Pandher; Ranjit
Patent Applications and Registrations
Patent applications and USPTO patent grants for Pandher; Ranjit.The latest application filed is for "sintering powder".
Company Profile
9.14.35
- Pandher; Ranjit - Plainsboro NJ
- PANDHER; Ranjit - Waterbury CT
- Pandher; Ranjit - South Plainfield NJ
- Pandher; Ranjit - Dover DE
Patent Activity
| Patent | Date |
|---|---|
| Advanced solder alloys for electronic interconnects Grant 11,411,150 - de Avila Ribas , et al. August 9, 2 | 2022-08-09 |
| Sintering Powder App 20220169905 - Ghosal; Shamik ; et al. | 2022-06-02 |
| Lead-free Solder Compositions App 20220072664 - PANDHER; Ranjit ; et al. | 2022-03-10 |
| Sintering paste Grant 11,162,007 - Ghosal , et al. November 2, 2 | 2021-11-02 |
| Low Temperature Soldering Solutions For Polymer Substrates, Printed Circuit Boards And Other Joining Applications App 20210283727 - RAUT; Rahul ; et al. | 2021-09-16 |
| Lead-free and antimony-free tin solder reliable at high temperatures Grant 11,090,768 - Choudhury , et al. August 17, 2 | 2021-08-17 |
| Multilayered Metal Nano And Micron Particles App 20210205935 - Ghoshal; Shamik ; et al. | 2021-07-08 |
| Applications Of Engineered Graphene App 20210061664 - Chaki; Nirmalya Kumar ; et al. | 2021-03-04 |
| Multilayered metal nano and micron particles Grant 10,894,302 - Ghoshal , et al. January 19, 2 | 2021-01-19 |
| Engineered polymer-based electronic materials Grant 10,682,732 - Venkatagiriyappa , et al. | 2020-06-16 |
| High Impact Solder Toughness Alloy App 20190262951 - Pandher; Ranjit ; et al. | 2019-08-29 |
| High Impact Solder Toughness Alloy App 20190255662 - Pandher; Ranjit ; et al. | 2019-08-22 |
| Sintering Powder App 20190194517 - Ghosal; Shamik ; et al. | 2019-06-27 |
| Low temperature high reliability alloy for solder hierarchy Grant 10,322,471 - Choudhury , et al. | 2019-06-18 |
| Advanced Solder Alloys For Electronic Interconnects App 20190157535 - de Avila Ribas; Morgana ; et al. | 2019-05-23 |
| Engineered Polymer-Based Electronic Materials App 20190143461 - Venkatagiriyappa; Ramakrishna Hosur ; et al. | 2019-05-16 |
| Sintering powder Grant 10,259,980 - Ghosal , et al. | 2019-04-16 |
| High Impact Solder Toughness Alloy App 20180290244 - Pandher; Ranjit ; et al. | 2018-10-11 |
| Joining to aluminum Grant 10,065,274 - Pandher , et al. September 4, 2 | 2018-09-04 |
| Advanced Solder Alloys For Electronic Interconnects App 20180102464 - de Avila Ribas; Morgana ; et al. | 2018-04-12 |
| Production of Graphene App 20180072573 - Chaki; Nirmalya Kumar ; et al. | 2018-03-15 |
| Engineered Polymer-Based Electronic Materials App 20180056455 - Venkatagiriyappa; Ramakrishna Hosur ; et al. | 2018-03-01 |
| High Impact Solder Toughness Alloy App 20170304955 - Pandher; Ranjit ; et al. | 2017-10-26 |
| Low Temperature High Reliability Alloy for Solder Hierarchy App 20170197281 - Choudhury; Pritha ; et al. | 2017-07-13 |
| High Impact Solder Toughness Alloy App 20170136583 - Pandher; Ranjit ; et al. | 2017-05-18 |
| Engineered Residue Solder Paste Technology App 20170135227 - Ramakrishna; Hosur Venkatagiriyappa ; et al. | 2017-05-11 |
| Multilayered Metal Nano and Micron Particles App 20170113306 - Ghoshal; Shamik ; et al. | 2017-04-27 |
| High Impact Solder Toughness Alloy App 20160214213 - Pandher; Ranjit ; et al. | 2016-07-28 |
| Joining To Aluminium App 20160175994 - Pandher; Ranjit ; et al. | 2016-06-23 |
| High Impact Solder Toughness Alloy App 20160144462 - Pandher; Ranjit ; et al. | 2016-05-26 |
| Solder Alloy App 20160107267 - Ingham; Anthony ; et al. | 2016-04-21 |
| Lead-free And Antimony-free Tin Solder Reliable At High Temperatures App 20160023309 - Choudhury; Pritha ; et al. | 2016-01-28 |
| Solder alloy Grant 9,221,131 - Ingham , et al. December 29, 2 | 2015-12-29 |
| Sintering Powder App 20150353804 - Ghosal; Shamik ; et al. | 2015-12-10 |
| Lead-free And Antimony-free Tin Solder Reliable At High Temperatures App 20150266137 - Choudhury; Pritha ; et al. | 2015-09-24 |
| Lead-free And Antimony-free Tin Solder Reliable At High Temperatures App 20150224604 - Choudhury; Pritha ; et al. | 2015-08-13 |
| High Impact Toughness Solder Alloy App 20140219711 - Pandher; Ranjit ; et al. | 2014-08-07 |
| Solder Compositions App 20140199115 - de Avila Ribas; Morgana ; et al. | 2014-07-17 |
| Solder alloy Grant 8,641,964 - Lewis , et al. February 4, 2 | 2014-02-04 |
| Reducing joint embrittlement in lead-free soldering processes Grant 8,191,757 - Lewis , et al. June 5, 2 | 2012-06-05 |
| Solder Alloy App 20080292492 - Ingham; Anthony E. ; et al. | 2008-11-27 |
| Solder Alloy App 20080159903 - Lewis; Brian G. ; et al. | 2008-07-03 |
| Solder Alloy App 20080159904 - Lewis; Brian G. ; et al. | 2008-07-03 |
| Reducing Joint Embrittlement In Lead-free Soldering Processes App 20080160310 - Lewis; Brian G. ; et al. | 2008-07-03 |
| Diamond based blue/UV emission source Grant 7,023,024 - Linga , et al. April 4, 2 | 2006-04-04 |
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