loadpatents
Patent applications and USPTO patent grants for Hwang; Dong Weon.The latest application filed is for "contact pin for testing semiconductor ic for high speed signal, spring contact inclucing same, and socket device".
Patent | Date |
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Contact pin for testing semiconductor IC for high speed signal, spring contact including same, and socket device Grant 11,387,584 - Hwang , et al. July 12, 2 | 2022-07-12 |
Contact Pin For Testing Semiconductor Ic For High Speed Signal, Spring Contact Inclucing Same, And Socket Device App 20220209449 - HWANG; Dong Weon ;   et al. | 2022-06-30 |
Spring Contact And Socket Having Spring Contact Embedded Therein App 20220206041 - Hwang; Dong Weon ;   et al. | 2022-06-30 |
Contact And Socket Device For Burning-in And Testing Semiconductor Ic App 20220196727 - HWANG; Dong Weon ;   et al. | 2022-06-23 |
Lidless Bga Socket Apparatus For Testing Semiconductor Device App 20220163561 - Hwang; Dong Weon ;   et al. | 2022-05-26 |
Contact And Test Socket Device For Testing Semiconductor Device App 20210148950 - Hwang; Dong Weon ;   et al. | 2021-05-20 |
Contact And Test Socket Device For Testing Semiconductor Device App 20210140997 - Hwang; Dong Weon ;   et al. | 2021-05-13 |
Spring Contact And Test Socket With Same App 20210102973 - Hwang; Dong Weon ;   et al. | 2021-04-08 |
BGA socket device for testing BGA IC Grant 10,971,843 - Hwang , et al. April 6, 2 | 2021-04-06 |
Contact and socket device for testing semiconductor Grant 10,955,438 - Hwang , et al. March 23, 2 | 2021-03-23 |
Contact and test socket device for testing semiconductor device Grant 10,935,572 - Hwang , et al. March 2, 2 | 2021-03-02 |
Contact for testing semiconductor device, and test socket device therefor Grant 10,761,110 - Hwang , et al. Sep | 2020-09-01 |
Bga Socket Device For Testing Bga Ic App 20200176910 - Hwang; Dong Weon ;   et al. | 2020-06-04 |
Contact And Socket Device For Testing Semiconductor App 20200049736 - Hwang; Dong Weon ;   et al. | 2020-02-13 |
Socket device for testing IC Grant 10,466,273 - Hwang , et al. No | 2019-11-05 |
Contact For Testing Semiconductor Device, And Test Socket Device Therefor App 20190317128 - Hwang; Dong Weon ;   et al. | 2019-10-17 |
Socket apparatus for semiconductor device test Grant 10,241,132 - Hwang , et al. | 2019-03-26 |
Contact And Test Socket Device For Testing Semiconductor Device App 20180348256 - Hwang; Dong Weon ;   et al. | 2018-12-06 |
Spring contact Grant 10,094,852 - Hwang , et al. October 9, 2 | 2018-10-09 |
Socket Apparatus For Semiconductor Device Test App 20170045551 - HWANG; Dong Weon ;   et al. | 2017-02-16 |
Socket device for testing semiconductor device Grant 9,494,616 - Hwang , et al. November 15, 2 | 2016-11-15 |
Socket device for an IC test Grant 9,435,853 - Hwang September 6, 2 | 2016-09-06 |
Socket Device For Testing Semiconductor Device App 20150377924 - HWANG; Dong Weon ;   et al. | 2015-12-31 |
Spring Contact App 20150377925 - HWANG; Dong Weon ;   et al. | 2015-12-31 |
Socket Device For An Ic Test App 20140239993 - Hwang; Dong Weon | 2014-08-28 |
Spring contact and a socket embedded with spring contacts Grant 8,808,038 - Hwang August 19, 2 | 2014-08-19 |
Structure for a spring contact Grant 8,715,015 - Hwang May 6, 2 | 2014-05-06 |
Structure For A Spring Contact App 20130012076 - Hwang; Dong Weon | 2013-01-10 |
Spring Contact And A Socket Embedded With Spring Contacts App 20120238136 - Hwang; Dong Weon | 2012-09-20 |
Test and burn-in socket for integrated circuits (ICs) Grant 7,918,679 - Hwang April 5, 2 | 2011-04-05 |
Test And Burn-in Socket For Integrated Circuits (ics) App 20110028019 - HWANG; Dong Weon | 2011-02-03 |
Test And Burn-in Socket For Integrated Circuits (ics) App 20110021056 - HWANG; Dong Weon | 2011-01-27 |
Test and burn-in socket for integrated circuits (ICs) Grant 7,874,863 - Hwang January 25, 2 | 2011-01-25 |
Test and burn-in socket for integrated circuits (ICS) Grant 7,828,575 - Hwang November 9, 2 | 2010-11-09 |
Test And Burn-in Socket For Integrated Circuits (ics) App 20090275220 - Hwang; Dong Weon | 2009-11-05 |
BGA-type test and burn-in socket for integrated circuits (ICs) Grant 7,601,018 - Hwang October 13, 2 | 2009-10-13 |
Bga-Type Test And Burn-In Socket For Integrated Circuits (Ics) App 20080207036 - Hwang; Dong Weon | 2008-08-28 |
Contact for electronic devices Grant 7,025,602 - Hwang April 11, 2 | 2006-04-11 |
Contact For Electronic Devices App 20060073710 - Hwang; Dong Weon | 2006-04-06 |
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