U.S. patent application number 11/240438 was filed with the patent office on 2006-04-06 for contact for electronic devices.
Invention is credited to Dong Weon Hwang.
Application Number | 20060073710 11/240438 |
Document ID | / |
Family ID | 36126132 |
Filed Date | 2006-04-06 |
United States Patent
Application |
20060073710 |
Kind Code |
A1 |
Hwang; Dong Weon |
April 6, 2006 |
CONTACT FOR ELECTRONIC DEVICES
Abstract
This present invention relates to a contact (100) for electronic
devices (1). More specifically, a contact (100) for electronic
devices (1) has an upper contact pin (110) which includes a contact
part (111) having a predetermined shape and contacting a lead of an
object to be tested, that is, an integrated circuit (IC) (1), two
support protrusions (112, 113) and a body (118); a lower contact
pin (130) coupled to the upper contact pin (110) to be orthogonal
to the upper contact pin (110); and a spring (190) fitted over a
predetermined area between the upper and lower contact pins (110,
130).
Inventors: |
Hwang; Dong Weon; (Flower
Mound, TX) |
Correspondence
Address: |
CHAUZA & HANDLEY, L.L.P.
PO BOX 140036
IRVING
TX
75014
US
|
Family ID: |
36126132 |
Appl. No.: |
11/240438 |
Filed: |
September 30, 2005 |
Current U.S.
Class: |
439/66 |
Current CPC
Class: |
G01R 1/0466 20130101;
G01R 1/0483 20130101; H01R 13/2421 20130101; H01R 12/714 20130101;
G01R 1/06722 20130101 |
Class at
Publication: |
439/066 |
International
Class: |
H01R 12/00 20060101
H01R012/00 |
Foreign Application Data
Date |
Code |
Application Number |
Oct 6, 2004 |
KR |
10-2004-0079649 |
Claims
1. A contact for electronic devices, comprising: an upper contact
pin, comprising: a contact part having a predetermined shape and
contacting a lead of an object to be tested, two support
protrusions, and a body; a lower contact pin coupled to the upper
contact pin to be orthogonal to the upper contact pin; a spring
fitted over a predetermined area between the upper and lower
contact pins; the body of the upper contact pin including inclined
surfaces and hooks provided on an end of the body, and two elastic
parts provided to be symmetrical with respect to each other; a
first channel defined by the two elastic parts, and providing a
space to allow movement of the lower contact pin, when the lower
contact pin is coupled to the upper contact pin; and a second
channel defined in the body of the upper contact pin to accommodate
hooks of the lower contact pin therein such that the lower contact
pin is movable, the second channel being in electrical contact with
hooks and side contact surfaces of the lower contact pin.
2. The contact for electronic devices as set forth in claim 1,
wherein the second channel has a predetermined depth, with a
thickness between two bottom ends of the second channel being equal
to or larger than a distance between inner ends of the hooks of the
elastic parts, which corresponds to a distance between channel
contact parts, so that the hooks of the lower contact pin contact a
bottom of the second channel, when the upper contact pin is coupled
to the lower contact pin.
3. The contact for electronic devices as set forth in claim 1,
wherein the contact part of the upper contact pin is selected out
of various shapes, including a V shape, a shape of a V which is
pointed at ends thereof, an A shape, a shape of an A which is
pointed at an end thereof, a rounded A shape, and a rounded A shape
which is pointed at an end thereof.
4. The contact for electronic devices as set forth in claim 1,
wherein a shape of a contact part of the lower contact pin is
different from that of the contact part of the upper contact
pin.
5. The contact for electronic devices as set forth in claim 1,
wherein the lower contact pin is configured so that the contact
part of the lower contact pin is solderable.
6. A contact for electronic devices, comprising: an upper contact
pin including a contact part having a predetermined shape and
contacting a lead of an object to be tested, two support
protrusions, and a body; a lower contact pin coupled to the upper
contact pin to be orthogonal to the upper contact pin; and a spring
fitted over a predetermined area between the upper and lower
contact pins; the body of the upper contact pin including inclined
surfaces and hooks provided on an end of the body, two elastic
parts provided to be symmetrical with respect to each other; a
channel defined by the two elastic parts, and providing a space to
allow movement of the lower contact pin, when the lower contact pin
is coupled to the upper contact pin; and a hole in the body of the
upper contact pin to accommodate hooks of the lower contact pin
such that the lower contact pin is movable.
7. The contact for electronic devices as set forth in claim 6,
wherein a stop rib provided between the channel and the hole is cut
at a center thereof.
8. The contact for electronic devices as set forth in claim 6,
wherein the contact part of the upper contact pin is selected out
of various shapes, including a V shape, a shape of a V which is
pointed at ends thereof, an A shape, a shape of an A which is
pointed at an end thereof, a rounded A shape, and a rounded A shape
which is pointed at an end thereof.
9. The contact for electronic devices as set forth in claim 6,
wherein a shape of a contact part of the lower contact pin is
different from that of the contact part of the upper contact
pin.
10. The contact for electronic devices as set forth in claim 6,
wherein the lower contact pin is configured so that the contact
part of the lower contact pin is solderable.
11. A contact for a making an electrical connection, the contact
comprising: a first contact pin having an elongate body, a first
end of said elongate body defining a contact portion, a second end
having two spaced part, longitudinally extending tangs which extend
away from said first end, and at least one first contact pin
support protuberance which extends outward from a side of said
elongate body; said longitudinally extending tangs each having a
protuberant portion which extends from an inward side of a
respective one of said tangs, toward an other of said tangs, said
protuberant portions defining catch surfaces; a second contact pin
having an elongate shape, an end portion of said elongate shape
defining a contact end, and two exteriorly disposed channel
portions extending into opposite sides of said second contact pin,
said channel portions extending longitudinally along a length of
said second contact pin and adapted for receiving said protuberant
portions of respective ones of said tangs, such that said
protuberant portions are moveable within said respective ones of
said channel portions with said protuberant portions in electrical
contact with said second contact pin; said channel portions in said
second contact pin defining stop surfaces which engage said catch
surfaces of said tangs of said first contact pin to prevent said
second contact pin from moving from between said two tangs of said
first contact pin; said second contact pin having at least one
second contact pin support protuberance which extends outward from
a side of said elongate body, spaced apart from said first contact
pin support protuberance; and a resilient biasing member extending
exteriorly around said first and second contact pins, and between
said at least one first contact pin support protuberance and said
second contact pin support protuberance to urge said first and
second pins to move in opposite directions, with said contact
portion of said first contact pin and said contact end of said
second contact pin disposed on opposite ends of said first and
second contact pins.
12. The contact as set forth in claim 11, wherein said first
contact pin and said second contact pin further comprise: a second
contact pin having an second end portion, opposite of said end
portion, defining two spaced part, longitudinally extending second
contact pin tangs which extend away from said contact end, said
second contact pin tangs each having a second contact pin
protuberant portion which extends from an inward side of a
respective one of said second contact tangs, toward an other of
said second contact tangs, and defining second contact pin catch
surfaces; said first contact pin having two exteriorly disposed
first contact pin channel portions extending into opposite side
portions of said first contact pin, said first contact pin channel
portions extending longitudinally along outward sides of said
elongate body of said first contact pin, wherein said first contact
pin channel portions are adapted for receiving said second contact
pin protuberant portions of respective ones of said second contact
pin tangs, such that said second contact pin protuberant portions
are moveable within said respective ones of said first contact pin
channel portions with said second contact pin protuberant portions
in electrical contact with said first contact pin; and said first
channel portions in said first contact pin defining first contact
pin stop surfaces which engage said second contact pin catch
surfaces of said second contact pin tangs to prevent said first
contact pin from moving from between said two second contact pin
tangs.
13. The contact as set forth in claim 12, wherein said first and
second contact pins are aligned such that said tangs of said first
contact pin extend in an opposite direction from said contact
portion than a direction in which said second contact pin tangs
extend from said contact end, with said first contact pin disposed
at an angular displacement of approximately ninety degrees from
said second contact pin around a longitudinal axis of said first
and second contact pins.
14. The contact as set forth in claim 13, wherein said tangs, said
first contact pin channel portions and said opposite side portions
of said first contact pin are substantially identical to said
second contact pin tangs, said channel portions and said sides of
said second contact pin, respectively.
15. The contact pin as set forth in claim 14, wherein said first
contact pin channel portions and said channel portions of said
second contact pins are defined by apertures which extend through
said bodies of said first and second contact pins, respectively.
Description
TECHNICAL FIELD OF THE INVENTION
[0001] The present invention relates generally to a contact for
electronic devices, and more particularly to a contact for
electronic devices which electrically connects a plurality of leads
of an integrated circuit (IC) provided in a test socket to
corresponding pads of a printed circuit board (PCB).
CROSS-REFERENCE TO RELATED APPLICATION
[0002] The present application is a continuation of Republic of
Korea Patent Application Serial No. 10-2004-0079649, filed Oct. 6,
2004, entitled "CONTACT FOR ELECTRONIC DEVICE," and invented by
Dong Weon Hwang, a citizen of the Republic of Korea, and a resident
of the United States.
BACKGROUND OF THE INVENTION
[0003] Generally, a test socket 20 of FIGS. 3a to 3c receives a
ball grid array-type semiconductor IC 1 of FIGS. 1a to 1c. Next,
the IC 1 is electrically connected to a PCB 11 of FIG. 2. In such a
state, the test socket performs the test of the IC 1.
[0004] As shown in FIGS. 3a to 3c, the test socket 20 performing
such a function includes a cover 21, a latch 24, and a socket body
22. The cover 21 is compressed against and is in close contact with
the IC 1 to be tested, thus forcing the IC 1 to be in close contact
with an upper contact part of a conventional contact 30 which is
positioned under the IC 1. The latch 24 locks the cover 21.
[0005] As shown in FIG. 4, the conventional contact 30 (called a
pogo pin) is positioned under the IC to be tested in the test
socket 20, and includes an upper contact pin 31, a lower contact
pin 34, a coil spring 33, and a body 32. The body 32 surrounds the
two contact pins 31 and 34 to prevent the removal of the contact
pins 31 and 34, and has the coil spring 33 therein to provide
elasticity to the contact pins 31 and 34, thus allowing the contact
pins 31 and 34 to move in a vertical direction.
[0006] A copper alloy material having a rod shape is machined and
gold-plated to manufacture the upper and lower contact pins 31 and
34. Further, the body 32 is manufactured through the following
process. That is, a copper alloy material having a pipe shape is
machined and gold-plated, and the two contact pins 31 and 34 and
the gold-plated spring 33 are accommodated in the pipe providing
the body 32. Subsequently, both ends of the pipe are narrowed so
that thick parts of the contact pins 31 and 34 are stopped by the
narrow ends, thus preventing the contact pins 31 and 34 from being
removed from the body 32.
[0007] Generally, it is preferable that an electrical signal of the
contact flow from the upper contact pin 31 through the inner
surface of the body 32 to the lower contact pin 34. Since the
electrical signal flows in this way, the electrical signal
transmission distance becomes short, thus precisely indicating
electrical properties.
[0008] Assuming that an electrical contact between the two contact
pins 31 and 34 and the inner surface of the body 32 is poor, the
electrical signal does not flow through the body 32 but flows
through the spring 33. In this case, the signal transmission
distance is increased. Consequently, the contact 30 cannot
efficiently perform its function.
[0009] The conventional contact 30 is problematic in that the
length (3.0 mm) of the body 32 is larger than the inner diameter
(0.3 mm) of the body 32, and the plating state of the body 32 is
poor, so that an electrical signal is not satisfactorily
transmitted between the two contact pins 31 and 34. Further, as the
contact is repeatedly used, debris generated by abrasion is caught
between the contact pins 31 and 34, and the body 32, thus
deteriorating electrical contact capacity. Further, the
conventional contact 30 is problematic in that the contact 30
requires a greater number of components, so that it is difficult to
assemble the components, thus productivity is low. Furthermore,
manufacturing costs are high due to a large amount of machining
work.
SUMMARY OF THE INVENTION
[0010] Accordingly, the present invention has been made keeping in
mind the above problems occurring in the prior art, and an object
of the present invention is to provide a contact for electronic
devices, capable of efficiently transmitting an electrical signal
from an upper contact pin to a lower contact pin.
[0011] Another object of the present invention is to provide a
contact for electronic devices, which reduces the number of
components, thus enhancing productivity, affording constant
quality, and realizing mass production at low cost.
[0012] To achieve the above objects, a contact for electronic
devices is provided having an upper contact pin, a lower contact
pin and a spring. The upper contact pin has a contact part having a
predetermined shape and contacting a lead of an object to be
tested, that is, an integrated circuit (IC), two support
protrusions, and a body. The lower contact pin is coupled to the
upper contact pin to be orthogonal to the upper contact pin. The
spring is fitted over a predetermined area between the upper and
lower contact pins. The body of the upper contact pin includes
inclined surfaces and hooks defined by protuberance portions
extending from two symmetrical tangs providing an end of the body
and defining two elastic parts which are symmetrical with respect
to each other. A first channel is defined by the two tangs
providing two elastic parts, and provides a space to allow movement
of the lower contact pin, when the lower contact pin is coupled to
the upper contact pin. A second channel is provided in the body of
the upper contact to accommodate hooks of the lower contact pin
therein such that the lower contact pin is movable, with the second
channel being in electrical contact with hooks and side contact
surfaces of the lower contact pin.
[0013] The second channel has a predetermined depth, with a
thickness between two bottom ends of the second channel being equal
to or larger than a distance between inner ends of the hooks of the
elastic parts, which corresponds to a distance between channel
contact parts, so that catch surfaces defined by the hooks of the
lower contact pin contact a stop surface of the second channel,
when the upper contact pin is coupled to the lower contact pin.
[0014] To achieve the above objects, a second contact for
electronic devices is provided having an upper contact pin, a lower
contact pin and a spring. The upper contact pin has a contact part
having a predetermined shape and contacting a lead of an object to
be tested, that is, an integrated circuit, two support protrusions,
and a body. The lower contact pin is coupled to the upper contact
pin to be orthogonal to the upper contact pin. The spring is fitted
over a predetermined area between the upper and lower contact pins.
The body of the upper contact pin includes inclined surfaces and
hooks provided by protuberant portions extending from two tangs
that provide two elastic parts provided to be symmetrical with
respect to each other. A channel defined by an opening between the
two elastic parts, and provides a space to allow movement of the
lower contact pin, when the lower contact pin is coupled to the
upper contact pin. A hole provides an opening in the body of the
upper contact pin to accommodate hooks of the lower contact pin
such that the lower contact pin is movable.
[0015] The stop rib provided between the channel and the hole is
cut at a center thereof.
[0016] The contact part of the upper contact pin is selected out of
various shapes, including a V shape, a shape of a V which is
pointed at ends thereof, an A shape, a shape of an A which is
pointed at an end thereof, a rounded A shape, and a rounded A shape
which is pointed at an end thereof.
[0017] The shape of a contact part of the lower contact pin is
preferably different from that of the contact part of the upper
contact pin. The lower contact pin is preferably configured so that
the contact part of the lower contact pin is solderable.
DESCRIPTION OF THE DRAWINGS
[0018] For a more complete understanding of the present invention
and the advantages thereof, reference is now made to the following
description taken in conjunction with the accompanying Drawings in
which FIGS. 1 through 17 which show various aspects for a contact
for electronic devices made according to the present invention, as
set forth below:
[0019] FIG. 1a is a top view of a ball grid array-type
semiconductor IC;
[0020] FIG. 1b is a front view of the ball grid array-type
semiconductor IC;
[0021] FIG. 1c is a bottom view of the ball grid array-type
semiconductor IC;
[0022] FIG. 2 is a top view of a PCB which is patterned to have
one-to-one electrical correspondence with a plurality of ball-type
leads of the ball grid array-type semiconductor IC;
[0023] FIG. 3a is a top view of a test socket and shows the cover
of the test socket in an open position;
[0024] FIG. 3b is a sectional view of a test socket and shows the
cover of the test socket in a closed position;
[0025] FIG. 3c is a sectional view of a test socket and shows the
cover of the test socket in an open position;
[0026] FIG. 4 is a partially cut away view of a conventional
contact;
[0027] FIG. 5 is a perspective view of a contact for a first
electronic device, according to the present invention;
[0028] FIG. 6 is an exploded perspective view of the contact for
the first electronic device, according to the present
invention;
[0029] FIG. 7a is a front view of an upper contact pin of the
contact for the first electronic device, according to the present
invention;
[0030] FIG. 7b is a side sectional view, taken along section line
7b-7b of FIG. 7a, of the upper contact pin of the contact for the
first electronic device, according to the present invention;
[0031] FIG. 8a is a front sectional view, taken along section line
8a-8a of FIG. 5, which shows the state where upper and lower
contact pins of the contact for the first electronic device,
according to the present invention, are coupled to each other;
[0032] FIG. 8b is a side sectional view, taken along section line
8b-8b of FIG. 8a, which shows the state where the upper and lower
contact pins of the contact for the first electronic device,
according to the present invention, are coupled to each other;
[0033] FIG. 9a is a front view of an upper contact pin of a contact
for a second electronic device, according to the present
invention;
[0034] FIG. 9b is a side sectional view, taken along section line
9b-9b of FIG. 9a, of the upper contact pin of the contact for the
second electronic device, according to the present invention;
[0035] FIG. 10a is a front sectional view, as would be viewed if
taken along section line 10a-10a of FIG. 9b, which shows the state
where upper and lower contact pins of the contact for the second
electronic device, according to the present invention, are coupled
to each other;
[0036] FIG. 10b is a side sectional view, taken along section line
10b-10b of FIG. 10a, which shows the state where the upper and
lower contact pins of the contact for the second electronic device,
according to the present invention, are coupled to each other;
[0037] FIG. 11a is a front view of an upper contact pin of a
contact for a third electronic device, according to the present
invention;
[0038] FIG. 11b is a side sectional view, taken along section line
11b-11b of FIG. 11a, of the upper contact pin of the contact for
the third electronic device, according to the present
invention;
[0039] FIG. 12a is a front sectional view, as would be viewed if
taken along section line 12a-12a of FIG. 11b, which shows the state
where upper and lower contact pins of the contact for the third
electronic device, according to the present invention, are coupled
to each other;
[0040] FIG. 12b is a side sectional view, taken along section line
12b-12b of FIG. 12a, and shows the state where the upper and lower
contact pins of the contact for the third electronic device,
according to the present invention, are coupled to each other;
[0041] FIG. 13a is a perspective view of a contact for electronic
devices having upper and lower contact parts, each having a V
shape, according to the present invention;
[0042] FIG. 13b is a perspective view of a contact for electronic
devices having upper and lower contact parts, each having a V shape
which is pointed at ends thereof, according to the present
invention;
[0043] FIG. 13c is a perspective view of a contact for electronic
devices having upper and lower contact parts, each having an A
shape, according to the present invention;
[0044] FIG. 13d is a perspective view of a contact for electronic
devices having upper and lower contact parts, each having an A
shape which is pointed at an end thereof, according to the present
invention;
[0045] FIG. 13e is a perspective view of a contact for electronic
devices having upper and lower contact parts, each having a rounded
A shape, according to the present invention;
[0046] FIG. 13f is a perspective view of a contact for electronic
devices having upper and lower contact parts, each having a rounded
A shape which is pointed at an end thereof, according to the
present invention;
[0047] FIG. 14a-14b are views which show assembly of the contact
for the first electronic device, according to the present
invention;
[0048] FIG. 15a is a view to illustrate an operating distance of
the contact for the first electronic device, according to the
present invention;
[0049] FIG. 15b is a view to illustrate the maximum operating
distance of the contact for the first electronic device, according
to the present invention;
[0050] FIG. 16 is a sectional view of a test socket in which the
contacts for electronic devices, according to the present
invention, are mounted; and
[0051] FIG. 17 is an enlarged sectional view of portion "A"
encircled in FIG. 16.
DETAILED DESCRIPTION OF THE INVENTION
[0052] Hereinafter, the present invention will be described in
detail with reference to the attached drawings.
[0053] A contact 100 for a first electronic device according to the
present invention will be described below with reference to FIGS. 5
through 8b.
[0054] FIG. 5 is a perspective view of a contact 100 for a first
electronic device, according to the present invention, FIG. 6 is an
exploded perspective view of the contact 100 for the first
electronic device, according to the present invention, FIG. 7a is a
front view of an upper contact pin 110 of the contact 100 for the
first electronic device, according to the present invention, FIG.
7b is a side sectional view of the upper contact pin 110 of the
contact for the first electronic device, according to the present
invention, FIG. 8a is a front sectional view to show the state
where upper and lower contact pins 110 and 130 of the contact 100
for the first electronic device, according to the present
invention, are coupled to each other, and FIG. 8b is a side
sectional view to show the state where the upper and lower contact
pins 110 and 130 of the contact 100 for the first electronic
device, according to the present invention, are coupled to each
other.
[0055] As shown in FIGS. 5 and 6, the contact 100 for the first
electronic device, according to this invention, includes an upper
contact pin 110, a lower contact pin 130, and a spring 190. The
upper and lower contact pins 110 and 130 have the same
construction, and are coupled to be aligned in an orthogonal
orientation to each other. The orthogonal orientation is with one
contact pin disposed at an angular displacement of ninety degrees
about a longitudinal axis of the contact pin, with respect to a
mating contact pin. The open ends of the contact pins having the
hooks are also aligned in opposite directions along the
longitudinal axis of the contact. The spring 190 provides a
resilient biasing member which is fitted over a predetermined area
between the upper and lower contact pins 110 and 130.
[0056] The upper and lower contact pins 110 and 130 are produced by
fabricating a sheet made of copper alloy through sheet metal
working. The shape of each of the contact pins 110 and 130 and the
thickness of each of the contact pins 110 and 130, which vary
slightly, are achieved using a sheet metal stamping die.
Preferably, the contact pins 110 and 130 and the spring 190 are
plated with gold so as to maintain constant electrical properties,
and such that ends of the contact pins 110 and 130 are
solderable.
[0057] Further, as shown in FIGS. 7a and 7b, the upper contact pin
110 includes a V-shaped contact part 111, two support protrusions
112 and 113, and a body 118. The V-shaped contact part 111 contacts
a ball-shaped lead 2 of a semiconductor IC 1, which is shown in
FIG. 1c.
[0058] The structure and function of this embodiment have been
described using the upper contact pin 110. However, they may be
illustrated with the lower contact pin.
[0059] The body 118 includes two longitudinally extending tangs 119
which extend to define two elastic parts which are symmetrical with
respect to each other. An inclined surface 122 and a hook 121
having a catch surface 128 are provided by protuberant portions
extending on an end of each the tangs defining the elastic parts
119. The catch surfaces 128 are preferably planar, but may be of
other shapes. A first channel 120 is defined by the two elastic
parts 119, and provides a space to allow relative movement of the
contact pins 110 and 130. Further, a second channel 116 is provided
in the body 118, and is in stable electrical contact with hooks 121
and side contact surfaces provided by sidewalls 115 of another
contact pin 130.
[0060] The second channel 116 has a predetermined depth. The
thickness d2 between two bottom ends of the second channel 116 is
equal to or larger than the distance d1 between the inner ends
defining catch surfaces 128 of the hooks 121 of the elastic parts
defined by the tangs 119, which corresponds to a distance between
channel contact parts 123. Thus, when the upper contact pin 110 is
coupled to the lower contact pin 130, the catch surfaces 128 of the
hooks 121 of one of the contact pins 110 and 130 contact the bottom
of the second channel 116 of the other of the contact pins 110 and
130.
[0061] The upper and lower contact pins 110 and 130 constructed as
described above are coupled to each other, as shown in FIGS. 8a and
8b, slidably moveable relative to one another.
[0062] That is, two hooks 121 of one of the contact pins 110 and
130 are stopped by the catch surfaces 128 of the hooks 121 engaging
a stop surface 117 which is provided on rib portion 125 defining an
end of the second channel of the other of the contact pins 110 and
130, thus preventing undesirable removal of the contact pins 110
and 130, after the contact pins 110 and 130 have been coupled to
each other.
[0063] Further, the two contact pins 110 and 130 are coupled to be
orthogonal to each other, with respective ends facing in opposite
direction and one of the two contact pins 110 and 130 rotated
approximately ninety degrees about the longitudinal axis of the
contact with respect to the other of the two contact pins 110 and
130. The orthogonal orientation maintains electrical contact,
because the channel contact parts 123 of the two hooks 121 of one
of the contact pins 110 and 130 are biased toward both sides of the
bottom of the second channel 116 of the other of the contact pins
110 and 130, due to low elasticity. That is, the elasticity of the
two elastic members 119 provided by the two tangs are elastically
engaging the bottom surface of respective ones of the channels
116.
[0064] Further, the probability that one point of each side contact
surface 124 of the hooks 123 of one of the contact pins 110 and 130
is in electric contact with one point of each sidewalls 115
provided on the second channel 116 of the other of the contact pins
110 and 130 is maximized. Thus, eight side contact surfaces 124 of
the hooks 121 of the two contact pins 110 and 130 and eight
sidewalls 115 of the second channels 116 corresponding to the side
contact surfaces 124 are in electrical contact with each other at
one or more positions, thus maximizing the probability of
contact.
[0065] The contact 100 for the first electronic device, according
to this invention, constructed as described above allows the upper
contact pin 110 and the lower contact pin 130 to stably
electrically contact each other, thus efficiently transmitting a
high-frequency signal and a relatively large current.
[0066] A contact 200 for a second electronic device, according to
this invention, will be described with reference to FIGS. 9a to
FIG. 10b.
[0067] FIG. 9a is a front view of an upper contact pin 210 of a
contact 200 for a second electronic device, according to the
present invention. FIG. 9b is a side sectional view of the upper
contact pin 210 of the contact 200 for the second electronic
device, according to the present invention. FIG. 10a is a front
sectional view to show the state where upper and lower contact pins
210 and 230 of the contact 200 for the second electronic device,
according to the present invention, are coupled to each other. FIG.
10b is a side sectional view to show the state where the upper and
lower contact pins 210 and 230 of the contact 200 for the second
electronic device, according to the present invention, are coupled
to each other, slidably moveable along the longitudinal axis
208.
[0068] The contact 200 for the second electronic device according
to this invention includes the upper contact pin 210, the lower
contact pin 230, and a spring (not shown). The upper and lower
contact pins 210 and 230 have the same construction, and are
coupled to be orthogonal to each other. The spring provides a
resilient biasing member which is fitted over a predetermined area
between the upper and lower contact pins 210 and 230.
[0069] Since the spring of the contact 200 for the second
electronic device according to this invention has the same
construction and function as the spring 190 of the contact 100 for
the first electronic device, the spring will not be described in
detail herein.
[0070] Further, since the lower contact pin 230 of the contact 200
for the second electronic device according to this invention has
the same construction and function as those of the upper contact
pin 210 that will be described below, the description of the lower
contact pin 230 will be omitted herein.
[0071] The construction and function of the upper contact pin 210
of the contact 200 for the second electronic device according to
this invention remain the same as those of the upper contact pin
110 of the contact 100 for the first electronic device, except that
a hole 216 is formed in place of the second channel 116 defined in
the upper contact pin 110.
[0072] Further, reference numerals 211, 212 and 213, 215, 217, 218,
219, 220, 221, 222, 223, 224 and 225 of FIG. 9a correspond
respectively to the contact part 111, the support protrusions 112
and 113, the sidewalls 115, the stop surface 117, the body 118, the
elastic part 119, the first channel 120, the hook 121, the inclined
surface 122, the channel contact part 123, the side contact surface
124, and the rib portion 125 of the contact 100 for the first
electronic device. The corresponding components have the same
construction and function.
[0073] A contact 300 for a third electronic device, according to
the present invention, will be described with reference to FIGS.
11a to 12b.
[0074] FIG. 11a is a front view of an upper contact pin 310 of a
contact 300 for a third electronic device, according to the present
invention. FIG. 11b is a side sectional view of the upper contact
pin 310 of the contact 300 for the third electronic device,
according to the present invention. FIG. 12a is a front sectional
view to show the state where upper and lower contact pins 310 and
330 of the contact 300 for the third electronic device, according
to the present invention, are coupled to each other. FIG. 12b is a
side sectional view to show the state where the upper and lower
contact pins 310 and 330 of the contact 300 for the third
electronic device, according to the present invention, are coupled
to each other, slidably moveable along the longitudinal axis
308.
[0075] The contact 300 for the third electronic device according to
this invention includes the upper contact pin 310, the lower
contact pin 330, and a spring (not shown). The upper and lower
contact pins 310 and 330 have the same construction, and are
coupled to be orthogonal to each other. The spring 190 (not shown)
is fitted over a predetermined area between the upper and lower
contact pins 310 and 330.
[0076] Since the spring 190 of the contact for the third electronic
device according to this invention has the same construction and
function as that of the contact 100 for the first electronic
device, the spring 190 will not be described in detail herein.
[0077] Further, since the lower contact pin 330 of the contact 300
for the third electronic device according to this invention has the
same construction and function as those of the upper contact pin
310 that will be described below, the description of the lower
contact pin 330 will be omitted herein.
[0078] The construction and function of the upper contact pin 310
of the contact 300 for the third electronic device according to
this invention remain the same as those of the upper contact pin
110 of the contact 100 for the first electronic device, except that
a hole 316 is formed in place of the second channel 116 defined in
the upper contact pin 110, and the center of a stop surface 317 is
cut, defining two tabs 325 and 326, so that an elastic part 320 of
the upper contact pin 310 is extended.
[0079] Further, reference numerals 311, 312 and 313, 315, 318, 319,
320, 321, 322, 323, and 324 of FIG. 11a correspond respectively to
the contact part 111, the support protrusions 112 and 113, the
sidewalls 115, the body 118, the elastic part 119, the first
channel 120, the hook 121, the inclined surface 122, the channel
contact part 123, and the side contact surface 124 of the contact
for the first electronic device. The corresponding components have
the same construction and function.
[0080] The contacts 100, 200 and 300 for the first to third
electronic devices according to this invention may have upper and
lower contact parts having various shapes to be suitable for
intended purposes. For example, contact pins 110 and 130 may have
upper and lower contact parts 101 and 131 which each have a V
shape, as shown in FIG. 13a. Upper and lower contact parts 102 and
132 may each have a V shape which is pointed at ends thereof, as
shown in FIG. 13b. Upper and lower contact parts 103 and 133 may
each have an A shape, as shown in FIG. 13c. Upper and lower contact
parts 104 and 134 may each have an A shape which is pointed at an
end thereof, as shown in FIG. 13d. Upper and lower contact parts
105 and 135 may each have a rounded A shape, as shown in FIG. 13e.
Further, upper and lower contact parts 106 and 136 may each have a
rounded A shape which is pointed at an end thereof, as shown in
FIG. 13f.
[0081] Although not shown in the drawings, the upper and lower
contact parts may have shapes other than the above-mentioned shapes
to be suitable for the properties of an object to be electrically
connected. For example, one of the contact parts has a contact
structure as described above, while the other contact part has a
solderable structure.
[0082] As necessary, the shapes of the upper and lower contact
parts may be different from each other.
[0083] The assembly of the contact 100 for the first electronic
device according to this invention constructed as described above
will be described with reference to FIGS. 14a-14d.
[0084] FIGS. 14a-14d show the assembly of the contact 100 for the
first electronic device, according to the present invention.
[0085] First, the spring 190 is fitted over the lower contact pin
130 in a direction from an upper end of the lower contact pin 130
to a lower end thereof. The upper contact pin 110 rotates relative
to the lower contact pin 130 at ninety degrees. In such a state,
the upper contact pin 110 is inserted into the spring 190.
[0086] Thereafter, as shown in FIGS. 8a and 8b, the upper contact
pin 110 is inserted until the two hooks 121 of the upper contact
pin 110 are stopped by the stop surface 117 provided at a
predetermined position in the second channel 116 of the lower
contact pin 130. Thereby, the assembly is completed.
[0087] At this time, the spring 190 is compressed to some extent.
According to the intended purpose of the contact 100, the
compression force of the spring 190 is appropriately designed.
[0088] For the efficient assembly of the contact 100, that is, for
mass production, a contact 100 having proper dimensions may be used
or an automatic assembling machine may be developed to maximize the
efficiency of production.
[0089] The operation of the contact 100 for the first electronic
device, according to this invention, which is assembled through the
above-mentioned method will be described with reference to FIGS.
15a and 15b.
[0090] FIG. 15a is a view to illustrate an operating distance of
the contact 100 for the first electronic device, according to the
present invention, and FIG. 15b is a view to illustrate the maximum
operating distance of the contact 100 for the first electronic
device, according to the present invention.
[0091] The left portion of FIG. 15a shows the initial state of
assembly of the contact 100 for the first electronic device
according to this invention, while the right portion of FIG. 15a
shows the state where the contact 100 for the first electronic
device according to this invention is compressed by a distance
S.
[0092] Further, when the contact 100 is operated from the initial
state of assembly shown in the left portion of FIG. 15a to a state
where operation stopping surfaces 140 of the upper and lower
contact pins 110 and 130 contact each other, as shown in FIG. 15b,
the operation distance becomes the maximum operation distance Smax.
It is preferable that the operation distance be seventy percent to
eighty percent of the maximum operation distance, when the contact
110 is used in practice.
[0093] The examples of using the contact 100, 200 and 300 for
electronic devices, according to this invention, which is operated
as described above, will be described below with reference to FIGS.
16 and 17.
[0094] FIG. 16 is a sectional view of a test socket 20 in which the
contact 100 for electronic devices, according to the present
invention, is mounted. FIG. 17 is an enlarged sectional view of
portion "A" encircled in FIG. 16.
[0095] As shown in FIGS. 16 and 17, when an electronic device,
especially, a semiconductor IC 1, is tested using one of the
contacts 100, 200 or 300 for electronic devices, according to this
invention, it is preferable that upper and lower bodies 27 and 28
of the test socket have contact seating spaces 403 and 404, contact
holding stop shoulders 401 and 405, and contact protrusion holes
402 and 406. A plurality of the contacts 100 are received in the
test socket 20.
[0096] Preferably, the contact part 111 of the lower contact pin
130 of the contact 100 slightly protrudes from the bottom surface
of the socket body 22 by a distance S1. Thus, when the socket 20 is
mounted on a PCB, the contact 100 is compressed by the protruding
distance S1.
[0097] Further, a protruding part 111 of the upper contact pin 110
protruding from the upper body 27 by a distance S2 is in electric
contact with a terminal of an electronic device to be tested,
especially, a semiconductor IC 1. Referring to FIG. 17, the
protruding part contacts a ball shaped lead 2, which is the
terminal of a BGA-type IC 1. At this time, the socket cover 21
compresses the IC 1, so that the upper contact pin 110 of the
contact 100 is compressed by the distance S2. It is preferable to
design the test socket 20 such that the total compression distance
S1+S2 of the contact is seventy percent to eighty percent of the
above-mentioned maximum operation distance Smax.
[0098] Further, according to another example of the use of this
invention, the contact is applied to a single row of connectors or
a plurality of rows of connectors, so that it is possible to
electrically connect PCBs to each other. This invention may be used
as a contact for a battery charging terminal of a mobile phone. As
such, the contact of this invention may be variously used.
[0099] As described above, the present invention provides a contact
for electronic devices, capable of efficiently transmitting an
electrical signal from an upper contact pin to a lower contact pin.
Further, this invention provides a contact for electronic devices,
which reduces the number of components, thus enhancing productivity
and providing constant product quality, in addition to affording
mass production at low cost. Furthermore, this invention provides a
contact for electronic devices, which is variously usable. That is,
the contact may be used for various sockets for testing
semiconductor ICs or various connectors.
[0100] Although the preferred embodiments of the present invention
have been disclosed for illustrative purposes, those skilled in the
art will appreciate that various modifications, additions and
substitutions are possible, without departing from the scope and
spirit of the invention as disclosed in the accompanying
claims.
* * * * *