U.S. patent application number 12/367812 was filed with the patent office on 2009-06-04 for process for obtaining a thin, insulating, soft magnetic film of high magnetization, corresponding film and corresponding integrated circuit.
This patent application is currently assigned to STMicroelectronics S.A.. Invention is credited to Pascal Ancey, Guillaume Bouche, Sandrine Couderc, Bernard Viala.
Application Number | 20090140384 12/367812 |
Document ID | / |
Family ID | 34948941 |
Filed Date | 2009-06-04 |
United States Patent
Application |
20090140384 |
Kind Code |
A1 |
Bouche; Guillaume ; et
al. |
June 4, 2009 |
PROCESS FOR OBTAINING A THIN, INSULATING, SOFT MAGNETIC FILM OF
HIGH MAGNETIZATION, CORRESPONDING FILM AND CORRESPONDING INTEGRATED
CIRCUIT
Abstract
A thin soft magnetic film combines a high magnetization with an
insulating character. The film is formed by nitriding Fe-rich
ferromagnetic nanograins immersed in an amorphous substrate. A
selective oxidation of the amorphous substrate is then performed.
The result is a thin, insulating, soft magnetic film of high
magnetization. Many types of integrated circuits can be made which
include a component using a membrane incorporating the
above-mentioned thin film.
Inventors: |
Bouche; Guillaume;
(Grenoble, FR) ; Ancey; Pascal; (Revel, FR)
; Viala; Bernard; (Sassenage, FR) ; Couderc;
Sandrine; (Grenoble, FR) |
Correspondence
Address: |
GARDERE WYNNE SEWELL LLP;INTELLECTUAL PROPERTY SECTION
3000 THANKSGIVING TOWER, 1601 ELM ST
DALLAS
TX
75201-4761
US
|
Assignee: |
STMicroelectronics S.A.
Montrouge
FR
Commissariat a L'Energie Atomique Batiment LE PONAND D
Paris
FR
|
Family ID: |
34948941 |
Appl. No.: |
12/367812 |
Filed: |
February 9, 2009 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
11189028 |
Jul 25, 2005 |
7504007 |
|
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12367812 |
|
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Current U.S.
Class: |
257/531 ;
252/62.51C; 252/62.51R; 252/62.56; 252/62.58; 252/62.59; 257/532;
257/E27.046; 257/E27.048; 428/328; 977/811 |
Current CPC
Class: |
H01F 10/007 20130101;
H01F 10/3227 20130101; H01F 41/302 20130101; H01L 23/552 20130101;
B82Y 40/00 20130101; H01F 10/136 20130101; H01F 10/138 20130101;
H01F 41/18 20130101; H01L 2924/0002 20130101; H01F 10/147 20130101;
Y10T 428/256 20150115; H01F 41/301 20130101; B82Y 25/00 20130101;
H01L 2924/0002 20130101; H01L 2924/00 20130101 |
Class at
Publication: |
257/531 ;
428/328; 252/62.51R; 252/62.51C; 252/62.56; 252/62.58; 252/62.59;
257/532; 977/811; 257/E27.048; 257/E27.046 |
International
Class: |
H01L 27/08 20060101
H01L027/08; B32B 15/00 20060101 B32B015/00; H01F 1/01 20060101
H01F001/01; C01G 49/02 20060101 C01G049/02 |
Foreign Application Data
Date |
Code |
Application Number |
Jul 27, 2004 |
FR |
0408289 |
Claims
1. A thin, insulating, soft magnetic film of high magnetization,
comprising an oxidized amorphous substrate in which nitrided
Fe-rich ferromagnetic nanograins are immersed.
2. The film according to claim 1, wherein the nanograins constitute
a crystalline phase of FeXN with X being selected from the group of
elements consisting of: Zr, Nb, Mo, Ru, Rh, Pd, Hf, Ta, W, Ir, Pt,
Al, Si, Ti, V, Cr, Mn, Cu and the lanthanides.
3. The film according to claim 1, wherein the nanograins have a
diameter of less than 10 nm.
4. The film according to claim 1, wherein the nanograins have a
body-centered cubic or body-centered tetragonal structure.
5. The film according claim 2, wherein the amorphous substrate
essentially consists of XO or XNO.
6. The film according to claim 1, wherein an amorphous phase
represents less than 20% of the total volume of the thin film.
7. The film according to claim 1, characterized in that each of a
plurality of elements is present within the film, in the following
proportions in atomic percent: Fe.sub.aX.sub.bN.sub.cO.sub.d,
45%.ltoreq.a.ltoreq.90%, 1%.ltoreq.b.ltoreq.5%
5%.ltoreq.c.ltoreq.20% 5%.ltoreq.d.ltoreq.30% with
a+b+c+d=100%.
8. An integrated circuit, comprising at least one component using a
membrane incorporating a thin, insulating, soft magnetic film of
high magnetization, comprising an oxidized amorphous substrate in
which nitrided Fe-rich ferromagnetic nanograins are immersed.
9. The integrated circuit according to claim 8, wherein the
component is an inductive component.
10. The integrated circuit according to claim 9, wherein the
membrane of the inductive component can be moved so as to vary the
inductance of the component.
11. The integrated circuit according to claim 10, wherein the
magnetic film of the membrane has a high magnetic permeability
.mu.' and low magnetic losses .mu.''.
12. The integrated circuit according to claim 9, wherein the
membrane of the inductive component is fixed and forms a screening
cover for the inductive component.
13. The integrated circuit according to claim 12, wherein the
magnetic film of the membrane has a low magnetic permeability .mu.'
and high magnetic losses .mu.''.
14. The integrated circuit according to claim 9, wherein the
membrane of the inductive component incorporates a magnetic film of
the FeHfNO type.
15. The integrated circuit according to claim 8, wherein the
membrane forms a cover for encapsulating the component.
16. The integrated circuit according to claim 8, wherein the
membrane forms a support for the component.
17. The integrated circuit according to claim 8, wherein the
component is a capacitive component and in that the membrane forms
the dielectric of the capacitive component.
18. The integrated circuit according to claim 8, wherein at least
two different components use two different parts of the same
membrane.
19. The integrated circuit according to claim 8, wherein the
membrane comprises the magnetic film sandwiched between two
passivation layers.
20. A substrate supporting a thin, insulating, soft magnetic film
of high magnetization, comprising: an amorphous substrate in which
nitrided nanograins are immersed; and a thin film formed from
selectively oxidization of only the amorphous substrate.
21. The substrate of claim 20 wherein the nanograins comprise
non-oxidized Fe-rich ferromagnetic nanograins forming a crystalline
phase dispersed in an amorphous phase associated with the amorphous
substrate.
22. The substrate of claim 20 further comprising a microstructure
comprising a body-centered cubic crystalline phase of nitride
nanograins.
23. The substrate of claim 20 further comprising a microstructure
comprising a body-centered tetragonal crystalline phase of nitride
nanograins.
24. The substrate of claim 20 wherein the thin film possesses soft
magnetic properties defined by H.sub.c<10 Oe.
25. The substrate of claim 20 wherein the thin film has a nitride
crystalline phase dispersed in an oxidized amorphous phase.
26. The substrate of claim 20 wherein the thin film elementally
comprises Fe, N and O as well as an additional element X selected
from the group consisting of: Al, Si, Ti, V, Cr, Mn, Cu and the
lanthanides.
27. The substrate of claim 20 wherein the thin film elementally
comprises Fe, N and O as well as an additional element X selected
from the group consisting of: Zr, Nb, Mo, Ru, Rh, Pd, Hf, Ta, W,
Ir, and Pt.
28. The substrate of claim 20 wherein the thin film forms a
membrane for an integrated circuit.
29. The substrate of claim 28 wherein the membrane is fixed within
the integrated circuit.
30. The substrate of claim 28 wherein the membrane is moveable
within the integrated circuit.
31. The substrate of claim 28 wherein the membrane is formed as a
wafer scale membrane covering an entire surface of the integrated
circuit.
Description
PRIORITY CLAIM
[0001] The present application is a divisional of U.S. application
patent Ser. No. 11/189,028 filed Jul. 25, 2005 which claims
priority from French Application for Patent No. 04 08289 filed Jul.
27, 2004, the disclosures of which are hereby incorporated by
reference.
BACKGROUND OF THE INVENTION
[0002] 1. Technical Field of the Invention
[0003] The present invention relates to ways of obtaining granular,
insulating, soft magnetic films of high magnetization and to their
possible applications in the microelectronics field and more
particularly in radiofrequency (RF) applications.
[0004] 2. Description of Related Art
[0005] The term "granular film" is understood to mean a film formed
from two phases, the first being generally dispersed in the second.
The first phase here is crystalline and the second is
amorphous.
[0006] The term "soft magnetic film" is understood to mean a film
having a magnetization that is easily reversible, characterized
among other things by a low coercive field (Hc.ltoreq.5 Oe).
[0007] The term "high magnetization" is understood to mean a film
possessing a high saturation magnetization (Ms>1 T). The term
"insulating film" is understood to mean a film having a very low
conductivity, i.e., a resistivity .rho..gtoreq.500 .mu..OMEGA.cm,
and for example a resistivity of .rho..gtoreq.10.sup.3
.mu..OMEGA.cm.
[0008] The term "magnetic film for RF applications" is understood
to mean a film that satisfies the conventional theory of coherent
magnetization rotation described by the celebrated
Landau-Lifshitz-Gilbert model on the basis of the existence of an
induced uniaxial magnetic anisotropy characterized by an anisotropy
field (Hk>Hc).
[0009] U.S. Pat. No. 5,573,863 discloses films of soft magnetic
alloys comprising a nanocrystalline phase, essentially consisting
of cubic Fe, and an amorphous phase comprising a rare earth element
or Ti, Zr, Hf, V, Nb, Ta or W and oxygen in a substantial quantity,
the two phases being in the form of a mixture. The choice of iron
is justified for its high magnetization.
[0010] The solution described relies on the known amorphizing
character of FeX alloys with X.gtoreq.15% by weight, where X
represents Ti, Zr, Hf, V, Nb, Ta or W, these elements being
deposited by sputtering. The suitable magnetic properties are
conventionally obtained after partial crystallization of the
compound by a magnetothermal treatment at 400.degree. C. after
deposition.
[0011] This makes it possible to obtain a relatively dense
nanocrystalline ferromagnetic phase dispersed in the initial
amorphous matrix. By obtaining a microstructure consisting of
ferromagnetic grains strongly coupled together on the nanoscale, it
is easier to achieve the conditions for obtaining the soft magnetic
character of the film.
[0012] A first difficulty consists of the fact that the volume
fraction of the nanocrystalline (ferromagnetic) phase is generally
low (less than 80%), which does not allow a high magnetization to
be achieved. Here, the proposed method adds to the known process
the reactive aspect, using oxygen. Of course, this leads to
oxidation of the film and to an increase in its resistivity.
However, the oxidation process is not selective--it relates both to
the grains and to the matrix.
[0013] The second difficulty consists of the fact that there is an
even greater reduction in the magnetization because of the
oxidation of the ferromagnetic crystalline phase of Fe. From this
it follows that an insulating character cannot be reconciled with
high magnetization.
[0014] U.S. Pat. No. 5,725,685 discloses soft magnetic alloy films
similar to those described in U.S. Pat. No. 5,573,863, with the
sole difference that the amorphous phase contains nitrogen in a
substantial quantity and not oxygen. This process makes it possible
to avoid the problem of oxidation of the ferromagnetic phase and of
maintaining a higher magnetization. However, the resistivity levels
are markedly too low owing to the absence of oxidation. It also
follows from this that it is impossible to reconcile an insulating
(or highly resistive) character here with high magnetization.
[0015] European Patent Application No. EP 1,361,586 describes a
method of producing a thin magnetic film possessing a high
magnetization and an insulating character. This film is prepared
using the technique of non-reactive cosputtering using two targets
composed respectively of a magnetic alloy and of a dielectric. The
advantage of this method is that it relies on a non-reactive
process (bombardment by only neutral ionic species), preventing the
ferromagnetic grains from being oxidized and making it possible in
theory to maintain a high magnetization. The method described may
either be sequential (alternating deposition of multilayers) or
concomitant (simultaneous code position).
[0016] The film described is formed from nanometric CoFe
ferromagnetic grains (CoFe being chosen for its high magnetization)
that are encapsulated in a dielectric matrix, composed, for
example, of Al.sub.2O.sub.3 or SiO.sub.2. The difficulty in this
case stems from the choice of the CoFe alloy, which is not
naturally soft. Thus, the soft magnetic properties of the film can
be provided only on condition that the size of the CoFe grains
(typically less than 10 nm) are sufficiently reduced and that
strong intergranular coupling be maintained, which assumes a
relatively small inter-grain distance (typically less than 5
nm).
[0017] However, the insulating character requires a certain volume
of dielectric material encapsulating the ferromagnetic grains so as
to avoid too high a percolation factor. The adjustments in terms of
processes (respective volume fractions of the two phases) are, in
this sense, contradictory. The use of CoFe alloys, initially
justified by a very high intrinsic magnetization, therefore makes
this method difficult and limiting. It is therefore impossible to
reconcile insulating character with high magnetization.
[0018] The trend in the microelectronics field is more and more for
ever decreasing individual dimensions of the components in
integrated circuits. For certain components this poses a
problem.
[0019] At the present time, the use of inductors, essentially of
planar geometry, within these RF circuits places a limit in terms
of the ratio of inductance to area occupied.
[0020] Introducing ferromagnetic layers with a high permeability
(.mu.') allows this ratio to be increased significantly. These
layers must meet the constraints of being used at high frequency,
especially in dissipative terms, so as to comply with a high
quality factor of the component.
[0021] Their integration must therefore minimize the additional
losses, the origin of which are mainly magnetic (.mu.'') and
capacitive (C). The capacitive losses stem from the juxtaposition
of several metal levels separated by dielectrics needed for the
fabrication of the component.
[0022] The first contribution may be minimized by establishing a
high ferromagnetic resonance frequency (FRF) thanks especially to
the use of layers with a high saturation magnetization. In certain
cases, the aim will on the contrary be to use the adsorbtivity at
ferromagnetic resonance (maximum .mu.'') for electromagnetic
screening functionalities. The capacitive contribution remains the
more limiting and the more difficult to get round in the current
prior art, in which the thin ferromagnetic layers suitable from the
magnetic standpoint are conducting in character.
[0023] At the present time, known soft magnetic materials with a
high magnetization form the FeXN family with X: Al, Si, Ta, Zr, Hf,
Rh, or Ti. Unlike U.S. Pat. No. 5,725,685 these materials are
obtained directly in the nanocrystallized state with an amorphous
matrix by reactive sputtering in a stream of nitrogen.
[0024] The incorporation of nitrogen atoms during the growth of the
film allows the grain size to be progressively reduced (down to 5
nm) and allows the associated volume fraction to be controlled,
which remains high (.gtoreq.90%). These materials have in general a
high magnetization (from 1.8 to 2 T) and excellent soft magnetic
properties up to several GHz.
[0025] On the other hand, they do not make it possible to achieve
optimum results in terms of integration in RF inductive coils
(self-inductors). This is because the resistivity (.rho.) of these
materials remains too low, of the order of 150 .mu..OMEGA.cm.
Despite the dispersion of the conducting FeXN crystalline phase in
a resistive amorphous matrix, the overall character of the material
remains essentially conducting.
[0026] The use of such a conducting material for this type of
application is the basis of problems relating to the capacitive
coupling between the plane and the inductive coil, which very
greatly degrades the load and does not make it possible to obtain
quite high quality factor values (typically Q.gtoreq.30). The
FeXO-type materials of insulating character described in the
literature themselves do not have suitable magnetic properties
(magnetization too low).
[0027] The current research remains focused on insulating magnetic
materials of high permeability allowing contact between a magnetic
plane and an inductive coil, or even the encapsulation of the
inductive coil, so as to improve the compactness and the
performance of these components in general.
[0028] There is a need in the art for a material having the
advantage of being both insulating and optimum from the standpoint
of the intended magnetic properties. The term "optimum magnetic
properties" is understood to mean the combination of a high
magnetization (.gtoreq.1.5 T), a low coercive field (Hc.ltoreq.5
Oe) and a uniaxial anisotropy field (H.sub.k.gtoreq.10 Oe). Its
insulating property prevents any problem of capacitive coupling
between the magnetic plane and the inductive coil, thus making it
possible to obtain a maximum gain (.gtoreq.100%) in the value of
the inductive coil and to improve its quality factor. As the
insulating film has a very low conductivity, it does not generate
supplementary capacitive effect once integrated in an RF
device.
SUMMARY OF THE INVENTION
[0029] Embodiments relate processes for obtaining a thin,
insulating, soft magnetic film of high magnetization, comprising
the nitriding of Fe-rich ferromagnetic nanograins immersed in an
amorphous substrate, and the selective oxidation of the amorphous
substrate.
[0030] Thus, an embodiment provides, in combination, the nitriding
of the nanograins and the selective oxidation of the amorphous
substrate constituting the intercrystalline matrix. This makes it
possible to obtain a material of the FeXNO type, which therefore
contains both oxygen and nitrogen, avoiding the problem of the
oxidation of the Fe-rich ferromagnetic phase responsible for the
reduction in the saturation magnetization.
[0031] According to one embodiment, the ferromagnetic nanograins
are formed mainly from FeXN with X being preferably chosen from the
following elements: Zr, Nb, Mo, Ru, Rh, Pd, Hf, Ta, W, Ir and Pt.
The list may be extended to elements from the family of rare earths
(lanthanides) and to the following elements: Al, Si, Ti, V, Cr, Mn
and Cu.
[0032] The nitriding may be carried out by reactive sputtering
using an FeX target in the presence of nitrogen with a uniaxial
magnetic field being applied in the plane of the substrate.
[0033] The oxidation may be carried out by reactive sputtering in
the presence of oxygen. This process may be performed at the same
time as the nitriding process, in a continuous or sequential
manner.
[0034] The oxidation may be carried out by cosputtering from an XO
target, with X defined as above. This process may be carried out
concomitantly with the nitriding process, resulting in the
production of a heterogeneous film consisting of aggregates of FeXN
and XO materials. This process may also be carried out sequentially
with the nitriding process, resulting in the production of a
heterogeneous film consisting of an alternation of FeXN and XO
multilayers.
[0035] The latter embodiment relies on the selective diffusion of
oxygen from the XO aggregates or layers into the amorphous matrix
of the FeXN aggregates or layers by post-deposition heat
treatment.
[0036] Embodiments also relate to a thin, insulating, soft magnetic
film of high magnetization, comprising an oxidized amorphous
substrate in which nitrided Fe-rich ferromagnetic nanograins are
immersed.
[0037] The nanograins may for example consists of an FeXN
crystalline phase and the amorphous substrate may consist of X or
XN, X being as defined above. The nanograins preferably have a
diameter of less than 10 nm and a body-centered cubic (bcc) or
body-centered tetragonal (bct) structure.
[0038] According to one embodiment, the amorphous phase represents
less than 20% of the total volume of the thin film.
[0039] Each element is present within the film, for example, in the
following proportions in at %: Fe.sub.aX.sub.bN.sub.cO.sub.d, in
which a+b+c+d=100% and:
[0040] 45%.ltoreq.a.ltoreq.90%,
[0041] 1%.ltoreq.b.ltoreq.5%
[0042] 5%.ltoreq.c.ltoreq.20%
[0043] 5%.ltoreq.d.ltoreq.30%.
[0044] Embodiments also propose an integrated circuit comprising at
least one component using a membrane incorporating a thin film as
defined above.
[0045] The component is, for example, inductive and the membrane of
the inductive component may be fixed or able to move.
[0046] When the membrane is fixed, the distance separating the
membrane from the inductive component may be reduced to a minimum.
The magnetic film preferably has a high magnetic permeability .mu.'
and low magnetic losses .mu.'', thereby making it possible to
maximize the value of the inductance and increasing the quality
factor. It is also possible, for example, to obtain smaller coils
of equal performance.
[0047] When the membrane of the inductive component is fixed, it
can form a screening cover for the inductive component. The
magnetic film of the membrane has, in this case, preferably a low
magnetic permeability .mu.' and high magnetic losses .mu.'' so as
to form a true electromagnetic screen with no effect on the
inductance of the component.
[0048] When the membrane is able to move, the magnetic film
preferably has a high magnetic permeability .mu.' and low magnetic
losses .mu.''. This allows the inductance of the component to be
controlled according to the position of the membrane relative to
the turns.
[0049] Other examples of integrated circuits include, for example,
circuits in which the membrane forms a cover for encapsulating the
component, or a support for another component. The component may
also be a capacitive component, the membrane then forming the
dielectric of the capacitive component.
[0050] The integrated circuits may also comprise two or more than
two different components using two different parts of the same
membrane.
[0051] Thus, the embodiments are particularly advantageous in this
regard as they allows co-integration of the several components on
the integrated circuit using same wafer-scale membrane.
BRIEF DESCRIPTION OF THE DRAWINGS
[0052] A more complete understanding of the method and apparatus of
the present invention may be acquired by reference to the following
Detailed Description when taken in conjunction with the
accompanying Drawings wherein:
[0053] FIGS. 1 to 5 show schematically various integrated circuits
comprising components using a thin film.
DETAILED DESCRIPTION OF THE DRAWINGS
[0054] Embodiments make it possible to obtain a thin, insulating,
soft ferromagnetic film of high magnetization from Fe-rich
ferromagnetic nanograins immersed in an amorphous substrate and
comprises a step of in situ nitriding of the nanograins and a step
of in situ selective oxidation of the amorphous matrix.
[0055] The term "Fe-rich nanograins" is understood to mean
nanograins having an iron content greater than 85% by weight.
[0056] The process for obtaining such a thin film may be carried
out for example according to two variants: the first consists of
reactive cathode sputtering of FeX layers in a stream of nitrogen
and oxygen; the second consists of selective oxygen diffusion in a
heterogeneous compound formed from collection of FeXN/XO aggregates
or bilayers.
[0057] The first variant consists of cathode sputtering of FeX
layers in a stream of nitrogen and oxygen.
[0058] These films are produced by known techniques, for example by
ion bombardment (RF/DC, diode, magnetron or ion beam) in a main
stream of argon and secondary streams of nitrogen and oxygen, at
room temperature.
[0059] The growth of the layers takes place in a uniaxial magnetic
field of about 100-200 Oe applied in the plane of the substrate.
The optimum deposition conditions are achieved for a pressure of
3.times.10.sup.-3-5.times.10.sup.-3 mbar, a mean gas flow rate of
50-100 sccm and at room temperature.
[0060] The nitriding and oxidation processes are controlled
respectively by means of the degrees of enrichment with the
secondary (reactive) gases injected into the chamber. The relative
degree of enrichment with nitrogen is defined by the ratio
N.sub.2/(Ar+N.sub.2+O.sub.2) and the degree of enrichment with
oxygen is defined by the ratio O.sub.2/(Ar+N.sub.2+O.sub.2). These
ratios may typically vary within a range from 0.1% to 10%. The
thicknesses of the films formed are between 500 .ANG. to 5000
.ANG..
[0061] The microstructure of the material obtained is as defined
below. For a nitrogen content of less than 5 at %, the
microstructure consists of a single bcc or bct (body-centered cubic
or body-centered tetragonal) crystalline phase consisting of FeXN
grains.
[0062] The mean diameter of the grains is of the order of 100 to 10
nm, which does not satisfy the conditions for obtaining soft
magnetic properties (Hc>10 Oe). These films do not possess
induced magnetic anisotropy. They have naturally high saturation
magnetization (M.sub.s.gtoreq.1.9 T).
[0063] For a nitrogen content of between 5 at % and 20 at %, the
thin films are then composed of a fine nanostructure comprising bcc
or bct FeXN nanograins randomly distributed in an X-rich amorphous
matrix.
[0064] The nitrogen is incorporated in the interstitial position in
the crystallographic lattice of the FeX nanograins until saturation
of the solid solution in the grains (at about 15-20 at %). This
incorporation is accompanied by a substantial expansion of the FeX
crystalline lattice (by up to 5%), the consequence of which is a
reduction in the mean grain size.
[0065] Under these conditions, the FeXN grains have a mean diameter
of around 10 to 2 nm with a mean intergranular distance of around 5
to 1 nm. This makes it possible to obtain soft magnetic properties
as defined above (H.sub.c.ltoreq.5 Oe). These films possess an
induced magnetic anisotropy characterized by an anisotropy field of
around 10 to 40 Oe. These films maintain a high saturation
magnetization, typically around 1.9 to 1.5 T. The electrical
resistivity of the films increases with the increase in nitrogen
content, typically up to 200 .mu..OMEGA.cm.
[0066] Above 20 at %, the excess nitrogen becomes fixed in the
amorphous matrix. The latter then becomes the predominant phase in
terms of volume proportion and the films tend towards a completely
amorphous microstructure no longer exhibiting soft magnetic
properties (Hc>20 Oe).
[0067] With the nitriding process having led to the microstructure
described above, the in situ oxidation process results in
preferential incorporation of the oxygen into the X-rich amorphous
matrix.
[0068] For various oxygen concentrations and for a nitrogen
concentration of between 5 and 20 at %, the films have the
corresponding microstructure described above with grains having a
diameter of around 10 to 2 nm that are approximately 5 to 1 nm
apart and encapsulated by a very highly resistive amorphous matrix
rich in phases of the XO or XNO type. This allows the soft magnetic
properties as defined above (Hc.ltoreq.5 Oe) to be maintained with
a substantial increase in the electrical resistivity of the films
until macroscopic insulating character is obtained.
[0069] A second variant consists of the selective diffusion of
oxygen through heterogeneous structures of the FeXN+XO type.
[0070] This selective diffusion may be carried out through the FeXN
and XO multilayers produced by cathode sputtering from an FeX
target and from an XO target. These films may be obtained by the
same techniques and conditions as those mentioned above within the
context of the reactive cathode sputtering (the first variant).
[0071] The nitriding process is controlled by the degree of
enrichment with nitrogen injected into the chamber, defined by the
ratio N.sub.2/(Ar+N.sub.2), which may typically vary within a range
from 0.1% to 10%. The thicknesses of the FeXN films formed here are
between 20 .ANG. and 500 .ANG.. The films correspond to those
having a nitrogen content of between 5 and 20 at % as described
above.
[0072] The thin XO films are themselves produced by known
techniques, for example by ion bombardment (RF, diode or magnetron
or by ion beam). The thickness of the XO film formed varies from 20
.ANG. to 500 .ANG.. The number of FeXN/XO bilayers may vary from 2
to 100.
[0073] The post-deposition annealing operations (with or without a
magnetic field) are carried out in a high-vacuum oven. The
annealing temperatures are between 150.degree. C. and 400.degree.
C. and the annealing time is between 1 h and 8 h. The annealing
allows selective diffusion of oxygen mainly into the X-rich
amorphous matrix constituting the FeXN layers. Thus, the degree of
oxidation of the amorphous matrix and the resistivity of the films
vary depending on the experimental conditions of the annealing. The
microstructure of the said films is identical to that obtained in
the first variant, i.e. cathode sputtering of the FeX layers in a
stream of nitrogen and of oxygen, described above.
[0074] The selective oxygen diffusion may also be carried out
through the heterogeneous layers consisting of FeXN and XO
aggregates, produced by cathode cosputtering from a target
comprising the two constituents FeX and XO. These films may be
obtained by the same techniques and conditions as those mentioned
above within the context of the reactive cathode sputtering (the
first variant).
[0075] The nitriding process is controlled by the degree of
enrichment with nitrogen injected into the chamber, defined by the
ratio N.sub.2/(Ar+N.sub.2), which may typically vary within a range
from 0.1% to 10%. The thicknesses of the FeXN films formed here are
between 500 .ANG. and 5000 .ANG.. The films correspond to those
having a nitrogen content of between 5 and 20 at % as described
above.
[0076] The post-deposition annealing operations and the final
characteristics of the films are identical to those described in
the first subvariant.
[0077] In general, the thin, insulating, soft magnetic film of high
magnetization comprises a crystalline phase and an amorphous phase.
The crystalline phase is dispersed in the amorphous phase.
[0078] Depending on the embodiment, the crystalline phase consists
of nanograins of Fe rich FeXN with interstitial solid solution of
nitrogen up to the limit of solubility. X is preferably chosen from
the following elements: Zr, Nb, Mo, Ru, Rh, Pd, Hf, Ta, W, Ir, Pt.
The list may be extended to elements of the rare earth family
(lanthanides) and to the following elements: Al, Si, Ti, V, Cr, Mn
and Cu. The grains have a diameter of less than 10 nm, possess a
bcc or bct structure and are not oxidized.
[0079] Depending on the embodiment (and its variants), the
amorphous phase is formed mainly from X, N and O rich in X
containing nitrogen and mainly oxygen, X being defined above. This
phase constitutes an insulating matrix encapsulating the said
grains with an intergranular distance of less than 5 nm.
Advantageously, this phase represents less than 20% of the total
volume of the film.
[0080] Considering an Fe.sub.aX.sub.bN.sub.cO.sub.d film by way of
indication and for X taken from the abovementioned first series,
the respective contents for each element in atomic percentages are
within the following ranges: 45%.ltoreq.a.ltoreq.90%;
1%.ltoreq.b.ltoreq.5%; 5%.ltoreq.c.ltoreq.20%;
5%.ltoreq.d.ltoreq.30% with a+b+c+d=100%.
[0081] By way of indication and for X taken from the first
abovementioned series, the table below gives a few useful magnetic
and electrical characteristics depending on the proportion of these
elements in the films obtained (a, b, c and d are given in atomic
percentages).
TABLE-US-00001 Composition a b c d Ms (T) .rho. (.mu..OMEGA. cm)
Fe.sub.aX.sub.bN.sub.cO.sub.d 45 5 20 30 0.8 10.sup.3-10.sup.6 46 4
20 30 0.9 47 3 20 30 1.0 48 2 20 30 1.1 49 1 20 30 1.2 52 3 15 30
1.3 57 3 10 30 1.35 62 3 5 30 1.4 67 3 5 25 1.5 10.sup.3-10.sup.4
72 3 5 20 1.55 82 3 5 10 1.65 85 5 5 5 1.7 500-10.sup.3 86 4 5 5
1.75 87 3 5 5 1.8 88 2 5 5 1.85 89 1 5 5 1.9
[0082] One advantageous characteristic of these films consists of
their resistivities, which may, depending on the case, be of the
order to 10.sup.3 to 10.sup.6 .mu..OMEGA.cm. In addition, the
selective oxidation of the intergranular X-rich matrix, and not of
the ferromagnetic Fe-rich grains, allows a high magnetization to be
maintained.
[0083] Finally, the selective nitriding of the Fe-rich crystalline
phase allows suitable soft and anisotropic magnetic properties to
be obtained. It is therefore possible to obtain a soft magnetic
film which is both insulating and has a high magnetization
satisfying the operating conditions for applications in the
radiofrequency regime. The thin films obtained typically have a
thickness varying from 5.times.10.sup.-2 to 1 .mu.m.
[0084] Integrated circuits may be produced using the thin,
insulating, soft films. The films are incorporated into a membrane,
the said membrane being used in the preparation of a component
intended for the production of an integrated circuit.
[0085] FIG. 1 shows schematically an example of an integrated
circuit IC, which comprises as component C an inductive component
C.sub.L. The inductive component C.sub.L comprises metal turns MT
that are placed in a substrate SB below a cavity 1 hollowed out in
the substrate. The inductive component C.sub.L also includes a
magnetic membrane MB consisting of a thin soft magnetic film 2
which, in this particular embodiment, is sandwiched between two
passivation layers 21 and 22. The passivation layers provide here
both protection of the film 2 and better mechanical integrity of
the membrane.
[0086] The passivation layers 21 and 22 are produced by means of
known methods with materials that are also known, such as those
based on silicon oxide and silicon nitride. The membrane preferably
comprises a magnetic film of the FeHfNO type.
[0087] The membrane MB may be fixed (FIG. 1) or it can move (FIG.
2) in the direction of the turns by any known means (thermal
expansion, mechanical means, piezoelectric means, etc.). When the
membrane is movable, the value of the inductance L of the inductive
component C.sub.L can be modified in a controlled manner.
[0088] When the membrane MB is fixed, the distance separating the
membrane from the RF inductive component may be reduced to a
minimum. The magnetic film 2 of the membrane preferably has a high
magnetic permeability .mu.' (typically .gtoreq.100) and has low
magnetic losses .mu.'' (typically .ltoreq.10). This allows the
inductance to be increased (typically by 30% to 120%) and allows a
high quality factor (typically Q.gtoreq.10). It is also possible,
for example, to obtain smaller coils with equal performance.
[0089] When the membrane MB of the inductive component is fixed, it
may form a screening cover for the inductive component. In this
case, the magnetic film 2 of the membrane preferably has a low
magnetic permeability .mu.' (typically .ltoreq.100) and a high
magnetic loss .mu.'' (typically .gtoreq.500). In this case, the
fixed membrane of the active component forms a screening cover for
the inductive component.
[0090] However, when the membrane MB can be moved, the magnetic
film 2 of the membrane has a high magnetic permeability .mu.'
(typically .gtoreq.100) and low magnetic losses .mu.'' (typically
.ltoreq.10). This allows the inductance of the component to be
controlled (typically over a 0% to 100% range--by being closer to
the membrane, inductance goes from a nominal value of X to
potentially 2.times.) depending on the position of the membrane
relative to the turns.
[0091] Whatever the nature of the component C, the membrane MB
comprising the film 2 may form a cover for encapsulating the
component C. The component C may for example be a MEMS
(MicroElectroMechanical System) (see FIG. 4). The membrane MB may
also, as shown schematically in FIG. 3, form a support for the
component C, which may for example be a resonator of the BAW (Bulk
Acoustic Wave) type.
[0092] The integrated circuits may comprise several, identical or
different, components using two different parts of the membrane, as
illustrated in FIG. 5.
[0093] This is because the membrane is formed as a "wafer-scale"
membrane, that is to say it covers the entire surface of the
integrated circuit. In this figure, the circuit comprises a first
inductive component C.sub.L, using part of the membrane, and a
second component, in this example, a capacitive component C.sub.C
for which another part of the membrane MB forms the dielectric of
the component placed between two metal layers ML.
[0094] Although preferred embodiments of the method and apparatus
of the present invention have been illustrated in the accompanying
Drawings and described in the foregoing Detailed Description, it
will be understood that the invention is not limited to the
embodiments disclosed, but is capable of numerous rearrangements,
modifications and substitutions without departing from the spirit
of the invention as set forth and defined by the following
claims.
* * * * *