loadpatents
name:-0.027411937713623
name:-0.025019884109497
name:-0.046414852142334
Hwang; Dong Weon Patent Filings

Hwang; Dong Weon

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hwang; Dong Weon.The latest application filed is for "contact pin for testing semiconductor ic for high speed signal, spring contact inclucing same, and socket device".

Company Profile
25.34.35
  • Hwang; Dong Weon - Seongnam KR
  • Hwang; Dong Weon - Gyeonggi-do KR
  • HWANG; Dong Weon - Seongnam-si KR
  • Hwang; Dong Weon - Seoul KR
  • HWANG; Dong Weon - Gangnam-gu Seoul CA KR
  • Hwang; Dong Weon - Flower Mound TX
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Contact pin for testing semiconductor IC for high speed signal, spring contact including same, and socket device
Grant 11,387,584 - Hwang , et al. July 12, 2
2022-07-12
Contact Pin For Testing Semiconductor Ic For High Speed Signal, Spring Contact Inclucing Same, And Socket Device
App 20220209449 - HWANG; Dong Weon ;   et al.
2022-06-30
Spring Contact And Socket Having Spring Contact Embedded Therein
App 20220206041 - Hwang; Dong Weon ;   et al.
2022-06-30
Contact And Socket Device For Burning-in And Testing Semiconductor Ic
App 20220196727 - HWANG; Dong Weon ;   et al.
2022-06-23
Lidless Bga Socket Apparatus For Testing Semiconductor Device
App 20220163561 - Hwang; Dong Weon ;   et al.
2022-05-26
Contact And Test Socket Device For Testing Semiconductor Device
App 20210148950 - Hwang; Dong Weon ;   et al.
2021-05-20
Contact And Test Socket Device For Testing Semiconductor Device
App 20210140997 - Hwang; Dong Weon ;   et al.
2021-05-13
Spring Contact And Test Socket With Same
App 20210102973 - Hwang; Dong Weon ;   et al.
2021-04-08
BGA socket device for testing BGA IC
Grant 10,971,843 - Hwang , et al. April 6, 2
2021-04-06
Contact and socket device for testing semiconductor
Grant 10,955,438 - Hwang , et al. March 23, 2
2021-03-23
Contact and test socket device for testing semiconductor device
Grant 10,935,572 - Hwang , et al. March 2, 2
2021-03-02
Contact for testing semiconductor device, and test socket device therefor
Grant 10,761,110 - Hwang , et al. Sep
2020-09-01
Bga Socket Device For Testing Bga Ic
App 20200176910 - Hwang; Dong Weon ;   et al.
2020-06-04
Contact And Socket Device For Testing Semiconductor
App 20200049736 - Hwang; Dong Weon ;   et al.
2020-02-13
Socket device for testing IC
Grant 10,466,273 - Hwang , et al. No
2019-11-05
Contact For Testing Semiconductor Device, And Test Socket Device Therefor
App 20190317128 - Hwang; Dong Weon ;   et al.
2019-10-17
Socket apparatus for semiconductor device test
Grant 10,241,132 - Hwang , et al.
2019-03-26
Contact And Test Socket Device For Testing Semiconductor Device
App 20180348256 - Hwang; Dong Weon ;   et al.
2018-12-06
Spring contact
Grant 10,094,852 - Hwang , et al. October 9, 2
2018-10-09
Socket Apparatus For Semiconductor Device Test
App 20170045551 - HWANG; Dong Weon ;   et al.
2017-02-16
Socket device for testing semiconductor device
Grant 9,494,616 - Hwang , et al. November 15, 2
2016-11-15
Socket device for an IC test
Grant 9,435,853 - Hwang September 6, 2
2016-09-06
Socket Device For Testing Semiconductor Device
App 20150377924 - HWANG; Dong Weon ;   et al.
2015-12-31
Spring Contact
App 20150377925 - HWANG; Dong Weon ;   et al.
2015-12-31
Socket Device For An Ic Test
App 20140239993 - Hwang; Dong Weon
2014-08-28
Spring contact and a socket embedded with spring contacts
Grant 8,808,038 - Hwang August 19, 2
2014-08-19
Structure for a spring contact
Grant 8,715,015 - Hwang May 6, 2
2014-05-06
Structure For A Spring Contact
App 20130012076 - Hwang; Dong Weon
2013-01-10
Spring Contact And A Socket Embedded With Spring Contacts
App 20120238136 - Hwang; Dong Weon
2012-09-20
Test and burn-in socket for integrated circuits (ICs)
Grant 7,918,679 - Hwang April 5, 2
2011-04-05
Test And Burn-in Socket For Integrated Circuits (ics)
App 20110028019 - HWANG; Dong Weon
2011-02-03
Test And Burn-in Socket For Integrated Circuits (ics)
App 20110021056 - HWANG; Dong Weon
2011-01-27
Test and burn-in socket for integrated circuits (ICs)
Grant 7,874,863 - Hwang January 25, 2
2011-01-25
Test and burn-in socket for integrated circuits (ICS)
Grant 7,828,575 - Hwang November 9, 2
2010-11-09
Test And Burn-in Socket For Integrated Circuits (ics)
App 20090275220 - Hwang; Dong Weon
2009-11-05
BGA-type test and burn-in socket for integrated circuits (ICs)
Grant 7,601,018 - Hwang October 13, 2
2009-10-13
Bga-Type Test And Burn-In Socket For Integrated Circuits (Ics)
App 20080207036 - Hwang; Dong Weon
2008-08-28
Contact for electronic devices
Grant 7,025,602 - Hwang April 11, 2
2006-04-11
Contact For Electronic Devices
App 20060073710 - Hwang; Dong Weon
2006-04-06

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