U.S. patent application number 11/671571 was filed with the patent office on 2007-06-07 for exposure apparatus and device manufacturing method.
This patent application is currently assigned to Canon Kabushiki Kaisha. Invention is credited to Masami Yonekawa.
Application Number | 20070127004 11/671571 |
Document ID | / |
Family ID | 34791584 |
Filed Date | 2007-06-07 |
United States Patent
Application |
20070127004 |
Kind Code |
A1 |
Yonekawa; Masami |
June 7, 2007 |
EXPOSURE APPARATUS AND DEVICE MANUFACTURING METHOD
Abstract
An exposure apparatus for exposing a substrate. The apparatus
includes an optical system being set at a reference temperature,
for directing light to the substrate, an exposure chamber for
storing the optical system in a vacuum ambience, and a load-lock
chamber, disposed adjacent to the exposure chamber, for converting
an ambience of a space surrounding the substrate into a vacuum
ambience. When the load-lock chamber converts the ambience of the
space surrounding the substrate into a vacuum ambience, the
temperature of the load-lock chamber is made higher than the
reference temperature.
Inventors: |
Yonekawa; Masami;
(Utsunomiya-shi, JP) |
Correspondence
Address: |
FITZPATRICK CELLA HARPER & SCINTO
30 ROCKEFELLER PLAZA
NEW YORK
NY
10112
US
|
Assignee: |
Canon Kabushiki Kaisha
Tokyo
JP
|
Family ID: |
34791584 |
Appl. No.: |
11/671571 |
Filed: |
February 6, 2007 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
11019112 |
Dec 22, 2004 |
7193682 |
|
|
11671571 |
Feb 6, 2007 |
|
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Current U.S.
Class: |
355/53 ;
355/30 |
Current CPC
Class: |
H01L 21/67201 20130101;
H01L 21/67248 20130101; H01L 21/67225 20130101; G03F 7/70808
20130101; H01L 21/67126 20130101; G03F 7/7085 20130101; G03F
7/70525 20130101; G03F 7/70841 20130101; G03F 7/70916 20130101;
G03F 7/70858 20130101 |
Class at
Publication: |
355/053 ;
355/030 |
International
Class: |
G03B 27/42 20060101
G03B027/42 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 26, 2003 |
JP |
2003-434539 |
Claims
1-13. (canceled)
14. An exposure apparatus for exposing a substrate, said apparatus
comprising: an optical system being set at a reference temperature,
for directing light to the substrate; an exposure chamber for
storing the optical system in a vacuum ambience; a load-lock
chamber disposed adjacent said exposure chamber, for converting an
ambience of a space surrounding the substrate into a vacuum
ambience; and at least one of a heat insulating material and a heat
insulating structure provided between said load-lock chamber and
said exposure chamber.
15. An apparatus according to claim 14, wherein the time in which
the substrate is introduced into said load-lock chamber and the
time in which heating means applies heat to said load-lock chamber
are at least partially overlapped with each other.
16. (canceled)
17. A device manufacturing method, comprising the steps of:
exposing a substrate by use of an exposure apparatus as recited in
claim 14; and developing the exposed substrate.
Description
[0001] This application is a divisional application of copending
U.S. patent application Ser. No. 11/019,112, filed Dec. 22,
2004.
FIELD OF THE INVENTION AND RELATED ART
[0002] This invention relates generally to a semiconductor exposure
apparatus. More particularly, the invention concerns an exposure
apparatus having a load-lock chamber, which is provided in
association with an apparatus for exposing a semiconductor
substrate in a vacuum ambience.
[0003] In relation to semiconductor devices, such as DRAMs or MPUs,
for example, much research and many developments are currently
being done to achieve devices having a linewidth of 0.1 .mu.m or
less in design rule. The exposure apparatuses to be used for this
generation will be those using an electron beam (EB) or extreme
ultraviolet light (EUV).
[0004] In such EB or EUV exposure apparatuses, exposure in
atmosphere is impracticable. The exposure has to be done in a
vacuum and, hence, the wafer loading and unloading should be made
by way of a load-lock chamber.
[0005] Generally, the load-lock chamber functions so that it
receives a wafer under atmospheric pressure and then, the chamber
is vacuum exhausted to a predetermined pressure level. After that,
a door is opened, and the wafer is loaded into the exposure
apparatus. After the exposure is completed, the wafer is unloaded
from the exposure apparatus, and the door at the exposure side is
closed. After that, the chamber inside pressure is turned back to
the atmospheric pressure, and then, the wafer is unloaded from the
chamber.
[0006] Here, when the load-lock chamber is vacuum exhausted,
particles are created within the chamber and they are adhered to
and deposited on the wafer surface. This causes a serious decrease
of yield of device production and degradation of device
reliability.
[0007] Conventionally, the mechanism of this phenomenon has been
regarded as particles, which are adhered and deposited inside the
load-lock chamber, are raised by vacuum exhausting, and they are
adhered to the wafer. Recently, however, another finding has been
obtained, according to which water vapor contained in the load-lock
chamber is condensed by a rapid temperature decrease due to
adiabatic expansion of inside gas, and the vapor is adhered to the
wafer.
[0008] The temperature of the gas during the vacuum evacuation
largely depends on the type of gas, the capacity of the load-lock
chamber, exhaust speed, and so on. A decrease amount of a few tens
of degrees (.degree. C.) was observed. When water vapor is
contained in the load-lock chamber, due to a rapid decrease of the
gas temperature, taking small particles as a nucleus, the water
vapor is condensed and grows into large particles (heterogeneous
nucleation condensation). Depending on the temperature, vapor is
frozen into ice, which is deposited on the wafer. Furthermore, the
above-described phenomenon of water vapor condensation causes
serious problems even without the presence of particles inside the
load-lock chamber that function as nuclei, the problems being that
various ions inside the gas function as a condensation nucleus
(heterogeneous nucleation condensation), or that water vapor is
coagulated and grows largely (homogeneous nucleation). Thus, the
presence of water vapor inside the load-lock chamber, itself, is
the source of the problem.
[0009] Japanese Laid-Open Patent Application, Publication No.
2003-234282 proposes the use of a heater inside a load-lock
chamber, as well as adjusting the exhausting speed for exhausting
the gas inside the load-lock chamber, in an attempt to avoid
condensation of water vapor inside the load-lock chamber.
SUMMARY OF THE INVENTION
[0010] It is accordingly an object of the present invention to
provide a unique and an improved exposure apparatus by which at
least one of the inconveniences described above can be solved or
reduced.
[0011] In accordance with an aspect of the present invention, to
achieve the above object, there is provided an exposure apparatus
for exposing a substrate, comprising an optical system being set at
a reference temperature, for directing light to the substrate, an
exposure chamber for storing the optical system in a vacuum
ambience, and a load-lock chamber disposed adjacent to the exposure
chamber, for converting an ambience of a space surrounding the
substrate into a vacuum ambience, wherein, when the load-lock
chamber converts the ambience of the space surrounding the
substrate into a vacuum ambience, the temperature of the load-lock
chamber is made higher than the reference temperature.
[0012] In one preferred form of this aspect of the present
invention, the difference between the load-lock chamber temperature
and the reference temperature is not less than five degrees and not
greater than thirty degrees. Preferably, the difference between the
load-lock chamber temperature and the reference temperature is not
less than ten degrees. More preferably, the difference between the
load-lock chamber temperature and the reference temperature is not
greater than twenty degrees.
[0013] The apparatus may further comprise a heating mechanism for
applying heat to the load-lock chamber, wherein the heating
mechanism is provided in a space, inside the load-lock chamber,
that does not contact with the space surrounding the substrate.
[0014] The temperature of the load-lock chamber may be a
temperature with which water vapor inside the space surrounding the
substrate is not condensed during exhausting of a gas inside the
space surrounding the substrate.
[0015] The load-lock chamber may function to start the conversion
of the ambience of the space surrounding the substrate inside the
load-lock chamber either when a result of measurement of gas
temperature measuring means provided in relation to the load-lock
chamber shows a temperature equal to or higher than a predetermined
temperature or when the time in which a gas inside the load-lock
chamber receives heat supply from a wall of the load-lock chamber
becomes equal to or longer than a predetermined time period.
[0016] The apparatus may further comprise at least one of a heat
insulating material or a heat insulating structure provided between
the load-lock chamber and the exposure chamber.
[0017] The apparatus may further comprise gas supply means for
supplying a gas into the load-lock chamber, and gas temperature
adjusting means capable of raising the temperature of the gas
supplied by the gas supplying means up to or beyond a predetermined
temperature.
[0018] The apparatus may further comprise temperature measuring
means for measuring the temperature of the load-lock chamber, and
control means for controlling the temperature of the load-lock
chamber on the basis of the measured temperature of the load-lock
chamber.
[0019] The apparatus may further comprise heating means for
applying heat to the load-lock chamber.
[0020] The apparatus may further comprise a deformable member
provided between the exposure chamber and the load-lock chamber for
relative displacement. The deformable member may be a bellows.
[0021] In accordance with another aspect of the present invention,
there is provided an exposure apparatus for exposing a substrate,
comprising an optical system being set at a reference temperature,
for directing light to the substrate, an exposure chamber for
storing the optical system in a vacuum ambience, a load-lock
chamber disposed adjacent to the exposure chamber, for converting
an ambience of a space surrounding the substrate into a vacuum
ambience, and at least one of a heat insulating material and a heat
insulating structure provided between the load-lock chamber and the
exposure chamber.
[0022] The apparatus may further comprise heating means for
applying heat to the load-lock chamber.
[0023] In one preferred form of this aspect of the present
invention, the time in which the substrate is introduced into the
load-lock chamber and the time in which the heating means applies
heat to the load-lock chamber are at least partially overlapped
with each other.
[0024] In accordance with a further aspect of the present
invention, there is provided a device manufacturing method,
comprising the steps of exposing a substrate by use of an exposure
apparatus as discussed above, and developing the exposed
substrate.
[0025] These and other objects, features and advantages of the
present invention will become more apparent upon a consideration of
the following description of the preferred embodiments of the
present invention taken in conjunction with the accompanying
drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0026] FIG. 1 is a schematic and diagrammatic view for explaining a
first embodiment of the present invention.
[0027] FIG. 2 is a schematic view of an exposure system to which
the present invention is applied.
[0028] FIG. 3 is a graph for explaining temperature decreases of a
gas and a wafer inside a load-lock chamber during vacuum
evacuation.
[0029] FIG. 4 is a graph for explaining the chamber inside pressure
during vacuum evacuation in a first state, in the first embodiment
of the present invention.
[0030] FIG. 5 is a graph for explaining the gas temperature during
vacuum evacuation in the first state, in the first embodiment of
the present invention.
[0031] FIG. 6 is a graph for explaining the value of the saturation
degree Sr during vacuum evacuation in the first state, in the first
embodiment of the present invention.
[0032] FIG. 7 is a graph for explaining the chamber inside pressure
during vacuum evacuation in a second state, in the first embodiment
of the present invention.
[0033] FIG. 8 is a graph for explaining the gas temperature during
vacuum evacuation in the second state, in the first embodiment of
the present invention.
[0034] FIG. 9 is a graph for explaining the value Sr during vacuum
evacuation in the second state, in the first embodiment of the
present invention.
[0035] FIG. 10 is a graph for explaining the chamber inside
pressure during vacuum evacuation in a third state, in the first
embodiment of the present invention.
[0036] FIG. 11 is a graph for explaining the gas temperature during
vacuum evacuation in the third state, in the first embodiment of
the present invention.
[0037] FIG. 12 is a graph for explaining the value Sr during vacuum
evacuation in the third state, in the first embodiment of the
present invention.
[0038] FIG. 13 is a schematic and diagrammatic view for explaining
a first modified example according to the first embodiment of the
present invention.
[0039] FIG. 14 is a schematic and diagrammatic view for explaining
a second modified example according to the first embodiment of the
present invention.
[0040] FIG. 15 is a schematic and diagrammatic view for explaining
a third modified example according to the first embodiment of the
present invention.
[0041] FIG. 16 is a schematic and diagrammatic view for explaining
a second embodiment of the present invention.
[0042] FIG. 17 is a flow chart for explaining an example of an
operation to be performed in the first embodiment of the present
invention.
[0043] FIG. 18 is a schematic view of a first example of a heat
insulating structure to be provided between a load-lock chamber and
an apparatus chamber, in accordance with the present invention.
[0044] FIG. 19 is a schematic view of a second example of a heat
insulating structure to be provided between a load-lock chamber and
an apparatus chamber, in accordance with the present invention.
[0045] FIG. 20 is a schematic view of chamber heating means
according to the present invention.
[0046] FIG. 21 is a flow chart for explaining the procedure of
manufacturing devices, such as semiconductor chips (e.g., ICs or
LSIs), LCDs and CCDs, for example, according to a third embodiment
of the present invention.
[0047] FIG. 22 is a flow chart for explaining details of a wafer
process at step 4 shown in FIG. 21.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0048] Preferred embodiments of the present invention will now be
described with reference to the attached drawings.
Embodiment 1
[0049] First of all, a projection exposure apparatus to which the
present invention is applied will be explained, with reference to
an EUV exposure apparatus shown in FIG. 2 of the drawings.
[0050] In FIG. 2, denoted at 1 is a wafer, and denoted at 2 is a
reflection type mask having an electronic circuit pattern formed
thereon. Denoted at 3 is a mask stage for holding a reflection type
mask thereon and for coarsely and finely moving the same in a scan
direction, and denoted at 5 is an optical system for directing
reflection light from the mask to a wafer 1 for projection exposure
thereof. Denoted at 6 is a wafer stage for holding a wafer thereon
and for coarsely and finely moving the same in six-axis directions.
The position of the wafer stage with respect to the X- and Y-axis
directions is continuously monitored by means of laser
interferometers (not shown). Normally, the scan motion of the mask
stage 3 and the wafer stage 6 is synchronously controlled to assure
that, when the reduction magnification of the projection optical
system is 1/.beta., the san speed of the mask stage is Vr, and the
scan speed of the wafer stage is Vw, a relation Vr/Vw=.beta. is
satisfied, between the scan speeds of these stages. Denoted at 8 is
a conveyance hand for loading and unloading a wafer between the
wafer stage 6 and a load-lock chamber to be described later.
[0051] The exposure process is carried out in an approximately
vacuum ambience (high vacuum ambience to substantially avoid
degradation of transmittance of EB light or EUV light), and, for
this reason, these units are accommodated in an apparatus chamber
4. Denoted at 7 is a vacuum pump for performing vacuum evacuation
of the chamber 4. Denoted at 15 is roughly illustrated load-lock
chamber of the present invention, and denoted at 9 is a vacuum pump
for performing vacuum evacuation of the load-lock chamber 15.
Denoted at 10 is a vent gas supply source for supplying dry N.sub.2
or dry air, for example, when the vacuum level inside the load-lock
chamber should be turned back to the atmospheric pressure. Denoted
at 11 is an apparatus-side gate valve for partitioning between the
apparatus chamber and the load-lock chamber, and denoted at 12 is
an exchanging-chamber side gate valve for partitioning between the
load-lock chamber and a substrate exchanging-chamber side gate
valve for partitioning between the load-lock chamber and a
substrate exchanging chamber, to be described later. Denoted at 14
is the substrate exchanging chamber for temporarily storing a wafer
under an atmospheric pressure. Denoted at 13 is a conveying hand
for loading and unloading a wafer between the load-lock chamber and
the substrate exchanging chamber. Although an illumination optical
system for illuminating a reflection type mask 2 with the use of
light from a light source is not illustrated, such an illumination
optical system is included in the EUV exposure apparatus of this
embodiment, as a matter of course.
[0052] Details of the load-lock chamber of the present invention
will now be described.
[0053] As regards the sequence of wafer conveyance, first, a wafer
in the wafer exchanging chamber 14 is loaded into the load-lock
chamber 15 under atmospheric pressure, by means of the conveyance
hand 13. The gate valve 12 is then closed and, after that, a valve
of the vacuum exhaust system 9 is opened, whereby exhausting is
started. After tens of seconds and a predetermined pressure is
reached, the gate valve 11 is opened and, by means of the conveying
hand 8, the wafer is conveyed from the load-lock chamber 15 to the
wafer stage 6. After alignment thereof is accomplished, the
exposure process is initiated.
[0054] During the process of vacuum exhausting of the load-locking,
inside gases are rapidly cooled due to adiabatic expansion. FIG. 3
illustrates this temperature of the gas and the wafer after the
gate valve 12 is closed and at the moment when the vacuum
evacuation is just going to be initiated, is T0. As the vacuum
exhausting starts, the temperature of the gas rapidly decreases
and, while it depends on the chamber capacity and the exhausting
speed, for example, after tens of seconds later, the temperature is
lowered by tens of degrees from T0. After that, due to heat
conduction from the chamber wall that has a large heat capacity,
the temperature rapidly becomes close to T0. On the other hand, as
regards the wafer having a large heat capacity as compared with the
gas, the temperature decreases with a longer time constant as
compared with the gas. It takes more than thirty minutes until,
after a temperature decrease by a few degrees, the temperature
returns close to T0.
[0055] As described hereinbefore, rapid cooling of the gas causes
the inconveniences that water vapor inevitably mixed into the gas
reach dew point and is condensed. Depending on the temperature,
vapor is frozen into ice, which is then adhered to and deposited on
a wafer as particles.
[0056] In accordance with this embodiment, to avoid the
inconveniences caused by a rapid temperature decrease of the gas,
heating means is provided at the load-lock chamber wall so as to
keep the load-lock chamber wall continuously at a predetermined
temperature or higher, such that the inside gas of the load-lock
chamber can be heated by the thermal energy from the load-lock
chamber wall. After the gas inside the load-lock chamber is raised
to a predetermined temperature or more, vacuum evacuation of the
load-lock chamber is initiated. This means that, by heating the
inside gas beforehand, the relative humidity is lowered, and also
that, by heating the chamber wall, the amount of heat supply from
the wall to the gas is increased to thereby prevent the water vapor
inside the load-lock chamber from reaching the dew point.
[0057] Referring to FIG. 1, the load-lock chamber of the present
invention will be explained in more detail. Denoted in the drawing
at 20 is a load-lock chamber. Gate valves, which are opened and
closed for wafer loading and unloading, are not illustrated.
Denoted at 1 is a wafer. Denoted at 28 is a flat heater for heating
the gas and the chamber wall up to a predetermined temperature. In
this embodiment, the flat heater is put on the whole inside wall
surface. The flat heater 28 has a function of raising the chamber
wall temperature at a predetermined temperature or higher and it
keeps the temperature. The chamber wall thus heated can serve to
heat a vent gas, each time it is supplied for the venting, up to a
predetermined temperature or more.
[0058] Denoted at 24 is an exhaust valve provided in a portion of
an exhaust pipe system, and denoted at 25 is a vacuum pump. Denoted
at 21 is a valve, which is used when dry nitrogen or dry air, for
example, is to be vented into the chamber. Denoted at 26a and 26b
are temperature sensors for measuring the inside gas temperature
and the chamber temperature, and denoted at 33a and 33b are
temperature gauges for these sensors. Denoted at 23a is a heater
control circuit having a function for heating the chamber wall up
to or more than a predetermined temperature and also for
maintaining that temperature. Denoted at 22 is a valve control
circuit by which the exhaust valve 24 is opened when the gas heated
by the chamber wall reaches a desired temperature or higher, to
initiate the vacuum evacuation.
[0059] As regards the predetermined temperature for which the
inside gas and the chamber should be heated, the gas and the wall
may be heated up to a temperature with which condensation of water
vapor contained in the inside gas during vacuum exhaust is
substantially prevented. With respect to the relationship between
the temperature and the water vapor condensation, the inventor of
the subject application conducted simulations. Referring now to
FIGS. 4-12, the results of these simulations will be explained.
[0060] Among these drawings, FIGS. 4, 5 and 6 concern a case
wherein both the gas temperature inside the load-lock chamber and
the temperature of the load-lock chamber wall, before a start of
vacuum evacuation, are set at an apparatus reference temperature of
23.degree. C. Hereinafter, this state will be referred to as a
"first state". On the other hand, FIGS. 7, 8 and 9 concern a case
wherein only the gas temperature inside the load-lock chamber is
set at a temperature of 23.degree. C.+10.degree. C. Hereinafter,
this state will be referred to as a "second state". Further, FIGS.
10, 11 and 12 concern a case wherein both the gas temperature
inside the load-lock chamber and the temperature of the load-lock
chamber wall are set at a temperature of 23.degree. C.+10.degree.
C. Hereinafter, this state will be referred to as a "third
state".
[0061] Although it is desirable that the exposure apparatus as a
whole is at the reference temperature, particularly, the optical
system (illumination optical system and the projection optical
system), should be maintained at the reference temperature or in a
range of .+-.1 degree with respect to the reference temperature,
more preferably, in a range of .+-.0.5 degree with respect to the
reference temperature. Of course, any other structural components
other than the optical systems should desirably be maintained at
the reference temperature or in an allowable tolerance range of the
reference temperature.
[0062] Specifically, simulations were made to the possibility of
water vapor condensation while taking the gas temperature and the
chamber temperature as parameters, with respect to a case wherein,
in relation to a load-lock chamber having a capacity of a few
liters and being arranged to process a 300 mm diameter wafer,
vacuum evacuation was conducted by means of an idealistic exhaust
system having an effective exhausting speed of 170 L/min, with the
air having a relative humidity of 10% (23.degree. C.). FIGS. 4, 7
and 10 illustrate the chamber inside pressure during the vacuum
evacuation, and FIGS. 5, 8 and 11 illustrate the gas temperature.
FIGS. 6, 9 and 12 show the results wherein the value Sr
(hereinafter, "saturation degree") that can be defined by a
saturated water vapor pressure P.sub.sat and the water vapor
pressure P.sub.vap in accordance with the following equation, is
plotted. S r = P vap [ P sat ##EQU1##
[0063] Normally, for a case wherein the saturation degree satisfies
Sr.gtoreq.1, if there are particles inside the gas, the water vapor
is condensed while using these particles as a nucleus
(heterogeneous nucleation).
[0064] As will be apparent from these drawings, comparing the first
and second states, it is seen that by raising the gas temperature
by 10.degree. C. before vacuum evacuation, as in the second state,
the saturation degree Sr decreases from 1.4 to 1.2 as contrasted to
the first state, wherein the temperature is not raised by
10.degree. C. However, the saturation degree is still more than
one, and this means that condensation of water vapor is inevitable.
In this case, the saturation degree Sr can be reduced to less than
one if the effective exhausting speed is lowered. However, the
throughput will be lowered, on the other hand. Here, by raising the
load-lock chamber temperature as well by 10.degree. C. (third
state), the saturation degree can be lowered to 0.8. Thus, the
possibility of water vapor condensation is removed. This is because
the wall of the load-lock chamber that has a large heat capacity as
compared with the gas functions like a heat bath to the gas, and
the amount of heat supply from the load-lock chamber wall to the
gas during the vacuum exhausting is significantly large in the
third state, as compared with the second state.
[0065] Thus, it is seen that, for the problem of water vapor
condensation, raising the temperature of the load-lock chamber wall
as well up to or beyond a predetermined temperature is more
effective. While the above-described example shows that Sr can be
reduced from 1.2 to 0.8 in accordance with the present invention,
the effectiveness of the present invention will become more notable
under more severe conditions, such as, for example, with a larger
exhausting speed and a higher gas temperature and a higher chamber
temperature.
[0066] Whether or not the water vapor is condensed in the chamber
depends on chamber capacity, exhausting speed, relative humidity,
gas temperature, chamber temperature, and so on. Therefore, it
cannot be said that water vapor condensation can necessarily be
avoided as long as the gas temperature and the chamber temperature
at the initial stage of vacuum evacuation are raised up to or
beyond a predetermined temperature. Practically, however, while
specifying these parameters beforehand, simulations or experiments
may be done. Through this procedure, the gas temperature and the
chamber temperature can be set.
[0067] Thus, in the present invention, it is important to heat the
load-lock chamber itself and, also, to keep the temperature
thereof. This necessitates the use of measures for heat conduction
from the load-lock chamber to the apparatus chamber (e.g., a
chamber that covers the exposure apparatus as a whole, or an
exposure chamber that accommodates therein an illumination optical
system and a projection optical system). More specifically, since
the load-lock chamber can be heated continuously up to a
temperature higher than the apparatus reference temperature by
about 10.degree. C. or even by 20 to 30.degree. C., in some cases,
it is necessary to provide a structure for preventing thermal
conduction of the heat to the apparatus side as much as possible or
for avoiding external contact to any thermal factors even if the
heat is conducted.
[0068] As a specific example, a heat insulating material may be
inserted between the load-lock chamber and the apparatus chamber.
Alternatively, a heat insulating structure may be provided. FIGS.
18 and 19 are fragmentary sectional views, respectively, wherein an
apparatus chamber and a load-lock chamber are connected to each
other through a gate valve. In FIG. 18, denoted at 4 is a portion
of an apparatus chamber section, and denoted at 20 is a portion of
a load-lock chamber section. Denoted at 28 is a flat heater as
described hereinbefore. Denoted at 41, 42 and 43 are components
that constitute a gate valve, wherein denoted at 41 is a partition
plate, denoted at 42 is an O-ring, and denoted at 43 is a holding
member for holding these elements. Driving means for actuating the
partition wall is not illustrated. Denoted at 40a and 40b are heat
insulating materials, which are important in the present invention.
The heat insulating material 40a is provided between the apparatus
and the gate valve, while the heat insulating material 40b is
provided between the gate valve and the load-lock chamber. With the
provision of dual heat insulating materials between the apparatus
chamber and the load-lock chamber as described above, the flow of
heat from the load-lock chamber wall 20 to the apparatus chamber
wall 4 can be reduced considerably.
[0069] As an alternative, as shown in FIG. 19, a hollow member 44
may be disposed between the apparatus chamber 4 and the gate valve
(41, 42, 43), while the inside of the hollow member is held at a
vacuum, to provide a heat insulating structure. Denoted at 45 are
vent holes extending through the hollow member 44 and the apparatus
chamber wall 4, through which a vacuum is applied by means of a
vacuum pump at the apparatus side. With the provision of a partial
vacuum structure between the apparatus chamber and the load-lock
chamber as described above, the flow of heat from the load-lock
chamber wall 20 to the apparatus chamber wall 4 can be reduced
considerably.
[0070] Preferably, in this embodiment, in addition to the insertion
of a heat insulating material between the load-lock chamber and the
apparatus chamber or to the provision of a heat insulating
structure therebetween as described above, a temperature adjusting
pipe 50 (FIG. 20) may be provided around the apparatus chamber to
collect any heat of a small amount leaked to the apparatus chamber
side. This is more effective to external disturbance caused by
thermal factors to the exposure apparatus system. Here, while a
temperature adjusting pipe is used as the temperature adjusting
means for the apparatus chamber, in this example, the invention is
not limited to this. Any other means may be used provided that it
assures efficient temperature adjustment.
[0071] Furthermore, because there is a possibility of expansion and
contraction of the load-lock chamber due to temperature variation,
a bellows may preferably be used to connect the load-lock chamber
with any other component, such as an exposure chamber, for example.
This is preferably because it allows a shift of a relative
positional relationship between the load-lock chamber and any other
chamber, such as an exposure chamber (a chamber that accommodates
therein an illumination optical system for illuminating a reticle
having a pattern, with light from a light source, and/or a
projection optical system for projecting the pattern onto a
workpiece to be exposed, such as a wafer).
[0072] Referring now to FIG. 17, the sequential operation of this
embodiment will be described. By using the heater control circuit,
the load-lock wall has been maintained at a predetermined
temperature or more than it, as determined in the manner described
hereinbefore. In this state, if the exposure of an N-th wafer is
completed (step 100), the N-th wafer is loaded into the load-lock
chamber (step 101). In order to bring the chamber inside pressure
back to the atmospheric pressure, the apparatus side gate valve is
closed, and then, a vent gas, such as dry N.sub.2 or dry gas, for
example, is introduced (step 102). Normally, the vent gas is at the
same temperature as that of the gas supply system for the clean
room, and the gas is introduced while being heated by the chamber
wall, until the atmospheric pressure is reached (step 103). After
the atmospheric pressure is resumed, the wafer exchanging chamber
side gate valve is opened, and the N-th wafer is unloaded (step
104). Subsequently, an (N+1)th wafer is introduced (step 105), and
the wafer exchanging chamber side gate valve is closed. During this
wafer exchanging, water vapor may be mixed into the load-lock
chamber. After introduction of the vent gas, the gas continuously
receives heat supply from the chamber wall. Therefore, the inside
gas temperature Tg gradually becomes close to the chamber wall
temperature. If the gas temperature does not reach a predetermined
temperature T1 (step 106), the system stands by in the state (step
107). After the predetermined temperature TI is reached or
exceeded, the valve control circuit opens the exhaust valve,
whereby vacuum exhaust is initiated (step 108). After a
predetermined pressure is reached (step 109), the (N+1)th wafer is
unloaded out of the load-lock chamber (step 110), and the exposure
process starts (step 111). Thereafter, the above-described
procedure is repeated. This is an example of the operation
according to the present invention.
[0073] In this embodiment, the heating means for heating the gas
and the chamber has been described with reference to an example of
a flat heater being put on the whole inside wall surface of the
chamber as shown in FIG. 1. However, in the present invention, any
other heating means may be used, provided that it can heat the gas
and the chamber simultaneously and efficiently.
[0074] An example is shown in FIG. 13, wherein denoted at 29 are
heat radiating fins attached to a flat heater mounted on the bottom
of the chamber. This structure enables efficient heating of the
inside gas. When this structure is embodied, the fin thickness and
the fin height should desirably be optimized to assure efficient
transfer of heat of the heater. Furthermore, when heating means,
such as a flat heater, is provided inside the chamber, depending on
the material used, it may cause a problem of degassing as a vacuum
is applied. On that occasion, as shown in FIG. 14, heating means
28a, such as a flat heater, may be mounted at the outside of the
chamber wall, while fins may be provided inside the chamber. As a
further alternative, while not shown in the drawing, a temperature
adjusting pipe may be provided inside the chamber or outside the
chamber, and a liquid medium being temperature controlled at a
predetermined temperature may be circulated through the pipe,
thereby to heat the gas and the chamber.
[0075] In this embodiment, the chamber temperature is raised
beforehand up to a predetermined temperature or more, such that the
vent gas supplied into the chamber receives heat supply from the
chamber, and after the gas reaches a predetermined temperature, the
vacuum evacuation is initiated. To this end, a temperature sensor
is provided inside the chamber to measure the gas temperature.
However, since, in this embodiment, the chamber is continuously
maintained at or beyond the predetermined temperature, the time
required for the gas temperature to reach a predetermined
temperature would have relatively good reproducibility. On that
occasion, by separately counting the time from the supply of the
vent gas into the chamber and by conducting the heating for more
than a predetermined time period, the predetermined temperature
could be reached assuredly. Therefore, the necessity of measuring
the gas temperature in real time may be avoided. Thus, on that
occasion, the temperature sensor 26a and temperature gauge 33a may
be omitted, as shown in FIG. 15. This makes the load-locking
structure much simpler.
[0076] As described hereinbefore, the inside gas is heated
beforehand prior to the vacuum exhaust, to lower the relative
humidity. Additionally, by heating the chamber wall continuously up
to a certain temperature, the amount of heat supply from the wall
to the gas is enlarged. As a result, even if the gas temperature
decreases during the vacuum exhaust, it is assured to prevent the
water vapor contained in the gas from reaching the dew point, and
creation of particles due to water vapor condensation can be
avoided effectively. Here, the load-lock chamber wall should
preferably be maintained at a temperature higher than the reference
temperature (22 to 23.degree. C.) of the exposure apparatus by 5 to
30.degree. C., more preferably, by 10 to 20.degree. C. Of course,
the gas inside the load-lock chamber, as well, should desirably be
kept similarly at a high temperature.
[0077] The heating mechanism for applying heat to the load-lock
chamber may be provided on the outside wall of the load-lock
chamber while taking into account the influence to a wafer, or the
like, inside the load-lock chamber (i.e., to avoid dust creation
from the heating mechanism or to avoid overheating of the wafer due
to radiation or heat conclusion). Alternatively, it may preferably
be provided in a portion being out of contact with the space
surrounded by the load-lock chamber, that is, the space in which a
wafer is accommodated.
[0078] Furthermore, for improvement of the throughput, the timing
for loading a wafer into the load-lock chamber and the timing for
heating the load-lock chamber may desirably be at least partially
overlapped with each other. Specifically, it is preferable that, at
the timing at which the loading of a wafer into the load-lock
chamber starts, heating of the load-lock chamber has already been
initiated. More preferably, during the wafer loading, the load-lock
chamber is heated continuously.
Embodiment 2
[0079] A second embodiment of the present invention pays a specific
note to the throughput. As an important feature, in relation to the
supply of a vent gas into the chamber, a gas heating mechanism is
provided separately from the load-lock chamber wall heating means,
thereby to assure that a gas having a temperature raised beforehand
up to a predetermined temperature is supplied into the chamber.
This enables initiation of vacuum evacuation just after the wafer
exchange.
[0080] Referring to FIG. 16, this embodiment will be described in
detail. This embodiment differs from the first embodiment in that
there is a heat exchanger 35 at an upstream position of a vent
valve 21. The heat exchanger comprises a heater and a large number
of fins connected thereto. Disposed downstream of this heat
exchanger is a sensor 26c for measuring the gas temperature, the
sensor being provided in a pipe. In association with a temperature
gauge 3 (33c), the temperature of the heated gas can be measured.
Denoted at 23b is a control circuit for adjusting the output of the
heater of the heat exchanger 35, and it controls the heater so that
the gas temperature at the time of gas venting is raised to and
kept continuously at a predetermined temperature or higher than it.
With the structure described above, it is assured that the
temperature of gas supplied into the chamber for the venting has
already been raised to a level equivalent to the chamber wall
temperature. In this case, as has been described with reference to
the operation of the first embodiment shown in FIG. 17, the
operations at steps 106 and 107 can be omitted and, when the wafer
is exchanged (steps 104 and 105), vacuum evacuation can be started
immediately.
[0081] In this embodiment, the heat exchanger comprises a heater
and a large number of fins. However, the invention is not limited
to this, and any other structures may be used.
[0082] As described hereinbefore, a gas having been
temperature-raised up to a predetermined temperature or beyond it
is supplied into the chamber for gas venting, such that vacuum
evacuation can be started just after the wafer exchange. Therefore,
creation of particles due to water vapor condensation can be
avoided while maintaining high throughput.
[0083] The first and second embodiments described above may
combined appropriately, as long as no contradistinction is caused
thereby.
Embodiment 3
[0084] Next, referring to FIGS. 21 and 22, an embodiment of a
device manufacturing method, which uses an exposure apparatus
described above, will be explained.
[0085] FIG. 21 is a flow chart for explaining the procedure of
manufacturing various microdevices, such as semiconductor chips
(e.g., ICs or LSIs), liquid crystal panels, or CCDs, for example.
Step 1 is a design process for designing a circuit of a
semiconductor device. Step 2 is a process for making a mask on the
basis of the circuit pattern design. Step 3 is a process for
preparing a wafer by using a material such as silicon. Step 4 is a
wafer process, which is called a pre-process, wherein, by using the
thus prepared mask and wafer, a circuit is formed on the wafer in
practice, in accordance with lithography. Step 5, subsequent to
this, is an assembling step, which is called a post-process,
wherein the wafer having been processed at step 5 is formed into
semiconductor chips. This step includes an assembling (dicing and
bonding) process and a packaging (chip sealing) process. Step 6 is
an inspection step, wherein an operation check, a durability check,
and so on, for the semiconductor devices produced by step 5, are
carried out. With these processes, semiconductor devices are
produced, and they are shipped (step 7).
[0086] FIG. 22 is a flow chart for explaining details of the wafer
process. Step 11 is an oxidation process for oxidizing the surface
of a wafer. Step 12 is a CVD process for forming an insulating film
on the wafer surface. Step 13 is an electrode forming process for
forming electrodes upon the wafer by vapor deposition. Step 14 is
an ion implanting process for implanting ions onto the wafer. Step
15 is a resist process for applying a resist (photosensitive
material) to the wafer. Step 16 is an exposure process for
printing, by exposure, the circuit pattern of the mask on the wafer
through the exposure apparatus described above. Step 17 is a
developing process for developing the exposed wafer. Step 18 is an
etching process for removing portions other than the developed
resist image. Step 19 is a resist separation process for separating
the resist material remaining on the wafer after being subjected to
the etching process. By repeating these processes, circuit patterns
are superposedly formed on the wafer.
[0087] With these processes, high density and high quality
microdevices can be manufactured. As described above, a device
manufacturing method that uses an exposure apparatus as well as a
device as a product thereof are included in the scope of the
present invention.
[0088] In accordance with the embodiments of the present invention
as described hereinbefore, the inside gas is heated beforehand,
prior to vacuum evacuation, by which the relative humidity is
lowered. Additionally, the chamber wall is heated continuously to a
predetermined temperature, thereby to enlarge the amount of heat
supplied from the wall to the gas during the vacuum evacuation.
This assures that, even if the gas temperature is lowered, the
water vapor contained in the gas is prevented from reaching the dew
point, such that creation of particles due to the water vapor
condensation can be prevented effectively. Furthermore, by heating
the chamber wall continuously to a predetermined temperature, it is
assured that the inside gas is heated beforehand prior to the
vacuum exhaust. Thus, even if the gas temperature is lowered during
the vacuum evacuation, the water vapor contained in the gas is
prevented from reaching the dew point. Therefore, creation of
particles due to the water vapor condensation can be prevented
effectively. Moreover, on the basis of experiments or simulations,
the initial gas temperature can be set at a temperature with which
condensation of water vapor does not occur. This assuredly prevents
water vapor condensation during the vacuum exhaust. The load-lock
chamber is provided with heating means to maintain the chamber
temperature constant. This enables an enlarged amount of heat
supply from the load-lock chamber to the inside gas during vacuum
evacuation.
[0089] The gas temperature may be measured and, when a
predetermined temperature or higher is measured, the vacuum
exhausting may be initiated. This avoids a time lag, and it is
advantageous with respect to the throughput. When the heating time
for the gas inside the load-lock chamber is counted, the gas
temperature measuring means may be omitted. This makes the
structure much simpler. Heat insulating means may be provided
between the apparatus chamber and the load-lock, to insulate heat
conduction therebetween. This effectively reduces the amount of
heat supply to the apparatus chamber, from the load-lock chamber
being heated. As a result, thermal external disturbance to the
apparatus can be reduced to be close to zero.
[0090] During the gas venting, a gas having been temperature-raised
up to a predetermined temperature or more may be supplied into the
chamber. This enables a start of vacuum evacuation just after the
wafer exchange. Thus, creation of particles due to water vapor
condensation can be avoided, while maintaining high throughput.
Moreover, on the basis of experiments or simulations, the initial
gas temperature and the chamber wall temperature before vacuum
evacuation can be set at a temperature with which condensation of
water vapor does not occur. This assuredly prevents water vapor
condensation during the vacuum exhaust. The load-lock chamber may
be provided with heating means to maintain the chamber temperature
constant. This enables an enlarged amount of heat supply from the
load-lock chamber to the inside gas. Furthermore, since, during the
gas venting, a gas having been temperature-raised up to a
predetermined temperature or higher can be supplied into the
chamber, the gas heating time can be shortened and, thus, high
throughput is enabled. When heat insulating means is provided
between the apparatus chamber and the load-lock chamber to isolate
the heat transfer therebetween, the amount of heat supplied to the
apparatus chamber from the load-lock chamber generating heat can be
reduced. As a result, thermal external disturbance to the apparatus
can be reduced to be close to zero.
[0091] While the invention has been described with reference to the
structures disclosed herein, it is not confined to the details set
forth and this application is intended to cover such modifications
or changes as may come within the purposes of the improvements or
the scope of the following claims.
[0092] This application claims priority from Japanese Patent
Application No. 2003-434539, filed Dec. 26, 2003, which is hereby
incorporated by reference.
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