Lee; Seon Goo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Seon Goo.The latest application filed is for "chip coated light emitting diode package and manufacturing method thereof".

Company Profile

0.46.41

Lee; Seon Goo - Kyungki-do KR
Lee; Seon Goo - Gyunggi-Do KR
Lee; Seon Goo - Gyeonggi-do KR
Lee; Seon-Goo - Gunpo-si KR
LEE; Seon Goo - Goonpo KR
Lee; Seon Goo - Gunpo KR
Lee; Seon Goo - Kyunggi-do KR
Lee; Seon Goo - Kyonggi-do KR
Lee; Seon Goo - Seoul KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
High power light emitting diode package Grant RE46,851 - Lee , et al. May 15, 2	2018-05-15
High power light emitting diode package Grant RE45,596 - Lee , et al. June 30, 2	2015-06-30
High power light emitting diode package Grant RE44,811 - Lee , et al. March 18, 2	2014-03-18
Chip coated light emitting diode package and manufacturing method thereof Grant 8,324,646 - Lee , et al. December 4, 2	2012-12-04
Method of manufacturing LED package for formation of molding member Grant 8,202,746 - Lee , et al. June 19, 2	2012-06-19
LED package having recess in heat conducting part Grant 8,169,128 - Lee , et al. May 1, 2	2012-05-01
High power light emitting diode package Grant RE43,200 - Lee , et al. February 21, 2	2012-02-21
LED package Grant 8,105,854 - Lee , et al. January 31, 2	2012-01-31
Chip coated light emitting diode package and manufacturing method thereof Grant 8,013,352 - Lee , et al. September 6, 2	2011-09-06
Package board and method for manufacturing thereof Grant 7,903,410 - Cho , et al. March 8, 2	2011-03-08
High power LED package and fabrication method thereof Grant 7,875,476 - Lee , et al. January 25, 2	2011-01-25
High power LED housing and fabrication method thereof Grant 7,846,752 - Kim , et al. December 7, 2	2010-12-07
Chip Coated Light Emitting Diode Package And Manufacturing Method Thereof App 20100289051 - LEE; Seon Goo ; et al.	2010-11-18
Side-emitting LED package and method of manufacturing the same Grant 7,833,811 - Han , et al. November 16, 2	2010-11-16
Chip coated light emitting diode package and manufacturing method thereof Grant 7,795,052 - Lee , et al. September 14, 2	2010-09-14
Light emitting diode package with diffuser and method of manufacturing the same Grant 7,790,482 - Han , et al. September 7, 2	2010-09-07
Chip coated light emitting diode package and manufacturing method thereof Grant 7,714,342 - Lee , et al. May 11, 2	2010-05-11
Chip Coated Light Emitting Diode Package And Manufacturing Method Thereof App 20100109040 - LEE; Seon Goo ; et al.	2010-05-06
Chip Coated Light Emitting Diode Package And Manufacturing Method Thereof App 20100112735 - Lee; Seon Goo ; et al.	2010-05-06
Light emitting diode package with metal reflective layer and method of manufacturing the same Grant 7,687,292 - Park , et al. March 30, 2	2010-03-30
LED package Grant 7,683,470 - Lee , et al. March 23, 2	2010-03-23
LED housing and fabrication method thereof Grant 7,678,592 - Lee , et al. March 16, 2	2010-03-16
High Power Led Package And Fabrication Method Thereof App 20100047941 - Lee; Seon Goo ; et al.	2010-02-25
Led Package App 20100047937 - Lee; Seon Goo ; et al.	2010-02-25
High power light emitting diode package and fabrication method thereof Grant 7,663,199 - Lee , et al. February 16, 2	2010-02-16
High power LED package and fabrication method thereof Grant 7,626,250 - Lee , et al. December 1, 2	2009-12-01
Light emitting diode package Grant 7,566,912 - Lee , et al. July 28, 2	2009-07-28
Method for producing molding compound resin tablet for wavelength conversion, and method for manufacturing white light emitting diode by using the production method Grant 7,560,057 - Yoon , et al. July 14, 2	2009-07-14
Light Emitting Diode Package With Diffuser And Method Of Manufacturing The Same App 20090155938 - Han; Seong Yeon ; et al.	2009-06-18
Method Of Manufacturing Light Emitting Diode Package App 20090087931 - LEE; Seon Goo ; et al.	2009-04-02
Light emitting diode package with diffuser and method of manufacturing the same Grant 7,501,656 - Han , et al. March 10, 2	2009-03-10
High power LED housing and fabrication method thereof Grant 7,498,610 - Kim , et al. March 3, 2	2009-03-03
High Power Led Housing And Fabrication Method Thereof App 20090053839 - KIM; Chang Wook ; et al.	2009-02-26
Side-view light emitting diode having protective device Grant 7,462,871 - Han , et al. December 9, 2	2008-12-09
Light emitting diode package having dual lens structure for lateral light emission Grant 7,458,703 - Han , et al. December 2, 2	2008-12-02
Side-emitting LED package and method of manufacturing the same App 20080254558 - Han; Kyung Taeg ; et al.	2008-10-16
Light emitting diode package with metal reflective layer and method of manufacturing the same App 20080233666 - Park; Jung Kyu ; et al.	2008-09-25
Package board and method for manufacturing thereof App 20080198552 - Cho; Suk-Hyeon ; et al.	2008-08-21
LED package App 20080179616 - Lee; Seon Goo ; et al.	2008-07-31
Side-emitting LED package and manufacturing method of the same App 20080128736 - Han; Kyung Taeg ; et al.	2008-06-05
Light-emitting diode Grant D568,261 - Lee , et al. May 6, 2	2008-05-06
Side-emitting LED package and manufacturing method of the same Grant 7,338,823 - Han , et al. March 4, 2	2008-03-04
Semiconductor package and method for fabricating the same Grant RE40,112 - Shin , et al. February 26, 2	2008-02-26
Light emitting diode package App 20070221928 - Lee; Young Ki ; et al.	2007-09-27
Light emitting diode package App 20070181899 - Lee; Min Sang ; et al.	2007-08-09
Chip on board package and manufacturing method thereof App 20070176198 - Lee; Seon Goo ; et al.	2007-08-02
Chip coated light emitting diode package and manufacturing method thereof App 20070158669 - Lee; Seon Goo ; et al.	2007-07-12
Led Housing And Fabrication Method Thereof App 20070145387 - LEE; Seon Goo ; et al.	2007-06-28
Method For Producing Molding Compound Resin Tablet For Wavelength Conversion, And Method For Manufacturing White Light Emitting Diode By Using The Production Method App 20070120290 - YOON; Joon Ho ; et al.	2007-05-31
LED package App 20070108460 - Lee; Seon Goo ; et al.	2007-05-17
Thin semiconductor package including stacked dies Grant 7,211,900 - Shin , et al. May 1, 2	2007-05-01
High power light emitting diode package Grant 7,208,772 - Lee , et al. April 24, 2	2007-04-24
Semiconductor package and method for fabricating the same Grant 7,190,071 - Shin , et al. March 13, 2	2007-03-13
Light emitting diode package with diffuser and method of manufacturing the same App 20070045644 - Han; Seong Yeon ; et al.	2007-03-01
LED having improved soldering structure, method for soldering the LED to PCB, and LED assembly manufactured by the method App 20070029572 - Han; Kyung Taeg ; et al.	2007-02-08
LED package having recess in heat conducting part App 20070030703 - Lee; Seon Goo ; et al.	2007-02-08
Side-view light emitting diode having protective device App 20070029564 - Han; Kyung Taeg ; et al.	2007-02-08
Light emitting diode package having dual lens structure for lateral light emission App 20070019416 - Han; Kyung Taeg ; et al.	2007-01-25
Method for producing molding compound resin tablet for wavelength conversion, and method for manufacturing white light emitting diode by using the production method Grant 7,157,029 - Yoon , et al. January 2, 2	2007-01-02
LED package for backlight unit Grant 7,156,538 - Han , et al. January 2, 2	2007-01-02
Side-emitting LED package and manufacturing method of the same App 20060284203 - Han; Kyung Taeg ; et al.	2006-12-21
Light emitting diode package with metal reflective layer and method of manufacturing the same App 20060284207 - Park; Jung Kyu ; et al.	2006-12-21
Side-emitting LED package and method of manufacturing the same App 20060273337 - Han; Kyung Taeg ; et al.	2006-12-07
High power LED package and fabrication method thereof App 20060273338 - Lee; Seon Goo ; et al.	2006-12-07
High power light emitting diode package and fabrication method thereof App 20060267036 - Lee; Seon Goo ; et al.	2006-11-30
LED housing and fabrication method thereof App 20060180925 - Lee; Seon Goo ; et al.	2006-08-17
High power LED housing and fabrication method thereof App 20060180824 - Kim; Chang Wook ; et al.	2006-08-17
High power light emitting diode package App 20060043401 - Lee; Seon Goo ; et al.	2006-03-02
Semiconductor package including passive elements and method of manufacture Grant 6,995,448 - Lee , et al. February 7, 2	2006-02-07
LED package for backlight unit App 20060023451 - Han; Kyung Taeg ; et al.	2006-02-02
Stacking structure for semiconductor chips and a semiconductor package using it Grant 6,982,485 - Lee , et al. January 3, 2	2006-01-03
Light-emitting diode Grant D512,694 - Kim , et al. December 13, 2	2005-12-13
Light-emitting diode Grant D512,029 - Kim , et al. November 29, 2	2005-11-29
Semiconductor package and method for fabricating the same App 20050205979 - Shin, Won Sun ; et al.	2005-09-22
High power LED package App 20050199884 - Lee, Seon Goo ; et al.	2005-09-15
Semiconductor package structure reducing warpage and manufacturing method thereof Grant 6,936,922 - Park , et al. August 30, 2	2005-08-30
Method for producing molding compound resin tablet for wavelength conversion, and method for manufacturing white light emitting diode by using the production method App 20050104244 - Yoon, Joon Ho ; et al.	2005-05-19
Semiconductor package and method for fabricating the same Grant 6,798,049 - Shin , et al. September 28, 2	2004-09-28
Semiconductor package and method for fabricating the same App 20040164411 - Shin, Won Sun ; et al.	2004-08-26
Semiconductor package and method for fabricating the same Grant 6,717,248 - Shin , et al. April 6, 2	2004-04-06
Semiconductor package and method for fabricating the same App 20030100142 - Shin, Won Sun ; et al.	2003-05-29
Semiconductor package and method for fabricating the same Grant 6,515,356 - Shin , et al. February 4, 2	2003-02-04
Thin profile stackable semiconductor package and method for manufacturing App 20030006494 - Lee, Sang Ho ; et al.	2003-01-09
Semiconductor package including passive elements and method of manufacture App 20020140085 - Lee, Sang Ho ; et al.	2002-10-03
Thin, stackable semiconductor packages Grant 6,303,997 - Lee October 16, 2	2001-10-16