Lange; Bernhard

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lange; Bernhard.The latest application filed is for "use of substituted ureas or urethanes for improvement of the use properties of mineral and synthetic nonaqueous industrial fluids".

Company Profile

0.7.16

Lange; Bernhard - Worms DE
Lange; Bernhard - Freising DE
Lange; Bernhard - Fresiling DE
Lange; Bernhard - Garland TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Use of substituted ureas or urethanes for improvement of the use properties of mineral and synthetic nonaqueous industrial fluids Grant 9,458,401 - Strittmatter , et al. October 4, 2	2016-10-04
Use Of Substituted Ureas Or Urethanes For Improvement Of The Use Properties Of Mineral And Synthetic Nonaqueous Industrial Fluids App 20160010020 - STRITTMATTER; Jan ; et al.	2016-01-14
System in package and method for manufacturing the same Grant 8,884,343 - Lange , et al. November 11, 2	2014-11-11
Use Of Substituted Ureas Or Urethanes For Further Improvement Of The Cold Flow Properties Of Mineral Oils And Crude Oils App 20130232858 - STRITTMATTER; Jan ; et al.	2013-09-12
System in Package and Method for Manufacturing The Same App 20130221526 - Lange; Bernhard ; et al.	2013-08-29
Chip Module And Method For Providing A Chip Module App 20120211895 - LANGE; Bernhard ; et al.	2012-08-23
Rfid Transponder And Method For Connecting A Semiconductor Die To An Antenna App 20120193801 - Gross; Johann ; et al.	2012-08-02
Leadframe and mold compound interlock in packaged semiconductor device Grant 7,741,704 - Lange , et al. June 22, 2	2010-06-22
Multi Lead Frame Power Package App 20100019361 - Kummerl; Steven A. ; et al.	2010-01-28
Integrated circuit package and method of manufacture thereof Grant 7,531,895 - Lange , et al. May 12, 2	2009-05-12
Integrated circuit chip packaging assembly Grant 7,488,623 - Kummerl , et al. February 10, 2	2009-02-10
Leadframe And Mold Compound Interlock In Packaged Semiconductor Device App 20080093715 - Lange; Bernhard ; et al.	2008-04-24
Multi Lead Frame Power Package App 20080020517 - Kummerl; Steven A. ; et al.	2008-01-24
Integrated Circuit Chip Packaging Assembly App 20070259484 - Kummerl; Steven Alfred ; et al.	2007-11-08
Integrated circuit chip packaging assembly Grant 7,256,482 - Kummerl , et al. August 14, 2	2007-08-14
System and method for die attach using a backside heat spreader Grant 7,221,055 - Lange May 22, 2	2007-05-22
Integrated Circuit Package And Method Of Manufacture Thereof App 20070057361 - Lange; Bernhard ; et al.	2007-03-15
Lead frame with attached components App 20060273432 - Lange; Bernhard ; et al.	2006-12-07
System and method for die attach using a backside heat spreader App 20060263944 - Lange; Bernhard	2006-11-23
Method and system for solder die attach App 20060258051 - Lange; Bernhard	2006-11-16
Integrated circuit package and method of manufacture thereof App 20060192273 - Lange; Bernhard ; et al.	2006-08-31
Multi lead frame power package App 20060131734 - Kummerl; Steven A. ; et al.	2006-06-22
Integrated circuit chip packaging assembly App 20060033185 - Kummerl; Steven Alfred ; et al.	2006-02-16

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