U.S. patent application number 11/234118 was filed with the patent office on 2006-02-02 for semiconductor integrated circuit device and process for manufacturing the same.
Invention is credited to Hideo Aoki, Isamu Asano, Kazuhiko Kajigaya, Takahiro Kumauchi, Yoshitaka Tadaki, Makoto Yoshida.
Application Number | 20060024875 11/234118 |
Document ID | / |
Family ID | 25346410 |
Filed Date | 2006-02-02 |
United States Patent
Application |
20060024875 |
Kind Code |
A1 |
Yoshida; Makoto ; et
al. |
February 2, 2006 |
Semiconductor integrated circuit device and process for
manufacturing the same
Abstract
In a process for manufacturing a semiconductor integrated
circuit device having a MISFET, in order that a shallow junction
between the source/drain of the MISFET and a semiconductor
substrate may be realized by reducing the number of heat treatment
steps, all conductive films to be deposited on the semiconductor
substrate are deposited at a temperature of 500.degree. C. or lower
at a step after the MISFET has been formed. Moreover, all
insulating films to be deposited over the semiconductor substrate
are deposited at a temperature of 500.degree. C. or lower at a step
after the MISFET has been formed.
Inventors: |
Yoshida; Makoto; (Tokyo,
JP) ; Kumauchi; Takahiro; (Tokyo, JP) ;
Tadaki; Yoshitaka; (Hannou-shi, JP) ; Kajigaya;
Kazuhiko; (Iruma-shi, JP) ; Aoki; Hideo;
(Tokyo, JP) ; Asano; Isamu; (Iruma-shi,
JP) |
Correspondence
Address: |
ANTONELLI, TERRY, STOUT & KRAUS, LLP
1300 NORTH SEVENTEENTH STREET
SUITE 1800
ARLINGTON
VA
22209-3873
US
|
Family ID: |
25346410 |
Appl. No.: |
11/234118 |
Filed: |
September 26, 2005 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
10950595 |
Sep 28, 2004 |
|
|
|
11234118 |
Sep 26, 2005 |
|
|
|
09416959 |
Oct 13, 1999 |
6815762 |
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|
10950595 |
Sep 28, 2004 |
|
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08865864 |
May 30, 1997 |
5981369 |
|
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09416959 |
Oct 13, 1999 |
|
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|
Current U.S.
Class: |
438/197 ;
257/E21.634; 257/E21.641 |
Current CPC
Class: |
H01L 21/2652 20130101;
H01L 2924/0002 20130101; H01L 27/10855 20130101; H01L 27/10894
20130101; H01L 21/823814 20130101; H01L 21/324 20130101; H01L
27/10814 20130101; H01L 21/76849 20130101; H01L 21/76897 20130101;
H01L 27/10873 20130101; H01L 21/823871 20130101; H01L 23/53257
20130101; H01L 27/10882 20130101; H01L 29/6659 20130101; H01L
21/76889 20130101; H01L 27/1052 20130101; H01L 21/76802 20130101;
H01L 21/32051 20130101; H01L 21/76855 20130101; H01L 2924/0002
20130101; H01L 21/32053 20130101; H01L 2924/00 20130101 |
Class at
Publication: |
438/197 |
International
Class: |
H01L 21/8234 20060101
H01L021/8234 |
Foreign Application Data
Date |
Code |
Application Number |
May 31, 1996 |
JP |
8-137957 |
Claims
1. A method for manufacturing a semiconductor integrated circuit
device having a first portion for a memory array and a second
portion for a circuit other than the memory array on a
semiconductor substrate, which semiconductor integrated circuit
device comprises: a MISFET arranged in said first portion, said
MISFET having first semiconductor regions and a gate electrode
between said first semiconductor regions; second semiconductor
regions arranged in said second portion; a first insulating film
formed over said semiconductor substrate to cover said first and
second portions; a plurality of first openings formed
simultaneously in said first insulating film above both said first
and second portions; a plurality of first conductor plugs formed in
said first openings in said first insulating film on said first
semiconductor regions in said first portion and on said second
semiconductor regions in said second portion; a first conductive
strip formed on said first insulating film in said first portion
and electrically connected to one of the first semiconductor
regions of said MISFET through one of said first conductor plugs,
wherein said first conductive strip is formed in a separate
manufacturing step from said first conductor plugs; a second
conductive strip formed on said first insulating film in said
second portion and electrically connected to said second
semiconductor regions through said first conductor plugs to
electrically connect said second semiconductor regions to one
another through said second conductive strip, wherein said second
conductive strip is formed in a separate manufacturing step from
said first conductor plugs; a second insulating film formed over
said first insulating film and said first and second conductive
strips; a second opening formed in said second insulating film over
an upper surface of one of the first conductor plugs formed in one
of said first openings in the first insulating film and connected
to the other of said first semiconductor regions of said MISFET; a
second conductor plug formed in said second opening in said second
insulating film to electrically connect with said one of said first
conductor plugs connected to the other of said first semiconductor
regions of said MISFET; and a third conductive strip formed on said
second insulating film and electrically connected to said second
conductor plug, the method for manufacturing the semiconductor
integrated circuit device comprising steps of: forming said
plurality of first openings simultaneously in said first insulating
film above both said first and second portions; and forming said
plurality of first conductor plugs in said first openings in said
first insulating film on said first semiconductor regions in said
first portion and on said second semiconductor regions in said
second portion simultaneously, wherein one of first conductor plugs
is directly physically connected to one of the first semiconductor
regions and the first conductive strip in said first portion and
another of the first conductor plugs is directly physically
connected to one of the second semiconductor regions and the second
conductive strip in the second portion.
2. The method for manufacturing a semiconductor integrated circuit
device according to claim 1, wherein each of said first conductor
plugs is comprised of a tungsten film.
3. The method for manufacturing a semiconductor integrated circuit
device according to claim 2, wherein each of said first conductor
plugs is comprised of a multilayer film of titanium nitride and
tungsten.
4. The method for manufacturing a semiconductor integrated circuit
device according to claim 2, wherein said second semiconductor
regions comprise an n-type semiconductor region and a p-type
semiconductor.
5. The method for manufacturing a semiconductor integrated circuit
device according to claim 4, wherein said second conductor plug is
comprised of a tungsten film.
6. A method for manufacturing a semiconductor integrated circuit
device having a first portion for a memory array and a second
portion for a circuit other than the memory array on a
semiconductor substrate, which semiconductor integrated circuit
device comprises: a MISFET arranged in said first portion, said
MISFET having first semiconductor regions of n-type conductivity
and a gate electrode between said first semiconductor regions; a
second semiconductor region of n-type conductivity and a third
semiconductor region of p-type conductivity arranged in said second
portion; a first insulating film formed over said semiconductor
substrate to cover said first and second portions; a plurality of
first openings formed simultaneously in said first insulating film
above both said first and second portions; a plurality of first
conductor plugs each comprising a tungsten film formed in said
first openings in said first insulating film on said first
semiconductor regions in said first portion and on said second
semiconductor regions in said second portion; a first conductive
strip formed on said first insulating film in said first portion
and electrically connected to one of the first semiconductor
regions of said MISFET through one of said first conductor plugs,
wherein said first conductive strip is formed in a separate
manufacturing step from said first conductor plugs; a second
conductive strip formed on said first insulating film in said
second portion and electrically connected to said second and third
semiconductor regions through said first conductor plugs to
electrically connect said second and third semiconductor regions to
one another through said second conductive strip, wherein said
second conductive strip is formed in a separate manufacturing step
from said first conductor plugs; a second insulating film formed
over said first insulating film and said first and second
conductive strips; a second opening formed in said second
insulating film over an upper surface of one of the first conductor
plugs formed in one of said first openings in the first insulating
film and connected to the other of said first semiconductor regions
of said MISFET; a second conductor plug formed in said second
opening in said second insulating film to electrically connect with
said one of said first conductor plugs connected to the other of
said first semiconductor regions of said MISFET; and a third
conductive strip formed on said second insulating film and
electrically connected to said second conductor plug, the method
for manufacturing the semiconductor integrated circuit device
comprising steps of: forming said plurality of first openings
simultaneously in said first insulating film above both said first
and second portions; and forming said plurality of first conductor
plugs each comprising a tungsten film in said first openings in
said first insulating film on said first semiconductor regions in
said first portion and on said second semiconductor regions in said
second portion simultaneously, wherein one of first conductor plugs
is directly physically connected to one of the first semiconductor
regions and the first conductive strip in said first portion and
another of the first conductor plugs is directly physically
connected to one of the second semiconductor regions and the second
conductive strip in the second portion.
7. The method for manufacturing a semiconductor integrated circuit
device according to claim 6, wherein each of said first conductor
plugs comprises a multi-layer film of titanium nitride and
tungsten.
8. The method for manufacturing a semiconductor integrated circuit
device according to claim 6, wherein said second conductor plug is
comprised of a tungsten film.
9. The method for manufacturing a semiconductor integrated circuit
device according to claim 1, the semiconductor integrated circuit
device further comprising: first silicide layers formed between
surfaces of said first semiconductor regions and said plurality of
first conductor plugs formed in said openings in said first
insulating film on said first semiconductor regions; and second
silicide layers formed between surfaces of said second
semiconductor regions and said plurality of first conductor plugs
formed in said openings in said first insulating film on said
second semiconductor regions.
10. The method for manufacturing a semiconductor integrated circuit
device according to claim 6, the semiconductor integrated circuit
device, further comprising: first silicide layers formed between
surfaces of said first semiconductor regions and said plurality of
first conductor plugs formed in said openings in said first
insulating film on said first semiconductor regions; and second
silicide layers formed between surfaces of said second
semiconductor regions and said plurality of first conductor plugs
formed in said openings in said first insulating film on said
second semiconductor regions.
11. A method for manufacturing a semiconductor integrated circuit
device having a first portion for a memory array and a second
portion for a circuit other than the memory array on a
semiconductor substrate, which semiconductor integrated circuit
device comprises: a MISFET arranged in said first portion, said
MISFET having first semiconductor regions and a gate electrode
between said first semiconductor regions; second semiconductor
regions arranged in said second portion; a first insulating film
formed over said semiconductor substrate to cover said first and
second portions; a plurality of openings formed simultaneously in
said first insulating film above both said first and second
portions; a plurality of conductor plugs formed in said openings in
said first insulating film on one of said first semiconductor
regions in said first portion and on said second semiconductor
regions in said second portion; a first conductive strip formed on
said first insulating film in said first portion and electrically
connected to said one of the first semiconductor regions of said
MISFET through one of said conductor plugs, wherein said first
conductive strip is formed in a separate manufacturing step from
said conductor plugs; a second conductive strip formed on said
first insulating film in said second portion and electrically
connected to said second semiconductor regions through said
conductor plugs to electrically connect said second semiconductor
regions to one another through said second conductive strip,
wherein said second conductive strip is formed in a separate
manufacturing step from said conductor plugs; and a second
insulating film formed over said first insulating film and said
first and second conductive strips, the method for manufacturing
the semiconductor integrated circuit device comprising steps of:
forming said plurality of openings simultaneously in said first
insulating film above both said first and second portions; and
forming said plurality of conductor plugs in said openings in said
first insulating film on said one of the first semiconductor
regions in said first portion and on said second semiconductor
regions in said second portion simultaneously, wherein said one of
the conductor plugs is directly physically connected to said one of
the first semiconductor regions and the first conductive strip in
said first portion and another of the conductor plugs is directly
physically connected to one of the second semiconductor regions and
the second conductive strip in the second portion.
12. The method for manufacturing a semiconductor integrated circuit
device according to claim 11, wherein each of said conductor plugs
is comprised of a tungsten film.
13. The method for manufacturing a semiconductor integrated circuit
device according to claim 12, wherein each of said conductor plugs
is comprised of a multilayer film of titanium nitride and
tungsten.
14. The method for manufacturing a semiconductor integrated circuit
device according to claim 12, wherein said second semiconductor
regions comprise an n-type semiconductor region and a p-type
semiconductor.
15. A method for manufacturing a semiconductor integrated circuit
device having a first portion for a memory array and a second
portion for a circuit other than the memory array on a
semiconductor substrate, which semiconductor integrated circuit
device comprises: a MISFET arranged in said first portion, said
MISFET having first semiconductor regions of n-type conductivity
and a gate electrode between said first semiconductor regions; a
second semiconductor region of n-type conductivity and a third
semiconductor region of p-type conductivity arranged in said second
portion; a first insulating film formed over said semiconductor
substrate to cover said first and second portions; a plurality of
openings formed simultaneously in said first insulating film above
both said first and second portions; a plurality of conductor plugs
each comprised of a tungsten film formed in said openings in said
first insulating film on one of said first semiconductor regions in
said first portion and on said second semiconductor regions in said
second portion; a first conductive strip formed on said first
insulating film in said first portion and electrically connected to
said one of the first semiconductor regions of said MISFET through
one of said conductor plugs, wherein said first conductive strip is
formed in a separate manufacturing step from said conductor plugs;
a second conductive strip formed on said first insulating film in
said second portion and electrically connected to said second and
third semiconductor regions through said conductor plugs to
electrically connect said second and third semiconductor regions to
one another through said second conductive strip, wherein said
second conductive strip is formed in a separate manufacturing step
from said conductor plugs; and a second insulating film formed over
said first insulating film and said first and second conductive
strips, the method for manufacturing the semiconductor integrated
circuit device comprising steps of: forming said plurality of
openings simultaneously in said first insulating film above both
said first and second portions; and forming said plurality of
conductor plugs each comprised of tungsten film in said openings in
said first insulating film on said one of the first semiconductor
regions in said first portion and on said second semiconductor
regions in said second portion simultaneously, wherein said one of
the conductor plugs is directly physically connected to said one of
the first semiconductor regions and the first conductive strip in
said first portion and another of the conductor plugs is directly
physically connected to one of the second semiconductor regions and
the second conductive strip in the second portion.
16. The method for manufacturing a semiconductor integrated circuit
device according to claim 15, wherein each of said conductor plugs
is comprised of a multilayer film of titanium nitride and
tungsten.
17. The method for manufacturing a semiconductor integrated circuit
device according to claim 11, the semiconductor integrated circuit
device further comprising: first silicide layers formed between
surfaces of said first semiconductor regions and said plurality of
conductor plugs formed in said openings in said first insulating
film on said one of the first semiconductor regions; and, second
silicide layers formed between surfaces of said second
semiconductor regions and said plurality of conductor plugs formed
in said openings in said first insulating film on said second
semiconductor regions.
18. The method for manufacturing a semiconductor integrated circuit
device according to claim 15, the semiconductor integrated circuit
device further comprising: first silicide layers formed between
surfaces of said first semiconductor regions and said plurality of
conductor plugs formed in said openings in said first insulating
film on said one of the first semiconductor regions; and second
silicide layers formed between surfaces of said second
semiconductor regions and said plurality of first conductor plugs
formed in said openings in said first insulating film on said
second semiconductor regions.
19. A apparatus for manufacturing a semiconductor integrated
circuit device having a first portion for a memory array and a
second portion for a circuit other than the memory array on a
semiconductor substrate, which semiconductor integrated circuit
device comprises: a MISFET arranged in said first portion, said
MISFET having first semiconductor regions and a gate electrode
between said first semiconductor regions; second semiconductor
regions arranged in said second portion; a first insulating film
formed over said semiconductor substrate to cover said first and
second portions; a plurality of first openings formed
simultaneously in said first insulating film above both said first
and second portions; a plurality of first conductor plugs formed in
said first openings in said first insulating film on said first
semiconductor regions in said first portion and on said second
semiconductor regions in said second portion; a first conductive
strip formed on said first insulating film in said first portion
and electrically connected to one of the first semiconductor
regions of said MISFET through one of said first conductor plugs,
wherein said first conductive strip is formed in a separate
manufacturing step from said first conductor plugs; a second
conductive strip formed on said first insulating film in said
second portion and electrically connected to said second
semiconductor regions through said first conductor plugs to
electrically connect said second semiconductor regions to one
another through said second conductive strip, wherein said second
conductive strip is formed in a separate manufacturing step from
said first conductor plugs; a second insulating film formed over
said first insulating film and said first and second conductive
strips; a second opening formed in said second insulating film over
an upper surface of one of the first conductor plugs formed in one
of said first openings in the first insulating film and connected
to the other of said first semiconductor regions of said MISFET; a
second conductor plug formed in said second opening in said second
insulating film to electrically connect with said one of said first
conductor plugs connected to the other of said first semiconductor
regions of said MISFET; and a third conductive strip formed on said
second insulating film and electrically connected to said second
conductor plug, the apparatus for manufacturing the semiconductor
integrated circuit device comprising steps of: means for forming
said plurality of first openings simultaneously in said first
insulating film above both said first and second portions; and
means for forming said plurality of first conductor plugs in said
first openings in said first insulating film on said first
semiconductor regions in said first portion and on said second
semiconductor regions in said second portion simultaneously,
wherein one of first conductor plugs is directly physically
connected to one of the first semiconductor regions and the first
conductive strip in said first portion and another of the first
conductor plugs is directly physically connected to one of the
second semiconductor regions and the second conductive strip in the
second portion.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This is a Continuation of application Ser. No. 10/950,595,
filed Sep. 28, 2004, which, in turn is a Continuation of
application Ser. No. 09/416,959 (now U.S. Pat. No. 6,815,762),
filed Oct. 13, 1999, which is a Divisional of application Ser. No.
08/865,864 (now U.S. Pat. No. 5,981,369), filed May 30, 1997, the
entire disclosures of which are hereby incorporated by
reference.
BACKGROUND OF THE INVENTION
[0002] The present invention relates to a technique for
manufacturing a semiconductor integrated circuit device having
MISFETs (Metal Insulator Semiconductor Field Effect Transistors)
and, more particularly, to a technique which is effective if
applied to the manufacture of a semiconductor integrated circuit
device having a DRAM (Dynamic Random Access Memory).
[0003] The LSI, represented by a large capacity DRAM of recent
years, has encountered a serious problem in that the high cost of
manufacturing has been raised by an increase in the number of
manufacturing steps, as the manufacturing process becomes more
complicated with increases in integration, speed and function. In
accordance with this, the number of insulating films and conductive
films deposited over a semiconductor substrate at a temperature of
700 to 900.degree. C. has increased to make it difficult to achieve
a high performance for the MISFETs by realizing a shallow junction.
Moreover, the increase in the wiring resistance resulting from the
miniaturization raises an obstruction to the speedup.
SUMMARY OF THE INVENTION
[0004] An object of the present invention is to provide a technique
capable of reducing the number of heat treatment steps in a process
for manufacturing a semiconductor integrated circuit device having
MISFETs.
[0005] Another object of the present invention is to provide a
technique capable of simplifying the process for manufacturing a
semiconductor integrated circuit device having MISFETs.
[0006] Another object of the present invention is to provide a
technique capable of lowering the wiring resistance of a
semiconductor integrated circuit device having MISFETs.
[0007] Another object of the present invention is to improve the
manufacturing yield of a semiconductor integrated circuit device
having DRAMs.
[0008] Another object of the present invention is to improve the
electrical characteristics of a semiconductor integrated circuit
device having DRAMs.
[0009] The aforementioned and other objects and novel features of
the present invention will become apparent from the following
description to be made with reference to the accompanying
drawings.
[0010] Representatives of the aspects of the invention, as
disclosed herein, will be briefly described in the following.
[0011] By a process for manufacturing a semiconductor integrated
circuit device of the present invention, all conductive films to be
deposited over a semiconductor substrate are deposited at a
temperature of 500.degree. C. or lower at a step after formation of
the MISFETs.
[0012] By a process for manufacturing a semiconductor integrated
circuit device of the present invention, all conductive films to be
deposited over a semiconductor substrate are made of a metal or its
compound.
[0013] By a process for manufacturing a semiconductor integrated
circuit device of the present invention, all insulating films to be
deposited over a semiconductor substrate are deposited at a
temperature of 500.degree. C. or lower at a step after formation of
the MISFETs.
[0014] By the present invention, there is provided a semiconductor
integrated circuit device comprising: [0015] (a) a semiconductor
substrate having a major surface; [0016] (b) a first semiconductor
region formed in the major surface of said semiconductor substrate;
[0017] (c) a first insulating film formed over the major surface of
said semiconductor substrate and having a first opening for
exposing a portion of said first semiconductor region to the
outside; [0018] (d) a first conductor layer made of a polysilicon
film formed in said first opening; [0019] (e) a second insulating
film positioned over said first insulating film and having a second
opening for exposing a portion of said first conductor layer to the
outside; and [0020] (f) a second conductor layer formed in said
second opening, [0021] wherein a silicide layer is formed at the
interface between said first conductor layer and said second
conductor layer.
[0022] According to the present invention, there is provided a
process for manufacturing a semiconductor integrated circuit device
comprising: [0023] (a) the step of forming a first semiconductor
region in the major surface of a semiconductor substrate; [0024]
(b) the step of depositing a first insulating film over the major
surface of said semiconductor substrate; [0025] (c) the step of
forming a first opening in said first insulating film in such a way
as to expose a portion of said first semiconductor region to the
outside; [0026] (d) the step of forming a first conductor layer
made of a polysilicon film selectively in said first opening;
[0027] (e) the step of forming a silicide film of a refractory
metal layer selectively only over said first conductor layer by
depositing said refractory metal film over said first conductor
layer and said first insulating film and by subjecting the same to
a heat treatment; [0028] (f) the step of removing said refractory
metal film over said first insulating film while leaving the
silicide film of said refractory metal layer; [0029] (g) the step
of depositing a second insulating film over said first insulating
film to form a second opening for exposing a portion of the
silicide film of said refractory metal layer to the outside; and
[0030] (h) the step of forming a second conductor layer in said
second opening.
BRIEF DESCRIPTION OF THE DRAWINGS
[0031] FIGS. 1 to 16 are section views of an essential portion of a
semiconductor substrate and show respective steps of a process for
manufacturing a semiconductor integrated circuit device
representing an Embodiment 1 of the present invention;
[0032] FIG. 17 is a cross-section of an essential portion of a
semiconductor substrate and shows the steps of a process for
manufacturing a semiconductor integrated circuit device
representing an Embodiment 2 of the present invention;
[0033] FIGS. 18 to 22 are section views of an essential portion of
a semiconductor substrate and show respective steps of a process
for manufacturing a semiconductor integrated circuit device
representing an Embodiment 3 of the present invention;
[0034] FIGS. 23 to 33 are section views of an essential portion of
a semiconductor substrate and show respective steps of a process
for manufacturing a semiconductor integrated circuit device
representing an Embodiment 4 of the present invention;
[0035] FIGS. 34 to 37 are section views of an essential portion of
a semiconductor substrate and show respective steps of a process
for manufacturing a semiconductor integrated circuit device
representing an Embodiment 5 of the present invention;
[0036] FIGS. 38 to 47 are section views of an essential portion of
a semiconductor substrate and show respective steps of a process
for manufacturing a semiconductor integrated circuit device
representing an Embodiment 6 of the present invention;
[0037] FIGS. 48 to 52 are section views of an essential portion of
a semiconductor substrate and show respective steps a process for
manufacturing a semiconductor integrated circuit device
representing an Embodiment 7 of the present invention;
[0038] FIGS. 53 and 54 are flow charts of the semiconductor
integrated circuit device manufacturing process representing an
Embodiment 7 of the present invention; and
[0039] FIGS. 55 to 58 are section views of an essential portion of
a semiconductor substrate and show respective steps a process for
manufacturing a semiconductor integrated circuit device
representing an Embodiment 8 of the present invention.
BRIEF DESCRIPTION OF THE DRAWINGS
[0040] The embodiments of the present invention will be described
in detail with reference to the accompanying drawings. Throughout
the drawings for explaining the various embodiments, the parts or
portions having the same functions are designated by the same
reference numerals, and their repeated description will be
omitted
Embodiment 1
[0041] The present embodiment is applied to a process for
manufacturing a DRAM having memory cells of stacked capacitor
structure, and in which information storing capacitive elements
(capacitors) are arranged over memory cell selecting MISFETs.
[0042] For manufacturing this DRAM, first of all, there is prepared
a semiconductor substrate 1 which is made of a p-type single
crystal silicon having a specific resistance of about 10 .OMEGA.cm,
as shown in FIG. 1. The surface of the semiconductor substrate 1 is
oxidized to form a thin silicon oxide film 43, and a silicon
nitride film 44 is deposited over the silicon oxide film 43 by a
CVD method. This silicon nitride film 44 is etched by using a
photoresist as a mask to remove the silicon nitride film 44 from an
element isolating region.
[0043] Next, as shown in FIG. 2, the semiconductor substrate 1 is
annealed at a temperature of about 1,000.degree. C. by using the
silicon nitride film 44 as a mask, to form a field oxide film 2
having a thickness of about 400 nm.
[0044] Next, the silicon nitride film 44 is removed, and the
semiconductor substrate 1, at the regions to form a memory array
and to form n-channel MISFETs of a peripheral circuit, is doped
with ions of a p-type impurity (boron (B)), as shown in FIG. 3, to
form a p-type well 3. Moreover, the semiconductor substrate 1, at
the region to form p-channel MISFETs of a peripheral circuit, is
doped with ions of an n-type impurity (phosphor (P)) to form an
n-type well 4. Subsequently, the p-type well 3 is doped through the
field oxide film 2 with boron (B) ions of a p-type impurity to form
a p-channel stopper layer 5 below the field oxide film 2, and the
n-type well 4 is doped through the field oxide film 2 with phosphor
(P) ions of an n-type impurity to form an n-type channel stopper
layer 6 below the field oxide film 2. After this, the surfaces of
the individual active regions of the p-type well 3 and the n-type
well 4, enclosed by the field oxide film 2, are thermally oxidized
at a temperature of about 800.degree. C. to form a gate oxide film
7 having a thickness of about 8 nm.
[0045] Next, as shown in FIG. 4, there are formed gate electrodes
8A (word lines WL) for the memory cell selecting MISFETs, gate
electrodes 8B of the n-channel MISFETs of the peripheral circuit,
and gate electrodes 8C of the p-channel MISFETs. These gate
electrodes 8A (word lines WL) and the gate electrodes 8B and 8C are
simultaneously formed by depositing a tungsten (W) film having a
thickness of about 150 nm at a filming temperature of about
475.degree. C. over the semiconductor substrate 1 by a CVD method,
by depositing a silicon nitride film 9 having a thickness of about
250 nm at a filming temperature of about 360.degree. C. over the W
film by a plasma CVD method, and by patterning those films by an
etching method using a photoresist as a mask.
[0046] Next, as shown in FIG. 5, the p-type well 3 is doped with
ions of an n-type impurity such as phosphor (P) or arsenic (As) by
using a (not-shown) photo-resist mask for exposing the NMOS forming
region to the outside, and the n-type well 4 is doped with boron
(8) ions of a p-type impurity by using a (not-shown) photoresist
mask for exposing the PMOS forming region to the outside. By a
subsequent annealing step, the n-type impurity (P) forms n-type
semiconductor regions 11 (a source region and a drain region) of
the memory cell selecting MISFETs and n.sup.--type semiconductor
region of the n-channel MISFETs of the peripheral circuit in
self-alignment with the gate electrodes 8A and 8B, and the p-type
impurity (B) forms p.sup.--type semiconductor region 14 of the
p-channel MISFETs of the peripheral circuit in self-alignment with
the gate electrodes 8C.
[0047] Next, as shown in FIG. 6, side wall spacers 10 are formed at
the individual side walls of the gate electrode 8A (word lines WL)
and gate electrodes 8B and 8C. After this, the p-type well 3 of the
peripheral circuit is doped with ions of an n-type impurity such as
arsenic (As) or phosphor (P) by using a (not-shown) photoresist
mask covering the memory array region and the PMOS forming region
of the peripheral circuit, and the n-type well 4 is doped with
boron (B) ions of a p-type impurity by using a (not-shown)
photoresist mask covering the memory array region and the NMOS
forming region of the peripheral circuit. The side wall spacers 10
are formed by depositing a silicon nitride film having a thickness
of about 100 nm at a filming temperature of about 360.degree. C.
over the semiconductor substrate 1 using a plasma CVD method[[ ]]
and by working the silicon nitride film using an anisotropic
etching method.
[0048] Next, by annealing the semiconductor substrate 1 in a
nitrogen atmosphere at about 900.degree. C. to diffuse the
aforementioned n-type impurity (P) and p-type impurity, as shown in
FIG. 7, there are formed n-type semiconductor regions 11 (the
source regions and the drain regions) of the memory cell selecting
MISFETs, an n.sup.--type semiconductor region 12 and an
n.sup.+-type semiconductor region 13 of the n-channel MISFETs of
the peripheral circuit, and a p.sup.--type semiconductor region 14
and a p-type semiconductor region 15 of the p-channel MISFETs. The
n.sup.+-type semiconductor region 13 and the p.sup.+-type
semiconductor region 15 are formed in self-alignment with the side
wall spacers 10. In the peripheral circuit, the source regions and
the drain regions of the n-channel MISFETs are individually
constructed of an LDD (Lightly Doped Drain) structure composed of
the n.sup.--type semiconductor region 12 and the n.sup.+-type
semiconductor region 13, and the source regions and the drain
regions of the p-channel MISFETs are individually constructed of an
LDD structure composed of the p.sup.--type semiconductor region 14
and the p.sup.+-type semiconductor region 15.
[0049] Next, as shown in FIG. 5, contact holes 17 and 18 for
exposing a portion of the semiconductor region 11 to the outside
are formed over the n-type semiconductor regions 11 (the source
regions and the drain regions) of the n-type semiconductor regions
11 of the memory cell selecting MISFETs; contact holes 19 and 20
for exposing portions of the semiconductor regions 12 and 13 to the
outside are formed over the n.sup.+-type semiconductor regions 13
(the source regions and the drain regions) of the n-channel MISFETs
of the peripheral circuit; and contact holes 21 and 22 for exposing
portions of the semiconductor regions 14 and 15 to the outside are
formed over the p.sup.+-type semiconductor regions 15 (the source
regions and the drain regions) of the p.sup.+-type semiconductor
regions 15 of the p-channel MISFETs, by depositing a silicon oxide
film 16 having a thickness of about 500 nm at a filming temperature
of about 390.degree. C. over the memory cell selecting MISFETs, the
n-channel MISFETs and the p-channel MISFETs of the peripheral
circuit using a plasma CVD method, by polishing the silicon oxide
film 16 by a CMP (Chemical-Mechanical Polishing) method to flatten
its surface, and by etching the silicon oxide film 15 and the gate
oxide film 7 using a photoresist as a mask.
[0050] At this time, the silicon nitride film 9, formed over the
gate electrodes 8A (the word lines WL) of the memory cell selecting
MISFETs, and the side wall spacers 10 of silicon nitride, formed at
the side walls, are slightly etched so that the contact holes 17
and 18 are formed in self-alignment with the side wall spacers.
Likewise, the silicon nitride film 9, formed over the gate
electrodes 8B of the n-channel MISFETs of the peripheral circuit
and over the gate electrodes 8C of the p-channel MISFETs, and the
side wall spacers 10 of silicon nitride, formed at the side walls,
are slightly etched, so that the contact holes 19 to 22 are formed
in self-alignment with the side wall spacers 10.
[0051] The insulating film to be formed over the memory cell
selecting MISFETs and the n-channel MISFETs and p-channel MISFETs
of the peripheral circuit should not be limited to the
aforementioned silicon oxide film 16 but can be an ozone
(O.sub.3)-BPSG (Boron-doped Phospho Silicate Glass) film deposited
at a filming temperature of about 450.degree. C. by a CVD method,
or an ozone-TEOS (Tatra Ethoxy Silane) film deposited at a filming
temperature of about 400.degree. C. by a CVD method. These
insulating films are flattened at their surfaces by the
chemical-mechanical polishing (CMP) method, as for the silicon
oxide film 16.
[0052] Next, as shown in FIG. 9, plugs 23, made of a multilayer
film of titanium nitride (TiN) and W, are buried in the contact
holes 17 to 22. These plugs 23 are formed by depositing a TiN film
having a thickness of about 50 nm acting as an adhesive layer for
the substrate and the W film over the silicon oxide film 16 by a
sputtering method, by depositing the W film having a thickness of
about 300 nm at a filming temperature of 475.degree. C. over the
TiN film by a CVD method, and by etching back the W film and the
TiN film.
[0053] At this time, in order to reduce the contact resistance
between the plugs 23 and the substrate, a Ti silicide (TiSi.sub.2)
film may be formed below the contact holes 17 to 22. This Ti
silicide film is formed by depositing a Ti film having a thickness
of about 50 nm over the silicon oxide film 16 by a sputtering
method, by causing the Ti film and the semiconductor substrate
below the contact holes 17 to 22 to react by annealing them at a
temperature of about 800.degree. C., and by wet-etching off the Ti
film left unreacted over the silicon oxide film 16. After this, the
TiN film and W film, deposited over the silicon oxide film 16, are
etched back to form the plugs 23.
[0054] Next, as shown in FIG. 10, bit lines BL.sub.1 and BL.sub.2
and wiring lines 24A and 24B of the peripheral circuit are formed
over the silicon oxide film 16. These bit lines BL.sub.1 and
BL.sub.2 and the wiring lines 24A and 24B are simultaneously formed
by depositing a W film having a thickness of about 300 nm at a
filming temperature of about 475.degree. C. over the silicon oxide
film 16 by a plasma CVD method, by depositing a silicon nitride
film 25 having a thickness of about 200 nm at a filming temperature
of about 360.degree. C. over that W film by a plasma CVD method,
and by etching and patterning those films by using a photoresist as
the mask.
[0055] The bit line BL.sub.1 is electrically connected through the
aforementioned contact hole 17 with one of the source region and
the drain region (the n-type semiconductor regions 11) of the
memory cell selecting MISFET. The bit line BL.sub.2 is extended
from the memory array region to the peripheral circuit region and
is electrically connected through the aforementioned contact hole
19 with one of the source region and the drain region (the
n.sup.+-type semiconductor regions 13) of an n-channel MISFET Qn of
the peripheral circuit.
[0056] One end of the wiring line 24A of the peripheral circuit is
electrically connected through the contact hole 20 with the other
(the n.sup.+-type semiconductor region 13) of the source region and
the drain region of the n-channel MISFET, and the other end of the
wiring line 24A is electrically connected through the contact hole
21 with one of the source region and the drain region (the
p.sup.+-type semiconductor regions 15) of the p-channel MISFET. The
wiring line 24B is electrically connected through the contact hole
22 with the other (the p.sup.+-type semiconductor region 15) of the
source region and the drain region of the p-channel MISFET.
[0057] Next, as shown in FIG. 11, side wall spacers 26 are formed
at the individual side walls of the bit lines BL.sub.1 and BL.sub.2
and the wiring lines 24A and 24B. These side wall spacers 28 are
formed by depositing a silicon nitride film having a thickness of
about 100 nm at a filming temperature of about 360.degree. C. over
the silicon oxide film 16 by a plasma CVD method, and by working
the silicon nitride film by an anisotropic etching method.
[0058] Next, as shown in FIG. 12, contact holes 28 for exposing the
plugs 23 in the contact holes 18 to the outside are formed over the
contact holes 18, formed to expose the upper portion of one of the
n-type semiconductor regions 11 (the source region and the drain
region) of the memory cell selecting MISFET, by depositing a
silicon oxide film 27 having a thickness of about 500 nm at a
filming temperature of about 390.degree. C. over the bit lines
BL.sub.1 and BL.sub.2 and the wiring lines 24A and 24B by a plasma
CVD method, by polishing the silicon oxide film 27 by a chemical
mechanical polishing (CMP) method to flatten its surface, and by
etching the silicon oxide film 27 by using a photoresist as a mask.
At this time, the silicon oxide film 25, formed over the bit line
BL.sub.1, and the side wall spacers 26 of silicon nitride, formed
at the side walls, are slightly etched so that the contact holes 28
are formed in self-alignment with the side wall spacers 26.
[0059] The insulating film to be deposited over the bit lines
BL.sub.1 and BL.sub.2 and the wiring lines 24A and 24B should not
be limited to the aforementioned silicon oxide film 27 but can be
the aforementioned ozone-BPSG film or ozone-TEOS film, or an SOG
(Spin On Glass) film. The ozone-BPSG film or ozone-TEOS film is
flattened, if employed, on its surface by a chemical mechanical
polishing (CMP) method such as used for the silicon oxide film
27.
[0060] Next, as shown in FIG. 13, W plugs 30 are buried in the
contact holes 28, and storage electrodes (lower electrodes) 32 of
information storing capacitive elements are formed over the contact
holes 28. The W plugs 30 are formed by depositing a W film having a
thickness of about 300 nm at a filming temperature of about
500.degree. C. over the silicon oxide film 27 by a CVD method, and
by etching back the W film. The storage electrodes 32 are formed by
depositing a W film having a thickness of about 500 nm at a filming
temperature of about 475.degree. C. over the silicon oxide film 27
by a CVD method, and by pattering the W film by using a photoresist
as a mask. The W film constituting the plugs 30 is deposited at a
higher filming temperature (500.degree. C.) than that (475.degree.
C.) of the W film constituting the storage electrodes 32, because
it is required to retain the coverage of the inside of the contact
holes 28.
[0061] Next, as shown in FIG. 14, there are formed over the storage
electrodes 32, a capacitor insulating film 33 and plate electrodes
(upper electrodes) 34 of the information storing capacitive
elements. The capacitor insulating film 33 and the plate electrodes
34 are simultaneously formed by depositing a Ta.sub.2O.sub.5 film
having a thickness of about 15 nm at a filming temperature of about
400 to 480.degree. C. over the storage electrodes 32 by a CVD
method, by depositing a TiN film having a thickness of about 150 nm
over the Ta.sub.2O.sub.5 film by a sputtering method, and by
etching and patterning those films by using a photoresist as a
mask. As a result, there is formed an information storing
capacitive element C of the memory cell, which is composed of the
storage electrode 32, the capacitor insulating film 33 and the
plate electrode 34.
[0062] Next, as shown in FIG. 15, a contact hole 36 is formed over
the plate electrode 34 of the information storing capacitive
element C by depositing a silicon oxide film 35 having a thickness
of about 500 nm at a filming temperature of about 390.degree. C.
over the information depositing capacitive element C by a plasma
CVD method, and by etching the silicon oxide film 35 by using a
photoresist as a mask. Simultaneously with this, a contact hole 37
is formed over the wiring line 24A of the peripheral circuit, and a
contact hole 38 is formed over the wiring line 24B, by etching the
silicon oxide film 35, the silicon oxide film 27 and the silicon
nitride film 25. The insulating film to be deposited over the
information storing capacitive element C should not be limited to
the aforementioned silicon oxide film 35 but can be a three-layered
insulating film in which a spin-on-glass film is sandwiched between
the two silicon oxide films 35.
[0063] Next, as shown in FIG. 16, wiring lines 39A, 39B, 39C and
39D are formed over the silicon oxide film 35. These wiring lines
39A, 39B, 39C and 39D are simultaneously formed by depositing a TiN
film having a thickness of about 50 nm, an Al (aluminum) alloy film
having a thickness of about 500 nm and a TiN film having a
thickness of about 10 nm over the silicon oxide film 35 at a
substrate temperature of 300 to 350.degree. C. by a sputtering
method, and etching and patterning those films by using a
photoresist as a mask. By the steps thus far described, the DRAM of
the present embodiment is substantially completed.
[0064] By the DRAM manufacturing process of the present embodiment,
at the step after formation of the individual source regions and
drain regions of the memory cell selecting MISFET and the n-channel
MISFET and the p-channel MISFET of the peripheral circuit, the
wiring conductive film and the insulating film are deposited at a
temperature of 500.degree. C. or lower, so that the diffusion of
the impurity into the substrate by the high-temperature heat
treatment can be suppressed to realize a shallow junction between
the source regions and the drain regions thereby to enhance the
high performance of the DRAM.
[0065] By the DRAM manufacturing process of the present embodiment,
all of the wiring conductive films are made of metal materials (W
or Al) or the metal compound material (TiN) so that the wiring
resistance which may rise because of the miniaturization, can be
lowered to increase the speedup of the DRAM. The wiring conductive
film should not be limited to the material employed in the present
embodiment but can be made of Ti or copper (Cu), for example.
Embodiment 2
[0066] In the foregoing Embodiment 1, the gate electrodes 8A of the
memory cell selecting MISFET and the gate electrodes 8B of the
n-channel MISFET and the gate electrodes 8C of the p-channel MISFET
of the peripheral circuit are individually composed of the tungsten
(W) film which is deposited at the filming temperature of about
475.degree. C. In the present embodiment, however, the gate
electrodes 8A (the word lines WL) and the gate electrodes 8B and 8C
are composed of a multilayer film of a polycrystalline silicon
film, a titanium nitride (TiN) film and a tungsten (W) film, as
shown in FIG. 17.
[0067] In this case, the polycrystalline silicon film having a
thickness of about 250 nm is deposited at first at a filming
temperature of about 540.degree. C. by a CVD method, and the
titanium nitride (TiN) having a thickness of about 50 nm for an
adhesive layer between the polycrystalline silicon film and the
tungsten (W) film is then deposited over the polycrystalline
silicon film by a sputtering method. The polycrystalline silicon
film is doped with an n-type impurity or phosphor (P) of about
1.5.times.10.sup.20 cm.sup.-3. The titanium nitride prevents the
polycrystalline silicon film and the tungsten (W) film from
reacting to form a tungsten silicide (WSi) film. This is because
the resistance rises if the tungsten turns into tungsten
silicide.
[0068] Next, the gate electrodes 8A (the word lines WL) and the
gate electrodes 8B and 8C are simultaneously formed by depositing a
W film having a thickness of about 100 nm at a filming temperature
of about 475.degree. C. over the TiN film by a CVD method, by
depositing the silicon nitride film 9 having a thickness of about
250 nm at a filming temperature of about 360.degree. C. over the W
film by a plasma CVD method, and by etching and patterning the
silicon nitride film 9, the W film, the TiN film and the
polycrystalline silicon film by using a photoresist as a mask. The
other steps are identical to those of the foregoing Embodiment 1,
and a DRAM is completed by applying the steps after the step of
forming the gate electrodes BA, BE and SC.
[0069] By the DRAM manufacturing process of the present embodiment,
the wiring conductive film and the insulating film are deposited at
a temperature of 500.degree. C. or lower after the individual
source regions and drain regions of the memory cell selecting
MISFET and the n-channel MISFET and the p-channel MISFET of the
peripheral circuit have been formed, so that the high performance
of the DRAM can be enhanced.
[0070] By the DRAM manufacturing process of the present embodiment,
the high speed of the DRAM can be increased as in Embodiment 1 by
making all the wiring conductive films of a material containing a
metal material or a metal compound.
Embodiment 3
[0071] In order to manufacture a DRAM of the present embodiment, as
shown in FIG. 18, the surface of the semiconductor substrate 1 of
p.sup.--type single crystal silicon is thermally oxidized at first
to form a thin silicon oxide film 43, and a silicon nitride film 44
is then deposited over the silicon oxide film 43 by a CVD method.
The silicon nitride film 44 is etched by using a photoresist as a
mask, and it is removed from the element isolating region.
[0072] Next, as shown in FIG. 19, the semiconductor substrate 1 at
the element isolating region is etched by using the silicon nitride
film 44 as a mask to form shallow grooves 52 having a depth of
about 0.35 .mu.m, and a silicon oxide film 53 having a thickness of
about 10 nm is then formed in the shallow groove 52.
[0073] Next, as shown in FIG. 20, a silicon oxide film 54 is buried
in the shallow groove 52. In order to bury the silicon oxide film
54 in the shallow groove 52, the silicon oxide film 54 having a
thickness of about 600 nm is deposited over the semiconductor
substrate 1 by a CVD method and is then polished by a
chemical-mechanical polishing (CMP) method. After this, the silicon
nitride film 44, left over the semiconductor substrate 1, is etched
off.
[0074] Next, as shown in FIG. 21, a p-type well 3 is formed by
doping the semiconductor substrate 1 with ions of a p-type impurity
or boron (B) by using the (not-shown) photoresist for exposing the
region for forming the memory array and the region for forming the
n-channel MISFET of the peripheral circuit selectively to the
outside, and the n-type well 4 is formed by doping the
semiconductor substrate 1 with ions of an n-type impurity or
phosphor (P) by using the (not-shown) photoresist exposing the
region for forming the p-channel MISFET of the peripheral circuit
selectively to the outside. For this doping, the peaks of the
individual distributions of the n-type impurity and the p-type
impurity are substantially equalized to the depth of the shallow
groove 52, so that the p-type or n-type semiconductor regions are
formed in the semiconductor substrate at the bottom of the shallow
groove 52. As a result, the p-type well 3 acts as a p-type channel
stopper layer, and the n-type well 4 acts as an n-type channel
stopper layer.
[0075] Next, as shown in FIG. 22, the surfaces of the individual
active regions of the p-type well 3 and the n-type well 4, enclosed
by the shallow groove 52, are thermally oxidized at a temperature
of about 800.degree. C. to form the gate oxide film 7 having a
thickness of about 8 nm. The subsequent steps are identical to
those of Embodiment 1.
[0076] By the DRAM manufacturing process of the present embodiment,
the p-type well 3 acts as the p-type channel stopper layer whereas
the n-type well 4 acts as the n-type channel stopper layer. As a
result, the ion implantation for forming the p-type channel stopper
layer and the ion implantation for forming the n-type channel
stopper layer can be eliminated to simplify the DRAM manufacturing
process more than the process of Embodiment 1.
[0077] By the DRAM manufacturing process of the present embodiment,
the elements are isolated by the shallow groove 52, formed in the
semiconductor substrate 1, so that the miniaturization of the DRAM
can be promoted. Since the step between the element isolating
region and the active region is eliminated, moreover, it is
possible to prevent the drawback that the conductive film such as
the gate electrode material, deposited over the semiconductor
substrate 1, is thinned at the step portion.
[0078] Mover, the step between the element isolating region and the
active region can be made less than the LOCOS of the prior art so
that a microminiaturization process can be performed at the step of
patterning the conductive film such as the gate electrode material
deposited over the semiconductor substrate.
[0079] The present embodiment can be combined with other
Embodiments of the present invention.
Embodiment 4
[0080] In order to manufacture the DRAM of the present embodiment,
employing the manufacturing process of Embodiment 1, the contact
holes 17 and 18 for exposing a portion of the semiconductor region
11 are formed by forming the memory cell selecting MISFET, the
n-channel MISFET and the p-channel MISFET of the peripheral
circuit, by depositing the silicon oxide film 16 over those
MISFETS, by polishing the silicon oxide film 16 using a chemical
mechanical-polishing (CMP) method to flatten its surface, and by
etching the silicon oxide film 16 and the gate oxide film 7 using a
photoresist as a mask to form the contact holes 17 and 18 over the
n-type semiconductor region 11 (the source region and the drain
region) of the memory cell selecting MISFET.
[0081] This not-shown photoresist mask is patterned to cover the
peripheral circuit forming region and to have openings over the
n-type semiconductor region 11 or the source and drain of the
memory cell selecting MISFET.
[0082] Next, as shown in FIG. 24, the plugs 29 of polycrystalline
silicon are buried in the contact holes. These plugs 29 are formed
by depositing the polycrystalline silicon film having a thickness
of about 360 nm at a filming temperature of about 540.degree. C.
over the silicon oxide film 16 by a CVD method, and by etching back
the polycrystalline silicon film (while leaving the polycrystalline
silicon film only in the contact holes 17 and 18): This
polycrystalline silicon film is doped with an n-type impurity of
phosphor (P).
[0083] Next, as shown in FIG. 25, a titanium (Ti) silicide layer 31
is formed on the surfaces of plugs 29 of polycrystalline silicon.
The titanium silicide layer 31 is formed by burying the
polycrystalline silicon plugs 29 in the contact holes 17 and 18, by
depositing, just after the burying step, a Ti film having a
thickness of about 50 nm over the silicon oxide film 16 by a
sputtering method, by annealing the Ti film and the polycrystalline
silicon (the plugs 29) at a temperature of about 800.degree. C. to
react, and by removing the Ti film, left unreacted over the silicon
oxide film 16, by wet etching.
[0084] Next, as shown in FIG. 26, the contact holes 19 and 20 are
formed over the n.sup.+-type semiconductor region 13 (the source
region and the drain region) of the n-channel MISFET of the
peripheral circuit, and the contact holes 21 and 22 are formed over
the p.sup.+-type semiconductor region 15 (the source region and the
drain region) of the p-channel MISFET, by depositing a silicon
oxide film 45 having a thickness of about 50 nm at a filming
temperature of about 360.degree. C. over the silicon oxide film 16
by a plasma CVD method, and by etching the silicon oxide film 45,
the silicon oxide film 16 and the gate oxide film 7 by using as a
mask a photoresist covering the memory cells and having openings
over the semiconductor regions 13 of the n-channel MISFET and the
semiconductor regions 15 of the p-channel MISFET of the peripheral
circuit region.
[0085] Next, as shown in FIG. 27, the plugs 23, composed of the
multilayer film of TiN and W, are buried in the contact holes 19 to
22 of the peripheral circuit in accordance with the process of
Embodiment 1. After this, the silicon oxide film 45 of the contact
holes 17, formed over one (located at the side for connecting the
bit lines) of the n-type semiconductor regions 11 (the source
region and the drain region) of the memory cell selecting MISFET,
is removed to expose the surface of the titanium silicide layer 31,
formed over the surfaces of the plugs 29, to the outside. After
this, as shown in FIG. 28, the bit lines BL1 and BL2 and the wiring
lines 24A and 24B of the peripheral circuit are formed over the
silicon oxide film 45, and the side wall spacers 26 are then formed
at the individual side walls of the bit lines BL1 and BL2 and the
wiring lines 24A and 24E. The methods for forming the insulating
film 25 over the bit lines BL1 and BL2 and the side wall spacers 26
are similar to those of Embodiment 1.
[0086] Next, as shown in FIG. 29, by the process of Embodiment 1,
the contact holes 28 are formed in self-alignment with the side
wall spacers 26 of the side walls of the bit lines BL1 and BL2 over
the aforementioned contact holes 18, formed over one of the n-type
semiconductor regions 11 (the source region and the drain region)
of the memory cell selecting MISFET, by depositing the silicon
oxide film 27 individually over the bit lines BL1 and BL2 and the
wiring lines 24A and 24E, by polishing and flattening the surface
of the silicon oxide film 27 by a chemical-mechanical polishing
(CMP) method, and by etching the silicon oxide film 27 by using a
photo-resist as a mask.
[0087] Next, as shown in FIG. 30, foreign matter on the surface of
the aforementioned Ti silicide layer 30, exposed at the bottoms of
the contact holes 28, is removed by a sputter-etching method using
argon (Ar), and the plugs 30 of polycrystalline silicon or W are
buried in the contact holes 28. If, at this time, the Ti silicide
film 31 is not formed on the surfaces of the polycrystalline
silicon plugs 29, the contact resistance is increased between the
surfaces of the plugs 29 (of polycrystalline silicon) are oxidized
at the time of burying the plugs 30 in the contact holes 28. If, at
this time, wet etching is executed to remove the oxide film from
the surfaces of the plugs 29 (of polycrystalline silicon), the
insulating film 27 in the bottoms and at the sides of the contact
holes 28 are side-etched to cause a shape defect to occur in the
contact holes 28. For the plugs 29 made of polycrystalline silicon,
the oxide film to be formed over the surfaces cannot be removed by
a dry etching method, but a wet etching method is essential.
[0088] By the DRAM manufacturing process of the present embodiment,
the Ti silicide layer 31 is formed on the surfaces of the
aforementioned polycrystalline silicon plugs 29, buried in the
contact holes 18, is formed to reduce the oxidation of the surfaces
of the plugs 29 (polycrystalline silicon) so that the oxide film
can be removed not by an isotropic wet etching method but only by a
dry etching method using Ar. As a result, there arises none of the
aforementioned problems. In short, the contact resistance can be
reduced without causing a shape defect to occur in the contact
holes 28.
[0089] In order to prevent the oxidation of the surfaces of the
plugs 29 (polycrystalline silicon), a metal film of Ti or the like
may be selectively grown on the surfaces of the polycrystalline
silicon plugs 29 immediately after the plugs 29 have been buried in
the contact holes 17 and 18. Next, as shown in FIG. 31, by the
process of Embodiment 1, the contact holes 36 are formed over the
plate electrodes 34 of the information storing capacitive element C
after forming the information storing capacitive element C over the
contact holes 28, by depositing the silicon oxide film 35 over the
information storing capacitive element C, and by etching the
silicon oxide film 35 by using a photoresist as a mask.
Simultaneously with this, by etching the silicon oxide film 35 and
the silicon oxide film 27, the contact holes 37 are formed over the
wiring lines 24A of the peripheral circuit, and the contact holes
38 are formed over the wiring lines 24B.
[0090] Next, as shown in FIG. 32, plugs 55 of TiN are buried in the
contact holes 35, 36 and 37. These TiN plugs 55 are formed by
depositing the TiN film over the silicon oxide film 35 by using a
sputtering method and a CVD method, and by etching back the TiN
film.
[0091] If the plugs 55 are composed of a multilayer film of TiN and
W, the TiN film and the W film are deposited over the silicon oxide
film 35 and are then etched back. In this case, TiN and W have
different etching rates so that the surface of the W film, buried
in the contact holes 36, 37 and 38, is excessively etched off if
the TiN film over the silicon oxide film 35 is completely removed.
This may cause breakage of Al wiring lines over the contact holes
36, 37 and 38 if the Al wiring lines are formed over the silicon
oxide film 35. If the TiN film is not completely etched off, but is
left over the silicon oxide film 35, on the other hand, separation
may occur at the interface between the TiN film and the Al wiring
lines when these wiring lines are formed thereover.
[0092] By the DRAM manufacturing process of the present embodiment,
the aforementioned drawbacks can be avoided by making the plug
material to be buried in the contact holes 36, 37 and 38, of a
single layer of TiN.
[0093] Next, as shown in FIG. 33, the wiring lines 39A, 39B, 39C
and 39D are formed over the silicon oxide film 35. Specifically,
these wiring lines 39A, 393, 39C and 39D are formed by depositing
an All alloy film having a thickness of about 500 nm and a TiN film
having a thickness of about 10 nun over the silicon oxide film 35
by a sputtering method, and by etching and patterning those films
by using a photoresist as a mask. After the steps thus far
described, the DRAM of the present embodiment is substantially
completed. It is needless to say that Embodiments 2 and 3 can be
applied to the present embodiment.
Embodiment 5
[0094] In the DRAM of the present embodiment, the conductive
material (TiN) constituting the plate electrodes 34 of the
information storing capacitive element C is used as the material
for the wiring lines of the peripheral circuit, and the plate
electrodes 34 and the wiring lines of the peripheral circuits are
formed in a common step.
[0095] For manufacturing this DRAM by the manufacturing process of
Embodiment 1, the capacitor insulating film 33 and the plate
electrodes 34 of the information storing capacitive element C are
formed simultaneously with wiring lines 56 and 57 of the peripheral
circuit, by forming the storage electrodes 32 of the information
storing capacitive element over the silicon oxide film 27,
deposited over the bit lines BL.sub.1 and BL.sub.2 and the wiring
lines 24A and 24E of the peripheral circuit, as shown in FIG. 34,
and by patterning the Ta.sub.2O.sub.5 film and the TiN film
deposited over the storage electrodes 32, as shown in FIG. 35.
[0096] The wiring lines 56 and 57, formed of the multilayer film of
the Ta.sub.2O.sub.5 film or the capacitor insulating film and the
TiN film deposited over the former, cannot be connected directly
with the underlying wiring lines through the contact holes. In this
case, if the TiN film is deposited after the Ta.sub.2O.sub.5 has
been deposited and then etched off from the peripheral circuit, the
direct connection with the underlying wiring lines can be made but
increases the number of steps. Since the Ta.sub.2O.sub.3 is
partially etched off, moreover, the reliability of the capacitor
insulating film may drop. Specifically, a photoresist film of a
predetermined pattern is formed over the capacitor insulating film
33, and this capacitor insulating film 33 is etched. After this,
the quality of the capacitor insulating film 33 is deteriorated by
the ashing treatment with O.sub.2 for removing the photoresist. In
the present embodiment, therefore, the wiring lines 58 and 57 and
the underlying wiring lines are connected by the following
method.
[0097] First of all, as shown in FIG. 36, the contact holes 36 are
formed over the plate electrodes 34 of the information storing
capacitive element C by depositing the silicon oxide film 35 over
the information storing capacitive element C and the wiring lines
56 and 57, and by etching the silicon oxide film 35 by using a
photoresist as a mask. Simultaneously with this, the contact holes
37 are formed over the wiring lines 24A of the peripheral circuit,
and the contact holes 38 are formed over the wiring lines 24B, by
etching the silicon oxide film 35, the silicon oxide film 27 and
the silicon nitride film 25 in the regions having the wiring lines
56 and 57. At this time, one end of the wiring line 56 is exposed
to the inside of the contact hole 37, and one end of the wiring
line 57 is exposed to the inside of the contact hole 38.
[0098] Next, as shown in FIG. 37, the TiN plugs 55 are 25 buried in
the contact holes 36, 37 and 38, and the wiring lines 39A, 39B, 39C
and 39D are then formed over the silicon oxide film 35. As a
result, the wiring line 56 is connected through the wiring line 39C
with the underlying wiring line 24A, and the wiring line 57 is
connected through the wiring line 39D with the underlying wiring
line 24B.
[0099] By the DRAM manufacturing process of the present embodiment,
by using a common material for the plate electrode (TiN) of the
information storing capacitive element C and the wiring of the
peripheral circuit, the wiring layers of the peripheral circuit can
be increased to improve the degree of freedom of the wiring
design.
[0100] By the DRAM manufacturing process of the present embodiment,
the wiring layers of the peripheral circuit can be increased
without any increase in the number of steps of manufacturing the
DRAM.
Embodiment 6
[0101] In the DRAM manufacturing process of Embodiment 5, the
contact hole 37 is formed over the wiring line 24A by etching the
silicon oxide film 35, the silicon oxide film 27 and the silicon
nitride film 25 in the regions having the wiring lines 56 and 57 of
the peripheral circuit, and the contact hole 38 is formed over the
wiring line 24B, so that one end of the wiring line 56 is exposed
to the inside of the contact hole 37 whereas one end of the wiring
line 57 is exposed to the inside of the contact hole 38 (as shown
in FIG. 36). If, at this time, the etching selection rate of the
wiring material (TiN) to the insulating films (the silicon oxide
film and the silicon nitride film) is small, the plate electrode 34
and the wiring lines 56 and 57 may be etched to reduce the film
thickness. In the present embodiment, therefore, the wiring lines
56 and 57 and the underlying wiring lines are connected by the
following method.
[0102] First of all, as shown in FIG. 38, the capacitor insulating
film 33 and the plate electrode 34 of the information storing
capacitive element C are formed simultaneously with the wiring
lines 56 and 57 of the peripheral circuit by patterning the
Ta.sub.2O.sub.5 film, the TiN film and a third film (a high
selection ratio film 58), deposited over the storage electrodes 32.
The high selection ratio film 58 may be either an insulating film
or a conductive film if it is made of a material having a high
etching selection ratio with respect to the silicon oxide film or
the silicon nitride film. A suitable film may be a tungsten (W)
film.
[0103] Next, as shown in FIG. 39, the contact holes 36 are formed
over the plate electrode 34 of the information storing capacitive
element C by etching the silicon oxide film 35, deposited over the
information storing capacitive element C and the wiring lines 56
and 57, by using a photoresist as a mask. Simultaneously with this,
the contact hole 37 is formed over the wiring line 24A of the
peripheral circuit, and the contact hole 38 is formed over the
wiring line 24B, by etching the silicon oxide film 35, the silicon
oxide film 27 and the silicon nitride film 25 in the regions having
the wiring lines 56 and 57. Since, at this time, the plate
electrode 34 and the wiring lines 56 and 57 are covered with the
high selection ratio film 58, the etching of the plate electrode 34
and the wiring lines 56 and 57 does not increase the film
thickness.
[0104] Next, as shown in FIG. 40, one end of the wiring line 56 is
exposed to the inside of the contact hole 37, and one end of the
wiring line is exposed to the inside of the contact hole 38 by
etching the high selection ratio film 58 covering the plate
electrode 34 and the wiring lines 56 and 57, at the final stage of
the etching treatment. After this, the wiring lines 39A, 39B, 39C
and 39D are formed over the silicon oxide film 35 in accordance
with the process of Embodiment 5. Incidentally, this etching step
is unnecessary if the high selection ratio film is made of
tungsten.
[0105] By the DRAM manufacturing process of the present embodiment,
it is possible to reliably prevent the drawback that the plate
electrode 34 and the wiring lines 56 and 57 are etched and thinned
at the step of forming the contact holes (36, 37 and 38).
[0106] The connection between the wiring lines 56 and 57 of the
peripheral circuit and the underlying wiring lines may also be
effected by the following method.
[0107] First of all, as shown in FIG. 41, the capacitor insulating
film 33 and the plate electrode 34 are formed simultaneously with
the wiring lines 56 and 57 of the peripheral circuit by patterning
the Ta.sub.2O.sub.5 film, the TiN film and the high selection ratio
film 58, deposited over the storage electrodes 32.
[0108] Next, as shown in FIG. 42, the contact hole 37 is formed
over the wiring line 24A of the peripheral circuit, and the contact
hole 38 is formed over the wiring line 24B, by etching the silicon
oxide film 35, the silicon oxide film 27 and the silicon nitride
film 25, formed over the wiring lines 56 and 57, by using a
photoresist 59 as a mask. At this time, the high selection ratio
film 58 covering the wiring lines 56 and 57 acts as an etching
stopper to prevent the wiring lines 56 and 57 from being etched and
thinned.
[0109] Next, as shown in FIG. 43, one end of the wiring line 56 is
exposed inside the contact hole 37, and one end of the wiring line
57 is exposed inside the contact hole 38, by etching the high
selection ratio film 58 covering the wiring lines 56 and 57, at the
final etching stage.
[0110] After this, as shown in FIG. 44, a wiring line 60 is formed
over the contact hole 37, and a wiring line 61 is formed over the
contact hole 38, by patterning the conductive film, deposited over
the silicon oxide film 27. As a result, the wiring line 56 of the
peripheral circuit is connected through the wiring line 60 to the
underlying wiring line 24A, and the wiring line 57 is connected
through the wiring line 61 to the underlying wiring line 24B.
[0111] The wiring lines 56 and 57 of the peripheral circuit and the
underlying wiring lines may be connected by the following
method.
[0112] First of all, as shown in FIG. 45, the capacitor insulating
film 33 and the plate electrode 34 of the information storing
capacitive element C are formed together with the wiring lines 56
and 67 of the peripheral circuit, by patterning the Ta.sub.2O.sub.5
film, the TiN film and the high selection ratio film 58, deposited
over the storage electrodes 32. After this, the contact hole 36 is
formed over the plate electrode 34 of the information storing
capacitive element C, and the contact hole 37 is formed over the
wiring line 56, by etching the silicon oxide film 35, deposited
over the information storing capacitive element C and the wiring
lines 56 and 57, by using a photoresist as a mask. Simultaneously
with this, the contact hole 38 is formed over the wiring line 24B
of the peripheral circuit by etching the silicon oxide film 35, the
silicon oxide film 27 and the silicon nitride film 25 in the region
where the wiring line 57 is formed. At this time, the plate
electrode 34 and the wiring lines 56 and 57 are covered with the
high selection ratio film 58, so that they are prevented from being
etched and thinned.
[0113] Next, as shown in FIG. 46, one end of the wiring line 56 is
exposed inside of the contact hole 37, and one end of the wiring
line 57 is exposed inside the contact hole 38, by etching the high
selection ratio film 58 covering the wiring lines 56 and 57, at the
final etching state.
[0114] Next, as shown in FIG. 47, the TiN plugs 55 are buried in
the contact holes 35, 36 and 37, and the wiring lines 39A, 39B and
39C are then formed over the silicon oxide film 35. As a result,
the wiring line 56 of the peripheral circuit is connected through
the wiring line 39C and the wiring line 57 with the underlying
wiring line 24B.
Embodiment 7
[0115] The present embodiment is applied to a process for
manufacturing a CMOS (Complementary Metal Oxide Semiconductor)
FET.
[0116] First of all, as shown in FIG. 48, the field oxide film 2
having a thickness of about 400 nm is formed over the surface of
the semiconductor substrate 1. The field oxide film 2 is prepared
by annealing the semiconductor substrate 1 at a temperature of
about 1,000.degree. C. by using a silicon nitride film as the
mask.
[0117] Subsequently, the surface of the semiconductor substrate in
the region to form the p-channel MISFET is covered with a
photoresist 70, and the semi-conductor substrate 1 in the region
where the n-channel MISFET is formed is doped with ions of a p-type
impurity (B) to form the p-type well 3.
[0118] Next, the photoresist 70 is removed, and the semiconductor
substrate is annealed to repair the crystal defects which are
caused by ion implantation of p-type impurity and is doped all over
its surface with ions of a p-type impurity (B) to form a channel
region 72 of the n-channel MISFET. At this time, the semiconductor
substrate 1 in the region where the p-channel MISFET is formed is
also doped with the ions of p-type impurity.
[0119] Next, as shown in FIG. 50, the region where the n-channel
MISFET is formed, namely, the p-type well 3 is covered with a
photoresist 71, and the semiconductor substrate 1 in the region
where the p-channel MISFET is formed is doped twice with the n-type
impurity (P) to form the n-type well 4. One of these two ion
implantations is to improve the device characteristics and
accordingly to introduce the impurity with a relatively low energy.
The other ion implantation is to isolate the elements and to reduce
the well resistance and accordingly to introduce the impurity with
a relatively high energy. The lower-energy ion implantation is a
pocket implantation of the PMOS to prevent the short channel effect
of the PMOS. On the other hand, the higher-energy ion implantation
has a peak impurity concentration at the interface between the
field oxide film 2 and the semiconductor substrate 1.
[0120] Next, as shown in FIG. 51, the n-type well 4 is doped with
ions of an n-type impurity (P) to form a channel region 73 of the
p-channel MISFET and to compensate the p-type impurity, the ions of
which have been introduced at the step of forming the channel
region of the aforementioned n-channel MISFET.
[0121] Incidentally, in the process described above, after the
p-type well 3 has been formed, the photoresist 70 is removed, and
the semiconductor substrate is then annealed to repair the crystal
defects which has been caused by the ion implantation of the p-type
impurity. Despite this description, however, the p-type well 3 may
be doped with ions of p-type impurity while omitting the annealing
step to leave the photoresist 70, thereby to form the channel
region 72 of the n-channel MISFET.
[0122] Moreover, a process, in which the insulating film is buried
in the shallow groove of Embodiment 3, can be applied to the
element isolating region.
[0123] Next, after the photoresist 71 has been removed, the gate
oxide film 7 is formed by a thermal oxidizing method over the
surfaces of the individual active regions of the p-type well 3 and
the n-type well 4, as shown in FIG. 52. Next, the gate electrode 8B
of the n-channel MISFET and the gate electrode SC of the p-channel
MISFET are formed over the gate oxide film 7.
[0124] The subsequent stops follow the flowchart shown in FIG. 53.
Specifically, the impurity activation for forming the source region
and the drain region is executed at a temperature of about
900.degree. C. Moreover, the treatment for producing Ti suicide or
the like on the bottom of the contact hole so as to lower the
contact resistance between the first layer wiring line and the
source region or the drain region is executed at 800.degree. C.,
and the subsequent depositions of the wiring conductive film and
the insulating film are executed at 450.degree. C. or lower.
[0125] The element isolating with the shallow groove is executed
according to the flowchart, shown in FIG. 54, as in Embodiment 3.
Specifically, the impurity activation for forming the source region
and the drain region is executed at a temperature of about
900.degree. C. Moreover, the treatment for forming Ti silicide or
the like on the bottom of the contact hole so as to lower the
contact resistance between the first layer wiring line and the
source region or the drain region is executed at 800.degree. C.,
and the subsequent depositions of the wiring conductive film and
the insulating film are executed at 450.degree. C. or lower.
[0126] By the CMOSFET manufacturing process of the present
embodiment, the formation of the p-type well and the channel region
of the n-channel MISFET and the formation of the n-type well and
the channel region of the p-channel MISFET can be made totally at
two photoresist steps thereby to reduce the steps of manufacturing
the CMOS LSI.
[0127] By the CMOSFET manufacturing process of the present
embodiment, the upper limits of the temperatures for the heat
treatments are made lower at the later steps so that the diffusion
of the impurity into the substrate caused by the hot heat treatment
can be suppressed to realize a shallower junction between the
source region and the drain region thereby to promote the high
performance of the CMOS LSI.
Embodiment 8
[0128] In the CMOSFET manufacturing process of the present
embodiment, as shown in FIG. 55, by the manufacturing process of
Embodiment 7, the gate electrode 8B of the n-channel MISFET is
formed at first over the gate oxide film 7 of the p-type well 3,
and the gate electrode 8C of the p-channel MISFET is then formed
over the gate oxide film 7 of the n-type well 4.
[0129] Next, as shown in FIG. 56, the surface of the n-type well 4
is covered with a photoresist 74, and the p-type well 3 is doped
with ions of P and As. At this time, the ions of P are introduced
more deeply and in a less dosage than the ions of As.
Alternatively, the ions of P may be obliquely introduced.
[0130] Next, after the photoresist 74 has been removed, as shown in
FIG. 57, the surface of the p-type well 3 is covered with a
photoresist 75, and the n-type well 4 is doped with ions of B.
[0131] Next, after the photoresist 75 has been removed, as shown in
FIG. 58, an annealing treatment for impurity activation is executed
to form the source region and drain region of the n-channel MISFET
and the source region and drain region of the p-channel MISFET. The
source region and drain region of the n-channel MISFET is
constructed of a double diffused drain structure, in which the
periphery and bottom portion of an n+-type semiconductor region 76,
heavily doped with diffused As are surrounded by an n-type
semiconductor region 77 lightly doped with diffused P, and the
source region and drain region of the p-channel MISFET are
constructed of a single diffused drain structure which has a p-type
semiconductor region 78.
[0132] By the CMOSFET manufacturing process of the present
embodiment, the source region and drain region of the n-channel
MISFET, constructed of a double diffused drain, and the source
region and drain region of the p-channel MISFET, constructed of a
single diffused drain structure, can be formed totally by three ion
implantations to simplify the CMOS LSI manufacturing process.
Moreover, the source region and drain region of the n-channel
MISFET is constructed of a double diffused drain structure so that
the high electric field of the end portion of the drain region can
be relaxed. As a result, it is possible to suppress the hot
electron effect of the n-channel MISFET which raises a problem if
the gate length is miniaturized.
[0133] Although our invention has been specifically described with
reference to various Embodiments, the invention should not be
limited thereto but can naturally be modified in various manners
without departing from the gist thereof.
[0134] The effects to be obtained by representative aspects of the
invention disclosed herein will be briefly described in the
following.
[0135] By the manufacturing process of the present invention, at
the step after the MISFET has been formed, all the conductive films
are deposited at a temperature of 500.degree. C. or lower over the
semiconductor substrate so that the number of heat treatment steps
can be reduced to form a MISFET of shallow junction.
[0136] By the manufacture process of the present invention, at the
step after the MISFET has been formed, all the insulating films are
deposited at a temperature of 500.degree. C. or lower over the
semiconductor substrate so that the number of heat treatment steps
can be reduced to form a MISFET of shallow junction.
[0137] By the manufacturing process of the present invention, all
the conductive films are made of a metal or its compound so that
the wiring resistance can be reduced.
[0138] By the manufacturing process of the present invention, it is
possible to simplify the process for manufacturing the
semiconductor integrated circuit device having MISFETs.
* * * * *