| Patent | Date |
|---|
Electronic or optoelectronic assembly with an electromagnetic screening structure, method for manufacturing same
Grant 8,134,087 - Lichtenegger , et al. March 13, 2 | 2012-03-13 |
Semiconductor device
Grant 7,868,430 - Paulus , et al. January 11, 2 | 2011-01-11 |
Connector module and method of manufacturing the same
Grant 7,766,560 - Dangelmaier , et al. August 3, 2 | 2010-08-03 |
Process for producing and apparatus for improving the bonding between a plastic and a metal
Grant 7,732,333 - Betz , et al. June 8, 2 | 2010-06-08 |
Semiconductor device with semiconductor device components embedded in a plastic housing composition
Grant 7,705,472 - Mahler , et al. April 27, 2 | 2010-04-27 |
Semiconductor Device
App 20100078796 - PAULUS; Stefan ; et al. | 2010-04-01 |
Method and use of a device for applying coatings to band-like structures during the production of semiconductor components
Grant 7,635,612 - Betz , et al. December 22, 2 | 2009-12-22 |
Electronic device with semiconductor chip including a radiofrequency power module
Grant 7,622,802 - Paulus , et al. November 24, 2 | 2009-11-24 |
MID module and a method of mounting an optical fibre in an MID module
Grant 7,597,484 - Ghahremani , et al. October 6, 2 | 2009-10-06 |
Optocoupler for converting optical signals into electrical signals and vice versa
Grant 7,476,036 - Auburger , et al. January 13, 2 | 2009-01-13 |
Digital camera with a transparent core disposed between a lens and a light-sensitive sensor
Grant 7,453,509 - Losehand , et al. November 18, 2 | 2008-11-18 |
Method for producing an optical or electronic module provided with a plastic package
Grant 7,442,559 - Auburger , et al. October 28, 2 | 2008-10-28 |
Process for Producing and Apparatus for Improving the Bonding Between a Plastic and a Metal
App 20080258281 - Betz; Bernd ; et al. | 2008-10-23 |
Radiofrequency power semiconductor module with cavity housing, and method for producing it
Grant 7,417,198 - Betz , et al. August 26, 2 | 2008-08-26 |
Connector module and method of manufacturing the same
App 20080160828 - Dangelmaier; Jochen ; et al. | 2008-07-03 |
Mid Module And A Method Of Mounting An Optical Fibre In An Mid Module
App 20080152285 - Ghahremani; Cyrus ; et al. | 2008-06-26 |
Electronic Or Optoelectronic Assembly With An Electromagnetic Screening Structure, Method For Manufacturing Same
App 20080113205 - LICHTENEGGER; Thomas ; et al. | 2008-05-15 |
Method for producing a plurality of electronic devices
Grant 7,354,797 - Kilger , et al. April 8, 2 | 2008-04-08 |
Optocoupler for Converting Optical Signals into Electrical Signals and Vice Versa
App 20070217734 - Auburger; Albert ; et al. | 2007-09-20 |
Semiconductor Device with Semiconductor Device Components Embedded in a Plastic Housing Composition
App 20070145606 - Mahler; Joachim ; et al. | 2007-06-28 |
Method and use of a device for applying coatings to band-like structures during the production of semiconductor components
App 20070128371 - Betz; Bernd ; et al. | 2007-06-07 |
Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier
Grant 7,221,048 - Daeche , et al. May 22, 2 | 2007-05-22 |
Method for producing a plurality of electronic devices
App 20060192285 - Kilger; Thomas ; et al. | 2006-08-31 |
Electronic device with external contact elements and method for producing a plurality of the devices
Grant 7,067,915 - Kilger , et al. June 27, 2 | 2006-06-27 |
Electronic sensor device and method for producing the electronic sensor device
Grant 7,056,764 - Auburger , et al. June 6, 2 | 2006-06-06 |
Electronic component comprising external surface contacts and a method for producing the same
App 20060091561 - Dangelmaier; Jochen ; et al. | 2006-05-04 |
Production methods for a leadframe and electronic devices
App 20060060981 - Paulus; Stefan | 2006-03-23 |
Method for producing an optical or electronic module provided with a plastic package and an optical or electronic module
App 20060049548 - Auburger; Albert ; et al. | 2006-03-09 |
Optical or electronic module and method for its production
App 20060027479 - Auburger; Albert ; et al. | 2006-02-09 |
Method for producing an optical or electronic module provided with a plastic package
App 20060024851 - Auburger; Albert ; et al. | 2006-02-02 |
Electronic device with semiconductor chip including a radiofrequency power module
App 20060012032 - Paulus; Stefan ; et al. | 2006-01-19 |
Method for fabricating a semiconductor component with contacts situated at the underside
App 20060014326 - Auburger; Albert ; et al. | 2006-01-19 |
High-frequency power semiconductor module with a hollow housing and method for the production thereof
App 20060012016 - Betz; Bernd ; et al. | 2006-01-19 |
Semiconductor module with a semiconductor sensor chip and a plastic package as well as method for its production
App 20060001116 - Auburger; Albert ; et al. | 2006-01-05 |
Leadframe for semiconductor chips and electronic devices and production methods for a leadframe and for electronic devices
Grant 6,969,905 - Paulus November 29, 2 | 2005-11-29 |
Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier
App 20050151246 - Daeche, Frank ; et al. | 2005-07-14 |
Apparatus for populating transport tapes
Grant 6,895,731 - Lehner , et al. May 24, 2 | 2005-05-24 |
Electronic device having a trimming possibility and at least one semiconductor chip and method for producing the electronic device
Grant 6,784,551 - Auburger , et al. August 31, 2 | 2004-08-31 |
Electronic device with external contact elements and method for producing a plurality of the devices
App 20040104459 - Kilger, Thomas ; et al. | 2004-06-03 |
Digital camera with a light-sensitive sensor
App 20040095502 - Losehand, Reinhard ; et al. | 2004-05-20 |
Apparatus for populating transport tapes
App 20040079055 - Lehner, Rudolf ; et al. | 2004-04-29 |
Apparatus and method for populating transport tapes
Grant 6,694,707 - Lehner , et al. February 24, 2 | 2004-02-24 |
Apparatus and method for populating transport tapes
App 20030136087 - Lehner, Rudolf ; et al. | 2003-07-24 |
Leadframe for semiconductor chips and electronic devices and production methods for a leadframe and for electronic devices
App 20030102538 - Paulus, Stefan | 2003-06-05 |
Electronic device having a trimming possibility and at least one semiconductor chip and method for producing the electronic device
App 20030057446 - Auburger, Albert ; et al. | 2003-03-27 |
Electronic sensor device and method for producing the electronic sensor device
App 20030052702 - Auburger, Albert ; et al. | 2003-03-20 |
Semiconductor component with contacts situated at the underside, and fabrication method
App 20030015774 - Auburger, Albert ; et al. | 2003-01-23 |
Method for manufacturing a component which is encapsulated in plastic, and a component which is encapsulated in plastic
App 20020076852 - Paulus, Stefan ; et al. | 2002-06-20 |
Housing for semiconductor chips
App 20010030359 - Hogerl, Jurgen ; et al. | 2001-10-18 |
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