U.S. patent application number 11/510294 was filed with the patent office on 2007-10-11 for method of fabricating a semiconductor device.
This patent application is currently assigned to INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE. Invention is credited to Hui-Lin Hsu, Po-Yuan Lo, Zing-Way Pei, Tri-Rung Yew.
Application Number | 20070238318 11/510294 |
Document ID | / |
Family ID | 38575887 |
Filed Date | 2007-10-11 |
United States Patent
Application |
20070238318 |
Kind Code |
A1 |
Hsu; Hui-Lin ; et
al. |
October 11, 2007 |
Method of fabricating a semiconductor device
Abstract
A method of fabricating a semiconductor device is provided. The
method of fabricating the semiconductor device comprises a
substrate. A polyacrylonitrile (PAN) powder is dissolved in a
solvent and the solvent is heated to form a PAN solution. The PAN
solution is cooled down and the PAN solution is then formed on the
substrate. The PAN solution is allowed to stand and the solvent in
the PAN solution is then removed to form a PAN dielectric layer on
the substrate. A patterned conductive layer is formed on the PAN
dielectric layer.
Inventors: |
Hsu; Hui-Lin; (Taipei City,
TW) ; Yew; Tri-Rung; (Hsinchu City, TW) ; Lo;
Po-Yuan; (Taipei City, TW) ; Pei; Zing-Way;
(Taichung City, TW) |
Correspondence
Address: |
QUINTERO LAW OFFICE, PC
2210 MAIN STREET, SUITE 200
SANTA MONICA
CA
90405
US
|
Assignee: |
INDUSTRIAL TECHNOLOGY RESEARCH
INSTITUTE
HSINCHU
TW
|
Family ID: |
38575887 |
Appl. No.: |
11/510294 |
Filed: |
August 25, 2006 |
Current U.S.
Class: |
438/780 ;
257/E51.007 |
Current CPC
Class: |
C08L 65/00 20130101;
C08L 79/02 20130101; H01L 51/052 20130101; H01L 51/0036
20130101 |
Class at
Publication: |
438/780 ;
257/E51.007 |
International
Class: |
H01L 21/31 20060101
H01L021/31; H01L 21/469 20060101 H01L021/469 |
Foreign Application Data
Date |
Code |
Application Number |
Apr 6, 2006 |
TW |
TW95112104 |
Claims
1. A method of fabricating a semiconductor device, comprising:
providing a substrate; dissolving a PAN powder in a first solvent
and heating the solvent to form a PAN solution; cooling down the
PAN solution and then forming the PAN solution on the substrate;
removing the solvent in the PAN solution and forming a PAN
dielectric layer on the substrate; and forming a patterned
conductive layer on the PAN dielectric layer.
2. The method of fabricating a semiconductor device as claimed in
claim 1, wherein the substrate is an inorganic or an organic
material.
3. The method of fabricating a semiconductor device as claimed in
claim 1, wherein the first solvent comprises propylene carbonate
(PC), dimethylformamide (DMF), dimethyl sulfoxide (DMSO),
dimethylacetamide, ethylene carbonate (EC), malononitrile,
succinonitrile or adiponitrile.
4. The method of fabricating a semiconductor device as claimed in
claim 1, wherein the first solvent is heated to a temperature of
about 100.degree. C. to 150.degree. C.
5. The method of fabricating a semiconductor device as claimed in
claim 1, wherein the first solvent is heated to a temperature of
about 50.degree. C. to 160.degree. C.
6. The method of fabricating a semiconductor device as claimed in
claim 1, wherein the first solvent is heated to a temperature of
about 25.degree. C. to 160.degree. C.
7. The method of fabricating a semiconductor device as claimed in
claim 1, wherein PAN solution is cooled to a temperature of about
25.degree. C. to 30.degree. C.
8. The method of fabricating a semiconductor device as claimed in
claim 1, wherein the PAN solution is cooled to a temperature of
about 20.degree. C. to 40.degree. C.
9. The method of fabricating a semiconductor device as claimed in
claim 1, wherein the PAN solution is cooled to a temperature of
about 20.degree. C. to 50.degree. C.
10. The method of fabricating a semiconductor device as claimed in
claim 1, wherein before removing the first solvent in the PAN
solution, further comprising: allowing the PAN solution to stand
for 2 min to 5 min.
11. The method of fabricating a semiconductor device as claimed in
claim 10, wherein the PAN solution stands for 1 min to 10 min.
12. The method of fabricating a semiconductor device as claimed in
claim 1, wherein the PAN solution is formed on the substrate by
spin-coating, inkjet-printing, casting or roll-to-roll
printing.
13. The method of fabricating a semiconductor device as claimed in
claim 1, wherein the first solvent in the PAN solution is removed
at a temperature of about 80.degree. C. to 130.degree. C.
14. The method of fabricating a semiconductor device as claimed in
claim 1, wherein the first solvent in the PAN solution is removed
at a temperature of about 50.degree. C. to 150.degree. C.
15. The method of fabricating a semiconductor device as claimed in
claim 1, wherein the first solvent in the PAN solution is removed
at a temperature of about 25.degree. C. to 150.degree. C.
16. The method of fabricating a semiconductor device as claimed in
claim 1, wherein the PAN solution has a weight concentration of
about 0.1 wt % to about 10 wt % of PAN.
17. The method of fabricating a semiconductor device as claimed in
claim 1, wherein the PAN solution has a weight concentration of
about 0.25 wt % to about 2 wt % of PAN.
18. The method of fabricating a semiconductor device as claimed in
claim 1, wherein the PAN dielectric layer has a thickness of about
40 nm to 60 nm.
19. The method of fabricating a semiconductor device as claimed in
claim 1, wherein the patterned conductive layer is a metal
layer.
20. The method of fabricating a semiconductor device as claimed in
claim 19, wherein the patterned conductive layer comprises Au or
Au-alloy.
21. The method of fabricating a semiconductor device as claimed in
claim 1, wherein before forming the patterned conductive layer,
comprising: dissolving an organic polymer powder in a second
solvent to form an organic polymer solution; forming the organic
polymer solution on the substrate; removing the second solvent in
the organic polymer solutions and forming an organic polymer layer
on the substrate; and the organic polymer layer is between the PAN
dielectric layer and the patterned conductive layer.
22. The method of fabricating the semiconductor device as claimed
in claim 21, wherein the substrate serves as a gate electrode.
23. The method of fabricating the semiconductor device as claimed
in claim 21, wherein the second solvent is toluene,
dichloromethane, trichloromethane (chloroform) or
tetrahydrofuran.
24. The method of fabricating the semiconductor device as claimed
in claim 21, wherein the organic polymer solution is formed on the
substrate by spin-coating, inkjet-printing, casting, roll-to-roll
printing or evaporation.
25. The method of fabricating the semiconductor device as claimed
in claim 21, wherein the organic polymer solution has a weight
concentration of about 0.1 wt % to about 0.5 wt % of the organic
polymer.
26. The method of fabricating the semiconductor device as claimed
in claim 21, wherein the organic polymer layer comprises Pentacene
or poly(3-hexylthiophene) (PH3T).
27. The method of fabricating the semiconductor device as claimed
in claim 21, wherein the organic polymer layer is Pentacene having
a thickness of about 20 nm to 40 nm.
28. The method of fabricating the semiconductor device as claimed
in claim 21, wherein the organic polymer layer is
poly(3-hexylthiophene) (PH3T) having a thickness of about 90 nm to
10 nm.
29. The method of fabricating the semiconductor device as claimed
in claim 21, wherein the patterned conductive layer serves as a
source/drain.
30. The method of fabricating the semiconductor device as claimed
in claim 29, wherein the source/drain is formed by
photolithography/etching.
31. The method of fabricating the semiconductor device as claimed
in claim 1, wherein before forming the PAN dielectric layer,
comprising: dissolving an conductive polymer powder in a third
solvent to form an conductive polymer solution; forming the
conductive polymer solution on the substrate; removing the solvent
in the conductive polymer solution and forming a conductive polymer
layer on the substrate; and the conductive polymer layer is between
the substrate and the PAN dielectric layer.
32. The method of fabricating the semiconductor device as claimed
in claim 31, wherein the third solvent is isopropylalcohol (IPA) or
ethanol.
33. The method of fabricating the semiconductor device as claimed
in claim 31, wherein the conductive polymer solution is formed on
the substrate by spin-coating, inkjet-printing, casting,
roll-to-roll printing or evaporation.
34. The method of fabricating the semiconductor device as claimed
in claim 31, wherein the conductive polymer solution has a weight
concentration of about 0.5 wt % to about 20 wt % of the conductive
polymer.
35. The method of fabricating the semiconductor device as claimed
in claim 31, wherein the conductive polymer layer has a thickness
of about 40 nm to 200 nm.
36. The method of fabricating the semiconductor device as claimed
in claim 31, wherein the conductive polymer layer is ethylene
glycol-doped
poly(3,4-ethylenedioxy-thiophene)/poly(styrenesulfonate)
(PEDOT:PSS+EG).
37. The method of fabricating the semiconductor device as claimed
in claim 31, wherein the conductive polymer layer and the patterned
conductive layer are served as a bottom electrode and a top
electrode.
38. The method of fabricating the semiconductor device as claimed
in claim 37, wherein the patterned conductive layer is formed by
photolithography/etching.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a fabricating method of a
semiconductor, and in particular to a method of fabricating a
semiconductor a polyacrylonitrile (C.sub.3H.sub.3N).sub.n, PAN)
dielectric layer.
[0003] 2. Description of the Related Art
[0004] Organic thin film transistors (OTFTs) have drawn a lot of
considerable in the past due to the advantages of light weight, low
cost of fabrication for large area, simple fabrication method, thin
profile, and mechanically flexible. Thus, OTFTs are employed in
disposable products, radio frequency identification (RFID), smart
levels, smart tags or other devices. Semiconductor materials,
dielectric materials, and conductive materials with high process
compatibility between layers of semiconductor devices are important
for current organic thin film developments. Also, low temperature
(<200.degree. C.) and simple fabrication processes are needed to
meet the requirement of low cost.
[0005] OTFTs, however, continue to encounter issues of low carrier
mobility and low on/off current ratio (Ion/Ioff), which require
high operating voltage to drive the transistors and in turn have
high power consumption. As a result, there have been numerous
studies on semiconductor materials in order to improve the
performance of OTFTs. In addition to working on improving the
properties of semiconductor materials to overcome the described
limitations, new dielectric materials that can provide high
saturation current with low leakage current at low voltage to
reduce operating voltage must be developed. Conventional inorganic
dielectric materials, however, often require high-temperature
chemical vapor deposition (CVD), annealing or oxidation processes
which result in high cost and process incompatibility which
flexible substrates can't withstand. Furthermore, most inorganic
materials are intrinsically rigid and easily breakable. Thus, a
novel organic dielectric material which is fabricated by
spin-coating, printing or jet printing in low temperature
(<200.degree. C.) to prevent high temperature processes and
achieve the requirement of low cost is desirable.
[0006] A conventional dielectric layer of an organic thin film
transistor comprises Polyvinyl alcohol (PVA), Polyvinyl Butyral
(PVB), PolyVinylChloride (PVC), PolyStyrene (PS), PolyVinylPhenol
(PVP) or PolyMethylMethAcrylate (PMMA).
[0007] FIG. 1a is a leakage current versus the applied voltage
characteristic of conventional Polyvinyl Butyral (PVB) and
Ti(OC.sub.4H.sub.9).sub.4 used for a dielectric layer of an organic
thin film transistor disclosed in US Pat. No. 20050001210A1. PVB
and Ti(OC.sub.4H.sub.9).sub.4 are mixed for the first dielectric
layer of an organic thin film transistor; PVP and cyclohexanone
solution with 10 wt % of cyclohexanone weight concentration are
mixed for the second dielectric layer of an organic thin film
transistor. FIG. 1a comprises a leakage current curve of a 300 nm
first dielectric and a 400 nm second dielectric layer 111, a
leakage current curve of a 200 nm first dielectric and a 500 nm
second dielectric layer 112, and a leakage current curve of a 700
nm cyclohexanone solution with 10 wt % of cyclohexanone weight
concentration 113. FIG. 1b is a leakage current versus applied
electric voltage characteristic of conventional Polyvinyl alcohol
(PVA) for a dielectric layer of an organic thin film transistor.
FIG. 1b comprises a leakage current curve of PVA 114 and a leakage
current curve of cross linked PVA 115. FIG. 1c is a Gate-Source
current versus Gate-Source voltage characteristic of conventional
PolyMethylMethAcrylate (PMMA) for a dielectric layer of an organic
thin film transistor which comprises a leakage current curve of
PMMA 116. FIG. 1d is a leakage current versus applied voltage
characteristic of conventional PolyVinylPhenol (PVP) for a
dielectric layer of an organic thin film transistor which comprises
a leakage current curve of 310 nm PVP 117, a leakage current curve
of 280 nm cross linked PVP 118, and a leakage current curve of 100
nm SiO.sub.2 119. The results show 1000.about.4 nA/cm.sup.2 leakage
current density with 10V applied voltage and show a high leakage
current in conventional dielectric materials of organic thin film
transistors.
BRIEF SUMMARY OF INVENTION
[0008] A detailed description is given in the following embodiments
with reference to the accompanying drawings.
[0009] A method for fabricating a semiconductor device is provided
by employing polyacrylonitrile ((C.sub.3H.sub.3N).sub.n, PAN) for a
dielectric layer to improve the issues as illustrated. Some
embodiments of a semiconductor device fabrication method comprise:
providing a substrate; dissolving a PAN powder in a first solvent
and heating the solvent to form a PAN solution; cooling down the
PAN solution and then forming the PAN solution on the substrate;
removing the solvent in the PAN solution and forming a PAN
dielectric layer on the substrate, and forming a patterned
conductive layer on the PAN dielectric layer.
[0010] Some embodiments of a semiconductor device fabrication
method comprise: providing a substrate; dissolving a PAN powder in
a first solvent and heating the solvent to form a PAN solution;
cooling down the PAN solution and then forming the PAN solution on
the substrate; removing the solvent in the PAN solution and forming
a PAN dielectric layer on the substrate, and forming a patterned
conductive layer on the PAN dielectric layer. The method of
fabricating a semiconductor device can further comprise: the step
of dissolving an organic polymer powder in a second solvent to form
an organic polymer solution; forming the organic polymer solution
on the substrate; removing the second solvent in the organic
polymer solutions and forming an organic polymer layer on the
substrate, and the organic polymer layer is between the PAN
dielectric layer and the patterned conductive layer before forming
the patterned conductive layer.
[0011] Some embodiments of a semiconductor device fabrication
method comprise: providing a substrate; dissolving a PAN, powder in
a first solvent and heating the solvent to form a PAN solution;
cooling down the PAN solution and then forming the PAN solution on
the substrate; removing the solvent in the PAN solution and forming
a PAN dielectric layer on the substrate, and forming a patterned
conductive layer on the PAN dielectric layer. The method of
fabricating a semiconductor device can further comprise: the step
of dissolving an conductive polymer powder in a third solvent to
form an conductive polymer solution; forming the conductive polymer
solution on the substrate; removing the solvent in the conductive
polymer solution and forming a conductive polymer layer on the
substrate, and the conductive polymer layer is between the
substrate and the PAN dielectric layer before forming the PAN
dielectric layer.
[0012] The method of the invention may provide a high quality PAN
dielectric layer having a 0.1 nA/cm.sup.2 leakage current density
which is lower than conventional PVA, PVB, PVC, PS, PVP, and PMMA.
PAN dielectric also has the advantage of low operating voltage
because PAN is highly polar with strong inter-chain interactions
between nitride groups. Thus PAN may be to a good candidate for use
as a gate dielectric in the fabrication of OTFTs due to this
important physical property.
[0013] An exemplary embodiment of the semiconductor device
fabrication method comprises: providing a PAN weight concentration
of a PAN solution; a solvent of the PAN solution; a temperature for
heating the PAN solution; a standing time after coating the PAN
solution, and a baking temperature for controlling the PAN solution
to the optimum process. Fabricating the PAN dielectric layer which
the leakage current is similar with the conventional furnace
SiO.sub.2 layer. The semiconductor device fabrication method of the
invention provides a lower cost fabrication process such as
spin-coating, inkjet-printing, cast, or roll-to-roll contact
printing at low temperature (<200.degree. C.). Superior low
leakage current of the 50 nm PAN dielectric layer as low as 0.7 pA
(leakage current density is 0.1 nA/cm.sup.2) with 10V applied
voltage, which is compatible with the 100 nm furnace SiO.sub.2
dielectric layer (leakage current density is 0.3 nA/cm.sup.2), even
lower than the 100 nm furnace SiO.sub.2 dielectric layer. Moreover,
the PAN dielectric layer according the invention has process
compatibility with semiconductor layers such as pentacene or
poly(3-hexylthiophene (P3HT). The fabricated organic thin film
transistor with PAN as the gate dielectric layer shows superior low
leakage current, and the PAN dielectric layer shows process
compatibility with flexible substrates (e. q. polyimide, PC or
PET), and is particularly applicable to organic thin film
transistors.
BRIEF DESCRIPTION OF DRAWINGS
[0014] The invention can be more fully understood by reading the
subsequent detailed description and examples with references made
to the accompanying drawings, wherein:
[0015] FIG. 1a is a leakage current versus applied voltage
characteristic of conventional Polyvinyl Butyral (PVB) and
(Ti(OC.sub.4H.sub.9).sub.4) for use in a dielectric layer of an
organic thin film transistor.
[0016] FIG. 1b is a leakage current versus applied voltage
characteristic of conventional Polyvinyl alcohol (PVA) for use in a
dielectric layer of an organic thin film transistor.
[0017] FIG. 1c is a Gate-Source current versus Gate-Source voltage
characteristic of conventional PolyMethylMethAcrylate (PMMA) for
use in a dielectric layer of an organic thin film transistor.
[0018] FIG. 1d is a leakage current versus applied voltage
characteristic of conventional PolyVinylPhenol (PVP) for use in a
dielectric layer of an organic thin film transistor.
[0019] FIGS. 2a to 2c, FIGS. 3a to 3b, FIGS. 4a to 4b and FIGS. 5a
to 5c show crosssections of preferred embodiments of the process of
fabricating a semiconductor device.
[0020] FIGS. 2a to 2c show crosssections of a first embodiment of
the process of fabricating a semiconductor device.
[0021] FIGS. 3a to 3b show crosssections of a second embodiment of
the process of fabricating a semiconductor device.
[0022] FIGS. 4a to 4b show crosssections of a third embodiment of
the process of fabricating a semiconductor device.
[0023] FIGS. 5a to 5c show crosssections of a fourth embodiment of
the process of fabricating a semiconductor device.
[0024] FIG. 6 is a process chart of fabricating a PAN dielectric
layer of a semiconductor device.
[0025] FIG. 7 is a leakage current versus applied voltage
characteristic comparison of a PAN dielectric layer and a
conventional SiO.sub.2 dielectric layer.
[0026] FIG. 8a is a drain-current (Id) versus drain-voltage (Vd)
characteristic of a fabricated organic thin film transistor
(channel width (W)/channel length (L)=100 .mu.m/100 .mu.m) of PAN
for a gate dielectric layer on an n-doped substrate (not shown) and
poly(3-hexylthiophene) (PH3T) for use in an active layer.
[0027] FIG. 8b is a drain-current (Id) versus drain-voltage (Vd)
characteristic of a fabricated organic thin film transistor
(channel width (W)/channel length (L)=100 .mu.m/100 .mu.m) of
thermal SiO.sub.2 for a gate dielectric layer on an n-doped
substrate and poly(3-hexylthiophene) (PH3T) for use in an active
layer.
[0028] FIG. 9a is a drain-current (Id) versus drain-voltage (Vd)
characteristic comparison of a fabricated organic thin film
transistor (channel width (W)/channel length (L)=100 .mu.m/100
.mu.m) with PAN for a gate dielectric layer on an n-doped substrate
and pentacene for use in an active layer.
[0029] FIG. 9b is a drain-current (Id) versus drain-voltage (Vd)
characteristic comparison of a fabricated organic thin film
transistor (channel width (W)/channel length (L)=100 .mu.m/100
.mu.m) with thermal SiO.sub.2 for a gate dielectric layer on an
n-doped substrate and pentacene for use in an active layer.
DETAILED DESCRIPTION OF INVENTION
[0030] The following description is of the best-contemplated mode
of carrying out the invention. This description is made for the
purpose of illustrating the general principles of the invention and
should not be taken in a limiting sense. The scope of the invention
is best determined by reference to the appended claims.
[0031] FIGS. 2a to 2c, FIGS. 3a to 3b, FIGS. 4a to 4b and FIGS. 5a
to 5c show crosssections of various embodiments of a process of
fabricating a semiconductor device. Wherever possible, the same
reference numbers are used in the drawing and the description to
refer the same or like parts.
[0032] Referring to FIG. 2a, the initial step of a first embodiment
of forming a Metal-Insulator-Silicon capacitor (MIS) 10a. A
substrate 100 is provided. The substrate 100 may comprise inorganic
materials, for example, n-doped silicon substrates (resistivity is
about 0.008.about.0.02 ohm-cm) or glass substrates. The substrate
100 may also comprise organic materials such as polyimide,
polycarbonate (PC) or polyethylene terephthalate (PET). In this
embodiment, the substrate 100 serves as a semiconductor layer of
the MIS; it also serves as a bottom electrode of the MIS.
[0033] Referring to FIG. 2b, a polyacrylonitrile (PAN) dielectric
layer 300 is formed on the substrate 100. The step of forming the
PAN dielectric layer 300 further comprises dissolving a PAN powder
(e. g., manufactured by Sigma-Aldrich Chemie GmbH Co.) in a solvent
such as propylene carbonate (PC), dimethylformamide (DMF), dimethyl
sulfoxide (DMSO), dimethylacetamide, ethylene carbonate (EC),
malononitrile, succinonitrile or adiponitrile. Next, the solvent is
heated to form PAN solution with PAN concentration of about 0.1 wt
% to about 10 wt % (weight percentage). The solvent is heated to a
temperature of about 25.degree. C. to 160.degree. C., preferably
about 25.degree. C. to 160.degree. C. More preferably about
100.degree. C. to 150.degree. C. Next, the PAN solution is cooled
to a temperature of about 25.degree. C. to 50.degree. C.,
preferably about 20.degree. C. to 40.degree. C. More preferably
about 25.degree. C. to 30.degree. C. Then the PAN solution is
formed on the substrate 100 by spin-coating, inkjet-printing,
casting or roll-to-roll printing. Next, the PAN solution is stands
for 1 to 10 min. More preferably for 2 to 5 min. Next, the solvent
in the PAN solution is removed by baking. The solvent in the PAN
solution is removed at a temperature of about 25.degree. C. to
150.degree. C., preferably at about 50.degree. C. to 150.degree. C.
More preferably about 80.degree. C. to 130.degree. C. Next, a PAN
dielectric 300 layer is formed on the substrate 100. The process of
forming the PAN dielectric layer 300 as described is a low
temperature process (<200.degree. C.). The process can prevent
the transmutation of the substrate 100 comprising organic or
polymer materials formed by a high temperature process. In this
first embodiment, the thickness of the PAN dielectric layer 300 is
preferably about 40 nm to 60 nm. The PAN dielectric layer 300
serves as an insulator layer of the MIS.
[0034] Referring to FIG. 2c, a patterned conductive layer 500 is
formed on the PAN dielectric layer 300. A conductive layer is
formed by physical vapor deposition (PVD). The patterned conductive
layer 500 is formed on the PAN dielectric layer 300 after
photolithography and etching. The patterned conductive layer 500
may comprise Au or an alloy thereof. In this embodiment, the
patterned conductive layer 500 serves as a metal layer of the MIS;
it also serves as a top electrode of the MIS. Thus, fabrication of
the Metal-Insulator-Silicon capacitor 10a according to the first
embodiment of the invention is complete.
[0035] As illustrated, the invention provides a
Metal-Insulator-Silicon capacitor 10a comprising a substrate 100. A
PAN dielectric layer 300 is formed on the substrate 100. A
patterned conductive layer 500 is formed on the PAN dielectric
layer 300.
[0036] FIGS. 3a to 3b show crosssections of a second embodiment of
the process of fabricating an organic thin film transistor 10b.
Referring to FIG. 3a, an organic polymer layer 400 is formed on the
PAN dielectric layer 300. The step of forming the organic polymer
layer 400 further comprises dissolving an organic polymer powder in
a solvent such as toluene, dichloromethane, trichloromethane
(chloroform) or tetrahydrofuran. Next, an organic polymer solution
with the organic polymer concentration of about 0.1 wt % to about
0.5 wt % (weight percentage) is formed. Next, the organic polymer
solution is formed on the substrate by spin-coating,
inkjet-printing, casting, roll-to-roll printing or evaporation.
Next, the solvent in the organic polymer solution is removed by
baking and the organic polymer layer 400 is formed on the PAN
dielectric layer 300. The organic polymer layer 400 comprises
pentacene or poly(3-hexylthiophene) (PH3T) having thicknesses of
about 20 to 40 nm or 90 to 110 nm respectively. In this embodiment,
the substrate 100, the PAN dielectric layer 300 and the organic
polymer layer 400 serve as the gate electrode, the gate dielectric
layer and the active layer respectively.
[0037] Referring to FIG. 3b, a source 500a/drain 500b is formed on
the organic polymer layer 400. A conductive layer is formed by
physical vapor deposition (PVD) on the organic polymer layer 400.
Then the source 500a/drain 500b is formed on the organic polymer
layer 400 after photolithography and etching. The source 500a/drain
500b may comprise Au or an alloy thereof. Thus, fabrication of the
organic thin film transistor 10b according to the second embodiment
of the invention is complete. The devices of the organic thin film
transistor 10b are nearly identical to those of the
Metal-Insulator-Silicon capacitor 10a (as shown in FIG. 2a to FIG.
2b) and for simplicity, their detailed description is omitted.
[0038] As illustrated, the invention provides an organic thin film
transistor 10b comprising a substrate 100. A PAN dielectric layer
300 is formed on the substrate 100. An organic polymer layer 400 is
formed on the PAN dielectric layer 300. A source 500a/drain 500b is
formed on the organic polymer layer 400.
[0039] FIGS. 4a to 4b show crosssections of a third embodiment of
the process of fabricating an organic thin film transistor 10c.
Referring to FIG. 4a, an organic polymer layer 400 is formed on the
PAN dielectric layer 300. The step of forming the organic polymer
layer 400 further comprises dissolving an organic polymer powder in
a solvent such as toluene, dichloromethane, trichloromethane
(chloroform) or tetrahydrofuran. Next, an organic polymer solution
with the organic polymer concentration of about 0.1 wt % to about
0.5 wt % (weight percentage) is formed. Next, the organic polymer
solution is formed on the substrate by spin-coating,
inkjet-printing, casting, roll-to-roll printing or evaporation.
Next, the solvent in the organic polymer solution is removed by
baking and the organic polymer layer 400 is formed on the PAN
dielectric layer 300. The organic polymer layer 400 comprises
pentacene or poly(3-hexylthiophene) (PH3T) having thicknesses of
about 20 to 40 nm or 90 to 110 nm respectively. In this embodiment,
the substrate 100, the PAN dielectric layer 300 and the organic
polymer layer 400 serve as the gate electrode, the gate dielectric
layer and the active layer of the organic thin film transistor 10c
respectively.
[0040] Referring to FIG. 4b, a source 500a/drain 500b is formed on
the organic polymer layer 400. A conductive layer is formed by
physical vapor deposition (PVD) on the organic polymer layer 400.
Then the source 500a/drain 500b is formed on the organic polymer
layer 400 after photolithography and etching. The source 500a/drain
500b may comprise Au or an alloy thereof. Thus, fabrication of the
organic thin film transistor 10c according to the third embodiment
of the invention is complete. The devices of the organic thin film
transistor 10c are nearly identical to those of the
Metal-Insulator-Silicon capacitor 10a and the organic thin film
transistor 10b (as shown in FIG. 2a to FIG. 2b and FIG. 3a). For
simplicity, their detailed description is omitted.
[0041] The main difference between the organic thin film transistor
10b and the organic thin film transistor 10c, according to the
second and the third embodiments of the invention, is that the
active layer is formed in the patterned organic polymer layer 400a,
and not completely formed over the PAN dielectric layer 300. The
source 500a/drain 500b is formed on part of the patterned organic
polymer layer 400a and the PAN dielectric layer 300 not covered by
the patterned organic polymer layer 400a. The source 500a/drain
500b covers the sidewall of the patterned organic polymer layer
400a.
[0042] FIGS. 5a to 5c show crosssections of a fourth embodiment of
fabricating a Metal-insulator-metal capacitor (MIM) 10d. Referring
to FIG. 5a, a conductive polymer layer 200 is formed on the
substrate 100. The step of forming the conductive polymer layer 200
further comprises dissolving a conductive polymer powder in a
solvent such as isopropylalcohol (IPA) or ethanol. Next, a
conductive polymer solution with conductive polymer concentration
of about 0.5 wt % to about 20 wt % (weight percentage) is formed.
Next, the conductive polymer solution is formed on the substrate by
spin-coating, inkjet-printing, casting, roll-to-roll printing or
evaporation. Next, the solvent in the conductive polymer solution
is removed by baking and the conductive polymer layer 200 is formed
on the substrate 100. The conductive polymer layer 200 comprises
ethylene glycol-doped
poly(3,4-ethylenedioxy-thiophene)/poly(styrenesulfonate)
(PEDOT:PSS+EG) and has thicknesses of about 40 to 200 nm. In this
embodiment, the conductive polymer layer 200 serves as the bottom
electrode of the MIM.
[0043] Referring to FIG. 5b, a patterned PAN dielectric layer 300a
is formed on the conductive polymer layer 200. The step of forming
the patterned PAN dielectric layer 300a further comprises forming
the PAN dielectric layer 300 on the, conductive polymer layer 200.
The patterned PAN dielectric layer 300a is formed on the conductive
polymer layer 200 after photolithography and etching.
[0044] Referring to FIG. 5c, the patterned conductive layer 500 is
formed on the patterned PAN dielectric layer 300a. A conductive
layer is formed by physical vapor deposition (PVD). The patterned
conductive layer 500 is formed on the patterned PAN dielectric
layer 300a after photolithography and etching. The patterned
conductive layer 500 may comprise Au or an alloy thereof. In this
embodiment, the patterned conductive layer 500 serves as a metal
layer of the MIM; it also serves as a top electrode of the MIM.
Thus, fabrication of the Metal-Insulator-Metal capacitor 10d
according to the fourth embodiment of the invention is
complete.
[0045] As illustrated, the invention provides a
Metal-Insulator-Metal capacitor 10d comprising a substrate 100. A
conductive polymer layer 200 is formed on the substrate 100. A
patterned PAN dielectric layer 300a is formed on the conductive
polymer layer 200. A patterned conductive layer 500 is formed on
the patterned PAN dielectric layer 300a.
[0046] FIG. 6 illustrates a process chart of fabricating a
semiconductor device. As shown in step 61, the step of forming the
PAN dielectric layer comprises dissolving a PAN powder in a solvent
such as propylene carbonate (PC), dimethylformamide (DMF), dimethyl
sulfoxide (DMSO), dimethylacetamide, ethylene carbonate (EC),
malononitrile, succinonitrile or adiponitrile, the solvent is
heated to form a PAN solution with PAN concentration of about 0.1
wt % to about 10 wt % (weight percentage). The solvent is heated to
a temperature of about 25.degree. C. to 160.degree. C., preferably
about 25.degree. C. to 160.degree. C. More preferably about
100.degree. C. to 150.degree. C. As shown in step 62, the PAN
solution is cooled to a temperature of about 25.degree. C. to
50.degree. C., preferably about 20.degree. C. to 40.degree. C. More
preferably about 25.degree. C. to 30.degree. C. As shown in step
63, the PAN solution is formed on the substrate 100 by
spin-coating, inkjet-printing, casting or roll-to-roll printing. As
shown in step 64, preferably the PAN solution stands for 1 to 10
min. More preferably for 2 to 5 min. As shown in step 65, the
solvent in the PAN solution is removed by baking. The solvent in
the PAN solution is removed at a temperature of about 25.degree. C.
to 150.degree. C., preferably about 50.degree. C. to 150.degree. C.
More preferably about 80.degree. C. to 130.degree. C. Thus,
formation the PAN dielectric 300 layer on the substrate 100 is
complete.
[0047] The fabricating method of the PAN dielectric 300 layer is
illustrated. The PAN dielectric 300 layer serves as the dielectric
layer of semiconductor devices. The PAN weight concentration of the
PAN solution, the solvent of the PAN solution, the heating
temperature region of the PAN solution, the standing time of the
PAN solution after coating the PAN solution and control of the
baking time are chosen for the optimal process. Fabricating the PAN
dielectric layer 300, the leakage current of which, is similar to a
conventional furnace SiO.sub.2 layer.
[0048] Referring to FIG. 7, a leakage current (I.sub.leak) versus
applied voltage (V.sub.appl) characteristic of a 50 nm PAN
dielectric layer 701 and a 100 nm furnace SiO.sub.2 dielectric
layer 702 is illustrated. FIG. 7 shows a 0.7 pA leakage current
(leakage current density is 0.1 nA/cm.sup.2) of PAN dielectric
layer 702 with 10V applied voltage and is compatible with the
furnace SiO.sub.2 dielectric layer 702 which has a 0.3 nA/cm.sup.2
leakage current density, even lower than the furnace SiO.sub.2
dielectric layer 702.
[0049] Referring to FIGS. 8a, a drain-current (Id) versus
drain-voltage (Vd) characteristic of a fabricated organic thin film
transistor (channel width (W)/channel length (L)=100 .mu.m/100
.mu.m) of PAN for a gate dielectric layer on an n-doped substrate
(not shown) and poly(3-hexylthiophene) (PH3T) for use in an active
layer is illustrated. Referring to FIG. 8b, a thermal SiO.sub.2 was
also used as a gate dielectric layer of another fabricated organic
thin film transistor (W/L=100 um/100 um) for Id versus Vd
characteristic comparison. The drain saturation current (Id_sat),
the threshold voltage (Vt); the carrier mobility (.mu.) and the
on/off current ratio (Ion/Ioff) are calculated by the following
formula: Id_sat=(W/2L).mu.C'(Vg-Vt).sup.2, where the W, L, .mu.,
C', Vg, Vt are channel width, channel length, carrier mobility,
area capacitance of gate dielectric, gate voltage and threshold
voltage, respectively. For the fabricated organic thin film
transistor with PAN for the gate dielectric layer and PH3T for the
active layer, the Id_sat at -40V Vg, .mu., Vt, and Ion/Ioff are
2.5.times.10.sup.-3 .mu.A/cm, 5.5.times.10.sup.-4
cm.sup.2V.sup.-1s.sup.-1, 1.3V, and 6.4.times.10.sup.1,
respectively. As to the fabricated organic thin film transistor
with thermal SiO.sub.2 for the gate dielectric layer and PH3T for
the active layer for comparison, the Id_sat at -40V Vg, .mu., Vt,
and Ion/Ioff are 1.5.times.10.sup.-3 .mu.A/cm, 2.1.times.10.sup.-3
cm.sup.2V.sup.-1s.sup.-1, -5.9V, and 3.4.times.10.sup.1,
respectively. The Id_sat of the fabricated organic thin film
transistor with PAN for the gate dielectric layer and PH3T for the
active layer is higher than the fabricated organic thin film
transistor with thermal SiO.sub.2 for the gate dielectric layer and
PH3T for the active layer. It is result form the higher C' of the
fabricated organic thin film transistor with PAN for the gate
dielectric layer and PH3T for the active layer. This is because the
PAN film (50 nm) is thinner than thermal SiO.sub.2 (100 nm), and
has a dielectric constant (k) (k=4.7) higher than that of thermal
SiO.sub.2 (k=4). The Ion/Ioff of the fabricated organic thin film
transistor with PAN for the gate dielectric layer and PH3T for the
active layer (6.4.times.10.sup.1) has the same order as the
fabricated organic thin film transistor with thermal SiO.sub.2
serves as the gate dielectric layer and PH3T for the active layer
(3.4.times.10.sup.1).
[0050] Referring to FIGS. 9a, an Id versus Vd characteristic of a
fabricated organic thin film transistor comparison a fabricated
organic thin film transistor (W/L=100 um/100 um) with PAN for a
gate dielectric layer on an n-doped substrate and pentacene for use
in an active layer is illustrated. Referring to FIGS. 9b, a thermal
SiO.sub.2 was also used as a gate dielectric layer of another
fabricated organic thin film transistor (W/L=100 um/100 um) for Id
versus Vd characteristic comparison. For the fabricated organic
thin film transistor with PAN for the gate dielectric layer and
pentacene for the active layer, the Id_sat at -40V Vg, .mu., Vt,
and Ion/Ioff are 2.1.times.10.sup.-3 .mu.A/cm, 1.4.times.10.sup.-2
cm.sup.2V.sup.-1s.sup.-1, -0.97V, and 3.14.times.10.sup.3,
respectively. As to the fabricated organic thin film transistor
with thermal SiO.sub.2 for the gate dielectric layer and pentacene
for the active layer for comparison, the Id_sat at -40V Vg, .mu.,
Vt, and Ion/Ioff are 1.25.times.10.sup.-3 .mu.A/cm,
3.1.times.10.sup.-3 cm.sup.2V.sup.-1s.sup.-1, -0.65V, and
4.55.times.10.sup.3, respectively. The Id_sat of the fabricated
organic thin film transistor with PAN for the gate dielectric layer
and pentacene for the active layer is higher than the fabricated
organic thin film transistor with thermal SiO.sub.2 for the gate
dielectric layer and pentacene for the active layer. This results
form the higher C' of the fabricated organic thin film transistor
with PAN for the gate dielectric layer and PH3T for the active
layer. This is because the thickness of PAN film (50 nm) is thinner
than that of thermal SiO.sub.2 (100 nm), and its dielectric
constant (k) (k=4.7) is higher than that of thermal SiO.sub.2
(k=4). The Ion/Ioff of the fabricated organic thin film transistor
with PAN for the gate dielectric layer and pentacene for the active
layer (3.14.times.10.sup.3) has the same order with the fabricated
organic thin film transistor with thermal SiO.sub.2 for the gate
dielectric layer and pentacene for the active layer
(4.55.times.10.sup.3). This proves that the PAN dielectric layer
according of the invention shows good performances with low leakage
current and low operating voltage and it is suitable for a gate
dielectric layer of an organic thin film transistor.
[0051] A novel organic dielectric material of the invention, PAN,
has advantages of a low temperature fabricating process, low cost,
low leakage current, low operating voltage, and process
compatibility with flexible substrates. It is particularly
applicable for use in organic thin film transistors.
[0052] While the invention has been described by way of example and
in terms of the preferred embodiments, it is to be understood that
the invention is not limited to the disclosed embodiments. To the
contrary, it is intended to cover various modifications and similar
arrangements (as would be apparent to those skilled in the art).
Therefore, the scope of the appended claims should be accorded the
broadest interpretation so as to encompass all such modifications
and similar arrangements.
* * * * *