U.S. patent application number 11/693380 was filed with the patent office on 2008-10-02 for fabrication of self-aligned gallium arsenide mosfets using damascene gate methods.
Invention is credited to Hussein I. Hanafi.
Application Number | 20080237663 11/693380 |
Document ID | / |
Family ID | 39792696 |
Filed Date | 2008-10-02 |
United States Patent
Application |
20080237663 |
Kind Code |
A1 |
Hanafi; Hussein I. |
October 2, 2008 |
FABRICATION OF SELF-ALIGNED GALLIUM ARSENIDE MOSFETS USING
DAMASCENE GATE METHODS
Abstract
A method for fabricating a gallium arsenide MOSFET device is
presented. A dummy gate is formed over a gallium arsenide
substrate. Source-drain extensions are implanted into the substrate
adjacent the dummy gate. Dummy spacers are formed along dummy gate
sidewalls and over a portion of the source-drain extensions.
Source-drain regions are implanted. Insulating spacers are formed
on dummy oxide spacer sidewalls. A conductive layer is formed over
the source-drain regions. The conductive layer is annealed to form
contacts to the source-drain regions. The dummy gate and the dummy
oxide spacers are removed to form a gate opening. A passivation
layer is in-situ deposited in the gate opening. The surface of the
passivation layer is oxidized to create an oxide layer. A
dielectric layer is ex-situ deposited over the oxide layer. A gate
metal is deposited over the dielectric layer to form a gate stack
in the gate opening.
Inventors: |
Hanafi; Hussein I.; (Basking
Ridge, NJ) |
Correspondence
Address: |
DINSMORE & SHOHL LLP
ONE DAYTON CENTRE, ONE SOUTH MAIN STREET, SUITE 1300
DAYTON
OH
45402-2023
US
|
Family ID: |
39792696 |
Appl. No.: |
11/693380 |
Filed: |
March 29, 2007 |
Current U.S.
Class: |
257/289 ;
257/E21.444; 257/E29.093; 257/E29.255; 438/285 |
Current CPC
Class: |
H01L 29/66606 20130101;
H01L 29/66545 20130101; H01L 29/6653 20130101; H01L 29/105
20130101; H01L 29/66522 20130101 |
Class at
Publication: |
257/289 ;
438/285; 257/E21.444; 257/E29.093; 257/E29.255 |
International
Class: |
H01L 29/78 20060101
H01L029/78; H01L 21/336 20060101 H01L021/336 |
Claims
1. A method for fabricating a gallium arsenide MOSFET device, the
method comprising: forming a dummy gate over a gallium arsenide
substrate; implanting source-drain extensions into the substrate
adjacent the dummy gate; forming dummy oxide spacers along the
sidewalls of the dummy gate and over a portion of the source-drain
extensions; implanting and annealing source-drain regions adjacent
the source-drain extensions; forming insulating spacers on the
sides of the dummy oxide spacers; defining the source-drain regions
with a photoresist layer; forming a conductive layer over the
photoresist layer; lifting off the photoresist layer and annealing
the conductive layer to form contacts to the source-drain regions;
removing the dummy gate and the dummy oxide spacers to form a gate
opening; depositing in-situ a passivation layer in the gate
opening; oxidizing the surface of the passivation layer to create
an oxide layer; depositing ex-situ a dielectric layer over the
oxide layer; and depositing a gate metal over the dielectric layer
to form a gate stack in the gate opening.
2. The method of claim 1, further comprising: depositing a
sacrificial oxide layer on the substrate; forming shallow trench
isolations regions in the substrate; implanting deep p-wells into
the substrate; and implanting and annealing shallow n-channels
after the deep p-well implants before the formation of the dummy
gate over the substrate.
3. The method of claim 1, wherein the source-drain regions are
annealed at about 1000.degree. C. for 5 seconds in nitrogen
gas.
4. The method of claim 1, wherein the conductive layer is formed by
evaporating a layer of gold geranium over the photoresist layer and
the source-drain regions, evaporating a layer of nickel over the
layer of gold geranium and evaporating a layer of gold over the
layer of nickel,.
5. The method of claim 4, wherein the layer of gold geranium is
about 50 nm thick.
6. The method of claim 4, wherein the layer of nickel is about 25
nm thick.
7. The method of claim 4, wherein the layer of gold is about 100 nm
thick.
8. The method of claim 4, wherein the layer of gold geranium, the
layer of nickel and the layer of gold are annealed in nitrogen gas
at about 400.degree. C. for about 60 seconds.
9. The method of claim 1, further comprising: depositing a layer of
nitride after forming the contacts to the source-drain regions;
depositing a layer of oxide over the layer of nitride and
planaraizing the oxide layer to the uppermost surface of the layer
of nitride; and etching the layer of oxide and layer of nitride to
the uppermost surface of the dummy gate.
10. The method of claim 9, wherein the layer of oxide and the layer
of nitride are reactively ion etched.
11. The method of claim 1, further comprises: wet cleaning the
surface of the substrate after removing the dummy gate and the
dummy oxide spacer; and removing surface oxygen by exposing the
substrate to atomic hydrogen.
12. The method of claim 1, wherein the passivation layer comprises
amorphous silicon.
13. The method of claim 12, wherein the amorphous silicon is
deposited using in-situ molecular beam epitaxy.
14. The method of claim 1, wherein the passivation layer is
approximately 1.5 nm thick.
15. The method of claim 1, wherein the oxide layer is oxidized in
air.
16. The method of claim 1, wherein the oxide layer comprises
silicon dioxide.
17. The method of claim 1, wherein the oxide layer is between about
0.3 nm to about 10 nm thick.
18. The method of claim 1, wherein the oxide layer is less than 1
nm thick.
19. The method of claim 1, wherein the dielectric layer comprises
hafnium oxide.
20. The method of claim 1, wherein the dielectric layer is
approximately 10 nm thick.
21. The method of claim 1, wherein the dielectric layer is
deposited using atomic layer deposition at 300.degree. C.
22. The method of claim 1, further comprising: annealing the device
at 600.degree. C. in nitrogen gas containing 5% oxygen after
depositing the dielectric layer.
23. A method for fabricating a gallium arsenide MOSFET device, the
method comprising: depositing a sacrificial oxide layer on a
substrate of gallium arsenide; forming shallow trench isolations
regions in the substrate; implanting deep p-wells into the
substrate; implanting and annealing shallow n-channels after the
deep p-well implants; forming a dummy gate over the shallow
n-channel and the sacrificial oxide layer; implanting source-drain
extensions adjacent the dummy gate and the shallow trench isolation
regions; forming dummy oxide spacers along the sidewalls of the
dummy gate and over a portion of the source-drain extensions;
implanting and annealing source-drain regions adjacent the
source-drain extensions and the shallow trench isolation regions;
forming insulating spacers on the sides of the dummy oxide spacers;
defining the source-drain regions with a photoresist layer; forming
a conductive layer over the photoresist layer; lifting off the
photoresist layer and annealing the conductive layer over the
source-drain regions to form alloy contacts to the source-drain
regions; depositing a layer of nitride; depositing a first layer of
oxide over the layer of nitride and planaraizing the first oxide
layer to the uppermost surface of the layer of nitride, wherein the
uppermost surface of the first layer of oxide is co-planar to the
uppermost surface of the layer of nitride; etching the first layer
of oxide and layer of nitride to the uppermost surface of the dummy
gate; removing the dummy gate; removing the dummy oxide spacers and
the sacrificial oxide layer; wet cleaning the surface of the
substrate; removing surface oxygen using atomic hydrogen;
depositing in-situ a passivation layer; oxidizing the surface of
the passivation layer to create a second oxide layer; depositing
ex-situ a dielectric layer over the second oxide layer; and
depositing gate metal over the dielectric layer to form a gate
stack.
24. The method of claim 23, wherein the sacrificial oxide layer is
about 10 nm thick.
25. The method of claim 23, wherein the sacrificial oxide layer is
deposited using low pressure chemical vapor deposition.
26. The method of claim 23, wherein the shallow trench isolations
regions are formed using liquid phase chemical enhanced
oxidation.
27. The method of claim 23, wherein the shallow trench isolations
regions are formed using oxygen implantation following activation
annealing.
28. The method of claim 27, wherein activation annealing occurs at
about 450.degree. C. in a helium gas ambient.
29. The method of claim 23, wherein the deep P-wells and shallow
n-channels are annealed at about 900.degree. C. for about 5 seconds
in nitrogen gas.
30. The method of claim 23, wherein the conductive layer is formed
by evaporating a layer of gold geranium over the photoresist layer
and the source-drain regions, evaporating a layer of nickel over
the layer of gold geranium and evaporating a layer of gold over the
layer of nickel,.
31. The method of claim 23, wherein the gate metal is planarized to
the uppermost surface of the layer of nitride.
32. A gallium arsenide MOSFET device, the device comprising: a
substrate of gallium arsenide; a dummy gate formed over the
substrate; source-drain extensions implanted into the substrate
adjacent the dummy gate; dummy oxide spacers formed along the
sidewalls of the dummy gate and over a portion of the source-drain
extensions; source-drain regions implanted into the substrate
adjacent the source-drain extensions; insulating spacers formed on
the sides of the dummy oxide spacers; contact pads in contact with
the source-drain regions; a passivation layer in-situ deposited in
the opening left after the removal of the dummy gate and the dummy
gate spacers; a layer of oxide formed over the passivation layer; a
dielectric layer ex-situ deposited over the oxide layer; and gate
metal deposited over the dielectric layer creating a gate
stack.
33. The method of claim 32, wherein the substrate of gallium
arsenide is undoped.
34. The method of claim 32, wherein the substrate of gallium
arsenide is has a (100) orientation.
35. The device of claim 32, wherein the contact pads are comprised
of a gold feranium/nickel/gold alloy.
36. The device of claim 32, wherein the passivation layer comprises
amorphous silicon.
37. The device of claim 32, wherein the oxide layer comprises
silicon dioxide.
38. The device of claim 32, wherein the dielectric layer comprises
hafnium oxide.
39. A gallium arsenide MOSFET device, the device comprising: a
substrate of gallium arsenide; a sacrificial oxide layer formed
over the substrate of gallium arsenide; shallow trench isolations
regions formed in the substrate; deep p-wells implanted into the
substrate; shallow n-channels implanted into the substrate and
annealed after the deep p-well implantation; a dummy gate formed
over the shallow n-channel and the sacrificial oxide layer;
source-drain extensions implanted into the substrate adjacent the
dummy gate and the shallow trench isolation regions; dummy oxide
spacers formed along the sidewalls of the dummy gate and over a
portion of the source-drain extensions; source-drain regions
implanted into the substrate adjacent the source-drain extensions
and the shallow trench isolation regions; insulating spacers formed
on the sides of the dummy oxide spacers; gold geranium/nickel/gold
alloy contact pads in contact with the source-drain regions; a
layer of nitride deposited over the device; a passivation layer
in-situ deposited in the opening left after the removal of the
dummy gate, dummy gate spacers and the sacrificial oxide layer; a
layer of oxide formed over the passivation layer; a dielectric
layer ex-situ deposited over the oxide layer; and gate metal
deposited over the dielectric layer creating a gate stack.
Description
BACKGROUND OF THE INVENTION
[0001] The present invention relates to fabricating self-aligned
metal oxide semiconductor field effect transistors (MOSFETS), and
more particularly, to fabricating self-aligned, inversion mode
gallium arsenide MOSFETS with excellent electrical
characteristics.
[0002] The difficulty of increasing performance in sub-100 nm
silicon (Si) complementary metal-oxide semiconductor (CMOS)
technology has renewed interest in the use of Group III-V channel
materials for advanced very large-scale integration (VLSI) CMOS.
Gallium Arsenide (GaAs) is an attractive choice due to its relative
maturity compared to other Group III-V compounds, its high electron
mobility (.about.6.times. compared to Si), and its lattice matching
with germanium (Ge). The main barrier towards implementing
enhancement--or depletion--mode GaAs MOSFETs for VLSI application
is the difficulty of forming a high-quality gate insulator that
passivates the interface states and prevents Fermi level pinning at
the GaAs surface. However, other problems also need to be overcome
including poor thermal stability of the gate stack and the lack of
a self-aligned contacting scheme.
[0003] Recently, GaAs n-channel metal-oxide semiconductor (NMOS)
capacitors with an in-situ molecular beam epitaxy (MBE) grown
amorphous silicon (.alpha.-Si) passivation layer and ex-situ
physical vapor deposition (PVD) hafnium oxide (HfO.sub.2) gate
dielectric have shown excellent electrical characteristics.
Interface state densities D.sub.it as low as
1.times.10.sup.11/cm.sup.2.eV are obtained with excellent thermal
stability of the GaAs/.alpha.-Si/SiO.sub.2/HfO.sub.2 . When
self-aligned GaAs MOSFETs were fabricated using conventional
metal-oxide semiconductor (MOS) processes, the devices exhibited
poor electrical characteristics, namely large subthreshold slope
and small on-off current ratio of 10.sup.3, a value that was
limited by gate leakage current. The poor electrical
characteristics and high gate leakage were attributed to
GaAs/.alpha.-Si/SiO.sub.2/HfO.sub.2 interface degradation caused by
conventional high-temperature front end of the line MOS
processes.
[0004] Therefore, there is a need for a method of fabricating a
self-aligning, inversion mode GaAs MOSFET with excellent electrical
characteristics.
BRIEF SUMMARY OF THE INVENTION
[0005] According to embodiments of the present invention, a process
to fabricate self-aligned, inversion mode GaAs MOSFETS with
excellent electric characteristics is presented. The process uses
damascene gate methods enabling the deposition of the MOSFET gate
stack after all the front-end-of-the-line (FEOL) hot processes are
performed. In the damascene gate method, the
.alpha.-Si/SiO.sub.2/HfO.sub.2/metal gate stack is deposited in a
groove formed by removing a dummy gate. As technologies scale to
smaller dimensions, the gate length of the GaAs MOSFET gets
shorter, hence the .alpha.-Si/SiO.sub.2/HfO.sub.2 stack occupies an
increasing fraction of the groove. In addition, the gate itself
tends to be rounded at the bottom meaning that only the center of
the gate has full control of the channel, and the presence of a gap
between the source and drain (S/D) extension and the gate edge
increases the on resistance of the MOSFET and degrades its
performance. By using a dummy spacer formed along the sidewall of
the dummy gate, the groove can be made much wider, for a given gate
length, while also allowing the accurate placement of the S/D
extension edges inside the groove to eliminate the gap between the
S/D extension and the actual gate. The wider groove facilitates the
introduction of the .alpha.-Si/SiO.sub.2/HfO.sub.2/metal gate
stack. Self-aligned source and drain regions are formed using
Si.sup.+ ion implantation. The contacts are formed by patterning a
conductive metal alloy such as GeAuNiAu.
[0006] Accordingly, it is a feature of the embodiments of the
present invention to provide a self-aligned source/drain contacting
scheme.
[0007] Because the degradation of the
GaAs/.alpha.-Si/SiO.sub.2/HfO.sub.2 interface in the GaAs MOSFETs
is caused by conventional MOS high temperature FEOL processing, it
is another feature of the embodiments of the present invention to
provide an integration scheme for GaAs MOSFETs using damascene gate
methods where all high-temperature FEOL processes are carried out
prior to gate stack deposition to improve GaAs MOSFET device
characteristics. Other features of the embodiments of the present
invention will be apparent in light of the description of the
invention embodied herein.
BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS
[0008] The following detailed description of embodiments of the
present invention can be best understood when read in conjunction
with the following drawings, where like structure is indicated with
like reference numerals and in which:
[0009] FIGS. 1a-m schematically illustrate the basic processing
steps of the formation of a self-aligned Gallium Arsenide metal
oxide semiconductor field effect transistor according to an
embodiment of the present invention.
DETAILED DESCRIPTION
[0010] In the following detailed description of the embodiments,
reference is made to the accompanying drawings that form a part
hereof, and in which are shown by way of illustration, and not by
way of limitation, specific embodiments in which the invention may
be practiced. It is to be understood that other embodiments may be
utilized and that logical, mechanical and electrical changes may be
made without departing from the spirit and scope of the present
invention.
[0011] FIGS. 1a-1m illustrate the formation of a self-aligned GaAs
MOSFET device 10 with high-k gate dielectrics using damascene gate
methods in a stepwise fashion. Referring to FIG. 1a, a substrate
100 of bulk undoped <100> orientated GaAs wafer is generally
provided. A sacrificial oxide layer 110, comprising, for example,
SiO.sub.2 or any other suitable sacrificial material, can be
deposited over the substrate 100 using conventional deposition
methods such as, for example, low pressure chemical vapor
deposition (LPCVD). The thickness of the sacrificial oxide layer
110 may vary but typically has a thickness of about 10 nm.
[0012] Shallow Trench Isolation (STI) regions 120 are formed in the
substrate 100. The STI openings are formed by first applying a
conventional resist to the exposed surface of sacrificial oxide
layer 110 (not shown). Lithography creates a pattern on the resist.
The resist pattern is then transferred by conventional etching
processing through the sacrificial oxide layer 110 and a portion of
substrate 100 so as to provide the structure shown in FIG. 1a.
After the trenches are formed in the sacrificial oxide layer 110
and the substrate 100, the trenches are filled with dielectric
material such as, for example, high-density plasma oxide or TEOS
(tetraethylorthosilicate). In one embodiment, the STI regions 120
are formed using liquid phase chemical enhanced oxidation. In
another embodiment, the STI regions 120 are formed using oxygen
implantation followed by activation annealing at 450.degree. C. in
a helium gas ambient. Although only two STI regions 120 are
illustrated, any number of STI regions 120 may be formed in the
substrate 100.
[0013] Turning to FIG. 1b, deep P-well 200 implantation can be made
into the substrate 100 followed by shallow n-channel 210
implantation for enhancement-mode devices 10 (See FIG. 1m) and
depletion-mode devices 10 utilizing conventional methods well known
in the art. The implantations are then annealed at 900.degree. C.
for 5 seconds in nitrogen gas. As shown in, FIG. 1c, a dummy gate
300 is formed over the sacrificial oxide layer 110. The dummy gate
300 is comprised of sacrificial polysilicon or any other suitable
related material. The dummy gate 300 may be formed using
conventional deposition processes such as, for example, CVD,
plasma-assisted CVD and sputtering, or LPCVD. Dummy gate 300 is
patterned by lithography and etching. Although, the formation of
only one dummy gate 300 is illustrated, it should be noted that any
number of dummy gates 300 can be formed on the surface of the
substrate 100 to create a plurality of MOSFET devices 10.
[0014] Silicon source/drain extensions 310 are then implanted in
the substrate 100. The source/drain extensions 310 may be formed
utilizing conventional ion implantation and annealing techniques
that are well known in the art. As shown in FIG. 1d, dummy oxide
spacers 400 are formed along the sidewalls of the dummy gate 300
and over portion of the source/drain extensions 310. The dummy
oxide spacers 400 are formed utilizing conventional deposition
processes that are well known in the art.
[0015] As shown in FIG. 1e, the silicon source and drain 500 are
implanted using silicon ion (Si+) implantation and are annealed at
1000.degree. C. for 5 seconds in nitrogen gas. In FIG. 1f,
insulating spacers 600 are formed on the sidewalls of the dummy
oxide spacers 400. The insulating spacers 600 may comprise nitride,
oxynitride or a combination thereof. The source and drain regions
500 are defined by a photoresist layer 610. A layer 620 is formed
by evaporating gold germanium (AuGe) to a thickness of
approximately 50 nm, followed by evaporating nickel to a thickness
of approximately 25 nm, which in turn is followed by evaporating
gold over the device 10 to a thickness of approximately 200 nm. The
photoresist layer 610 and the metals in layer 620 are lifted off by
conventional methods known in the art to yield source/drain contact
pads 620 as shown in FIG. 1g. The device 10 is annealed in nitrogen
at 400.degree. C. for sixty seconds to form the source/drain ohmic
AuGeNiAu alloy contacts 620.
[0016] As shown in FIG. 1h, a nitride overlayer 700 is deposited
over the device 10. An oxide layer 710 is then deposited on the
nitride layer 700, and the oxide layer 710 is planarized so that
the uppermost surface of the oxide layer 710 is substantially
co-planar to the uppermost surface of the nitride layer 700. Any
conventional planarization process such as chemical-mechanical
polishing or grinding may be utilized. The oxide layer 710 can be,
for example, high-density plasma oxide, TEOS, or any other suitable
oxide.
[0017] As shown in FIG. 1i, the oxide layer 710 and nitride layer
700 are removed by reactive ion etching (RIE) so that the uppermost
surface of the nitride layer 700 is substantially co-planar to the
uppermost surface of the dummy gate 300.
[0018] As shown in FIG. 1j, the dummy gate 300 is removed by
etching utilizing RIE or a chemical down stream etching process
exposing the sacrificial oxide layer 110 and resulting in the
formation of gate opening 720. As shown in FIG. 1k, the dummy oxide
spacer 400 and the sacrificial oxide layer 110 in the gate opening
720 are removed by etching utilizing conventional etching
processing stopping on the uppermost surface of the deep P-doped
well 200 of substrate 100. The innermost surface of the insulating
spacers 600 define the boundaries of the gate opening 720. The
source-drain extensions 310 edges are within the gate opening 720
resulting in no gap between the source-drain extensions 310 and the
gate opening 720. The removal of the dummy oxide spacers 400 has
allowed the resulting gate opening 720 to be made much wider for a
given gate length. Additionally, the wider gate opening 720
facilitates gate formation.
[0019] As shown in FIG. 1l, after all the front-end-of-the-line hot
processes are preformed, the uppermost surface of the n-doped GaAs
channel 210 within the gate opening 720 is wet cleaned. The device
10 is then loaded into an MBE (Molecular Beam Epitaxy) system and
any remaining surface oxygen is removed using atomic hydrogen. The
first component of the gate stack is an approximately 1.5 nm layer
of amorphous silicon (.alpha.-Si) 800 which is in-situ deposited
over the device 10 and into the gate opening 720 as a passivation
layer. The device 10 is then oxidized in air (i.e., native oxide)
to create a layer of silicon dioxide. The layer of silicon dioxide
can have a thickness of between about 0.3 nm to about 10 nm.
Preferably, the layer of silicon dioxide should be less than 1 nm.
An approximately 10 nm thick high dielectric constant (k)
dielectric layer 810 of Hafnium oxide (HfO.sub.2) is ex-situ
deposited on the device 10 and into the gate opening 720 over the
.alpha.-Si 800 layer by atomic layer deposition (ALD) at
300.degree. C. The device 10 is then annealed at 600.degree. C. in
nitrogen gas containing 5% oxygen. Finally, as shown in FIG. 1m, a
conductive material 900 such as polysilicon, W, Ta, or TiN is then
formed in the gate opening 720 over the dielectric layer 810
utilizing conventional deposition processes including, but not
limited to: CVD, plasma-assisted CVD, sputtering, plating,
evaporation and other like deposition processes. The structure may
then be planarized by conventional planarization processes, e.g.,
CMP, to the uppermost surfaces of the nitride layer 700 and the
insulating spacers 600.
[0020] It is noted that terms like "preferably," "commonly," and
"typically" are not utilized herein to limit the scope of the
claimed invention or to imply that certain features are critical,
essential, or even important to the structure or function of the
claimed invention. Rather, these terms are merely intended to
highlight alternative or additional features that may or may not be
utilized in a particular embodiment of the present invention.
[0021] Having described the invention in detail and by reference to
specific embodiments thereof, it will be apparent that
modifications and variations are possible without departing from
the scope of the invention defined in the appended claims. More
specifically, although some aspects of the present invention are
identified herein as preferred or particularly advantageous, it is
contemplated that the present invention is not necessarily limited
to these preferred aspects of the invention.
* * * * *