FIG. 1, the pins
forming first connector 111 and second connectors 112 must be
mechanically inserted into the socket pins of memory module socket
120. However, this insertion-connection approach presents some
structural difficulties. That is, considering the direction at
which memory module 110 is inserted into memory module socket 120
and the edge-perpendicular layout of the individual pins forming
first connector 111 and second connectors 112, the sheering
mechanical force exerted on the pins of second connectors 112 may
actually damage the constituent pins.
[0015] Ideally, the layout of the pins forming second connectors
120 and/or the socket pins in memory module socket 120 would be
re-arranged to avoid this mechanical wear and tear. However, the
structure of memory module socket 120 is restricted due to its
electrical and physical characteristics and a less wearing
mechanical arrangement has not been practically realized. For
example, it is difficult to shorten the length of a wiring
connection associated with second connectors 112 without the
connection to memory module socket 120 becoming electrically
unstable.
[0016] Many DIMM type memory modules designed for portable use
within mobile devices and notebook computers have adopted the
so-called small outline dual in-line memory module (SODIMM) layout.
The connection approach between SODIMMs and corresponding memory
module sockets is different from that of general DIMMs. The SODIMM
is inserted in its memory module socket by first being inclined at
a predetermined angle with respect to the mainboard substrate and
then pivoted toward the mainboard parallel with the surface of the
mainboard substrate in order to be coupled within the memory module
socket. This increased insertion and layout complexity preclude
conventional SODIMMs from having widthwise connectors in addition
to lengthwise connectors.
[0017] A growing demand exists for a practical connection approach
for SODIMMs having expanded connection capabilities.
SUMMARY OF THE INVENTION
[0018] Embodiments of the invention provide a memory module having
an increased number of connectors without expanding the overall
area of the memory module, while simultaneously providing a
structure that is simple, easy to realize, and capable of being
securely and reliably installed in a corresponding memory module
socket. Embodiments of the invention also provide corresponding
memory module sockets and mainboard assemblies.
[0019] In one embodiment, the invention provides a memory module
socket disposed on a principal surface of a mainboard, and adapted
to mechanically receive and electrically connect a memory module
with a mainboard, the memory module socket comprising; a first unit
socket having a plurality of first socket pins adapted to
electrically connect a first connector disposed on an edge of the
memory module, and a second unit socket having a plurality of
second socket pins adapted to electrically connect to a second
connector disposed on the memory module orthogonal to the first
connector, wherein the memory module as installed in the memory
module socket is parallel to the principal surface of the
mainboard.
[0020] In another embodiment, the invention provides a mainboard
adapted to mechanically receive and electrically connect a memory
module, and mainboard comprising; a mainboard substrate and a
memory module socket mounted on the mainboard substrate. The memory
module socket comprises; a first unit socket having a plurality of
first socket pins adapted to electrically connect a first connector
disposed on an edge of the memory module, and a second unit socket
having a plurality of second socket pins adapted to electrically
connect to a second connector disposed on the memory module
orthogonal to the first connector, wherein the memory module as
installed in the memory module socket is parallel to the principal
surface of the mainboard.
[0021] In another embodiment, the invention provides a memory
module comprising; a memory module substrate having a plurality of
memory devices mounted thereon, a first connector having a first
set of connection pins with in a first arrangement, the first
connector being formed on a lengthwise edge of the memory module
substrate, and a second connector disposed orthogonal to the first
connector and having a second set of connection pins with a second
arrangement different from the first arrangement.
BRIEF DESCRIPTION OF THE DRAWINGS
[0022] FIG. 1 is a front view showing a state in which a memory
module is coupled to a conventional memory module socket;
[0023] FIG. 2 is a cross sectional view showing a coupling state of
a memory module and a memory module socket according to an
embodiment of the present invention;
[0024] FIG. 3 is a plan view of the memory module of FIG. 2;
[0025] FIG. 4 is a perspective view of a second unit socket of the
memory module socket of FIG. 2;
[0026] FIG. 5 is a plan view of the memory module of FIG. 3 and the
second unit socket of the memory module socket of FIG. 4;
[0027] FIG. 6 is a cross sectional view for explaining the
operation of a fixing latch of the memory module socket of FIG.
2;
[0028] FIG. 7 is a view schematically showing the wiring pattern of
the memory module of FIG. 3;
[0029] FIG. 8 is a plan view of a memory module according to
another embodiment of the present invention; and
[0030] FIG. 9 is a plan view of the second unit socket of a memory
module socket according to another embodiment of the present
invention that is coupled to the memory module of FIG. 8.
DESCRIPTION OF EMBODIMENTS
[0031] The invention will now be described in relation to several
embodiments illustrated in the attached drawings. Throughout the
written description and drawings, like reference numerals will be
used to denote like or similar elements.
[0032] FIG. 2 is a cross sectional view showing a coupled state
between a memory module and a memory module socket according to an
embodiment of the present invention. FIG. 3 is a plan view of the
memory module shown in FIG. 2. FIG. 4 is a perspective view of the
second unit socket of the memory module socket shown in FIG. 2.
FIG. 5 is a plan view of the memory module shown in FIG. 3 and the
second unit socket of the memory module socket shown in FIG. 4.
FIG. 6 is a cross sectional view further illustrating the operation
of the fixing latch for the memory module socket shown in FIG. 2.
FIG. 7 is a schematic view illustrating a wiring pattern for the
memory module shown in FIG. 3.
[0033] As illustrated in FIGS. 2 through 7, only a mainboard
substrate 50 of an assumed mainboard is shown. The multiplicity of
components commonly provided on the mainboard are not illustrated
to preserve clarity in the drawings. With collective reference to
FIGS. 2 through 7, a memory module socket 20 is installed on
mainboard substrate 50 and an end portion of a memory module 10 is
inserted in memory module socket 20. Memory module 10 is
electrically connected to the mainboard via memory module socket
20.
[0034] In the illustrated embodiment, memory module 10 is assumed
to be a SODIMM, such as the type commonly used in mobile devices
such as notebook computers and mobile phones. However, the
invention is not limited to only this type of memory module, but
may be applied to at least other DIMM types. However, as will be
described in greater detail below, an embodiment of the present
invention as applied to a SODIMM (e.g., memory module 10) allows an
efficient arrangement of the memory module on mainboard substrate
50 with an expanded number of connection ports having greater
overall physical reliability.
[0035] As shown in greater detail in FIG. 3, memory module 10
comprises a memory module substrate 14 having a wiring pattern 70
formed thereon, a plurality of memory devices 15 mounted on a
principal surface of memory module substrate 14, lengthwise
connectors 11 and widthwise connectors 12 formed on respective
lengthwise and widthwise edges of the principal surface. For
convenience of explanation, the lengthwise connector 11 will
hereafter be referred to as first connector 11 and the widthwise
connectors 12 will be referred to collectively or singularly as
second connector 12. The illustrated example of FIG. 2 assumes
first and second connectors formed by a Tape Automated Bonding
(TAB) process but other manufacturing techniques may be used to
form the connectors. Further, the terms lengthwise and widthwise
are clearly relative terms drawn to the particular rectangular
shape of conventional memory modules. Such relative geometric terms
are merely exemplary and embodiments of the invention may include
memory module substrates have any reasonable shape and size, hence
the generic use of "first" and "second" to distinguish respective
connectors having different layouts relative to a corresponding
memory module socket and/or a direction of insertion for the
constituent memory module with the module socket.
[0036] That is, certain embodiments of the invention provide a
first connector 11 and a second connector 12 having different
connection pin layout structures adapted for connection within
memory module socket 20. For example, since first connector 11 will
be mechanically inserted into a first unit socket 30 and
electrically connected with a plurality of first socket pins formed
within first unit socket 30, the plurality of connection pins
forming first connector 11 may be linearly arranged in a lengthwise
direction on one edge of memory module 10. In contrast, since
second connector 12 will be mechanically connected into a second
unit socket 40 and electrically connected to a plurality of second
socket pins 41 formed with second unit socket 40, the plurality of
connection pins forming second connector 12 will have a different
arrangement (e.g., in one embodiment a so-called staggered
arrangement in which the pins forming the second connector 12 are
arranged in a zigzag pattern). If the connection pins forming
second connector 12 are arranged with a staggered structure, more
pins may be arranged in a given spaced as compared with
conventional arrangements. Thus, the number of connection ports
provided by memory module 10 may be increased without impairing the
physical reliability of the design or expanding the size of the
module.
[0037] As noted above, memory module 10 is electrically connected
to the mainboard via memory module socket 20 installed on mainboard
substrate 50. Since memory module 10 includes first connector 11
and second connector 12 having different connection pin
arrangements, memory module socket 20 comprises first unit socket
30 and second unit socket 40 respectively provided to receive first
connector 11 and second connector 12.
[0038] Thus, memory module socket 20 according to the illustrated
embodiment comprises first unit socket 30 and second unit socket
40. In various embodiments, one or more second unit sockets 40 may
be provided on mainboard substrate 50, each adapted to receive a
corresponding second connector 12. Second unit socket 40 is
disposed lateral to first unit socket 30 along mainboard substrate
50. With the above structure, an edge portion of memory module
substrate 14 may be laterally inserted into first unit socket 30
and then pivoted downward to make an electrical connection with one
or more second unit socket(s) 40.
[0039] Thus, first unit socket 30, as shown in FIG. 2, is adapted
to mechanically receive and electrically connect the edge portion
of memory module 10 including first connector 11. First unit socket
30 includes a plurality of first socket pins (not shown) adapted to
respectively connect with the pins forming first connector 11. In
one embodiment, this one-for-one connection is accomplished by
means of a leaf spring mechanism 31 aligning the position of memory
module substrate 14 and securely supporting memory module 10 with
an elastic spring force.
[0040] As illustrated in FIG. 2, leaf spring mechanism 31 is
provided to elastically support first connector 11 of memory module
10 from opposing sides when the lengthwise edge of memory module
substrate 14 is inserted in first unit socket 30. That is, memory
module substrate 14 is inserted in first unit socket 30 at a
laterally disposed angle with respect to mainboard substrate 50.
Once memory module 10 is inserted, leaf spring mechanism 31 presses
memory module substrate 14 downward such that it ultimately lays
parallel with the principal surface of mainboard substrate 50.
Accordingly, the plurality of pins forming first connector 11 are
respectively connected with the first socket pins of first unit
socket 30 by the elastic force provided by leaf spring mechanism
31. Once memory module 10 has been brought into this position,
second connector 12 is ready for insertion with second unit socket
40.
[0041] In one embodiment, two second unit sockets 40, as shown in
FIG. 2, are disposed in an orthogonal relationship with first unit
socket 30 and each adapted to receive a second connector 12
disposed on a widthwise edge of memory module 10. Each second unit
socket 40, as further illustrated in FIG. 4, includes a plurality
of second socket pins 41 having a one-for-one correspondence with
the pins forming each second connector 12. Each second unit socket
40 also includes a notch protrusion 43 used to properly align and
position memory module substrate 14, a plurality of fixing latches
45 capturing an inserted memory module substrate 14, and opposing
alignment pins 47 used to check the positioning of memory module
substrate 14 once captured onto second unit socket 40.
[0042] Unlike the conventional arrangement illustrated in FIG. 1,
memory module 10 may be gently pivoted into connection contact with
second unit socket(s) 40. The corresponding second connectors 12
are not stressed by the force used to mechanically insert the
memory module into its corresponding socket. Further, this
arrangement accommodates a second connector 12 having a "complex"
connection pin layout, as opposed to the conventional "linear"
layout of side-by-side pins. The zigzag pattern shown in blow-up
section of FIG. 3 is one example of a complex connection pattern.
Such complex connection pin layouts allow an increased number of
connection pins per unit width of the memory module. In the
illustrated example, the staggered or zigzag connection pin layout
can be used to realize a more efficient wiring pattern because the
second socket pins 41 are arranged more densely. Yet this greater
number of connection pins may be safely seated within a
corresponding memory socket without risk of damage.
[0043] Notch protrusion 43, as shown in FIGS. 4 and 5, is provided
in a central location of second unit socket 40 in correspondence
with a notch 16 formed in the widthwise edge portion of memory
module substrate 14. Notch 16 in memory module substrate 14 couples
with notch protrusion 43 when memory module substrate 14 is
captured within second unit socket 40, thereby aligning memory
module substrate 14 within second unit socket 40.
[0044] Fixing latches 45, as shown in FIG. 4, are provided at
intervals along the length of second unit socket 40. As further
illustrated in FIG. 6, by pivoting fixing latch 45 following
insertion of memory module 10 into second unit socket(s) 40, memory
module substrate 14 may be held securely to second unit socket(s)
40 by an elastic force exerted by fixing latch 45 to securely
capture memory module 10 at second unit socket(s) 40. In the
illustrated embodiment, although three fixing latches are provided
any other reasonable number of fixing latches might be used.
[0045] Alignment pins 47 are additionally provided in the
illustrated embodiment at opposing ends of second unit socket 40.
Alignment pins 47 ensure that memory module substrate 14 is
properly aligned with second unit socket(s) 40 and may be used to
check positioning.
[0046] In the foregoing configuration, the alignment of memory
module 10 is first provided by matching notch 16 of memory module
10 to notch protrusion 43 of second unit socket 40. Then, the
alignment may be improved using alignment pins 47 such that second
connector 12 of memory module 10 is electrically connected to
second socket pins 41 of memory module socket 20. Once properly
positioned, memory module 10 may be held securely in second unit
socket(s) 40 by fixing latches 45 to provide enhanced physical
stability and operating reliability.
[0047] As memory module 10 is coupled to memory module socket 20,
power, address, control, and data signals may be communicated from
the mainboard to each one of the plurality of memory devices 15 on
memory module 10 via memory module socket 20. The potential for
noise and signal distortion is reduced as the length of
corresponding signal lines is reduced. When a connector is provided
on only a single lengthwise edge of a memory module, as is typical
with conventional approaches, it is difficult to design a wiring
layout having relatively short wiring lengths.
[0048] However, in a memory module according to one particular
embodiment of the invention, as illustrated for example in FIG. 7,
the relative length of wiring may be reduced by connecting power,
address, and control signal lines 71 through second connector 12,
and connecting data signal lines 72 through first connector 11.
[0049] As applied to SODIMMs, certain embodiments of the invention
additionally minimize the "dead space" commonly present in relation
to connected memory modules. Reduction of this dead space
facilitates the design of thinner host device profiles for, e.g.,
mobile devices and notebook computers.
[0050] A memory module according to another embodiment of the
present invention will be described with reference to FIG. 8 which
is a plan view of the memory module and FIG. 9 which is a plan view
of a corresponding second unit socket.
[0051] As shown in FIGS. 8 and 9, a memory module 10a according to
another embodiment of the present invention has a second connector
12a that is disposed in a central portion of memory module 10a
orthogonal to first connector 11a. The pins forming second
connector 12a may be arranged in a complex pattern allowing for the
inclusion of relatively more pins per unit area. A notch 16a is
provided in a central portion of second connector 12a and is
adapted to couple with a notch protrusion 43a associated with a
second unit socket 40a in order to properly position and align
memory module 10a with respect to a corresponding memory module
socket (not shown). Thus, memory module 10a may be securely aligned
and fixed relative to a memory module socket. Here again, the
power, address, and control signal lines 71a may be connected
through second connector 10a to the central portion of memory
module 10a, while data signal lines 72a are connected through first
connector 11a.
[0052] In the present embodiment, although the second connector 12a
is provided in the central area of the memory module substrate 14a
parallel to a short side of the second connector 12a, the right
scope of the present invention is not limited thereto. For example,
a plurality of memory devices 15a can be arranged lengthy in a
direction along the short side. In this case, the second connector
12a can be provided between the memory devices 15a. The second
connector 12a of the memory module 10a can be formed on the memory
module substrate 14a between the plurality of memory devices 15a
because of a particular structure of the second unit socket of the
memory module socket according to the present invention.
[0053] As shown in additional detail in FIG. 9, a single second
unit socket 40a may be provided by the embodiment of the invention
illustrated in FIGS. 8 and 9. The second connector 12a of memory
module 10a may be similarly connected with second unit socket 40a
mounted on a mainboard as described above. That is, a lengthwise
edge of memory module 10a containing first connector 11a is first
inserted into a corresponding first unit socket (not shown, but
similar to the one described above). Then, the memory module
substrate 14a is pressed downward to engage second connector 12a
with second unit socket 40a. Fixing latches, alignment pins, and
notch-to-notch protrusion assemblies may be similarly used to
secure memory module 10a within first and second unit sockets.
However alternate arrangements are also possible. For example,
fixing latches may not be provided in relation to second unit
socket 40a, but notch protrusion 43a may be designed to forcibly
couple with notch 16a formed on memory module 10a to fix and
support memory module substrate 14a.
[0054] In the above-described embodiments, terms such as downward,
lateral, etc., are used in relation to the illustrated examples.
They are clearly relative terms and should not be construed as
mandating a particular geometry, layout arrangement of relative
position of elements. One or more second connectors may be
variously disposed at any reasonable position along a memory
module. Various connection pin types and layouts may be used.
[0055] While this invention has been particularly shown and
described with reference to preferred embodiments thereof, it will
be understood by those skilled in the art that various changes in
form and details may be made therein without departing from the
scope of the invention as defined by the appended claims.
* * * * *