U.S. patent application number 11/979330 was filed with the patent office on 2008-07-03 for exposure apparatus, exposure method, and method for producing device.
This patent application is currently assigned to NIKON CORPORATION. Invention is credited to Tohru Kiuchi.
Application Number | 20080158531 11/979330 |
Document ID | / |
Family ID | 39583419 |
Filed Date | 2008-07-03 |
United States Patent
Application |
20080158531 |
Kind Code |
A1 |
Kiuchi; Tohru |
July 3, 2008 |
Exposure apparatus, exposure method, and method for producing
device
Abstract
An exposure apparatus includes a first optical member via which
an exposure beam exits; a first movable body which is movable on a
light-exit side of the first optical member; a measuring member
which is provided on the first movable body and which has an
inclined surface to which a measuring beam for position measurement
is irradiated; and a transmitting member which is provided on the
first movable body, which has an end surface protruding more
outwardly than the measuring member, and which has a transmitting
area through which the measuring beam is transmissive. When the
liquid immersion method is applied to the exposure apparatus, the
substrate can be exposed efficiently and satisfactorily.
Inventors: |
Kiuchi; Tohru;
(Higashikurume-shi, JP) |
Correspondence
Address: |
OLIFF & BERRIDGE, PLC
P.O. BOX 320850
ALEXANDRIA
VA
22320-4850
US
|
Assignee: |
NIKON CORPORATION
TOKYO
JP
|
Family ID: |
39583419 |
Appl. No.: |
11/979330 |
Filed: |
November 1, 2007 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
60959925 |
Jul 18, 2007 |
|
|
|
Current U.S.
Class: |
355/53 ;
355/77 |
Current CPC
Class: |
G03B 27/42 20130101;
G03F 7/70341 20130101; G03F 7/70733 20130101; G03F 7/70775
20130101 |
Class at
Publication: |
355/53 ;
355/77 |
International
Class: |
G03B 27/42 20060101
G03B027/42 |
Foreign Application Data
Date |
Code |
Application Number |
Nov 15, 2006 |
JP |
2006-309168 |
Claims
1. An exposure apparatus which exposes a substrate by irradiating
an exposure beam onto the substrate, the exposure apparatus
comprising: a first optical member via which the exposure beam
exits; a first movable body which is movable on a light-exit side
of the first optical member; a measuring member which is provided
on the first movable body and which has an inclined surface to
which a measuring beam for position measurement is irradiated; and
a transmitting member which is provided on the first movable body,
which has an end surface protruding more outwardly from the first
movable body than the measuring member, and which has a
transmitting area through which the measuring beam is
transmissive.
2. The exposure apparatus according to claim 1, further comprising
a second movable body which is movable independently from the first
movable body on the light-exit side of the first optical member,
wherein the measuring member is provided on each of the first
movable body and the second movable body; and the transmitting
member is provided on each of the first movable body and the second
movable body.
3. The exposure apparatus according to claim 2, wherein the
measuring member and the transmitting member are arranged in a
predetermined positional relationship for each of the first movable
body and the second movable body so that the measuring beam,
traveling along one of the inclined surface and the transmitting
area, comes into the other of the inclined surface and the
transmitting area.
4. The exposure apparatus according to claim 2, wherein the
measuring member is arranged on at least one side surface of each
of the first movable body and the second movable body so that the
inclined surface is directed upwardly; the transmitting member is a
plate-shaped member having an upper surface and a lower surface;
each of the first movable body and the second movable body has an
opposing surface which is opposable to the first optical member;
and the transmitting member is arranged at a position above the
measuring member so that the upper surface of the transmitting
member is substantially flush with a top surface of the opposing
surface of each of the first movable body and the second movable
body, and that at least a part of the lower surface of the
transmitting member is opposite to the inclined surface of the
measuring member.
5. The exposure apparatus according to claim 2, further comprising
a holding mechanism which is provided on each of the first movable
body and the second movable body and which detachably holds at
least a part of the transmitting member.
6. The exposure apparatus according to claim 4, wherein the
transmitting member is arranged so that at least a part of the
lower surface thereof is opposite to a predetermined area of the
opposing surface of one of the first movable body and the second
movable body; and the exposure apparatus further comprises an
optical sensor which is provided on each of the first movable body
and the second movable body and into which a light beam comes via
the transmitting member.
7. The exposure apparatus according to claim 1, wherein the
transmitting member has another transmitting area which is
different from the transmitting area; and another measuring beam,
which is different from the measuring beam, is transmissive through
the another transmitting area.
8. The exposure apparatus according to claim 4, further comprising:
a measuring device which receives the measuring beam via the
inclined surface of the measuring member and through the
transmitting area of the transmitting member to obtain position
information about a position of the first movable body and a
position of the second movable body; a storage device which stores
a correction amount in relation to a measured value of the
measuring device corresponding to a position of the transmitting
area of the transmitting member; and a controller which is capable
of adjusting, at least during exposure of the substrate, at least
one of the measured value of the measuring device, the position of
the first movable body, and the position of the second movable
body, based on a measurement result obtained by the measuring
device and stored information stored in the storage device.
9. The exposure apparatus according to claim 2, further comprising
a driving system which synchronously moves the first movable body
and the second movable body in a state that the end surface of the
transmitting member provided on the first movable body and the end
surface of the transmitting member provided on the second movable
body are made to be close to each other or brought into contact
with each other on a predetermined surface including an irradiation
position at which the exposure beam from the first optical member
is irradiated.
10. The exposure apparatus according to claim 9, wherein when the
driving system synchronously drives the first movable body and the
second movable body, the driving system makes the end surface of
the transmitting member provided on the first movable body and the
end surface of the transmitting member provided on the second
movable body to be close to each other or to be brought into
contact with each other to form a space capable of retaining a
liquid between the first optical member and at least one of the
transmitting members, the first movable body, and the second
movable body.
11. The exposure apparatus according to claim 2, further
comprising: an exposure station; a measuring station; and a
controller which controls movements of the first movable body and
the second movable body in the exposure station, in the measuring
station and between the exposure station and the measuring
station.
12. The exposure apparatus according to claim 11, wherein the
controller controls the movements of the first movable body and the
second movable body so that the end surface of the transmitting
member provided on the first movable body and the end surface of
the transmitting member provided on the second movable body are
close to each other or make contact with each other.
13. The exposure apparatus according to claim 12, wherein the
transmitting member provided on the first movable body has a first
extending portion which extends from the end surface thereof, the
transmitting member provided on the second movable body has a
second extending portion which extends from the end surface
thereof, and an end surface of the first extending portion and an
end surface of the second extending portion are close to each other
or make contact with each other.
14. An exposure apparatus which exposes a substrate by irradiating
an exposure beam onto the substrate, the exposure apparatus
comprising: a first optical member via which the exposure beam
exits; a first movable body which is movable on a light-exit side
of the first optical member; a measuring member which is provided
on the first movable body and which has an inclined surface to
which a measuring beam for position measurement is irradiated; a
movable member which is provided on the first movable body, which
is supported movably with respect to the first movable body, and
which has an end surface arranged in a predetermined positional
relationship with respect to the inclined surface of the measuring
member; and a driving device which moves the movable member to a
first position at which the end surface of the movable member
protrudes more outwardly from the first movable body than the
measuring member and to a second position at which the movable
member does not obstruct travel of the measuring beam at least from
the inclined surface of the measuring member.
15. The exposure apparatus according to claim 14, wherein the
driving device positions the movable member to the second position
at least during a period in which the exposure beam is irradiated
onto the substrate.
16. The exposure apparatus according to claim 14, further
comprising: a second movable body which is movable independently
from the first movable body on the light-exit side of the first
optical member; and a driving system which synchronously moves the
first movable body and the second movable body on a predetermined
surface including an irradiation position at which the exposure
beam from the first optical member is irradiated, wherein the
measuring member is provided on each of the first movable body and
the second movable body; the movable member is provided on each of
the first movable body and the second movable body, the movable
member being supported movably with respect to each of the first
movable body and the second movable body; the driving device moves
the movable member to the first position when the driving system
synchronously moves the first movable body and the second movable
body; and the driving system synchronously moves the first movable
body and the second movable body in a state that the end surface of
the movable member provided on the first movable body and the end
surface of the movable member provided on the second movable body
are close to each other or make contact with each other.
17. The exposure apparatus according to claim 16, wherein when the
driving system synchronously moves the first movable body and the
second movable body, the driving device moves the movable member to
the first position to form a space capable of retaining a liquid
between the first optical member and at least one of the movable
member, the first movable body, and the second movable body.
18. The exposure apparatus according to claim 16, wherein the
movable member is a plate-shaped member having an upper surface and
a lower surface; the measuring member is arranged on at least one
side surface of each of the first movable body and the second
movable body so that the inclined surface is directed upwardly;
each of the first movable body and the second movable body has an
opposing surface which is opposable to the first optical member;
and the movable member is arranged at a position above the
measuring member so that the upper surface of the movable member is
substantially flush with a top surface of the opposing surface of
each of the first movable body and the second movable body, and
that at least a part of the lower surface of the movable member is
opposite to the inclined surface of the measuring member.
19. The exposure apparatus according to claim 18, further
comprising: a support mechanism which is provided on each of the
first movable body and the second movable body and which supports
the movable member from a side of the lower surface thereof in a
non-contact manner; and a first holding mechanism which holds the
movable member from a side of the upper surface, wherein the
driving device moves the movable member held by the first holding
mechanism to at least one of the first position and the second
position by relatively moving the movable member held by the first
holding mechanism, the first movable body, and the second movable
body.
20. The exposure apparatus according to claim 19, wherein the first
holding mechanism is capable of forming a liquid immersion space of
the liquid in a space between the first holding mechanism and the
movable member, and the first holding mechanism holds the movable
member by forming a gas bearing in another space between the first
holding mechanism and the movable member at the outside of the
liquid immersion space.
21. The exposure apparatus according to claim 20, wherein the
driving system synchronously moves the first movable body and the
second movable body in a first direction on the predetermined
surface; and a size of the movable member in the first direction is
greater than at least a size of the liquid immersion space in the
first direction.
22. The exposure apparatus according to claim 20, further
comprising a second holding mechanism which is provided on each of
the first movable body and the second movable body and which holds
the movable member by attracting the lower surface of the movable
member arranged at least at one of the first position and the
second position.
23. The exposure apparatus according to claim 2, wherein each of
the first movable body and the second movable body is movable while
holding the substrate.
24. The exposure apparatus according to claim 16, wherein each of
the first movable body and the second movable body is movable while
holding the substrate.
25. The exposure apparatus according to claim 2, further comprising
a second optical member which is provided to obtain position
information about the substrate held by at least one of the first
movable body and the second movable body, wherein each of the first
movable body and the second movable body is movable to an opposing
position at which each of the first movable body and the second
movable body is opposite to the second optical member; and an
operation, in which the first movable body is arranged at an
irradiation position at which the exposure beam from the first
optical member is irradiated to expose the substrate held by the
first movable body, is performed concurrently with at least a part
of another operation in which the second movable body is arranged
at the opposing position opposite to the second optical member to
measure another substrate held by the second movable body.
26. The exposure apparatus according to claim 16, further
comprising a second optical member which is provided to obtain
position information about the substrate held by at least one of
the first movable body and the second movable body, wherein each of
the first movable body and the second movable body is movable to an
opposing position at which each of the first movable body and the
second movable body is opposite to the second optical member; and
an operation, in which the first movable body is arranged at the
irradiation position at which the exposure beam from the first
optical member is irradiated to expose the substrate held by the
first movable body, is performed concurrently with at least a part
of another operation in which the second movable body is arranged
at the opposing position opposite to the second optical member to
measure another substrate held by the second movable body.
27. An exposure apparatus which exposes a substrate by irradiating
an exposure beam onto the substrate, the exposure apparatus
comprising: an optical member via which the exposure beam exits; a
first movable body which is movable on a light-exit side of the
optical member; a detector which is provided on the first movable
body and which detects the exposure beam; and a transmitting plate
which is provided on the first movable body and which has a first
transmitting area which transmits a measuring beam for position
measurement of the first movable body and a second transmitting
area which transmits a detecting light beam to the detector.
28. The exposure apparatus according to claim 27, wherein the
movable body has a surface on which the substrate is placed; a
recess, in which the detector is arranged, is formed on the
surface; the transmitting plate covers the recess; and the
transmitting plate extends from the surface of the movable
body.
29. A method for producing a device, comprising using the exposure
apparatus as defined in claim 1.
30. A method for producing a device, comprising using the exposure
apparatus as defined in claim 14.
31. A method for producing a device, comprising using the exposure
apparatus as defined in claim 27.
32. An exposure method for exposing a substrate by irradiating an
exposure beam onto the substrate held by a first movable body which
has a first inclined surface reflecting a measuring beam, the
exposure method including: measuring a position of the substrate,
held by the first movable body, by receiving the measuring beam
from the first inclined surface via a first transmitting member
provided to extend from the first movable body to outside of the
first inclined surface; and exposing the substrate by irradiating
the exposure beam onto the substrate on the first movable body of
which position is measured.
33. The exposure method according to claim 32, further comprising
measuring a position of a second movable body which is movable
independently from the first movable body; wherein the second
movable body includes a second inclined surface reflecting the
measuring beam and a second transmitting member provided to extend
to outside of the second inclined surface; and a position of the
second movable body is measured by receiving the measuring beam
from the second inclined surface via the second transmitting
member.
34. The exposure method according to claim 33, wherein the
substrate is exposed at an exposure station, and the position of
the first movable body or the position of the second movable body
is measured at a measuring station disposed separately and away
from the exposure station.
35. A method for producing a device, comprising: exposing a
substrate by using the exposure method as defined in claim 32;
developing the exposed substrate; and processing the developed
substrate.
Description
CROSS-REFERENCES TO RELATED APPLICATIONS
[0001] This application claims the benefit of priority of Japanese
Patent Application No. 2006-309168 filed on Nov. 15, 2006 and U.S.
Provisional Application No. 60/959,925 filed on Jul. 18, 2007, the
entire disclosures of which are incorporated herein by
reference.
TECHNICAL FIELD
[0002] The present invention relates to an exposure apparatus which
exposes a substrate, an exposure method, and a method for producing
a device.
BACKGROUND ART
[0003] In relation to the exposure apparatus usable in the
photolithography process, a liquid immersion exposure apparatus is
known, which exposes the substrate through a liquid as disclosed in
Japanese Patent Application Laid-open Nos. 2004-289126 and
2004-289128. On the other hand, a multi-stage type (twin-stage
type) exposure apparatus is known, which is provided with a
plurality of substrate stages holding the substrates as disclosed
in Published Japanese Translation of PCT International Publication
for Patent Application No. 2000-511704, Japanese Patent Application
Laid-open Nos. 2000-323404 and 2000-505958, Published Japanese
Translation of PCT International Publication for Patent Application
No. 2001-513267, Japanese Patent Application Laid-open No.
2002-158168, and International Publication No. 2005/074014.
DISCLOSURE OF THE INVENTION
Task to Be Solved by the Invention:
[0004] In the liquid immersion exposure apparatus, when all of the
liquid is recovered every time when the substrate stage is
separated and away from the projection optical system, for example,
during the exchange of the substrate, there is such a possibility
that the throughput of the exposure apparatus is lowered. When all
of the liquid is recovered, and the state of a light-exit surface
of the projection optical system is changed from the wet state to
the dry state, then due to the vaporization of the liquid, the
adhesion trace (water mark) of the liquid is formed on the
light-exit surface of the projection optical system in some cases,
and the temperature change occurs in other cases, thereby leading
to a possibility such that the exposure accuracy is deteriorated.
Therefore, it is desirable that the light-exit surface of the
projection optical system is always wetted with the liquid.
[0005] In the multi-stage type exposure apparatus, when it is
intended to always wet the light-exit surface of the projection
optical system with the liquid by retaining or holding a cap member
(shutter member) so that the cap member (shutter member) is
opposite to or facing the light-exit surface of the projection
optical system as in the conventional technique, it is undeniable
that the possibility is present to cause any inconvenience or
problem including, for example, the falling of the cap member, the
leakage of the liquid on the cap member and the like. Further,
there is such a possibility that the throughput of the exposure
apparatus is lowered due to a delivery operation between the
substrate stage and the cap member. Therefore, it is demanded to
contrive such a technique that the light-exit surface of the
projection optical system can be always wetted with the liquid to
expose the substrate efficiently and satisfactorily even when the
liquid immersion method is applied to the multi-stage type exposure
apparatus.
[0006] The present invention has been made taking the foregoing
circumstances into consideration, an object of which is to provide
an exposure apparatus and an exposure method in which a substrate
can be exposed efficiently and satisfactorily when the liquid
immersion method is applied to the exposure apparatus, and a method
for producing a device using the exposure apparatus and the
exposure method.
Solution for the Task:
[0007] In order to achieve the object as described above, the
present invention adopts the following constructions corresponding
to respective drawings as illustrated in embodiments.
[0008] According to a first aspect of the present invention, there
is provided an exposure apparatus which exposes a substrate by
irradiating an exposure beam onto the substrate, the exposure
apparatus including: a first optical member via which the exposure
beam exits; a first movable body which is movable on a light-exit
side of the first optical member; a measuring member provided on
the first movable body and having an inclined surface to which a
measuring beam for position measurement is irradiated; and a
transmitting member provided on the first movable body, having an
end surface protruding more outwardly from the first movable body
than the measuring member, and having a transmitting area through
which the measuring beam is transmissive.
[0009] According to the first aspect of the present invention, the
substrate can be exposed efficiently and satisfactorily.
[0010] According to a second aspect of the present invention, there
is provided an exposure apparatus which exposes a substrate by
irradiating an exposure beam onto the substrate, the exposure
apparatus including: a first optical member via which the exposure
beam exits; a first movable body which is movable on a light-exit
side of the first optical member; a measuring member provided on
the first movable body and having an inclined surface to which a
measuring beam for position measurement is irradiated; a movable
member which is provided on the first movable body, which is
supported movably with respect to the first movable body, and which
has an end surface arranged in a predetermined positional
relationship with respect to the inclined surface of the measuring
member; and a driving device capable of moving the movable member
to a first position at which the end surface of the movable member
protrudes more outwardly from the first movable body than the
measuring member and to a second position at which the movable
member does not obstruct travel of the measuring beam at least from
the inclined surface of the measuring member.
[0011] According to the second aspect of the present invention, the
substrate can be exposed efficiently and satisfactorily.
[0012] According to a third aspect of the present invention, there
is provided an exposure apparatus which exposes a substrate by
irradiating an exposure beam onto the substrate, the exposure
apparatus including: an optical member via which the exposure beam
exits; a first movable body which is movable on a light-exit side
of the optical member; a detector which is provided on the first
movable body and which detects the exposure beam; and a
transmitting plate provided on the first movable body and having a
first transmitting area which transmits a measuring beam for
position measurement of the first movable body and a second
transmitting area which transmits a detecting light beam to the
detector.
[0013] According to the third aspect of the present invention, the
substrate can be exposed efficiently and satisfactorily.
[0014] According to a fourth aspect of the present invention, there
is provided a method for producing a device, including using the
exposure apparatus as defined in any one of the foregoing
aspects.
[0015] According to the fourth aspect of the present invention, the
device can be produced by using the exposure apparatus which makes
it possible to expose the substrate efficiently and
satisfactorily.
[0016] According to a fifth aspect of the present invention, there
is provided an exposure method for exposing a substrate by
irradiating an exposure beam onto the substrate held by a movable
body which has an inclined surface reflecting a measuring beam, the
exposure method including: measuring a position of the substrate,
held by the movable body, by receiving the measuring beam from the
inclined surface via a transmitting member provided to extend from
the movable body to outside of the inclined surface; and exposing
the substrate by irradiating the exposure beam onto the substrate
on the movable body of which position is measured.
[0017] According to the fifth aspect of the present invention, the
substrate can be exposed efficiently and satisfactorily.
[0018] According to a sixth aspect of the present invention, there
is provided a method for producing a device, including: exposing a
substrate by using the exposure method as defined above; developing
the exposed substrate; and processing the developed substrate.
[0019] According to the sixth aspect of the present invention, the
substrate can be exposed efficiently and satisfactorily.
BRIEF DESCRIPTION OF THE DRAWINGS
[0020] FIG. 1 is a schematic arrangement view of an exposure
apparatus according to a first embodiment.
[0021] FIG. 2 is a plan view of first and second substrate stages
and a substrate stage-driving system according to the first
embodiment.
[0022] FIG. 3 is a perspective view illustrating the vicinity of a
first substrate table according to the first embodiment.
[0023] FIG. 4 is a plan view of the first and second substrate
tables according to the first embodiment.
[0024] FIG. 5 is a side view of the first and second substrate
tables according to the first embodiment.
[0025] FIG. 6 is a side sectional view illustrating the vicinity of
a transmitting member provided on the first substrate table.
[0026] FIG. 7 schematically illustrates an exposure method
according to the first embodiment.
[0027] FIG. 8 schematically illustrates the exposure method
according to the first embodiment.
[0028] FIG. 9 schematically illustrates the exposure method
according to the first embodiment.
[0029] FIG. 10 schematically illustrates the exposure method
according to the first embodiment.
[0030] FIG. 11 schematically illustrates the exposure method
according to the first embodiment.
[0031] FIG. 12 schematically illustrates the exposure method
according to the first embodiment.
[0032] FIG. 13 schematically illustrates the exposure method
according to the first embodiment.
[0033] FIG. 14 schematically illustrates the change in measured
value of an interferometer resulting from the transmitting
member.
[0034] FIG. 15 is a perspective view of exemplary first and second
substrate tables according to a second embodiment.
[0035] FIG. 16 is a perspective view of an exemplary first
substrate table according to a third embodiment.
[0036] FIG. 17 is a side view of a first substrate table according
to a fourth embodiment.
[0037] FIG. 18 is a plan view of a part of the first substrate
table according to the fourth embodiment.
[0038] FIG. 19 is a side sectional view of a part of the first
substrate table according to the fourth embodiment.
[0039] FIG. 20 is a side sectional view of the first substrate
table according to the fourth embodiment.
[0040] FIG. 21 is a side sectional view of the first substrate
table according to the fourth embodiment.
[0041] FIGS. 22A to 22D schematically illustrate an exposure method
according to the fourth embodiment.
[0042] FIG. 23 is a flow chart illustrating exemplary steps of
producing a microdevice.
[0043] FIG. 24 is a flow chart illustrating the exposure method of
the present invention.
BEST MODE FOR CARRYING OUT THE INVENTION
[0044] Embodiments of the present invention will be explained below
with reference to the drawings. However, the present invention is
not limited to the illustrated embodiments. In the following
description, the XYZ rectangular coordinates system is defined. The
positional relationship in relation to the respective members will
be explained with reference to the XYZ rectangular coordinates
system. An X axis direction is a predetermined direction in a
horizontal plane, a Y axis direction is a direction which is
perpendicular to the X axis direction in the horizontal plane, and
a Z axis direction is a direction which is perpendicular to the X
axis direction and the Y axis direction respectively (i.e., the
vertical direction). The directions of rotation (inclination) about
the X axis, the Y axis, and the Z axis are designated as .theta.X,
.theta.Y, and .theta.Z directions respectively.
First Embodiment
[0045] A first embodiment will be explained. FIG. 1 is a schematic
arrangement view of an exposure apparatus EX according to the first
embodiment. In this embodiment, an explanation will be made as
exemplified by a case in which the exposure apparatus EX is an
exposure apparatus of the multi-stage type (twin-stage type)
provided with a plurality of (two) substrate stages 1, 2 each of
which is movable while holding a substrate P as disclosed, for
example, in Japanese Patent Application Laid-open No. 10-163099,
Japanese Patent Application Laid-open No. 10-214783 (corresponding
to U.S. Pat. No. 6,590,634), Published Japanese Translation of PCT
International Publication for Patent Application Nos. 2000-505958
(corresponding to U.S. Pat. No. 5,969,441) and 2000-511704
(corresponding to U.S. Pat. No. 5,815,246), Japanese Patent
Application Laid-open Nos. 2000-323404 (corresponding to U.S. Pat.
No. 6,674,510) and 2000-505958 (corresponding to U.S. Pat. No.
5,969,081), Published Japanese Translation of PCT International
Publication for Patent Application No. 2001-513267 (corresponding
to U.S. Pat. No. 6,208,407), and Japanese Patent Application
Laid-open No. 2002-158168 (corresponding to U.S. Pat. No.
6,710,849). That is, in this embodiment, the exposure apparatus EX
has the first substrate stage 1 which is movable while holding the
substrate P, and the second substrate stage 2 which is movable
while holding the substrate P independently from the first
substrate stage 1. The multi-stage type (twin-stage type) exposure
apparatus is disclosed in U.S. Pat. Nos. 6,341,007, 6,400,441,
6,549,269, 6,590,634, contents of which are incorporated herein by
reference within a range of permission of the domestic laws and
ordinances of the designated state or the selected state.
[0046] With reference to FIG. 1, the exposure apparatus EX includes
a mask stage 3 which is movable while holding a mask M, a first
substrate stage 1 which is movable while holding the substrate P, a
second substrate stage 2 which is movable while holding another
substrate P independently from the first substrate stage 1, a mask
stage-driving system 4 which moves the mask stage 3, a substrate
stage-driving system 5 which moves the first substrate stage 1 and
the second substrate stage 2, a measuring system 6 including laser
interferometers 6Px, 6Py, 6Pz, 6M which measure the position
information about the stages 1, 2, 3 respectively, an illumination
system IL which illuminates the mask M with an exposure beam EL
(exposure light EL), a projection optical system PL which projects,
onto the substrate P, an image of a pattern of the mask M
illuminated with the exposure light EL, a controller 7 which
controls the operation of the entire exposure apparatus EX, and a
storage device 10 which is connected to the controller 7 and which
stores various information in relation to the exposure.
[0047] The substrate P referred to herein is a substrate for
producing a device, and includes, for example, substrates in which
various films of, for example, a photosensitive material
(photoresist) and a protective film (top coat film) are formed on a
base material including, for example, a semiconductor wafer such as
a silicon wafer. The mask M includes a reticle on which a device
pattern to be projected onto the substrate P is formed. For
example, a predetermined pattern is formed by using a
light-shielding film such as chromium on a transparent plate member
such as a glass plate. In this embodiment, a transmission type mask
is used as the mask M. However, it is also possible to use a
reflection type mask. The transmission type mask is not limited to
a binary mask on which the pattern is formed with the
light-shielding film. The transmission type mask also includes, for
example, a phase shift mask of the spatial frequency modulation
type or the half tone type.
[0048] The exposure apparatus EX is provided with an exposure
station ST1 in which the exposure light EL is irradiated onto the
substrate P, and a measuring station ST2 in which the predetermined
measurement in relation to the exposure and the exchange of the
substrate P are performed. The exposure apparatus EX is provided
with a base member BP having a guide surface GF which movably
supports each of the first substrate stage 1 and the second
substrate stage 2. The first substrate stage 1 and the second
substrate stage 2 are movable on the guide surface GF between the
exposure station ST1 and the measuring station ST2 while holding
the substrates P respectively. In this embodiment, the guide
surface GF is substantially parallel to the XY plane. The first
substrate stage 1 and the second substrate stage 2 are movable in
the XY directions (two-dimensional directions) and in .theta.Z
direction along the guide surface GF.
[0049] The illumination system IL, the mask stage 3, the projection
optical system PL and the like are arranged in the exposure station
ST1. The projection optical system PL has a plurality of optical
elements. A terminal end optical element 8 (final optical element
8), which is closest to the image plane of the projection optical
system PL among the plurality of optical elements of the projection
optical system PL, has a light-exit surface (lower surface) via
which the exposure light EL exits. The first substrate stage 1 is
movable on the light-exit side of the terminal end optical element
8, of the projection optical system PL, via which the exposure
light EL exits (movable on the image plane side of the projection
optical system PL). The second substrate stage 2 is movable
independently from the first substrate stage 1 on the light-exit
side of the terminal end optical element 8 of the projection
optical system PL (on the image plane side of the projection
optical system PL). Although not shown, the projection optical
system PL is provided on a barrel surface plate which is supported
by three support columns via an anti-vibration mechanism. However,
as disclosed, for example, in International Publication No.
2006/038952, the projection optical system PL may be supported by
hanging the projection optical system PL, for example, with respect
to an unillustrated main frame member arranged at a position above
or over the projection optical system PL, or with respect to the
mask base in which the mask stage 3 is placed.
[0050] Various measuring devices capable of executing the
measurement in relation to the exposure of the substrate P,
including, for example, a focus/leveling-detecting system FL and an
alignment system AL which obtain the position information about the
substrate P held by at least one of the first substrate stage 1 and
the second substrate stage 2, are arranged in the measuring station
ST2. The alignment system AL has a plurality of optical elements.
The alignment system AL obtains the position information about the
substrate P by using the optical elements. The
focus/leveling-detecting system FL also has a plurality of optical
elements. The focus/leveling-detecting system FL also obtains the
position information about the substrate P by using the optical
elements.
[0051] A transport system H is provided in the vicinity of the
measuring station ST2 in order to exchange the substrate P. By
using the transport system H, the controller 7 is capable of
executing the substrate exchange operation in which the substrate P
for which the exposure process has been performed is unloaded from
the first substrate stage 1 (or the second substrate stage 2) moved
to the substrate exchange position (loading position) of the
measuring station ST2, and another substrate P to be subjected to
the exposure process is loaded onto the first substrate stage 1 (or
the second substrate stage 2). In this embodiment, although the
loading position and the unloading position are located in a same
position in the measuring station ST2, the loading and unloading
may be performed at different positions.
[0052] The exposure apparatus EX of the embodiment of the present
invention is the liquid immersion exposure apparatus to which the
liquid immersion method is applied in order that the exposure
wavelength is substantially shortened to improve the resolution and
the depth of focus is substantially widened. The exposure apparatus
EX is provided with a nozzle member 30 which is capable of forming
a liquid immersion space LS for the liquid LQ so that the optical
path space for the exposure light EL is filled with the liquid LQ.
The optical path space for the exposure light EL is a space which
includes the optical path in which the exposure light EL travels.
The liquid immersion space LS is the space which is filled with the
liquid LQ. The nozzle member 30 is also referred to as "liquid
immersion space forming member" or "containment member (confinement
member), etc. The exposure apparatus EX irradiates the exposure
light EL onto the substrate P via the projection optical system PL
and the liquid LQ to expose the substrate P.
[0053] The nozzle member 30 includes a seal member which is
disclosed, for example, in Japanese Patent Application Laid-open
Nos. 2004-289126 (corresponding to U.S. Pat. No. 6,952,253) and
2004-289128 (corresponding to U.S. Pat. No. 7,110,081). The nozzle
member 30 is provided with a flow passage for supplying and
recovering the liquid LQ with respect to the optical path space for
the exposure light EL. The flow passage is omitted from the
illustration in the drawings. A liquid supply device (not shown)
which supplies the liquid LQ to the optical path space for the
exposure light EL and a liquid recovery device (not shown) which
recovers the liquid LQ are connected to the flow passage. The
liquid supply device is capable of supplying the liquid LQ for
forming the liquid immersion space LS to the optical path space for
the exposure light EL via the flow passage. The liquid recovery
device is capable of recovering the liquid LQ in the liquid
immersion space LS via the flow passage. The liquid supply device
includes a liquid supply section which is capable of feeding out
the liquid LQ, a supply tube which has one end connected to the
liquid supply section, a tank which accommodates the liquid LQ, a
filter, a pressurizing pump, and the like. The liquid recovery
device includes a liquid recovery section which is capable of
recovering the liquid LQ, a recovery tube which has one end
connected to the liquid recovery section, a tank which accommodates
the liquid LQ, a filter, a suction pump, and the like. It is not
necessarily indispensable that the exposure apparatus EX is
provided with all of the liquid supply device and the liquid
recovery device as well as the tank, filter unit, pump and the like
constructing each of the liquid supply and recovery devices. Any
equipment of the factory or the like, in which the exposure
apparatus EX is installed, may be used instead of all or a part(s)
of the liquid supply and recovery devices.
[0054] In this embodiment, water (pure or purified water) is used
as the liquid LQ. Not only the ArF excimer laser beam but also the
emission line radiated, for example, from a mercury lamp and the
far ultraviolet light beam (DUV light beam) such as the KrF excimer
laser beam are transmissive through pure water. The optical element
8 is formed of calcium fluoride (CaF.sub.2). Calcium fluoride has a
high affinity for water. Therefore, the liquid LQ can make tight
contact with approximately the entire surface of a liquid contact
surface 2a of the optical element 8. The optical element 8 may be
silica glass having high affinity for water.
[0055] As the nozzle member 30, it is also allowable to use nozzle
members having structures disclosed, for example, in International
Publication No. 2004/086468 (corresponding to United States Patent
Application Publication No. 2005/0280791), International
Publication No. 2005/024517, European Patent application
publication No. 1420298, International Publication Nos.
2004/055803, 2004/057589 and 2004/057590, International Publication
No. 2005/029559 (corresponding to United States Patent Application
Publication No. 2006/0231206), U.S. Pat. No. 6,952,253, and the
like.
[0056] The nozzle member 30 is capable of forming the liquid
immersion space LS between the nozzle member 30 and an object
opposite to or facing the nozzle member 30. In this embodiment, the
nozzle member 30 is arranged in the vicinity of the terminal end
optical element 8 of the projection optical system PL. The liquid
immersion space LS can be formed between the nozzle member 30 and
the object arranged at a position at which the exposure light EL
can be irradiated, i.e., between the nozzle member 30 and the
object arranged at the position opposite to the light-exit surface
of the terminal end optical element 8, on the light-exit side of
the terminal end optical element 8 (on the image plane side of the
projection optical system PL). The nozzle member 30 forms the
liquid immersion space LS of the liquid LQ to fill, with the liquid
LQ, the optical path space for the exposure light EL on the
light-exit side of the terminal end optical element 8, specifically
the optical path space for the exposure light EL between the
terminal end optical element 8 and the object by retaining the
liquid LQ between the nozzle member 30 and the object.
[0057] The nozzle member 30 is provided, for example, with a supply
port formed in an inner surface of the nozzle member 30 opposite to
or facing the optical element 8 of the projection optical system
PL; a recovery port formed in a lower surface (bottom surface) of
the nozzle member 30 to which an object is arranged to be opposite
or facing; a supply flow passage formed in the nozzle member 30 and
connected to the supply tube of the liquid supply device; and a
recovery flow passage formed in the nozzle member 30 and connected
to the recovery tube of the liquid recovery device. The supply port
may include a first supply port which is formed on the side in the
+X direction of the optical element 8, and a second supply port
which is formed on the side in the -X direction of the optical
element 8. The first and second supply ports may be arranged to
interpose the projection area in the X direction. The supply port
may have, for example, a rectangular form which is long in the Y
direction, a circular arc-shaped form, or the like. The recovery
port may be formed to be a rectangular frame-shaped recovery port
(or optionally, for example, circular-shaped recovery port)
arranged to surround the optical element 8 of the projection
optical system PL, and the recovery port may be provided outside
the supply port with respect to the optical element 8.
Alternatively, the supply port may be a groove-shaped recess, and
may be provided with a mesh filter, which is a porous member formed
with a large number of small holes or pores in a mesh form and
fitted to cover the recovery port.
[0058] The nozzle member 30 may be supported and hung with respect
to the main frame (not shown) which holds the projection optical
system PL. Alternatively, the nozzle member 30 may be provided on
another frame member separate from the main frame. Further
alternatively, when the projection optical system PL is supported
in a hanging manner, the nozzle member 30 may be supported by being
hung integrally with the projection optical system PL, or the
nozzle member 30 may be provided, for example, on a measuring frame
which is hung and supported independently from the projection
optical system PL. In the case of the latter, it is also allowable
that the projection optical system PL is not supported in a hanging
manner.
[0059] The object, which is opposable (can be opposite) to the
nozzle member 30 and the terminal end optical element 8, include
any object which has an opposing surface which is opposable to or
which can face the terminal end optical element 8, and which is
movable on the light-exit side of the terminal end optical element
8. In this embodiment, the object, which can be opposite to the
nozzle member 30 and the terminal end optical element 8, includes
at least one of the first substrate stage 1 and the second
substrate stage 2 which are movable on the light-exit side of the
terminal end optical element 8. The object, which can be opposite
to or can face the nozzle member 30 and the terminal end optical
element 8, also includes the substrate P held by each of the first
and second substrate stages 1, 2. The first and second substrate
stages 1, 2 (first and second substrate tables 12, 22) have
opposing surfaces 15, capable of being opposite to the nozzle
member 30 and the terminal end optical element 8, respectively.
Each of the first and second substrate stages 1, 2 is movable to a
position at which the opposing surface can be opposite to or can
face the nozzle member 30 and the terminal end optical element 8,
and at which a space, capable of retaining the liquid LQ between at
least a part of the opposing surface 15, 25 and the nozzle member
30 and the terminal end optical element 8, can be formed. Note that
the object may include a measuring stage which will be explained
later. Further, the liquid immersion space LS formed between the
object and the nozzle member 30 and the terminal end optical
element 8 is referred, on the object, simply to as "liquid
immersion area" or the like.
[0060] The nozzle member 30 can form the liquid immersion space LS
of the liquid LQ between the nozzle member 30 and the terminal end
optical element 8 and the first and second substrate stages 1, 2 by
retaining the liquid LQ between the nozzle member 30 and the
terminal end optical element 8 and at least a part or parts of the
opposing surfaces 15, 25 of the first and second stages 1, 2 so
that the optical path space for the exposure light EL on the
light-exit side of the terminal end optical element 8 is filled
with the liquid LQ.
[0061] In this embodiment, the nozzle member 30 forms the liquid
immersion space LS between the object (at least one of the first
substrate stage 1, the second substrate stage 2, and the substrate
P) and the terminal end optical element 8 and the nozzle member 30
so that a partial area (local area) of a surface of the object is
covered with the liquid LQ of the liquid immersion space LS. That
is, in this embodiment, the exposure apparatus EX adopts the local
liquid immersion system in which the liquid immersion space LS is
formed between the substrate P and the terminal end optical element
8 and the nozzle member 30 so that the partial area on the
substrate P is covered with the liquid LQ of the liquid immersion
space LS at least during the exposure of the substrate P. In this
embodiment, a local liquid immersion apparatus (liquid immersion
system) which forms the liquid immersion space LS is constructed by
including the nozzle member 30 and the like. Note that when the
exposure is performed for a shot area located in the circumference
(edge) portion of the substrate P, the liquid immersion space LS
extends (protrudes) also to the outside of the substrate P, thereby
covering a part of the opposing surface 15 and a part of the
opposing surface 25 as well.
[0062] In this embodiment, as described later on, the exposure
apparatus EX is provided with measuring mirrors 1Rz, 2Rz provided
on or for the first substrate stage 1 and the second substrate
stage 2 respectively and having inclined surfaces (surfaces
inclined with respect to the XY plane) to which measuring beam
(measuring light) ML for the position measurement from the laser
interferometer 6Pz is irradiated; and predetermined members 81, 82
(hereinafter referred to as "transmitting members") provided on or
for the first substrate stage 1 and the second substrate stage 2
respectively, having end surfaces protruding outwardly in the XY
plane than the measuring mirrors 1Rz, 2Rz respectively, and having
transmitting areas through which the measuring light ML is
transmissive. The transmitting member 81 is provided for the first
substrate stage 1, and the transmitting member 82 is provided for
the second substrate stage 2. Each of the transmitting members 81,
82 is a plate-shaped member having upper and lower surfaces. Each
of the transmitting members 81, 82 is capable of forming the space
in which the liquid LQ can be retained, between the nozzle member
30 and the terminal end optical element 8. The transmitting member
may be provided for only one of the first and second substrate
stages 1, 2.
[0063] The alignment system AL of the measuring station ST2 has an
optical element 9 which can be opposite to the object (at least one
of the first substrate stage 1, the second substrate stage 2, and
the substrate P). Each of the first substrate stage 1 and the
second substrate stage 2 is movable to a position opposite to the
optical element 9 of the alignment system AL. The alignment system
AL detects, for example, an alignment mark on the substrate P and
reference marks on the first and second substrate stages 1, 2 via
the optical element 9 to obtain the position information about the
substrate P held by at least one of the first substrate stage 1 and
the second substrate stage 2.
[0064] In the following description, the terminal end optical
element 8, of the projection optical system PL, via which the
exposure light EL exits and which is arranged in the exposure
station ST1, is appropriately referred to as "first optical element
8". The optical element 9 of the alignment system AL for obtaining
the position information about the substrate P, which is arranged
in the measuring station ST2, is appropriately referred to as
"second optical element 9". The position, which is opposite to the
first optical element 8 and onto which the exposure light EL from
the first optical element 8 is irradiated, is appropriately
referred to as "irradiation position". The position, which is
opposite to the second optical element 9, is appropriately referred
to as "opposing position (opposite position)". Since the substrate
P is exposed at the irradiation position, the irradiation position
can be also referred to as "exposure portion". Further, since the
mark detection is performed at the opposing position, the opposing
position can also be referred to as "detection position" or
"measurement position".
[0065] Therefore, the first substrate stage 1 and the second
substrate stage 2 are movable while holding the substrates P
respectively in the predetermined area on the guide surface GF
including the position which is opposite to the first optical
element 8 and at which the exposure light EL is irradiated from the
first optical element 8 and the position which is opposite to the
second optical element 9.
[0066] The exposure apparatus EX of the embodiment of the present
invention is the scanning type exposure apparatus (so-called
scanning stepper) in which the image of the pattern of the mask M
is projected onto the substrate P while synchronously moving the
mask M and the substrate P in the predetermined scanning
directions. In the embodiment of the present invention, the Y axis
direction is the scanning direction (synchronous movement
direction) for the substrate P. The scanning direction (synchronous
movement direction) for the mask M is also the Y axis direction.
The exposure apparatus EX irradiates the exposure light EL onto the
substrate P via the projection optical system PL and the liquid LQ
while moving the substrate P in the Y axis direction with respect
to the projection area of the projection optical system PL and
moving the mask M with respect to an illumination area of the
illumination system IL in synchronization with the movement of the
substrate P in the Y axis direction so that the substrate P is
exposed. Accordingly, the image of the pattern of the mask M is
projected onto the substrate P.
[0067] The illumination system IL illuminates a predetermined
illumination area on the mask M with the exposure light EL having a
uniform illuminance distribution. Lights usable as the exposure
light EL irradiated from the illumination system IL include, for
example, emission lines (g-ray, h-ray, i-ray) irradiated, for
example, from a mercury lamp, far ultraviolet light beams (DUV
light beams) such as the KrF excimer laser beam (wavelength: 248
nm), and vacuum ultraviolet light beams (VUV light beams) such as
the ArF excimer laser beam (wavelength: 193 nm) and the F.sub.2
laser beam (wavelength: 157 nm). In this embodiment, the ArF
excimer laser beam is used as the exposure light EL.
[0068] The mask stage 3 is movable in the X axis direction, the Y
axis direction, and the .theta.Z direction while holding the mask M
by the mask stage-driving system 4 including, for example, an
actuator such as a linear motor. The position information about the
mask stage 3 (mask M) is measured by the laser interferometer 6M of
the measuring system 6. The laser interferometer 6M measures the
position information about the mask stage 3 in relation to the X
axis direction, the Y axis direction, and the .theta.Z direction by
using the measuring mirror 3R provided on the mask stage 3. The
controller 7 drives the mask stage-driving system 4 based on the
measurement result of the measuring system 6 to control the
position of the mask M held by the mask stage 3.
[0069] The projection optical system PL projects the image of the
pattern of the mask M onto the substrate P at a predetermined
projection magnification. The projection optical system PL has a
plurality of optical elements. The optical elements are supported
by a barrel PK. In this embodiment, the projection optical system
PL is a reduction system having the projection magnification of,
for example, 1/4, 1/5, 1/8 or the like. The projection optical
system PL may be any one of the 1.times. magnification system and
the magnifying system. In this embodiment, an optical axis AX of
the projection optical system PL is parallel to the Z axis
direction. The projection optical system PL may be any one of the
dioptric system including no catoptric optical element, the
catoptric system including no dioptric optical element, and the
catadioptric system including catoptric and dioptric optical
elements. The projection optical system PL may form any one of the
inverted image and the erecting image.
[0070] The exposure light EL, which is radiated from the
illumination system IL and which passes via the mask M, comes into
the projection optical system PL from the object plane side of the
projection optical system PL. the projection optical system PL is
capable of making the exposure light EL, incident from the object
plane side, to exit from the light-exit surface (lower surface) of
the first optical element 8 so that the substrate P is irradiated
therewith.
[0071] The first substrate stage 1 has a body 11 of the stage
(stage body 11), and a first substrate table 12 which is supported
by the stage body 11 and which has a substrate holder 13 for
detachably holding the substrate P. The stage body 11 is supported
in a non-contact manner by, for example, an air bearing 14 on or
over the upper surface (guide surface GF) of the base member BP.
The first substrate table 12 has a recess 12C. The substrate holder
13 is arranged in the recess 12C. A partial area of the opposing
surface 15, which is disposed around the recess 12C of the first
substrate table 12, is substantially flat, and has an approximately
same height as that of (flush with) the surface of the substrate P
held by the substrate holder 13. That is, the first substrate table
12 has the opposing surface 15 having the area which is
substantially flush with the surface of the substrate P held by the
substrate holder 13 of the first substrate table 12. The first
substrate stage 1 is movable, by the substrate stage-driving system
5, in the directions of six degrees of freedom of the X axis, Y
axis, Z axis, .theta.X, .theta.Y, and .theta.Z directions on the
base member BP while holding the substrate P with the substrate
holder 13.
[0072] The second substrate stage 2 has a body of the stage (stage
body) 21, and a second substrate table 22 which is supported by the
stage body 21 and which has a substrate holder 23 for detachably
holding the substrate P. The stage body 21 is supported in a
non-contact manner by, for example, an air bearing 24 on or over
the upper surface (guide surface GF) of the base member BP. The
second substrate table 22 has a recess 22C. The substrate holder 23
is arranged in the recess 22C. A partial area of the opposing
surface 25, which is disposed around the recess 22C of the second
substrate table 22, is substantially flat, and has an approximately
same height as that of (flush with) the surface of the substrate P
held by the substrate holder 23. That is, the second substrate
table 22 has the opposing surface 25 having the area which is
substantially flush with the surface of the substrate P held by the
substrate holder 23 of the second substrate table 22. The second
substrate stage 2 is movable, by the substrate stage-driving system
5, in the directions of six degrees of freedom of the X axis, Y
axis, Z axis, .theta.X, .theta.Y, and .theta.Z directions on the
base member BP while holding the substrate P with the substrate
holder 23.
[0073] The first substrate stage 1, including the stage body 11 and
the first substrate table 12, has approximately same shape and
approximately same size as those of the second substrate stage 2
including the stage body 21 and the second substrate table 22, and
the first and second substrate stages 1, 2 are constructed
approximately in the same manner. In this embodiment, the first and
second substrate tables 12, 22 of the first and second substrate
stages 1, 2 are substantially rectangular in the XY plane
respectively.
[0074] The substrate stage-driving system 5 includes, for example,
an actuator such as a linear motor, and is capable of moving each
of the first substrate stage 1 and the second substrate stage 2.
The substrate stage-driving system 5 is provided with a coarse
movement system 5A which moves each of the stage bodies 11, 21 on
the base member BP, and a fine movement system 5B which moves the
substrate tables 12, 22 on the stage bodies 11, 21,
respectively.
[0075] The coarse movement system 5A includes, for example, an
actuator such as a linear motor, and is capable of moving each of
the stage bodies 11, 21 on the base member BP in the X axis
direction, the Y axis direction, and the .theta.Z direction. When
the stage bodies 11, 21 are moved in the X axis direction, the Y
axis direction, and the .theta.Z direction by the coarse movement
system 5A, the substrate tables 12, 22, which are provided on the
stage bodies 11, 21 respectively, are also moved in the X axis
direction, the Y axis direction, and the .theta.Z direction
together with the stage bodies 11, 21 respectively.
[0076] FIG. 2 shows the first substrate stage 1 and the second
substrate stage 2 as viewed from an upper position. With reference
to FIG. 2, the coarse movement system 5A, which is provided to move
the first substrate stage 1 and the second substrate stage 2,
includes a plurality of linear motors 42, 43, 44, 45, 46, 47. The
coarse movement system 5A is provided with a pair of Y axis guide
members 31, 32 which extend in the Y axis direction. Each of the Y
axis guide members 31, 32 is provided with a magnet unit having a
plurality of permanent magnets. The Y axis guide member 31, which
is one of the pair, supports two slide members 35, 36 movably in
the Y axis direction; and the Y axis guide member 32, which is the
other of the pair, supports two slide members 37, 38 movably in the
Y axis direction. Each of the slide members 35, 36, 37, 38 is
provided with a coil unit having an armature coil. That is, in this
embodiment, Y axis linear motors 42, 43, 44, 45 of the moving coil
type are formed by the slide members 35, 36, 37, 38 each having the
coil unit and the Y axis guide members 31, 32 each having the
magnet unit.
[0077] The coarse movement system 5A is provided with a pair of X
axis guide members 33, 34 which extend in the X axis direction.
Each of the X axis guide members 33, 34 is provided with a coil
unit having an armature coil. The X axis guide member 33, which is
one of the pair, supports a slide member 51 movably in the X axis
direction; and the X axis guide member 34, which is the other of
the pair, supports a slide member 52 movably in the X axis
direction. Each of the slide members 51, 52 is provided with a
magnet unit having a plurality of permanent magnets. With reference
to FIGS. 1 and 2, the slide member 51 is connected to the stage
body 11 of the first substrate stage 1, and the slide member 52 is
connected to the stage body 21 of the second substrate stage 2.
That is, in this embodiment, an X axis linear motor 46 of the
moving magnet type is formed by the slide member 51 having the
magnet unit and the X axis guide member 33 having the coil unit.
Similarly, an X axis linear motor 47 of the moving magnet type is
formed by the slide member 52 having the magnet unit and the X axis
guide member 34 having the coil unit. With reference to FIGS. 1 and
2, the first substrate stage 1 (stage body 11) is moved in the X
axis direction by the X axis linear motor 46, and the second
substrate stage 2 (stage body 21) is moved in the X axis direction
by the X axis linear motor 47.
[0078] The slide members 35, 37 are fixed to one end and the other
end of the X axis guide member 33 respectively, and the slide
members 36, 38 are fixed to one end and the other end of the X axis
guide member 34 respectively. Therefore, the X axis guide member 33
is movable in the Y axis direction by the Y axis linear motors 42,
44, and the X axis guide member 34 is movable in the Y axis
direction by the Y axis linear motors 43, 45. With reference to
FIGS. 1 and 2, the first substrate stage 1 (stage body 11) is moved
in the Y axis direction by the Y axis linear motors 42, 44, and the
second substrate stage 2 (stage body 21) is moved in the Y axis
direction by the Y axis linear motors 43, 45.
[0079] By making the thrust forces, which are generated by the pair
of Y axis linear motors 42, 44 respectively, to be slightly
different from each other, it is possible to control the position
of the first substrate stage 1 in the .theta.Z direction. By making
the thrust forces, which are generated by the pair of Y axis linear
motors 43, 45 respectively, to be slightly different from each
other, it is possible to control the position of the second
substrate stage 2 in the .theta.Z direction.
[0080] In this embodiment, the substrate tables 12, 22 are
supported movably by the stage bodies 11, 21.
[0081] As shown in FIG. 1, the fine movement system 5B includes
actuators 11V, 21V such as voice coil motors intervening between
the stage bodies 11, 21 and the substrate tables 12, 22
respectively; and unillustrated measuring devices (for example, an
encoder system) for measuring the driving amount of each of the
actuators. The fine movement system 5B is capable of moving the
substrate tables 12, 22 on the stage bodies 11, 21 respectively in
at least the Z axis, .theta.X, and .theta.Y directions. The fine
movement system 5B is capable of moving (finely moving) the
substrate tables 12, 22 on the stage bodies 11, 21 respectively in
the X axis, Y axis, and .theta.Z directions.
[0082] In this way, the driving system 5, which includes the coarse
movement system 5A and the fine movement system 5B, is capable of
moving each of the first substrate table 12 and the second
substrate table 22 in the directions of six degrees of freedom of
the X axis, Y axis, Z axis, .theta.X, .theta.Y, and .theta.Z
directions.
[0083] The first substrate stage 1 (stage body 11) and the second
substrate stage 2 (stage body 21) are releasably connected to the
slide members 51, 52 respectively via joint members as disclosed,
for example, in Published Japanese Translation of PCT International
Publication for Patent Application Nos. 2000-505958 (corresponding
to U.S. Pat. No. 5,969,441) and 2000-511704 (corresponding to U.S.
Pat. No. 5,815,246) and Japanese Patent Application Laid-open No.
2001-223159 (corresponding to U.S. Pat. No. 6,498,350).
[0084] As shown in FIGS. 1 and 2, the first substrate stage 1 is
provided with a first joint member 61 which is provided on a side
surface of the stage body 11 on the -Y side, and a second joint
member 62 which is provided on a side surface on the +Y side.
Similarly, the second substrate stage 2 is provided with a third
joint member 63 which is provided on a side surface of the stage
body 21 on the -Y side, and a fourth joint member 64 which is
provided on a side surface on the +Y side.
[0085] On the other hand, the substrate stage-driving system 5 is
provided with a joint member 53 which is provided on the slide
member 51, and a joint member 54 which is provided on the slide
member 52. The joint member 53 is provided on the side surface of
the slide member 51 on the +Y side so that the joint member 53 is
directed toward the measuring station ST2 (+Y side). The joint
member 54 is provided on the side surface of the slide member 52 on
the -Y side so that the joint member 54 is directed toward the
exposure station ST1 (-Y side).
[0086] The slide member 51 and the joint member 53 are releasably
connected to each other as described later on. The slide member 51
and the joint member 53 are movable together. The slide member 52
and the joint member 54 are fixed to each other. The slide member
52 and the joint member 54 are movable together. Therefore, the
linear motors 42, 44, 46 are capable of moving the slide member 51
and the joint member 53 together, and the linear motors 43, 45, 47
are capable of moving the slide member 52 and the joint member 54
together.
[0087] The first joint member 61 of the stage body 11 and the third
joint member 63 of the stage body 21 are successively connected
releasably to the joint member 53 provided for the slide member 51.
The second joint member 62 of the stage body 11 and the fourth
joint member 64 of the stage body 21 are successively connected
releasably to the joint member 54 provided for the slide member
52.
[0088] That is, the stage body 11 of the first substrate stage 1
and the stage body 21 of the second substrate stage 2 are
successively connected releasably to the joint member 53 provided
for the slide member 51 via the first joint member 61 and the third
joint member 63. The stage body 11 of the first substrate stage 1
and the stage body 21 of the second substrate stage 2 are
successively connected releasably to the joint member 54 provided
for the slide member 52 via the second joint member 62 and the
fourth joint member 64.
[0089] In the following description, the joint member 53 to which
the stage body 11 of the first substrate stage 1 and the stage body
21 of the second substrate stage 2 are successively connected
releasably and the slide member 51 which is fixed to the joint
member 53 are appropriately referred to as "first connecting member
71" in combination. Further, the joint member 54 to which the stage
body 11 of the first substrate stage 1 and the stage body 21 of the
second substrate stage 2 are successively connected releasably and
the slide member 52 which is fixed to the joint member 54 are
appropriately referred to as "second connecting member 72" in
combination.
[0090] Therefore, the linear motors 42, 44, 46 are capable of
moving the first connecting member 71. The linear motors 43, 45, 47
move the second connecting member 72.
[0091] As shown in FIG. 2, the exposure apparatus EX is provided
with a first area SP1, a second area SP2, a third area SP3, and a
fourth area SP4 which are defined on the base member BP. The first
area SP1 includes the position opposite to the first optical
element 8 of the projection optical system PL, and is an area
defined on at least a part of the exposure station ST1. The second
area SP2 is an area different from the first area SP1. The second
area SP2 includes the position opposite to the second optical
element 9 of the alignment system AL, and is an area defined on at
least a part of the measuring station ST2. The first area SP1 and
the second area SP2 are defined in the Y axis direction. In this
embodiment, the first area SP1 is arranged on the -Y side of the
second area SP2. The third area SP3 and the fourth area SP4 are
arranged between the first area SP1 and the second area SP2. The
third area SP3 and the fourth area SP4 are defined in the X axis
direction intersecting the Y axis direction. In this embodiment,
the third area SP3 is arranged on the +X side of the fourth area
SP4.
[0092] The first substrate stage 1 is movable, by the substrate
stage-driving system 5, while holding the substrate P in the
predetermined area on the base member BP including the first area
SP1 and the second area SP2. Similarly, the second substrate stage
2 is movable, by the substrate stage-driving system 5, while
holding the substrate P independently from the first substrate
stage 1 in the predetermined area on the base member BP including
the first area SP1 and the second area SP2.
[0093] In this embodiment, when the first substrate stage 1 is
moved from the second area SP2 to the first area SP1, the first
substrate stage 1 is moved from the second area SP2 to the first
area SP1 via at least a part of the third area SP3. When the first
substrate stage 1 is moved from the first area SP1 to the second
area SP2, the first substrate stage 1 is moved from the first area
SP1 to the second area SP2 via at least a part of the third area
SP3. When the second substrate stage 2 is moved from the second
area SP2 to the first area SP1, the second substrate stage 2 is
moved from the second area SP2 to the first area SP1 via at least a
part of the fourth area SP4. When the second substrate stage 2 is
moved from the first area SP1 to the second area SP2, the second
substrate stage 2 is moved from the first area SP1 to the second
area SP2 via at least a part of the fourth area SP4.
[0094] The controller 7 executes the release of the connection
between the first connecting member 71 and the substrate stage 1
(or the second substrate stage 2), the release of the connection
between the second connecting member 72 and the second substrate
stage 2 (or the first substrate stage 1), the connection between
the first connecting member 71 and the second substrate stage 2 (or
the first substrate stage 1), and the connection between the second
connecting member 72 and the first substrate stage 1 (or the second
substrate stage 2) on the base member BP at a predetermined timing.
That is, the controller 7 executes the exchange operation for the
first connecting member 71 and the second connecting member 72 with
respect to the first substrate stage 1 and the second substrate
stage 2 at the predetermined timing.
[0095] The first connecting member 71 is alternately connected to
the first joint member 61 of the stage body 11 and the third joint
member 63 of the stage body 21. The second connecting member 72 is
alternately connected to the second joint member 62 of the stage
body 11 and the fourth joint member 64 of the stage body 21. That
is, the first connecting member 71 is alternately connected to the
stage body 11 of the first substrate stage 1 and the stage body 21
of the second substrate stage 2 via the first joint member 61 and
the third joint member 63; and the second connecting member 72 is
alternately connected to the stage body 11 of the first substrate
stage 1 and the stage body 21 of the second substrate stage 2 via
the second joint member 62 and the fourth joint member 64.
[0096] The first connecting member 71 moves one of the connected
substrate stages of the first substrate stage 1 and the second
substrate stage 2 by the drive of the linear motors 42, 44, 46. The
second connecting member 72 moves the other of the connected
substrate stages 1, 2 by the drive of the linear motors 43, 45,
47.
[0097] In this embodiment, the stage body (11, 21) and the
substrate table (12, 22) are relatively movable. However, the stage
body and the substrate table may be provided integrally. In this
case, the stage body may be movable in the directions of six
degrees of freedom.
[0098] Next, an explanation will be made with reference to FIGS. 1
and 2 about an example of the measuring system 6 measuring the
position information about the first and second substrate stages 1,
2. The first substrate table 12 of the first substrate stage 1 and
the second substrate table 22 of the second substrate stage 2 have
measuring mirrors 1Rx, 1Ry, 1Rz, 2Rx, 2Ry, 2Rz to each of which the
measuring light ML from the measuring system 6 is irradiated to
measure the positions of the first substrate table 12 and the
second substrate table 22.
[0099] The measuring system 6 includes laser interferometers 6Px,
6Py, 6Pz capable of radiating the measuring light ML for the
position measurement onto each of the measuring mirrors 1Rx, 1Ry,
1Rz, 2Rx, 2Ry, 2Rz. The measuring system 6 is capable of measuring
the position information about the first and second substrate
tables 12, 22 by irradiating the measuring light ML for the
position measurement onto each of the measuring mirrors 1Rx, 1Ry,
1Rz, 2Rx, 2Ry, 2Rz provided at predetermined positions on the first
and second substrate tables 12, 22 respectively. In this
embodiment, the measuring system 6 is capable measuring the
position information in relation to the directions of six degrees
of freedom of the X axis, Y axis, Z axis, .theta.X, .theta.Y, and
.theta.Z directions of the first and second substrate tables 12, 22
by using the measuring mirrors 1Rx, 1Ry, 1Rz, 2Rx, 2Ry, 2Rz
provided at the predetermined positions on the first and second
substrate tables 12, 22 respectively.
[0100] The measuring mirror 1Rx is arranged at an upper portion of
each of the side surfaces of the first substrate table 12 on the +X
side and the -X side. The measuring mirror 1Ry is arranged at an
upper portion of each of the side surfaces of the first substrate
table 12 on the +Y side and the -Y side. The measuring mirror 1Rz
is arranged at a lower portion of each of the side surfaces of the
first substrate table 12 on the +X side, the -X side, the +Y side,
and the -Y side.
[0101] The measuring mirror 2Rx is arranged at an upper portion of
each of the side surfaces of the second substrate table 22 on the
+X side and the -X side. The measuring mirror 2Ry is arranged at an
upper portion of each of the side surfaces of the second substrate
table 22 on the +Y side and the -Y side. The measuring mirror 2Rz
is arranged at a lower portion of each of the side surfaces of the
second substrate table 22 on the +X side, the -X side, the +Y side,
and the -Y side.
[0102] The measuring system 6 has the laser interferometers 6Px,
6Py, 6Pz which measures the position information about the first
and second substrate tables 12, 22 by irradiating the measuring
light ML onto each of the measuring mirrors 1Rx, 1Ry, 1Rz, 2Rx,
2Ry, 2Rz provided at predetermined positions on the first and
second substrate tables 12, 22 of the first and second substrate
tables 1, 2 respectively. The laser interferometers 6Px, 6Py, 6Pz
are provided on or for each of the exposure station ST1 and the
measuring station ST2. The laser interferometers 6Px, 6Py, 6Pz,
which are provided for the exposure station ST1, measure the
position information about the first substrate table 12 (or the
second substrate table 22) present or located in the exposure
station ST1. The laser interferometers 6Px, 6Py, 6Pz, which are
provided for the measuring station ST2, measure the position
information about the second substrate table 22 (or the first
substrate table 12) present in the measuring station ST2.
[0103] The laser interferometer 6Px is capable of irradiating the
measuring light ML, having a measuring axis directed in the X axis
direction, onto each of the measuring mirrors 1Rx, 2Rx to measure
the positions of the first and second substrate tables 12, 22 in
relation to the X axis direction. The laser interferometer 6Py is
capable of irradiating the measuring light ML, having a measuring
axis directed in the Y axis direction, onto each of the measuring
mirrors 1Ry, 2Ry to measure the positions of the first and second
substrate tables 12, 22 in relation to the Y axis direction. The
laser interferometer 6Pz is capable of irradiating the measuring
light ML, having an measuring axis directed in the Z axis
direction, onto each of the measuring mirrors 1Rz, 2Rz to measure
the positions of the first and second substrate tables 12, 22 in
relation to the Z axis direction.
[0104] The measuring mirrors 1Rz, 2Rz have inclined surfaces 1Sz,
2Sz onto each of which the measuring light ML for the position
measurement from the laser interferometers 6Pz is irradiated. The
inclined surfaces 1Sz, 2Sz are inclined with respect to the XY
plane as described above. However, the inclined surfaces 1Sz, 2Sz
are also inclined with respect to the measuring lights ML
irradiated from the laser interferometers 6Pz. The inclined
surfaces 1Sz, 2Sz of the measuring mirrors 1Rz, 2Rz function as the
reflecting surfaces for reflecting the irradiated measuring lights
ML. In the following description, the inclined surfaces of the
measuring mirrors 1Rz, 2Rz, which are capable of reflecting the
irradiated measuring lights ML, are appropriately referred to as
"reflecting surfaces".
[0105] The measuring mirrors 1Rz, 2Rz are arranged on the side
surfaces of the first substrate stage 1 and the second substrate
stage 2 respectively so that the reflecting surfaces (inclined
surfaces) 1Sz, 2Sz are directed upwardly. The reflecting surfaces
1Sz, 2Sz of the measuring mirrors 1Rz, 2Rz are inclined by a
predetermined angle (for example, 45 degrees) with respect to the
XY plane so that the reflecting surfaces 1Sz, 2Sz are directed
upwardly. The measuring lights ML, which are emitted from the laser
interferometers 6Pz and which are irradiated onto the measuring
mirrors 1Rz, 2Rz respectively, are reflected by the reflecting
surfaces 1Sz, 2Sz of the measuring mirrors 1Rz, 2Rz respectively;
and the measuring lights ML are irradiated onto measuring mirrors
1K, 2K provided on predetermined support frames 19. The measuring
lights ML, which are irradiated onto the measuring mirrors 1K, 2K
and which are reflected by the measuring mirrors 1K, 2K
respectively, are received by the laser interferometers 6Pz via the
reflecting surfaces 1Sz, 2Sz of the measuring mirrors 1Rz, 2Rz of
the first and second substrate tables 12, 22 respectively. The
laser interferometers 6Pz are capable of measuring the position
information about the first and second substrate tables 12, 22 in
the Z axis direction by using the received measuring lights ML. The
technique, which relates to the laser interferometer capable of
measuring the position information about the first and second
substrate tables 12, 22 in the Z axis direction (Z interferometer),
is disclosed, for example, in Japanese Patent Application Laid-open
No. 2000-323404 (corresponding to U.S. Pat. No. 7,206,058) and
Published Japanese Translation of PCT International Publication for
Patent Application No. 2001-513267 (corresponding to U.S. Pat. No.
6,208,407).
[0106] By providing at least one of the laser interferometer 6Px
and the laser interferometer 6Py as a plurality of laser
interferometers 6Px (6Py) and by irradiating at least one of the
measuring light ML having the measuring axis directed in the X axis
direction and the measuring light ML having the measuring axis
directed in the Y axis direction as a plurality of the measuring
lights ML each having the measuring axis directed in the X axis (Y
axis) direction, the measuring system 6 is capable of measuring the
position information about the first and second substrate tables
12, 22 in the .theta.Z direction by using the plurality of
measuring lights ML. By providing the laser interferometer 6Pz as a
plurality of interferometers 6Pz and by irradiating the measuring
light ML having the measuring axis directed in the Z direction as a
plurality of measuring lights ML having the measuring axis in the Z
direction, the measuring system 6 is capable of measuring the
position information about the first and second substrate tables
12, 22 in the .theta.X and .theta.Y directions by using the
plurality of measuring lights ML.
[0107] In the following description, the laser interferometers 6Px,
6Py, 6Pz are appropriately referred to as "X interferometer 6Px",
"Y interferometer 6Py", and "Z interferometer 6Pz"
respectively.
[0108] The measuring system 6 has the alignment system AL which
includes the second optical element 9. The alignment system AL is
arranged in the measuring station ST2. The alignment system AL is
capable of detecting the alignment mark of the substrate P and the
reference marks arranged on the opposing surfaces 15, 25 of the
first and second substrate tables 12, 22.
[0109] The measuring system 6 has the focus/leveling-detecting
system FL. The focus/leveling-detecting system FL is arranged in
the measuring station ST2, and detects the surface position
information about the surfaces of the substrate P held by the first
and second substrate tables 12, 22 (position information in
relation to the Z axis, .theta.X, and .theta.Y directions). The
focus/leveling-detecting system FL alternately detects, in the
measuring station ST2, the surface position information about the
surface of the substrate P held by the first substrate table 12 and
the surface position information about the surface of the substrate
P held by the second substrate table 22.
[0110] The controller 7 drives the substrate stage-driving system 5
based on the measurement result of the measuring system 6 to
control the positions of the first and second substrate tables 12,
22 to thereby control the positions of the substrates P held by the
substrate holders 13, 23 of the first and second substrate tables
12, 22.
[0111] In the exposure station ST1, the substrate P is exposed via
the projection optical system PL and the liquid LQ. In the
measuring station ST2, the measurement in relation to the exposure
and the exchange of the substrate P are performed. Each of the
first substrate stage 1 and the second substrate stage 2 is movable
between the first area SP1 of the exposure station ST1 and the
second area SP2 of the measuring station ST2 while holding the
substrate P.
[0112] Next, the transmitting members 81, 82 will be explained with
reference to FIGS. 2 to 6. FIG. 3 is a perspective view
illustrating the vicinity of the first substrate table 12 on which
the transmitting member 81 is provided. FIG. 4 is a plan view of
the first and second substrate tables 12, 22 on which the
transmitting members 81, 82 are provided; and FIG. 5 is a side view
thereof. FIG. 6 is a side sectional view illustrating the vicinity
of the transmitting member 81 provided for the first substrate
table 12. In the following description with reference to FIGS. 2 to
6, although the transmitting member 81 provided for the first
substrate table 12 is mainly explained, a similar explanation is
applied also to the transmitting member 82 provided for the second
substrate table 22.
[0113] The transmitting member 81 has a protruding portion 81S
which protrudes from (the side surface of) the first substrate
table 12 more outwardly than the measuring mirror 1Rz. The
protruding portion 81S has an end surface 81E. The end surface 81E
also protrudes from the first substrate table 12 more outwardly
than the measuring mirror 1Rz. The protruding portion 81S defines a
transmitting area 81S through which the measuring light ML is
transmissive. In this embodiment, the transmitting member 81 is
formed, for example, of a glass material such as silica glass
through which the measuring light ML is transmissive. The measuring
mirror 1Rz is arranged on the side surface of the first substrate
table 12 so that the measuring mirror 1Rz protrudes outwardly (in
the -X direction as shown in the drawing) from the side surface of
the first substrate table 12. The end surface 81E of the
transmitting member 81 is arranged on the first substrate table 12
so that the end surface 81E protrudes outwardly (in the -X
direction as shown in the drawing) in the XY plane more than the
measuring mirror 1Rz.
[0114] Each of the measuring mirrors 1Rz is arranged on the side
surface of the first substrate table 12 so that the reflecting
surface 1Sz is directed upwardly (in the +Z direction). The
reflecting surface 1Sz of the measuring mirror 1Rz is inclined with
respect to the XY plane by a predetermined angle (for example, 45
degrees).
[0115] The transmitting member 81 is a plate-shaped member (glass
member) having upper and lower surfaces. The transmitting member 81
is arranged on the first substrate table 12 so that the upper
surface of the transmitting member 81 is substantially flush with a
partial area 15A of the opposing surface 15 of the first substrate
table 12 (positions in the Z axis direction thereof are
approximately equal to each other). The transmitting area 81S of
the transmitting member 81 is a plane-parallel. The upper and lower
surfaces of the transmitting area 81S of the transmitting member 81
held by the first substrate table 12 are substantially parallel to
the XY plane.
[0116] The transmitting member 81 is arranged at a position above
or over the measuring mirror 1Rz so that at least a part of the
lower surface of the transmitting member 81 is opposite to or
facing the reflecting surface 1Sz of the measuring mirror 1Rz. The
transmitting member 81 is connected to a part of the opposing
surface of the first substrate table 12 so that the transmitting
area 81S is opposite to the reflecting surface 1Sz of the measuring
mirror 1Rz at the position above or over the measuring mirror
1Rz.
[0117] The measuring mirror 1Rz and the transmitting member 81 are
arranged in a predetermined positional relationship on the first
substrate table 12 so that the measuring light ML via one of the
reflecting surface 1Sz of the measuring mirror 1Rz and the
transmitting area 81S of the transmitting member 81 comes into the
other of the reflecting surface 1Sz and the transmitting area
81S.
[0118] That is, as shown in FIG. 6, the measuring light ML, which
is emitted or radiated from the Z interferometer 6Pz and which is
irradiated onto the measuring mirror 1Rz, is reflected by the
reflecting surface 1Sz of the measuring mirror 1Rz, and then comes
into the transmitting area 81S of the transmitting member 81
arranged at the position above the measuring mirror 1Rz. The
measuring light ML, which comes into the transmitting area 81S of
the transmitting member 81, is transmitted through the transmitting
area 81S, and then is irradiated onto a measuring mirror 1K
provided on a predetermined support frame 19. The measuring light
ML, which is irradiated onto the measuring mirror 1K and which is
reflected by the measuring mirror 1K, comes into the transmitting
area 81S of the transmitting member 81. Afterwards, the measuring
light ML is transmitted through the transmitting area 81S, and then
exits from the transmitting area 81S. Then, the measuring light ML,
which exits from the transmitting area 81S of the transmitting
member 81, comes into the reflecting surface 1Sz of the measuring
mirror 1Rz. The measuring light ML, which comes into the reflecting
surface 1Sz of the measuring mirror 1Rz, is reflected by the
reflecting surface 1Sz, and then comes into the Z interferometer
6Pz. The Z interferometer 6Pz receives the measuring light ML from
the reflecting surface 1Sz of the measuring mirror 1Rz.
[0119] As shown in FIG. 6, the area 15A which is substantially
flush with the surface of the substrate P held by the substrate
holder 13 and an area 15B which is located at a position lower than
the area 15A are formed on the opposing surface 15 of the first
substrate table 12 opposable to the first optical element 8. The
area 15B is formed to be continued to the side surface of the first
substrate table 12. A step 12D is formed between the area 15A and
the area 15B.
[0120] The exposure apparatus EX is provided with a holding
mechanism 90 which is provided on or for the first substrate table
12 and which detachably holds at least a part of the transmitting
member 81. At least a part of the holding mechanism 90 is formed in
the area 15B of the opposing surface 15. The lower surface of the
transmitting member 81 and the area 15B of the opposing surface 15
are capable of making contact with each other.
[0121] The transmitting member 81 is arranged so that a part of the
lower surface of the transmitting member 81 is opposite to the area
15B of the opposing surface 15 of the first substrate table 12. The
holding mechanism 90 includes a groove 91 which is formed in the
area 15B of the opposing surface 15 and which is provided to form a
space with respect to the lower surface of the transmitting member
81 arranged to make contact with the area 15B; a suction port 92
which is formed inside the groove 91; and a vacuum system 94 which
is connected to the suction port 92 via a flow passage 93. The
vacuum system 94 is capable of sucking, via the suction port 92, a
gas present in the space formed between the groove 91 and the lower
surface of the transmitting member 81. The operation of the vacuum
system 94 is controlled by the controller 7. The vacuum system 94
of the holding mechanism 90 is driven to suck the gas in the space
via the suction port 92 in a state that the lower surface of the
transmitting member 81 makes contact with the area 15B of the
opposing surface 15 of the first substrate table 12 and that the
space is formed between the groove 91 and the lower surface of the
transmitting member 81. By doing so, the controller 7 can attract
and hold the lower surface of the transmitting member 81 in the
area 15B of the opposing surface 15 of the first substrate table
12. The controller 7 can release the attraction and holding of the
transmitting member 81, by stopping the driving of the vacuum
system 94 of the holding mechanism 90. That is, the holding
mechanism 90 of this embodiment includes the so-called vacuum chuck
mechanism.
[0122] The upper surface of the transmitting member 81 held by the
holding mechanism 90 is substantially flush with the area 15A of
the opposing surface 15 of the first substrate table 12. That is,
the area 15A of the opposing surface 15 of the first substrate
table 12 is substantially flush with the upper surface of the
transmitting member 81 held by the holding mechanism 90 and with
the surface of the substrate P held by the substrate holder 13.
[0123] In the following description, the area 15A, of the opposing
surface 15, which is substantially flush with the surface of the
substrate P and the upper surface of the transmitting member 81 is
appropriately referred to as "top surface 15A". The area 15B, of
the opposing surface 15, which is capable of holding the lower
surface of the transmitting member 81, is appropriately referred to
as "holding surface 15B".
[0124] The end surface 81E of the transmitting member 81 held by
the holding mechanism 90 protrudes outwardly more than the
measuring mirror 1Rz.
[0125] The exposure apparatus EX is provided with an optical sensor
75 which is provided on or for the first substrate table 12 and
into which the light beam comes via the transmitting member 81. The
optical sensor 75 is arranged in a recess 12H formed at the inside
of the holding surface 15B. The transmitting member 81 is arranged
so that at least a part of the lower surface of the transmitting
member 81 is opposite to the holding surface 15B of the first
substrate table 12. Light beam (light) via the transmitting member
81 can come into the optical sensor 75 arranged in the recess
12H.
[0126] In this embodiment, the transmitting member 81 has a
light-shielding film 76 which is formed, for example, with chromium
or the like in a partial area of the upper surface of the
transmitting member 81; and a slit-shaped aperture 77 which is
formed on a part of the light-shielding film 76. The transmitting
member 81 is exposed at the aperture 77. The light beam is
transmissive through the aperture 77. An area of the transmitting
member 81, which is opposite to the aperture 77, is appropriately
referred to as "second transmitting area 81SS (82SS)" in relation
to the transmitting area (first transmitting area) 81S (82S)
described above.
[0127] The size of the light-shielding film 76, in the XY plane,
substantially parallel to the top surface 15A of the first
substrate table 12 is greater than that of the recess 12H. Only the
light passing through the aperture 77 comes into the optical sensor
75 in a state that the transmitting member 81 is held by the
holding mechanism 90. That is, the optical sensor 75 receives only
the light passing through the aperture 77 of the transmitting
member 81 in the state that the transmitting member 81 is held by
the holding mechanism 90.
[0128] In this embodiment, the optical sensor 75 is an optical
sensor which constitutes at least a part of a spatial
image-measuring system as disclosed, for example, in Japanese
Patent Application Laid-open No. 2002-14005 (corresponding to
United States Patent Application Publication No. 2002/0041377) and
Japanese Patent Application Laid-open No. 2002-198303
(corresponding to United States Patent Application Publication No.
2002/0041377).
[0129] The optical sensor 75 may be an optical sensor which is
capable of measuring the intensity (transmittance) of the exposure
light EL as disclosed, for example, in International Publication
Nos. 2005/074014 (corresponding to United States Patent Application
Publication No. 2007/0127006) and 2006/013806 (corresponding to
European Patent Application Publication No. 1791164). Various
detectors or measuring devices including, for example, an uneven
illuminance measuring device, an illuminance meter, and a wave
aberration measuring device may be arranged in the recess 12H
formed in the top surface 15A of the first substrate table 12,
instead of or together with the optical sensor 75. The light is
allowed to come into the detector or the measuring device after
being transmitted through the aperture of each of various patterns
provided on or for the transmitting member 81.
[0130] Those usable as the detector or the measuring device
include, for example, an uneven illuminance sensor disclosed, for
example, in Japanese Patent Application Laid-open No. 57-117238
(corresponding to U.S. Pat. No. 4,465,368), a spatial image
measuring device measuring the light intensity of a spatial image
(projected image) of a pattern projected by the projection optical
system PL disclosed, for example, in Japanese Patent Application
Laid-open No. 2002-14005 (corresponding to United States Patent
Application Publication No. 2002/0041377), an illuminance monitor
disclosed, for example, in Japanese Patent Application Laid-open
No. 11-16816 (corresponding to United States Patent Application
Publication No. 2002/0061469), and a wave aberration measuring
device disclosed, for example, in International Publication No.
99/60361 (corresponding to European Patent No. 1,079,223).
[0131] The transmitting member 81 provided for the first substrate
table 12 has been mainly explained above. In this embodiment, a
holding mechanism 90, which is the same as or equivalent to the
holding mechanism 90 provided for the first substrate table 12, is
provided also for the second substrate table 22. A transmitting
member 82, which is the same as or equivalent to the transmitting
member 81, is detachably held by the holding mechanism 90. An end
surface 82E of the transmitting member 82 held by the holding
mechanism 90 of the second substrate table 22 protrudes outwardly
more than the measuring mirror 2Rz. The measuring mirror 2Rz and
the transmitting member 82 are arranged in a predetermined
positional relationship on the second substrate table 22 so that
the measuring light ML via one of the reflecting surface 2Sz of the
measuring mirror 2Rz and the transmitting area 82S of the
transmitting member 82 comes into the other of the reflecting
surface 2Sz and the transmitting area 82S. The second substrate
table 22 is provided with an optical sensor 75. A light beam
(light), which is transmitted through an aperture 77 of a
light-shielding film 76 formed on the transmitting member 82, comes
into the optical sensor 75.
[0132] In this embodiment, one piece of the transmitting member 81
is arranged in the vicinity of the edge on the -X side of the
opposing surface 15 of the first substrate table 12 so that the
transmitting member 81 is opposite to the reflecting surface 1Sz of
the measuring mirror 1Rz arranged on the side surface on the -X
side of the first substrate table 12. Further, one piece of the
transmitting member 82 is arranged in the vicinity of the edge on
the +X side of the opposing surface 25 of the second substrate
table 22 so that the transmitting member 82 is opposite to the
reflecting surface 2Sz of the measuring mirror 2Rz arranged on the
side surface on the +X side of the second substrate table 22.
[0133] The end surface 81E of the transmitting member 81 is
substantially linear. The transmitting member 81 is held by the
holding mechanism 90 of the first substrate table 12 so that the
end surface 81E is substantially parallel to the Y axis. Similarly,
the end surface 82E of the transmitting member 82 is substantially
linear. The transmitting member 82 is held by the holding mechanism
90 of the second substrate table 22 so that the end surface 82E is
substantially parallel to the Y axis.
[0134] In this embodiment, as described later on, the controller 7
uses the substrate stage-driving system 5 to synchronously move the
first substrate stage 1 and the second substrate stage 2 in the X
axis direction in a state that the end surface 81E on the -X side
of the transmitting member 81 of the first substrate table 12 and
at least a part of the end surface 82E on the +X side of the
transmitting member 82 of the second substrate table 22 are close
to each other or make contact with each other. In this embodiment,
a step 81D is formed at a part of the end surface 81E on the -X
side of the transmitting member 81 of the first substrate table 12.
A step 82D, which is adapted to (meshed or engaged with) the step
81D of the transmitting member 81 of the first substrate table 12,
is formed at a part of the end surface 82E on the +X side of the
transmitting member 82 of the second substrate table 22.
[0135] Next, an explanation will be made with reference to FIGS. 7
to 12 and 24 about an example of the exposure method and the
operation of the exposure apparatus constructed as described
above.
[0136] In this embodiment, when one of the first substrate stage 1
and the second substrate stage 2 is arranged in the first area SP1
of the exposure station ST1, the other of the first substrate stage
1 and the second substrate stage 2 executes the predetermined
process in the second area SP2 of the measuring station ST2.
[0137] For example, the exposure apparatus EX performs an operation
in which one of the first substrate stage 1 and the second
substrate stage 2 is arranged at a position, in the exposure
station ST1, at which the exposure light EL from the first optical
element 8 is irradiated to expose the substrate P held by the one
substrate stage, concurrently with at least a part of an operation
in which the other of the first substrate stage 1 and the second
substrate stage 2 is arranged at a position, in the measuring
station ST2, at which the other of the first substrate stage 1 and
the second substrate stage 2 is opposite to the second optical
element 9 to measure the substrate P held by the other of the first
substrate stage 1 and the second substrate stage 2. Further, the
exposure apparatus EX performs the substrate exchange operation
such that the other of the first substrate stage 1 and the second
substrate stage 2 is arranged in the second area SP2 of the
measuring station ST2 in a state that the one of the first
substrate stage 1 and the second substrate stage 2 is arranged in
the first area SP1 of the exposure station ST1, wherein the
exposure apparatus EX uses the transport system H to unload the
substrate P, for which the exposure process has been performed from
the other of the first substrate stage 1 and the second substrate
stage 2, and to load another substrate P, which is to be subjected
to the exposure process, onto the other of the first substrate
stage 1 and the second substrate stage 2.
[0138] In this embodiment, the first substrate stage 1 and the
second substrate stage 2 are successively arranged in the first
area SP1 of the exposure station ST1 to successively execute the
operation in which the exposure light EL is irradiated onto the
substrate P held by the first substrate stage 1 arranged in the
first area SP1 and the operation in which the exposure light EL is
irradiated onto the substrate P held by the second substrate stage
2 arranged in the first area SP1.
[0139] As shown in FIG. 7, the controller 7 arranges the second
substrate stage 2 at the substrate exchange position in the
measuring station ST2; and the controller 7 uses the transport
system H to load the substrate P, which is to be subjected to the
exposure process, on the second substrate stage 2. The controller 7
starts, for example, the predetermined measurement process in
relation to the substrate P held by the second substrate stage 2 in
the measuring station ST2 (SM1).
[0140] On the other hand, the first substrate stage 1, holding the
substrate P, for which the measurement process has been already
completed in the measuring station ST2, is arranged in the first
area SP1 of the exposure station ST1. The controller 7 starts the
exposure of the substrate P held by the first substrate stage 1 in
the exposure station ST1 (SE1).
[0141] The controller 7 executes the liquid immersion exposure of
the substrate P held by the first substrate stage 1 in the exposure
station ST1. The controller 7 exposes the substrate P in a state
that the substrate P held by the first substrate stage 1 is
opposite to the first optical element 8 of the projection optical
system PL and that the optical path space for the exposure light EL
on the light-exit side of the first optical element 8 is filled
with the liquid LQ. A plurality of shot areas are defined on the
substrate P. The controller 7 successively exposes, via the
projection optical system PL and the liquid LQ, each of the
plurality of shot areas on the substrate P held by the first
substrate stage 1, while using the substrate stage-driving system 5
to move the first substrate stage 1 in the first area SP1.
[0142] The measurement process and/or the like is executed for the
substrate P held by the second substrate stage 2 in the measuring
station ST2 during the period in which the exposure process is
executed for the substrate P held by the first substrate stage 1 in
the exposure station ST1. For example, the controller 7 measures
the position information about the substrate P held by the second
substrate stage 2 arranged in the measuring station ST2. The
position information about the substrate P herein includes at least
one of the alignment information of the substrate P with respect to
a predetermined reference position (position information in
relation to the X, Y, and .theta.Z directions of the plurality of
shot areas on the substrate P) and the surface position information
about the substrate P with respect to a predetermined reference
surface (position information in relation to the Z, .theta.X, and
.theta.Y directions).
[0143] That is, the controller 7 executes the above-described
detecting operation using the alignment system AL and the detecting
operation using the focus/leveling-detecting system FL. For
example, in the detecting operation using the
focus/leveling-detecting system FL, the controller 7 uses the
focus/leveling-detecting system FL to detect the surface position
information about the predetermined reference surface and the
surface of the substrate P, while measuring, in the measuring
station ST2, the position information about the position in the Z
axis direction of the second substrate stage 2 with the Z
interferometer 6Pz. The controller 7 determines the approximate
plane (approximate surface) of the surface of the substrate P
(respective shot areas) based on the reference surface in the
coordinate system defined by the measuring system 6 including the Z
interferometer 6Pz.
[0144] In the second substrate stage 2, the measuring mirrors 2Rz
are arranged on the four side surfaces of the second substrate
stage 2 respectively. Upon executing the measurement process for
the substrate P on the second substrate stage 2 in the measuring
station ST2, the measuring system 6 makes the measuring lights ML
from the Z interferometers 6Pz to be irradiated onto at least
three, among the four measuring mirrors 2Rz, which are arranged on
three side surfaces among the four side surfaces respectively, to
measure the position information in the Z axis direction of the
second substrate stage 2. In this embodiment, in the measuring
station ST2, three Z interferometers 6Pz are arranged on the +X
side, the -X side, and the +Y side with respect to the second
optical element 9. The measuring lights ML are irradiated from the
Z interferometers 6Pz onto the measuring mirrors 2Rz of the second
substrate stage 2. At least a part of the measuring light ML
irradiated from the Z interferometer 6Pz is transmitted through the
transmitting member 82 of the second substrate stage 2.
[0145] In the detecting operation using the alignment system AL, in
the measuring station ST2, the controller 7 uses the alignment
system AL to detect the alignment mark provided on the substrate P
corresponding to the shot areas on the substrate P respectively and
detects the reference mark formed on a part of the second substrate
stage 2, while measuring the position information in the X axis
direction and the Y axis direction of the second substrate stage 2
which holds the substrate P with the X interferometer 6Px and the Y
interferometer 6Py. With this, the positional information of the
alignment mark (and consequently of the shot areas) and of the
reference mark. Note that a short area, among the shot areas, for
which the detection of the alignment mark is performed by the
alignment system AL, may be all the shot areas on the substrate P.
However, in this embodiment, such shot area or areas is/are only a
part of the shot areas. Then, based on the position information
measured for the shot areas, the controller 7 determines the
position information about the position of each of the plurality of
shot areas on the substrate P with respect to the predetermined
reference position by the calculation process.
[0146] After the exposure process is completed for the substrate P
held by the first substrate stage 1 in the exposure station ST1,
and after the measurement process is completed for the substrate P
held by the second substrate stage 2 in the measuring station ST2,
then the controller 7 starts the movement of the second substrate
stage 2 from the second area SP2 of the measuring station ST2 to
the first area SP1 of the exposure station ST1. Note that the
movement of the second substrate stage 2 may be started before the
exposure process for the substrate P in the exposure station ST1 is
completed.
[0147] In this embodiment, the controller 7 arranges the first
substrate stage 1 at the position opposite to the first optical
element 8 also when the controller 7 moves the second substrate
stage 2 from the second area SP2 to the first area SP1. By doing
so, the liquid LQ of the liquid immersion space LS is continuously
retained between the first optical element 8 and the first
substrate stage 1 (substrate P) even during the execution of the
operation in which the second substrate stage 2 is moved from the
second area SP2 to the first area SP1. In accordance with the
operation as described above, as shown in FIG. 8, both of the first
substrate stage 1 and the second substrate stage 2 are arranged in
the first area SP1 of the exposure station ST1. At the point of
time when the exposure process is completed for the substrate P
held by the first substrate stage 1, the first substrate stage 1 is
moved, while retaining the liquid LQ between the first substrate
stage 1 and the first optical element, to a predetermined position
in the first area SP, as shown in FIG. 8, at which the exchange
operation for the connecting members is to be performed.
[0148] Subsequently, the controller 7 executes the exchange
operation for the first connecting member 71 and the second
connecting member 72 with respect to the first substrate stage 1
and the second substrate stage 2, while maintaining the state that
the first substrate stage 1 and the first optical element 8 are
opposite to each other. That is, the controller 7 releases the
connection between the first connecting member 71 and the first
joint member 61 of the first substrate stage 1 to release the first
substrate stage 1 from the first connecting member 71. Further, the
controller 7 releases the connection between the second connecting
member 72 and the fourth joint member 64 of the second substrate
stage 2 to release the second substrate stage 2 from the second
connecting member 72.
[0149] After that, as shown in FIG. 9, the controller 7 moves the
first connecting member 71 in the -X direction to connect the first
joint member 71 to the third joint member 63 of the second
substrate stage 2, and the controller 7 moves the second connecting
member 72 in the +X direction to connect the second connecting
member 72 to the second joint member 62 of the first substrate
stage 1.
[0150] In the exchange operation as described above, the first
connecting member 71, which has been connected to the first
substrate stage 1, is connected to the second substrate stage 2,
and the second connecting member 72, which has been connected to
the second substrate stage 2, is connected to the first substrate
stage 1.
[0151] Subsequently, in order to perform the liquid immersion
exposure of the substrate P on the second substrate stage 2, the
controller 7 uses the substrate stage-driving system 5 to change
the state that the first optical element 8 is opposite to at least
one of the first substrate stage 1 and the transmitting member 81
(namely, state that the liquid LQ is retained between the first
optical element 8 and at least one of the first substrate stage 1
and the transmitting member 81) to the state that the first optical
element 8 is opposite to at least one of the second substrate stage
2 and the transmitting member 82 (namely, state that the liquid LQ
is retained between the first optical element 8 and at least one of
the second substrate stage 2 and the transmitting member 82).
[0152] In this embodiment, the substrate stage-driving system 5
synchronously moves the first substrate stage 1 and the second
substrate stage 2 in a state that the end surface 81E of the
transmitting member 81 of the first substrate stage 1 and the end
surface 82E of the transmitting member 82 of the second substrate
stage 2 are close to each other or make contact with each other in
the first area SP1 of the guide surface GF including the position
at which the exposure light EL from the first optical element 8 is
irradiated, as disclosed, for example, in International Publication
No. 2005/074014 (corresponding to United States Patent Application
Publication No. 2007/0127006). The sentence "the end surface 81E of
the transmitting member 81 of the first substrate stage 1 and the
end surface 82E of the transmitting member 82 of the second
substrate stage 2 are close to each other" means that the liquid LQ
does not leak from any space or gap between the end surface 81E of
the transmitting member 81 of the first substrate stage 1 and the
end surface 82E of the transmitting member 82 of the second
substrate stage 2, or that the liquid LQ leaks in a small amount of
such an extent that the operation of the exposure apparatus is not
affected thereby.
[0153] The substrate stage-driving system 5 allows the end surface
81E of the transmitting member 81 of the first substrate stage 1
and the end surface 82E of the transmitting member 82 of the second
substrate stage 2 to be close to each other or make contact with
each other so that at least one of the transmitting member 81, the
transmitting member 82, the first substrate stage 1, and the second
substrate stage 2 forms a space capable of retaining the liquid LQ
with respect to the first optical element 8 when the first
substrate stage 1 and the second substrate stage 2 are
synchronously moved (SE2).
[0154] The controller 7 makes at least one of the transmitting
member 81, the transmitting member 82, the first substrate stage 1,
and the second substrate stage 2 continuously to form the space
capable of retaining the liquid LQ with respect to the first
optical element 8. That is, the controller 7 uses the substrate
stage-driving system 5 in the first area SP1 of the guide surface
GF including the position opposite to the first optical element 8,
in the state that the end surface 81E of the transmitting member 81
and the end surface 82E of the transmitting member 82 are close to
each other or make contact with each other, to move the first
substrate stage 1 and the second substrate stage 2 synchronously in
the XY plane with respect to the first optical element 8 (SE3). In
this embodiment, the controller 7 synchronously moves the first
substrate stage 1 and the second substrate stage 2 in the +X
direction in the state that the end surface 81E of the transmitting
member 81 of the first substrate stage 1 and the end surface 82E of
the transmitting member 82 of the second substrate stage 2 are
close to each other or make contact with each other. Accordingly,
it is possible to make the change from the state that at least one
of the first substrate stage 1 and the transmitting member 81 is
opposite to the optical element 8 as shown in FIG. 9 to the state
that at least one of the second substrate stage 2 and the
transmitting member 82 is opposite to the first optical element 8
as shown in FIG. 10. That is, it is possible to make the change
from the state that the liquid LQ is retained between the first
optical element 8 and at least one of the first substrate stage 1
and the transmitting member 81 to the state that the liquid LQ is
retained between the first optical element 8 and at least one of
the second substrate stage 2 and the transmitting member 82.
Although not shown, during the process in which the change is made
from the state shown in FIG. 9 to the state shown in FIG. 10, the
controller 7 firstly synchronously moves the first substrate stage
1 and the second substrate stage 2 in the -Y direction until the
liquid immersion space LS arrives at the position of the step 81D
formed at the end surface 81E of the transmitting member 81 in the
Y direction in the state that the end surface 81E of the
transmitting member 81 of the first substrate stage 1 and the end
surface 82E of the transmitting member 82 of the second substrate
stage 2 are close to each other or make contact with each other.
Subsequently, the controller 7 can synchronously move the first
substrate stage 1 and the second substrate stage 2 in the +X
direction so that the liquid immersion space LS passes over the
steps 81D, 82D formed at the end surfaces 81E, 82E of the
transmitting members 81, 82, respectively, to be moved onto the
second substrate stage 2. The controller 7 can synchronously move
the first substrate stage 1 and the second substrate stage 2 in the
+Y direction so that the first optical element 8 is positioned in
the arrangement as shown in FIG. 10. Here, after the liquid
immersion space LS is moved from the first substrate stage 1 (or
from the transmitting member 81) to the second substrate stage 2
(or to the transmitting member 82), it is allowable to start the
movement of the first substrate stage 1 to the second area SP2, and
the movement of the second substrate stage 2 to a predetermined
position in the first area SP1 including, for example, to a
position at which the measurement by the optical sensor 75 is
performed or to an exposure start position, without arranging the
first and second substrate stages 1, 2 as shown in FIG. 10.
Alternatively, at the point of time when the first and second
substrate stages 1, 2 are arranged as shown in FIGS. 8 and 9, it is
allowable to position the first and second substrate stages 1, 2
such that the first optical element 8 is located substantially at a
same position as the steps 81D, 82D of the transmitting members 81,
82 with respect to the Y-axis.
[0155] In this embodiment, the measuring mirrors 1Rz are arranged
on the four side surfaces of the first substrate table 12
respectively so that the measuring mirrors 1Rz protrude (project)
from the side surfaces. Further, the measuring mirrors 2Rz are
arranged on the four side surfaces of the second substrate table 22
respectively so that the measuring mirrors 2Rz protrude (project)
from the side surfaces. When the change is made from the state that
the liquid LQ is retained between the first substrate stage 1 and
the first optical element 8 to the state that the liquid LQ is
retained between the second substrate stage 2 and the first optical
element 8, the end surface 81E of the transmitting member 81
protruding outwardly in the -X direction more than the measuring
mirror 1Rz and the end surface 82E of the transmitting member 82
protruding outwardly in the +X direction more than the measuring
mirror 2Rz are made to be close to each other or brought into
contact with each other. Accordingly, it is possible to
satisfactorily allow the end surface 81E of the transmitting member
81 and the end surface 82E of the transmitting member 82 to be
close to each other or make contact with each other, while
suppressing the contact (collision) between the measuring mirror
1Rz of the first substrate stage 1 and at least one of the second
substrate stage 2 and the measuring mirror 2Rz and the contact
(collision) between the measuring mirror 2Rz of the second
substrate stage 2 and at least one of the first substrate stage 1
and the measuring mirror 1Rz. Therefore, it is possible to smoothly
make the change from the state that the liquid LQ is retained
between the first substrate stage 1 and the first optical element 8
to the state that the liquid LQ is retained between the second
substrate stage 2 and the first optical element 8, while
suppressing the leakage of the liquid LQ in the state that the
liquid immersion space LS of the liquid LQ is formed. That is, it
is possible to make the change from the state that the first
substrate stage 1 and the first optical element 8 are opposite to
each other to the state that the second substrate stage 2 and the
first optical element 8 are opposite to each other in such a state
that the optical path space for the exposure light EL on the
light-exit side of the first optical element 8 is continuously
filled with the liquid LQ.
[0156] In this embodiment, the steps 81D, 82D, which are meshed or
engaged with each other, are formed on the end surfaces 81E, 82E of
the transmitting members 81, 82 respectively. Therefore, as
schematically shown in FIG. 12, the movement of the first and
second substrate stages 1, 2 is controlled, for example, such that
the liquid immersion space LS passes along or across the upper
surfaces of the transmitting members 81, 82 on the steps 81D, 82D
in a state that the steps 81D, 82D are meshed with each other,
thereby suppressing the leakage of the liquid LQ more
effectively.
[0157] After that, the controller 7 controls the substrate
stage-driving system 5 to move the first substrate stage 1 to the
measuring station ST2 while maintaining the state that the second
substrate stage 2 is opposite to the first optical element 8
(SE4).
[0158] As shown in FIG. 11, the second substrate stage 2 is
arranged in the first area SP1 of the exposure station ST1, and the
first substrate stage 1 is arranged in the second area SP2 of the
measuring station ST2. The substrate P, which is held by the first
substrate stage 1 having been moved to the measuring station ST2,
is unloaded at the substrate exchange position by the transport
system H; and a new substrate P, which is to be exposed, is loaded
on the first substrate stage 1 (SM3). The controller 7 starts the
measurement process for the substrate P loaded on the first
substrate stage 1 in the measuring station ST2, and/or the like
(SM4).
[0159] In the first substrate stage 1, the measuring mirrors 1Rz
are arranged on the four side surfaces of the first substrate stage
1 respectively. When the measurement process is executed for the
substrate P on the first substrate stage 1 in the measuring station
ST2, the measuring system 6 irradiates the measuring lights ML from
the Z interferometers 6Pz onto measuring mirrors 1Pz among the four
measuring mirrors 1Pz which are arranged on at least three side
surfaces, of the four side surfaces, respectively to measure the
information about the position in the Z axis direction of the first
substrate stage 1. In this embodiment, the three Z interferometers
6Pz are arranged in the measuring station ST2 on the +X side, the
-X side, and the +Y side with respect to the second optical element
9. The measuring lights ML are irradiated from the Z
interferometers 6Pz onto the measuring mirrors 1Rz of the first
substrate stage 1. At least parts of the measuring lights ML
irradiated from the Z interferometers 6Pz are transmitted through
the transmitting member 81 of the first substrate stage 1.
[0160] The controller 7 executes the liquid immersion exposure of
the substrate P held by the second substrate stage 2 in the
exposure station ST1 (SE5). The controller 7 exposes the substrate
P in the state that the optical path space for the exposure light
EL on the light-exit side of the first optical element 8 is filled
with the liquid LQ and that the substrate P held by the second
substrate stage 2 and the first optical element 8 of the projection
optical system PL are opposite to each other. The plurality of shot
areas are defined on the substrate P. The controller 7 successively
exposes, via the projection optical system PL and the liquid LQ,
each of the plurality of shot areas on the substrate P held by the
second substrate stage 2, while using the substrate stage-driving
system 5 to move the second substrate stage 2 in the first area
SP1.
[0161] If necessary, before starting the exposure of the substrate
P, the controller 7 can make the exposure light EL to be irradiated
onto the aperture 77 through the liquid LQ while allowing the first
optical element 8 and the aperture 77 to be opposite to each other.
The exposure light EL, existing from the first optical element 8
and irradiated onto the aperture 77 through the liquid LQ, comes
into the optical sensor 75. The controller 7 can execute the
predetermined process, for example, such that the calibration is
executed for the projection optical system PL based on the
detection result obtained by the optical sensor 75.
[0162] Upon exposing the substrate P, the controller 7 exposes the
substrate P while adjusting the position of the substrate P held by
the second substrate stage 2 in the exposure station ST1 by using
the measurement result obtained in the measuring station ST2.
[0163] For example, the controller 7 measures, with the Z
interferometers 6Pz, the position in the Z axis direction of the
second substrate stage 2 arranged in the exposure station ST1 to
determine the positional relationship between an approximate plane
of the surface of the substrate P and the image plane of the
projection optical system PL in the coordinate system defined by
the measuring system 6 including the Z interferometers 6Pz. The
position information about the reference surface in the Z axis
direction and the approximate plane of the surface of the substrate
P based on the reference surface in the coordinate system defined
by the measuring system 6 including the Z interferometers 6Pz have
been already measured in the measuring station ST2. The position
information about the image plane of the projection optical system
PL with respect to the reference surface is previously stored in
the controller 7. Therefore, the controller 7 can determine the
positional relationship between the approximate plane of the
surface of the substrate P and the image plane of the projection
optical system PL in the coordinate system defined by the measuring
system 6 including the Z interferometers 6Pz based on the
measurement result obtained by measuring, with the Z
interferometers 6Pz, the position in the Z axis direction of the
second substrate stage 2 arranged in the exposure station ST1. The
controller 7 exposes the substrate P while controlling the position
of the second substrate stage 2 based on the position information
measured with the measuring system 6 including the Z
interferometers 6Pz so that the surface of the substrate P and the
image plane of the projection optical system PL are in the
predetermined positional relationship (the surface of the substrate
P and the image plane of the projection optical system PL are
matched to each other).
[0164] In the second substrate stage 2, the measuring mirrors 2Rz
are arranged on the four side surfaces of the second substrate
stage 2 respectively. When the measurement is executed for the
position information about the second substrate stage 2 in the
exposure station ST1, the measuring system 6 makes the measuring
lights ML from the Z interferometers 6Pz to be irradiated onto
measuring mirrors 2Pz among the four measuring mirrors 2Pz arranged
on at least three surfaces of the four surfaces respectively to
measure the position information about the second substrate stage 2
in the Z axis direction. In this embodiment, the three Z
interferometers 6Pz are arranged in the exposure station ST1 on the
+X side, the -X side, and the -Y side with respect to the first
optical element 8. The measuring lights ML are irradiated from the
Z interferometers 6Pz onto the measuring mirrors 2Rz of the second
substrate stage 2. At least parts of the measuring lights ML
irradiated from the Z interferometers 6Pz are transmitted through
the transmitting member 82 of the second substrate stage 2. Note
that the mark of the mask M is detected by, for example, the
optical sensor 75 prior to the exposure of the substrate P, or the
reference mark and the mark of the mask M are detected by an
unillustrated alignment sensor prior to the exposure of the
substrate P, and then the substrate P is exposed, by using also the
result of this detection, while controlling the position of the
second substrate stage 2.
[0165] The processes as described above are repeated thereafter.
That is, the exposure process is executed for the substrate P held
by the second substrate stage 2 in the exposure station ST1, and
the measurement process is executed for the substrate P held by the
first substrate stage 1 in the measuring station ST2. After the
completion of the exposure process for the substrate P held by the
second substrate stage 2 in the exposure station ST1 and the
measurement process for the substrate P held by the first substrate
stage 1 in the measuring station ST2, the controller 7 uses the
substrate stage-driving system 5 to move the first substrate stage
1, arranged in the second area SP2 of the measuring station ST2, to
the first area SP1 of the exposure station ST1. The exchange
operation is executed to exchange the first connecting member 71
and the second connecting member 72. The first connecting member 71
is released from the second substrate stage 2, and the first
connecting member 71 is connected to the first substrate stage 1;
and the second connecting member 72 is released from the first
substrate stage 1, and the second connecting member 72 is connected
to the second substrate stage 2. The controller 7 makes the change
from the state that the second substrate stage 2 and the first
optical element 8 are opposite to each other to the state that the
first substrate stage 1 and the first optical element 8 are
opposite to each other. After that, the controller 7 uses the
substrate stage-driving system 5 to move the second substrate stage
2, arranged in the first area SP1 of the exposure station SP1, to
the second area SP2 of the measuring station ST2. The controller 7
successively exposes the plurality of shot areas of the substrate P
held by the first substrate stage 1 while moving the first
substrate stage 1 in the exposure station ST1; and the controller 7
executes the predetermined process including, for example, the
exchange of the substrate P on the second substrate stage 2 and the
measurement process in the measuring station ST2.
[0166] After moving, to the exposure station ST1, the first
substrate stage 1 holding the substrate P for which the measurement
process has been completed in the measuring station ST2 and upon
executing the exposure process for the substrate P in the exposure
station ST1, the controller 7 uses the Z interferometers 6Pz to
measure the position in the Z axis direction of the first substrate
stage 1 arranged in the exposure station ST1, and the controller 7
determines the positional relationship between the approximate
plane of the surface of the substrate P and the image plane of the
projection optical system PL based on the measurement result.
[0167] In the first substrate stage 1, the measuring mirrors 1Rz
are arranged on the four side surfaces of the first substrate stage
1 respectively. Upon executing the measurement of the position
information about the first substrate stage 1 in the exposure
station ST1, the measuring system 6 makes the measuring lights ML
from the Z interferometers 6Pz to be irradiated onto measuring
mirrors 1Pz among the four measuring mirrors 1Pz which are arranged
on at least three side surfaces of the four side surfaces
respectively to measure the position information about the position
in the Z axis direction of the first substrate stage 1. In this
embodiment, the three Z interferometers 6Pz are arranged in the
exposure station ST1 on the +X side, the -X side, and the -Y side
with respect to the first optical element 8. The measuring lights
ML are irradiated from the Z interferometers 6Pz onto the measuring
mirrors 2Rz of the first substrate stage 1. At least parts of the
measuring lights ML irradiated from the Z interferometers 6Pz are
transmitted through the transmitting member 81 of the first
substrate stage 1.
[0168] As explained above, according to this embodiment of the
present invention, the transmitting members 81, 82, which have the
end surfaces 81E, 82E protruding outwardly more than the measuring
mirrors 1Rz, 2Rz respectively and which have the transmitting areas
81S, 82S through which the measuring lights ML from the Z
interferometers 6Pz are transmissive, are arranged for the first
and second substrate stages 1, 2 respectively. Accordingly, at
least one of the transmitting member 81, the transmitting member
82, the first substrate stage 1, and the second substrate stage 2
can be arranged at the position opposite to the first optical
element 8 without obstructing the measuring operation of the Z
interferometer 6Pz, and the optical path space for the exposure
light EL on the light-exit side of the first optical element 8 can
be always filled with the liquid LQ continuously without executing
the operation for recovering all of the liquid LQ. Therefore, the
exposure of the substrate P held by the first substrate stage 1 and
the exposure of the substrate P held by the second substrate stage
2 can be executed while suppressing the decrease in the throughput
of the exposure apparatus EX. It is possible to suppress the
occurrence of the water mark caused by the absence or disappearance
of the liquid LQ, the occurrence of the temperature change caused
by the heat of vaporization, and the like; and it is possible to
suppress the deterioration of the exposure accuracy.
[0169] In this embodiment, the measuring mirrors 1Rz, 2Rz, which
are provided to measure the positions of the first and second
substrate tables 12, 22, protrude outwardly on the side surfaces of
the first substrate stage 1 (first substrate table 12) and the side
surfaces of the second substrate stage 2 (second substrate table
22), respectively. It is difficult to make the opposing surface
(top surface) 15 of the first substrate stage 1 and the opposing
surface (top surface) 25 of the second substrate stage 2 to be
close to each other or brought into contact with each other.
According to this embodiment, the movement of the liquid immersion
space LS from one to the other of the first substrate stage 1 and
the second substrate stage 2 is executed by using the transmitting
members 81, 82 which have the end surfaces 81E, 82E protruding
outwardly more than the measuring mirrors 1Rz, 2Rz and through
which the measuring lights ML are transmissive. Therefore, it is
possible to make the change from one to the other of the state that
the first substrate stage 1 and the first optical element 8 are
opposite to each other and the state that the second substrate
stage and the first optical element 8 are opposite to each other,
in the state that the space capable of retaining the liquid LQ is
continuously formed while suppressing, for example, the collision
of the measuring mirrors 1Rz, 2Rz of the first and second substrate
stages 1, 2, and without obstructing the measuring operation of the
Z interferometer 6Pz.
[0170] According to this embodiment, the transmitting members 81,
82 are detachably held to the first and second substrate stages 1,
2 by the holding mechanisms 90. Therefore, for example, the
deteriorated transmitting members 81, 82 can be easily exchanged
with new transmitting members 81, 82.
[0171] According to this embodiment, the apertures 77, which shape
the light beam coming into the optical sensor 75, are provided on
each of the transmitting members 81, 82. Therefore, it is
unnecessary to provide any new optical member to shape the light
beam coming into the optical sensor 75. Therefore, it is possible
to reduce the number of parts.
[0172] In this embodiment, the transmitting member 81 is arranged
so that the transmitting member 81 is opposite to the reflecting
surface 1Sz of the measuring mirror 1Rz arranged on the side
surface on the -X side of the first substrate table 12. The
measuring light ML, which is irradiated onto the measuring mirror
1Rz arranged on the side surface on the -X side of the first
substrate table 12, is transmitted through at least a part of the
transmitting member 81. The transmitting member 81 is, for example,
a plane-parallel, and the upper and lower surfaces of the
transmitting area 81S of the transmitting member 81, held by the
holding mechanism 90, are substantially parallel to the XY plane.
If the thickness of the transmitting member 81 is nonuniform in
relation to the Y axis direction, and/or any warpage arises in the
transmitting member 81, then there is a possibility that the
optical path length of the measuring light ML might be changed
depending on the position in the Y axis direction of the
transmitting area 81S of the transmitting member 81, thereby
affecting the measurement accuracy of the Z interferometer 6Pz. The
same or equivalent situation regarding the above possibility is
applied also in relation to the measuring mirror 2Rz provided for
the second substrate table 22.
[0173] Accordingly, if necessary, the controller 7 is capable of
correcting, for example, the error of the measured value of the Z
interferometer 6Pz caused, for example, due to the warpage and the
uneven thickness of the transmitting member 81. An explanation will
be made below about an exemplary method for correcting the measured
value of the Z interferometer 6Pz due to the transmitting member
81.
[0174] At first, before exposing the substrate P, the controller 7
previously uses the Z interferometer 6Pz to execute the operation
to obtain the position information about the first substrate stage
1 in the Z axis direction. That is, the controller 7 makes the
measuring light ML from the Z interferometer 6Pz to be irradiated
and makes the measuring light ML to be received by the Z
interferometer 6Pz via the reflecting surface 1Sz of the measuring
mirror 1Rz and the transmitting area 81S of the transmitting member
81, to thereby obtain the position information about the first
substrate stage 1 in the Z axis direction. In this procedure, as
schematically shown in FIG. 13, the controller 7 makes the
measuring light ML to be irradiated from the Z interferometer 6Pz
and makes the measuring light ML to be received by the Z
interferometer 6Pz via the reflecting surface 1Sz of the measuring
mirror 1Rz and the transmitting area 81S of the transmitting member
81 while monitoring, for example, the driving amount of the
above-described actuator 11V with the encoder system or the like to
thereby move the first substrate table 12 (first substrate stage 1)
in the Y axis direction such that the position in the Z axis
direction of the first substrate table 12 is not changed.
Accordingly, the Z interferometer 6Pz successively receives the
measuring light ML via the respective positions in the Y axis
direction of the transmitting member 81.
[0175] In this situation, if the transmitting member 81 has any
uneven thickness in the Y axis direction, and/or any warpage
arises, then the measured value of the Z interferometer 6Pz is
changed in relation to the Y axis direction, as schematically shown
in FIG. 14, depending on the change of the optical path length
caused due to the uneven thickness and/or the like.
[0176] The controller 7 derives the correction amount in relation
to the measured value of the Z interferometer 6Pz corresponding to
the position in the Y axis direction of the transmitting area 81S
of the transmitting member 81. That is, if any uneven thickness or
the like is present in the transmitting member 81, any error, which
is caused due to the uneven thickness or the like of the
transmitting member 81, arises between the actual position (Z
position) of the first substrate table 12 and the position of the
first substrate table 12 measured by the Z interferometer 6Pz. The
controller 7 derives the correction amount to cancel the error,
corresponding to the position in the Y axis direction of the
transmitting area 81S of the transmitting member 81. The controller
7 stores the derived correction amount in the storage device
10.
[0177] For example, upon exposing the substrate P, when the
controller 7 measures the position information about the first
substrate table 12 with the Z interferometer 6Pz, the controller 7
adjusts the measured value of the Z interferometer 6Pz based on the
measurement result of the Z interferometer 6Pz and the storage
information of the storage device 10. That is, the controller 7
adjusts (corrects) the measured value of the Z interferometer 6Pz,
which may possibly include the error caused due to the uneven
thickness or the like of the transmitting member 81, based on the
correction amount previously determined and stored in the storage
device 10. Then, the controller 7 controls, by using the substrate
stage-driving system 5 (mainly the fine movement system 5B), the
position in the Z axis direction of the first substrate table 12
based on the measured value of the Z interferometer 6Pz after the
adjustment (correction). Accordingly, the position in the Z axis
direction of the first substrate table 12 can be satisfactorily
adjusted based on the measured value of the Z interferometer 6Pz in
which the error caused due to the uneven thickness or the like of
the transmitting member 81 is canceled.
[0178] On the other hand, the controller 7 can also adjust the
position of the first substrate table 12 by determining, based on
the measured value of the Z interferometer 6Pz and the correction
amount stored in the storage device 10, the driving amount of the
substrate stage-driving system 5 (mainly the fine movement system
5B) so as to move the first substrate table 12 to the desired
position and by driving the substrate stage-driving system 5 based
on the determined driving amount, without adjusting (correcting)
the measured value of the Z interferometer 6Pz based on the
correction amount stored in the storage device 10.
[0179] The explanation has been made herein about a case that the
position of the first substrate table 12 is adjusted. However, the
second substrate table 22 is also dealt with equivalently or in the
same manner as described above. In this embodiment, each of the
transmitting members 81, 82 is a member entirely formed of a
transmissive material such as glass. However, it is also allowable
to use a composite member in which only the transmitting area 81S
(82S) (a first transmitting area) and a second transmitting area
opposite to the aperture are formed of the transmissive material.
Alternatively, a metal film or a fluoride film may be partially
formed on the transmitting member 81, 82 in order to strengthen the
transmitting member 81, 82 or to improve the liquid repellence with
respect to the liquid LQ.
Second Embodiment
[0180] Next, a second embodiment will be explained. In the
following description, the constitutive parts or components, which
are same as or equivalent to those of the first embodiment
described above, are designated by the same reference numeral, and
any explanation thereof will be simplified or omitted.
[0181] FIG. 15 is a perspective view of first and second substrate
tables 12, 22 according to the second embodiment. In the first
embodiment described above, the transmitting member 81 is formed so
that the transmitting member 81 has the lower surface opposite to
the substantially entire region of the reflecting surface 1Sz of
the measuring mirror 1Rz arranged on the side surface on the -X
side of the first substrate table 12, in other words, the
transmitting member 81 has an approximately same size (length) as
that of the measuring mirror 2Rz in relation to the Y axis
direction. However, as shown in FIG. 15, the transmitting member 81
may be formed so that the transmitting member 81 has the lower
surface opposite to a partial area of the reflecting surface 1Sz of
the measuring mirror 1Rz. Similarly, the transmitting member 82 may
be also formed so that the transmitting member 82 is opposite to a
partial area of the reflecting surface 2Sz of the measuring mirror
2Rz arranged on the side surface on the +X side of the second
substrate table 22. Even when the transmitting members 81, 82 are
formed to be smaller than the measuring mirrors 1Rz, 2Rz, the
movement of the first and second substrate stages 1, 2 is
controlled so that the end surface 81E of the transmitting member
81 and the end surface 82E of the transmitting member 82 are
allowed to be close to each other or make contact with each other,
and that the liquid immersion space LS passes across the
transmitting members 81, 82. Accordingly, it is possible to
smoothly make the change from one to the other of the state that
the liquid LQ is retained between the first substrate stage 1 and
the first optical element 8 and the state that the liquid LQ is
retained between the second substrate stage 2 and the first optical
element 8, while suppressing the collision between the measuring
mirror 1Rz and the measuring mirror 2Rz and/or the like.
[0182] In the embodiment shown in FIG. 15, in accordance with the
movement of the first substrate stage 1 (second substrate stage 2),
two states, namely a first state that the measuring light ML from
the Z interferometer 6Pz passes through the transmitting member 81
(82) and a second state that the measuring light ML from the Z
interferometer 6Pz does not pass through the transmitting member 81
(82) are both brought about. In this case, there is such a
possibility that any error might appear in the measurement result
of the Z interferometer 6Pz between the first state and the second
state depending on the change in the optical path length due to the
presence or absence of the transmitting member 81 (82).
[0183] Accordingly, if necessary, the controller 7 can correct, for
example, the error of the measured value of the Z interferometer
6Pz resulting from the presence or absence of the transmitting
member 81 (or the transmitting member 82). An explanation will be
made below about an exemplary method for correcting the measured
value of the Z interferometer 6Pz resulting from the presence or
absence of the transmitting member 81.
[0184] At first, before exposing the substrate P, the controller 7
previously executes the operation to obtain the position
information about the first substrate stage 1 in the Z axis
direction by using the Z interferometer 6Pz. The controller 7
monitors, for example, the driving amount of the actuator 11V
described above with the encoder system or the like and the
controller 7 makes the measuring light ML to be irradiated from the
Z interferometer 6Pz while moving the first substrate table 12
(first substrate stage 1) in the Y axis direction such that the
position in the Z axis direction of the first substrate table 12 is
not changed. Accordingly, the measuring light ML via the reflecting
surface 1Sz of the measuring mirror 1Rz and the transmitting area
81S of the transmitting member 81, and the measuring light ML via
the reflecting surface 1Sz of the measuring mirror 1Rz but not via
the transmitting area 81S of the transmitting member 81
successively come into the Z interferometer 6Pz. That is, the
controller 7 obtains the position information about the first
substrate stage 1 in the Z axis direction by making the measuring
light ML to be irradiated from the Z interferometer 6Pz, and by
making the measuring light via the transmitting area 81S of the
transmitting member 81 or the measuring light ML not via the
transmitting area 81S to be received by the Z interferometer
6Pz.
[0185] In this procedure, the measured value of the Z
interferometer 6Pz is changed in relation to the Y axis direction
depending on the change in the optical path length due to the
presence or absence of the transmitting member 81 in relation to
the Y axis direction.
[0186] The controller 7 derives the correction amount in relation
to the measured value of the Z interferometer 6Pz corresponding to
the position in the Y axis direction of the reflecting surface 1Sz
of the measuring mirror 1Rz. That is, any difference arises in the
measured value of the Z interferometer 6Pz between a position at
which the transmitting member 81 is present and another position at
which the transmitting member 81 is absent. The controller 7
derives the correction amount to cancel the difference. The
controller 7 stores the derived correction amount in the storage
device 10.
[0187] For example, when the controller 7 measures the position
information about the first substrate table 12 with the Z
interferometer 6Pz upon exposing the substrate P, the controller 7
adjusts the measured value of the Z interferometer 6Pz based on the
measurement result of the Z interferometer 6Pz and the storage
information of the storage device 10. Namely, the controller 7
adjusts (corrects), based on the correction amount previously
determined and stored in the storage device 10, the measured value
of the Z interferometer 6Pz which might possibly include the error
due to the presence of the transmitting member 81. The controller 7
controls the position in the Z axis direction of the first
substrate table 12 based on the measured value of the Z
interferometer 6Pz after the adjustment (correction), by using the
substrate stage-driving system 5 (mainly the fine movement system
5B). Accordingly, it is possible to satisfactorily adjust the
position in the Z axis direction of the first substrate table 12
based on the measured value of the Z interferometer 6Pz in which
the error caused by the presence of the transmitting member 81 is
canceled.
[0188] On the other hand, the controller 7 can also determine,
based on the measured value of the Z interferometer 6Pz and the
correction amount stored in the storage device 10, the driving
amount of the substrate stage-driving system 5 (mainly the fine
movement system 5B) to move the first substrate table 12 to a
desired position, without adjusting (correcting) the measured value
of the Z interferometer 6Pz based on the correction amount stored
in the storage device 10; and the controller 7 can also drive the
substrate stage-driving system 5 based on the determined driving
amount to adjust the position of the first substrate table 12.
[0189] The explanation has been made herein about the case in which
the position of the first substrate table 12 is adjusted. However,
the second substrate table 22 is also dealt with in the same manner
as described above.
Third Embodiment
[0190] Next, a third embodiment will be explained. In the following
description, the constitutive parts or components, which are same
as or equivalent to those of the embodiment described above, are
designated by the same reference numeral, and any explanation
thereof will be simplified or omitted.
[0191] FIG. 16 is a perspective view of a first substrate table 12
according to the third embodiment. In the first embodiment
described above, one piece of the transmitting member 81 is
arranged to be opposite to the measuring mirror 1Rz arranged on the
side surface on the -X side of the first substrate table 12.
However, as shown in FIG. 16, four pieces of the transmitting
member 81 may be arranged to be opposite to the measuring mirrors
1Rz arranged on the four side surfaces of the first substrate table
12 respectively. Similarly, four transmitting members 82 may be
also provided for the second substrate table 22.
[0192] Accordingly, when the change is made from one to the other
of the state that the liquid LQ is retained between the first
substrate stage 1 and the first optical element 8 and the state
that the liquid LQ is retained between the second substrate stage 2
and the first optical element 8, then the first substrate stage 1
and the second substrate stage 2 can be synchronously moved, for
example, in a state that an end surface 81E of the transmitting
member 81 arranged on the +X side of the first substrate table 12
and an end surface 82E of the transmitting member 82 arranged on
the -X side of the second substrate table 22 are close to each
other or make contact with each other; or the first substrate stage
1 and the second substrate stage 2 can be synchronously moved in a
state that an end surface 81E of the transmitting member 81
arranged on the +Y side of the first substrate table 12 and an end
surface 82E of the transmitting member 82 arranged on the -Y side
of the second substrate table 22 are close to each other or make
contact with each other.
Fourth Embodiment
[0193] Next, a fourth embodiment will be explained. In the
following description, the constitutive parts or components, which
are same as or equivalent to those of the embodiment described
above, are designated by the same reference numeral, and any
explanation therefor will be simplified or omitted.
[0194] The feature of the fourth embodiment is that the
transmitting members (movable members) 81, 82 are supported movably
with respect to the first and second substrate tables 12, 22; and
that the transmitting members 81, 82 are moved to a first position
at which the end surfaces 81E, 82E protrude outwardly more than the
measuring mirrors 1Rz, 2Rz and to a second positions at which the
transmitting members 81, 82 do not obstruct the travels of the
measuring lights ML from the reflecting surfaces 2Sz of the
measuring mirrors 1Rz, 2Rz, respectively. The phrase "do (does) not
obstruct travel of the measuring light (beam)" means that the "do
(does) not affect the optical path for the light", namely the
measuring light ML does not undergo any one of the transmission,
refraction, and reflection with respect to the member 81, 82, and
the optical path length of the measuring light is not changed
thereby.
[0195] FIG. 17 is a side view of the first substrate table 12
according to the fourth embodiment as viewed from the -X side. FIG.
18 is a plan view of a part of the first substrate table 12. FIG.
19 is a side sectional view of a part of the first substrate table
12. In the following, although an explanation will be given mainly
about the first substrate table 12 and the transmitting member 81,
the explanation is also applied to the second substrate table 22
and the transmitting member 82 similarly or equivalently as
well.
[0196] The transmitting member 81 is a plate-shaped member having
upper and lower surfaces, and has the end surface 81E in the same
manner as in each of the embodiments described above. In this
embodiment, the transmitting member 81 is supported movably at
least in the X axis direction with respect to the first substrate
table 12, in the drawing. The end surface 81E of the transmitting
member 81 is arranged in a predetermined positional relationship
with respect to the reflecting surface 1Sz of the measuring mirror
1Rz.
[0197] In this embodiment, a plurality of (three in this
embodiment) guiding objective members 83 extending in the X axis
direction are connected to the lower surface, of the transmitting
member 81, which is opposite to or facing the first substrate table
12. Guide grooves 84, extending in the X axis direction and each
having the guiding objective members 83 arranged therein, are
formed inside the holding surface 15B of the opposing surface 15,
of the first substrate table 12, which is opposite to or facing the
lower surface of the transmitting member 81. The size (length) of
each of the guide grooves 84 in relation to the X axis direction is
larger (longer) than the size (length) of the guiding objective
member 83. The size (width) of the guide groove 84 in relation to
the Y axis direction is larger than the size (width) of the guiding
objective member 83.
[0198] Gas supply ports 85, each of which supplies a gas to a space
between the side surfaces of the guiding objective member 83 and
the inner side surfaces of one of the guide grooves 84, are formed
on the inner side surfaces, of the guide groove 84, which is
opposite to or facing the side surfaces of the guiding objective
member 83. By the gas which is supplied from the gas supply ports
85, a gap is maintained between the side surfaces of the guiding
objective member 83 and the inner side surfaces of the guide groove
84 opposite thereto.
[0199] FIGS. 20 and 21 are sectional views of FIG. 17. The first
substrate table 12 is provided with support mechanisms 86 which
support the transmitting member 81 from the lower surface side in a
non-contact manner. In this embodiment, a magnet (for example, the
N-pole) is arranged on the lower surface of each of the guiding
objective members 83. The support mechanism 86 includes a magnet
(for example, the N-pole) arranged on the bottom surface of each of
the guide grooves 84 opposite to the lower surface of the guiding
objective member 83. The magnet of the guiding objective member 83
has the pole which is same as the pole of the magnet of the guide
groove 84. Therefore, the magnets are repelled to each other,
thereby supporting the transmitting member 81 connected to the
guiding objective members 83 in the non-contact manner with respect
to the holding surface 15B of the first substrate table 12 opposite
to the lower surface of the transmitting member 81, as shown in
FIG. 21.
[0200] The support mechanism 86 also includes the gas supply ports
85 described above. The gap is maintained between the side surfaces
of the guiding objective member 83 and the opposing inner side
surfaces of the guide groove 84 by the gas supplied from the gas
supply ports 85 even in such a state that the guiding objective
member 83 is floated by the magnets with respect to the bottom
surface of the guide groove 84.
[0201] The transmitting member 81, which has the guiding objective
members 83 supported in the non-contact manner with respect to the
holding surface 15B of the first substrate table 12 by the support
mechanisms 86, is movable in the X axis direction while being
guided by the guide grooves 84. The transmitting member 81 moves in
the X axis direction while being guided by the guide grooves 84, to
be thereby movable to the first position at which the end surface
81E protrudes outwardly more than the measuring mirror 1Rz and the
second position at which the end surface 81E does not obstruct the
travel of the measuring light ML from the reflecting surface 1Sz of
the measuring mirror 1Rz.
[0202] In this embodiment, the nozzle member 30 is capable of
holding the transmitting member 81 from the upper surface side. As
described above, the nozzle member 30 of this embodiment includes
the seal member which is disclosed, for example, in Japanese Patent
Application Laid-open Nos. 2004-289126 (corresponding to U.S. Pat.
No. 6,952,253) and 2004-289128 (corresponding to U.S. Pat. No.
7,110,081). The nozzle member 30 has a gas introducing port and a
gas discharge port. The controller 7 is capable of forming a gas
bearing between the lower surface of the nozzle member 30 and the
upper surface of the transmitting member 81 by a gas introducing
(supply) operation via the gas introducing port of the nozzle
member 30 and a gas discharge (sucking) operation via the gas
discharge port, while making the nozzle member 30 to be opposite to
the transmitting member 81 supported in the non-contact manner with
respect to the holding surface 15B of the first substrate table 12
with the support mechanisms 86. A gas bearing of the pressurizing
vacuum type is formed between the lower surface of the nozzle
member 30 and the upper surface of the transmitting member 81. A
gap G (for example, a gap of 0.1 to 1.0 mm) is maintained by the
gas bearing between the lower surface of the nozzle member 30 and
the upper surface of the transmitting member 81. The nozzle member
30 is capable of forming the liquid immersion space LS of the
liquid LQ with respect to the transmitting member 81. Further, the
nozzle member 30 is capable of holding the upper surface of the
transmitting member 81 by forming the gas bearing with respect to
the transmitting member 81 at the outside of the liquid immersion
space LS. That is, the nozzle member 30 holds the transmitting
member 81 in the state that the predetermined gap is maintained
between the lower surface of the nozzle member 30 and the upper
surface of the transmitting member 81, by utilizing the sucking
action generated by the formation of the gas bearing between the
nozzle member 30 and the transmitting member 81.
[0203] In this embodiment, the exposure apparatus EX is provided
with a second holding mechanism 87 which is provided for the first
substrate table 12 and which is capable of holding the transmitting
member 81 by attracting the lower surface of the transmitting
member 81 arranged at least one of the first position and the
second position. The second holding mechanism 87 includes suction
ports 88 which are formed at predetermined positions, of the
holding surface 15B, of the first substrate table 12, opposite to
the lower surface of the transmitting member 81 and which is
capable of sucking the gas, and a vacuum system (not shown) which
is connected to the suction ports 88 via a flow passage.
[0204] The controller 7 is capable of attracting and holding the
lower surface of the transmitting member 81 with the holding
surface 15B by driving the vacuum system of the second holding
mechanism 87 in a state that the lower surface of the transmitting
member 81 and the holding surface 15B of the first substrate table
12 are opposite to each other to thereby suck the gas in the space
between the lower surface of the transmitting member 81 and the
holding surface 15B via the suction ports 88. The controller 7 is
capable releasing the transmitting member 81 from the state of
being attracted and held, by stopping the driving operation of the
vacuum system of the second holding mechanism 87.
[0205] The controller 7 is capable of controlling the second
holding mechanism 87 to execute the sucking operation using the
suction ports 88, by controlling the vacuum system so that the
holding force brought about by the second holding mechanism 87,
namely the force (suction force), generated by the sucking
operation by the suction ports 88 for the gas between the lower
surface of the transmitting member 81 and the holding surface 15B
and attracting the transmitting member 81 toward the holding
surface 15B, is stronger than the repelling force generated between
the magnets of the guiding objective members 83 and the magnets of
the guide grooves 84. The controller 7 is capable of holding
(suction-holding) the transmitting member 81 with the holding
surface 15B of the first substrate table 12 so that the holding
surface 15B of the first substrate table 12 and the lower surface
of the transmitting member 81 make contact with each other as shown
in FIG. 20, by executing the sucking operation using the suction
ports 88 so that the force (suction force), generated by the
sucking operation by the suction ports 88 and attracting the
transmitting member 81 toward the holding surface 15B, is stronger
than the repelling force generated between the magnets of the
guiding objective members 83 and the magnets of the guide grooves
84.
[0206] Next, an explanation will be made, with reference to
schematic views shown in FIG. 22, about an example of the operation
of the exposure apparatus EX according to the fourth embodiment. In
this embodiment, the controller 7 moves the transmitting member 81
to the second position at which the travel of the measuring light
from the reflecting surface 1Sz of the measuring mirror 1Rz is not
obstructed by the transmitting member 81 as shown, for example, in
FIG. 19 at least during the period in which the exposure light EL
is irradiated onto the substrate P held by the first substrate
table 12. That is, in this embodiment, the transmitting member 81
is arranged at the second position at which the transmitting member
81 does not obstruct at least the travel of the measuring light
from the reflecting surface 1Sz of the measuring mirror 1Rz at
least during the exposure of the substrate P held by the first
substrate table 12. The controller 7 uses the second holding
mechanism 87 to hold the lower surface of the transmitting member
81 arranged at the second position so that the lower surface of the
transmitting member 81 is attracted to the holding surface 15B of
the first substrate table 12. In this embodiment, the transmitting
member 81 is held by the second holding mechanism 87 at the
position at which the end surface 81E does not protrude outwardly
more than or beyond the side surface of the first substrate table
12.
[0207] The controller 7 moves the second substrate stage 2 from the
second area SP2 of the measuring station ST2 to the first area SP1
of the exposure station ST1 after the exposure process is completed
for the substrate P held by the first substrate stage 1 in the
exposure station ST1 and the measurement process is completed for
the substrate P held by the second substrate stage 2 in the
measuring station ST2. The controller 7 executes the exchange
operation between the first connecting member 71 and the second
connecting member 72 for the first substrate stage 1 and the second
substrate stage 2, while maintaining the state that the first
substrate stage 1 and the first optical element 8 are opposite to
each other.
[0208] Subsequently, the controller 7 uses the substrate
stage-driving system 5 to make the change from the state that at
least one of the first substrate stage 1 and the transmitting
member 81 is opposite to the first optical element 8 (namely, state
that the liquid LQ is retained between the first optical element 8
and at least one of the first substrate stage 1 and the
transmitting member 81) to the state that at least one of the
second substrate stage 2 and the transmitting member 82 is opposite
to the first optical element 8 (namely, state that the liquid LQ is
retained between the first optical element 8 and at least one of
the second substrate stage 2 and the transmitting member 82).
Accordingly, the substrate P on the second substrate stage 2 can be
subjected to the liquid immersion exposure.
[0209] At first, the controller 7 controls the position of the
first substrate stage 1 by using the substrate stage-driving system
5 so that the nozzle member 30 and the transmitting member 81 are
opposite to each other. With this, the liquid immersion space LS is
formed between the nozzle member 30 and the transmitting member 81,
and the gas bearing is formed at the outside of the liquid
immersion space LS. In this embodiment, the size in the X axis
direction of the transmitting member 81 is greater than at least
the size in the X axis direction of the liquid immersion space LS.
In this embodiment, the size of the upper surface of the
transmitting member 81 is greater than at least the size of the
liquid immersion space LS, in the XY plane substantially parallel
to the upper surface of the transmitting member 81. Therefore, the
liquid immersion space LS can be formed between the nozzle member
30 and the transmitting member 81.
[0210] Then, the controller 7 stops the sucking operation which has
been performed via the suction ports 88 of the second holding
mechanism 87. Accordingly, as shown in FIG. 22A, the transmitting
member 81 is supported in the non-contact manner with respect to
the holding surface 15B of the first substrate table 12 in
accordance with the action of the support mechanisms 86 including
the magnets.
[0211] The gas bearing is formed between the nozzle member 30 and
the upper surface of the transmitting member 81. The nozzle member
30 holds, from the upper surface side, the transmitting member 81
supported in the non-contact manner with respect to the holding
surface 15B of the first substrate table 12 by the support
mechanisms 86.
[0212] After the controller 7 makes the upper surface of the
transmitting member 81 to be held by the nozzle member 30, the
controller 7 moves the first substrate table 12 relative to the
transmitting member 81 held by the nozzle member 30. In this
embodiment, the controller 7 controls the substrate stage-driving
system 5 to move the first substrate table 12 (first substrate
stage 1) in the +X direction with respect to the transmitting
member 81 held by the nozzle member 30. The transmitting member 81
having the guiding objective members 83, which is held by the
nozzle member 30, is moved in the -X direction with respect to the
first substrate table 12 while being guided by the guide grooves
84. Accordingly, as shown in FIG. 22B, the transmitting member 81
is moved to the first position at which the end surface 81E
protrudes outwardly more than or beyond the measuring mirror
1Rz.
[0213] In this embodiment, the exposure apparatus EX has a third
holding mechanism 100 which is capable of holding the transmitting
member 82 of the second substrate table 22 from the upper surface
side. The third holding mechanism 100 holds the upper surface of
the transmitting member 82 by forming a gas bearing with respect to
the upper surface of the transmitting member 82. The controller 7
controls the substrate stage-driving system 5 to move the second
substrate table 22 in the -X direction in a state that the upper
surface of the transmitting member 82 supported in the non-contact
manner with respect to the second substrate table 22 is held by the
third holding mechanism 100. Accordingly, as shown in FIG. 22B, the
transmitting member 82 is moved to the first position at which the
end surface 82E protrudes outwardly more than or beyond the
measuring mirror 2Rz.
[0214] As shown in FIG. 22C, after the transmitting member 81 is
moved to the first position, the controller 7 uses the second
holding mechanism 87 of the first substrate table 12 to hold the
lower surface of the transmitting member 81 arranged at the first
position so that the lower surface of the transmitting member 81 is
attracted to the holding surface 15B of the first substrate table
12. Similarly, the controller 7 uses the second holding mechanism
of the second substrate table 22 to hold the transmitting member 82
arranged at the first position so that the transmitting member 82
is attracted to the holding surface of the second substrate table
22.
[0215] The controller 7 controls the substrate stage-driving system
5 to synchronously move the first substrate stage 1 and the second
substrate stage 2 in the state that the end surface 81E of the
transmitting member 81 of the first substrate table 12 moved to the
first position and the end surface 82E of the transmitting member
82 of the second substrate table 22 moved to the first position are
close to each other or make contact with each other.
[0216] When the controller 7 synchronously moves the first
substrate stage 1 and the second substrate stage 2 by using the
substrate stage-driving system 5, the controller 7 moves the
transmitting member 81 and the transmitting member 82 to the first
positions respectively to allow the end surface 81E of the
transmitting member 81 of the first substrate table 12 and the end
surface 82E of the transmitting member 82 of the second substrate
table 22 to be close to each other or make contact with each other.
By doing so, at least one of the transmitting member 81, the
transmitting member 82, the first substrate stage 1, and the second
substrate stage 2 forms the space capable of holding the liquid LQ
with respect to the first optical element 8.
[0217] That is, when the controller 7 synchronously moves the first
substrate table 12 and the second substrate table 22 by using the
substrate stage-driving system 5, the controller 7 moves the
transmitting members 81, 82 to the first positions by using, for
example, the nozzle member 30, the third holding mechanism 100, the
substrate stage-driving system 5 and the like.
[0218] The controller 7 uses the substrate stage-driving system 5
to move the first substrate stage 1 and the second substrate stage
2 synchronously in the XY plane with respect to the first optical
element 8 in the first area SP1 of the guide surface GF including
the position at which the exposure light EL from the first optical
element 8 is irradiated and which is opposite to the first optical
element 8, in the state that the end surface 81E of the
transmitting member 81 and the end surface 82E of the transmitting
member 82 are close to each other or make contact with each other.
Accordingly, the controller 7 can make the change from the state
that at least one of the first substrate table 12 and the
transmitting member 81 is opposite to the first optical element 8
and the liquid LQ is retained between the first optical element 8
and at least one of the first substrate table 12 and the
transmitting member 81 to the state that at least one of the second
substrate table 22 and the transmitting member 82 is opposite to
the first optical element 8 and the liquid LQ is retained between
the first optical element 8 and at least one of the second
substrate table 22 and the transmitting member 82.
[0219] In this embodiment, when the change is made from the state
that the liquid LQ is retained between the first substrate table 12
and the first optical element 8 to the state that the liquid LQ is
retained between the second substrate table 22 and the first
optical element 8, the end surface 81E of the transmitting member
81 is moved to the first position at which the end surface 81E
protrudes outwardly more than the measuring mirror 1Rz, and the end
surface 82E of the transmitting member 82 is moved to the first
position at which the end surface 82E protrudes outwardly more than
the measuring mirror 2Rz. Since the end surface 81E of the
transmitting member 81 and the end surface 82E of the transmitting
member 82 are allowed to be close to each other or make contact
with each other, it is possible to suppress or prevent the contact
(collision) between the measuring mirror 1Rz of the first substrate
table 12 and at least one of the second substrate table 22 and the
measuring mirror 2Rz and to suppress or prevent the contact
(collision) between the measuring mirror 2Rz of the second
substrate table 22 and at least one of the first substrate table 12
and the measuring mirror 1Rz. Accordingly, it is possible to
smoothly make the change from the state that the liquid LQ is
retained between the first substrate stage 1 and the first optical
element 8 to the state that the liquid LQ is retained between the
second substrate stage 2 and the first optical element 8, while
suppressing the leakage of the liquid LQ.
[0220] After making the nozzle member 30 and the transmitting
member 82 to be opposite to each other, the controller 7 cancels or
releases the holding operation for the transmitting member 82
having been effected by the second holding mechanism of the second
substrate table 22. Accordingly, the transmitting member 82 is
supported in the non-contact manner with respect to the holding
surface 15B of the second substrate table 22.
[0221] The nozzle member 30 holds the upper surface of the
transmitting member 82 by forming the liquid immersion space LS
between the nozzle member 30 and the upper surface of the
transmitting member 82 and forming the gas bearing between the
nozzle member 30 and the transmitting member 82 at the outside of
the liquid immersion space LS. In this embodiment, the size in the
X axis direction of the transmitting member 82 is greater than at
least the size in the X axis direction of the liquid immersion
space LS. In this embodiment, the size of the upper surface of the
transmitting member 82 is greater than at least the size of the
liquid immersion space LS, in the XY plane substantially parallel
to the upper surface of the transmitting member 82. Therefore, the
liquid immersion space LS can be formed between the nozzle member
30 and the transmitting member 82.
[0222] After making the upper surface of the transmitting member 82
to be held by the nozzle member 30, the controller 7 moves the
second substrate table 22 relative to the transmitting member 82
held by the nozzle member 30. In this embodiment, the controller 7
controls the substrate stage-driving system 5 to move the second
substrate table 22 (second substrate stage 2) in the +X direction
with respect to the transmitting member 82 held by the nozzle
member 30. Accordingly, as shown in FIG. 22D, the transmitting
member 82 is moved to the second position at which the transmitting
member 82 does not obstruct the travel of the measuring light from
the reflecting surface 2Sz of the measuring mirror 2Rz, namely the
transmitting member 82 is not irradiated with the measuring
light.
[0223] After making the transmitting member 82 to be moved to the
second position, the controller 7 uses the second holding mechanism
of the second substrate table 22 to effect the holding so that the
lower surface of the transmitting member 82 is attracted by suction
(suction-attracted) to the holding surface of the second substrate
table 22. After moving the transmitting member 82 to the second
position, the controller 7 starts the exposure of the substrate P
held by the second substrate table 22.
[0224] In this embodiment, as shown in FIG. 22D, the exposure
apparatus EX is provided with a fourth holding mechanism 101 which
is capable of holding the transmitting member 81 of the first
substrate table 12 from the upper surface side. The fourth holding
mechanism 101 holds the upper surface of the transmitting member 81
by forming a gas bearing with respect to the upper surface of the
transmitting member 81. The controller 7 moves the first substrate
table 12 in the -X direction in a state that the upper surface of
the transmitting member 81 supported in the non-contact manner with
respect to the first substrate table 12 is held by the fourth
holding mechanism 101. Accordingly, as shown in FIG. 22D, the
transmitting member 81 is moved to the second position at which the
transmitting member 81 does not obstruct the travel of the
measuring light from the reflecting surface 1Sz of the measuring
mirror 1Rz. After moving the transmitting member 81 to the second
position, the controller 7 uses the second holding mechanism 87 of
the first substrate table 12 to effect the holding so that the
lower surface of the transmitting member 81 is suction-attracted to
the holding surface 15B of the first substrate table 12.
[0225] As explained above, according to this embodiment, the
transmitting members 81, 82 are moved to the first positions so
that the end surfaces 81E, 82E of the transmitting members 81, 82
protrude outwardly more than the measuring mirrors 1Rz, 2Rz
respectively only when the change is made from one to the other of
the state that the liquid LQ is retained between the first
substrate table 1 and the first optical element 8 and the state
that the liquid LQ is retained between the second substrate stage 2
and the first optical element 8. Since the transmitting members 81,
82 are moved to the second positions so that the transmitting
members 81, 82 do not obstruct the travels of the measuring lights
of the Z interferometers 6Pz at least when the exposure of the
substrate P is performed, it is possible to smoothly execute the
movement of the liquid immersion space LS between the first
substrate table 12 and the second substrate table 22, and it is
possible to maintain the measurement accuracy of the Z
interferometer 6Pz at least during the exposure of the substrate P.
Therefore, the substrate P can be exposed satisfactorily.
[0226] In the fourth embodiment, the transmitting members 81, 82
are moved to the positions at which the transmitting members 81, 82
do not obstruct the travels of the measuring lights of the Z
interferometers 6Pz at least during the exposure of the substrate
P. Therefore, it is not necessarily indispensable that the
transmitting members 81, 82 have the function to transmit the light
beam. Namely, it is possible to use a non-transmissive member
instead of the transmitting members 81, 82 used in the first
embodiment. For example, it is possible to use a member formed of a
metal including stainless steel, titanium and the like; or a
synthetic resin having the liquid repellence including
polytetrafluoroethylene and the like. Alternatively, only a portion
covering the optical sensor 75 may be made light transmissive, and
other portions may be formed of a non-transmissive member.
[0227] In the projection optical system of each of the first to
fourth embodiments described above, the optical path space on the
image plane (light-exit surface) side of the optical element
arranged at the end portion, is filled with the liquid. However, as
disclosed for example in International Publication No. 2004/019128
(corresponding to United States Patent Application Publication No.
2005/0248856) etc., it is also possible to adopt a projection
optical system wherein the optical path space on the object plane
(light incident surface) side of the optical element arranged at
the end portion is also filled with the liquid. Further, a thin
film, which has the liquid-attracting and/or dissolution-preventive
function, may be formed on all or a part (including at least the
contact surface which makes contact with the liquid) of the surface
of the terminal end optical element 8. Although silica glass has
the high affinity for the liquid, and thus any
dissolution-preventive film is unnecessary therefor, it is
preferable to form at least an anti-dissolution film for calcium
fluoride.
[0228] The measuring operation in the measuring station ST2 may be
performed in a state that the liquid immersion space LS is formed
on the substrate P and/or on the first and second substrate tables
12, 22. The supply operation and the recovery operation for the
liquid LQ may be possibly required in order to form the liquid
immersion space LS in the measuring station ST2. However, it is
enough that the operations described above are performed during the
period in which the exposure is performed for the substrate P in
the other station. Therefore, the throughput is scarcely affected
thereby.
[0229] Each of the embodiments described above is illustrative of
the case in which the transmitting member 81 is provided for the
first substrate table 12 and the transmitting member 82 is provided
for the second substrate table 22. However, it is also allowable
that the transmitting member is provided for only any one of the
substrate tables. In this case, by making the transmitting member
to have a length which is not less than twice the length of a
protruding portion, of one measuring mirror, for example, the
measuring mirror 1Rz, protruding outwardly from the substrate table
12, it is possible to prevent the measuring mirrors 1Rz, 2Rz from
colliding with each other when the liquid immersion space LS is
delivered from the first substrate table 12 to the second substrate
table 22. Further, in each of the above-described embodiments, the
interferometer mirrors (reflecting surfaces) are provided on four
side surfaces, respectively, of each of the substrate tables (12,
22). However, the number and arrangement of the mirrors (reflecting
surfaces) are not limited to this. For example, the mirrors may be
provided on only two or three side surfaces. Further, in each of
the above-described embodiments, the transmitting member is
provided on the end portion, of the substrate table, for which the
interferometer is provided. However, the arrangement of the
transmitting member is not limited to this. For example, it is
allowable that the transmitting member is provided on an end
portion, of the substrate table, for which any interferometer
mirror is not provided.
[0230] Each of the foregoing embodiments have been explained as
exemplified by the multi-stage type exposure apparatus using the
liquid immersion method by way of example. However, the present
invention is not limited thereto. It is also allowable to adopt any
exposure apparatus which has one stage, and it is also allowable to
adopt any exposure apparatus which does not use the liquid
immersion method. It is possible to use the present invention
depending on the relationship between the position of the substrate
table and the position of passage of the measuring light for the Z
interferometer.
[0231] The liquid LQ is water in the embodiment of the present
invention. However, the liquid LQ may be any liquid other than
water. For example, when the light source of the exposure light EL
is the F.sub.2 laser, the F.sub.2 laser beam is not transmitted
through water. Therefore, as the liquid LQ, it is allowable to use,
for example, fluorine-based fluids such as fluorine-based oil and
perfluoropolyether (PFPE). Alternatively, other than the above, it
is also possible to use, as the liquid LQ, liquids (for example,
cedar oil and the like) which have the transmittance with respect
to the exposure light EL, which have the refractive index as high
as possible, and which are stable against the photoresist coated on
the surface of the substrate P and the projection optical system
PL. As for the liquid LQ, it is also allowable to use liquids
having the refractive index of about 1.6 to 1.8. The liquid LQ,
which has the refractive index higher than that of pure water (for
example, the refractive index of not less than 1.5), includes, for
example, predetermined liquids having the C--H bond or the O--H
bond such as isopropanol having a refractive index of about 1.50
and glycerol (glycerin) having a refractive index of about 1.61;
predetermined liquids (organic solvents) such as hexane, heptane,
and decane; and decalin (decahydronaphthalene) having a refractive
index of about 1.60. As for the liquid LQ, it is also allowable to
use those obtained by mixing arbitrary two or more liquids of the
foregoing liquids and those obtained by adding (mixing) at least
one of the foregoing liquid or liquids to (with) pure water.
Further, as for the liquid LQ, it is also allowable to use those
obtained by adding (mixing) base or acid such as H.sup.+, Cs.sup.+,
K.sup.+, Cl.sup.-, SO.sub.4.sup.2-, and PO.sub.4.sup.2- to (with)
pure water, and it is also allowable to use those obtained by
adding (mixing) fine particles of Al oxide or the like to (with)
pure water. As for the liquid LQ, it is preferable to use those
which have small coefficient of light absorption, which have small
temperature dependency, and which are stable against the
photosensitive material (or, for example, the top coat film or the
antireflection film) coated on the surface of the substrate P
and/or the projection system PL. As for the liquid LQ, it is also
possible to use various fluids including, for example,
supercritical fluids.
[0232] In the respective embodiments described above, the
interferometer system is used to measure the position information
about each of the mask stage and the substrate stage. However, the
measurement of the position information is not limited to this. For
example, it is also allowable to use an encoder system for
detecting the scale (diffraction grating) provided on each of the
stages, as disclosed, for example, in International Publication No.
2007/083758 (corresponding to U.S. patent application Ser. No.
11/655,082), International Publication No. 2007/097379
(corresponding to U.S. patent application Ser. No. 11/708,533) and
the like. Alternatively, it is allowable to use an encoder system
having an encoder head which is provided on the substrate table and
a scale provided at a position above or over the substrate table,
as disclosed, for example, in United States Patent Application
Publication No. 2006/0227309 and the like. In this case, it is
preferable that a hybrid system comprising both of the
interferometer system and the encoder system is provided, and that
the measurement result of the encoder system is calibrated
(subjected to the calibration) by using the measurement result of
the interferometer system. The position control of the stage may be
performed by switchingly using the interferometer system and the
encoder system or using both of the interferometer system and the
encoder system. Further, in each of the embodiments, it is
allowable to use, as the actuator driving the first and second
substrate stages, a planar motor.
[0233] The substrate P, which is usable in the respective
embodiments described above, is not limited to the semiconductor
wafer for producing the semiconductor device. Those applicable
include, for example, a glass substrate for the display device, a
ceramic wafer for the thin film magnetic head, a master plate
(synthetic silica glass, silicon wafer) for the mask or the reticle
to be used for the exposure apparatus, a film member and the like.
The shape of the substrate P is not limited only to the circular
shape, and may be any other shape including, for example,
rectangular shapes.
[0234] As for the exposure apparatus EX, the present invention is
also applicable to a scanning type exposure apparatus based on the
step-and-scan system (scanning stepper) for performing the scanning
exposure with the pattern of the mask M by synchronously moving the
mask M and the substrate P as well as to a projection exposure
apparatus based on the step-and-repeat system (stepper) for
performing the full field exposure with the pattern of the mask M
in a state that the mask M and the substrate P are allowed to stand
still, and successively step-moving the substrate P.
[0235] In the exposure based on the step-and-repeat system, a
reduction image of a first pattern may be transferred onto the
substrate P by using the projection optical system in a state that
the first pattern and the substrate P are allowed to substantially
stand still; and then the full field exposure may be performed on
the substrate P by partially overlaying a reduction image of a
second pattern with respect to the first pattern by using the
projection optical system in a state that the second pattern and
the substrate P are allowed to substantially stand still. Namely,
the exposure apparatus EX may be a full field exposure apparatus
based on the stitch system. As for the exposure apparatus based on
the stitch system, the present invention is also applicable to an
exposure apparatus based on the step-and-stitch system in which at
least two patterns are partially overlaid and transferred on the
substrate P, and the substrate P is successively moved. Note that
the exposure apparatus of the stitch system may be a scanning type
exposure apparatus which transfers each of the patterns by the
scanning exposure.
[0236] The present invention is also applicable to an exposure
apparatus provided with a substrate stage which holds the
substrate; and a measuring stage which is provided with a reference
member having a reference mark formed therein and/or various
photoelectric sensors as disclosed, for example, in Japanese Patent
Application Laid-open No. 11-135400 (corresponding to International
Publication No. 1999/23692) and Japanese Patent Application
Laid-open No. 2000-164504 (corresponding to U.S. Pat. No.
6,897,963). The contents of U.S. Pat. No. 6,897,963 etc. is
incorporated herein by reference within a range of permission of
the domestic laws and ordinances of the designated state or the
selected state. For example, when a measuring mirror (having a
mirror surface formed of an inclined surface), which protrudes from
the side surface, is provided on or for at least one of the
substrate stage and the measuring stage, the substrate P can be
efficiently exposed by applying the present invention. In this
case, the liquid immersion space can be moved between the substrate
stage and the measuring stage such that the substrate stage and the
measuring stage are moved in a state that the substrate stage and
the measuring stage are made to approach to each other or brought
into contact with each other and that the other of the substrate
stage and the measuring stage is arranged to be opposite to the
optical element 8 in exchange with respect to one of the substrate
stage and the measuring stage. On the measuring stage, the
measurement relating to the exposure (for example, the base line
measurement) can be executed by using the measuring device
(measuring member) provided on the measuring stage in a state that
the liquid immersion space is formed. Accordingly, it is possible
to obtain the information required for the liquid immersion
exposure for the substrate P (for example, the base line amount,
the illuminance of the exposure light EL, and/or the like). Details
of the operation for moving the liquid immersion space between the
substrate stage and the measuring stage and the measuring operation
of the measuring stage during the exchange of the substrate are
disclosed, for example, in International Publication No.
2005/074014 (corresponding to European Patent Application
Publication No. 1713113) and International Publication No.
2006/013806. Further, the exposure apparatus having the measuring
stage may be provided with a plurality of substrate stages.
[0237] The respective embodiments described above have been
explained as exemplified by the exposure apparatus provided with
the projection optical system PL by way of example. However, the
present invention is applicable to an exposure apparatus and an
exposure method in which the projection optical system PL is not
used. Even when the projection optical system PL is not used in
such apparatus and method, the exposure light beam is radiated onto
the substrate via an optical member such as a lens, and the liquid
immersion area is formed in a predetermined space between such an
optical member and the substrate. It is also possible to omit the
mask stage depending on the above-described exposure system.
[0238] The respective embodiments described above have been
explained as exemplified by the case of the application of the
liquid immersion method in which the substrate P is exposed in such
a state that the optical path space for the exposure light EL is
filled with the liquid LQ by way of example. However, the present
invention is also applicable to the ordinary dry type exposure
apparatus in which the optical path space for the exposure light EL
is filled only with a gas, rather than being filled with the liquid
LQ.
[0239] The optical element (terminal end optical element) 8 of the
projection optical system PL may be formed of, for example, a
single crystal material of fluorine compound such as barium
fluoride, strontium fluoride, lithium fluoride, sodium fluoride and
the like; or silica glass (silica), instead of calcium fluoride.
Alternatively, the optical element (terminal end optical element) 8
may be formed of a material having a refractive index higher than
those of silica glass and calcium fluoride (for example, a material
having a refractive index of not less than 1.6). Materials usable
as the material having the refractive index of not less than 1.6
include, for example, sapphire, germanium dioxide and the like
disclosed in International Publication No. 2005/059617, and
potassium chloride (refractive index: about 1.75) disclosed in
International Publication No. 2005/059618.
[0240] In the respective embodiments described above, the ArF
excimer laser is used as the light source for the exposure light
EL. However, it is also allowable to use a high harmonic
wave-generating device which includes, for example, a solid laser
light source such as a DFB semiconductor laser or a fiber laser; a
light-amplifying section having a fiber amplifier or the like; and
a wavelength-converting section, and which outputs a pulse light
beam having a wavelength of 193 nm as disclosed, for example, in
U.S. Pat. No. 7,023,610. Further, in the respective embodiments
described above, the projection area (exposure area) is
rectangular. However, it is also allowable to adopt any other shape
including, for example, circular arc-shaped, trapezoidal,
parallelogramic, rhombic shapes and the like.
[0241] As for the type of the exposure apparatus EX, the present
invention is not limited to the exposure apparatus for the
semiconductor device production which exposes the substrate P with
the semiconductor device pattern. The present invention is also
widely applicable, for example, to an exposure apparatus which
produces a liquid crystal display device or for producing a display
as well as to an exposure apparatus which produces, for example, a
thin film magnetic head, an image pickup device (CCD), a
micromachine, MEMS, a DNA chip, a reticle, or a mask; and the
like.
[0242] In the embodiments described above, the light-transmissive
type mask is used, in which a predetermined light-shielding pattern
(or phase pattern or dimming or light-reducing pattern) is formed
on a light-transmissive substrate. However, in place of such a
mask, as disclosed, for example, in U.S. Pat. No. 6,778,257, it is
also allowable to use an electronic mask which forms, based on
electronic data of a pattern to be subjected to the exposure a
transmissive pattern, a reflective pattern, or a light-emitting
pattern. The electronic mask is also referred to as "variable
shaped mask", "active mask" or "image generator" and includes DMD
(Digital Micro-mirror Device) as a kind of the non-light emission
type image display device (spatial image modulator). The exposure
apparatus using DMD is disclosed, for example, in Japanese Patent
Application Laid-open Nos. 8-313842 and 2004-304135 in addition to
U.S. Pat. No. 6,778,257 as mentioned above. The contents of U.S.
Pat. No. 6,778,257 is incorporated herein by reference within a
range of permission of the domestic laws and ordinances of the
designated state or the selected state.
[0243] The present invention is also applicable to an exposure
apparatus (lithography system) in which the substrate P is exposed
with a line-and-space pattern by forming interference fringes on
the substrate P as disclosed, for example, in International
Publication No. 2001/035168.
[0244] The present invention is also applicable, for example, to an
exposure apparatus in which patterns of two masks are combined on
the substrate via the projection optical system, and one shot area
on the substrate is subjected to the double exposure substantially
simultaneously by performing one time of the scanning exposure as
disclosed, for example, Published Japanese Translation of PCT
International Publication for Patent Application No. 2004-519850
(corresponding to U.S. Pat. No. 6,611,316). The contents of U.S.
Pat. No. 6,611,316 is incorporated herein by reference within a
range of permission of the domestic laws and ordinances of the
designated state or the selected state of this international
application. The present invention is also applicable, for example,
to an exposure apparatus based on the proximity system and a mirror
projection aligner.
[0245] As described above, the exposure apparatus EX according to
each of the embodiments of the present invention is produced by
assembling the various subsystems including the respective
constitutive elements as defined in claims so that the
predetermined mechanical accuracy, electric accuracy, and optical
accuracy are maintained. In order to secure the various accuracies,
those performed before and after the assembling include the
adjustment for achieving the optical accuracy for the various
optical systems, the adjustment for achieving the mechanical
accuracy for the various mechanical systems, and the adjustment for
achieving the electric accuracy for the various electric systems.
The steps of assembling the various subsystems into the exposure
apparatus include, for example, the mechanical connection, the
wiring connection of the electric circuits, and the piping
connection of the air pressure circuits in correlation with the
various subsystems. It goes without saying that the steps of
assembling the respective individual subsystems are performed
before performing the steps of assembling the various subsystems
into the exposure apparatus. When the steps of assembling the
various subsystems into the exposure apparatus are completed, the
overall adjustment is performed to secure the various accuracies as
the entire exposure apparatus. It is desirable that the exposure
apparatus is produced in a clean room in which the temperature, the
cleanness and the like are managed.
[0246] As shown in FIG. 23, a microdevice such as the semiconductor
device is produced by performing, for example, a step 201 of
designing the function and the performance of the microdevice, a
step 202 of manufacturing a mask (reticle) based on the designing
step, a step 203 of producing a substrate as a base material for
the device, a substrate-processing step 204 including the process
of exposing the substrate P in accordance with the embodiment
described above and developing the exposed substrate P, a step 205
of assembling the device (including processing processes such as a
dicing step, a bonding step, a packaging step and the like), and an
inspection step 206.
[0247] As for various United States Patents, United States Patent
Application Publications and the like referred to in this
specification, the contents thereof are incorporated herein by
reference within a range of permission of the domestic laws and
ordinances of the designated state or the selected state, in
relation to those other than those having been specifically and
explicitly incorporated herein by reference as well.
[0248] According to the present invention, the substrate can be
exposed efficiently and satisfactorily. Even when the present
invention is applied to the liquid immersion exposure, it is
possible to produce the device having the desired performance at a
good productivity. Therefore, the present invention can remarkably
contribute to the development of the precision mechanical equipment
industry including the semiconductor industry in our country.
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