U.S. patent application number 11/867051 was filed with the patent office on 2009-04-09 for stable gold bump solder connections. This patent application is currently assigned to TEXAS INSTRUMENTS INCORPORATED. Invention is credited to Robert John Furtaw, Bernardo Gallegos, Rebecca L. Holford, Wei Qun Peng, Kejun Zeng.
Application Number | 20090091024 11/867051 |
Document ID | / |
Family ID | 40130461 |
Filed Date | 2009-04-09 |
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