U.S. patent application number 11/398058 was filed with the patent office on 2006-08-10 for single wafer dryer and drying methods.
This patent application is currently assigned to Applied Materials, Inc.. Invention is credited to Younes Achkire, Haoquan Fang, Boris Fishkin, Boris T. Govzman, Alexander Lerner, Shijian Li, Rashid Mavleiv, Guy Shirazi, Michael Sugarman, Jianshe Tang.
Application Number | 20060174921 11/398058 |
Document ID | / |
Family ID | 23311345 |
Filed Date | 2006-08-10 |
United States Patent
Application |
20060174921 |
Kind Code |
A1 |
Achkire; Younes ; et
al. |
August 10, 2006 |
Single wafer dryer and drying methods
Abstract
In a first aspect, a module is provided that is adapted to
process a wafer. The module includes a processing portion having
one or more features such as (1) a rotatable wafer support for
rotating an input wafer from a first orientation wherein the wafer
is in line with a load port to a second orientation wherein the
wafer is in line with an unload port; (2) a catcher adapted to
contact and travel passively with a wafer as it is unloaded from
the processing portion; (3) an enclosed output portion adapted to
create a laminar air flow from one side thereof to the other; (4)
an output portion having a plurality of wafer receivers; (5)
submerged fluid nozzles; and/or (6) drying gas flow deflectors,
etc. Other aspects include methods of wafer processing.
Inventors: |
Achkire; Younes; (Los Gatos,
CA) ; Lerner; Alexander; (San Jose, CA) ;
Govzman; Boris T.; (Sunnyvale, CA) ; Fishkin;
Boris; (San Carlos, CA) ; Sugarman; Michael;
(San Francisco, CA) ; Mavleiv; Rashid; (Campell,
CA) ; Fang; Haoquan; (Sunnyvale, CA) ; Li;
Shijian; (San Jose, CA) ; Shirazi; Guy;
(Mountain View, CA) ; Tang; Jianshe; (San Jose,
CA) |
Correspondence
Address: |
DUGAN & DUGAN, PC
55 SOUTH BROADWAY
TARRYTOWN
NY
10591
US
|
Assignee: |
Applied Materials, Inc.
|
Family ID: |
23311345 |
Appl. No.: |
11/398058 |
Filed: |
April 4, 2006 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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11179926 |
Jul 12, 2005 |
|
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|
11398058 |
Apr 4, 2006 |
|
|
|
10286404 |
Nov 1, 2002 |
6955516 |
|
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11179926 |
Jul 12, 2005 |
|
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60335335 |
Nov 2, 2001 |
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Current U.S.
Class: |
134/34 ;
134/26 |
Current CPC
Class: |
H01L 21/67751 20130101;
H01L 21/681 20130101; B08B 3/10 20130101; Y10S 414/139 20130101;
H01L 21/67034 20130101; H01L 21/68764 20130101 |
Class at
Publication: |
134/034 ;
134/026 |
International
Class: |
B08B 3/00 20060101
B08B003/00 |
Claims
1. A method of rinsing a microelectronic device comprising:
immersing at least a portion of a surface of the microelectronic
device within an immersion vessel containing a liquid bath;
separating the microelectronic device from the liquid bath into a
gas environment and, during such separation, forming a meniscus at
an interface between the surface of the microelectronic device and
the liquid bath; and delivering a cleaning enhancement substance
into the gas environment and specifically directed to the meniscus
that is formed while the microelectronic device is separated from
the liquid bath, the delivery of cleaning enhancement substance
being conducted as a series of gas streams formed by a nozzle with
a series of delivery orifices arranged along the direction of
extension of the meniscus along the surface of the microelectronic
device so that a gradient in the surface tension of the liquid at
the meniscus is created.
2. The method of claim 1, wherein the delivery step further
comprises delivering cleaning enhancement substance to menisci that
are formed at a plurality of surfaces of the microelectronic
device.
3. The method of claim 1, wherein portions of a plurality of
microelectronic devices are immersed within a liquid bath at the
same time and at least one surface of each microelectronic device
is separated from the liquid bath so that a meniscus is formed at
that surface and wherein the delivery step further comprises
delivering cleaning enhancement substance to a meniscus formed at
that surface.
4. The method of claim 3, wherein the plurality of microelectronic
devices are immersed together within an immersion vessel.
5. The method of claim 4, wherein the cleaning enhancement
substance is delivered to menisci that are formed at plural
surfaces of a plurality of microelectronic devices.
6. The method of claim 3, wherein the plurality of microelectronic
devices are immersed at the same time, but within liquid baths
provided within separate immersion vessels.
7. The method of claim 6, wherein the cleaning enhancement
substance is delivered to menisci that are formed at plural
surfaces of a plurality of microelectronic devices.
8. The method of claim 3, wherein the cleaning enhancement
substance is delivered as a series of gas streams arranged along
the direction of extension of the menisci formed at oppositely
facing surfaces of a plurality of the microelectronic devices while
cleaning enhancement substance is also delivered to the gas
environment.
9. A method of rinsing microelectronic devices comprising:
immersing a plurality of microelectronic devices within an
immersion vessel containing a liquid bath; separating the
microelectronic devices from the liquid bath into a gas environment
and, during such separation, forming menisci at interfaces between
the surfaces of the microelectronic devices and the liquid bath;
and delivering cleaning enhancement substance into the gas
environment and specifically directed to menisci formed at surfaces
of a plurality of microelectronic devices, wherein the cleaning
enhancement substance is delivered to menisci by supplying gas flow
from nozzles arranged in the direction of extension of the menisci
formed at opposite surfaces of a plurality of the microelectronic
devices while the cleaning enhancement substance is also delivered
by another dispensing nozzle to the gas environment.
10. The method of claim 9, wherein the cleaning enhancement
substance is delivered by an elongate nozzle having a series of
delivery orifices.
11. The method of claim 9, wherein the plurality of microelectronic
devices are immersed together within an immersion vessel.
12. The method of claim 11, wherein the cleaning enhancement
substance is delivered to menisci that are formed at plural
surfaces of a plurality of microelectronic devices.
13. The method of claim 9, wherein the plurality of microelectronic
devices are immersed at the same time, but within liquid baths
provided within separate immersion vessels.
14. The method of claim 13, wherein the cleaning enhancement
substance is delivered to menisci that are formed at plural
surfaces of a plurality of microelectronic devices.
Description
[0001] This application is a continuation of and claims priority
from U.S. patent application Ser. No. 11/179,926 filed Jul. 12,
2005 which is a division of and claims priority from U.S. patent
application Ser. No. 10/286,404 filed Nov. 1, 2002, which claims
priority from U.S. Provisional Patent Application Ser. No.
60/335,335, filed Nov. 2, 2001. All of the above-identified patent
applications are hereby incorporated by reference herein in their
entirety.
FIELD OF THE INVENTION
[0002] This invention is concerned with semiconductor manufacturing
and is more particularly concerned with techniques for drying a
substrate.
BACKGROUND OF THE INVENTION
[0003] As semiconductor device geometries continue to decrease, the
importance of ultra clean processing increases. Aqueous cleaning
within a tank of fluid (or a bath) followed by a rinsing bath
(e.g., within a separate tank, or by replacing the cleaning tank
fluid) achieves desirable cleaning levels. After removal from the
rinsing bath, absent use of a drying apparatus, the bath fluid
would evaporate from the substrate's surface causing streaking,
spotting and/or leaving bath residue on the surface of the
substrate. Such streaking, spotting and residue can cause
subsequent device failure. Accordingly, much attention has been
directed to improved methods for drying a substrate as it is
removed from an aqueous bath.
[0004] A method known as Marangoni drying creates a surface tension
gradient to induce bath fluid to flow from the substrate in a
manner that leaves the substrate virtually free of bath fluid, and
thus may avoid streaking, spotting and residue marks. Specifically,
during Marangoni drying a solvent miscible with the bath fluid
(e.g., IPA vapor) is introduced to a fluid meniscus which forms as
the substrate is lifted from the bath or as the bath fluid is
drained past the substrate. The solvent vapor is absorbed along the
surface of the fluid, with the concentration of the absorbed vapor
being higher at the tip of the meniscus. The higher concentration
of absorbed vapor causes surface tension to be lower at the tip of
the meniscus than in the bulk of the bath fluid, causing bath fluid
to flow from the drying meniscus toward the bulk bath fluid. Such a
flow is known as a "Marangoni" flow, and can be employed to achieve
substrate drying without leaving streaks, spotting or bath residue
on the substrate.
SUMMARY OF THE INVENTION
[0005] In a first aspect of the invention, a first module is
provided that is adapted to process a wafer. The module includes a
processing portion having a load port through which a wafer may be
lowered into the processing portion, and an unload port,
horizontally displaced from the load port, such that the wafer may
be raised out of the processing portion at the unload port. The
module also includes a rotatable wafer support for rotating an
input wafer from a first orientation wherein the wafer is in line
with the load port, to a second orientation wherein the wafer is in
line with the unload port.
[0006] In a second aspect of the invention, a second module is
provided that is adapted to process a wafer. The second module
includes a processing portion having the load port and unload port
described with regard to the first module. The second module also
includes (1) an external overflow weir positioned along the
exterior of the processing portion; and (2) a separation wall
positioned between the load port and the unload port so as to
divide an upper region of the processing portion into a first
section and a second section, and so as to deter surface fluid from
traveling between the first section and the second section.
[0007] In a third aspect of the invention, a third module is
provided that is adapted to process a wafer. The third module
includes a processing portion having the load port described with
regard to the first module. The third module also includes a spray
mechanism adapted to be submerged in fluid contained in the
processing portion during processing, and positioned so as to spray
fluid to the underwater surface of a wafer as the wafer is lowered
through the load port.
[0008] In a fourth aspect of the invention, a fourth module is
provided that is adapted to process a wafer. The fourth module
includes a processing portion having the load port and unload port
described with regard to the first module. The fourth module also
includes an output portion having (1) a first wafer receiver
adapted to receive a wafer raised through the unload port; and (2)
a catcher coupled to the wafer receiver and adapted to contact a
wafer being elevated from the unload port and to elevate passively
therewith.
[0009] In a fifth aspect of the invention, a fifth module is
provided that is adapted to process a wafer. The fifth module
includes a processing portion having the load port and unload port
described with regard to the first module. The fifth module also
includes an output portion having a first wafer receiver adapted to
receive a wafer raised through the unload port, and an enclosure
surrounding the first wafer receiver. The enclosure includes (1) a
first opening adapted such that a wafer may be raised from the
processing portion, through the unload port, to the first wafer
receiver; (2) a second opening adapted to allow a wafer handler to
extract a wafer from the first wafer receiver; and (3) a plurality
of additional openings adapted to allow a laminar flow of air to be
established within the enclosure.
[0010] In a sixth aspect of the invention, a sixth module is
provided that is adapted to process a wafer. The fifth module
includes a processing portion having the load port and unload port
described with regard to the first module. The fifth module also
includes an output portion having (1) a first wafer receiver
adapted to receive a wafer raised through the unload port; and (2)
a second wafer receiver adapted to receive a wafer raised through
the unload port. The first and second wafer receivers are adapted
to translate between a first position wherein the first wafer
receiver is positioned to receive a wafer raised through the unload
port, and a second position wherein the second wafer receiver is
positioned to receive a wafer raised through the unload port.
Numerous other aspects are provided, as are methods, apparatus and
systems in accordance with these and other aspects.
[0011] Other features and aspects of the present invention will
become more fully apparent from the following detailed description,
the appended claims and the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] FIG. 1 is a schematic side view of an inventive drying
apparatus comprising a processing portion, and an output portion,
both configured according to a first aspect;
[0013] FIGS. 2A-I are schematic side views of the inventive drying
apparatus of FIG. 1 showing sequential stages of wafer transport
through, and output from, the inventive drying apparatus;
[0014] FIGS. 3A-B are a schematic side view and a top plan view
respectively showing the drying apparatus of FIG. 1 wherein the
output portion is configured according to a second aspect;
[0015] FIGS. 4A-I are schematic side views of the inventive drying
apparatus of FIGS. 3A-B showing sequential positions of the output
portion during wafer output thereto;
[0016] FIG. 5 is a schematic side view showing the inventive drying
apparatus wherein the processing portion is configured according to
a second aspect;
[0017] FIG. 6 is a schematic side view of a vapor flow deflector
that may be installed in association with a vapor nozzle in a
drying apparatus;
[0018] FIG. 7 is a graph which plots the number of particles
observed on wafers dried via various IPA concentrations and various
flow rates;
[0019] FIG. 8A is a schematic drawing useful in describing a vapor
flow angle; and
[0020] FIG. 8B is a table showing preferred vapor flow angles for
drying substrates comprising various materials.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0021] A drying apparatus provided in accordance with the present
invention comprises a processing portion and an output portion. The
processing portion includes a main chamber that may be configured
according to two main aspects. A first aspect (submersion chamber
18a) submerges a wafer in a bath of fluid and is shown and
described with reference to FIGS. 1-2I; a second aspect (spray
chamber 18b) sprays an unsubmerged wafer with fluid and is shown
and described with reference to FIG. 5.
[0022] Similarly, the output portion includes an output platform
that may be configured according to two main aspects. A first
aspect (rotation platform 58) rotates a wafer from a generally
vertical orientation to a generally horizontal orientation and is
shown and described with reference to FIGS. 1-2I; a second aspect
(translation platform 158) translates horizontally so as to receive
a generally vertically oriented wafer in one of a plurality of
wafer receivers, and is shown and described with reference to FIGS.
3A-4K.
[0023] Each aspect of the processing portion and output portion is
considered inventive on its own. Accordingly, each aspect of the
processing portion may be used with either aspect of the output
portion, and vice versa. Additionally each aspect of the processing
portion and the output portion may be used with conventional output
portions and processing portions, respectively. Finally, numerous
individual features of the processing portions and output portions
are inventive, as will be apparent with reference to the figures
and the description that follows.
[0024] FIG. 1 is a side schematic view of an inventive drying
apparatus 11 in which the processing portion and the output portion
are configured according to a first aspect of the present
invention. The inventive drying apparatus 11 comprises a processing
portion 10 and an output portion 12.
Processing Portion--First Aspect
[0025] The processing portion 10 comprises a submersion chamber 18a
which submerges a wafer in a bath of fluid, such as deionized
water, and which may or may not include a surfactant, or other
cleaning chemistry such as Applied Materials' ElectraClean.TM.
solution.
[0026] An upper separation wall 24 (FIG. 2A) divides the submersion
chamber 18a into two sections: a rinsing section 26 and a "drying"
section 28. By separating the drying section 28 from the rinsing
section 26, a cleaner exit zone is maintained and the risk of
removed particles re-adhering to the wafer during drying is
reduced, as particles tend to be removed in the rinsing section 26
and overflowed therefrom. The submersion chamber 18a may have an
overflow weir 20 surrounding the chamber 18a such that fluid may be
overflowed thereto. Fluid may be continuously supplied, for
example, to the lower portion of the chamber 18a so that fluid
continuously overflows to the weir 20. An overflow weir 20a (FIGS.
2A-I) may be coupled to the upper separation wall 24 to aid in
removing particles from the rinsing section 26 as well as from the
drying section 28. High and low fluid level sensors (not shown) may
be coupled to both the chamber 18a and the weirs 20, 20a. In an
alternative aspect, not shown, the overflow weir 20 may comprise a
chamber in which the processing portion 10 is mounted. An exhaust
line (e.g., a facilities exhaust line) may be coupled to the
chamber (e.g., near the bottom thereof) and a drain line may be
positioned along the bottom of the chamber, which may be slanted to
facilitate drainage.
[0027] The rinsing section 26 may be equipped with overhead spray
nozzles 30 and/or submerged spray nozzles 32 each of which are
adapted to direct fluid to the surface of the wafer as it enters
the rinsing section 26. The rinsing section 26 may, in one aspect,
be used to rinse from the wafer any fluid film (e.g., surfactant)
which may have been sprayed on the wafer prior to transfer into the
inventive drying apparatus 11. It has been found that such a
surfactant spraying step prevents a hydrophobic wafer from drying
during transfer to the inventive apparatus 11. A surfactant spray
(preferably a spray containing a low concentration of a surfactant
such as an Alfonic surfactant) is therefore desirable prior to
loading the wafer into a drying apparatus in order to prevent the
formation of watermarks on the wafer. Such an inventive process may
be performed in a scrubber or during wafer transfer (e.g., a wafer
handler or scrubber may comprise a mechanism for wetting the
substrate with surfactant either during scrubbing or as the
substrate is removed from the scrubber or during transfer via the
wafer handler).
[0028] The rinsing section 26 further includes a load port 34,
which may be merely a location through which the wafer passes as it
enters the rinsing section 26, or which may be an opening defined
by a top wall or lid (if any) of the rinsing section 26.
[0029] Located at or near the bottom of the submersion chamber 18a
is a cradle 36, adapted to receive and support a generally
vertically oriented wafer (which may be slightly inclined from
normal). The cradle 36 is further adapted to rotate from a first
position in which the cradle 36 may receive a wafer that enters the
rinsing section 26 via the load port 34, to a second position in
which a wafer may be lifted from the cradle 36 through an exit port
37 of the drying section 28. As the cradle 36 rotates the wafer
from the rinsing section 26 to the drying section 28 the wafer
remains submerged in the fluid.
[0030] A mechanism for rotating the cradle 36 is preferably mounted
outside the processing portion 10 and is coupled to the cradle 36
either directly or magnetically through a wall of the processing
portion 10. In the exemplary embodiment of FIG. 1, a linkage system
38 is configured to rotate the cradle 36 from the first position
(within the rinsing section 26) to the second position (within the
drying section 28) when the linkage is downwardly actuated, and to
retract the cradle 36 from the drying section 28 to the rinsing
section 26 when the linkage system 38 is upwardly actuated. An
actuator 40 is shown coupled to the linkage system 38. The actuator
40 may be any conventional actuator such as an air cylinder or the
like.
[0031] An alternative configuration for achieving cradle rotation
may comprise mounting the cradle 36 on a rod that extends
horizontally along the bottom of the submersion chamber 18a so that
the cradle 36 may rotate about the rod. In such a configuration the
cradle 36 may be, for example, nearly as wide as the submersion
chamber 18a, such that a magnet may be mounted on both sides of the
cradle 36, and may couple through the side walls of the chamber 18a
to external magnets. The external magnets may be driven forward and
backward by an actuator (such as pneumatic actuator 40). To
facilitate rotation of both the cradle 36 and the external magnets,
rollers may be mounted thereto so as to contact and roll along the
side walls of the submersion chamber 18a.
[0032] A pair of sensors (not shown) may be coupled to the actuator
40, the linkage system 38 and/or the cradle 36 so as to detect the
first and second cradle positions. Further, a sensor, such as an
optical sensor (not shown) may detect the presence of the wafer on
the cradle 36. Once wafer presence is detected a signal may be sent
to the actuator 40 to cause the actuator 40 to rotate the cradle 36
from the first position to second position.
[0033] The drying section 28 may include a pusher 44 which is
preferably adapted to contact the lower edge of the wafer with
minimal contact area. Such pushers are conventionally referred to
as knife-edged pushers. The knife-edged pusher 44 may be coupled to
a vertical guide (not shown) positioned along the rear wall of the
drying section 28, and may be further coupled (e.g., magnetically)
to an actuator (for example a lead screw 48 of FIG. 1, driven by a
motor) which is adapted to lift and lower the pusher 44 along the
guide so that the pusher 44 may elevate a wafer from the drying
section 28 and may then return to the pusher's original position
below the cradle 36.
[0034] The rear wall of the drying section 28 is preferably
inclined (e.g., nine degrees) such that the pusher maintains the
wafer in an inclined position as it is elevated from the drying
section 28, so as to ensure more repeatable wafer position than can
be achieved with a non-inclined, vertical orientation.
[0035] A pair of inclined guides 46 may also be coupled to the rear
wall of the drying section 28 and positioned so as to contact the
opposing edges of the wafer as the wafer is lifted from the cradle
36 through the drying section 28. Each guide 46 may be include a
slot such as V or U shaped slot in which the wafer's edge is held.
Alternatively each guide 46 may include a beveled surface against
which the wafer's edge may rest, or the guides 46 may be angled
away from the wafer so as to minimize contact therewith.
[0036] The exit port 37 of the drying section 28 is preferably
defined by a top wall or lid of the drying section 28, such that
drying vapors may be exhausted therefrom (e.g., via a pump) rather
than escaping into the surrounding atmosphere. Positioned above the
fluid level but below the exit port 37 are a pair of spray
mechanisms 50 adapted to provide a continuous spray of vapor across
both the front and back surfaces of the wafer as the wafer is
elevated from the fluid. Spray mechanisms 50 are positioned so as
to spray vapor to a meniscus that forms as the wafer is lifted from
the fluid. Although the spray mechanisms 50 may comprise a single
linear nozzle, or a plurality of nozzles, they preferably comprise
a tube having a line of holes formed therein (e.g., 114 holes
having 0.005-0.007 inch diameters and being uniformly spaced along
the 8.5 inches that are adjacent to the wafer). Such spray tubes 50
are preferably made of quartz or stainless steel.
[0037] Each spray tube 50 may be manually oriented so as to direct
a vapor flow (e.g., IPA vapor) at a desired angle (e.g., relative
to a horizontal line drawn through the center of the tubes 50 and
parallel to the fluid surface as shown in FIG. 8A). The IPA vapor
flow may be directed with or without the aid of a flow deflector as
described further with reference to FIG. 6. A specific angle of the
flow may vary depending upon the material of the wafer to be dried.
The table listing preferred flow angles for exemplary materials is
shown in FIG. 8B.
[0038] The IPA vapor flow supplied to the fluid meniscus creates a
Marangoni force that results in a downward liquid flow opposite to
the wafer lift direction. Thus, the wafer surface above the
meniscus is dried.
[0039] In order to contain and exhaust the IPA vapor inside the
drying section 28, an exhaust manifold 51 and a nitrogen blanket
manifold 54 are provided. These manifolds may be built into a top
cover 56 of the drying section 28, above the spray mechanisms 50. A
gas flow module (not shown) coupled to spray mechanisms 50, the
exhaust manifold 51 and the nitrogen blanket manifold 54 controls
the IPA vapor flow rate, the exhaust rate and the nitrogen blanket
flow rate. In addition, an exhaust line (not shown) may be located
beneath the output portion 12 and may maintain a vertical laminar
flow through the output portion 12, as well as diluting any IPA
vapor that may escape from the drying section 28. The spray
mechanisms 50 are preferably positioned close to the meniscus, and
the nitrogen blanket manifold 54 is preferably positioned close to
the unload port 37.
[0040] Wafer Processing--First Aspect
[0041] FIGS. 2A-I are schematic side elevational views which show a
wafer at various stages as the wafer travels through the inventive
apparatus 11. Referring to FIG. 2A, as a robot (such as a walking
beam robot, not shown herein although disclosed in U.S. patent
application Ser. No. 09/558,815, filed Apr. 26, 2000, the entire
disclosure of which is incorporated herein by reference) loads the
wafer W into the rinsing section 26 via the load port 34, the
nozzles 30, 32 spray DI water onto both sides of the wafer W. The
robot releases the wafer onto the cradle 36, and then retracts from
the rinsing section 26 to its home position, above the loadport 34.
An optical sensor (not shown) detects the presence of the wafer on
the cradle 36 (FIG. 2B), and signals the actuator 40 to actuate the
linkage system 38 thereby causing the cradle 36 to rotate from the
rinsing section 26 to the drying section 28.
[0042] The cradle 36, located at or near the bottom of the
submersion tank 18a, transfers the wafer from the rinsing section
26 to the drying section 28. During this transfer the wafer remains
submerged in the fluid. Thus the cradle 36 rotates from a vertical
position, for receipt of the wafer, to an inclined position (e.g.,
9.degree. incline), for wafer elevation through the drying section
28 (FIG. 2C).
[0043] The wafer W is then lifted, via the pusher 44, toward the
unload port 37 with a lifting velocity profile that lifts at a
process speed (e.g., 10 mm/sec) from a time when the top of the
wafer emerges from the tank fluid (and the drying vapor spray is
initiated) until a time when the wafer's lower edge (e.g., the
lower 30-40 mm of the wafer) emerges from the tank fluid. While the
lower edge of the wafer emerges from the tank fluid and passes
through the drying vapor, the wafer is lifted at a slower speed
(e.g., less than 5 mm/sec.) because the lower portion of the wafer
is more difficult to dry (due to the wafer's curvature). After the
entire wafer has been dried, the wafer may be lifted at a faster
speed (e.g., greater than 10 mm/sec.) to a transfer position. As
the wafer is lifted, the wafer edges lean by the force of gravity,
on the two parallel inclined guides 46, which are submerged in the
fluid.
[0044] As the wafer W is lifted out of the fluid, the pair of spray
mechanisms 50 (FIG. 2D) spray an IPA vapor and nitrogen mixture at
the meniscus that forms on both sides of the wafer W. The IPA vapor
flow may be directed with or without the help of a flow deflector
as described further with reference to FIG. 6. The specific angle
of the flow may vary depending upon the type of material on the
wafer to be dried.
[0045] FIG. 8A is a schematic diagram useful in describing vapor
flow angle. With reference to FIG. 8A, flow angle .theta. of a
stream 72 of vapor/carrier gas is measured relative to the
water/air interface (and/or a horizontal center line through a
nozzle tube 50) as shown. (In one embodiment, a nozzle tube 50 is
positioned about 0.5 inches laterally from the wafer W, the flow
angle is selected to be about 25.degree. and the nozzle height
H.sub.N is selected so that the stream 72 strikes the wafer W at a
height H.sub.v of about 3.7 mm above the water/air interface. Other
lateral spacings, flow angles, nozzle heights H.sub.N and vapor
strike heights H.sub.v may be employed.) A table listing preferred
flow angles (measured relative to the water/air interface) for
exemplary materials is shown in FIG. 8B. Surface material refers to
the material on a wafer that is to be dried. Dry-in or wet-in refer
to whether a wafer is dry or wet prior to processing within the
drying apparatus 11. Dry-out means that a wafer is dry when removed
from the drying apparatus 11. Black Diamond.RTM. is a low k
dielectric available from Applied Materials, Inc. (e.g.,
carbon-doped oxide). IPA vapor flow creates a "Marangoni" force
resulting in a downward liquid flow opposite to the wafer lift
direction. Thus, the wafer surface above the meniscus is dried.
[0046] During the drying process, the IPA vapors are exhausted from
the processing portion 10 via the exhaust manifold 51, and a flow
of nitrogen is directed across the output port 37 (via the nitrogen
blanket manifold 54) to deter IPA vapor from exiting the processing
portion 10. The gas delivery module (not shown) controls the IPA
vapor flow, the exhaust rate and the nitrogen blanket flow
rate.
Output Portion--First Aspect
[0047] In the embodiment shown in FIGS. 1-2I the output portion 12
includes a platform 58, adapted to rotate between two positions: a
processing position (FIG. 2E) for receiving a wafer from the drying
section 28 and a FAB interface position (FIG. 2G) for outputting a
wafer to a transfer robot. The processing position matches the
incline at which the wafer is elevated form the drying section 28,
and the processing position is generally horizontal. A motor or
other driving mechanism coupled to the output portion 12 drives
rotation of the platform 58.
[0048] The output portion 12 may include a catcher 60 adapted to
move passively with the wafer W. The catcher 60 may be, for
example, mounted on a linear ball slide (not shown) that has a
stopper at each end. When the platform 58 is in the processing
position (e.g., vertically inclined toward the processing portion
10 with the same 9.degree. incline as the inclined guides 46), the
catcher 60 moves to the bottom of the linear ball slide due to
gravity. This low position may be detected with an optical sensor
(not shown). The catcher 60 may contact the wafer at two points
that are separated by a distance and that may be closely toleranced
to follow the wafers circumference. Accordingly, the catcher 60 may
aid in precise wafer positioning.
[0049] The output portion 12 may also include a finger 62 adapted
to move between a wafer securing position and a wafer passage
position. When in the wafer securing position the finger 62 may
lock and secure the wafer after the wafer is elevated above the
finger 62, thereby allowing the pusher 44 to retract, leaving the
wafer held in place on the output portion 12 by the finger 62 and
the catcher 60. The finger 62 may be, for example, actuated by an
air cylinder (not shown) and equipped with a pair of switches (not
shown) to detect the wafer securing and wafer passage positions of
the finger 62. An optical sensor (not shown) may also be provided
to sense when the wafer is at a sufficient elevation above the
finger 62 so that the finger 62 may safely assume the wafer
securing position.
[0050] Wafer Output--First Aspect
[0051] Prior to lifting the wafer W through the drying section 28,
the platform 58 is generally vertically inclined (e.g., with a
9.degree. incline) (FIG. 2C). The catcher 60 is at its low position
and the finger 62 is in the wafer passage position. As the wafer W
exits the drying section 28 (FIG. 2D), it pushes the catcher 60
(e.g., at two points of contact) and causes the catcher 60 to move
upward therewith against gravity. The wafer W is thus secured
between three points (via the pusher 44 and the catcher 60). When
the pusher 44 reaches its high position, the finger 62 is actuated
to the wafer securing position so as to secure the wafer W on the
platform 58, and the pusher 44 may then retract. (The finger 62 is
shown in the wafer securing position in FIG. 2E.) Because the
catcher 60 moves passively with the elevating wafer W, wafer
rubbing and particle generation during transfer into the output
portion 12 may be reduced.
[0052] After the wafer W is secured on the platform 58, the
platform 58 rotates to its horizontal position (FIG. 2F). An air
cylinder 64 (FIG. 1) which may include an adjustable stop and shock
absorber (not shown) may be used to lower the platform 58 to a
defined output position, for example, at an elevation where a wafer
handler 66 (FIG. 2H) may extract the wafer W. The finger 62 is then
retracted as shown in FIG. 2H, and the wafer handler 66 picks up
the wafer W to transfer it to another location (e.g., to a
cassette). The platform 58 then returns to its generally vertically
inclined process position (FIG. 2I) ready to receive the next
processed wafer W' as the next processing wafer W' when it is
elevated from the drying section 28.
[0053] In one or more embodiments of the invention, a dedicated gas
delivery and exhaust module (not shown) may be employed to deliver
isopropyl alcohol (IPA) vapor, nitrogen and exhaust to the drying
apparatus 11 (e.g., near the spray mechanism 50). For example,
clean, dry air combined with one or more venturis (not shown) may
provide the exhaust (e.g., a gas line (not shown) may supply clean,
dry air to a pressure port of a venturi mounted near the unload
port 42 to provide exhaust).
[0054] To provide an IPA/nitrogen flow to the spray mechanism 50, a
mass flow controller (not shown) may provide a flow of nitrogen at
a predetermined rate to an IPA bubbler (not shown). In at least one
embodiment, a 1.4 liter bubbler is employed to deliver an
IPA/nitrogen mixture having a concentration of about 5% IPA. Other
bubbler sizes and/or IPA concentrations may be employed.
[0055] In one particular embodiment of the invention, the bubbler
may be equipped with three level sensors: Low, High and Hi-Hi level
sensors. The first two level sensors may be used, for example,
during an automatic refill of the IPA bubbler. The latter Hi-Hi
sensor may be used, for example, as a hardware interlock to prevent
overfilling the bubbler. A pressurized supply vessel (not shown),
such as a 1-Liter or otherwise appropriately sized vessel, may be
employed to automatically refill the bubbler with liquid IPA. The
supply vessel may include a low-level sensor and may be
automatically or manually refilled when its low-level sensor is
triggered.
[0056] A nitrogen blanket flow rate (e.g., for preventing IPA vapor
from escaping from the processing portion 10) may be controlled
with a needle valve or other suitable mechanism. Clean dry air and
nitrogen blanket supply lines may each be provided with a flow
switch for safety purposes (e.g., hardware interlock flow switches
that may be used to shut-off the IPA vapor supply when the exhaust
or nitrogen blanket flow are lost). Pressure regulators may be used
to control pressure in each supply line.
Output Portion--Second Aspect
[0057] FIGS. 3A-B are a schematic side view and a top plan view,
respectively, of a second embodiment of the output portion 12 of
the inventive drying apparatus. The inventive apparatus 11a of
FIGS. 3A-B includes an enclosure 111 that surrounds the output
portion 12. A translatable platform 158 of the output portion 12
may include two or more wafer receivers 113a, 113b, each comprising
the catcher 60 and the finger 62 described with reference to FIGS.
1-2I. In this embodiment the translatable platform 158 is adapted
to move horizontally (e.g., via a lead screw, pneumatic cylinder,
motor or the like), so that the wafer being elevated from the
drying portion 28 may be received by either the first or second
wafer receiver 113a, 113b. In this manner wafer throughput may be
maximized, as a first wafer may be held at the first wafer receiver
113a for pick up by a wafer handler (not shown) while a second
wafer is being output to the second wafer receiver 113b, or vice
versa.
[0058] The enclosure 111 has a first side wall 115a which may be
positioned adjacent a transfer robot (not shown). The first side
wall 115a has an opening 117 through which the transfer robot may
extract wafers. The enclosure 111 may also have an internal
partition wall 115b positioned opposite the first side wall 115a,
for dividing the enclosure 111 into two chambers 111a, 111b. The
first chamber 111a may enclose the translatable platform 158 with
sufficient space to allow the translatable platform to translate
back and forth so as to receive a wafer at either the first or
second wafer receivers 113a-b. The second chamber 111b may enclose
the mechanisms employed to translate the translatable platform 158,
as well as any other moving parts (represented generally by
reference numeral 159 in FIG. 3B). Such an internal partition wall
115b, that separates the two chambers may have a plurality of small
openings 119 (FIG. 3A) that preferably cover the entire internal
partition wall 115b. When the region adjacent the transfer robot is
maintained at a higher pressure than the region adjacent the
inventive drying apparatus 11a, air may flow laminarly in the
opening 117, across the first and second wafer receivers 113a, 113b
(parallel to the wafers' major surface as indicated by arrow F) and
through the small openings 119 into the second chamber 111b. The
second chamber 111b may be exhausted via an exhaust system not
shown.
[0059] In addition, an exhaust line (not shown) located beneath the
output portion 12 maintains an acceptable vertical laminar flow
through the output portion 12, and also dilutes any IPA vapors that
escape from the drying section 28. The enclosure 111 of the output
portion 12 acts as an additional containment mechanism for
preventing IPA vapor from entering the atmosphere surrounding the
drying apparatus 11a.
[0060] In order to allow a wafer to be output to the first wafer
receiver 113a without blocking the processing portion 26 of the
main tank 118, a front wall 121 of the main tank 118 (i.e., the
front wall of the processing portion 26) may be angled (e.g.,
9.degree.), as shown in FIG. 3A. By angling the front wall of the
processing portion 26, the load port 34 is able to be located far
enough from the output port 37 so as to avoid blockage by the
output enclosure 111, yet the fluid volume of the processing
portion 10 is not increased as much as it would be if a straight
front wall were employed. In embodiments that employ such an angled
front wall the cradle 36 may be adapted to elevate to a position
near the load port 34, such that a wafer handler may place a wafer
on the elevated cradle 36. Such an elevating cradle 36 allows for
use of a wafer handler that does not have the ability to rotate so
as to match the angle between the load port 34 and the bottom of
the processing portion 10. The elevatable cradle 36 may be coupled
to a guide located along an inside surface of the angled front
wall, and may magnetically coupled through the front wall to an
external actuator, and thus may operate similarly to the elevatable
pusher 44.
[0061] Wafer Output--Second Aspect
[0062] FIGS. 4A-I are schematic side views that show a wafer at
various stages of processing within the alternative apparatus 11a
of FIGS. 3A-B. As shown in FIG. 4A wafer W1 is positioned on wafer
receiver 113a of output platform 158 and output platform 158 is in
its right-most position with the second wafer receiver 113b
positioned to receive the next wafer output from the drying section
28. A wafer W2 is positioned on the submerged cradle 36 and the
pusher 44 is in positioned below the cradle 36. In FIG. 4B the
pusher 44 has elevated (e.g., through a slot or opening in the
cradle 36) so as to lift the wafer W2 from the cradle 36, and the
cradle 36 has rotated back to a vertical position.
[0063] In FIG. 4C the pusher 44 has reached the elevation where the
wafer W2 passes through the unload port 37 and the top edge of the
wafer W2 contacts the catcher 60. As the wafer moves into the
unload port 37 the IPA vapor spray, the nitrogen blanket and the
exhaust are initiated. Also in FIG. 4C the cradle 36 has elevated
and is positioned inside the load port 34 ready to receive the next
incoming wafer.
[0064] As shown in FIG. 4D the first wafer W1 has been extracted
from the first wafer receiver 113a of the enclosure 111 and the
catcher 60 has returned to the lowered position. The second wafer
W2 has been elevated onto the second wafer receiver 113b to an
elevation above the finger 62, the finger 62 has moved into
positioned below the second wafer W2 and the pusher 44 has lowered
and is no longer supporting the second wafer W2 which is now held
between the finger 62 and the catcher 60. A third wafer W3 has been
loaded onto the cradle 36 and the cradle 36 has lowered to the
bottom of the processing portion 10. Note that as the third wafer
W3 lowers through the load port 34 in may be sprayed by submerged
nozzles 32 and/or by unsubmerged nozzles 30 (not shown).
[0065] As shown in FIG. 4E the platform 158 has moved to its
left-most position such that the first wafer receiver 113a is in
position to receive the next wafer output from the drying section
28. The pusher 44 has lowered to a position below the elevation of
the cradle 36 and the cradle 36 is beginning to rotate the third
wafer W from the rinsing portion 26 to the drying portion 28.
[0066] As shown in FIG. 4F the cradle 36 has rotated to position
the third wafer W3 in the drying portion 28 and the upper portion
of the third wafer W3 is resting on the wafer guides 46.
[0067] As shown in FIG. 4G the pusher 44 has elevated, lifting the
third wafer W3 off of the cradle 36 and the cradle 36 has rotated
back to a vertical position.
[0068] As shown in FIG. 4H the pusher 44 begins to lift the third
wafer W3 through the IPA vapor spray and through the nitrogen
blanket, to a position where the top of the third wafer W3 contacts
the catcher 60 of the first wafer receiver 113a. The cradle 36 has
elevated to position itself within the load port 34, ready to
receive the next incoming wafer.
[0069] As shown in FIG. 4I the second wafer W2 has been extracted
from the second wafer receiver 113b of the output enclosure 111 and
the catcher 60 has returned to its lowered position. The third
wafer W3 has been elevated onto the first wafer receiver 113a to an
elevation above the finger 62, the finger 62 has moved into
positioned below the third wafer W3 and the pusher 44 has lowered
and is no longer supporting the third wafer W3, which is now held
between the finger 62 and the catcher 60. A fourth wafer W4 has
been loaded onto the cradle 36 and the cradle 36 has been lowered
to the bottom of the rinsing portion 10. Note that as the fourth
wafer W4 lowers through the load port 34 it may be sprayed by
submerged nozzles 32 and/or by unsubmerged nozzles (not shown).
Processing Portion--Second Aspect
[0070] FIG. 5 is a side schematic view of an inventive drying
apparatus 211 showing only the processing portion 10 thereof. The
processing portion 10 is configured according to a second aspect of
the present invention. Specifically, rather than a main chamber
that submerges a wafer (such as submersion chamber 18a of FIGS.
1-2I), in the second aspect of the invention the main chamber
sprays an unsubmerged wafer with fluid both to rinse and/or
maintain the wetness of the wafer in the rinsing chamber 226, and
sprays the unsubmerged wafer with fluid to create the fluid
meniscus (for Marangoni drying) in the drying chamber 228. Only
minor hardware differences exist between a processing portion
configured for submersion and a processing portion configured for
spray processing.
[0071] As can be seen with reference to FIG. 5, the overflow weirs
20 and 20a of FIGS. 1-2I may be omitted. Preferably, a pair of
spray nozzles 30 are positioned to spray fluid to both the front
and back surfaces of a wafer as the wafer enters through the load
port 34. In the embodiment of FIG. 5 the separation wall 24 deters
fluid spray from splashing from the rinsing portion 226 into the
region above the fluid nozzles provided in the drying portion 228
(and thus deters inadvertent rewetting of a dried wafer). Within
the drying portion 228, an additional fluid supplying spray
mechanism 50a is provided below the IPA supplying spray mechanisms
50.
[0072] In operation an incoming wafer is sprayed with a fluid such
as deionized water which may or may not include a surfactant or
other cleaning chemistry such as Applied Materials'
ElectraClean.TM. solution so as to rinse and/or maintain the
wetness of the wafer. As the wafer exits the drying portion 228 the
wafer is sprayed with a fluid such as deionized water with or
without a surfactant or another cleaning agent. This exit fluid
spray forms a uniform fluid meniscus across the wafer. The IPA
spray mechanism 50 sprays IPA vapor to the meniscus thereby
creating a Marangoni flow that dries the wafer. Note that wafer
transfer within the processing portion 10, and wafer output to the
output portion 12 may be as described with reference to FIGS.
1-4I.
Flow Deflector
[0073] The efficiency of the delivery of IPA vapor to the
wafer/air/water interface (i.e., the meniscus) may be improved by
installing a vapor flow deflector in association with each IPA
vapor delivery nozzle/tube 50. One such arrangement is
schematically illustrated in FIG. 6. To simplify the drawing, a
nozzle tube 50 (which may comprise the tube 50 described above) and
flow deflector 68 are shown only on one side of the wafer W,
although in practice a nozzle tube 50 and flow detector 68 may be
provided on each side of the wafer W. Also the wafer W is shown as
exiting normal to the surface of the water 76, although the wafer W
may exit the surface of the water 76 at an incline (e.g.,
approximately 9.degree. from normal, although other angles may be
employed).
[0074] In one embodiment of the invention, the flow deflector 68
may take the form of a two part sleeve adapted to fit around the
nozzle tube 50. A first part 69 of the flow deflector 68 defines a
wedge-shaped space 70 into which a stream 72 of IPA vapor (e.g.,
mixed with a carrier gas such as nitrogen) is sprayed and is
designed to direct the stream 72 at a specific angle relative to,
for example, a horizontal line L drawn through the center of the
nozzle tube 50 and parallel to the water surface. The second part
(e.g., a lower wing 74) of the flow deflector 68 may dip below the
surface of the water 76 to limit the volume of water exposed to the
IPA vapor. The stream 72 of IPA vapor is preferably angled
downwardly, as illustrated in FIG. 6 so as to impinge on the inner
surface 78 of the first part 69 of the flow deflector 68. The
stream 72 of IPA vapor may then be reflected (not shown) by inner
surface 78 to the meniscus 80 formed at the wafer/air/water
interface. In one or more embodiments, the angle between the IPA
stream 72 and the inner surface 78 does not exceed 45.degree.,
although the angle of the IPA stream 72 preferably is selected so
that IPA vapor strikes the meniscus 80 within a desired angular
range (as described below with reference to FIGS. 8A-B) and/or with
a desired flow velocity to optimize IPA vapor delivery to the
meniscus 80.
[0075] In one exemplary embodiment, the flow deflector 68 has a
slit opening 82 that may have a width of 0.05 inches and may be
spaced, for example, 0.10 inches above the surface of the water 76,
and 0.10 inches away from wafer W so as to efficiently deliver IPA
to the meniscus 80. Other slit opening widths, distances above the
surface of the water 76 and/or distances from the wafer W may be
employed. The flow deflector 68 may be aimed at an angle of
45.degree. relative to the surface of the water 76, however other
angles may be employed. Preferably the slit opening 82 is aimed so
as to point just below the meniscus 80.
[0076] The flow deflector 68 serves to limit the volume of water
exposed to IPA vapor, thereby reducing waste and consumption of
IPA, improving dryer efficiency and performance, and reducing
safety risks. In one embodiment, the range of water volume exposed
to IPA is about 0-12 milliliters for a 300 mm wafer and about 0-8
milliliters for a 200 mm wafer although other ranges may be
employed.
[0077] If no flow deflector 68 is employed, the stream 72 of IPA
vapor may impinge the surface of the water 76 at an angle in the
range of 22.degree.-30.degree. which has been found to be suitable
for drying several different types of films formed on a wafer.
Other impingement angles may also be employed. The flow deflector
68 may be constructed from a single piece of material, or may
comprise more than two parts. The flow deflector 68 may be formed
from stainless steel or another suitable material.
Reduced Concentration IPA Mixture
[0078] The safety and efficiency of the cleaning/drying module can
be further improved by reducing the concentration of IPA vapor in
the IPA/carrier gas mixture (e.g., to 0.2% or less) while
increasing the flow rate of the mixture (e.g., to at least 2-3
liters per minute and preferably about 5 liters per minute). The
increased flow rate compensates for the low concentration of IPA
and allows for highly efficient and low defect drying with a high
drying rate (e.g., 10 mm/sec, resulting in a drying time of 20
seconds for a 200 mm wafer assuming a constant wafer lifting
speed). FIG. 7 is a graph which plots the number of particles
larger than 0.12 microns (so called "adders" in FIG. 3) observed on
wafers dried by gas (nitrogen) having various IPA concentrations
and various flow rates. Results may also vary depending on nozzle
diameter, nozzle spacing from wafer surface, use of and angle of
flow deflectors, etc. Experimental data shows that for a carrier
gas flow rate of 5 liters per minute, the number of defects on
silicon and on low k dielectric containing wafers does not increase
when the concentration of IPA vapor is reduced from 1 percent to
0.2 percent.
[0079] As previously noted, the wafer lifting speed may be reduced
when the lower portion of the wafer W is being dried. Similarly,
the IPA concentration in the IPA/carrier gas mixture may be
increased and/or the flow rate of the IPA/carrier gas mixture may
be increased when the lower portion of the wafer W is being dried.
It will be understood that other inert gases can be employed
instead of nitrogen. Also, it will be understood that IPA can be
replaced with other organic vapors conventionally used for
Marangoni drying, etc.
[0080] While the present invention has been disclosed in connection
with the preferred embodiments thereof, it should be understood
that other embodiments may fall within the spirit and scope of the
invention. Particularly, it will be apparent that the inventive
lifting profile, and the inventive IPA deflector can be used within
any drying system, and are not limited to use within the system
disclosed. Similarly, the use of spray nozzles (underwater and/or
above the water/fluid bath) to rinse a substrate as it enters a
rinsing tank may be employed in systems other than those disclosed
herein. A module having an angled wall with angled wafer guides for
outputting a wafer in a known orientation is considered inventive,
as is a passive output catcher. Further inventive features include
a method and apparatus for transferring a wafer (particularly a
submerged wafer) from a first angle, to a second angle, and a
module adapted to transfer the wafer from one angle to the next so
as to move the wafer from alignment with an input port, to
alignment with an output port. Accordingly, it will be understood
that the embodiments described herein are merely exemplary, and an
inventive apparatus may employ one or more of the inventive
features.
[0081] Some of the inventive features which may be employed
individually are as follows: [0082] a module that combines a
rinsing section and a drying section without having the rinsed
wafer surface exposed to air; [0083] a rinsing section equipped
with submerged and/or overhead spray nozzles for better removal of
surfactant and process tank particles (the overhead sprays
providing the most aggressive rinsing); [0084] a main tank with two
sections to separate the loading and unloading ports; [0085] tubes,
nozzles and/or flow deflectors that precisely deliver IPA vapor
(e.g., to the tip of the meniscus) to minimize IPA consumption;
[0086] IPA spray tubes that can be precisely oriented at the best
angle for supplying IPA to the meniscus; (see U.S. Patent
Application Ser. No. 60/273,786 filed Mar. 5, 2001, titled Spray
Bar, the entire disclosure of which is incorporated herein by this
reference); [0087] a friction-free guide mechanism that employs a
"catcher" mounted on the output station; [0088] a cradle that
simplifies the underwater wafer transfer from the rinsing section
to the drying section; [0089] a variable speed pusher having a lift
velocity profile; [0090] slanted back wall and/or slanted front
wall; [0091] internal overflow weir for tanks having separate input
and output ports; [0092] the enclosed output with laminar air flow;
[0093] a deflector that limits the surface area of fluid exposed to
the drying (e.g., IPA) vapor; [0094] exhaust employing venturi for
diluting organic solvent concentration; [0095] the use of a drying
gas mixture having reduced concentration of organic solvent and
increased flow rate; [0096] a plurality of output wafer supports
for at least partially simultaneous output from dryer and pick up
by a robot; and [0097] a module having a rinsing section and a
section adapted for Marangoni drying, both of which employ spray
mechanisms rather than wafer submersion.
[0098] Compared to a conventional SRD, the inventive apparatus 11
may provide superior performance and a wider process window for
drying both hydrophobic and hydrophilic wafer surfaces. The novel
drying technique based on the "Marangoni" principle may, in one
example, leave only a 3 nm thick layer for evaporation as compared
to a 200 nm layer which may be left by conventional SRDs. By
combining the process module with the output station, the inventive
apparatus may achieve a fast drying speed that may lead to a high
throughput for a wide variety of different films. The rinsing
section spray nozzles also may be capable of removing surfactant
that may be applied to hydrophobic wafers during scrubbing and
transfer to the drying module.
[0099] It should be noted that the nitrogen blanket is merely
exemplary, and a blanket of any inert gas or air or plurality of
gases (including air) can be employed to form a blanket across the
output port and then to deter drying vapors from escaping from the
apparatus. Also, it should be noted that IPA vapor is merely
exemplary, and other vapors or gases that are miscible with the
fluid (that is applied to the drying section) so as to create a
Marangoni flow that dries the wafer surface may be similarly
employed. Accordingly, such vapors or gases will be referred to
herein as drying gases. The terms "catcher," "finger" and "cradle"
as used herein are not intended to be limited to any specific shape
or structure, but rather refer generally to any structure that
functions as do the catcher, finger and cradle described
herein.
[0100] Accordingly, while the present invention has been disclosed
in connection with the preferred embodiments thereof, it should be
understood that other embodiments may fall within the spirit and
scope of the invention, as defined by the following claims.
* * * * *