U.S. patent application number 11/364347 was filed with the patent office on 2006-07-06 for appartus and method for forming pattern.
This patent application is currently assigned to TOSHIBA MACHINE CO., LTD.. Invention is credited to Ryoichi Hirano, Satoshi Imura, Noriaki Nakayamada.
Application Number | 20060147822 11/364347 |
Document ID | / |
Family ID | 27603602 |
Filed Date | 2006-07-06 |
United States Patent
Application |
20060147822 |
Kind Code |
A1 |
Hirano; Ryoichi ; et
al. |
July 6, 2006 |
Appartus and method for forming pattern
Abstract
A pattern forming apparatus includes a drawing chamber having a
drawing substrate on which an original pattern is drawn, a first
temperature control unit having a first temperature regulator to
make the temperature of the drawing chamber constant, and a
constant-temperature member arranged near the drawing substrate.
The pattern forming apparatus further includes a second temperature
control unit having a second temperature regulator. The second
temperature control unit is configured to control the set
temperature of the constant-temperature member independently such
that the temperature of the drawing substrate becomes substantially
constant when the original pattern is drawn.
Inventors: |
Hirano; Ryoichi; (Tokyo,
JP) ; Imura; Satoshi; (Shizuoka-shi, JP) ;
Nakayamada; Noriaki; (Shizuoka-ken, JP) |
Correspondence
Address: |
PILLSBURY WINTHROP SHAW PITTMAN, LLP
P.O. BOX 10500
MCLEAN
VA
22102
US
|
Assignee: |
TOSHIBA MACHINE CO., LTD.
Tokyo
JP
KABUSHIKI KAISHA TOSHIBA
Tokyo
JP
|
Family ID: |
27603602 |
Appl. No.: |
11/364347 |
Filed: |
March 1, 2006 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
10329514 |
Dec 27, 2002 |
7036980 |
|
|
11364347 |
Mar 1, 2006 |
|
|
|
Current U.S.
Class: |
430/30 ;
430/330 |
Current CPC
Class: |
G03F 1/78 20130101; B82Y
40/00 20130101; H01J 2237/2001 20130101; B82Y 10/00 20130101; Y10S
430/143 20130101; H01J 37/3174 20130101; H01J 2237/304
20130101 |
Class at
Publication: |
430/030 ;
430/330 |
International
Class: |
G03F 7/00 20060101
G03F007/00 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 27, 2001 |
JP |
2001-398013 |
Claims
1. A pattern forming method comprising: measuring a temperature of
a dummy substrate, which is included in a drawing chamber whose
temperature is made constant by a first temperature control unit,
using a first temperature measuring device when an original pattern
is drawn on the dummy substrate while the dummy substrate is
varying in position; computing temperature distribution of the
dummy substrate based on the temperature measured by the first
temperature measuring device; and controlling a second temperature
control unit based on the temperature distribution, the second
temperature control unit being configured to control a set
temperature of a constant-temperature member independently of a
temperature of the drawing chamber when the original pattern is
drawn on a drawing substrate, and the constant-temperature member
being arranged near the drawing substrate.
2. The pattern forming method according to claim 1, wherein the
controlling includes controlling the constant-temperature member
such that the constant-temperature member is set at a constant set
temperature.
3. The pattern forming method according to claim 1, further
comprising supplying a correction value to drawing data to draw the
original pattern using an energy beam optical system based on the
temperature measured by the first temperature measuring device.
4. A pattern forming method comprising: measuring a temperature of
a drawing substrate, which is included in a drawing chamber whose
temperature is made constant by a first temperature control unit,
using a second temperature measuring device when an original
pattern is drawn on the drawing substrate; and controlling a second
temperature control unit based on the temperature measured by the
second temperature measuring device, the second temperature control
unit being configured to control a set temperature of a
constant-temperature member independently of a temperature of the
drawing chamber when the original pattern is drawn on the drawing
substrate while the drawing substrate is varying in position, and
the constant-temperature member being arranged near the drawing
substrate.
5. The pattern forming method according to claim 4, wherein the
controlling includes controlling the set temperature of the
constant-temperature member in accordance with the temperature of
the drawing substrate.
6. The pattern forming method according to claim 4, further
comprising supplying a correction value to drawing data to draw the
original pattern using an energy beam optical system based on the
temperature measured by the second temperature measuring device.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a divisional of co-pending U.S.
application Ser. No. 10/329,514, filed Dec. 27, 2002, and to which
priority is claimed under 35 U.S.C. .sctn.121. This application is
based upon and claims the benefit of priority under 35 U.S.C.
.sctn. 119 from the prior Japanese Patent Application No.
2001-398013, filed Dec. 27, 2001, the entire contents of both
applications are incorporated herein by reference in their
entireties. the entire contents of which are incorporated herein by
reference.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates to a pattern forming apparatus
and a pattern forming method. More specifically, the invention
relates to an apparatus and a method for manufacturing a reticle
(or a mask) on which at least one original pattern is drawn.
[0004] 2. Description of the Related Art
[0005] Recently, the circuit trace widths required for
semiconductor devices have become narrower and narrower as an LSI
(Large Scale Integrated Circuit) increases in packing density and
capacity. This type of semiconductor device is conventionally
fabricated by transferring several tens of kinds of original
patterns with a desired circuit pattern from a reticle aligned with
high precision to an exposure domain on a wafer.
[0006] Step-and-repeat equipment including a highly precise optical
system and a highly precise X-Y stage is used for the transfer of
the original patterns. The wafer is fixed on the X-Y stage so that
its whole surface can be exposed with the original patterns, and
moved relative to the optical system by step and repeat. Therefore,
the step-and-repeat equipment is also referred to as a stepper.
[0007] The original pattern on the reticle is drawn on a glass
substrate that is finished with high precision and formed as a
chromium (Cr) pattern through an etching process and the like.
Chromium (Cr) is usually vapor-deposited on one side of the glass
substrate and resist is applied uniformly on the chromium (Cr).
When the chromium (Cr) pattern is formed, the glass substrate is
irradiated with an energy beam (electron beam) from an energy beam
optical system. The resist-coated surface of the glass substrate is
entirely scanned with a beam spot corresponding to design (drawing)
data. Thus, an arbitrary chromium (Cr) pattern is formed by
controlling chromium (Cr) etching according to the place of the
substrate, using the resist deteriorated at the time of the scan.
The chromium (Cr) pattern is formed by combining the narrowed beam
spots into one original pattern. It is thus possible to draw a fine
original pattern with high precision by controlling the positions
of the beam spots accurately.
[0008] It has been said that the old stepper cannot resolve an
original pattern of 1 micron or less in terms of the wavelength
limit of light. The present stepper can resolve a fine original
pattern of the order of submicron because of the improvement in
optical and illumination systems and the appearance of a phase
shift mask that controls the phase of light on a reticle.
[0009] If, however, the glass substrate varies in temperature
during the drawing of a fine original pattern on the glass
substrate, it expands and contracts. During the drawing, the glass
substrate is fixed on a drawing stage whose position is controlled
precisely. The control of a place of the glass substrate for
drawing an original pattern is performed on the basis of the
measured values of a laser interferometer. However, the laser
interferometer cannot sense the expansion or contraction of the
glass substrate under drawing. If, therefore, the temperature of
the glass substrate changes during the drawing, a positional error
occurs in the drawn original pattern. The glass substrate is made
chiefly of synthetic quartz. The coefficient a of linear expansion
of synthetic quartz is 0.4.times.10.sup.-6. Assuming that the
temperature of the glass substrate under drawing changes one degree
(1.degree. C.), a distance of 130 mm between two points on the
glass substrate changes 52 nm
(=130.times.10.sup.6.times.1.times..alpha.). This change is
considered to be a positional error over a place for drawing the
original pattern. In other words, it is necessary to always keep
the temperature of the glass substrate under drawing constant.
[0010] To resolve the above problem, conventionally,
constant-temperature water whose temperature is regulated with high
accuracy is caused to flow near a drawing chamber including a
drawing stage, and the temperature of the drawing chamber is
regulated to stabilize the temperature of the glass substrate.
However, various machine parts are arranged around the glass
substrate. For example, an electrooptic barrel, which irradiates a
glass substrate with an electron beam, generates heat with electric
power that drives a coil. This heat generation is one of causes to
vary the temperature of the glass substrate. In order to eliminate
this problem, the temperature of constant-temperature water has to
be regulated quickly in accordance with temperature variations of
the glass substrate. Since, however, the above machine parts are
very heavy, their follow-up characteristic to the temperature
variations of the constant-temperature water is extremely poor.
Moreover, the machine parts are heat generation sources and the
amounts of heat to be generated vary from part to part. Thus, the
influence upon the glass substrate on which an original pattern is
to be formed varies from place to place. As described above, it is
very difficult to keep the temperature of the glass substrate under
drawing constant even though the temperature of the drawing chamber
is simply regulated.
BRIEF SUMMARY OF THE INVENTION
[0011] A first object of the present invention is to provide a
pattern forming apparatus that is capable of keeping the
temperature of a drawing substrate more constant when an original
pattern is drawn on the drawing substrate and also capable of
drawing a fine original pattern with high precision.
[0012] A second object of the present invention is to provide a
pattern forming method that is capable of keeping the temperature
of a drawing substrate more constant when an original pattern is
drawn on the drawing substrate and also capable of drawing a fine
original pattern with high precision.
[0013] In order to attain the first object, a pattern forming
apparatus according to one aspect of the present invention
comprises: a drawing chamber including a drawing substrate on which
an original pattern is drawn; a first temperature control unit
having a first temperature regulator, the first temperature control
unit being configured to make a temperature of the drawing chamber
constant; a constant-temperature member arranged near the drawing
substrate; and a second temperature control unit having a second
temperature regulator, the second temperature control unit being
configured to control a set temperature of the constant-temperature
member independently such that a temperature of the drawing
substrate becomes substantially constant when the original pattern
is drawn.
[0014] In order to attain the second object, a pattern forming
method according to another aspect of the present invention
comprises: measuring a temperature of a dummy substrate, which is
included in a drawing chamber whose temperature is made constant by
a first temperature control unit, using a first temperature
measuring device when an original pattern is drawn on the dummy
substrate while the dummy substrate is varying in position;
computing temperature distribution of the dummy substrate based on
the temperature measured by the first temperature measuring device;
and controlling a second temperature control unit based on the
temperature distribution, the second temperature control unit being
configured to control a set temperature of a constant-temperature
member independently of a temperature of the drawing chamber when
the original pattern is drawn on a drawing substrate, and the
constant-temperature member being arranged near the drawing
substrate.
[0015] In order to attain the second object, a pattern forming
method according to still another aspect of the present invention
comprises: measuring a temperature of a drawing substrate, which is
included in a drawing chamber whose temperature is made constant by
a first temperature control unit, using a second temperature
measuring device when an original pattern is drawn on the drawing
substrate; and controlling a second temperature control unit based
on the temperature measured by the second temperature measuring
device, the second temperature control unit being configured to
control a set temperature of a constant-temperature member
independently of a temperature of the drawing chamber when the
original pattern is drawn on the drawing substrate while the
drawing substrate is varying in position, and the
constant-temperature member being arranged near the drawing
substrate.
[0016] According to the pattern forming apparatus and pattern
forming method described above, the temperature of the glass
substrate on which an original pattern is drawn can be controlled
with high precision, independently of the temperature of the
drawing chamber. Thus, the follow-up characteristic to the
temperature variations of constant-temperature water can greatly be
improved.
BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING
[0017] FIG. 1 is a block diagram showing a configuration of a
reticle manufacturing apparatus as an example of a fine pattern
forming apparatus according to a first embodiment of the present
invention;
[0018] FIG. 2 is a cross-sectional view taken along line II-II of
FIG. 1;
[0019] FIG. 3A is a graph of the distribution of temperature before
the temperature of a dummy mask used in the reticle manufacturing
apparatus becomes constant;
[0020] FIG. 3B is a graph showing the distribution of temperature
after the temperature of the dummy mask becomes constant; and
[0021] FIG. 4 is a block diagram showing a configuration of a
reticle manufacturing apparatus according to a second embodiment of
the present invention.
DETAILED DESCRIPTION OF THE INVENTION
[0022] Embodiments of the present invention will now be described
with reference to the accompanying drawings.
First Embodiment
[0023] FIGS. 1 and 2 show an example of a configuration of a fine
pattern forming apparatus according to a first embodiment of the
present invention. In the first embodiment, a reticle manufacturing
apparatus for drawing an original pattern on a glass substrate to
manufacture a reticle is taken as an example of the fine pattern
forming apparatus. The apparatus includes a drawing chamber 11, and
the drawing chamber 11 has a circulation path 12 through which the
temperature-controlled first constant-temperature water (coolant)
13 circulates in the up and down, right and left, and forward and
backward walls of the drawing chamber 11. The temperature of the
first constant-temperature water 13 is regulated (controlled) with
high precision by a first temperature regulator 15. The first
temperature regulator 15 makes up a first temperature control unit,
together with a main control circuit 47 (described later).
[0024] The drawing chamber 11 contains an X-Y stage (drawing stage)
21. The X-Y stage 21 holds a glass substrate (not shown) serving as
a drawing substrate on which an original pattern is drawn. The X-Y
stage 21 is freely moved and driven in X and Y directions by a
drive unit 23. The position of the X-Y stage 21 is precisely
measured by a laser interferometer 25.
[0025] The above glass substrate is formed by vapor-depositing
chromium (Cr) on one side of glass raw material such as synthetic
quartz and then applying resist thereon uniformly. The
resist-applied surface of the glass substrate is irradiated with an
electron beam B from an electron beam optical system 27 serving as
an energy beam optical system and the whole surface of the glass
substrate is scanned with a beam spot corresponding to drawing
data. Thus, an arbitrary chromium (Cr) pattern is formed by
controlling chromium (Cr) etching according to a place of the glass
substrate, using the resist that deteriorated on the occasion of
the scan. Therefore, a reticle is manufactured in which an original
pattern corresponding to at least a desired circuit pattern is
drawn on the glass pattern.
[0026] In the drawing chamber 11, a constant-temperature member 31
is arranged opposite to the glass substrate. The
constant-temperature member 31 covers the end portion of the
electron beam optical system 27 and has a hole 31a through which
the electron beam B emitted from the end portion of the system 27
passes. The constant-temperature member 31 also has a circulation
path 32 through which second constant-temperature water (coolant)
33, which is temperature-controlled with high precision, circulates
in the wall opposed to at least the glass substrate. The
temperature of the second constant-temperature water 33 is
controlled (regulated) by a second temperature regulator 35 that is
provided separately from the first temperature regulator 15. The
second temperature regulator 35 makes up a second temperature
control unit, together with a main control circuit 47 (described
later).
[0027] In the reticle manufacturing apparatus according to the
first embodiment, the constant-temperature member 31 is provided
near the glass substrate and its temperature can be controlled
independently of that of the drawing chamber 11. When an original
pattern is drawn on the glass substrate, the temperature of the
second constant-temperature water 33 flowing in the
constant-temperature member 31 is regulated by the second
temperature regulator 35 with high precision. Thus, the follow-up
characteristic of the second constant-temperature water 33 to
temperature variations in the glass substrate can greatly be
improved. Therefore, the glass substrate under drawing can be
maintained at an almost constant temperature more easily than when
the temperature of the glass substrate is stabilized only by the
drawing chamber 11. Consequently, a fine original pattern can be
drawn with high precision.
[0028] The temperature of the second constant-temperature water 33
is regulated using a dummy mask (dummy substrate) 41 as shown in
FIG. 1. The dummy mask 41 is made of the same material as that of
the glass substrate and formed in substantially the same shape as
that of the glass substrate. Moreover, the dummy mask 41 includes a
thermometer (first temperature measuring device) 41a. As will be
described later, the thermometer 41a measures the temperature of
the dummy mask 41 when an original pattern is drawn on the dummy
mask 41, as in the case where an original pattern is actually drawn
on the glass substrate. In this case, not only the temperature of
an arbitrary portion of the dummy mask 41 can be measured, but also
a temperature variation of the dummy mask 41 due to the movement of
the X-Y stage 21 (a temperature difference due to the variation in
position) can be measured by measuring the temperature of the dummy
mask 41 while moving the X-Y stage 21.
[0029] The above reticle manufacturing apparatus includes a storage
circuit 43, a computing circuit 45 serving as an arithmetic
circuit, and a main control circuit 47. The storage circuit 43
stores measurement results obtained by the thermometer 41a. For
example, it stores the temperature of the dummy mask 41 held on the
X-Y stage 21 when the original pattern is actually drawn on the
dummy mask 41. The storage circuit 43 is supplied with the
measurement results from the thermometer 41a through wiring 21b in
a supporting arm 21a of the X-Y stage 21. The computing circuit 45
computes the distribution of temperature varied with the movement
of the dummy mask 41 based on the measurement results of the
temperature of the dummy mask 41 stored in the storage circuit 43.
The main control circuit 47 controls the first and second
temperature regulators 15 and 35 based on the above temperature
distribution computed by the computing circuit 45.
[0030] The above-described reticle manufacturing apparatus includes
a drawing control circuit 49 which supplies a correction value to
drawing data for drawing an original pattern with the electron beam
optical system 27 when the needed arises. For example, the drawing
control circuit 49 corrects the drawing data based on the
measurement results of the temperature of the dummy mask 41 stored
in the storage circuit 43.
[0031] An operation of drawing an original pattern on a glass
substrate in the above reticle manufacturing apparatus (a method of
manufacturing a reticle) will now be described. Before starting a
manufacture of a reticle, the dummy mask 41 including the
thermometer 41a is held on the X-Y stage 21. An original pattern is
actually drawn on the dummy mask 41 by the electron beam optical
system 27 while varying the position of the dummy mask 41. At this
time, the temperature of the dummy mask 41 is measured in sequence
by the thermometer 41a. More specifically, the dummy mask 41 is
held on the X-Y stage 21 and then the inner part of the drawing
chamber 11 is evacuated by a vacuum device (not shown). The first
temperature regulator 15 controls the temperature of the first
constant-temperature water 13 and keeps the set temperature of the
drawing chamber 11 constant. In this state, the drive unit 23 moves
the X-Y stage 21 in the X and Y directions while the laser
interferometer 25 measures the position of the X-Y stage 21
accurately. Thus, an original pattern is drawn in a given position
on the dummy mask 41 by irradiating the moving dummy mask 41 with
an electron beam B from the electron beam optical system 27. The
output of the laser interferometer 25 is used to control the
irradiation position of the electron beam B. When the original
pattern is drawn, the thermometer 41a measures the temperature of
the dummy mask 41 and the storage circuit 43 stores the measured
temperature.
[0032] After the temperature of the dummy mask 41 is measured at
the time of drawing, the manufacture of the actual reticle, i.e.,
the drawing of the original pattern on the glass substrate starts.
Specifically, the glass substrate is held on the X-Y stage 21.
After that, as in the above case, the inner part of the drawing
chamber 11 is evacuated and the first temperature regulator 15
controls the temperature of the first constant-temperature water 13
to keep the set temperature of the drawing chamber 11 constant.
[0033] Moreover, on the occasion of the manufacture of the actual
reticle, the computing circuit 45 computes the distribution of
temperature varied with the movement of the dummy mask 41 based on
the measurement results stored in the storage circuit 43. Based on
the temperature distribution, the main control circuit 47 controls
at least the second temperature regulator 35. In this case, the
main control circuit 47 obtains such set temperature as to minimize
a variation of the temperature of the glass substrate held on the
X-Y stage 21 from the temperature distribution. The second
temperature regulator 35 controls the second constant-temperature
water 33 based on the set temperature and maintains the set
temperature of the constant-temperature member 31 at the optimal
fixed temperature (constant temperature).
[0034] In this state, the drive unit 23 moves the X-Y stage 21 in
the X and Y directions while the laser interferometer 25 is
measuring the position of the X-Y stage 21 precisely. Thus, the
electron beam optical system 27 emits the electron beam B to draw
an original pattern in a given position on the glass substrate
while the glass substrate is moving. Since the temperature of the
glass substrate under drawing is kept almost constant, a fine
original pattern can be drawn with high precision. In other words,
the material and shape of the dummy mask 41 used for measurement of
temperature are substantially the same as those of the glass
substrate used for manufacture of the reticle. Therefore, the
temperature of the glass substrate under drawing can easily be kept
almost constant by making the temperature of the
constant-temperature member 31 constant by the set temperature
based on the measurement results (distribution) of the temperature
of the dummy mask 41. Consequently, an original pattern can be
drawn with almost no positional errors.
[0035] FIGS. 3A and 3B show the distribution of temperature varied
with the movement of the dummy mask 41. FIG. 3A shows the
temperature distribution obtained before the temperature of the
constant-temperature member 31 is optimized. For example, the set
temperature of the drawing chamber 11 is 22.48.degree. C.
(incidentally the set temperature of the constant-temperature
member 31 is 22.89.degree. C.). FIG. 3B shows the temperature
distribution obtained after the temperature of the
constant-temperature member 31 is optimized. For example, the set
temperature of the drawing chamber 11 is 22.48.degree. C. and that
of the constant-temperature member 31 is 22.59.degree. C.
[0036] In the above case, the temperature distribution is
repeatedly obtained while varying the set temperature of the
constant-temperature member 31, and the set temperature in the
temperature distribution in which the temperature variation becomes
the smallest is used as the optimum temperature of the
constant-temperature member 31.
[0037] In FIG. 3A, reference numeral 101 indicates a range of
temperature of 23.03.degree. C. to 23.035.degree. C., 102 a range
of temperature of 23.025.degree. C. to 23.03.degree. C., 103 a
range of temperature of 23.02.degree. C. to 23.025.degree. C., 104
a range of temperature of 23.015.degree. C. to 23.02.degree. C.,
105 a range of temperature of 23.01.degree. C. to 23.015.degree.
C., 106 a range of temperature of 23.005.degree. C. to
23.01.degree. C., 107 a range of temperature of 23.0.degree. C. to
23.005.degree. C., 108 a range of temperature of 22.995.degree. C.
to 23.0.degree. C., 109 a range of temperature of 22.99.degree. C.
to 22.995.degree. C., 110 a range of temperature of 22.985.degree.
C. to 22.99.degree. C., 111 a range of temperature of 22.98.degree.
C. to 22.985.degree. C., 112 a range of temperature of
22.975.degree. C. to 22.98.degree. C., 113 a range of temperature
of 22.97.degree. C. to 22.975.degree. C., 114 a range of
temperature of 22.965.degree. C. to 22.97.degree. C., 115 a range
of temperature of 22.96.degree. C. to 22.965.degree. C., 116 a
range of temperature of 22.955.degree. C. to 22.96.degree. C., and
117 a range of temperature of 22.95.degree. C. to 22.955.degree.
C.
[0038] In FIG. 3B, reference numeral 201 indicates a range of
temperature of 22.925.degree. C. to 22.93.degree. C., 202 a range
of temperature of 22.92.degree. C. to 22.925.degree. C., 203 a
range of temperature of 22.915.degree. C. to 22.92.degree. C., 204
a range of temperature of 22.91.degree. C. to 22.915.degree. C.,
205 a range of temperature of 22.905.degree. C. to 22.91.degree.
C., and 206 a range of temperature of 22.9.degree. C. to
22.905.degree. C.
[0039] As is apparent from FIGS. 3A and 3B, the temperature
difference is 0.085 (=23.035-22.95).degree. C. before the
temperature of the member 31 is optimally made constant, whereas
the temperature difference is 0.03 (=22.93-22.9).degree. C. after
it is optimally made constant. It is seen from this, too that it is
effective in maintaining the constant temperature of the glass
substrate under drawing to make the temperature of the
constant-temperature member 31 constant by the optimum temperature
or regulate the set temperature of the second constant-temperature
water 33 based on the temperature distribution obtained before the
member 31 is optimally made constant and make the set temperature
of the member 31 optimum.
[0040] As described above, the follow-up characteristic of the
second constant-temperature water to the temperature variations of
the glass substrate can greatly be improved. In other words, the
constant-temperature member whose temperature can be controlled
independently of that of the drawing chamber is provided to control
the set temperature of the constant-temperature member on the basis
of the results obtained by previously measuring the temperature of
the dummy mask which is substantially equal to that of the glass
substrate. Thus, the constant-temperature member can easily be made
constant by the optimum temperature that corresponds to
substantially the constant temperature of the glass substrate under
drawing. Therefore, the temperature of the glass substrate can be
made more constant when the original pattern is drawn than when the
temperature of the glass substrate is stabilized only in the
drawing chamber; consequently, a fine original pattern can be drawn
with high precision, too.
[0041] In the foregoing first embodiment, the temperature of the
constant-temperature member 31 is made constant or the member 31 is
so controlled that its set temperature becomes constant. The first
embodiment is not limited to this. For example, the set temperature
of the constant-temperature member 31 can easily be varied with the
measured temperature of the dummy mask 41 so as not to cause a
difference in the temperature of the glass substrate under drawing
due to the variations in position. In this case, a fine original
pattern can be formed with higher precision.
[0042] When an original pattern is drawn on the glass substrate,
the drawing control circuit 49 can supply a correction value to
drawing data for drawing the original pattern based on the measured
temperature of the dummy mask 41 (for example, temperature
distribution). It is thus possible to draw a fine original pattern
with higher precision and, in this case, the advantage can greatly
be improved in combination with the control of the set temperature
of the constant-temperature member 31. In other words, when the
drawing data is corrected on the basis of the distribution of
temperature varied with the movement of the dummy mask 41, a fine
original pattern can sufficiently be drawn with high precision to
some extent, irrespective of the control of the set temperature of
the constant-temperature member 31.
[0043] The first embodiment is not limited to the control of only
the set temperature of the constant-temperature member 31. For
example, the temperature of the glass substrate can be stabilized
at the time of drawing by controlling the set temperature of each
of the constant-temperature member 31 and drawing chamber 11 based
on the temperature distribution obtained when the temperature of
the dummy mask 41 is measured.
Second Embodiment
[0044] FIG. 4 shows an example of a configuration of a fine pattern
forming apparatus according to a second embodiment of the present
invention. The second embodiment is directed to a reticle
manufacturing apparatus for drawing an original pattern on a glass
substrate to manufacture a reticle. In this apparatus, the
temperature of the glass substrate is measured at the time of
drawing and the set temperature of a constant-temperature member is
controlled based on the measurement results. As shown in FIG. 4, a
thermometer (second temperature measuring device) 51 is attached on
an X-Y stage 21. The thermometer 51 measures the temperature of a
glass substrate 53 held on the X-Y stage 21 when an original
pattern is drawn thereon. In the reticle manufacturing apparatus,
the thermometer 51 attached on the X-Y stage 21 is used in place of
the thermometer 41a included in the dummy mask 41 in the first
embodiment and measures the temperature of the glass substrate 53
in sequence when a reticle is manufactured.
[0045] When the drawing of an original pattern on the glass
substrate 53 (the manufacture of a reticle) actually starts, the
thermometer 51 measures the temperature of the glass substrate 53.
Based on the temperature measured in sequence, a second temperature
regulator 35 regulates the temperature of the second
constant-temperature water 33 flowing in a constant-temperature
member 31 with high precision through, for example, a storage
circuit 43, a computing circuit
[0046] and a main control circuit 47. Thus, the set temperature of
the constant-temperature member 31 is varied such that the glass
substrate 53 can always be maintained at the optimum temperature,
and the temperature of the glass substrate 53 can be made constant
at the time of drawing.
[0047] In the second embodiment, the set temperature of the
constant-temperature member 31 can sequentially be varied with the
variation in the position of the glass substrate 53 (position of
the X-Y stage 21) based on the temperature of the glass substrate
53 measured by the thermometer 51. Consequently, a fine original
pattern can be formed with high precision without varying in
temperature due to the variations in the position of the glass
substrate 53.
[0048] In the second embodiment, too, the temperature of the
constant-temperature member 31 is made constant as in the foregoing
first embodiment. In other words, the constant-temperature member
31 can easily be controlled such that its set temperature becomes
constant.
[0049] Moreover, as in the first embodiment, when an original
pattern is drawn on the glass substrate 53, a drawing control
circuit 49 can supply a correction value to drawing data for
drawing the original pattern based on the measured temperature of
the glass substrate 53. Thus, a fine original pattern can be drawn
with high precision. In this case, too, the advantage can greatly
be improved in combination with the control of the set temperature
of the constant-temperature member 31. In other words, when the
drawing data is corrected on the basis of the measured temperature
of the glass substrate 53, a fine original pattern can sufficiently
be formed with high precision to some extent, irrespective of the
control of the set temperature of the constant-temperature member
31.
[0050] The second embodiment is not limited to the control of only
the set temperature of the constant-temperature member 31. For
example, the temperature of the glass substrate 53 can be
stabilized at the time of drawing by controlling the set
temperature of each of the constant-temperature member 31 and
drawing chamber 11 based on the measured temperature of the glass
substrate 53.
[0051] Neither the first embodiment nor the second embodiment is
limited to the above reticle manufacturing apparatus but can be
applied to various types of fine pattern forming apparatus.
[0052] Additional advantages and modifications will readily occur
to those skilled in the art. Therefore, the invention in its
broader aspects is not limited to the specific details and
representative embodiments shown and described herein. Accordingly,
various modifications may be made without departing from the spirit
or scope of the general inventive concept as defined by the
appended claims and their equivalents.
* * * * *