U.S. patent application number 11/396120 was filed with the patent office on 2006-08-10 for tantalum based crucible.
This patent application is currently assigned to The Fox Group, Inc.. Invention is credited to Heikki I. Helava, Mark G. Ramm.
Application Number | 20060174826 11/396120 |
Document ID | / |
Family ID | 34838331 |
Filed Date | 2006-08-10 |
United States Patent
Application |
20060174826 |
Kind Code |
A1 |
Helava; Heikki I. ; et
al. |
August 10, 2006 |
Tantalum based crucible
Abstract
A crucible is provided that is thermally stable at high
temperatures and is suitable for use in the growth of large, bulk
AlN, Al.sub.xGa.sub.1-xN or other nitride single crystals. The
crucible is comprised of specially treated tantalum. During the
initial treatment, the walls of the crucible are carburized, thus
achieving a crucible that can be subjected to high temperatures
without deformation. Once the carburization of the tantalum is
complete, the crucible undergoes further treatment to protect the
surfaces that are expected to come into contact with nitride vapors
during crystal growth with a layer of TaN. If the crucible is to be
used with a graphite furnace, only the inner surfaces of the
crucible are converted to TaN, thus keeping TaC surfaces adjacent
to the graphite furnace elements. If the crucible is to be used
with a non-graphite furnace, both the inner and outer surfaces of
the crucible are converted to TaN.
Inventors: |
Helava; Heikki I.;
(Piedmont, CA) ; Ramm; Mark G.; (Forest Hills,
NY) |
Correspondence
Address: |
PATENT LAW OFFICE OF DAVID G. BECK
P. O. BOX 1146
MILL VALLEY
CA
94942
US
|
Assignee: |
The Fox Group, Inc.
|
Family ID: |
34838331 |
Appl. No.: |
11/396120 |
Filed: |
March 31, 2006 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
10779203 |
Feb 13, 2004 |
7056383 |
|
|
11396120 |
Mar 31, 2006 |
|
|
|
Current U.S.
Class: |
117/103 |
Current CPC
Class: |
C30B 29/403 20130101;
C30B 23/00 20130101; C30B 35/002 20130101 |
Class at
Publication: |
117/103 |
International
Class: |
C30B 23/00 20060101
C30B023/00; C30B 25/00 20060101 C30B025/00; C30B 28/12 20060101
C30B028/12; C30B 28/14 20060101 C30B028/14 |
Claims
1. A crucible fabricated from tantalum, comprising: a plurality of
interior surfaces; a plurality of exterior surfaces; a tantalum
carbide layer formed on said plurality of interior surfaces and
said plurality of exterior surfaces; and a tantalum nitride layer
formed on said tantalum carbide layer formed on said plurality of
interior surfaces.
2. The crucible of claim 1, wherein a carbon concentration in said
tantalum carbide layer is greater than 0.02 grams per square
centimeter.
3. The crucible of claim 1, wherein said tantalum nitride layer is
approximately 1.5 millimeters thick.
4. A crucible fabricated from tantalum, comprising: a plurality of
interior surfaces; a plurality of exterior surfaces; a tantalum
carbide layer formed on said plurality of interior surfaces and
said plurality of exterior surfaces; and a tantalum nitride layer
formed on said tantalum carbide layer formed on said plurality of
interior surfaces and said plurality of exterior surfaces.
5. The crucible of claim 4, wherein a carbon concentration in said
tantalum carbide layer is greater than 0.02 grams per square
centimeter.
6. The crucible of claim 4, wherein said tantalum nitride layer is
approximately 1.5 millimeters thick.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application is a divisional of U.S. patent application
Ser. No. 10/779,203, filed Feb. 13, 2004, the disclosure of which
is incorporated herein by reference for any and all purposes.
FIELD OF THE INVENTION
[0002] The present invention relates generally to the generation of
monocrystalline nitrides and, more particularly, to the design and
fabrication of a crucible suitable for growing monocrystalline
nitrides.
BACKGROUND OF THE INVENTION
[0003] Aluminum nitride (AlN) is material that has a number of
characteristics (i.e., structural, chemical, thermal and
electrical) that make it an ideal candidate for a variety of
applications including, but not limited to, sensors, light emitting
diodes (LEDs), laser diodes (LDs) and insulating substrates for
high frequency, high power electronics. AIN shares the same
wurtzite crystal structure as GaN, thus epitaxial growth on AlN is
not limited to the c-plane, but can also utilize the a- and
m-planes. As such the polarization effects that are always present
in films grown on c-plane substrates can be avoided by depositing
the epitaxial layers on either the a- or m-plane. Additionally, the
thermal conductivity of AlN is much higher than sapphire and
comparable to that of 6H--SiC. Furthermore, AlN is chemically
stable under Al ,Ga.sub.1-xN epitaxial growth conditions, thus
allowing uncontaminated layers to be grown. One of this material's
most interesting characteristics is its surface acoustic wave (SAW)
velocity which is the highest ever reported. As such, it is an
excellent candidate for both piezoelectric and SAW devices.
[0004] The inability to realize all of the benefits offered by AlN
is largely due to the unavailability of bulk single crystals with a
diameter of at least 2 inches. The most commonly used method to
produce AlN single crystals is the sublimation method which
utilizes vapor-phase crystallization of an evaporated solid source.
The primary difficulty encountered during the growth of AlN results
from the strong reaction between the crucible material and the AlN
vapors at high temperatures. This problem is exacerbated due to
long growth cycles such as those required to grow large crystals,
and due to the desired high growth temperatures.
[0005] High growth temperatures, for example temperatures in excess
of 2200.degree. C., provide the higher growth rates that are
desirable for the growth of large, bulk AlN crystals. Additionally,
the use of high growth temperatures helps reduce the thermal stress
in the AlN crystals since such temperatures permit the use of
smaller temperature gradients. By reducing thermal stress in the
growing crystal, crystalline defects can be minimized. High growth
temperatures also allow the aluminum and nitrogen atoms to locate
in the best equilibrium lattice positions since surface adatom
mobilities increase with temperature.
[0006] The most common refractory material used to grow AlN is
graphite. It is relatively inexpensive and easy to mechanically
process. Due to the electrical properties of graphite, it can be
used in growth systems utilizing either resistance or RF heating.
Unfortunately graphite does not have sufficient thermal stability
to be used at temperatures greater than 1000.degree. C.
Furthermore, as a result of graphite's thermal instability,
graphite crucibles degrade rapidly, often resulting in changes in
the heat field distribution within the growth cell and unstable
growth parameters. To counter this effect, growth cycles may be
conducted in an inert atmosphere (e.g., argon, helium). However
even under these growth conditions there are sufficient aluminum
and nitrogen vapors to react with the graphite, leading to the
graphite crucible's deterioration and ultimately its failure.
Another disadvantage of graphite is that even the purest grades of
graphite exhibit high impurity concentrations (e.g., boron,
aluminum, nickel, chromium, copper, etc.) that affect the
electrical properties and overall quality of the grown crystal.
[0007] Tantalum carbide (TaC) is another material that researchers
have tried to use to grow AlN crystals. TaC crucibles have been
used quite favorably to grow silicon carbide (SiC) crystals, in
part because carbon is a constituent of both SiC and the crucible.
If a TaC crucible is used to grow AlN crystals, however, the
nitrogen vapors formed by the evaporating AlN source interact with
the TaC crucible, resulting in nitrogen substituting for the carbon
in the crucible and the vapor phase becoming doped with carbon. As
the substitution process is most intense during the initial stages
of growth, and as the initial stages of growth define the quality
of the growing crystal, it is virtually impossible to grow a high
quality AlN crystal with a TaC crucible.
[0008] Accordingly, what is needed in the art is a method that
allows high quality, large diameter AlN single crystals to be
grown. The present invention provides a crucible suitable for
growing such crystals as well a method of manufacturing the
same.
SUMMARY OF THE INVENTION
[0009] The present invention provides a method and apparatus for
growing large, bulk AlN, Al.sub.xGa.sub.1-xN or other nitride
single crystals at high temperatures. In particular, a crucible is
provided that is thermally stable at high temperatures and does not
react strongly with AlN vapors. As a result of the allowable high
growth temperatures, crystalline defects in the as-grown material
are minimized.
[0010] In accordance with the invention, the desired source (e.g.,
AlN) and a seed crystal of the desired polytype are co-located
within the crucible. The separation distance depends on the
material to be grown; for an AlN source the distance separating the
evaporating surface of the source and the growing surface is
comparable to the track length of an AlN molecule. The growth zone
is defined by the substantially parallel surfaces of the source and
the seed in combination with the sidewalls of the crucible.
[0011] In further accordance with the invention, the crucible is
comprised of tantalum that has been specially treated. During the
initial treatment, the walls of the crucible are carburized, thus
achieving a crucible that can be subjected to high temperatures
without deformation. Once the carburization of the tantalum is
complete, the crucible undergoes further treatment to protect the
surfaces that are expected to come into contact with the nitride
vapors (e.g., AlN) during crystal growth with a layer of TaN. If
the crucible is to be used with a graphite furnace, only the inner
surfaces of the crucible are converted to TaN, thus keeping TaC
surfaces adjacent to the graphite furnace elements. If the crucible
is to be used with a non-graphite furnace, both the inner and outer
surfaces of the crucible are converted to TaN.
[0012] The crucible is initially fabricated from tantalum that is
preferably at least 99.9 percent pure. Once the crucible is shaped,
it undergoes a series of processing steps to clean the surfaces and
remove surface contaminants. A thin, near-surface layer of Ta--C is
then formed and annealed, resulting in a surface that will not
interact with carbon particles. Lastly the crucible is annealed in
a nitrogen environment to convert the desired surfaces (i.e., inner
or inner/outer crucible surfaces) to TaN.
[0013] A further understanding of the nature and advantages of the
present invention may be realized by reference to the remaining
portions of the specification and the drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0014] FIG. 1 is a cross-sectional view of a crucible according to
the invention;
[0015] FIG. 2 illustrates one seed mounting method for use with the
crucible shown in FIG. 1;
[0016] FIG. 3 is a cross-sectional view of a crucible for use with
a graphite heating system;
[0017] FIG. 4 is a cross-sectional view of a crucible for use with
a non-graphite heating system;
[0018] FIG. 5 illustrates the methodology of preparing a crucible
suitable for use with a graphite heating system;
[0019] FIG. 6 illustrates the crucible set-up during TaN conversion
of inner crucible surfaces;
[0020] FIG. 7 illustrates the crucible set-up during TaN conversion
of inner and outer crucible surfaces;
[0021] FIG. 8 illustrates the methodology of preparing a crucible
suitable for use with a non-graphite heating system; and
[0022] FIG. 9 is an illustration of a growth furnace that can be
used with either embodiment of the crucible of the present
invention.
DESCRIPTION OF THE SPECIFIC EMBODIMENTS
[0023] FIG. 1 is a cross-sectional view of a crucible 100 in
accordance with the invention for use in growing AlN,
Al.sub.xGa.sub.1-xN or other nitride crystals using the sublimation
technique. The crucible includes a main portion 101 and a lid
portion 103. In the preferred embodiment and assuming that the
crystal to be grown is to be comprised of AlN, an AlN source 105 is
located on the bottom of crucible portion 101 and a seed crystal
107 is mounted to the inner surface of crucible lid 103, the growth
surface of seed crystal 107 and the surface of source 105 being
substantially parallel to one another. Alternately, source 105 can
be mounted to the inner surface of crucible lid 103 and the seed
crystal 107 located on the bottom of crucible portion 101. In order
to prevent the loss of the source material due to precipitation of
source vapors outside of the growth surface, preferably the inner
dimensions of crucible 100 in general, and crucible sidewalls 109
in particular, do not exceed the dimensions of axial growth zone
111. If the inner dimensions of sidewalls 109 do exceed the
dimensions of axial growth zone 111, preferably it is by a minor
amount. Preferably the distance between the evaporating surface of
source 105 and the growing surface of seed crystal 107 is not much
in excess of the track length of an AlN molecule, assuming that the
material to be grown is AlN. This configuration enhances the
crystal growth rate as the precipitation of source vapors outside
of the seed crystal growth surface is minimized.
[0024] If the crystal to be grown in crucible 100 is to be
comprised only of AlN and brought about only by the mass transport
of AlN vapors from the source to the seed, preferably crucible
portion 101 and lid portion 103 are vacuum sealed, thus allowing
the vapor phase composition within the growth zone to remain close
to stoichiometric. Alternately, the crucible may remain unsealed
but maintained within a nitrogen environment sufficient to keep the
vapor composition within the crucible close to stoichiometric.
Alternately, the crucible may be sealed and maintained within a
nitrogen environment, thus insuring that if the crucible has a leak
due to a failed seal, a close to stoichiometric composition can be
maintained.
[0025] FIG. 1 shows a single seed 107. It will be appreciated that
the invention is not limited to the use of a single seed and in
fact multiple seeds can be used. If multiple seed crystals are
used, preferably their growth surfaces are located within the same
plane and are parallel to the evaporating surface of source
105.
[0026] It will be appreciated that there are many methods known by
those of skill in the art for mounting seed crystal 107 within
crucible 100. FIG. 2 illustrates one mounting method in which a
seed holder 201 is located within the crucible. Preferably seed
holder 201 is comprised of tantalum that has been treated to form
TaN surfaces as described in detail below relative to crucible
100.
[0027] Crucible 100 is comprised of tantalum (Ta) that has been
treated to alter the crucible's surface characteristics. The exact
treatment used to alter the crucible's surface characteristics and
the final structure depends on the type of furnace that is to be
used with the crucible. Preferably if a graphite heating system
will be used with the crucible, the crucible is sealed during use
and treated so that the inner crucible walls 301 that will be
exposed to components of AlN vapor during the growth process are
comprised of TaN (see FIG. 3). Exterior crucible walls 303 which
will be adjacent to elements of the graphite heating system are
comprised of TaC. Preferably if a non-graphite heating system will
be used, an alternate crucible design is used in which both the
inner and exterior crucible walls 401 are comprised of TaN (see
FIG. 4). In this configuration it is less important to seal the
crucible during use.
[0028] As a result of converting the surfaces in contact with AlN
vapor to TaN, the ability of the surface to absorb AlN vapors as
the monocrystalline AlN is grown are significantly impacted.
Consequently, during crystal growth the vapor-phase composition
within the crucible is close to stoichiometric. Additionally, the
portions of the crucible comprised of TaC are able to withstand the
operating temperatures required to grow the AlN single crystal
without deforming or otherwise failing.
[0029] FIG. 5 illustrates the primary steps in preparing a crucible
such as the one shown in FIG. 3. Initially crucible 100 is
fabricated from metallic tantalum (step 501), the metal being at
least 99.9 percent pure and of any suitable shape (e.g., rod,
rolled, etc.). It is understood that the shape of crucible 100 is
not limited to the shape shown in FIGS. 1-4. Once the crucible has
been shaped, for example using standard machining processes, it is
initially cleaned with standard organic solvents (step 503). An
acid solution is then used to remove metallic remnants left on the
surface after crucible shaping (step 505). Preferably in this step
the crucible is boiled for 30 minutes in a pre-heated acid solution
comprised of a 3:1 mixture of HCl and HNO.sub.3. Preferably the
crucible is then etched in a room temperature 1:1 mixture of
HNO.sub.3 and HF for approximately 20 to 30 seconds (step 507).
This etching step must be short to insure that the etchant does not
damage the surface finish quality of the crucible. After etching,
the crucible is washed in distilled or deionized boiling water,
preferably for at least 10 minutes with the water being changed at
least three times during the process (step 509). Once the cleaning
is complete, the crucible is dried (step 511).
[0030] After the crucible has been fabricated and the surfaces
cleaned, preferably following the above-described process, the
crucible is processed in carbon containing vapor in order to form a
thin, near-surface layer of Ta--C. Preferably the carbon processing
follows the following steps. Although the crucible can be annealed
at a pressure of 10.sup.-1 Torr or less in carbon containing vapor,
preferably the crucible is annealed at a pressure of 10.sup.-3 Torr
or less in graphite that is at least 99.99 percent pure (step 513).
In the latter process, the crucible is placed entirely within a
graphite container filled with graphite powder. Preferably a
step-wise annealing process is used to avoid crucible deformation
or cracking. Assuming that the crucible is annealed in graphite,
the annealing furnace is first evacuated to the best possible
vacuum, typically on the order of 10.sup.-3-10.sup.-4 Torr, and the
crucible is annealed at a temperature of between about 800.degree.
and 1000.degree. C. for at least one hour and more preferably two
hours. The annealing temperature is then raised to a temperature of
between about 1500.degree. and 1600.degree. C. and the crucible is
annealed for at least one hour and more preferably three hours. The
annealing temperature is then raised again to a temperature of
approximately 2000.degree. in argon at about 10.sup.-1 Torr for two
hours and more preferably three hours.
[0031] As a result of this annealing process, a thin near-surface
layer comprised of Ta--C carbides is formed on the entire surface
of the crucible. The depth of the carbon saturated layer is
approximately 500-700 microns assuming the crucible is formed of
materials prepared by powder metallurgy. Note that if the crucible
is formed of material prepared by vacuum melting or metal rolling,
the carbon penetration level is considerably less (i.e.,
approximately 5 to 30 microns with the above process). The greater
penetration depth for materials prepared by powder metallurgy is
due to accelerated diffusion along grain boundaries. Accordingly,
the inventors have found that the quality of the carbide layer as
well as the boundary between the metal and the carbide is governed
by the technique used to fabricate the tantalum used in the
crucible (e.g., powder metallurgy, rolled metal, vacuum melting,
etc.).
[0032] After formation of the carbide layer, the crucible is
subjected to further temperature processing (step 515), thus
assuring that the layer protects the surface of the crucible from
interaction with carbon particles. During this processing step the
crucible is placed in graphite powder in an argon atmosphere, the
graphite powder being at least 99.99 percent pure with a grain size
of less than 100 microns and the argon being at least 99.999
percent pure. An annealing temperature of between 2500 .degree. and
2600.degree. C. is used with an annealing time of at least 2 hours.
The annealing time is governed by the thickness of the crucible.
After completion of the annealing process the crucible is cooled to
room temperature at a cooling rate of less than 20.degree. C. per
minute (step 517). Additionally, during each annealing step the
temperature variation across the surface of the crucible should be
less than 20.degree. C. After all stages of annealing are complete,
the amount of carbon that has penetrated into the tantalum crucible
surfaces should be more than 0.02 grams per square centimeter.
[0033] Assuming that the crucible is to be used in a graphite
heating system, as previously noted the inner surfaces of the
crucible must be converted to TaN (e.g., FIG. 3). The first step in
converting the inner surfaces to TaN is to place the crucible 601
in a graphite container 603 as illustrated in FIG. 6 (step 519).
The crucible and graphite container are then placed in a furnace
605 (step 521) and the furnace is evacuated down to a pressure of
at least 10.sup.-5 Torr (step 523). After back-filling the furnace
with nitrogen to a pressure of 500-600 Torr (step 525), the TaC
crucible is then sealed (step 527) resulting in nitrogen being
sealed within the crucible. The furnace is once again evacuated to
a pressure of at least 10.sup.-5 Torr (step 529) and then heated to
a temperature of approximately 1500.degree. C. (step 531). During
the heating step, the furnace is continually pumped, preferably to
a pressure of at least 10.sup.-4 Torr, thereby removing any
nitrogen from the volume surrounding the crucible/container. This
step is preferably performed for an hour.
[0034] The next step is to back-fill the furnace with an inert gas,
preferably argon, to a pressure of approximately 650 Torr (step
533). The furnace temperature is then raised to approximately
1800.degree. C. (step 535), this step performed for approximately
two hours. After completion of this stage of the processing, the
inner surface of crucible is converted to TaN, typically to a depth
of approximately 30-40 microns.
[0035] During the above process, typically a portion of the
nitrogen sealed within the crucible escapes due to an imperfect
seal. Even if nitrogen does not escape from the crucible, it
becomes contaminated due to desorption of carbon and other
impurities off the inner walls of the container. Accordingly, the
nitrogen charge within the crucible is preferably replenished. To
do so, the furnace heaters are first turned off (step 537). Then
after the crucible and graphite container have cooled, the graphite
container and the crucible lid are opened (step 539) and the system
evacuated to as low a pressure as possible, preferably to at least
10.sup.-4 Torr and more preferably to at least 10.sup.-5 Torr (step
541). The system is then back-filled with nitrogen, preferably to a
pressure of 500-600 Torr (step 543), and the TaC crucible is
resealed (step 545). The furnace is then evacuated to a pressure of
at least 10.sup.-5 Torr (step 547) and then heated for
approximately 4 hours at a temperature of approximately
2200.degree. C. (step 549). As before, during the heating step the
furnace is continually pumped. After this stage of processing the
converted TaN has a depth of approximately 500-700 microns.
[0036] In preparation for a last conversion step, the furnace
heaters are again turned off (step 551), the graphite container and
the crucible are opened after cool down (step 553) and the system
is evacuated to as low a pressure as possible, preferably to at
least 10.sup.-4 Torr and more preferably to at least 10.sup.-5 Torr
(step 555). The system is then back-filled with nitrogen,
preferably to a pressure of 500-600 Torr (step 557), and the TaC
crucible is once again resealed (step 559). The furnace is then
evacuated to a pressure of at least 10.sup.-5 Torr (step 561) and
then heated for approximately 6 hours at a temperature of
approximately 2400.degree. C. (step 563). As before, during the
heating step the furnace continues to be pumped. After this stage
of processing, the converted TaN has a depth of approximately 1.5
millimeters. The heaters are then turned off and the crucible
allowed to cool (step 565). The crucible, now of the structure
shown in FIG. 3, is ready to be used to grow AlN, Al ,Ga.sub.1-xN
or other nitride crystals.
[0037] If the crucible is to be used in a non-graphite furnace, the
crucible is prepared as described below and illustrated in FIGS. 7
and 8. Initially, the steps to prepare this crucible are the same
as those used to prepare a crucible for use in a graphite furnace.
However, after the surfaces of the crucible have converted to
Ta--C, the processing steps are different. This difference is
because the goal of this process is to convert both the inner and
outer surfaces of the crucible to TaN. Accordingly, the TaC
crucible 701 and crucible lid 701 are not placed within a graphite
container. Rather, the TaC crucible and lid are placed directly
into furnace 605 (step 801) and the furnace is evacuated down to a
pressure of at least 10.sup.-5 Torr (step 803). Note that although
the crucible lid may be placed on the crucible, it is not
hermetically sealed to the crucible, thus allowing the pressure
within the container to be the same as that in the surrounding
volume (within the furnace).
[0038] The furnace is then back-filled with nitrogen to a pressure
of 500-600 Torr (step 805) and heated to a temperature of
approximately 1500.degree. C. (step 807) for approximately one
hour. Next, the furnace is evacuated (step 809) and then
back-filled with an inert gas, preferably argon, to a pressure of
approximately 650 Torr (step 811). The furnace temperature is then
raised to approximately 1800.degree. C. (step 813) and held at that
temperature for approximately two hours. After completion of this
stage of the processing, the inner and outer surfaces of the
crucible are converted to TaN, typically to a depth of
approximately 30-40 microns.
[0039] The first step of the next stage of processing is to
evacuate the furnace to as low a pressure as possible, preferably
to at least 10.sup.-4 Torr and more preferably to at least
10.sup.-5 Torr (step 815). The system is then back-filled with
nitrogen, preferably to a pressure of 500-600 Torr (step 817), and
then heated for approximately 4 hours at a temperature of
approximately 2200.degree. C. (step 819). After this stage of
processing, the converted TaN has a depth of approximately 500-700
microns. Preferably prior to the last stage of treatment, the
system is evacuated (step 821), thus eliminating possible sources
of contamination. Then the system is back-filled with nitrogen,
preferably to a pressure of 500-600 Torr (step 823), and then
heated for approximately 6 hours at a temperature of approximately
2400.degree. C. (step 825). After this stage of processing, the
converted TaN has a depth of approximately 1.5 millimeters. The
heaters are then turned off and the crucible allowed to cool (step
827). The crucible, now of the structure shown in FIG. 4, is ready
to be used to grow AlN, Al.sub.xGa.sub.1-xN or other nitride
crystals.
[0040] FIG. 9 is an illustration of a growth furnace that can be
used with either embodiment of the crucible of the present
invention. It will be appreciated that the current invention is not
limited to use with this particular furnace. Furnace 900 is a
double-walled, quartz, water-cooled induction heated reactor with
an operational temperature of up to 2500.degree. C. with a graphite
heater, and up to 2700.degree. C. with a tantalum or tungsten
heater. Furnace 900 is designed for operation at up to 10.sup.-5
Torr, preferably with either an inert or nitrogen atmosphere. This
furnace includes two separate and independent vacuum volumes, 901
and 903, separated by tube 905. Volume 901 includes the growth zone
while volume 903 accommodates the heating and thermoinsulation
components. Tube 905 is preferably comprised of either tantalum or
tungsten. Bellows 907 compensates for thermal expansion of tube
905. Crucible 909 is held in place within volume 901 using crucible
holder 911. This design also includes a manipulator 913 for use in
sealing and opening crucible 909.
[0041] As will be understood by those familiar with the art, the
present invention may be embodied in other specific forms without
departing from the spirit or essential characteristics thereof.
Accordingly, the disclosures and descriptions herein are intended
to be illustrative, but not limiting, of the scope of the invention
which is set forth in the following claims.
* * * * *