loadpatents
name:-0.013543844223022
name:-0.0095551013946533
name:-0.0050039291381836
Lee; Jea-Eun Patent Filings

Lee; Jea-Eun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Jea-Eun.The latest application filed is for "coupled via structure, circuit board having the coupled via structure and method of manufacturing the circuit board".

Company Profile
4.8.9
  • Lee; Jea-Eun - Seoul KR
  • Lee; Jea-Eun - Gangseo-gu KR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Coupled via structure, circuit board having the coupled via structure and method of manufacturing the circuit board
Grant 10,887,980 - Seo , et al. January 5, 2
2021-01-05
Coupled Via Structure, Circuit Board Having The Coupled Via Structure And Method Of Manufacturing The Circuit Board
App 20200178386 - SEO; Dong-Yoon ;   et al.
2020-06-04
Coupled via structure, circuit board having the coupled via structure
Grant 10,561,013 - Seo , et al. Feb
2020-02-11
Coupled Via Structure, Circuit Board Having The Coupled Via Structure
App 20190191547 - SEO; Dong-Yoon ;   et al.
2019-06-20
Memory module for high-speed operations
Grant 9,082,464 - Sung , et al. July 14, 2
2015-07-14
Data receiver, semiconductor device and memory device including the same
Grant 8,559,241 - Park , et al. October 15, 2
2013-10-15
Memory Module For High-speed Operations
App 20130208524 - SUNG; MYUNG-HEE ;   et al.
2013-08-15
Data Receiver, Semiconductor Device And Memory Device Including The Same
App 20120014156 - PARK; Sung-Joo ;   et al.
2012-01-19
Memory module
Grant 7,859,879 - Park , et al. December 28, 2
2010-12-28
Integrated circuit module and method of forming the same
Grant 7,799,605 - Park , et al. September 21, 2
2010-09-21
Memory Module, Memory Module Socket And Mainboard Using Same
App 20090209134 - PARK; Sung-Joo ;   et al.
2009-08-20
Memory module
App 20090154212 - Park; Sung-Joo ;   et al.
2009-06-18
Memory module, memory module socket and mainboard using same
Grant 7,540,743 - Park , et al. June 2, 2
2009-06-02
Memory Module, Memory Module Socket And Mainboard Using Same
App 20080038961 - PARK; Sung-Joo ;   et al.
2008-02-14
Memory module having improved arrangement of discrete devices
App 20080030943 - Kim; Kyoung-sun ;   et al.
2008-02-07
Integrated circuit module and method of forming the same
App 20080023702 - Park; Sung-Joo ;   et al.
2008-01-31

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