U.S. patent application number 12/007297 was filed with the patent office on 2008-06-05 for side-emitting led package and manufacturing method of the same.
This patent application is currently assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD.. Invention is credited to Ho Sik Ahn, Hun Joo Hahm, Kyung Taeg Han, Seong Yeon Han, Dae Yeon Kim, Seon Goo Lee, Young Sam Park.
Application Number | 20080128736 12/007297 |
Document ID | / |
Family ID | 37559871 |
Filed Date | 2008-06-05 |
United States Patent
Application |
20080128736 |
Kind Code |
A1 |
Han; Kyung Taeg ; et
al. |
June 5, 2008 |
Side-emitting LED package and manufacturing method of the same
Abstract
The invention relates to a side-emitting LED package and a
manufacturing method of the same. The invention provides a
side-emitting LED package for emitting light from a light source
sideward including a substrate with an electrode formed thereon.
The package also includes a light source disposed on the substrate,
a molded part that covers and protects the substrate with the light
source thereon, and a reflective layer that covers an outer surface
of the molded part. The molded part with the reflective layer forms
a light transmitting surface in one side thereof. The invention
allows easy manufacture of a reflecting surface in a desired shape,
miniaturization regardless of the LED chip size, mass-production in
an LED array, significantly improving productivity.
Inventors: |
Han; Kyung Taeg; (Hwasung,
KR) ; Hahm; Hun Joo; (Sungnam, KR) ; Kim; Dae
Yeon; (Suwon, KR) ; Ahn; Ho Sik; (Suwon,
KR) ; Han; Seong Yeon; (Suwon, KR) ; Park;
Young Sam; (Seoul, KR) ; Lee; Seon Goo;
(Gunpo, KR) |
Correspondence
Address: |
MCDERMOTT WILL & EMERY LLP
600 13TH STREET, N.W.
WASHINGTON
DC
20005-3096
US
|
Assignee: |
SAMSUNG ELECTRO-MECHANICS CO.,
LTD.
Kyungki-Do
KR
|
Family ID: |
37559871 |
Appl. No.: |
12/007297 |
Filed: |
January 9, 2008 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
11444397 |
Jun 1, 2006 |
7338823 |
|
|
12007297 |
|
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Current U.S.
Class: |
257/98 ;
257/E25.02; 257/E33.057; 257/E33.059; 257/E33.072 |
Current CPC
Class: |
H01L 24/97 20130101;
H01L 2224/97 20130101; H01L 33/0095 20130101; H05K 2201/10106
20130101; H01L 33/486 20130101; H01L 2924/15787 20130101; H01L
33/60 20130101; H01L 2224/32225 20130101; H01L 2224/48227 20130101;
H01L 2924/00 20130101; H01L 2224/48227 20130101; H01L 2924/00
20130101; H01L 2924/00 20130101; H01L 2224/73265 20130101; H01L
2224/32225 20130101; H01L 2924/00 20130101; H01L 2924/00014
20130101; H01L 2224/73265 20130101; H01L 2224/48227 20130101; H01L
2224/48091 20130101; H01L 2224/97 20130101; H01L 2224/73265
20130101; H01L 2224/48091 20130101; H01L 2924/15787 20130101; H01L
33/54 20130101; H01L 2924/181 20130101; H01L 2924/181 20130101;
H01L 2224/32225 20130101; H01L 25/0753 20130101 |
Class at
Publication: |
257/98 ;
257/E33.057 |
International
Class: |
H01L 33/00 20060101
H01L033/00 |
Foreign Application Data
Date |
Code |
Application Number |
Jun 1, 2005 |
KR |
2005-46796 |
Claims
1. A side-emitting LED package for emitting light from a light
source sideward, comprising: a substrate with an electrode formed
thereon; a light source electrically connected to the electrode and
disposed on the substrate; a molded part covering and protecting
the substrate and the light source disposed on the substrate; a
reflective layer covering an outer surface of the molded part; and
a light transmitting surface formed in one side of the package with
respect to a plane where the light source is disposed.
2. The side-emitting LED package according to claim 1, wherein the
reflective layer comprises one selected from a group consisting of
a curved surface, a horizontal planar top surface with a sloped
planar side surface, and a sloped planar surface.
3. The side-emitting LED package according to claim 1, wherein the
reflective layer is formed by depositing or plating metal selected
from a group consisting of Al, Au, Ag, Ni, W, Ti and Pt.
4. The side-emitting LED package according to claim 1, wherein the
reflective layer is formed by attaching a high reflectivity film on
the molded part.
5. The side-emitting LED package according to claim 1, wherein the
light source comprises at least one LED chip disposed inside the
molded part.
6. The side-emitting LED package according to claim 1 wherein the
substrate comprises a printed circuit board or a ceramic substrate
with the electrode formed thereon.
7. The side-emitting LED package according to claim 1, wherein
light is transmitted through the light transmitting surface in a
sideward direction perpendicular to a plane where the LED chip is
disposed on.
8-15. (canceled)
Description
CLAIM OF PRIORITY
[0001] This application claims the benefit of Korean Patent
Application No. 2005-46796 filed on Jun. 1, 2005, in the Korean
Intellectual Property Office, the disclosure of which is
incorporated herein by reference.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates to a side-emitting LED package
for emitting light from one side thereof, and a manufacturing
method of the same. More particularly, the invention relates to a
side-emitting LED package which has a reflecting surface easily
manufactured in a desired form, can be mass-produced in a compact
size regardless of an LED chip size, and can easily be adapted to
have an LED array inside thereof, thereby significantly improving
productivity, and a manufacturing method of the same.
[0004] 2. Description of the Related Art
[0005] In general, a backlight such as used in a mobile phone or a
PDA adopts an LED package having a light transmitting surface in
one side thereof for its light source.
[0006] Such LED packages are becoming slimmer as the mobile phones
are becoming slimmer nowadays.
[0007] Aside-emitting LED package 200 illustrated in FIG. 1(a) is a
structure, in which a molded body 210 covers a lead frame having an
LED chip therein, and thus its thickness is limited to be about 0.5
T. Therefore, such a method is limited in reducing the
thickness.
[0008] FIG. 1(b) illustrates another structure of LED package 230.
In this conventional technology, an LED chip 234 is mounted on a
substrate 232, which is covered by a molded body 236 having a
cavity therein bonded to the substrate 232. Then, a solution of
phosphor and epoxy mixed together is injected and cured in the
cavity, and diced afterwards. This conventional method, however,
entails a complicated process, and thus is not efficient in terms
of productivity.
[0009] FIG. 2(a) illustrates another conventional side-emitting LED
package 250. This conventional structure is taught in Japanese
Patent Application Publication 1997-83019, in which an LED is used
for a light source 252, and light from the LED is induced toward
one side of the package to be emitted out of the package.
[0010] In this conventional structure, an outer surface of the
light source 252 is wrapped with a lens, and a retainer 256 wraps
around the lens 254. The retainer 256 has an opening in one side to
form a light transmitting surface 256a, and a reflecting surface
258 is formed on the opposite side of the light transmitting
surface 258 inside the retainer 256.
[0011] This conventional structure also, however, entails a
complicated and cumbersome manufacturing process, in which the
retainer 256 and the reflecting surface 258 should be prepared
separately to wrap around the lens 254.
[0012] In addition, FIG. 2(b) illustrates another LED package 270,
which is disclosed in U.S. Pat. No. 6,674,096 granted to Sommers,
Mathew L. In this structure, a molded part 274 wraps around an LED
chip 272, and has a centrally depressed reflecting surface 276 on
an upper surface thereof. The reflecting surface 276 has a
reflective layer 278 formed thereon to form a light transmitting
surface around the sides of the molded part 274. However, this
conventional technology also bears a problem in that the light
transmitting surface 280 is not formed in one particular direction,
and thus the reflected light is not focused but tends to be
scattered.
SUMMARY OF THE INVENTION
[0013] The present invention has been made to solve the foregoing
problems of the prior art and it is therefore an object of the
present invention to provide a side-emitting LED package which does
not additionally require an injection-molded material and thus can
have minimal thickness, and a manufacturing method of the same.
[0014] It is another object to provide a PCB type side-emitting LED
package having a reflecting surface that can easily be manufactured
in a desired shape, which can be mass-produced, and a manufacturing
method of the same.
[0015] It is further another object to provide a side-emitting LED
package which can be mass-produced and is not affected by an LED
chip size, and can have an LED array inside thereof, and a
manufacturing method of the same.
[0016] It is yet another object to provide a side-emitting LED
package which adopts Epoxy Molding Compound (EMC) transfer molding
to minimize color dispersion, and a manufacturing method of the
same.
[0017] According to an aspect of the invention for realizing the
object, there is provided a side-emitting LED package for emitting
light from a light source sideward, including: a substrate with an
electrode formed thereon; a light source electrically connected to
the electrode and disposed on the substrate; a molded part covering
and protecting the substrate and the light source disposed on the
substrate; a reflective layer covering an outer surface of the
molded part; and a light transmitting surface formed in one side of
the package with respect to a plane where the light source is
disposed.
[0018] According to another aspect of the invention for realizing
the object, there is provided a A manufacturing method of an LED
package for emitting light from a light source sideward, the method
comprising steps of: (i) providing a substrate with electrodes
formed thereon; (ii) disposing light sources on the substrate;
(iii) forming a molded part on the substrate and the light sources
disposed on the substrate; (iv) dicing the molded part to divide
into individual packaging parts; (v) forming a reflective layer
covering an outer surface of the molded part; and (vi) dicing one
side of the molded part and the reflective layer to form a light
transmitting surface in one side.
BRIEF DESCRIPTION OF THE DRAWINGS
[0019] The above and other objects, features and other advantages
of the present invention will be more clearly understood from the
following detailed description taken in conjunction with the
accompanying drawings, in which:
[0020] FIG. 1 illustrates side-emitting LED packages according to
the prior art, in which, (a) is a structure including a molded
body, and (b) is a structure including a printed circuit board and
a molded body;
[0021] FIG. 2 illustrates other side-emitting LED packages
according to the prior art, in which, (a) is a structure including
a lens, a reflecting surface and a retainer, and (b) is a structure
including a reflecting surface and a reflective layer that are
centrally depressed;
[0022] FIG. 3 is a perspective view illustrating a side-emitting
LED package according to the present invention;
[0023] FIG. 4 is a sectional view illustrating embodiments of the
side-emitting LED package according to the present invention, in
which (a) illustrates a reflective layer in a curved surface, (b)
illustrates a reflective layer in a horizontal planar top surface
with a sloped planar side surface, and (c) illustrates a reflective
layer in a sloped planar surface;
[0024] FIG. 5 is a sectional view illustrating the side-emitting
LED package according to the present invention, in which (a) is a
structure having one LED chip as a light source, and (b) is a
structure having a plurality of LED chips as a light source;
[0025] FIG. 6a illustrates a manufacturing method of the
side-emitting LED package having one LED chip as a light
source;
[0026] FIG. 6b is a detailed view of the manufacturing method of
the side emitting LED package shown in FIG. 6a, with magnified
dicing lines;
[0027] FIG. 7a illustrates a manufacturing method of the
side-emitting LED package having a plurality of LED chips as a
light source; and
[0028] FIG. 7b is a detailed view of the manufacturing method shown
in FIG. 7a with magnified dicing lines.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
[0029] Preferred embodiments of the present invention will now be
described in detail with reference to the accompanying
drawings.
[0030] Referring to FIGS. 3 to 5, a side-emitting LED package 1
according to the present invention is designed to emit light from
an LED chip or a light source 5 to one side. The direction of light
emission preferably forms a right angle with a plane where the LED
chip is mounted.
[0031] The side-emitting LED package 1 according to the present
invention has a substrate 15 with electrodes 15a formed thereon.
The substrate 15 is preferably a printed circuit board (PCB) or a
ceramic substrate having patterned electrodes (not shown) or the
electrodes 15a formed as vertical electrodes such as vias.
[0032] In addition, the LED chip as the light source 5 is disposed
on the substrate 15 and electrically connected to the electrodes
15a. Either a horizontal type of LED chip having electric terminals
formed only on an upper surface thereof or a vertical type of LED
chip having electric terminals formed on upper and lower surfaces
thereof is applicable in the present invention.
[0033] In addition, a molded part 10 is formed to cover the
substrate 15 with the light source 5 disposed thereon. The molded
part 10 is formed by curing resin, etc., and preferably made of
transparent Epoxy Molding Compound (EMC) containing phosphor to
minimize color dispersion.
[0034] Various forms of mold (not shown) can be used in the process
of forming the molded part 10. For example, as shown in FIG. 4(a),
the molded part 10 can have a curved surface, or as shown in FIG.
4(b), can have a horizontal planar top surface with a sloped planar
side surface opposed to a light transmitting surface 17, or as
shown in FIG. 4(c), can have a sloped planar surface. The desired
shape of the molded part 10 as described can be obtained by
machining the mold in advance according to the desired structure of
the molded part 10.
[0035] When the molded part 10 is formed as just described, it is
machined according to the desired shape for each package.
[0036] When the molded part 10 is completed in a desired form as
described above, a reflective layer 20 is formed thereon with the
light transmitting surface 17 formed on one particular surface
thereof.
[0037] The reflective layer 20 can be formed by depositing metal
selected from a group consisting of Al, Au, Ag, Ni, W, Ti and Pt or
attaching a thin film directly on an outer surface of the molded
part 10. Alternatively, if an electrode (not shown) for plating is
formed on the substrate 15, the reflective layer 20 can be formed
by plating. The reflective layer 20 completely wraps the molded
part 10 to prevent light from leaking so that light is emitted only
through the light transmitting surface 17 formed on one side of the
molded part 10.
[0038] Therefore, in the same fashion as the molded part 10, the
reflective layer 20 may be a curved surface, a horizontal planar
top surface with a sloped planar side surface opposed to the light
transmitting surface 17, and a sloped planar surface.
[0039] The light transmitting surface 17 preferably forms a right
angle with the LED chip forming the light source 5 or with a planar
surface of the substrate 15 where the LED chip is mounted. In
addition, the light transmitting surface 17 is preferably composed
of a single planar surface so that light is emitted with a specific
directivity through one particular side.
[0040] Alternatively, the light transmitting surface 17 can be
composed of a plurality of planar surfaces or a curved surface
having a predetermined curvature.
[0041] As shown in FIG. 5(a), in the side-emitting LED package 1
according to the present invention, at least one LED chip is
disposed inside the molded part 10 to form the light source 5. That
is, as shown in FIG. 5(b), the light source 5 may be composed of
one LED chip or a plurality of LED chips in accordance with optical
requirements.
[0042] In case of a plurality of LED chips forming a single light
source 5, solder resistors 22 are formed between the LED chips on
the substrate 15 to electrically insulate the reflective layer from
the electrodes 15a.
[0043] A manufacturing method of a side-emitting LED package
according to the present invention will be explained in detail
hereunder.
[0044] As shown in FIG. 6, the manufacturing method 100 of the
side-emitting LED package according to the present invention starts
with a step 102 of providing a substrate 15 with electrodes 15a
formed thereon. On the substrate 15, solder resistors 22, which
will be explained later, are formed between LED chips.
[0045] In this step 102, the substrate 15 may be a printed circuit
board (PCB) or a ceramic substrate having the electrodes 15a as
vertical electrodes 15a such as vias or patterned electrodes (not
shown). The electrodes 15a such as vias are formed in each area
where the LED chip is disposed to form a light source 5. When
needed, an additional patterned electrode can be formed to connect
the vias with the light source 5.
[0046] The next step 104 is disposing a plurality of light sources
on the substrate 15.
[0047] In this step 104, a plurality of LED chips are
simultaneously mounted on a single substrate 15 to form the light
sources 5 and electrically connected to the electrodes 15a of the
substrate 15.
[0048] In the next step 106, a molded part 10 is formed on the
substrate 15 with the light sources 5.
[0049] In this step 106, the molded part 10 containing phosphor is
formed by transfer molding of Epoxy Molding Compound (EMC) to
minimize color dispersion once it is cured.
[0050] In addition, various forms of mold can be used to form the
molded part 10, such as a curved surface, a horizontal planar top
surface with a sloped side surface opposed to the light
transmitting surface 17 and a sloped planar surface, as explained
with reference to FIG. 4.
[0051] After the molded part 10 is formed as described, it is diced
in the next step 108.
[0052] In this step 108, only the molded part 10 is diced or etched
to form a desired shape of molded part 10 for packaging each LED
chip that forms each light source 5. In this step 108, the molded
part 10 is diced or etched such that its peripheral end portions
partially cover the solder resistors 22 on the substrate 15.
[0053] In the next step 110, a reflective layer 20 is formed to
cover an outer surface of the molded part 10. The reflective layer
20 can be formed by depositing metal having high reflectivity
selected from a group consisting of, for example, Al, Au, Ag, Ni,
W, Ti and Pt on the molded part 10, or attaching a high
reflectivity film on the molded part 10. Here, it is preferable
that the reflective layer 20 completely covers an outer surface of
the molded part 10 to prevent leaking of light to the outside.
[0054] In addition, the manufacturing method of the present
invention includes the last step 112, in which a side of the molded
part 10 and the reflective layer 20 is diced to form a light
transmitting surface 17.
[0055] In this step 112 of forming the light transmitting surface
17, a side of the molded part 10 and the reflective layer 20 is
diced simultaneously so that the entire outer surface of the molded
part 10 except the portion of the light transmitting surface 17 is
covered by the reflective layer 20.
[0056] Here, the peripheral end portions of the reflective layer 20
partially cover the solder resistors 22 on the substrate 15 to
ensure electrical insulation between the reflective layer 20 and
the electrodes 15a.
[0057] In addition, the above step 112 includes cutting the
substrate 15 along horizontal and vertical cutting lines 30 into
individual LED packages.
[0058] FIG. 7 illustrates step-by-step a manufacturing method 150
of a side-emitting LED package having a light source 5 comprising a
plurality of LED chips disposed inside a single molded part 10 with
a reflective layer 20 thereon.
[0059] The manufacturing method 150 of a side-emitting LED package
according to the present invention starts with providing a
substrate 15 with electrodes 15a formed thereon, as explained with
reference to FIG. 6.
[0060] In each area where an LED chip will be disposed later on the
substrate 15 to form a light source 5, solder resistors 22 are
formed to electrically insulate the electrodes 15a in this area
from other parts. A plurality of vias are formed to provide the
electrodes 15a.
[0061] In the next step 154, the LED chips are disposed on the
substrate 15 to form a light source 5, and wires are installed to
connect the LED chips to the electrodes 15a.
[0062] In the next step 156, a molded part 10 is formed covering
the substrate and the light source 5 disposed on the substrate. The
molded part 10 is made of transparent Epoxy Molding Compound
(EMC).
[0063] Once the molded part 10 is completed as described, it is
diced in the next step 158.
[0064] In this step 158, the molded part 10 is diced into a
plurality of packaging parts such that a desired number of LED
chips form a single light source 5 inside a single molded part 10
or a single packaging part. In this step 158, peripheral end
portions of the molded part 10 partially cover the solder resistors
22 on the substrate 15.
[0065] The solder resistors 22 block electrical connection between
the electrodes 15a and the reflective layer 20, which will be
formed later.
[0066] In the next step 160, as explained with reference to FIG. 6,
metal having high reflectivity, for example, Al, Au, Ag, Ni, W, Ti
and Pt, is deposited or plated on an outer surface of the molded
part 10, or a high reflectivity film is attached on the molded part
10. Lastly, in the step 162, a side of the molded part 10 and the
reflective layer 20 is diced to form a light transmitting surface
17 on one side of thereof.
[0067] When the reflective layer 20 is formed as described above,
the substrate 15 is cut horizontally and vertically to obtain
individual side-emitting LED packages 1, each having a plurality of
LED chips therein to form a light source 5.
[0068] According to the present invention as set forth above, no
other molded material is needed in addition to the molded part 10
so that the package has a minimal thickness to be easily applied to
various miniaturized electronic devices.
[0069] In the present invention, the mold (not shown) is
manufactured freely in various forms to obtain various forms of the
molded part 10, thereby obtaining a desired form of the reflective
layer 20 on the molded part 10.
[0070] In addition, the present invention is not restricted by a
molded material other than the molded part, resulting in a compact,
thin structure. Also, as the light transmitting surface is formed
in a side perpendicular with respect to a plane where the LED chip
is mounted on, the package can be manufactured in a small thickness
regardless of the LED chip size.
[0071] In addition, the substrate is processed as a PCB, that is,
the processes of mounting, molding and dicing are conducted as a
PCB manufacturing process, enabling mass-production in an array
type.
[0072] Furthermore, the invention adopts the molded part made of
transparent Epoxy Molding Compound (EMC) containing phosphor to
minimize color dispersion after it is cured, thereby significantly
improving optical properties of the package.
[0073] The present invention has been described with reference to
preferred embodiments of the invention. This invention may,
however, be embodied in many different forms and should not be
construed as limited to the embodiments set forth herein. While the
present invention has been shown and described in connection with
the preferred embodiments, it will be apparent to those skilled in
the art that modifications and variations can be made without
departing from the spirit and scope of the invention as defined by
the appended claims.
* * * * *