U.S. patent application number 11/429199 was filed with the patent office on 2006-09-07 for data processing apparatus for semiconductor processing apparatus.
Invention is credited to Shoji Ikuhara, Akira Kagoshima, Toshio Masuda, Junichi Tanaka, Hideyuki Yamamoto.
Application Number | 20060199288 11/429199 |
Document ID | / |
Family ID | 27787583 |
Filed Date | 2006-09-07 |
United States Patent
Application |
20060199288 |
Kind Code |
A1 |
Tanaka; Junichi ; et
al. |
September 7, 2006 |
Data processing apparatus for semiconductor processing
apparatus
Abstract
A semiconductor processing method in which a sample wafer is
disposed inside of a chamber for processing and process data is
detected by using a generated plasma generated which includes data
concerning emission light generated. Information data corresponding
to the processing data is selectively sent to one of first and
second data storing devices in accordance with a predetermined
condition. The selective sending of the information data includes
selectively sending the information data to one of the first and
second data storing devices until an amount of the information data
which has been sent to and stored in the one of the storing devices
reaches a predetermined amount of processing of the sample wafer as
the predetermined condition, and thereafter selectively sending the
information data corresponding to a succeeding process to the other
of the first and second data storing devices.
Inventors: |
Tanaka; Junichi; (Tsuchiura,
JP) ; Masuda; Toshio; (Toride, JP) ;
Kagoshima; Akira; (Kudamatsu, JP) ; Ikuhara;
Shoji; (Hikari, JP) ; Yamamoto; Hideyuki;
(Kudamatsu, JP) |
Correspondence
Address: |
ANTONELLI, TERRY, STOUT & KRAUS, LLP
1300 NORTH SEVENTEENTH STREET
SUITE 1800
ARLINGTON
VA
22209-3873
US
|
Family ID: |
27787583 |
Appl. No.: |
11/429199 |
Filed: |
May 8, 2006 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
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10807181 |
Mar 24, 2004 |
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11429199 |
May 8, 2006 |
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10087982 |
Mar 5, 2002 |
6776872 |
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10807181 |
Mar 24, 2004 |
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Current U.S.
Class: |
438/16 |
Current CPC
Class: |
H01L 22/34 20130101;
H01L 21/67276 20130101; H01L 22/20 20130101 |
Class at
Publication: |
438/016 |
International
Class: |
H01L 21/66 20060101
H01L021/66 |
Claims
1. A semiconductor processing method, comprising the steps of:
disposing a sample wafer as a processing object inside of a
chamber; detecting process data during processing of the sample
wafer which is performed by using a plasma generated inside of the
chamber, the process data including data concerning emission light
generated within the chamber during the processing; and selectively
sending information data corresponding to the processing data to
one of first and second data storing devices in accordance with a
predetermined condition; wherein the step of selectively sending
information data includes a substep of selectively sending the
information data to one of the first and second data storing
devices until an amount of the information data which has been sent
to and stored in the one of the storing devices reaches a
predetermined amount of processing of the sample wafer as the
predetermined condition, and selectively sending the information
data corresponding to a succeeding process to the other of the
first and second data storing devices after the amount of the
information data reaches the predetermined amount of
processing.
2. A semiconductor processing method according to claim 1, wherein
in the substep, the information data is sent to the one of the
first and second data storing devices until the information data of
one of (a) a predetermined data and a time period, (b) a
predetermined time period, and (c) a predetermined at least one lot
of the sample wafer, has been sent to and stored in the one of the
first and second data storing devices.
3. A semiconductor processing method according to claim 1, wherein
the second data storing device is configured so as to be able to
read the information data which is stored therein and which is to
be analyzed while the first data storing device stores the
information data corresponding to the process data which is
generated during processing of at least the sample wafer which is
to be analyzed.
4. A semiconductor processing method according to claim 2, wherein
the second data storing device is configured so as to be able to
read the information data which is stored therein and which is to
be analyzed while the first data storing device stores the
information data corresponding to the process data which is
generated during processing of at least the sample wafer which is
to be analyzed.
5. A semiconductor processing method according to claim 4, further
comprising the step of sending the information data to one of the
first storing device and second data storing device through a first
path and reading the information data thus stored through a second
path.
6. A semiconductor processing method according to claim 5, further
comprising the steps of: reading the information data stored in one
of the first data storing device and the second data storing device
and analyzing information data thus read; and adjusting the
processing of the sample wafer in accordance with a result of the
analyzing.
7. A semiconductor processing method according to claim 4, further
comprising the steps of: reading the information data stored in one
of the first data storing device and the second data storing device
and analyzing information data thus read; and adjusting the
processing of the sample wafer in accordance with a result of the
analyzing.
8. A semiconductor processing method according to claim 3, further
comprising the step of: sending the information data to one of the
first storing device and second data storing device through a first
path and reading the information data thus stored through a second
path.
9. A semiconductor processing method according to claim 3, further
comprising the steps of: reading the information data stored in one
of the first data storing device and the second data storing device
and analyzing information data thus read; and adjusting the
processing of the sample wafer in accordance with a result of the
analyzing.
Description
CROSS REFERENCE TO RELATED APPLICATION
[0001] This is a continuation of U.S. application Ser. No.
10/807,181, filed Mar. 24, 2004, which is a divisional of U.S.
application Ser. No. 10/087,982, filed Mar. 5, 2002, now U.S. Pat.
No. 6,776,872, the subject matter of which is incorporated by
reference herein.
BACKGROUND OF THE INVENTION
[0002] The present invention relates to a data processing apparatus
for a semiconductor manufacturing apparatus, and in particular, to
a data processing apparatus for a semiconductor manufacturing
apparatus suitable for a semiconductor manufacturing apparatus to
conduct micromachining.
[0003] FIG. 12 shows a configuration of a data processing apparatus
for a semiconductor manufacturing apparatus in the prior art. The
configuration of FIG. 12 includes an etching system 1 of the
semiconductor manufacturing apparatus, etching chambers 11 and 12
as processing chambers of the etching system 1, and sensors 13 and
14 respectively of the etching chambers 11 and 12. Each of the
sensors 13 and 14 measures various physical quantities, for
example, a degree of vacuum in a vacuum chamber, plasma density,
and an output from a plasma emission spectrometer to produce sensor
data. The configuration further includes a controller 15 of the
etching system 1 to obtain wafer processing information items such
as a type of a wafer being processed and a processing condition for
the wafer. Reference numeral 2 indicates a data collector.
Reference numeral 21 indicates a data processor of the data
collector 2. The data processor 21 collects the sensor data and the
wafer processing information to store them in a database 22.
Reference numeral 3 indicates a data analyzer which accesses the
database (DB) 22 via the data processor 21 to acquire necessary
data and analyzes the data. The operator of the semiconductor
manufacturing apparatus can operate the semiconductor manufacturing
apparatus according to results of the analysis.
[0004] FIG. 13 shows a sequence of processing executed by the data
processor 21. As can be seen from FIG. 13, when the etching system
1 includes a plurality of etching chambers 11 and 12, the data
processor 21 obtains, for example, alternately sensor data from the
sensors 13 and 14 of the respective chambers 11 and 12 to store the
data in the database 22.
SUMMARY OF THE INVENTION
[0005] Since the sensor data includes, for example, information
with respect to time of a plasma emission spectrum (several
thousand of data items per second) from the plasma emission
spectrometer described above, a large amount of information items
must be processed. Therefore, the data analyzer 3 takes a long
period of time to obtain sensor data from the data collector 2 and
imposes at the same time a load onto the data collector 2. This
hinders the data collecting operation of the data collector 2.
Particularly, when the etching system includes a plurality of
etching chambers as shown in FIG. 12, the data collector must
alternately handle the data items from the sensors in a duplicated
manner as shown in FIG. 13. Therefore, it is difficult to guarantee
a free period of time to be allocated for the data analyzer 3 to
execute data processing, for example, a data extraction request.
That is, in the data processing apparatus of the prior art, it is
difficult to guarantee a wait period of time to execute processing
such as analysis, and hence usability of the apparatus is
deteriorated.
[0006] It is therefore an object of the present invention, which
has been devised to remove the problem, to provide a data
processing apparatus for a semiconductor manufacturing apparatus
with high usability in which the wait time required for the
processing is reduced.
[0007] To solve the problem, there is provided according to the
present invention a data processing apparatus for a semiconductor
manufacturing apparatus comprising a semiconductor manufacturing
apparatus for executing processing for a wafer, a data collecting
semiconductor device for collecting processing data generated in
association with the processing, and a data copying semiconductor
device for extracting the processing data collected in said data
collecting semiconductor device and for producing a copy of the
processing data. Moreover, the data processing apparatus may
comprise data analyzing means for analyzing the data copy produced
by said data copying semiconductor device and for diagnosing a
processing state of said processing apparatus.
[0008] Other objects, features and advantages of the invention will
become apparent from the following description of the embodiments
of the invention taken in conjunction with the accompanying
drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0009] FIG. 1 is a diagram showing a configuration of a data
processing apparatus for a semiconductor manufacturing apparatus in
an embodiment of the present invention;
[0010] FIG. 2 is a diagram for explaining data items stored in a
database;
[0011] FIG. 3 is a flowchart for explaining processing of a data
processing apparatus for a semiconductor manufacturing
apparatus;
[0012] FIG. 4 is a flowchart for explaining another processing of a
data processing apparatus for a semiconductor processing
apparatus;
[0013] FIG. 5 is a diagram showing an example of an operation
display screen presented on a display of a data copying
semiconductor device;
[0014] FIG. 6 is a diagram showing another embodiment of the
present invention;
[0015] FIG. 7 is a diagram showing further another embodiment of
the present invention;
[0016] FIG. 8 is a diagram showing an example of an operation
display screen presented on a display of a data copier;
[0017] FIG. 9 is a diagram showing still another embodiment of the
present invention;
[0018] FIG. 10 is a diagram showing another embodiment of the
present invention;
[0019] FIG. 11 is a diagram showing still another embodiment of the
present invention;
[0020] FIG. 12 is a diagram showing a configuration of a data
processing apparatus for a semiconductor manufacturing apparatus of
the prior art; and
[0021] FIG. 13 is a diagram for explaining division of data
processing.
DESCRIPTION OF THE EMBODIMENTS
[0022] Referring now to the accompanying drawings, description will
be given of an embodiment of the present invention. FIG. 1 shows a
configuration of a data processing apparatus for a semiconductor
manufacturing apparatus in an embodiment of the present invention.
The data processing apparatus shown in FIG. 1 includes a data
copying semiconductor device 4a, a database copying semiconductor
device 41, a database copy 42 produced by copying a database 22. In
FIG. 1, the same constituent components as those of FIG. 12 are
assigned with the same reference numeral and description thereof
will be avoided.
[0023] As described above, the data processor 21 of the data
collector 2 collects sensor data from the sensors 13 and 14 and
wafer processing information from the controller 15 for each wafer
to store the respective data in the database 22. The sensor data
thus obtained for each wafer is stored as a sensor data file in the
database 22. It is desirable that the sensor data for each wafer is
related to the wafer processing data for the wafer using, for
example, a list of correspondence therebetween.
[0024] The database copying semiconductor device 41 obtains the
sensor data for each wafer, the wafer processing information for
each wafer, and the list of correspondence therebetween to store
these items in the database copy 42. The database copying
semiconductor device 41 produces the copy during a free period of
time of the data collector 2. When such a free period of time is
insufficient, it is desirable that the processor 21 transfers the
obtained sensor data to the copying device 4a at the end of each
sensor data sampling period of time before the processor 21
register the sensor data to the database 22. This reduces the data
transfer time when compared with a case in which the data stored in
the database 22 is read therefrom and is transferred to the copying
semiconductor device 4a. When the quantity of sensor data varies
between the sensors, for example, because only one of the etching
chambers is used, the data can be transferred to the copying
semiconductor device 41 in a period of time in which the data
collector 2 is operating with a lower load.
[0025] Since the copy of the wafer processing data including the
sensor data for each wafer, the processing information for each
wafer, and the correspondence list is stored in the database copy
42, the data analysis can be conducted without imposing any load
onto the data collector 2. That is, the data analyzer 3 can access
the database copy 42 without paying attention to the load imposed
on the data collector 2.
[0026] FIG. 2 shows a configuration of data stored in the database
22. As can be seen from FIG. 2, the database 22 includes a sensor
data file 221 in which the sensor data is filed for each wafer and
a data management table 222 in which the wafer processing
information and a correspondence list between the wafer processing
information and the sensor data file are stored. The database copy
42 of the copy server 4a includes a sensor data file copy 421 and
data management table copy 422 which are copies of part or all of
the sensor data file 221 and the data management table 222,
respectively. Since the sensor data has a large amount of data as
described above, it is favorable to transfer the data to the copy
server 4a in a free period of time of the data collector 2 or each
time the data is received from each sensor. Since the size of each
record in the data management table 222 is small, it is favorable
to transfer the data at a time when the wafer processing is
terminated or when the processing of a lot is terminated.
[0027] FIG. 3 is a flowchart to explain processing of the data
processing apparatus for a semiconductor manufacturing apparatus
according to the present embodiment. The flowchart includes part
(a) "processing of the etching system 1", part (b) "processing of
the data collector 2", and part (c) "processing of the data copying
semiconductor device 4a".
[0028] First, in flowchart part (a) of the etching system 1, the
system 1 starts wafer processing in step 11. In step 12, the
controller 15 outputs wafer processing information such as a wafer
processing recipe, a type of semiconductor chip on the wafer, a
wafer number, and a processing lot number to the data collector 2.
In step 13, the data collector 2 can acquire sensor data at a
predetermined interval of time during the wafer processing. In step
14, a check is made to determine whether or not the wafer
processing has been terminated. If the processing has been
terminated, control goes to step 15 to wait for the wafer
processing of a subsequent wafer.
[0029] In flowchart part (b) of the data collector 2, whether or
not the wafer processing information has been received from the
etching system 1 is determined. If the information has been
received, control goes to step 22. Otherwise, control goes to step
27. The collector 2 receives the sensor data in step 22 and then
stores the data in the sensor data file 221 of the database 22. In
step 24, the collector 2 determines whether or not the processing
has been finished for the wafer. If the processing has been
finished, the collector 2 updates the data management table 222 of
the database 22 in step 25, and sends update information of the
table 222 to the data copying semiconductor device 4a in step 26.
In step 27, the collector 2 determines presence or absence of
sensor data to be processed. If any sensor data remains for copy,
the collector 2 sends the data to the copy server 4a.
[0030] In flowchart part (c) of the data copying semiconductor
device 4a, the semiconductor device 4a waits for reception of data
in step 31. When data of the data management table 222 is received,
control goes to step 32, and then updates the data management table
copy 422 in step 33. When sensor data is received, control goes to
step 34, and then generates a sensor data file copy to store the
file copy in the database copy 42.
[0031] FIG. 4 shows a flowchart of another processing in the data
processing apparatus for a semiconductor manufacturing apparatus in
which the data processor 21 generates data for the database 22 and
simultaneously transfers the data to the copying semiconductor
device 4a. The flowchart includes part (a) "processing of the
etching system 1", part (b) "processing of the data collector 2",
and part (c) "processing of the data copying semiconductor device
4a". In FIG. 4, the same constituent components as those of FIG. 3
are assigned with the same reference numeral and description
thereof will be avoided.
[0032] In the case shown in FIG. 4, the data collector 2 stores the
sensor data in the sensor data file 221 of the database 22 in step
23 and then transfers the sensor data to the copy server 4a in step
23a. In this operation, the data can be transferred in a shorter
period of time when compared with the case in which the data once
stored in the database 22 is read therefrom and is then transferred
to the copying semiconductor device 4a.
[0033] FIG. 5 shows an example of an operation display screen
presented on a display of the data copying semiconductor device 4a.
In an actual system, the data analyzer 3 analyzes a part of the
data stored in the database 22. For example, the analyzer 3 may
analyze only a semiconductor device having quite fine structure in
some cases. In such a case, the user can specify the type of wafers
to be analyzed. For example only a type of device or a type of
recipe is copied so that a small amount of data is copied onto the
database copy 42 in the copying device 4a, for example, only a
semiconductor device type or a recipe type as the copy condition so
that the data is copied onto the database copy 42 of the copying
semiconductor device 4a.
[0034] To specify the condition, the user inputs in a copy
semiconductor device list display area 31 shown in FIG. 5 a list of
semiconductor devices to be copied or the user inputs in a removal
semiconductor device display area 32 a list of semiconductor
devices to be excluded. Or, the user may specify or reserve a
period of time to create a copy for the data collector 2. This is
advantageously effective, for example, when a large-capacity
recording semiconductor device cannot be used for the database copy
42 of the copy server 4a or when data is obtained for a long period
of time for the analysis.
[0035] Incidentally, when the copy condition is inputted, an
authentication technique may be employed. For example, a password
is inputted to protect the copy of the data. As a result, only
particular information protected by the password can be stored in
the database copy to thereby prevent leakage of the information.
Using the function, a semiconductor device maker of the system can
limit a range of data to be presented to a vender of the apparatus.
Alternatively, the apparatus vendor maker can limit a range of data
to be presented to the semiconductor device maker.
[0036] FIG. 6 shows a configuration of another embodiment of the
present invention. The configuration includes a data analyzer 3
disposed in a copying semiconductor device 4b. By including the
data analyzer 3, the copying semiconductor device 4b functions as a
data analysis server. When the copying semiconductor device or the
data analysis server is configured as a web application server,
external input/output semiconductor devices 51 and 52 to be
connected to the server can be easily implemented using a general
web browser.
[0037] FIG. 7 shows a configuration of still another embodiment of
the present invention. The configuration includes a data analyzer 3
and an input/output semiconductor device 5 which are disposed in
the copying semiconductor device 4c. The semiconductor device 4c is
attached onto the data collector 2 such that the semiconductor
device 4c can be removed from the collector 2 to be independently
transported.
[0038] By constructing the copying semiconductor device 4c as a
portable server or a portable analysis server, the semiconductor
device 4c can be attached onto the data collector 2 so that data is
analyzed according to necessity. That is, when the semiconductor
device 4c is attached onto the data collector 2, the semiconductor
device 4c can update the database copy 42 thereof for the analysis
of data. Therefore, also when a client does not desire to install
the data analyzer operating in a continuous fashion, it is possible
to acquire data from the data collector 2. This function is
especially convenient when an engineer of the apparatus vendor
visits the site for repair, maintenance, or process tuning. He is
able to plug his own copying device 4c into the data collector 2 so
that the database copy 42 is synchronized with the original
database 22.
[0039] FIG. 8 shows an example of the operation display screen of
the copying semiconductor device 4c.
[0040] As described above, when the copying semiconductor device 4c
is constructed as a portable server or a portable analysis server
and is not continuously connected to the data collector 2, a large
amount of data items not copied in the copying semiconductor device
4c remain in the data collector 2 depending on cases. In this
situation, when the data collector 2 is connected to the copying
semiconductor device 4c to start copying the data, the copying
operation takes a long period of time and hence the analysis cannot
be started. However, by specifying a condition of data items to be
copied from the data collector 2 onto the data copying
semiconductor device 4c before the copying is started, only the
data necessary for the analysis can be copied. The condition of
data items to be copied can be specified by, for example, a
semiconductor device name formed on the wafer, a recipe name used
for the wafer processing, or information of day and time of the
processing as shown in FIG. 8.
[0041] FIG. 9 shows still another embodiment of the present
invention. The configuration of FIG. 9 includes a realtime
diagnosing semiconductor device 23 to diagnoses, for example, an
end point of processing of the etching system 1 in a realtime
fashion. The device is embedded in the data collector 2 and high
speed data exchange between th data processor 21 and the diagnosing
device 23 is established. The configuration also includes a data
analyzer 3 disposed in the data copying semiconductor device or an
analysis server 4b. The analyzer 3 generates information necessary
for the diagnosis in the diagnosing semiconductor device 23, for
example, a determining criterion to determine the end point or a
model formula for the diagnosis and then sends the information to
the realtime diagnosing semiconductor device 23.
[0042] In the diagnosis using the data analyzer 3 of the data
copying semiconductor device 4b, a long period of time is required
before the diagnosis is started. Therefore, this operation is not
suitable for the realtime diagnosis in some cases. However, by
disposing the realtime diagnosing semiconductor device 23 in the
data collector 2, the diagnosis can be immediately carried out.
[0043] FIG. 10 shows further another embodiment of the present
invention. The configuration of FIG. 10 includes data collectors 2a
and 2b and data analyzers 3a and 3b. As can be seen from the
configuration, the etching system 1 includes a plurality of etching
chambers 11 and 12. The data collector 2a and the data analyzer 3a
are disposed for the etching chamber 11 and the data collector 2b
and the data analyzer 3b are disposed for the etching chamber
12.
[0044] By disposing a data collector and a data analyzer for each
etching chamber, the data analyzer can transfer data from the data
collector to the data analyzer using a free processing period of
time between the continuous wafer processing of the etching
chamber.
[0045] FIG. 11 shows still another embodiment of the present
invention. The embodiment includes external databases 22a and 22b
disposed at positions outside the data collector 2. The data
collector 2 stores collected data in either one of the external
storages 22a and 22b according to a storage change condition set by
a data storage change condition setting semiconductor device 23. A
storage change condition can be set from an external semiconductor
device to the condition setting semiconductor device 23. The
embodiment further includes a display 24 to display, for example,
all storages or a storage being currently used.
[0046] The external storage may be a hard disk or a semiconductor
memory. By connecting these external storage via, for example, a
local area network (LAN) to the data analyzer, data can be obtained
from the external storage not connected to the data collector 2 to
analyze the data without taking the load imposed on the data
collector 2 into consideration.
[0047] The external storage may also include removable media such
as a removable hard disk, a removable digital video disk (DVD), a
removable magnetooptical disk, and a zip drive (trademark) and so
on. If the storage is constructed such that the body of media is
ejected from the storage when the data collection is finished, the
operator can easily collect the media. When such a removable media
is employed as the external storage, the removable media can be
incorporated into the data collector 2.
[0048] The storage change condition may be automatically set
according to the capacity of the external storage. However, it is
more convenient if the user can set the condition. The storage
change condition may be specified by information of "day and time"
or information for a periodic specification such as "Monday every
week". Or, the condition may be a point of time when samples of a
specified number of lots are completely processed. The storage
where the data collector 2 via the data processor 21 is updating
the database is called `active storage`. The operator can specify a
storage change condition such that when the active storage is
changed. As shown in FIG. 11, after the storage change condition,
which is set by the storage change condition setting device 23, is
fulfilled, the data collector 2 via the data processor 21 thereof
starts to store the database into another storage so that the
storage for which the storing operation is finished is released
from updating tasks. Thereafter, the operator may produce a backup
copy of the database in the released storage. Or, if the storage is
removable device, the operator can just pick up the removable media
containing data. It is preferable that when the active storage is
changed, the event is displayed on the storage display or a
notification is sent to the operator via e-mail.
[0049] According to the embodiments described above, it is possible
to provide a data processing apparatus for a semiconductor
manufacturing apparatus with high usability in which the period of
time required for the processing is reduced. Since a data collector
and a data analyzer are disposed for each etching chamber in the
processing chamber of the semiconductor manufacturing apparatus,
the period of free time to be allocated to data processing such as
a data extraction request of the data analyzer can be sufficiently
guaranteed. Therefore, the load imposed on the data collector can
be reduced. The data collector is connected to a plurality of
external storages such that the storages are appropriately changed
in the operation. This advantageously reduces the load imposed on
the data collector, for example, for a data extraction request of
the data analyzer. The collected data can be easily controlled.
[0050] According to the present invention described above, it is
possible to provide a data processing apparatus for a semiconductor
manufacturing apparatus with high usability in which the period of
time required for the processing is reduced.
[0051] It should be further understood by those skilled in the art
that the foregoing description has been made on embodiments of the
invention and that various changes and modifications may be made in
the invention without departing from the spirit of the invention
and the scope of the appended claims.
* * * * *