| Patent | Date |
|---|
Anode Material For Secondary Battery, Anode For Secondary Battery And Secondary Battery
App 20220311000 - Yew; Tri-Rung ; et al. | 2022-09-29 |
Anode Material For Secondary Battery, Anode For Secondary Battery And Secondary Battery
App 20210226208 - Yew; Tri-Rung ; et al. | 2021-07-22 |
Electrode material for secondary battery and secondary battery
Grant 10,615,449 - Chu , et al. | 2020-04-07 |
Electrode Material For Secondary Battery And Secondary Battery
App 20190305357 - Chu; Yu-Ying ; et al. | 2019-10-03 |
Method of fabricating metal-insulator-metal capacitor
Grant 10,079,277 - Yew , et al. September 18, 2 | 2018-09-18 |
Method Of Fabricating Metal-insulator-metal Capacitor
App 20180151666 - Yew; Tri-Rung ; et al. | 2018-05-31 |
Three-dimensional electrode and a biological probe comprising the same
Grant 9,662,026 - Pan , et al. May 30, 2 | 2017-05-30 |
Multilayer-stacked resistive random access memory device
Grant 9,450,184 - Yew , et al. September 20, 2 | 2016-09-20 |
Multilayer-stacked Resistive Random Access Memory Device
App 20160240779 - YEW; Tri-Rung ; et al. | 2016-08-18 |
Three-dimensional Electrode And A Biological Probe Comprising The Same
App 20160120424 - PAN; I-An ; et al. | 2016-05-05 |
Electron Beam Apparatus For Patterned Metal Reduction And Method For The Same
App 20150259783 - LAI; SHIH-EN ; et al. | 2015-09-17 |
Enzyme-free Colorimetric Immunoassay
App 20150093840 - HUANG; Jing-Huei ; et al. | 2015-04-02 |
W18o49-type Tungsten Oxide Nanomaterial And Applications Thereof In Light Sensor, Mosfet And Solar Cell
App 20150075594 - YEW; Tri-Rung ; et al. | 2015-03-19 |
Self-assembly nano-composite solar cell
Grant 8,937,241 - Yeh , et al. January 20, 2 | 2015-01-20 |
P-type transparent conductive oxide for solar cell comprising molybdenum trioxide doped with indium
Grant 8,609,981 - Chen , et al. December 17, 2 | 2013-12-17 |
Microelectrode array and method for modifying carbon nanotube electrode interface of the same array
Grant 8,593,052 - Yen , et al. November 26, 2 | 2013-11-26 |
Microelectrode Array And Method For Modifying Carbon Nanotube Electrode Interface Of The Same Array
App 20130307520 - YEN; Shiang-Jie ; et al. | 2013-11-21 |
Self-assembly Nano-composite Solar Cell
App 20130284268 - YEH; Che-Ning ; et al. | 2013-10-31 |
Method for fabricating interconnections with carbon nanotubes
Grant 8,461,037 - Wu , et al. June 11, 2 | 2013-06-11 |
Organic thin film transistor
Grant 8,368,057 - Wang , et al. February 5, 2 | 2013-02-05 |
Perylene diimide derivative and organic semiconductor element using the same material
Grant 8,283,469 - Chen , et al. October 9, 2 | 2012-10-09 |
Full-spectrum Absorption Solar Cell
App 20120152335 - SHIU; Hui-Ying ; et al. | 2012-06-21 |
Electric Conductivity-based Biosensor
App 20120148449 - Chuang; Ya-Hsuan ; et al. | 2012-06-14 |
Method For Fabricating Interconnections With Carbon Nanotubes
App 20120135598 - WU; Hsin-wei ; et al. | 2012-05-31 |
P-type Transparent Conductive Oxides And Solar Cells With P-type Transparent Conductive Oxides
App 20120118386 - CHEN; Han-Yi ; et al. | 2012-05-17 |
Perylene Diimide Derivative And Organic Semiconductor Element Using The Same Material
App 20110233526 - Chen; Szu-Ying ; et al. | 2011-09-29 |
Organic thin film transistor
App 20110193065 - Wang; Yu-Ping ; et al. | 2011-08-11 |
Flexible Probe Structure And Method For Fabricating The Same
App 20110144471 - HSU; Hui-Lin ; et al. | 2011-06-16 |
Interconnect structure and method of fabricating the same
Grant 7,858,147 - Wu , et al. December 28, 2 | 2010-12-28 |
Specimen kit and fabricating method thereof
Grant 7,807,979 - Liu , et al. October 5, 2 | 2010-10-05 |
Carbon nanotube and method of visualizing carbon nanotube
Grant 7,754,107 - Wu , et al. July 13, 2 | 2010-07-13 |
Field-effect transistor structure and fabrication method thereof
App 20090325370 - Yang; Tsung-Yeh ; et al. | 2009-12-31 |
Field-effect transistor structure and fabrication method thereof
App 20090250731 - Yang; Tsung-Yeh ; et al. | 2009-10-08 |
Self-aligned Field-effect Transistor Structure And Manufacturing Method Thereof
App 20090236675 - Yang; Wei-Chang ; et al. | 2009-09-24 |
Interconnect structure and method of fabricating the same
App 20090197113 - Wu; Yu-Tsung ; et al. | 2009-08-06 |
Biosensor structure and fabricating method thereof
App 20090191616 - Lu; Yi-Chun ; et al. | 2009-07-30 |
Carbon nanotube and method of visualizing carbon nanotube
App 20080296538 - Wu; Ning-Yu ; et al. | 2008-12-04 |
Multifunctional Nano-probe Interface Structure For Neural Prostheses And Manufacturing Method Thereof
App 20080140195 - Su; Huan-Chieh ; et al. | 2008-06-12 |
Specimen Kit And Fabricating Method Thereof
App 20080135778 - Liu; Kuo-Liang ; et al. | 2008-06-12 |
Dual damascene structure for the wiring-line structures of multi-level interconnects in integrated circuit
Grant 7,378,740 - Yew , et al. May 27, 2 | 2008-05-27 |
Interconnection Structure And Manufacturing Method Thereof
App 20080067681 - Tseng; Tzu-chun ; et al. | 2008-03-20 |
Method of fabricating a semiconductor device
App 20070238318 - Hsu; Hui-Lin ; et al. | 2007-10-11 |
Gradient barrier layer for copper back-end-of-line technology
Grant 7,067,917 - Liou , et al. June 27, 2 | 2006-06-27 |
Method making bonding pad
Grant 6,987,057 - Lee , et al. January 17, 2 | 2006-01-17 |
Dual damascene structure for the wiring-line structures of multi-level interconnects in integrated circuit
App 20050263876 - Yew, Tri-Rung ; et al. | 2005-12-01 |
Capacitor in an interconnect system and method of manufacturing thereof
Grant 6,894,364 - Hao , et al. May 17, 2 | 2005-05-17 |
Bonding pad structure
Grant 6,794,752 - Lee , et al. September 21, 2 | 2004-09-21 |
Capacitor In An Interconnect System And Method Of Manufacturing Thereof
App 20040157392 - HAO, MING-YIN ; et al. | 2004-08-12 |
Dual damascene structure for the wiring-line structures of multi-level interconnects in integrated circuit
App 20040084780 - Yew, Tri-Rung ; et al. | 2004-05-06 |
Method of forming dual damascene structure
Grant 6,680,248 - Huang , et al. January 20, 2 | 2004-01-20 |
Dual damascene structure for the wiring-line structures of multi-level interconnects in integrated circuit
App 20030189254 - Yew, Tri-Rung ; et al. | 2003-10-09 |
Gradient barrier layer for copper back-end-of-line technology
App 20030186541 - Liou, Fu-Tai ; et al. | 2003-10-02 |
Gradient barrier layer for copper back-end-of-line technology
App 20030186087 - Liou, Fu-Tai ; et al. | 2003-10-02 |
Method of forming dual damascene structure
Grant 6,593,223 - Huang , et al. July 15, 2 | 2003-07-15 |
Bonding pad structure and method for making same
App 20030006505 - Lee, Ellis ; et al. | 2003-01-09 |
Structure of a dual damascene via
App 20020171147 - Yew, Tri-Rung ; et al. | 2002-11-21 |
Method for fabricating a barrier layer
App 20020137329 - Fang, Edberg ; et al. | 2002-09-26 |
Dual damascene structure for the wiring-line structures of multi-level interconnects in integrated circuit
App 20020130417 - Yew, Tri-Rung ; et al. | 2002-09-19 |
Method of fabricating dram capacitor
App 20020081803 - Huang, Kuo-Tai ; et al. | 2002-06-27 |
Method of forming dual damascene structure
App 20020050645 - Huang, Yimin ; et al. | 2002-05-02 |
Method for fabricating shallow trench isolation structure
Grant 6,306,722 - Yang , et al. October 23, 2 | 2001-10-23 |
Bonding pad structure and method for making same
App 20010022403 - Lee, Ellis ; et al. | 2001-09-20 |
Method of fabricating a thin and structurally-undefective dielectric structure for a storage capacitor in dynamic random-access memory
Grant 6,291,288 - Huang , et al. September 18, 2 | 2001-09-18 |
Method of forming borderless contact
Grant 6,281,143 - Huang , et al. August 28, 2 | 2001-08-28 |
Method of manufacturing copper interconnect
Grant 6,265,313 - Huang , et al. July 24, 2 | 2001-07-24 |
Multi-step spacer formation of semiconductor devices
Grant 6,242,334 - Huang , et al. June 5, 2 | 2001-06-05 |
Method Of Fabricating A Dual -damascene Structure In An Integrated Cirtcuit With Multilevel-interconnect Strcture
App 20010001742 - HUANG, YIMIN ; et al. | 2001-05-24 |
Method for fabricating gate oxide layer
Grant 6,221,712 - Huang , et al. April 24, 2 | 2001-04-24 |
Method of patterning dielectric
App 20010000155 - Huang, Yimin ; et al. | 2001-04-05 |
Process for low k organic dielectric film etch
Grant 6,184,142 - Chung , et al. February 6, 2 | 2001-02-06 |
Method for manufacturing dielectric layer
Grant 6,159,845 - Yew , et al. December 12, 2 | 2000-12-12 |
Method of fabricating gate
Grant 6,150,251 - Yew , et al. November 21, 2 | 2000-11-21 |
Method for fabricating semiconductor device
Grant 6,140,192 - Huang , et al. October 31, 2 | 2000-10-31 |
Fabrication method of a tantalum pentoxide dielectric layer for a DRAM capacitor
Grant 6,133,086 - Huang , et al. October 17, 2 | 2000-10-17 |
Method of fabricating a dynamic random access memory device
Grant 6,114,200 - Yew , et al. September 5, 2 | 2000-09-05 |
Method for manufacturing shallow trench isolation structure
Grant 6,087,262 - Yang , et al. July 11, 2 | 2000-07-11 |
Via structure and method of manufacture
Grant 6,080,660 - Wang , et al. June 27, 2 | 2000-06-27 |
Structure of a capacitor in a semiconductor device having a self align contact window which has a slanted sidewall
Grant 6,078,492 - Huang , et al. June 20, 2 | 2000-06-20 |
Method of fabricating a daul damascene structure
Grant 6,077,769 - Huang , et al. June 20, 2 | 2000-06-20 |
Method of forming bonding pad
Grant 6,069,066 - Huang , et al. May 30, 2 | 2000-05-30 |
Method of fabricating a capacitor of a dynamic random access memory
Grant 6,037,206 - Huang , et al. March 14, 2 | 2000-03-14 |
Fabricating method of a barrier layer
Grant 6,025,264 - Yew , et al. February 15, 2 | 2000-02-15 |
Method for unlanded via etching using etch stop
Grant 6,020,258 - Yew , et al. February 1, 2 | 2000-02-01 |
Method of fabricating dual damascene
Grant 6,017,817 - Chung , et al. January 25, 2 | 2000-01-25 |
Dual damascene processing method
Grant 6,001,414 - Huang , et al. December 14, 1 | 1999-12-14 |
Method of forming a dual damascene with dummy metal lines
Grant 6,001,733 - Huang , et al. December 14, 1 | 1999-12-14 |
Process and structure for embedded DRAM
Grant 5,998,251 - Wu , et al. December 7, 1 | 1999-12-07 |
Method for forming a DRAM cell electrode
Grant 5,994,181 - Hsieh , et al. November 30, 1 | 1999-11-30 |
Method for forming charge storage structure
Grant 5,994,183 - Huang , et al. November 30, 1 | 1999-11-30 |
Dual damascence process
Grant 5,990,015 - Lin , et al. November 23, 1 | 1999-11-23 |
Method for increasing capacitance
Grant 5,976,931 - Yew , et al. November 2, 1 | 1999-11-02 |
Dielectric pattern
Grant 5,959,361 - Huang , et al. September 28, 1 | 1999-09-28 |
Method of fabricating a shallow-trench isolation structure in integrated circuit
Grant 5,960,299 - Yew , et al. September 28, 1 | 1999-09-28 |
Method for fabricating a shallow-trench isolation structure with a rounded corner in integrated circuit
Grant 5,956,598 - Huang , et al. September 21, 1 | 1999-09-21 |
Method of Making High-K Dielectrics for embedded DRAMS
Grant 5,930,618 - Sun , et al. July 27, 1 | 1999-07-27 |
Dual damascene process
Grant 5,801,094 - Yew , et al. September 1, 1 | 1998-09-01 |
Method for growing hemispherical grain silicon
Grant 5,753,559 - Yew , et al. May 19, 1 | 1998-05-19 |
| 