U.S. patent application number 11/191308 was filed with the patent office on 2006-02-09 for optical or electronic module and method for its production.
Invention is credited to Albert Auburger, Hans Hurt, Thomas Lichtenegger, Stefan Paulus, Nikolaus Schunk, Frank Weberpals, Josef Wittl.
Application Number | 20060027479 11/191308 |
Document ID | / |
Family ID | 34928814 |
Filed Date | 2006-02-09 |
United States Patent
Application |
20060027479 |
Kind Code |
A1 |
Auburger; Albert ; et
al. |
February 9, 2006 |
Optical or electronic module and method for its production
Abstract
One or more aspects of the invention relate to an optical or
electronic module with at least one optical or electronic component
and a plastic package within which the component is embedded. The
component has an operative region that facilitates operative
connection with surroundings. The plastic package has a first
region, which comprises a transparent polymer compound, and a
second region, which comprises a non-transparent polymer compound.
The first region extends such that it borders the operative region
of the component.
Inventors: |
Auburger; Albert;
(Regenstauf, DE) ; Hurt; Hans; (Regensburg,
DE) ; Lichtenegger; Thomas; (Alteglofsheim, DE)
; Paulus; Stefan; (Zeitlarn, DE) ; Schunk;
Nikolaus; (Maxhutte-Haidhof, DE) ; Weberpals;
Frank; (Regensburg, DE) ; Wittl; Josef;
(Parsberg, DE) |
Correspondence
Address: |
ESCHWEILER & ASSOCIATES, LLC;NATIONAL CITY BANK BUILDING
629 EUCLID AVE., SUITE 1210
CLEVELAND
OH
44114
US
|
Family ID: |
34928814 |
Appl. No.: |
11/191308 |
Filed: |
July 28, 2005 |
Current U.S.
Class: |
206/497 ;
257/E23.052; 257/E23.126; 257/E25.032; 257/E33.059 |
Current CPC
Class: |
H01L 2924/12041
20130101; H01L 24/49 20130101; H01L 23/3135 20130101; H01L
2224/48247 20130101; G02B 6/4257 20130101; H01L 2224/8592 20130101;
G02B 6/4201 20130101; H01L 2924/12043 20130101; H01L 24/48
20130101; H01L 2924/19041 20130101; H01L 2224/48472 20130101; H01L
2924/1815 20130101; H01L 2924/00014 20130101; H01L 23/49575
20130101; G02B 6/4245 20130101; H01L 2224/48257 20130101; H01L
2224/49109 20130101; H01L 2924/14 20130101; H01L 33/54 20130101;
H01L 2224/48091 20130101; H01S 5/0231 20210101; H01L 2924/181
20130101; G02B 6/426 20130101; H01L 2924/01068 20130101; G02B
6/4253 20130101; H01S 5/02216 20130101; G02B 6/4204 20130101; G02B
6/4274 20130101; H01L 25/167 20130101; H01L 2224/48137 20130101;
H01L 2224/48235 20130101; H01L 2224/48091 20130101; H01L 2924/00014
20130101; H01L 2224/48472 20130101; H01L 2224/48247 20130101; H01L
2924/00 20130101; H01L 2224/49109 20130101; H01L 2224/48247
20130101; H01L 2924/00 20130101; H01L 2224/48472 20130101; H01L
2224/48091 20130101; H01L 2924/00 20130101; H01L 2924/12043
20130101; H01L 2924/00 20130101; H01L 2924/181 20130101; H01L
2924/00012 20130101; H01L 2924/00014 20130101; H01L 2224/45099
20130101; H01L 2924/00014 20130101; H01L 2224/45015 20130101; H01L
2924/207 20130101 |
Class at
Publication: |
206/497 |
International
Class: |
B65D 65/00 20060101
B65D065/00 |
Foreign Application Data
Date |
Code |
Application Number |
Jul 28, 2004 |
EP |
04090300.7 |
Claims
1. An optical or electronic module, comprising: at least one
optical or electronic component which has an operative region that
facilitates an operative connection to surroundings, and a plastic
package within which the component is embedded, where the plastic
package has a first region which comprises a transparent polymer
compound, and a second region which comprises a non-transparent
polymer compound, and where the first region extends such that it
borders the operative region of the component.
2. The module of claim 1, wherein an opening is formed in the
second region and borders the first region, the operative region of
the component being in operative connection with the surroundings
via the first region and the opening.
3. The module of claim 1, wherein the first region forms a
light-shaping or light-guiding structure above the operative region
of the component.
4. The module of claim 1, wherein the second region laterally
adjoins the first region and thereby encapsulates further
components of the module with the non-transparent polymer
compound.
5. The module of claim 4, wherein the component and the first
region of the plastic package are formed as a prefabricated package
and are placed as such onto a carrier of the module, the
subsequently provided second region of the plastic package partly
enclosing the prefabricated package, but not covering the first
region.
6. The module of claim 4, further comprising a bonding
interconnector at the border between the first region of the
plastic package and the second region of the plastic package from
which a first bonding wire extends into the first region and a
second bonding wire extends into the second region.
7. The module of claim 1, further comprising a carrier, where the
optical or electronic component is arranged on a first side of the
carrier and at least one further component of the module is
arranged on a second side of the carrier, the second region of the
plastic package encapsulating the components arranged on the second
side of the carrier.
8. The module of claim 7, wherein the second region of the plastic
package partly extends onto the first side of the carrier, but does
not cover the first region with the non-transparent polymer
compound.
9. The module of claim 7, wherein the optical or electronic
component is arranged on the carrier via a printed circuit board
with via holes.
10. The module of claim 1, wherein the optical component comprises
at least one of an optoelectronic transmitting component and an
optoelectronic receiving component.
11. The module of claim 1, wherein the electronic component
comprises at least one of a pressure sensor and a temperature
sensor.
12. A method for producing an optical or electronic module provided
with a plastic package, comprising: providing at least one optical
or electronic component, the component having an operative region
that facilitates operative connection with surroundings of the
module, encapsulatiing the component with a first transparent
polymer compound that at least borders the operative region,
encapsulating the component, the first, transparent polymer
compound and, if present, further components of the module with a
second, non-transparent polymer compound, and removing at least
some of the second polymer compound such that the first polymer
compound is exposed allowing the component to enter into operative
connection with the surroundings via the operative region.
13. The method of claim 12, wherein, after the partial removal of
the second polymer compound, a light-shaping or light-guiding
structure is formed in the first polymer compound above the
operative region of the component.
14. The method of claim 12, wherein the optical or electronic
component is arranged on a carrier before the encapsulation.
15. A method for producing an optical or electronic module provided
with a plastic package, comprising: providing at least one
prefabricated package having an optical or electronic component and
an encapsulation of the component, where the encapsulation
comprises a first, transparent polymer compound, the component
having an operative region that facilites operative connection with
surroundings of the module, and the encapsulation bordering at
least the operative region, arranging the prefabricated package on
a carrier, and encapsulating the package, the carrier and, if
present, further components of the module with a second,
non-transparent polymer compound, where the second polymer compound
partly encloses the prefabricated package, but does not cover the
first polymer compound of the prefabricated package.
16. A method for producing an optical or electronic module provided
with a plastic package, comprising: providing at least one
prefabricated package having an optical or electronic component and
an encapsulation of the component, where the encapsulation
comprises a first, transparent polymer compound, the component
having an operative region that facilitates operative connection
with surroundings of the module, and the encapsulation bordering at
least the operative region, arranging the prefabricated package on
a carrier, encapsulating the package, the carrier and, if present,
further components of the module with a second, non-transparent
polymer compound, and removing at least some of the second polymer
compound such that the first polymer compound is exposed allowing
the component to enter into operative connection with the
surroundings via operative region.
17. The method of claim 12, wherein the partial removal of the
second polymer compound comprises at least one of a milling process
and a laser ablation process, the second polymer compound being
removed down to the first, transparent polymer compound.
18. A method for producing an optical or electronic module provided
with a plastic package, comprising: providing at least one optical
or electronic component, the component having an operative region
that facilitates operative connection with surroundings of the
module, encapsulating the operative region with a first,
transparent polymer compound, and encapsulating a further component
of the module with a second, non-transparent polymer compound,
where the first and second polymer compounds are formed in
different regions of the module.
19. The method of claim 18, where the first and second polymer
compounds are formed next to each other in the module.
20. The method of claim 18, where the optical or electronic
component is located on a first side of a carrier, where at least
one further component of the module is located on a second side of
the carrier, and where the first and second polymer compounds are
provided on different sides of the module.
21. The method of claim 20, where the second polymer compound
extends onto the first side of the carrier.
22. The method of claim 18, where the first polymer compound and
the second polymer compound are provided in a two-component
injection-molding process.
Description
REFERENCE TO RELATED APPLICATIONS
[0001] This application claims the benefit of the priority date of
European application 04090300.7, filed on Jul. 28, 2004, the
contents of which are herein incorporated by reference in their
entirety.
FIELD OF THE INVENTION
[0002] The present invention relates generally optics, and more
particularly to an optical or electronic module and one or more
techniques for making the same.
BACKGROUND OF THE INVENTION
[0003] It is known to embed optoelectronic modules with a
transparent embedding material. For example, DE 199 09 242 A1
discloses an optoelectronic module where a leadframe with an
optoelectronic transducer is positioned in a module package and
embedded with a transparent, moldable polymer material. Light is
coupled in or out by means of an optical fiber, which is coupled to
a connecting piece of the module package. On the leadframe there is
also a driver device or receiving device for the optoelectronic
transducer.
[0004] However, the use of embedding materials that are transparent
for the respective range of wavelengths has disadvantages in that
transparent embedding materials generally have a high coefficient
of thermal expansion and, accordingly, when there are great
temperature fluctuations, stresses can occur within the embedding
or pachaging materials which can damage sensitive bonding wire
connections.
[0005] It is therefore advantageous in principle to incorporate
fillers within embedding materials which produce a favorable
coefficient of thermal expansion. A general disadvantage of the use
of such polymers, however, is that an optical path cannot be
created within the embedding material.
SUMMARY OF THE INVENTION
[0006] The following presents a simplified summary in order to
provide a basic understanding of one or more aspects of the
invention. This summary is not an extensive overview of the
invention, and is neither intended to identify key or critical
elements of the invention, nor to delineate the scope thereof.
Rather, the primary purpose of the summary is to present one or
more concepts of the invention in a simplified form as a prelude to
the more detailed description that is presented later.
[0007] One or more aspects of the present invention relate to
providing an optical or electronic module which provides desirable
thermal properties despite the use of non-transparent embedding
material.
[0008] According to one or more aspects of the present invention,
an optical or electronic module has a plastic package comprising a
first region, which comprises a transparent polymer compound, and a
second region, which comprises a non-transparent polymer compound.
The first region, with the transparent polymer compound, thereby
borders the operative region of the component and preferably
extends such that it exclusively borders the component. On the
other hand, other components of the module, such as for example an
electrical IC chip, resistors, capacitors, etc., and a possibly
present carrier, remain substantially free of the transparent
polymer compound. They are encapsulated with the non-transparent
polymer compound, which has a favorable thermal behavior.
[0009] One or more aspects of the present invention, therefore,
relate to using two plastics for the encapsulation, namely a
transparent plastic and a non-transparent plastic. The volume of
the transparent plastic can be minimized and its use locally
restricted, thus making it possible to use the optical or
electronic module at higher ambient temperatures.
[0010] According to one or more aspects of the present invnention,
an operative region of the optical or electrical component refers
to any region that permits an operative connection of the component
to the surroundings. For example, an operative region may comprise
the photosensitive region of a photodiode, the sensor region of a
pressure sensor or a temperature sensor, the light-emitting region
of a semiconductor laser or an LED or the area of a lens, a mirror
or a prism that is facing the outer side of the module.
[0011] In a preferred embodiement, it is provided that, bordering
the first region, an opening is formed in the second region, the
operative region of the component being in operative connection
with the surroundings via the first region and the opening. To
produce such a configuration, it is provided that, after
encapsulation with the transparent polymer compound, the component
is completely encapsulated with the non-transparent polymer
compound. Subsequently, the region over the operative region of the
component is partially removed again, for instance by milling or
laser ablation, until the optically transparent polymer compound of
the first region is exposed. This creates an opening in the second
region.
[0012] According to one or more aspects of the present invention, a
light-shaping or light-guiding structure is formed on the side of
the first region that is facing away from the operative region of
the component. For example, a lens, a Fresnel lens or a light guide
is formed in the first region.
[0013] According to one or more aspects of the present invention,
the second region laterally adjoins the first region and thereby
encapsulates further components of the module with the
non-transparent polymer compound. Such a further component may
merely be a carrier of the module on which the component is
arranged.
[0014] According to one or more aspects of the present invention,
the component and the first region of the plastic package bordering
it can form a prefabricated package (e.g., a "premolded package").
It may be, for example, a complete LED with SMD contacts or a laser
diode with SMD contacts. This premolded package can, for example,
be placed on a carrier of the module. In such an example, although
the subsequently provided second region of the plastic package
partly encloses the prefabricated package, it does not cover the
first region of the plastic package, so that the optical path is
retained. For this purpose, the geometries of the injection molds
used for the encapsulation are correspondingly designed.
[0015] According to one or more aspects of the present invention,
the transparent polymer compound is applied in advance to the
optical or electronic component so that merely the non-transparent
polymer has to be applied in an injection mold.
[0016] According to one or more aspects of the present invention,
the two regions arranged next to each other (with transparent
polymer compound and with non-transparent polymer compound) are
produced one after the other, for instance in a 2-component
injection-molding process. In such a case, preferably at the border
between the first region of the plastic package and the second
region of the plastic package there is a bonding interconnector,
from which a first bonding wire extends into the first region and a
second bonding wire extends into the second region. This permits
the electrical contacting of the component in spite of the use of
two plastics. The border between the plastics runs straight through
the bonding interconnector.
[0017] According to one or more aspects of the present invention,
the optical or electronic component may be arranged on a carrier.
The carrier of the module is preferably formed as a leadframe, also
referred to as a metal carrier or a stamped grid. The leadframe
preferably has at least one planar carrier region, also referred to
as a "die pad" or "chip island", and also a plurality of contact
leads, which are located at the edge region of the leadframe. The
optical or electronic component is in this case respectively
arranged on a carrier region. Instead of a leadframe, however, it
is also possible in principle for any other carriers to be used.
For example, carriers which comprise a patterned film of plastic or
a printed circuit board can also be used. It is also possible in
principle to dispense with a separate carrier entirely.
[0018] According to one or more aspects of the present invention, a
carrier is provided and the optical or electronic component is
arranged on a first side of the carrier and at least one further
component of the module is arranged on a second side of the
carrier. In this case, the second region of the plastic package
encapsulates the components arranged on the second side of the
carrier. On the first side there is exclusively the transparent
polymer compound. This division allows simple application of the
polymer compounds and production of the module. Alternatively,
however, the second region of the plastic package also partly
extends onto the first side of the carrier, but does not cover the
first region with the transparent polymer compound.
[0019] As a result, the thermal properties of the module are
further improved. According to one or more aspects of the present
invention, the optical or electronic component is preferably
arranged on the carrier by means of a printed circuit board with
via holes. The printed circuit board consists, for example, of
customary printed circuit board material or a patterned film of
plastic (e.g., of Kapton.RTM.).
[0020] According to one or more aspects of the present invention,
the optical component preferably comprises an optoelectronic
transmitting component or an optoelectronic receiving component, in
particular a photodiode, an LED or a semiconductor laser. However,
the optical component may, for example, also comprise a lens, an
optical filter, a prism, a mirror or the like. If the component
comprises an electronic component, it is preferably a sensor, in
particular a pressure sensor or a temperature sensor.
[0021] According to one or more aspects of the present invention, a
method for producing an optical or electronic module provided with
a plastic package is provided. The method includes providing at
least one optical or electronic component, the component having an
operative region that facilitates operative connection with
surroundings of the module. The method also inclused encapsulatiing
the component with a first transparent polymer compound that at
least borders the operative region, and encapsulating the
component, the first, transparent polymer compound and, if present,
further components of the module with a second, non-transparent
polymer compound. Also, at least some of the second polymer
compound is removed such that the first polymer compound is exposed
allowing the component to enter into operative connection with the
surroundings via the operative region.
[0022] According to one or more aspects of the present invention,
after encapsulation with the transparent polymer compound, the
component is encapsulated with the non-transparent polymer
compound. Subsequently, a region over the component is partially
removed again, for example by milling or laser ablation, until the
optically transparent polymer compound is exposed.
[0023] According to one or more aspects of the present invention,
another method for producing an optical or electronic module
provided with a plastic package is provided. The method includes
providing at least one prefabricated package having an optical or
electronic component and an encapsulation of the component, where
the encapsulation comprises a first, transparent polymer compound,
the component having an operative region that facilites operative
connection with surroundings of the module, and the encapsulation
bordering at least the operative region. The method also incluses
arranging the prefabricated package on a carrier, and encapsulating
the package, the carrier and, if present, further components of the
module with a second, non-transparent polymer compound, where the
second polymer compound partly encloses the prefabricated package,
but does not cover the first polymer compound of the prefabricated
package.
[0024] According to one or more aspects of the present invention,
the non-transparent polymer compound is realized in a prefabricated
package. This is followed by embedding or press-molding with the
non-transparent embedding compound.
[0025] According to one or more aspects of the present invention,
yet another method for producing an optical or electronic module
provided with a plastic package is provided. The method includes
providing at least one prefabricated package having an optical or
electronic component and an encapsulation of the component, where
the encapsulation comprises a first, transparent polymer compound,
the component having an operative region that facilitates operative
connection with surroundings of the module, and the encapsulation
bordering at least the operative region. The method also includes
arranging the prefabricated package on a carrier, and encapsulating
the package, the carrier and, if present, further components of the
module with a second, non-transparent polymer compound. Also, at
least some of the second polymer compound is removed such that the
first polymer compound is exposed allowing the component to enter
into operative connection with the surroundings via operative
region.
[0026] According to one or more aspects of the present invention,
preferably the partial removal of the second polymer compound takes
place by a milling process or a laser ablation process. In this
case, the second, non-transparent polymer compound is removed down
to the first, transparent polymer compound.
[0027] According to one or more aspects of the present invention,
still another method for producing an optical or electronic module
provided with a plastic package is provided. The method includes
providing at least one optical or electronic component, the
component having an operative region that facilitates operative
connection with surroundings of the module, and encapsulating the
operative region with a first, transparent polymer compound. Also,
a further component of the module is encapsulated with a second,
non-transparent polymer compound, where the first and second
polymer-compounds are formed in different regions of the
module.
[0028] According to one or more aspects of the present invention,
the first and second polymer compounds are formed next to each
other in the module.
[0029] According to one or more aspects of the present invention, a
carrier is additionally provided, on a first side of which the
optical or electronic component is located, and on a second side of
which at least one further component of the module is located, the
first and second polymer compounds being provided on different
sides of the module. The further component may also be merely the
carrier.
[0030] According to one or more aspects of the present invention,
an encapsulation of the component with polymer compound preferably
comprises embedding or press-molding the component with the polymer
compound. The embedding or press-molding may in this case take
place in a special mold, in particular an injection mold.
BRIEF DESCRIPTION OF THE DRAWINGS
[0031] The invention is explained in more detail below wherein
reference is made to the following drawings.
[0032] FIG. 1a illustrates a cross sectional view through
components of a first exemplary embodiment of an optical module
after a first fabrication stage according to one or more aspects of
the present invention;
[0033] FIG. 1b illustrates a cross sectional view through
components of the optical module of FIG. 1a after a further
production stage;
[0034] FIG. 1c illustrates a cross sectional view of the finished
optical module according to the first exemplary embodiment;
[0035] FIG. 2a illustrates a cross sectional view of a second
exemplary embodiment of an optical module according to one or more
aspects of the present invention;
[0036] FIG. 2b illustrates a cross sectional view of a
prefabricated package of the optical module of FIG. 2a;
[0037] FIG. 3 illustrates a cross sectional view through a third
exemplary embodiment of an optical module according to one or more
aspects of the present invention;
[0038] FIG. 4 illustrates a cross sectional view through a fourth
exemplary embodiment of an optical module according to one or more
aspects of the present invention.
DETAILED DESCRIPTION OF THE INVENTION
[0039] One or more aspects of the present invention will now be
described with reference to the drawing figures, wherein like
reference numerals are used to refer to like elements throughout.
It should be understood that the drawing figures and following
descriptions are merely illustrative and that they should not be
taken in a limiting sense. In the following description, for
purposes of explanation, numerous specific details are set forth in
order to provide a thorough understanding of the present invention.
It will be evident to one skilled in the art, however, that the
present invention may be practiced without these specific details.
Thus, it will be appreciated that variations of the illustrated
systems and methods apart from those illustrated and described
herein may exist and that such variations are deemed as falling
within the scope of the present invention and the appended
claims.
[0040] FIG. 1c illustrates a first exemplary embodiment of an
optical module according to one or more aspects of the present
invention. The module includes an optical component 1 and an
assigned electronic device 2, which are arranged on a leadframe 3,
and also with a plastic package 4, which consists on the one hand
of a transparent polymer material 41 and on the other hand of a
non-transparent polymer material 42 and forms regions 41, 42
corresponding thereto. In the package 4 there is, bordering the
non-transparent material 42, a package opening 43.
[0041] The optical component 1 is, for example, a luminescence
diode (LED), a semiconductor laser or a photodiode. The electronic
device 2 is, for example, a driver or a preamplifier. The optical
component 1 preferably takes the form of a prefabricated chip. The
electronic device 2 preferably takes the form of an integrated
circuit (IC).
[0042] The optical component 1 has on its upper side an operative
area 11. This is, for example, a light-emitting area 11 of an LED
chip.
[0043] The leadframe 3 has two planar carrier areas 31, 32, which
are also referred to as "die pads" and on which on the one hand the
optical component 1 and on the other hand the electronic device 2
are arranged. Furthermore, the leadframe 3 has at its edge a
plurality of contact leads. In this case, the contact leads project
from the package 4. Leadframes 3 of this type are known in the
prior art, so are not discussed any further.
[0044] FIG. 1a illustrates the module represented in FIG. 1c after
an initial stage of fabrication. On the leadframe 3, the optical
component 1 and the electronic device 2 are arranged on the carrier
regions 31, 32, respectively. The electrical contacting of these
module components 1, 2 takes place on the one hand by a contact on
the underside, which is electrically connected directly to the
respective carrier area 31, 32, and on the other hand by means of
bonding wires 5.
[0045] A drop of transparent polymer material 41 is applied to the
optical component 1 and hardened. Such a transparent drop is also
referred to as a "glob top".
[0046] Subsequently, according to FIG. 1b, the entire arrangement
is embedded or press-molded with a non-transparent polymer material
42, which contains fillers to improve the physical properties. For
example, the non-transparent polymer material 42 is press-molded in
an injection-molding process around the already present components,
in particular also around the drop of transparent polymer material
41.
[0047] To provide an optical window and make it possible for the
optical component 1 to communicate with the outside world, it is
then also necessary to remove a partial region of the
non-transparent polymer material 42, and more particularly the
partial region which is located between the transparent polymer
material 41 and the outer side of the package 4. The exposure takes
place for example by a milling device or by means of a laser
ablation device. The package opening 42 represented in FIG. 1c is
thereby formed.
[0048] Removal of the non-transparent polymer material 42 in the
region of the package window 43 thereby takes place until the
optically transparent material 41, and with it the optical window
of the component 1, is exposed.
[0049] This opportunity is taken to point out that, for the
purposes of the present invention, the term "optically transparent"
or "transparent" is understood as meaning that the respective
material is transparent for the one or more wavelengths emitted or
received by the component being considered.
[0050] In a modification of the optical module of FIG. 1, it is
envisaged to realize a specific geometry 41a in the transparent
material 41 after exposure of the optical window 43. This is
represented by dashed lines in FIG. 1c. In particular, a
light-shaping or light-guiding geometry 41a, for example a lens, a
Fresnel lens or a light guide, may be provided. The desired
geometry is produced for example by means of a specially shaped
miller or with the aid of a laser.
[0051] FIG. 2a illustrates a further exemplary embodiment according
to one or more aspects of the present invention, in which the
optical component 1 is part of a prefabricated package 6 with SMD
contacts, which is placed onto a leadframe 3 by a standard
component-loading process. The standard component-loading process
comprises, for example, adhesive bonding or soldering of the
prefabricated component onto the leadframe 3.
[0052] The prefabricated package 6 is represented in greater detail
in FIG. 2b. Apart from the actual optical component 1, it has a
carrier material 63, for example a submount or a leadframe, and
also bonding wires 62. The optical component is surrounded by an
optically transparent material 61. The construction of the package,
however, is to be understood as only given by way of example.
[0053] After loading the leadframe 3 with the prefabricated SMD
package 6, the leadframe 3 is encapsulated together with the
electronic device 1 and the package 6 by injection-molding with a
non-transparent polymer compound 42. In this case, the geometries
of the injection mold used for this are designed in such a way
that, although the carrier material 63 of the package 6 is partly
enclosed by the non-transparent embedding compound 42, the optical
window of the package 6 remains free of the non-transparent polymer
compound 42.
[0054] In the case of this configuration, the non-transparent
embedding compound 42 consequently forms a region of the package
which is adjacent and alongside the transparent polymer compound 61
of the prefabricated package 6.
[0055] In a modification of the production method, the package 6 is
initially completely enclosed with the non-transparent polymer
compound 42 and, subsequently, the non-transparent polymer compound
42 is removed by means of a milling process or a laser ablation
process in a way corresponding to the exemplary embodiment of FIGS.
1a to 1c.
[0056] FIG. 3 illustrates a third exemplary embodiment of a module
according to one or more aspects of the present invention, where
the module comprises an optical component 1, an assigned electrical
device 2, a carrier 3 with two carrier regions 31, 32, a
transparent embedding compound 41 and a non-transparent embedding
compound 42. The transparent embedding compound 41 thereby
additionally forms an integrated lens 9.
[0057] The module of FIG. 3 is produced by a 2-component
injection-molding process. The optical component 1, which is
located on the one leadframe carrier region 31, is embedded with
the transparent polymer compound 41. If the corresponding leadframe
carrier region 31 were to have further optical components, for
example, these would likewise be embedded with the transparent
polymer compound 41. Following this, the remaining components and
regions are packaged with the non-transparent polymer compound 42.
It is immaterial here whether embedding takes place first with the
non-transparent polymer compound or with the transparent polymer
compound.
[0058] The module has in this case a so-called bonding
interconnector 7. This is a conducting region, from which on the
one hand a bonding wire extends to the optical component 1 and on
the other hand a bonding wire extends to the electronic device 2.
The bonding interconnector 7 in this case runs through the
interface between the transparent polymer 41 and the
non-transparent polymer 42. The bonding interconnector 7 permits
electrical contacting between the component 1 and the electronic
device 2 in spite of the use of two plastics. In addition, a
supporting area for an injection mold may be provided.
[0059] The bonding interconnector 7 may be realized with different
materials. For example, it can be realized by a region of the
leadframe, by a coated ceramic, by a patterned polymer carrier
layer (e.g., of polyimide) or by a printed circuit board, for
example.
[0060] FIG. 4 illustrates a fourth exemplary embodiment of an
optical module according to one or more aspects of the present
invention. The module can be produced in a manner substantially
similar to that described with respect to FIG. 3. Unlike the
configuration depicted in FIG. 3, however, the optical component 1
(e.g., an LED, a photodiode) is arranged on one side of a carrier
3, while electrical components, such as for example an electronic
device 2 and also resistors and capacitors, for example, are
arranged on the other side of the carrier 3. The carrier 3 is in
this case preferably formed in turn as a leadframe. The optical
component 1 is located on a substrate 8 with via holes 81, in order
to lead the electrical contacts to the leadframe 3 onto the upper
side of the substrate 8. The additional substrate 8 is, for
example, a printed circuit board or a patterned polyimide layer
(usually referred to in the trade as Kapton.RTM.).
[0061] In one example, the side with the optical component is
encapsulated by injection-molding with a transparent polymer
material. By contrast, the opposite side with the electrical
components is encapsulated by injection-molding with a
non-transparent polymer material.
[0062] In order to keep the volume of the transparent polymer
compound small, it is preferred that merely the optical component 1
is encapsulated by injection-molding with a transparent polymer
compound 41, while the other regions (in particular the leadframe 3
and the further substrate 8) are encapsulated by injection-molding
with a non-transparent polymer compound 42, 42'.
[0063] It is pointed out that the component 1 may also be an
electronic component. The component 1 may be, for example, a sensor
chip, such as a pressure sensor and/or a temperature sensor, for
example, as are used in the automobile industry.
[0064] Furthermore, it is pointed out that the module may have a
number of optical or electronic components as described herein, and
a transparent embedding material may be provided locally for each
of the components.
[0065] Finally, it is also pointed out that the production of the
optical or electronic module preferably takes place as repeats on a
multi-cavity mold, where the individual optical or electronic
modules are singulated after completion of the production
method.
[0066] Although the invention has been shown and described with
respect to a certain aspect or various aspects, it is obvious that
equivalent alterations and modifications will occur to others
skilled in the art upon the reading and understanding of this
specification and the annexed drawings. In particular regard to the
various functions performed by the above described components
(e.g., assemblies, devices, circuits, etc.), the terms (including a
reference to a "means") used to describe such components are
intended to correspond, unless otherwise indicated, to any
component which performs the specified function of the described
component (i.e., that is functionally equivalent), even though not
structurally equivalent to the disclosed structure which performs
the function in the herein illustrated exemplary embodiments of the
invention. In addition, while a particular feature of the invention
may have been disclosed with respect to only one of several aspects
of the invention, such feature may be combined with one or more
other features of the other aspects as may be desired and
advantageous for any given or particular application. Furthermore,
to the extent that includes, or other similar ters are used herein,
such terms are intended to be inclusive in a manner similar to the
term "comprising." Also, exemplary is merely intended to mean an
example, rather than the best.
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