U.S. patent application number 12/036528 was filed with the patent office on 2008-07-03 for solder alloy.
This patent application is currently assigned to FRY'S METALS, INC.. Invention is credited to John Laughlin, Brian G. Lewis, Ranjit Pandher, Bawa Singh.
Application Number | 20080159904 12/036528 |
Document ID | / |
Family ID | 39584244 |
Filed Date | 2008-07-03 |
United States Patent
Application |
20080159904 |
Kind Code |
A1 |
Lewis; Brian G. ; et
al. |
July 3, 2008 |
SOLDER ALLOY
Abstract
An alloy suitable for use in a ball grid array or chip scale
package, the alloy comprising from 0.05-1.5 wt. % copper; from
2.5-5 wt. % silver; one or both of from 0.005-0.3 wt % nickel
and/or from 0.003-0.3 wt % chromium; from 0-0.1 wt. % phosphorus;
from 0-0.1 wt. % germanium; from 0-0.1 wt. % gallium; from 0-0.3
wt. % of one or more rare earth elements; from 0-0.3 wt. % indium;
from 0-0.3 wt. % magnesium; from 0-0.3 wt. % calcium; from 0-0.3
wt. % silicon; from 0-0.3 wt. % aluminium; from 0-0.3 wt. % zinc;
from 0-2 wt. % bismuth; from 0-1 wt. % antimony; from 0-0.2 wt %
manganese; from 0-0.3 wt % cobalt; from 0-0.3 wt % iron; and from
0-0.1 wt % zirconium; and the balance tin, together with
unavoidable impurities.
Inventors: |
Lewis; Brian G.; (Branford,
CT) ; Singh; Bawa; (Voorhees, NJ) ; Laughlin;
John; (Tucson, AZ) ; Pandher; Ranjit;
(Plainsboro, NJ) |
Correspondence
Address: |
SENNIGER POWERS LLP
ONE METROPOLITAN SQUARE, 16TH FLOOR
ST LOUIS
MO
63102
US
|
Assignee: |
FRY'S METALS, INC.
South Plainfield
NJ
|
Family ID: |
39584244 |
Appl. No.: |
12/036528 |
Filed: |
February 25, 2008 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
PCT/GB2006/003167 |
Aug 24, 2006 |
|
|
|
12036528 |
|
|
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|
60949064 |
Jul 11, 2007 |
|
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60710917 |
Aug 24, 2005 |
|
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Current U.S.
Class: |
420/561 ;
420/560 |
Current CPC
Class: |
C22C 13/00 20130101 |
Class at
Publication: |
420/561 ;
420/560 |
International
Class: |
C22C 13/00 20060101
C22C013/00 |
Claims
1. An alloy suitable for use in a ball grid array or chip scale
package, the alloy comprising: from 0.05-1.5 wt. % copper; from
2.5-5 wt. % silver; one or both of from 0.005-0.3 wt % nickel
and/or from 0.003-0.3 wt % chromium; from 0-0.1 wt. % phosphorus;
from 0-0.1 wt. % germanium; from 0-0.1 wt. % gallium; from 0-0.3
wt. % of one or more rare earth elements; from 0-0.3 wt. % indium;
from 0-0.3 wt. % magnesium; from 0-0.3 wt. % calcium; from 0-0.3
wt. % silicon; from 0-0.3 wt. % aluminium; from 0-0.3 wt. % zinc;
from 0-2 wt. % bismuth; from 0-1 wt. % antimony; from 0-0.2 wt %
manganese; from 0-0.3 wt % cobalt; from 0-0.3 wt % iron; and from
0-0.1 wt % zirconium; and the balance tin, together with
unavoidable impurities.
2. An alloy as claimed in claim 1 comprising from 0.02-0.3 wt %
nickel.
3. An alloy as claimed in claim 2 comprising from 0.02 to 0.2 wt %
nickel.
4. An alloy as claimed in claim 1 comprising from 0.005 to 0.3 wt %
chromium.
5. An alloy as claimed in claim 4 comprising from 0.01 to 0.2 wt %
chromium.
6. An alloy as claimed in claim 1 comprising from 0.1 to 1 wt. %
Cu.
7. An alloy as claimed in claim 6 comprising from 0.1 to 0.9 wt. %
Cu.
8. An alloy as claimed in claim 1 comprising from 3 to 4 wt. %
Ag.
9. An alloy as claimed in claim 8 comprising from 3 to 3.5 wt. %
Ag.
10. An alloy as claimed in claim 1 comprising from 0.02-0.2 wt. %
of at least one of cobalt and iron.
11. An alloy as claimed in claim 1 comprising from 0.01-0.3 wt. %
magnesium.
12. An alloy as claimed in claim 1 comprising from 0.02-0.3 wt. %
iron.
13. An alloy as claimed in claim 1 comprising from 0.01-0.15 wt. %
manganese.
14. An alloy as claimed in claim 1 comprising from 0.05-0.3 wt. %
indium.
15. An alloy as claimed in claim 1 comprising from 0.01-0.3 wt. %
calcium.
16. An alloy as claimed in claim 1 comprising from 0.01-0.3 wt. %
silicon.
17. An alloy as claimed in claim 1 comprising from 0.008-0.3 wt. %
aluminium.
18. An alloy as claimed in claim 1 comprising from 0.01-0.3 wt. %
zinc.
19. An alloy as claimed in claim 1 comprising from 0.05-1 wt. %
antimony.
20. An alloy as claimed in claim 1 comprising from 0.05 to 1 wt. %
bismuth.
21. An alloy as claimed in claim 1, wherein said one or more rare
earth elements comprises one or more elements selected from cerium,
lanthanum, neodymium and praseodymium.
22. An alloy as claimed in claim 1 comprising from 0.1 to 0.8 wt. %
Cu, from 3 to 4 wt. % Ag, from 0.03 to 0.15 wt % nickel and/or from
0.01 to 0.07 wt % chromium.
23. An alloy as claimed in claim 1 in the form of a bar, a stick, a
solid or flux cored wire, a foil or strip, a preform, or a powder
or paste (powder plus flux blend), or solder spheres for use in
ball grid array joints, or a pre-formed solder piece.
24. A soldered ball grid array or chip scale package joint
comprising an alloy as defined in claim 1.
25. Use of an alloy as defined in claim 1 in a ball grid array or
chip scale package.
Description
REFERENCE TO RELATED APPLICATIONS
[0001] This application is a continuation-in-part of PCT
application PCT/GB2006/003167, filed Aug. 24, 2006 and claiming
priority to U.S. provisional application 60/710,917, filed Aug. 24,
2005, and this application also claims priority to U.S. provisional
application 60/949,064, filed Jun. 11, 2007, the entire disclosures
of which are incorporated herein by reference.
FIELD OF THE INVENTION
[0002] The present invention relates to an alloy and, in
particular, a lead-free solder alloy. The alloy is particularly,
though not exclusively, suitable for use in ball grid arrays and
chip scale packages in the form of solder spheres.
BACKGROUND OF THE INVENTION
[0003] For environmental reasons, there is an increasing demand for
lead-free replacements for lead-containing conventional alloys.
Many conventional solder alloys are based around the tin-copper
eutectic composition, Sn-0.7 wt. % Cu, and tin-silver eutectic
composition, 96.5 wt. % Sn-3.5 wt. % Ag.
[0004] A ball grid array joint is a bead of solder between two
substrates, typically circular pads. Arrays of these joints are
used to mount chips on circuit boards.
[0005] The drop shock reliability of solder joints has become a
major issue for the electronic industry partly because of the ever
increasing popularity of portable electronics and partly due to the
transition to lead-free solders. Most of the commonly recommended
lead-free solders are high tin alloys which have relatively higher
strength and modulus. This plays a critical role in the reliability
of lead-free solder joints. Further, even though metallurgically,
it is the tin in the solder alloys that principally participates in
the solder joint formation, details of the IMC (intermetallic
compound) layers formed with tin-lead and lead-free alloys are
essentially the same. The markedly different process conditions for
tin-lead and lead-free alloys also bear on solder joint quality.
Brittle failure of solder joints in drop shock occurs at or in the
interfacial IMC layer(s). This is due to the inherent brittle
nature of the IMC, defects within or at IMC interfaces or transfer
of stress to the interfaces as a result of the low ductility of the
bulk solder.
[0006] There are a number of requirements for a solder alloy to be
suitable for use in ball grid arrays (BGA) and chip scale packages
(CSP). First, the alloy must exhibit good wetting characteristics
in relation to a variety of substrate materials such as copper,
nickel, nickel phosphorus, nickel boron ("electroless nickel").
Solder alloys tend to dissolve the substrate and to form an
intermetallic compound at the interface with the substrate. For
example, tin in the solder alloy will react with the substrate at
the interface to form an intermetallic. If the substrate is copper,
then a layer of Cu.sub.6Sn.sub.5 will be formed. Such a layer
typically has a thickness of from a fraction of a micron to a few
microns. At the interface between this layer and the copper
substrate an intermetallic compound of Cu.sub.3Sn may be present.
Such an intermetallic compound may result in a brittle solder
joint.
[0007] In some cases, voids occur, which may contribute to
premature fracture of a stressed joint.
[0008] Other important factors are (i) the presence of
intermetallics in the alloy itself, which results in stronger
mechanical properties, (ii) oxidation resistance in multiple
reflow, and (iii) alloy stability. This latter consideration is
important for applications where the alloy is held in a tank or
bath for long periods of time.
SUMMARY OF THE INVENTION
[0009] The present invention aims to address at least some of the
problems associated with the prior art and to provide an improved
solder alloy.
[0010] Accordingly, the present invention provides an alloy
suitable for use in a ball grid array or chip scale package, the
alloy comprising:
[0011] from 0.05-1.5 wt. % copper;
[0012] from 2.5-5 wt. % silver;
[0013] one or both of from 0.005-0.3 wt % nickel and/or from
0.003-0.3 wt % chromium;
[0014] from 0-0.1 wt. % phosphorus;
[0015] from 0-0.1 wt. % germanium;
[0016] from 0-0.1 wt. % gallium;
[0017] from 0-0.3 wt. % of one or more rare earth elements;
[0018] from 0-0.3 wt. % indium;
[0019] from 0-0.3 wt. % magnesium;
[0020] from 0-0.3 wt. % calcium;
[0021] from 0-0.3 wt. % silicon;
[0022] from 0-0.3 wt. % aluminium;
[0023] from 0-0.3 wt. % zinc;
[0024] from 0-2 wt. % bismuth;
[0025] from 0-1 wt. % antimony;
[0026] from 0.008-0.2 wt % manganese;
[0027] from 0.01-0.3 wt % cobalt;
[0028] from 0.02-0.3 wt % iron;
[0029] from 0.008-0.1 wt % zirconium; and
[0030] the balance tin, together with unavoidable impurities.
BRIEF DESCRIPTION OF THE DRAWINGS
[0031] FIG. 1 is a graph showing the effect of Ni addition on
intermetallic compound formation in a SnAgCu alloy.
[0032] FIG. 2 is a graph showing the results of ball pull tests on
a SnAgCu alloy with and without the addition of Ni.
[0033] FIG. 3 is a graph showing the results of ball pull tests on
a SnAgCu alloy with and without the addition of Cr; and
[0034] FIG. 4 is a graph showing the results of ball pull tests
(pull force) on a SnAgCu alloy with and without the addition of
Cr.
[0035] Corresponding reference characters indicate corresponding
parts throughout the drawings.
DESCRIPTION OF THE EMBODIMENT(S) OF THE INVENTION
[0036] The present invention will now be further described. In the
following passages different aspects of the invention are defined
in more detail. Each aspect so defined may be combined with any
other aspect or aspects unless clearly indicated to the contrary.
In particular, any feature indicated as being preferred or
advantageous may be combined with any other feature or features
indicated as being preferred or advantageous.
[0037] Copper forms an eutectic with tin, lowering the melting
point and increasing the alloy strength. A copper content in the
hyper-eutectic range increases the liquidus temperature but further
enhances the alloy strength. In one embodiment, the alloy
preferably comprises from 0.1 to 1 wt. % Cu, more preferably from
0.1 to 0.9 wt. % Cu, still more preferably from 0.1 to 0.8 wt. %
Cu. In another embodiment, the alloy preferably comprises from 0.15
to 1 wt. % Cu, more preferably from 0.5 to 0.9 wt. % Cu, still more
preferably from 0.6 to 0.8 wt. % Cu. Specific examples of preferred
alloys are ones containing 0.1 wt. % Cu, 0.5 wt. % Cu, and 0.7 wt.
% Cu.
[0038] Silver lowers the melting point and improves the wetting
properties of the solder to copper and other substrates. The alloy
preferably comprises from 2.5 to 5 wt. % Ag, more preferably from 3
to 4.5 wt. % Ag, still more preferably from 3 to 4 wt. % Ag. Most
preferably, the alloy comprises from 3 to 3.5 wt. % Ag.
[0039] A high silver content (i.e. preferably .gtoreq.2.5 wt. %,
more preferably .gtoreq.3 wt. %) has been found to be beneficial
because it provides higher resistance against the fracture of
solder joints during temperature cycling. The net result of the
thermo-mechanical stress experienced in the solder joints during
temperature cycling is re-crystallization and grain growth followed
by grain boundary sliding under the stress. Cracks propagate as a
result of, for example, micro-void coalescence along grain
boundaries. Crack propagation therefore can be reduced for alloys
for which grain motion is minimized. The presence of particle
phases like Ag.sub.3Sn in SnAgCu alloys at or intersecting
boundaries is a cause for the more limited grain boundary siding in
such alloys. For higher silver content alloys, there is a greater
amount of Ag.sub.3Sn intermetallic compound in the bulk of the
solder, which results in improved fatigue resistance. However, too
high a silver content can have an adverse affect on drop shock
resistance and for this reason the silver content preferably does
not exceed 5 wt. %, more preferably it does not exceed 4 wt. %,
still more preferably it does not exceed 3.5 wt. %.
[0040] The presence of nickel in the alloy is beneficial in terms
of mechanical properties (as demonstrated by improved ball pull)
and also solder spread. The alloy may comprise from 0.005 to 0.3
wt. % nickel, preferably from 0.01 to 0.3 wt % nickel, more
preferably 0.02 to 0.3 wt %, more preferably 0.02 to 0.2 wt %,
still more preferably 0.03 to 0.15 wt %, still more preferably 0.04
to 0.12 wt %. A particularly advantageous range is 0.04 to 0.08 wt
% nickel. Ball pull results indicate that there is a reproducible
correlation between improved ball pull and solder spread and the
optimum nickel content in these respects has been found to be 0.03
to 0.07 wt %, preferably 0.04 to 0.06 wt %, more preferably
approximately 0.05 wt %. The same is also confirmed by drop shock
test results. The performance with 0.5 wt % nickel is poorer than
0.05% nickel (however, good results are also obtained at
approximately 0.1 wt % nickel). For this reason, the nickel content
should not exceed approximately 0.3 wt % nickel.
[0041] The presence of chromium in the alloy is also beneficial in
terms of mechanical properties (as demonstrated by improved ball
pull). However, chromium on its own (i.e. without nickel) has
little or no effect on solder spread. Surprisingly, however, in
conjunction with nickel an improvement in solder spread is
observed. The alloy may comprise from 0.003 to 0.3 wt. % chromium,
preferably from 0.005 to 0.3 wt % chromium, more preferably 0.01 to
0.2 wt %, more preferably 0.01 to 0.1 wt %, still more preferably
0.01 to 0.07 wt %. The optimum is 0.02 to 0.06 wt % chromium,
preferably 0.02 to 0.04 wt %, more preferably approximately 0.03 wt
%. However, good results are also obtained at approximately 0.05 wt
%. In the manufacture of the alloy, in order to achieve the
required alloying effect, it is advantageous to add the chromium to
the tin and other components by first alloying some or all of the
chromium with some or all of the copper.
[0042] Nickel and chromium may act as intermetallic compound growth
modifiers and grain refiners. For example, while not wishing to be
bound by theory, it is believed that nickel forms an intermetallic
with tin and with the copper to form a CuNiSn intermetallic and the
presence of the low solubility elements in the intermetallic slows
the diffusion of Cu and thereby reduces the amount of IMC that
forms over time. It has been found that growth rates of the CuNiSn
intermetallics are less than in nickel-free alloys.
[0043] Chromium has a low solubility in tin but alloys with copper.
Chromium is therefore preferably alloyed via the copper component
in the solder and thereby it is proposed that it will limit the
formation of Cu.sub.6Sn.sub.5 IMC in the bulk solder. The presence
of the intermetallics affects the microstructure developed on
cooling the alloy from the molten to the solid state. A finer grain
structure is observed, which further benefits the appearance and
strength of the alloy.
[0044] Up to 0.3 wt % chromium in combination with up to 0.3 wt %
nickel and 2.5 to 5 wt % silver results in an alloy with improved
properties. In particular, it has been found that alloys containing
the nickel and chromium additions have a reduced ball pull force
for the so called Mode 2 failure. Mode 2 is the preferred failure
mode. It is necking and tensile failure in the solder, not at the
interface.
[0045] Chromium has also been found to soften the alloy and improve
oxidation resistance. With regard to tarnish performance, a small
quantity (.about.50 ppm) of phosphorus addition may advantageously
be used. The presence of nickel in the alloy also provides
reasonable protection against tarnish resistance of solder
spheres.
[0046] The sum of nickel and chromium is preferably from 0.008 to
0.6 wt %, more preferably 0.01 to 0.2 wt %, still more preferably
0.01 to 0.15 wt %. The optimum combined amount of nickel and
chromium is 0.05 to 0.12 wt %.
[0047] It has surprising been found that the presence of both
nickel and chromium in the alloys according to the present
invention has a very positive effect on mechanical properties. The
addition of either nickel or chromium results in some improvement
in mechanical properties, as demonstrated by high strain rate
testing performance and ball pull data. However, it has been found
that there is a synergistic effect between nickel and chromium: the
collective effect of the nickel and chromium additions is greater
than the sum of the individual effects. In particular, the alloys
according to the present invention can show >80% reduction in
mode 4 failures as demonstrated by drop shock evaluations.
[0048] The combination of nickel and chromium in the alloys
according to present invention therefore offers high drop shock
reliability and also improved solder spread.
[0049] If present, the alloy preferably comprises from 0.02-0.2 wt.
% of at least one of cobalt and/or iron, more preferably from
0.02-0.1 wt. % of at least one of cobalt and/or iron.
[0050] If present, the alloy preferably comprises from 0.005-0.3
wt. % magnesium. In this case, improved properties can be obtained
by the presence of from 0.02-0.3 wt % Fe.
[0051] If present, the alloy preferably comprises from 0.01-0.15 wt
% manganese, more preferably from 0.02-0.1 wt % manganese.
[0052] Cobalt, manganese, iron, antimony, and zirconium may also
act as intermetallic compound growth modifiers and grain
refiners.
[0053] Indium, zinc, magnesium, calcium, gallium and aluminium may
act as diffusion compensators. The addition of appropriate fast
diffusing species can be effective in balancing what otherwise
would be a net atom flux away from, for example, the
solder-substrate interface, resulting in void formation (Horsting
or Kirkendall). Indium has been found to have a beneficial effect
on solder wetting. Indium lowers the melting point of the solder.
Indium may also act to reduce the formation of voids in the solder
joint. Indium may also improve the strength of the Sn-rich matrix.
Zinc has been found to act in a similar manner to indium. The alloy
may optionally contain up to 0.3 wt. % indium, for example 0.05-0.3
wt. % indium, preferably from 0.1-0.2 wt. % indium.
[0054] The alloy may optionally comprise from 0.01-0.3 wt. %
calcium, more preferably from 0.1-0.2 wt. % calcium.
[0055] The alloy may optionally comprise from 0.01-0.3 wt. %
silicon, more preferably from 0.1-0.2 wt. % silicon.
[0056] The alloy may optionally comprise from 0.01-0.3 wt. % zinc,
more preferably from 0.1-0.2 wt. % zinc.
[0057] The alloy may optionally comprise from 0.05-1 wt. %
antimony, more preferably from 0.1-0.5 wt. % antimony.
[0058] Aluminium (as well as chromium, germanium, silicon and
phosphorous) may be beneficial in terms of oxidation reduction. The
alloy may optionally comprise from 0.008-0.3 wt. % aluminium, more
preferably from 0.1-0.2 wt. % aluminium.
[0059] Phosphorus, germanium and gallium may act as dross reducers.
The alloy may optionally contain up to 0.1 wt. % of one or more of
each of phosphorus, germanium and gallium.
[0060] Bismuth may act to improve wetting and fatigue resistance.
Bismuth can lower the solidus temperature and improve strength
through precipitation hardening while suppressing the formation of
large Ag.sub.3Sn IMC in the bulk solder. The alloys according to
the present invention may contain up to 2 wt. % bismuth, more
preferably up to 1 wt. %, still more preferably up to 0.5 wt. %
bismuth, for example 0.05 to 0.5 wt. %.
[0061] If present, the alloy preferably comprises up to 0.05 wt. %
of one or more rare earth elements. The one or more rare earth
elements preferably comprise two or more elements selected from
cerium, lanthanum, neodymium and praseodymium.
[0062] The alloys according to the present invention are lead-free
or essentially lead-free. The alloys offer environmental advantages
over conventional lead-containing solder alloys.
[0063] The alloys according to the present invention will typically
be supplied as a solder sphere for CSP applications but may also be
supplied as bar, stick or ingot, optionally together with a flux.
The alloys may also be provided in the form of a wire, for example
a cored wire, which incorporates a flux, a sphere or a preform cut
or stamped from a strip or solder. These may be alloy only or
coated with a suitable flux as required by the soldering process.
The alloys may also be supplied as a powder blended with a flux to
produce a solder paste.
[0064] The alloys according to the present invention may be used in
molten solder baths as a means to solder together two or more
substrates and/or for coating a substrate.
[0065] It will be appreciated that the alloys according to the
present invention may contain unavoidable impurities, although, in
total, these are unlikely to exceed 1 wt. % of the composition.
Preferably, the alloys contain unavoidable impurities in an amount
of not more than 0.5 wt. % of the composition, more preferably not
more than 0.3 wt. % of the composition, still more preferably not
more than 0.1 wt. % of the composition.
[0066] The alloys according to the present invention may consist
essentially of the recited elements. It will therefore be
appreciated that in addition to those elements which are mandatory
(i.e. Sn, Cu. Ag, and at least one of Ni and/or Cr) other
non-specified elements may be present in the composition provided
that the essential characteristics of the composition are not
materially affected by their presence.
[0067] The alloys will typically comprise at least 90 wt. % tin,
preferably from 94 to 97.4 wt. %. Accordingly, the present
invention further provides an alloy for use in a ball grid array or
chip scale package, the alloy comprises:
[0068] from 94-97.4 wt % tin;
[0069] from 0.05-1.5 wt. % copper;
[0070] from 2.5-5 wt. % silver;
[0071] one or both of from 0.005-0.3 wt. % nickel and/or from
0.003-0.3 wt. % chromium;
[0072] from 0-0.1 wt. % phosphorus;
[0073] from 0-0.1 wt. % germanium;
[0074] from 0-0.1 wt. % gallium;
[0075] from 0-0.3 wt. % of one or more rare earth elements;
[0076] from 0-0.3 wt. % indium;
[0077] from 0-0.3 wt. % magnesium;
[0078] from 0-0.3 wt. % calcium;
[0079] from 0-0.3 wt. % silicon;
[0080] from 0-0.3 wt. % aluminium;
[0081] from 0-0.3 wt. % zinc;
[0082] from 0-2 wt. % bismuth;
[0083] from 0-1 wt. % antimony;
[0084] from 0.008-0.2 wt % manganese;
[0085] from 0.01-0.3 wt % cobalt;
[0086] from 0.02-0.3 wt % iron; and
[0087] from 0.008-0.1 wt % zirconium;
together with unavoidable impurities.
[0088] The alloys according to the present invention are
particularly well suited to applications involving ball grid arrays
or chip scale packages. Accordingly, the present invention also
provides for the use of a solder alloy as herein described in a
ball grid array or chip scale package.
[0089] The following are examples of preferred alloy compositions
in accordance with the present invention which show surprisingly
good mechanical properties (eg high drop shock reliability) and
also improved solder spread. The collective effect of the nickel
and chromium additions is greater than the sum of the individual
effects.
[0090] The present invention also provides for a ball grid array or
chip scale package joint comprising the solder alloy composition as
herein described.
[0091] Having described the invention in detail, it will be
apparent that modifications and variations are possible without
departing from the scope of the invention defined in the appended
claims.
EXAMPLES
[0092] The following are non-limiting examples to further describe
the present invention.
Example 1
[0093] An alloy was prepared by melting Sn in a cast iron crucible
(alternatively a ceramic crucible can be used). To the molten Sn
was added an alloy of Sn-3 wt % Cu, and alloys of Sn-5 wt % Ag and
Sn-0.35 wt % Ni. These additions were made with the alloy bath
temperature at 350.degree. C. The bath was cooled to 300.degree. C.
for the addition of phosphorus in the form of an alloy Sn-0.3%
P.
[0094] The alloy was sampled to verify the composition of
TABLE-US-00001 Ag 0.3 wt % Cu 0.7 wt % P 0.006 wt % and remainder
tin
[0095] The alloy composition was then jetted as a metal stream into
an inerted vertical column. The metal stream was spherodised by the
application of magnetostrictive vibrational energy applied through
the melt pot and at or near the exit orifice.
[0096] Equally, the alloy composition could be punched and then
spherodised as a sphere.
[0097] The alloy, provided in the form of a sphere, can be used in
a ball grid array joint or chip scale package. Flux is printed or
pin transferred to the pads of a CSP. The spheres are then pick and
placed or shaken through a stencil onto the fluxed pads. The
package is then reflowed in a standard reflow oven at a peak
temperature of between 240.degree. C. and 260.degree. C.
[0098] Alloy and solder joint performance was assessed in packages
aged at 150.degree. C. for up to 1000 hours. IMC growth was
measured by standard metallographic techniques. Mechanical ball
pull testing was used to assess solder joint failure mode (brittle
or ductile).
Example 2
[0099] The following alloy composition was prepared in a similar
manner to Example 1 (all wt. %)
TABLE-US-00002 Ag 0.3 Cu 0.7 Ni 0.2 P 0.006 Sn balance
[0100] This alloy may be provided in the form of a sphere and used
in a ball grid array joint or chip scale package.
Example 3
[0101] The following alloy composition was prepared in a similar
manner to Example 1.
TABLE-US-00003 Ag 0.3 Cu 0.7 Co 0.2 P 0.006 Sn balance
[0102] This alloy may be provided in the form of a sphere and used
in a ball grid array joint or chip scale package.
Example 4
[0103] The following alloy composition was prepared in a similar
manner to Example 1.
TABLE-US-00004 Ag 0.3 Cu 0.7 Cr 0.05 P 0.006 Sn balance
[0104] This alloy may be provided in the form of a sphere and used
in a ball grid array joint or chip scale package.
Example 5
[0105] Alloys have been prepared corresponding to the compositions
of Examples 1 to 4 where Ge is substituted for the phosphorus
content.
Example 6
[0106] The following alloy composition was prepared in a similar
manner to Example 1.
TABLE-US-00005 Ag 0.3 Cu 0.7 Co 0.2 Sn balance
[0107] This alloy may be provided in the form of a sphere and used
in a ball grid array joint or chip scale package.
Example 7
[0108] The following alloy composition was prepared in a similar
manner to Example 1.
TABLE-US-00006 Ag 0.3 Cu 0.7 Ni 0.10 Ge 0.10 P 0.006 Sn balance
[0109] This alloy may be provided in the form of a sphere and used
in a ball grid array joint or chip scale package.
Example 8
[0110] The following alloy composition was prepared in a similar
manner to Example 1.
TABLE-US-00007 Ag 1.1 Cu 0.5 Fe 0.25 Mg 0.1 Sn balance
[0111] This alloy may be provided in the form of a sphere and used
in a ball grid array joint or chip scale package.
Example 9
[0112] The following alloy composition was prepared in a similar
manner to Example 1.
TABLE-US-00008 Ag 2 Cu 0.5 Co 0.2 Sn balance
[0113] This alloy may be provided in the form of a sphere and used
in a ball grid array joint or chip scale package.
Example 10
[0114] The following alloy composition was prepared in a similar
manner to Example 1.
TABLE-US-00009 Ag 3 Cu 0.5 Cr 0.05 Sn balance
[0115] This alloy may be provided in the form of a sphere and used
in a ball grid array joint or chip scale package.
Example 11
[0116] The following alloy composition was prepared in a similar
manner to Example 1.
TABLE-US-00010 Ag 0.3 Cu 0.7 Ni 0.2% Sn balance
[0117] This alloy may be provided in the form of a sphere and used
in a ball grid array joint or chip scale package.
Example 12
[0118] The following alloy composition was prepared in a similar
manner to Example 1.
TABLE-US-00011 Ag 0.3 Cu 0.7 Fe 0.1 Mg 0.05 Sn balance
[0119] This alloy may be provided in the form of a sphere and used
in a ball grid array joint or chip scale package.
Example 13
[0120] The following alloy composition was prepared in a similar
manner to Example 1.
TABLE-US-00012 Ag 0.3 Cu 0.7 Cr 0.05 Co 0.2 Sn balance
[0121] This alloy may be provided in the form of a sphere and used
in a ball grid array joint or chip scale package.
Example 14
[0122] The following alloy composition was prepared in a similar
manner to Example 1.
TABLE-US-00013 Ag 0.3 Cu 0.7 Cr 0.05 Ni 0.2 Sn balance
[0123] This alloy may be provided in the form of a sphere and used
in a ball grid array joint or chip scale package.
Example 15
[0124] The following alloy composition was prepared in a similar
manner to Example 1.
TABLE-US-00014 Ag 0.3 Cu 0.7 Cr 0.05 Fe 0.2 Sn balance
[0125] This alloy may be provided in the form of a sphere and used
in a ball grid array joint or chip scale package.
Example 16
[0126] The following alloy composition was prepared in a similar
manner to Example 1.
TABLE-US-00015 Ag 0.3 Cu 0.7 Cr 0.05 Fe 0.2 Mg 0.1 Sn balance
Example 17
Empirical Testing of SnAgCu alloys
[0127] In the context of this example, FIGS. 1 through 4 are graphs
showing the following:
[0128] FIG. 1 shows the effect of Ni addition on intermetallic
compound formation in a SnAgCu alloy.
[0129] FIG. 2 shows the results of ball pull tests on a SnAgCu
alloy with and without the addition of Ni;
[0130] FIG. 3 shows the results of ball pull tests on a SnAgCu
alloy with and without the addition of Cr.
[0131] FIG. 4 shows the results of ball pull tests (pull force) on
a SnAgCu alloy with and without the addition of Cr.
Experimental Procedures
[0132] Ball pull tests are well known in the field of metallurgy
and solder alloys. The experimental work was conducted on Dage 4000
and Dage 4000 HS Ball Pull and Ball Shear systems. The Dage 4000
machine is capable of performing ball pull test at speeds up to 15
mm/sec while the Dage 4000 HS can do the same test up to 1000
mm/sec. All the tests were carried out using 18 mil (450 .mu.m)
spheres assembled on CABGA100 substrates with NiAu pad finish.
Spheres were assembled using a water-soluble paste flux (Alpha
WS9180-M3) that was stencil printed on the substrates. Spheres were
placed using a simple manual alignment assembly setup and reflowed
in air, in a seven-zone convection reflow oven.
[0133] With regard to the alloys tested, two silver SnAgCu base
alloys were used having the silver, copper, and tin contents shown
in the below table I:
TABLE-US-00016 TABLE I Tin Silver Content Copper Content Identifier
Content (wt. %) (wt. %) SAC405 Balance 4.0 0.5 SAC305 Balance 3.0
0.5
[0134] Ni and Cr were added to these alloys to form the following
alloy compositions:
[0135] Base alloy: SAC305 modified by adding Ni to yield an alloy
having the components and percentages
TABLE-US-00017 Ag 3 wt. % Cu 0.5 wt. % Ni 0.05 wt. % Balance
tin
[0136] Base alloy: SAC405 modified by adding Ni to yield an alloy
having the components and percentages
TABLE-US-00018 Ag 4 wt. % Cu 0.5 wt. % Ni 0.05 wt. % Balance
tin
[0137] Base alloy: SAC305 modified by adding Cr to yield an alloy
having the components and percentages
TABLE-US-00019 Ag 3 wt. % Cu 0.5 wt. % Cr 0.003 wt. % Balance
tin
[0138] Base alloy: SAC305 modified by adding Cr to yield an alloy
having the components and percentages
TABLE-US-00020 Ag 3 wt. % Cu 0.5 wt. % Cr 0.003 wt. % Balance
tin
[0139] Base alloy: SAC305 modified by adding Ni to yield an alloy
having the components and percentages
TABLE-US-00021 Ag 4 wt. % Cu 0.5 wt. % Cr 0.003 wt. % Balance
tin
[0140] Base alloy: SAC305 modified by adding Ni to yield an alloy
having the components and percentages
TABLE-US-00022 Ag 3 wt. % Cu 0.5 wt. % Cr 0.005 wt. % Balance
tin
[0141] FIG. 1 shows the effect of Ni addition on IMC formation in
SAC305. It can be seen that the presence of Ni reduces the rate of
Cu.sub.3Sn growth.
[0142] FIG. 2 shows the results of ball pull tests on SAC305 with
and without the addition of Ni. It can be seen that the presence of
Ni reduces the fraction of interfacial fractures in the ball pull
test.
[0143] FIG. 3 shows the results of ball pull tests on SAC305 with
and without the addition of Cr. It can be seen that the presence of
Cr reduces the fraction of interfacial fractures in the ball pull
test.
[0144] FIG. 4 shows the results of ball pull tests (pull force) on
SAC305 with and without the addition of Cr. It can be seen that the
presence of Cr reduces the pull force.
[0145] Similar results were obtained for SAC405.
[0146] This alloy may be provided in the form of a sphere and used
in a ball grid array joint or chip scale package.
[0147] When introducing elements of the present invention or the
preferred embodiments(s) thereof, the articles "a", "an", "the" and
"said" are intended to mean that there are one or more of the
elements. The terms "comprising", "including" and "having" are
intended to be inclusive and mean that there may be additional
elements other than the listed elements.
[0148] In view of the above, it will be seen that the several
objects of the invention are achieved and other advantageous
results attained.
[0149] As various changes could be made in the above compositions
and processes without departing from the scope of the invention, it
is intended that all matter contained in the above description and
shown in the accompanying drawings shall be interpreted as
illustrative and not in a limiting sense.
* * * * *