Gallegos; Bernardo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Gallegos; Bernardo.The latest application filed is for "stress relief for flip-chip packaged devices".

Company Profile

3.16.26

Gallegos; Bernardo - McKinney TX
Gallegos; Bernardo - The Colony TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Stress Relief For Flip-chip Packaged Devices App 20220210911 - Luo; Tianyi ; et al.	2022-06-30
Semiconductor Package With Nickel-silver Pre-plated Leadframe App 20220208665 - Dadvand; Nazila ; et al.	2022-06-30
Package terminal cavities Grant 11,244,881 - Gallegos February 8, 2	2022-02-08
Package Terminal Cavities App 20210098322 - GALLEGOS; Bernardo	2021-04-01
Leadframe having organic, polymerizable photo-imageable adhesion layer Grant 10,672,692 - Williamson , et al.	2020-06-02
Substrates With Solder Barriers On Leads App 20200135627 - GALLEGOS; Bernardo ; et al.	2020-04-30
Leadframe Having Organic, Polymerizable Photo-Imageable Adhesion Layer App 20180096860 - Williamson; Jaimal Mallory ; et al.	2018-04-05
Process For Forming Leadframe Having Organic, Polymerizable Photo-imageable Adhesion Layer App 20180096859 - Williamson; Jaimal Mallory ; et al.	2018-04-05
Process for forming leadframe having organic, polymerizable photo-imageable adhesion layer Grant 9,934,989 - Williamson , et al. April 3, 2	2018-04-03
Method of packaging a circuit Grant 9,875,930 - Gallegos , et al. January 23, 2	2018-01-23
Method of making integrated circuit Grant 9,536,781 - Gallegos , et al. January 3, 2	2017-01-03
Semiconductor package having etched foil capacitor integrated into leadframe Grant 9,373,572 - Howard , et al. June 21, 2	2016-06-21
Semiconductor Package Having Etched Foil Capacitor Integrated Into Leadframe App 20160035655 - Howard; Gregory E. ; et al.	2016-02-04
Method Of Making Integrated Circuit App 20150357238 - Gallegos; Bernardo ; et al.	2015-12-10
Semiconductor package having etched foil capacitor integrated into leadframe Grant 9,165,873 - Howard , et al. October 20, 2	2015-10-20
Integrated circuit and method of making Grant 9,142,472 - Gallegos , et al. September 22, 2	2015-09-22
Semiconductor package having etched foil capacitor integrated into leadframe Grant 9,142,496 - Howard , et al. September 22, 2	2015-09-22
Method and apparatus for stopping resin bleed and mold flash on integrated circuit lead finishes Grant 9,054,092 - Gallegos , et al. June 9, 2	2015-06-09
Method An Apparatus For Stopping Resin Bleed And Mold Flash On Integrated Circit Lead Finishes App 20150115421 - Gallegos; Bernardo ; et al.	2015-04-30
Method Of Fabricating A Circuit App 20150111344 - Gallegos; Bernardo ; et al.	2015-04-23
Integrated Circuit And Method Of Making App 20130075890 - Gallegos; Bernardo ; et al.	2013-03-28
Integrated Circuit And Method Of Making App 20130075928 - Gallegos; Bernardo ; et al.	2013-03-28
Integrated Circuit And Method Of Making App 20130075894 - Gallegos; Bernardo ; et al.	2013-03-28
Packaged electronic devices having die attach regions with selective thin dielectric layer Grant 8,298,874 - Gallegos , et al. October 30, 2	2012-10-30
Packaged Electronic Devices Having Die Attach Regions With Selective Thin Dielectric Layer App 20120252170 - Gallegos; Bernardo ; et al.	2012-10-04
Packaged electronic devices having die attach regions with selective thin dielectric layer Grant 8,222,748 - Gallegos , et al. July 17, 2	2012-07-17
Stable Gold Bump Solder Connections App 20110177686 - ZENG; Kejun ; et al.	2011-07-21
Stable Gold Bump Solder Connections App 20110108980 - Zeng; Kejun ; et al.	2011-05-12
Stable gold bump solder connections Grant 7,939,939 - Zeng , et al. May 10, 2	2011-05-10
Semiconductor device having substrate with differentially plated copper and selective solder Grant 7,851,928 - Gallegos , et al. December 14, 2	2010-12-14
Packaged Electronic Devices Havng Die Attach Regions With Selective Thin Dielectric Layer App 20100301493 - GALLEGOS; BERNARDO ; et al.	2010-12-02
Flip chip semiconductor device having workpiece adhesion promoter layer for improved underfill adhesion Grant 7,808,113 - Gallegos October 5, 2	2010-10-05
Integrated Circuit Device With Improved Underfill Coverage App 20100007015 - Gallegos; Bernardo	2010-01-14
Flip Chip Semiconductor Device Having Workpiece Adhesion Promoter Layer For Improved Underfill Adhesion App 20100007032 - Gallegos; Bernardo	2010-01-14
Semiconductor Device Having Substrate With Differentially Plated Copper And Selective Solder App 20090302463 - GALLEGOS; BERNARDO ; et al.	2009-12-10
Stable Gold Bump Solder Connections App 20090091024 - Zeng; Kejun ; et al.	2009-04-09
Electrical circuit and method of formation App 20030183418 - Castro, Abram M. ; et al.	2003-10-02
Electrical circuit and method of formation App 20030066679 - Castro, Abram M. ; et al.	2003-04-10

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