Stable Gold Bump Solder Connections

Zeng; Kejun ;   et al.

Patent Application Summary

U.S. patent application number 11/867051 was filed with the patent office on 2009-04-09 for stable gold bump solder connections. This patent application is currently assigned to TEXAS INSTRUMENTS INCORPORATED. Invention is credited to Robert John Furtaw, Bernardo Gallegos, Rebecca L. Holford, Wei Qun Peng, Kejun Zeng.

Application Number20090091024 11/867051
Document ID /
Family ID40130461
Filed Date2009-04-09

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