U.S. patent application number 11/074278 was filed with the patent office on 2006-06-22 for multi lead frame power package.
This patent application is currently assigned to Texas Instruments Incorporated. Invention is credited to Anthony L. Coyle, Steven A. Kummerl, Bernhard Lange.
Application Number | 20060131734 11/074278 |
Document ID | / |
Family ID | 36087658 |
Filed Date | 2006-06-22 |
United States Patent
Application |
20060131734 |
Kind Code |
A1 |
Kummerl; Steven A. ; et
al. |
June 22, 2006 |
Multi lead frame power package
Abstract
According to an embodiment of the invention, a system, operable
to facilitate dissipation of thermal energy, includes a mold
compound, a die, a first lead frame, and a second lead frame. The
die is disposed within the mold compound, and in operation
generates thermal energy. The first lead frame is disposed at least
partially within the mold compound and is operable to facilitate
transmission of a signal. The second lead frame is disposed at
least partially within the compound, at least partially separated
from the first lead frame, and is operable to facilitate a
dissipation of thermal energy.
Inventors: |
Kummerl; Steven A.;
(Carrollton, TX) ; Lange; Bernhard; (Garland,
TX) ; Coyle; Anthony L.; (Plano, TX) |
Correspondence
Address: |
TEXAS INSTRUMENTS INCORPORATED
P O BOX 655474, M/S 3999
DALLAS
TX
75265
US
|
Assignee: |
Texas Instruments
Incorporated
|
Family ID: |
36087658 |
Appl. No.: |
11/074278 |
Filed: |
March 7, 2005 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
60636935 |
Dec 17, 2004 |
|
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|
Current U.S.
Class: |
257/706 ;
257/E23.042; 257/E23.051; 257/E23.092 |
Current CPC
Class: |
H01L 2224/48247
20130101; H01L 23/49537 20130101; H01L 2924/01079 20130101; H01L
2924/00 20130101; H01L 2224/45099 20130101; H01L 2924/00 20130101;
H01L 2924/00012 20130101; H01L 2924/00014 20130101; H01L 2924/00
20130101; H01L 2224/45015 20130101; H01L 2924/00 20130101; H01L
23/4334 20130101; H01L 2924/207 20130101; H01L 2924/00014 20130101;
H01L 2924/07802 20130101; H01L 2924/14 20130101; H01L 2924/01322
20130101; H01L 2224/48091 20130101; H01L 2224/48091 20130101; H01L
2924/07802 20130101; H01L 2924/00014 20130101; H01L 2924/14
20130101; H01L 23/49568 20130101; H01L 24/48 20130101; H01L
2924/3025 20130101; H01P 1/387 20130101; H01L 2924/3011 20130101;
H01L 2924/00014 20130101; H01L 2924/09701 20130101; H01L 2924/3011
20130101; H01L 2924/181 20130101; H01L 2924/181 20130101; H01L
2924/3025 20130101 |
Class at
Publication: |
257/706 |
International
Class: |
H01L 23/34 20060101
H01L023/34 |
Claims
1. A system for facilitating dissipation of thermal energy, the
system comprising: a mold compound; a die disposed within the mold
compound, the die in operation generating thermal energy; and a
first lead frame disposed at least partially within the mold
compound, wherein a wing of the first lead frame is external of the
mold compound, and the wing is operable to receive thermal energy
dissipated from the die through the first lead frame.
2. The system of claim 1, further comprising: a thermal dissipation
system, wherein the wing is thermally coupled to the thermal
dissipation system, and the thermal dissipation system is operable
to receive thermal energy dissipated to the wing.
3. The system of claim 2, wherein the thermal dissipation system is
a heat sink.
4. The system of claim 1, further comprising: a second lead frame
disposed at least partially within the mold compound, wherein the
second lead frame is at least partially separated from the first
lead frame, and the second lead frame is operable to facilitate a
dissipation of thermal energy.
5. The system of claim 4, wherein at least one of the first lead
frame and the second lead frame is positioned above the die and at
least one of the first lead frame and the second lead frame is
positioned below the die.
6. The system of claim 1, further comprising: a second lead frame
disposed at least partially within the mold compound, wherein the
second lead frame is at least partially separated from the first
lead frame, and the second lead frame is operable to facilitate
transmission of a signal.
7. The system of claim 6, wherein at least one of the first lead
frame and the second lead frame is positioned above the die and at
least one of the first lead frame and the second lead frame is
positioned below the die.
8. The system of claim 6, wherein the first lead frame and the
second lead frame are positioned below the die.
9. A system, operable to facilitate dissipation of thermal energy,
the system comprising: a mold compound; a die disposed within the
mold compound, the die in operation generating thermal energy; a
first lead frame disposed at least partially within the mold
compound, wherein the first lead frame is operable to facilitate
transmission of a signal; and a second lead frame disposed at least
partially within the mold compound, wherein the second lead frame
is at least partially separated from the first lead frame, and the
second lead frame is operable to facilitate a dissipation of
thermal energy.
10. The system of claim 9, wherein at least one of the first lead
frame and the second lead frame is positioned above the die and at
least one of the first lead frame and the second lead frame is
positioned below the die.
11. The system of claim 10, wherein the second lead frame is
disposed above the die and extends beyond the surface of the mold
compound.
12. The system of claim 9, wherein the first and the second lead
frame are disposed below the die.
13. The system of claim 9, further comprising: a thermal
dissipation system, wherein the second lead frame is thermally
coupled to the thermal dissipation system.
14. The system of claim 9, further comprising: a third lead frame
disposed at least partially within the mold compound, wherein the
third lead frame is at least partially separated from the first
lead frame and the second lead frame, and the third lead frame is
operable to facilitate a dissipation of thermal energy.
15. The system of claim 14, wherein at least one of the second and
third lead frame is positioned above the die and at least one of
the second and third lead frame is positioned below the die.
16. The system of claim 15, further comprising: a thermal
dissipation system, wherein the second lead frame and the third
lead frame are thermally coupled to the thermal dissipation
system.
17. A method of facilitating dissipation of thermal energy away
from a die in an integrated circuit package with a mold compound,
the method comprising: thermally coupling a first lead frame to the
die, wherein the first lead frame and the die are at least
partially disposed in the mold compound, and the die generates
thermal energy; extending a wing of the first lead frame external
of the mold compound; and transferring at least a portion of the
thermal energy through the first lead frame from the die to the
wing.
18. The method of claim 17, further comprising: thermally coupling
the wing to another object, wherein the at least a portion of the
thermal energy transferred through the first lead frame from the
die to the wing is further transferred to the other object.
19. The method of claim 18, wherein the other object is a heat
sink.
20. The method of claim 17, further comprising: thermally coupling
a second lead frame to the die, wherein at least a portion of the
thermal energy is transferred through the second lead frame.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] Pursuant to 35 U.S.C. .sctn. 119 (e), this application
claims priority from United States Provisional Patent Application
Ser. No. 60/636,935, entitled MULTI LEADFRAME POWER PACKAGE (MLP2),
filed Dec. 17, 2004.
TECHNICAL FIELD OF THE INVENTION
[0002] This invention relates generally to the field of
semiconductor devices and, more particularly, to a multi lead frame
power package.
BACKGROUND OF THE INVENTION
[0003] A packaged integrated circuit may generally include
semiconductor chips and their associated components embedded within
a molding. The packaged integrated circuits may be connected to a
printed circuit board of an electronic device. Through the printed
circuit board, the packaged integrated circuit may be connected to
other chips and to external inputs and outputs. In operation, the
components of the packaged integrated circuits create thermal
energy, which dissipates in attempts to seek thermal
equilibrium.
SUMMARY OF THE INVENTION
[0004] According to an embodiment of the invention, a system,
operable to facilitate dissipation of thermal energy, includes a
mold compound, a die, and a first lead frame. The die is disposed
within the mold compound, and in operation generates thermal
energy. The first lead frame is disposed at least partially within
the mold compound. The first lead frame includes a wing that is
external of the mold compound and is operable to receive thermal
energy dissipated from the die through the first lead frame.
[0005] According to another embodiment of the invention, a system,
operable to facilitate dissipation of thermal energy, includes a
mold compound, a die, a first lead frame, and a second lead frame.
The die is disposed within the mold compound, and in operation
generates thermal energy. The first lead frame is disposed at least
partially within the mold compound and is operable to facilitate
transmission of a signal. The second lead frame is disposed at
least partially within the compound, at least partially separated
from the first lead frame, and is operable to facilitate a
dissipation of thermal energy.
[0006] Certain embodiments of the invention may provide numerous
technical advantages. For example, a technical advantage of one
embodiment may include the capability to increase the efficiency of
thermal dissipation away from a die in a packaged integrated
circuit. Other technical advantages of other embodiments may
include the capability to provide a metal attachment extending from
a packaged integrated circuit to which a heat sink may attach; the
capability to increase thermal dissipation throughput in a packaged
integrated circuit; and the capability to allow flexibility in
designing geometries to help spread thermal energy within and out
of a packaged integrated circuit.
[0007] Although specific advantages have been enumerated above,
various embodiments may include all, some, or none of the
enumerated advantages. Additionally, other technical advantages may
become readily apparent to one of ordinary skill in the art after
review of the following figures and description.
BRIEF DESCRIPTION OF THE DRAWINGS
[0008] For a more complete understanding of example embodiments of
the present invention and its advantages, reference is now made to
the following description, taken in conjunction with the
accompanying drawings, in which:
[0009] FIG. 1 is a side cross-sectional view of a system, according
to an embodiment of the invention;
[0010] FIG. 2 is a side cross-sectional view of a system, according
to another embodiment of the invention;
[0011] FIG. 3 is a side cross-sectional view of a system, according
to yet another embodiment of the invention;
[0012] FIG. 4 is a side cross-sectional view of a system, according
to yet another embodiment of the invention;
[0013] FIG. 5 is a side cross-sectional view of a system, according
to yet another embodiment of the invention;
[0014] FIG. 6 is a side cross-sectional view of a system, according
to yet another embodiment of the invention;
[0015] FIG. 7 is a side cross-sectional view of a system, according
to yet another embodiment of the invention;
[0016] FIG. 8 is a cut away top view of a system, according to yet
another embodiment of the invention;
[0017] FIG. 9 is a side cross-sectional view of a system, according
to yet another embodiment of the invention;
[0018] FIG. 10 is a cut away top view of a system, according to yet
another embodiment of the invention;
[0019] FIG. 11 is a side cross-sectional view of a system,
according to yet another embodiment of the invention;
[0020] FIGS. 12A, 12B, and 12C are cut away top views illustrating
a production of a system, according to an embodiment of the
invention; and
[0021] FIGS. 13A and 13B illustrate a configuration of coupling a
thermal dissipation system to a packaged integrated circuit.
DETAILED DESCRIPTION OF EXAMPLE EMBODIMENTS OF THE INVENTION
[0022] It should be understood at the outset that although example
embodiments of the present invention are illustrated below, the
present invention may be implemented using any number of
techniques, whether currently known or in existence. The present
invention should in no way be limited to the example embodiments,
drawings, and techniques illustrated below, including the
embodiments and implementation illustrated and described herein.
Additionally, the drawings are not necessarily drawn to scale.
[0023] FIG. 1 is a side cross-sectional view of a system 60A,
according to an embodiment of the invention. The system 60A in this
embodiment generally includes a die 200 supported on and/or bonded
to a pad 310A of a lead frame 300A. The die 200 and pad 310A are at
least partially encapsulated in a mold compound 50 to form a
packaged integrated circuit 100A. Encapsulation of the die 200 and
the pad 310A with the mold compound 50 may be accomplished using a
variety of semiconductor fabrication packaging techniques
recognized by those of ordinary skill in the art. Although
configurations of a packaged integrated circuit will be described
with reference to embodiments herein, the packaged integrated
circuit may include more, less, or different components than those
described.
[0024] The die 200 may comprise a variety of materials including
silicon, gallium arsenide, or other suitable substrate materials.
The die 200 generally provide the foundation for a variety of
semiconductor features, including but not limited to, analog and/or
digital circuits such as digital to analog converters, computer
processor units, amplifiers, digital signal processors,
controllers, transistors, or other semiconductor features. Although
not explicitly shown, the die 200 may be attached to the pad 310A,
utilizing a variety of attachment mediums, including epoxy,
polyimide, other adhesive chemistries, mixture of such chemistries,
solder, a gold-silicon Eutectic layer, or other suitable material
for bonding the die 200 to the pad 310A. In various embodiments,
such attachment mediums may establish both a mechanical and thermal
connection between the die 200 and pad 310A.
[0025] One generally recognized purpose of the mold compound 50 is
to provide electrical isolation of semiconductor features formed in
and/or on the die 200. Accordingly, the lead frame 300A may be
utilized to facilitate the transfer of electrical signaling between
the semiconductor features formed in and/or on the die 200 and a
variety of other devices, for example, a printed circuit board. To
this end, the lead frame 300A may be generally made from any
suitable electrically conductive material, such as copper,
aluminum, or other suitable materials. The pad 310A of the lead
frame 300A may similarly be made of a variety of electrically
conductive materials, including copper alloys, nickel alloys,
aluminum, other suitable materials, or combinations of the
preceding. While not explicitly shown in FIG. 1, the lead frame
300A may include leads to transfer such electrical signaling.
Examples of such leads are discussed below in the embodiment
described with reference to FIG. 8.
[0026] The pad 310A in this embodiment is shown protruding outside
the mold compound 50 of the packaged integrated circuit 100A,
forming wings 320A. The wings 320A of FIG. 1 are bent upwards in
this embodiment; however, in other embodiments the wings 320A may
be positioned in other directions. For example, the wings 320A may
be bent down, bent at an angle, or left extending straight out. In
some embodiments of the invention, during manufacture of the system
60A, the wings 320A extending outside a footprint area of the
packaged integrated circuit 100 may be bent in the desired
direction as opposed to being removed.
[0027] In operation, the semiconductor features formed in and/or on
the die 200 generate thermal energy. The thermal energy generated
by the die 200 in attempts to seek thermal equilibrium may
generally dissipate through the mold compound 50. However, the mold
compound typically has a relatively low thermal conductivity for
the transfer of thermal energy in relation to other types of
material. Additionally, ever-increasing power densities being
utilized in semiconductor features formed in and/or on the die 200
increase the amount of thermal energy being created. Accordingly,
teachings of embodiments of the invention take advantage of the
thermal conductive properties of the pad 310A to dissipate thermal
energy from the die 200 to the wings 320A. As the conductive path
through the pad 310A may have a better thermal conductivity for the
transfer of thermal energy than the mold compound 50, greater
dissipation of thermal energy away from the die 200 may be
accomplished. As will be recognized by one of ordinary skill in the
art, the transfer of thermal energy may commonly be referred to as
"heat".
[0028] Thermal energy dissipated to the wings 320A may dissipate
into the air, other devices, or other suitable materials, some of
which will be described below. As an example, in some embodiments,
the wings 320A of the pad 310A may be bent down to contact a
printed circuit board such that the printed circuit board operates
as a heat sink for dissipation of the thermal energy away from the
die 200.
[0029] FIG. 2 is a side cross-sectional view of a system 60B,
according to another embodiment of the invention. The system 60B of
FIG. 2 is similar to the system 60A of FIG. 1, including a packaged
integrated circuit 100B with mold compound 50, a die 200, a pad
310B, a lead frame 300B, and wings 320B. However, the system 60B of
FIG. 2 includes a thermal dissipation system 400 coupled to the
wings 320B on each side of the packaged integrated circuit 100B.
Any of a variety of thermal dissipation systems may be utilized,
including in some embodiments a metallic configuration or
configurations utilizing fluid (e.g., systems utilizing circulated
fluids). In this embodiment, the thermal dissipation system 400 is
shown as a heat sink 410B with cooling fins 412B. Heat sinks are
generally recognized by those of ordinary skill in the art. Any of
a variety of configurations of heat sinks may be utilized,
including in some embodiments, heat sinks with cooling fans. With
the system 60B of FIG. 2, thermal energy may be dissipated from the
die 200 through the pad 310B, the wings 320B, and to the heat sink
410B, where the cooling fins 412B facilitate transfer of the
thermal energy to the air, other devices, or other suitable
materials.
[0030] FIG. 3 is a side cross-sectional view of a system 60C,
according to yet another embodiment of the invention. The system
60C of FIG. 3 is similar to the system 60A of FIG. 1, including a
packaged integrated circuit 100C with mold compound 50, a die 200,
a pad 310C, and a lead frame 300C. However, the system 60C of FIG.
3 includes another lead frame 500C coupled below the lead frame
300C and disposed at least partially within the mold compound 50 of
the packaged integrated circuit 100C. The lead frame 500C may
generally be designed to dissipate thermal energy as opposed to
carrying a signal. The lead frame 500C may be made of a variety of
thermally conductive materials including, but not limited to,
copper alloys, nickel alloys, aluminum, other suitable materials,
or combinations of the preceding. In production of the packaged
integrated circuit 100C the lead frame 500C may be added at the
bottom of the pad 310 during the injection of mold compound 50 or
prior to the injection of mold compound 50, utilizing a variety of
objects, including clamps, glue, adhesive tape, soldering, thermal
conductive attachment material, and other suitable materials. In
the incorporation of lead frame 500C in proximity to lead frame
300C, one of ordinary skill in the art would recognize that the
lead frames 300C, 500C, may be configured in a manner as to not
disturb the electrical signals that may be carried by the leads of
the lead frame 300C. FIG. 8 gives examples of a bend that may be
utilized to preserve electrical signaling while facilitating
thermal dissipation.
[0031] The lead frame 500C of FIG. 3, similar to the lead frame
300A of FIG. 1, generally protrudes outside the mold compound 50 of
the packaged integrated circuit 100C, forming wings 520C. With
system 60C of FIG. 5, thermal energy may be dissipated from the die
200 through the pad 310C and the lead frame 500C to the wings 520C.
The additional conductive path provided by the lead frame 500C
facilitates the transfer of thermal energy away from the die
200.
[0032] Although thermal conductivity generally tracks electrical
conductivity for a large number of materials (e.g., metals), one of
ordinary skill in the art will recognize that for some materials
this may not the case. Accordingly, embodiments of the invention
may take advantage of this phenomena to facilitate dissipation of
thermal energy away from the die 200 while not interrupting
electrical signaling.
[0033] FIG. 4 is a side cross-sectional view of a system 60D,
according to yet another embodiment of the invention. The system
60D of FIG. 3 may operate in a similar manner to the system 60C of
FIG. 3, including a packaged integrated circuit 100D with mold
compound 50, a die 200, a pad 310D, a lead frame 300D, a lead frame
500D, and wings 520D. However, in the system 60D of FIG. 4 the
wings 520D are bent up at a distance from mold compound 50 of the
packaged integrated circuit 100D. With the system 60D of FIG. 4,
thermal energy may be dissipated from the die 200 through the pad
310D and the lead frame 500D to the wings 520D. The configuration
of the wings 520D in this embodiment may facilitate connections to
other devices, for example a heat sink.
[0034] FIG. 5 is a side cross-sectional view of a system 60E,
according to yet another embodiment of the invention. The system
60E of FIG. 5 may operate in a similar manner to the system 60D of
FIG. 4, including a packaged integrated circuit 100E with mold
compound 50, a die 200, a pad 310E, a lead frame 300E, a lead frame
500E, and wings 520E. However, the system 60E of FIG. 5 includes a
thermal dissipation system 400 coupled to the wings 520E on each
respective side of the packaged integrated circuit 100E. Similar to
FIG. 2, any of variety of thermal dissipation systems may be
utilized, including in some embodiments metallic configurations or
configurations that utilize fluid. In this embodiment, the thermal
dissipation system 400 is shown as a heat sink 410E with cooling
fins 412E. With the system 60E of FIG. 5, thermal energy may be
dissipated from the die 200 through the pad 310E, the lead frame
500E, and the wings 520E, to the heat sink 410E, where the cooling
fins 412E facilitate transfer of the thermal energy to the air,
other devices, or other suitable materials.
[0035] FIG. 6 is a side cross-sectional view of a system 60F,
according to yet another embodiment of the invention. The system
60F of FIG. 6 may operate in a similar manner to the system 60D of
FIG. 4, including a packaged integrated circuit 100F with mold
compound 50, a die 200, a pad 310F, a lead frame 300F, a lead frame
500F, and wings 520F. However, the wings 520D are bent up flush
against the mold compound 50 of the packaged integrated circuit
100F.
[0036] FIG. 7 is a side cross-sectional view of a system 60G,
according to yet another embodiment of the invention. The system
60G of FIG. 7 may operate in a similar manner to the system 60E of
FIG. 6, including a packaged integrated circuit 100G with mold
compound 50, a die 200, a pad 310G, a lead frame 300G, a lead frame
500G, and wings 520G flush with the mold compound 50 of the
packaged integrated circuit 100G. However, in FIG. 7, a thermal
dissipation system 400 is coupled to the wings 520G on each
respective side of the packaged integrated circuit 100G. Similar to
FIGS. 2 and 5, any of a variety of thermal dissipation systems may
be utilized, including in some embodiments metallic configurations
or configurations that utilize fluid. In this embodiment, the
thermal dissipation system 400 is shown as a heat sink 410G with
cooling fins 412G and a contact piece 414G. The contact piece 414G
facilitates dissipation of thermal energy traveling through the
mold compound 50, for example, from the top of the die 200. With
system 60G of FIG. 7, thermal energy may additionally be dissipated
from the die 200 through the pad 310G, the lead frame 500G, and the
wings 520G to the heat sink 410G where the cooling fins 412G
facilitate transfer of thermal energy to the air, other devices, or
other suitable materials.
[0037] FIG. 8 is a cut away top view of a system 60H, according to
yet another embodiment of the invention. A portion of the compound
50 has been removed to illustrate features of the system 60H. The
system 60H of FIG. 8 may operate in a similar manner to the system
60F of FIG. 6, including a packaged integrated circuit 100H with
mold compound 50, a die 200, a pad 310H, a lead frame 300H, a lead
frame 500H, and wings 520H. FIG. 8 also shows a configuration of
leads 330H that may be utilized to facilitate electrical signaling
between semiconductor features formed in and/or on the die 200 and
other devices, for example, a printed circuit board. One of
ordinary skill would understand that the lead frames 300H, 500H,
may be configured in a variety of manner to preserve the electrical
signals that may be carried by the leads 330H. For example, the
leads 330H of the lead frame 300H may be bent as shown in FIG.
8.
[0038] By incorporating a lead frame 500H in addition to the signal
carrying lead frame 300H, geometry constrictions may be avoided in
some embodiments. For example, the lead frame 300H may require a
particular geometry to carry an electrical signal while the lead
frame 500H may require a completely different geometry designed to
facilitate a dissipation of thermal energy. The separation and/or
partial separation of the lead frame 300H and lead frame 500H may
allow such configurations.
[0039] FIG. 9 is a side cross-sectional view of a system 60I,
according to yet another embodiment of the invention. The system
60I of FIG. 9 may operate in a similar manner to the system 60F of
FIG. 6, including a packaged integrated circuit 100I with mold
compound 50, a die 200, a pad 310I, and a lead frame 300I. However,
the system 60I of FIG. 9 includes a lead frame 700I above the lead
frame 300I. The lead frame 700I in a manner similar to the lead
frame 500C of FIG. 3 may generally be designed to dissipate thermal
energy as opposed to carrying a signal. Accordingly, the lead frame
700I may be made of a variety of thermally conductive materials
including, but not limited to, copper alloys, nickel alloys,
aluminum, other suitable materials, or combinations of the
preceding. Lead frame 700I may be thermally and mechanically
coupled to the die 200 using an attachment material 220. A variety
of different attachment materials 220 may be utilized, including
but not limited to a liquid die attach, film tape-type die attach,
thermal conductive die attach material, or other suitable
materials. The attachment materials 220 in some embodiments may
also act as a thermal expansion stress relief between the die 200
and the lead frame 700I. Coupled between the die 200 and the lead
frame 300I in this embodiment is also a wire bond 210 that may be
utilized to facilitate the transfer of electrical signaling. The
attachment material 220 may be non-electrically conductive, to
avoid interference with the operation of the features on the die
200. With the system 60I of FIG. 9, thermal energy may be
dissipated from the die 200 through the attachment material 220 to
the lead frame 700I where the thermal energy may either be
transferred to the air, other devices, or other suitable materials.
In some embodiments, the lead frame 700I may extend beyond the
surface of the mold compound 50 while in other embodiment the lead
frame 700I may not extend beyond the surface of the mold compound
50.
[0040] The lead frame 700I may be added to the top side of the die
200 in a variety of manners. For example, the lead frame 700I may
be added after bonding of the wire bonds 220, but prior to molding,
utilizing external clamping features to hold the lead frames 300I,
700I together. Other techniques may additionally be utilized as
will be recognized by one of ordinary skill in the art.
[0041] FIG. 10 is a cut away top view of a system 60J, according to
yet another embodiment of the invention. A portion of the mold
compound 50 has been removed to illustrate features of the system
60J. The system 60J of FIG. 10 may operate in a similar manner to
the system 60I of FIG. 9, including a packaged integrated circuit
100J with mold compound 50, a die 200, a pad 310J, a lead frame
300J, a lead frame 700J, attachment material 220 and wire bonds
210. FIG. 10 shows also a configuration of leads 330J.
[0042] FIG. 11 is a side cross-sectional view of a system 60K,
according to yet another embodiment of the invention. The system
60K of FIG. 11 may operate in a similar manner to the to features
described in system 60H of FIG. 8 and system 60I of FIG. 9,
including a packaged integrated circuit 100K with mold compound 50,
a pad 310K, a lead frame 300K, a lead frame 500K, wings 520K, a
lead frame 700K, attachment material 220, and a thermal dissipation
system 400. Similar to description of FIGS. 2, 5, and 7, any of a
variety of thermal dissipation systems may be utilized, including
in some embodiments metallic configuration or configurations that
utilize fluid. In this embodiment, the thermal dissipation system
400 is shown as a heat sink 410K with cooling fins 412K and a
contact pieces 414K. With the system 60K of FIG. 11, thermal energy
may be dissipated from the die 200 through the pad 310K, the lead
frame 500K, and the wings 520K, to the heat sink 410K.
Additionally, thermal energy may be dissipated from the die 200
through the attachment materials 220 and lead frame 700I, and
contact pieces 416K of the heat sink 410K. Yet further paths of
thermal dissipation may include dissipation from the die 200
through the attachment materials 220, the lead frame 700I, and the
wings 520K to the heat sink 410K. At the heat sink 410K, the
cooling fins 412K may facilitate transfer of the thermal energy to
the air, other devices, or other suitable materials.
[0043] FIGS. 12A, 12B, and 12C are cut away top views illustrating
a production of a system 60L, according to an embodiment of the
invention. A portion of mold compound 50 has been removed to
illustrate features of system 60L. FIG. 12A generally shows a
portion of the system 60L after a molding process with mold
compound 50. Lead frame 300L includes a wing 320L and lead frame
500L includes a wing 520L. FIG. 12B shows the system 60L after
removing the wing 320L of the lead frame 300L to reveal an opening
522L in the lead frame 500L. Although such a removal of the wing
320L is described in this embodiment, in other embodiments the wing
320L may be retained. FIG. 12C shows the system 60L after a bending
of the wing 520L up. Yet other methods of configuration may be
utilized as will become apparent to one of ordinary skill in the
art.
[0044] FIGS. 13A and 13B illustrate a configuration of a coupling
of a thermal dissipation system 400 such as a heat sink 410M to a
packaged integrated circuit 100M. In FIGS. 14A and 14B, an angled
portion 402M of the heat sink 410M is uni-directionally latched in
an opening 522M of the lead frame 500M. The opening 522M may
generally be formed by the bending up of the wing 520M in the
manner described above with reference to FIG. 12B and FIG. 12C.
Although such a configuration has been shown in this embodiment, in
other embodiments, a heat sink 410M may be attached to portions of
the packaged integrated circuit in a variety of other manners. For
example, the heat sink 410M may be attached with thermal epoxy or
mechanically held with thermal grease. Yet other manners,
techniques, and methods may be utilized.
[0045] Although the present invention has been described with
several embodiments, a myriad of changes, variations, alterations,
transformations, and modifications may be suggested to one skilled
in the art, and it is intended that the present invention encompass
such changes, variations, alterations, transformation, and
modifications as they fall within the scope of the appended
claims.
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